A refrigeration module and method of making the same

Abstract

The application discloses a refrigeration module and a manufacturing method thereof, and aims to solve the problem that the refrigeration module is scrapped when a particle in the refrigeration module is damaged and a circuit is broken. The application comprises two ceramic substrates and a plurality of thermoelectric semiconductor components connected between the two ceramic substrates. A plurality of bus bars are arranged on one ceramic substrate at intervals, and a plurality of thermoelectric semiconductor components arranged at intervals are connected in parallel between two adjacent bus bars. The plurality of thermoelectric semiconductor components arranged at intervals are connected in parallel between two adjacent bus bars of the refrigeration module. Each thermoelectric semiconductor component is independent of each other, and the normal work of other thermoelectric semiconductor components is not affected when any one thermoelectric semiconductor component is damaged, so that the product can continue to be used, and the service life of the product is prolonged.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a cooling module and a method for manufacturing the same. Background Technology

[0002] Currently, most commercially available thermoelectric coolers have a series internal structure, and they are manufactured as a single unit without the possibility of disassembly and replacement of parts. This means that if even one particle within the cooler fails and breaks the circuit, the entire product must be scrapped. This is especially problematic in environments with high vibration or prone to drops, where the frequency of particle damage increases significantly, severely impacting product lifespan. For example, Chinese patent application number 2019106972391 discloses a thermoelectric semiconductor cooler and its module. By providing non-functional areas on the first and second substrates that prevent the formation of current paths, the thermal stress experienced by the thermoelectric semiconductor cooler during packaging is reduced, effectively improving its reliability. However, since the particles within the thermoelectric semiconductor cooler are connected in series, if even one particle fails and breaks the circuit, the entire product must be scrapped. Summary of the Invention

[0003] To overcome the above shortcomings, the present invention provides a cooling module and its manufacturing method, with two objectives: first, each PN junction of the cooling module is powered separately, avoiding the situation where the entire product is scrapped due to the failure of a single particle, thereby extending the service life of the cooling module; second, the semiconductor particle welding efficiency is high during the manufacturing process of the cooling module.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a cooling module, comprising two ceramic substrates and a plurality of thermoelectric semiconductor components connected between the two ceramic substrates, wherein a plurality of busbars are spaced apart on one ceramic substrate, and a plurality of thermoelectric semiconductor components are connected in parallel between adjacent busbars.

[0005] Multiple thermoelectric semiconductor components are connected in parallel between two adjacent busbars of the cooling module. Each thermoelectric semiconductor component is independent of the others. If any thermoelectric semiconductor component is damaged, it will not affect the normal operation of the other thermoelectric semiconductor components, thus enabling the product to continue to be used and helping to extend the product's service life.

[0006] Preferably, the thermoelectric semiconductor assembly includes P-type thermoelectric particles, N-type thermoelectric particles, and a conductive sheet. The conductive sheet is disposed on another ceramic substrate. One end of each of the P-type and N-type thermoelectric particles is connected to the conductive sheet, and the other end of each of the P-type and N-type thermoelectric particles is connected to two adjacent busbars, respectively.

[0007] The conductive sheet connects P-type and N-type thermoelectric particles together to form PN junctions. Each PN junction is powered independently, and the failure of a single PN junction will not cause the entire product to be scrapped. After the current passes through a row of PN junctions, it converges at the busbar and is then transferred to the next row of PN junctions, and so on, to form a complete product.

[0008] Preferably, the busbar edge is provided with a number of welding points that correspond one-to-one with the thermoelectric semiconductor components, and the welding points extend out of the busbar edge.

[0009] The placement of the solder joints facilitates the welding of thermoelectric semiconductor components to busbars.

[0010] A method for manufacturing a cooling module includes the following steps: S1, applying solder paste to a ceramic substrate; S2, loading P-type thermoelectric particles and N-type thermoelectric particles between two ceramic substrates; S3, heating and soldering.

[0011] A cooling module is formed by soldering P-type and N-type thermoelectric particles between two ceramic substrates. The P-type and N-type thermoelectric particles are arranged in pairs, and each pair is connected to form a PN junction. During fabrication, solder paste is first applied to the ceramic substrates. Then, the P-type and N-type thermoelectric particles are loaded between the two substrates, making contact with the solder paste. Finally, heating and soldering are performed to weld the P-type and N-type thermoelectric particles to the two ceramic substrates, completing the fabrication of the cooling module. This process is highly efficient.

