A heat sink for a high-power LED lamp
Patent Information
- Application Number
- CN202611046867.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-15
- Publication Date
- 2026-10-16
AI Technical Summary
[0003]为克服上述现有技术的不足，本发明提供一种大功率LED灯具用散热器，解决了现有大功率LED灯具因产热集中、散热效率不足的技术问题
本发明的目的是提供一种大功率LED灯具用散热器，通过成对设置的竖向分布基座配合散热鳍片内的连通流道以及侧壁导流管，构建了持续稳定的两相工质相变散热循环，依靠工质相变过程的吸放热实现热量快速转移，能够快速带走大功率LED灯具工作产生的大量热量，有效抑制灯体温度升高；通过凸槽嵌合结构配合导热层，降低了LED灯体与散热器之间的接触热阻，提升了热量传导效率；通过设置导流斜面，可引导冷凝后的液态工质快速回流至下方基座，缩短循环周期，保障相变散热效率；上方基座增设的间隔槽部配合主动散热的风扇，能够强化强制对流换热效果，快速排出上方基座蓄积的热量，持续维持相变循环所需的高低温差，保证散热过程持续稳定运行。
Smart Images
Figure CN122920385A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat sink technology, and in particular to a heat sink for high-power LED lighting fixtures. Background Technology
[0002] With the development of semiconductor lighting technology, high-power LED lamps have been widely used in outdoor lighting, industrial plants, and large venues due to their advantages such as high brightness and low energy consumption. However, the photoelectric conversion efficiency of LEDs is limited, with approximately 70% to 80% of the input electrical energy being converted into heat. Because high-power LED lamps have high power density and small chip size, heat generation is concentrated. If the heat cannot be dissipated effectively and in a timely manner, the LED junction temperature will rise sharply, leading to accelerated light decay, color temperature drift, shortened lifespan, and even chip burnout. In severe cases, this can even cause safety accidents. Therefore, there is an urgent need for a heat sink for high-power LED lamps to solve these problems. Summary of the Invention
[0003] To overcome the shortcomings of the prior art, the present invention provides a heat sink for high-power LED lamps, which solves the technical problems of concentrated heat generation and insufficient heat dissipation efficiency in existing high-power LED lamps.
[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: A heat sink for a high-power LED lamp is provided for mounting on a high-power LED lamp, the LED lamp comprising: a lamp body, the lamp body having a mounting portion including: The bases are arranged in pairs, with the pair of bases spaced apart vertically. Each base has an inner cavity, and the inner cavity near the lamp body is filled with a two-phase working fluid. A set of heat dissipation fins, the set of heat dissipation fins being spaced apart between a pair of inner cavities, each heat dissipation fin abutting against a pair of bases in the vertical direction, and each heat dissipation fin having a flow channel extending in the vertical direction for connecting the pair of inner cavities; A plurality of guide tubes are disposed on the sidewalls of a pair of bases, the guide tubes being used to connect a pair of inner cavities; A heat dissipation component is mounted on the upper end of the base located above.
[0005] Based on the above structure, the principle of the heat sink for high-power LED lamps is as follows: During use, the LED lamp generates a large amount of heat, which is conducted to the lower base through the mounting part. The two-phase working fluid filled in the lower base absorbs heat and reaches saturation temperature. The liquid working fluid vaporizes into high-temperature steam. The phase change process absorbs heat and quickly carries away the heat from the LED lamp, suppressing the temperature rise of the lamp body. The vertical spacing between the upper and lower bases creates a high-low temperature difference. The high-temperature steam flows upward into the inner cavity of the upper base through the vertically extended flow channels inside the heat sink fins. During this process, the heat of the steam is transferred through the sides of the heat sink fins. The wall transfers heat to the outside air to complete the initial cooling. Since the temperature of the upper base is lower than that of the lower base, the gaseous working fluid that has completed the initial cooling liquefies upon entering the inner cavity of the upper base. During the liquefaction process, heat is released and all of the heat is transferred to the upper base. The liquefied working fluid flows back to the inner cavity of the lower base along the guide pipe by gravity, completing one gas-liquid cycle. The heat dissipation component continuously blows air onto the surface of the upper base, forcibly accelerating the convection between the upper base and the ambient air, carrying away the heat accumulated in the upper base, and continuously maintaining the temperature difference between the upper and lower bases to ensure that the gas-liquid phase change cycle can operate continuously and stably.