[0012] Preferably, in step S2, a sieve plate is first used for screening. The sieve plate is provided with P-type loading holes and N-type loading holes. The sieve plate enters the storage tank containing P-type thermoelectric particles and N-type thermoelectric particles respectively for screening, so that the P-type thermoelectric particles are loaded into the P-type loading holes and the N-type thermoelectric particles are loaded into the N-type loading holes. Then the sieve plate is transferred to the ceramic substrate, so that the P-type thermoelectric particles and N-type thermoelectric particles fall and are loaded between the two ceramic substrates.

[0013] A sieve plate is used for screening P-type and N-type thermoelectric particles. The sieve plate enters the storage tank containing P-type thermoelectric particles; at this time, the P-type loading hole is open and the N-type loading hole is closed, and the P-type thermoelectric particles are loaded into the P-type loading hole. The sieve plate then enters the storage tank containing N-type thermoelectric particles; at this time, the N-type loading hole is open and the P-type loading hole is closed, and the N-type thermoelectric particles are loaded into the N-type loading hole. Through two screening processes, all P-type and N-type thermoelectric particles are loaded onto the sieve plate. The sieve plate is then transferred to the ceramic substrate, allowing the P-type and N-type thermoelectric particles to fall and be loaded between the two ceramic substrates in one pass, greatly improving work efficiency.

[0014] Preferably, a sliding frame that moves left and right is installed on the screen plate, and a screen baffle that moves back and forth is installed on the sliding frame. Screen holes are provided on the screen baffle. The left and right movement of the sliding frame causes the screen holes to switch and align with the P-type and N-type loading holes. The back and forth movement of the screen baffle causes the screen holes to be misaligned with the P-type and N-type loading holes.

[0015] The sliding frame and screen baffle facilitate the screening of P-type and N-type thermoelectric particles by the screen plate. The sliding frame moves left and right to switch the screen holes between the P-type and N-type loading holes. When the screen hole is aligned with the P-type loading hole, the P-type loading hole is open and the N-type loading hole is closed, allowing the screen plate to enter the storage tank containing P-type thermoelectric particles and load them into the P-type loading hole. Conversely, when the sliding frame moves to align the screen hole with the N-type loading hole, the N-type loading hole is open and the P-type loading hole is closed, allowing the screen plate to enter the storage tank containing N-type thermoelectric particles and load them into the N-type loading hole.

[0016] After the P-type and N-type thermoelectric particles are loaded into the sieve plate, the sieve baffle moves back and forth to misalign the sieve holes with the P-type and N-type loading holes, so that the sieve baffle covers the P-type and N-type loading holes and prevents the P-type and N-type thermoelectric particles from slipping off the sieve plate.

[0017] Preferably, a movable baffle plate is installed inside the sieve plate, and a material passage hole is provided on the baffle plate. Both the P-type and N-type material passage holes are misaligned with the material passage holes. The baffle plate moves so that both the P-type and N-type material passage holes are connected to the material passage holes.

[0018] Both the P-type and N-type loading holes are offset from the feed holes on the baffle plate, allowing the baffle plate to support the P-type thermoelectric particles in the P-type loading holes and the N-type thermoelectric particles in the N-type loading holes. When the sieve plate moves to the ceramic substrate, the baffle plate moves, aligning the P-type and N-type loading holes with the feed holes, allowing the P-type and N-type thermoelectric particles to fall and be supported on the ceramic substrate, making contact with the solder paste. The baffle plate facilitates the feeding of P-type and N-type thermoelectric particles.

[0019] Another option is to set negative pressure adsorption holes inside the sieve plate, and to set ventilation holes at the bottom of both the P-type and N-type loading holes that are connected to the negative pressure adsorption holes.

[0020] After the P-type and N-type thermoelectric particles are loaded into the sieve plate, negative pressure is generated by evacuating the negative pressure adsorption holes. The negative pressure adsorption and positioning of the P-type thermoelectric particles in the P-type loading holes and the N-type thermoelectric particles in the N-type loading holes are achieved through the vent holes.