[0006] Furthermore, in a heat sink for a high-power LED lamp in this application, the mounting part has a groove on the side near the lower base, and the lower base has a protrusion adapted to the groove on the side near the lamp body. The groove is used to accommodate the protrusion. As a preferred embodiment of this application, the structure of the groove and the protrusion cooperating with each other in the heat sink for a high-power LED lamp increases the contact area between the mounting part and the lower base, effectively reducing contact thermal resistance. The heat generated by the LED lamp can be quickly and smoothly conducted to the inner cavity of the lower base, improving heat conduction efficiency and preventing the LED lamp from accumulating heat and causing the operating temperature to be too high. At the same time, the protrusion is fitted into the groove, which can realize quick positioning during the heat sink installation process, improve assembly efficiency, and enhance the stability of the connection between the lamp body and the heat sink. This prevents the heat sink from shifting due to vibration or external force during long-term operation of the LED lamp, ensuring continuous and stable heat dissipation performance.
[0007] Furthermore, in a high-power LED lamp heat sink of this application, a thermally conductive layer is provided on the inner wall of the groove, and the thermally conductive layer is used to fill the gap between the inner wall of the groove and the protrusion. As a preferred embodiment of this application, in a high-power LED lamp heat sink, the thermally conductive layer is used to fill the tiny gaps between the inner wall of the groove and the protrusion caused by part processing errors, avoiding the air left in the gap from blocking heat conduction, further reducing contact thermal resistance, so that the heat generated by the LED lamp can be smoothly conducted to the inner cavity of the base below, thereby improving the overall heat conduction and heat dissipation efficiency of the heat sink.
[0008] Furthermore, in a high-power LED lamp heat sink of this application, a flow-guiding slope is provided on the inner wall of the inner cavity of the upper base. The flow-guiding slope is located on the inner side wall of the inner cavity of the upper base near the heat dissipation component and extends obliquely towards the flow-guiding tube. As a preferred embodiment of this application, the flow-guiding slope of the high-power LED lamp heat sink can guide the liquid working fluid condensed in the inner cavity of the upper base. The liquefied working fluid can quickly flow into the flow-guiding tube along the inclined flow-guiding slope, and then smoothly flow back to the inner cavity of the lower base by gravity. This shortens the working fluid return cycle, improves heat transfer efficiency, effectively reduces the junction temperature of the LED lamp beads, slows down light decay, and improves the lifespan of the LED lamp.
[0009] Furthermore, in this application, a heat sink for a high-power LED lighting fixture includes a fan, which is detachably mounted on the upper end of a base. As a preferred embodiment of this application, the detachable mounting structure of this high-power LED lighting fixture heat sink facilitates the removal and cleaning or replacement of the fan when dust accumulation causes a decrease in heat dissipation efficiency, or when the fan malfunctions or is damaged. This reduces the difficulty of later maintenance and lowers operating costs.
[0010] Furthermore, in a high-power LED lighting fixture heat sink of this application, a plurality of grooves are provided on the outer wall of the base near the heat dissipation component, and the plurality of grooves are spaced horizontally upwards. As a preferred embodiment of this application, the design of the plurality of grooves in the high-power LED lighting fixture heat sink of this application can increase the contact area between the upper base and the outside cold air. When the fan blows air onto the upper base for forced heat dissipation, the airflow can enter the grooves to form turbulence, which breaks the thermal boundary layer on the outer wall of the upper base, effectively reduces the convective thermal resistance, and further improves the efficiency of forced convection heat transfer. It can more quickly remove the heat accumulated in the upper base, continuously maintain a stable temperature difference between the upper and lower bases, ensure that the gas-liquid phase change heat dissipation cycle can continue to operate, and further improve the overall heat dissipation capacity of the heat sink.
[0011] Furthermore, in this application, the projected area of the upper base in the vertical direction of the heat sink for high-power LED lighting fixtures is larger than that of the lower base. As a preferred embodiment of this application, the larger projected area of the upper base in the heat sink for high-power LED lighting fixtures provides ample installation space for the heat dissipation components and increases the heat exchange area between the upper base and the outside air. This enhances the forced convection heat dissipation efficiency of the heat dissipation components on the upper base, ensuring that the upper base dissipates accumulated heat more quickly, stably maintaining the temperature difference required for the gas-liquid phase change cycle, thereby accelerating the vapor liquefaction rate and ensuring heat dissipation efficiency.
[0012] Furthermore, in a high-power LED lighting fixture heat sink of this application, the mounting portion is detachably connected to the lower base via a set of threaded locking members, which are spaced apart circumferentially along the mounting portion. As a preferred embodiment of this application, the detachable connection structure of the high-power LED lighting fixture heat sink facilitates the separation of the LED lighting fixture from the heat sink, allowing for individual maintenance and replacement of either the LED lighting fixture or the heat sink later, avoiding the need for complete replacement when one component is damaged, and effectively reducing later maintenance costs. The set of threaded locking members provides a stable locking force for the LED lighting fixture and the lower base, ensuring a tight fit between the two and guaranteeing the stability of heat conduction.
[0013] As can be seen from the above technical solution, the present invention has the following beneficial effects: The purpose of this invention is to provide a heat sink for high-power LED lamps. Through paired vertically distributed bases, connected flow channels within the heat sink fins, and sidewall guide pipes, a continuous and stable two-phase working fluid phase change heat dissipation cycle is constructed. Relying on the heat absorption and release during the working fluid phase change process, rapid heat transfer is achieved, quickly removing the large amount of heat generated by the high-power LED lamp and effectively suppressing the lamp body temperature rise. The grooved interlocking structure combined with a thermally conductive layer reduces the contact thermal resistance between the LED lamp body and the heat sink, improving heat conduction efficiency. By setting a flow-guiding slope, the condensed liquid working fluid can be guided to quickly flow back to the lower base, shortening the cycle and ensuring phase change heat dissipation efficiency. The additional spacer slots on the upper base, combined with an active cooling fan, enhance the forced convection heat transfer effect, quickly dissipating the heat accumulated in the upper base, continuously maintaining the high and low temperature difference required for the phase change cycle, and ensuring continuous and stable operation of the heat dissipation process. Attached Figure Description
[0014] Figure 1 This is a three-dimensional structural schematic diagram of a heat sink for a high-power LED lamp according to an embodiment of this application; Figure 2 This is a bottom view of a heat sink for a high-power LED lamp according to an embodiment of this application; Figure 3 This is a three-dimensional structural diagram of an LED lamp in a heat sink for a high-power LED lamp according to an embodiment of this application; Figure 4 This is a cross-sectional view of a heat sink for a high-power LED lamp according to an embodiment of this application; Figure 5 This is a three-dimensional structural diagram of the heat sink fins in a high-power LED lamp according to an embodiment of this application.
[0015] In the diagram: 1-LED lamp; 11-lamp body; 12-mounting part; 120-groove; 2-base; 20-inner cavity; 21-protrusion; 22-flow guide slope; 23-slot; 3-heat dissipation fins; 30-flow channel; 4-flow guide pipe; 5-heat dissipation component; 51-fan; 6-heat conduction layer; 7-threaded locking part. Detailed Implementation
[0016] like Figure 1 , 2 As shown in Figures 3, 4, and 5, a heat sink for a high-power LED lamp is used for mounting on a high-power LED lamp 1. The LED lamp 1 includes: a lamp body 11, and a mounting portion 12 is provided on the lamp body 11, including: The bases 2 are arranged in pairs, with the pair of bases 2 spaced apart vertically. Each base 2 has an inner cavity 20, and the inner cavity 20 near the lamp body 11 is filled with a two-phase working fluid. A set of heat dissipation fins 3 are spaced apart between a pair of inner cavities 20. Each heat dissipation fin 3 abuts against a pair of bases 2 in the vertical direction. Each heat dissipation fin 3 is provided with a flow channel 30 extending in the vertical direction, which is used to connect the pair of inner cavities 20. A plurality of guide tubes 4 are disposed on the sidewalls of a pair of bases 2, and the guide tubes 4 are used to connect a pair of inner cavities 20. Heat dissipation component 5 is installed on the upper end of the base 2 located above.