[0021] Preferably, in step S2, the ceramic substrate is positioned by a loading seat with a positioning groove. The ceramic substrate is loaded into the positioning groove to complete the loading of P-type and N-type thermoelectric particles. In step S3, the loading seat is transferred to the welding furnace for welding.

[0022] The mounting base is equipped with positioning grooves to position the ceramic substrate, ensuring the reliability of welding and the accuracy of installation position.

[0023] Preferably, a movable support plate is provided at the bottom of the positioning groove, and the ceramic substrate is supported on the support plate.

[0024] The support plate is designed to move up and down, allowing adjustment of the positioning groove depth. First, the lower ceramic substrate is inserted into the positioning groove, with its upper surface flush with the upper surface of the loading seat. Then, the sieve plate supports the loading seat, and P-type and N-type thermoelectric particles are fed onto the solder paste on the ceramic substrate. The support plate lowers its movement height, and then another ceramic substrate is loaded into the positioning groove, sandwiching the P-type and N-type thermoelectric particles between the two substrates. After soldering, the support plate moves upward, pushing out the cooling module for easy unloading.

[0025] Compared with the prior art, the beneficial effects of the present invention are: (1) Each thermoelectric semiconductor component of the refrigeration module is independent of each other, and each PN junction is powered separately. If any thermoelectric semiconductor component is damaged, it will not affect the normal operation of other thermoelectric semiconductor components, so that the product can continue to be used, thereby extending the service life of the product; (2) In the manufacturing process of the refrigeration module, all P-type thermoelectric particles and N-type thermoelectric particles are loaded onto the sieve plate through two screenings. Then the sieve plate is transferred to the ceramic substrate, so that the P-type thermoelectric particles and N-type thermoelectric particles fall and are loaded between the two ceramic substrates at once, which greatly improves the welding efficiency. Attached Figure Description

[0026] Figure 1 This is a structural diagram of the refrigeration module of the present invention.

[0027] Figure 2 This is a structural diagram of the ceramic substrate of the present invention.

[0028] Figure 3 This is a cross-sectional view of the refrigeration module of the present invention.

[0029] Figure 4 This is a structural diagram of the sieve plate according to Embodiment 1 of the present invention.

[0030] Figure 5 This is a structural diagram of the sliding frame according to Embodiment 1 of the present invention.

[0031] Figure 6 This is a structural diagram of the loading seat of the present invention.

[0032] Figure 7 This is a structural diagram of the sieve plate according to Embodiment 2 of the present invention.

[0033] In the diagram: 1. Ceramic substrate, 2. Thermoelectric semiconductor component, 3. Busbar, 4. Welding point, 5. P-type thermoelectric particle, 6. N-type thermoelectric particle, 7. Conductive sheet, 8. Sieve plate, 9. P-type loading hole, 10. N-type loading hole, 11. Loading seat, 12. Slide rod, 13. Screening baffle, 14. Positioning rod, 15. Tension spring, 16. Slot, 17. Slide rail, 18. Spring pin, 19. Screening hole, 20. Material blocking baffle, 21. Material passage hole, 22. Baffle body, 23. Connector, 24. Insertion slot, 25. Positioning spring, 26. Positioning block, 27. Stepped surface, 28. Positioning post, 29. Dovetail groove, 30. Protrusion, 31. Positioning strip, 32. Negative pressure adsorption hole, 33. Vent hole, 34. Positioning groove, 35. Support plate. Detailed Implementation

[0034] The technical solution of the present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Example 1: A refrigeration module (see Figure 1 , Figure 2 , Figure 3 The device includes two ceramic substrates 1 and multiple thermoelectric semiconductor components 2 connected between the two ceramic substrates 1, with the thermoelectric semiconductor components 2 arranged in several rows at intervals. Several busbars 3 are spaced apart on one of the ceramic substrates 1, with multiple thermoelectric semiconductor components 2 connected in parallel between adjacent busbars 3. Several solder points 4, corresponding one-to-one with thermoelectric semiconductor components 2, are spaced apart on the edges of the busbars 3, with the solder points 4 on adjacent busbars 3 positioned opposite each other. The solder points 4 facilitate the soldering of the thermoelectric semiconductor components 2 to the busbars 3.

[0035] The thermoelectric semiconductor component 2 includes P-type thermoelectric particles 5, N-type thermoelectric particles 6, and a conductive sheet 7. The conductive sheet 7 is disposed on another ceramic substrate 1. One end of each of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 is connected to the conductive sheet 7, and the other end of each is connected to two adjacent busbars 3. Both the busbars 3 and the conductive sheet 7 are made of copper. The conductive sheet 7 connects the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 together to form PN junctions. Each PN junction is powered independently, and the failure of a single PN junction will not cause the entire product to be scrapped. After the current passes through a row of PN junctions, it converges at the busbar 3 and is then transmitted to the next row of PN junctions, and so on, forming a complete product.

[0036] Each thermoelectric semiconductor component 2 in the cooling module is independent of each other, and each PN junction is powered separately. If any thermoelectric semiconductor component 2 is damaged, it will not affect the normal operation of other thermoelectric semiconductor components 2, allowing the product to continue to be used and thus extending the product's service life.

[0037] A method for manufacturing a refrigeration module (see [reference]) Figure 4 , Figure 5 , Figure 6 The fabrication of the cooling module includes the following steps: S1, applying solder paste to the ceramic substrate 1; the solder paste is applied to the conductive sheet 7 of one ceramic substrate 1 and the solder joint 4 of the busbar 3 of another ceramic substrate 1.

[0038] In step S2, P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded between the two ceramic substrates 1. In step S2, a sieve plate 8 is used for sieving; the sieve plate 8 has P-type loading holes 9 and N-type loading holes 10, which correspond one-to-one with the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 on the refrigeration module. The depth of the P-type loading holes 9 and N-type loading holes 10 is greater than the height of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6. In step S2, the ceramic substrate 1 is positioned using a loading seat 11, which has a positioning groove 34. The ceramic substrate 1 is placed in the positioning groove 34 to complete the loading of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6. A lifting and moving support plate 35 is provided at the bottom of the positioning groove 34, and the ceramic substrate 1 is supported on the support plate 35. Several guide pillars are connected to the bottom of the support plate 35. The loading seat 11 is provided with guide holes corresponding to the guide pillars. The guide pillars are inserted and connected to the guide holes. A lifting piston cylinder is installed on the loading seat 11, and the telescopic rod of the lifting piston cylinder is connected to the support plate 35. A positioning groove 34 is provided on the loading seat 11 to achieve positioning of the ceramic substrate 1, ensuring the reliability of welding and the accuracy of installation position.

[0039] A sliding frame that moves left and right is installed on the sieve plate 8. A screening baffle 13 that moves back and forth is installed on the sliding frame. The screening baffle 13 fits against the upper surface of the sieve plate 8. The sliding frame includes two sliding rods 12. A positioning rod 14 is connected between the two sliding rods 12 to form a U-shaped structure. The positioning rod 14 is connected to one end of the two sliding rods 12. A tension spring 15 is installed between the other end of the two sliding rods 12 and the sieve plate 8. Slots 16 and protruding slide rails 17 are provided on the opposite surfaces of the two sliding rods 12. Slide grooves are provided on the opposite side walls of the sieve plate 8. The slide rails 17 are movably inserted into the slide grooves, so that the slide rails 17 can slide along the slide grooves. Positioning rod 14 abuts against the side wall of screen plate 8 to position the sliding frame. A spring pin 18 is installed on slide rod 12, with its end abutting against the side wall of screen plate 8. When the positioning rod 14 pulls slide rod 12, the spring pin 18 slides with slide rod 12. After slide rod 12 slides to its final position, the spring pin 18 pops outward and is limited at the end of screen plate 8, thus positioning slide rod 12. Screening baffle 13 is fitted into slots 16 on the two slide rods 12, allowing the screening baffle 13 to move back and forth.

[0040] Screening baffle 13 is provided with screening holes 19. The sliding frame moves left and right to switch the alignment of screening holes 19 with P-type loading holes 9 and N-type loading holes 10. Screening baffle 13 moves back and forth to misalign screening holes 19 with P-type loading holes 9 and N-type loading holes 10. The number of screening holes 19 on screening baffle 13 is the same as the number of P-type loading holes 9 or N-type loading holes 10 on screen plate 8.