[0017] Based on the above structure, the principle of the heat sink for high-power LED lamps is as follows: During use, the LED lamp 1 generates a large amount of heat, which is conducted to the lower base 2 through the mounting part 12. The two-phase working fluid filled in the lower base 2 absorbs heat and reaches saturation temperature. The liquid working fluid vaporizes into high-temperature steam. The phase change process absorbs heat and quickly carries away the heat of the LED lamp 1, suppressing the temperature rise of the lamp body 11. The upper and lower bases 2 are vertically spaced to form a high-low temperature difference. The high-temperature steam flows upward into the inner cavity 20 of the upper base 2 through the vertically extended flow channel 30 inside the heat dissipation fins 3. During this process, the heat of the steam will be transferred through the heat dissipation fins 3... The sidewall transfers heat to the outside air for initial cooling. Since the temperature of the upper base 2 is lower than that of the lower base 2, the gaseous working fluid, after initial cooling, liquefies upon entering the inner cavity 20 of the upper base 2. During liquefaction, heat is released and transferred entirely to the upper base 2. The liquefied working fluid, under gravity, flows back along the guide pipe 4 to the inner cavity 20 of the lower base 2, completing one gas-liquid cycle. The heat dissipation component 5 continuously blows air onto the surface of the upper base 2, forcibly accelerating the convection between the upper base 2 and the ambient air, carrying away the heat accumulated in the upper base 2, and continuously maintaining the temperature difference between the upper and lower bases 2 to ensure the continuous and stable operation of the gas-liquid phase change cycle. A set of heat dissipation fins 3 are evenly spaced between the two inner cavities 20; ethanol can be used as the two-phase working fluid.
[0018] In this embodiment, the mounting part 12 has a groove 120 near the lower base 2, and the lower base 2 has a protrusion 21 that adapts to the groove 120 near the lamp body 11. The groove 120 is used to accommodate the protrusion 21. The structure of the groove 120 and the protrusion 21 cooperating with each other increases the contact area between the mounting part 12 and the lower base 2, effectively reducing the contact thermal resistance. The heat generated by the LED lamp 1 can be quickly and smoothly conducted to the inner cavity 20 of the lower base 2, improving the heat conduction efficiency and preventing the LED lamp 1 from accumulating heat and causing the operating temperature to be too high. At the same time, the protrusion 21 is fitted into the groove 120, which can realize the quick positioning during the heat sink installation process, improve the assembly efficiency, and enhance the stability of the connection between the lamp body 11 and the heat sink. This prevents the heat sink from shifting due to vibration or external force during long-term operation of the LED lamp 1, ensuring continuous and stable heat dissipation performance. The groove 120 is rectangular in shape, and correspondingly, the protrusion 21 is also rectangular in shape.
[0019] In this embodiment, a thermally conductive layer 6 is provided on the inner wall of the groove 120. The thermally conductive layer 6 is used to fill the gap between the inner wall of the groove 120 and the protrusion 21. The thermally conductive layer 6 fills the tiny gaps between the inner wall of the groove 120 and the protrusion 21 caused by part processing errors, preventing air trapped in the gaps from blocking heat conduction, further reducing contact thermal resistance, and allowing the heat generated by the LED lamp 1 to be smoothly conducted to the inner cavity 20 of the lower base 2, thereby improving the overall heat conduction and heat dissipation efficiency of the heat sink. The thermally conductive layer 6 can be a thermally conductive silicone sheet.
[0020] In this embodiment, a flow-guiding slope 22 is provided on the inner wall of the inner cavity 20 of the upper base 2. The flow-guiding slope 22 is located on the inner side wall of the inner cavity 20 of the upper base 2 near the heat dissipation component 5 and extends obliquely towards the flow-guiding pipe 4. The flow-guiding slope 22 can guide the liquid working fluid condensed in the inner cavity 20 of the upper base 2. The liquefied working fluid can quickly flow into the flow-guiding pipe 4 along the inclined flow-guiding slope 22, and then smoothly flow back to the inner cavity 20 of the lower base 2 by gravity. This shortens the working fluid return cycle, improves heat transfer efficiency, effectively reduces the junction temperature of the LED lamp 1, slows down light decay, and improves the lifespan of the LED lamp 1. The inclination angle of the flow-guiding slope 22 is set to 15°-30°.
[0021] In this embodiment, the heat dissipation component 5 includes a fan 51, which is detachably mounted on the upper end of the base 2. The detachable mounting structure facilitates the removal of the fan 51 for cleaning, repair, or replacement when dust accumulation causes a decrease in heat dissipation efficiency, or when the fan 51 malfunctions or is damaged, reducing the difficulty of later maintenance and operating costs. The fan 51 is detachably mounted on the base 2 using a set of four screws.