[0041] The sieve plate 8 enters the storage tank containing P-type thermoelectric particles 5 and N-type thermoelectric particles 6 respectively for screening, so that the P-type thermoelectric particles 5 are loaded into the P-type loading hole 9 and the N-type thermoelectric particles 6 are loaded into the N-type loading hole 10; then the sieve plate 8 is transferred to the ceramic substrate 1, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and are loaded between the two ceramic substrates 1.

[0042] A movable baffle plate 20 is installed inside the sieve plate 8. A material passage hole 21 is provided on the baffle plate 20. The P-type material passage hole 9 and the N-type material passage hole 10 are both misaligned with the material passage hole 21. The baffle plate 20 is moved so that the P-type material passage hole 9 and the N-type material passage hole 10 are connected to the material passage hole 21. The baffle plate 20 includes several baffle bodies 22 and connecting bodies 23. Several insertion slots 24 are provided on the screen plate 8 at intervals. P-type loading holes 9 and N-type loading holes 10 are all connected to the insertion slots 24. The baffle bodies 22 are inserted and connected to the insertion slots one by one. One end of each baffle body 22 is connected to the connecting body 23. The other end of the baffle body 22 is connected to the screen plate 8 with a positioning spring 25. The connecting body 23 is pressed against the outer wall of the screen plate 8. The other end of the baffle body 22 is connected to the positioning block 26. A stepped surface 27 is provided in the insertion slot 24. The distance between the positioning block 26 and the stepped surface 27 forms the moving distance of the baffle plate 20.

[0043] The sliding frame and screen baffle 13 facilitate the screening operation of the screen plate 8 for P-type thermoelectric particles 5 and N-type thermoelectric particles 6. The sliding frame moves left and right, switching the screen hole 19 between the P-type loading hole 9 and the N-type loading hole 10. When the screen hole 19 is aligned with the P-type loading hole 9, the P-type loading hole 9 is open, and the N-type loading hole 10 is closed. The screen plate 8 then enters the storage tank containing the P-type thermoelectric particles 5, allowing the P-type thermoelectric particles 5 to be loaded into the P-type loading hole 9. The sliding frame moves again, aligning the screen hole 19 with the N-type loading hole 10. At this point, the N-type loading hole 10 is open, and the P-type loading hole 9 is closed. The screen plate 8 then enters the storage tank containing the N-type thermoelectric particles 6, allowing the N-type thermoelectric particles 6 to be loaded into the N-type loading hole 10.

[0044] After the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded into the sieve plate 8, the sieve baffle 13 moves back and forth to make the sieve hole 19 misaligned with the P-type loading hole 9 and the N-type loading hole 10, so that the sieve baffle 13 covers the P-type loading hole 9 and the N-type loading hole 10, preventing the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 from slipping off the sieve plate 8.

[0045] Both the P-type loading hole 9 and the N-type loading hole 10 are misaligned with the feed hole 21 on the baffle plate 20, allowing the baffle plate 20 to support the P-type thermoelectric particles 5 in the P-type loading hole 9 and the N-type thermoelectric particles 6 in the N-type loading hole 10. The sieve plate 8 moves to the ceramic substrate 1, and the baffle plate 20 moves so that the P-type loading hole 9 and the N-type loading hole 10 are aligned with the feed hole 21, allowing the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 to fall and be supported on the ceramic substrate 1, making contact with the solder paste. The baffle plate 20 facilitates the feeding of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6.

[0046] The loading base 11 is provided with several positioning posts 28, and the lower surface of the sieve plate 8 is provided with several positioning holes corresponding to the positioning posts 28. First, the ceramic substrate 1 with the busbar 3 is installed in the positioning groove 34. The positioning groove 34 is adapted to the ceramic substrate 1 for positioning. The support plate 35 supports the ceramic substrate 1. At this time, the upper surface of the ceramic substrate 1 is flush with the upper surface of the loading base 11. Then, the sieve plate 8, which is filled with P-type thermoelectric particles 5 and N-type thermoelectric particles 6, is supported on the loading base 11. The positioning holes on the sieve plate 8 are inserted into the positioning posts 28 on the loading base 11 to achieve positioning. Then, the baffle plate 20 is pulled so that the P-type loading hole 9 and N-type loading hole 10 are connected to the corresponding feed hole 21, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and are supported on the ceramic substrate 1 and come into contact with the solder paste. Then the support plate 35 descends, the sieve plate 8 is removed, and the ceramic substrate 1 with the conductive sheet 7 is loaded into the positioning groove 34, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are sandwiched between the two ceramic substrates 1.