[0022] In this embodiment, the outer wall of the upper base 2 near the heat dissipation component 5 is provided with a plurality of grooves 23, which are spaced apart horizontally upwards. The design of the grooves 23 increases the contact area between the upper base 2 and the outside cold air. When the fan 51 blows air onto the upper base 2 for forced heat dissipation, the airflow can enter the grooves 23 to form turbulence, disrupting the thermal boundary layer on the outer wall of the upper base 2, effectively reducing convective thermal resistance, and further improving the efficiency of forced convection heat transfer. This allows for faster removal of the heat accumulated in the upper base 2, maintaining a stable temperature difference between the upper and lower bases 2, ensuring the continuous operation of the gas-liquid phase change heat dissipation cycle, and further enhancing the overall heat dissipation capacity of the radiator. The grooves 23 are evenly spaced horizontally on the outer wall of the upper base 2 near the heat dissipation component 5.
[0023] In this embodiment, the vertical projected area of the upper base 2 is larger than that of the lower base 2. The larger projected area of the upper base 2 provides ample installation space for the heat dissipation component 5 and increases the heat exchange area between the upper base 2 and the outside air. This improves the forced convection heat dissipation efficiency of the heat dissipation component 5 on the upper base 2, ensuring that the upper base 2 dissipates accumulated heat more quickly, stably maintaining the temperature difference required for the gas-liquid phase change cycle, thereby accelerating the steam liquefaction rate and ensuring heat dissipation efficiency.
[0024] In this embodiment, the mounting part 12 is detachably connected to the lower base 2 via a set of threaded locking members 7, which are spaced apart circumferentially along the mounting part 12. This detachable connection structure facilitates the separation of the LED lamp 1 from the heat sink, allowing for individual maintenance and replacement of either the LED lamp 1 or the heat sink later, avoiding the need for complete replacement of any damaged component and effectively reducing maintenance costs. The set of threaded locking members 7 provides a stable locking force to the LED lamp 1 and the lower base 2, ensuring a tight fit and stable heat conduction. The set of threaded locking members 7 consists of four members, evenly spaced circumferentially along the mounting part 12. The threaded locking members 7 can be a combination of screws and nuts.
[0025] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can conceive of other specific embodiments of the invention without creative effort, and these embodiments will all fall within the scope of protection of the present invention.
Claims
1. A heat sink for a high-power LED lamp, used for mounting on a high-power LED lamp (1), the LED lamp (1) comprising: The lamp body (11), on which a mounting part (12) is provided, is characterized in that it includes: The bases (2) are arranged in pairs, with the pair of bases (2) spaced apart vertically. Each base (2) has an inner cavity (20), and the inner cavity (20) near the lamp body (11) is filled with a two-phase working fluid. A set of heat dissipation fins (3) are spaced apart between a pair of inner cavities (20). Each heat dissipation fin (3) abuts against a pair of bases (2) in the vertical direction. Each heat dissipation fin (3) has a flow channel (30) extending in the vertical direction, which is used to connect the pair of inner cavities (20). A plurality of guide tubes (4) are provided on the sidewalls of a pair of bases (2), and the guide tubes (4) are used to connect a pair of inner cavities (20); Heat dissipation component (5) is installed on the upper end of the base (2) located above.
2. The heat sink for high-power LED lamps according to claim 1, characterized in that: The mounting part (12) has a groove (120) on the side near the lower base (2), and the lower base (2) has a protrusion (21) on the side near the lamp body (11) that is adapted to the groove (120). The groove (120) is used to accommodate the protrusion (21).
3. A heat sink for high-power LED lamps according to claim 2, characterized in that: A heat-conducting layer (6) is provided on the inner wall of the groove (120), and the heat-conducting layer (6) is used to fill the gap between the inner wall of the groove (120) and the protrusion (21).
4. A heat sink for high-power LED lamps according to claim 1, characterized in that: The inner wall of the cavity (20) of the base (2) above is provided with a flow guiding slope (22). The flow guiding slope (22) is located on the inner wall of the cavity (20) of the base (2) above, close to the heat dissipation component (5), and extends obliquely toward the flow guiding pipe (4).
5. A heat sink for high-power LED lamps according to claim 1, characterized in that: The heat dissipation component (5) includes a fan (51) which is detachably mounted on the upper end of the base (2) located above.
6. A heat sink for high-power LED lamps according to claim 5, characterized in that: The base (2) above has a number of grooves (23) on the outer wall near the heat dissipation component (5), and the grooves (23) are spaced apart horizontally upward.
7. A heat sink for high-power LED lamps according to claim 1, characterized in that: The vertical projected area of the upper base (2) is greater than the projected area of the lower base (2).
8. A heat sink for high-power LED lamps according to claim 1, characterized in that: The mounting part (12) is detachably connected to the base (2) below by a set of threaded locking members (7), which are spaced apart along the circumference of the mounting part (12).