[0047] S3, Heating and Welding. The loading seat 11 is transferred into the welding furnace for welding. After welding is completed, the support plate 35 moves upward, pushing the refrigeration module upward for unloading.

[0048] In the manufacturing process of the refrigeration module, all P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded onto the sieve plate 8 through two screenings. Then, the sieve plate 8 is transferred to the ceramic substrate 1, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and are loaded between the two ceramic substrates 1 in one go, which greatly improves the welding efficiency.

[0049] Example 2: A refrigeration module (see Figure 1 , Figure 2 , Figure 3 The device includes two ceramic substrates 1 and multiple thermoelectric semiconductor components 2 connected between the two ceramic substrates 1, with the thermoelectric semiconductor components 2 arranged in several rows at intervals. Several busbars 3 are spaced apart on one of the ceramic substrates 1, with multiple thermoelectric semiconductor components 2 connected in parallel between adjacent busbars 3. Several solder points 4, corresponding one-to-one with thermoelectric semiconductor components 2, are spaced apart on the edges of the busbars 3, with the solder points 4 on adjacent busbars 3 positioned opposite each other. The solder points 4 facilitate the soldering of the thermoelectric semiconductor components 2 to the busbars 3.

[0050] The thermoelectric semiconductor component 2 includes P-type thermoelectric particles 5, N-type thermoelectric particles 6, and a conductive sheet 7. The conductive sheet 7 is disposed on another ceramic substrate 1. One end of each of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 is connected to the conductive sheet 7, and the other end of each is connected to two adjacent busbars 3. Both the busbars 3 and the conductive sheet 7 are made of copper. The conductive sheet 7 connects the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 together to form PN junctions. Each PN junction is powered independently, and the failure of a single PN junction will not cause the entire product to be scrapped. After the current passes through a row of PN junctions, it converges at the busbar 3 and is then transmitted to the next row of PN junctions, and so on, forming a complete product.

[0051] Each thermoelectric semiconductor component 2 in the cooling module is independent of each other, and each PN junction is powered separately. If any thermoelectric semiconductor component 2 is damaged, it will not affect the normal operation of other thermoelectric semiconductor components 2, allowing the product to continue to be used and thus extending the product's service life.

[0052] A method for manufacturing a refrigeration module (see [reference]) Figure 6 , Figure 7 The fabrication of the cooling module includes the following steps: S1, applying solder paste to the ceramic substrate 1; the solder paste is applied to the conductive sheet 7 of one ceramic substrate 1 and the solder joint 4 of the busbar 3 of another ceramic substrate 1.

[0053] In step S2, P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded between the two ceramic substrates 1. In step S2, a sieve plate 8 is used for sieving; the sieve plate 8 has P-type loading holes 9 and N-type loading holes 10, which correspond one-to-one with the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 on the refrigeration module. The depth of the P-type loading holes 9 and N-type loading holes 10 is greater than the height of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6. In step S2, the ceramic substrate 1 is positioned using a loading seat 11, which has a positioning groove 34. The ceramic substrate 1 is loaded into the positioning groove 34 to complete the loading of the P-type thermoelectric particles 5 and N-type thermoelectric particles 6. A lifting and moving support plate 35 is provided at the bottom of the positioning groove 34, and the ceramic substrate 1 is supported on the support plate 35. Several guide pillars are connected to the bottom of the support plate 35. The loading seat 11 is provided with guide holes corresponding to the guide pillars. The guide pillars are inserted and connected to the guide holes. A lifting piston cylinder is installed on the loading seat 11, and the telescopic rod of the lifting piston cylinder is connected to the support plate 35. A positioning groove 34 is provided on the loading seat 11 to achieve positioning of the ceramic substrate 1, ensuring the reliability of welding and the accuracy of installation position.

[0054] A sliding frame that moves left and right is installed on the sieve plate 8. A screening baffle 13 that moves back and forth is installed on the sliding frame. The screening baffle 13 fits against the upper surface of the sieve plate 8. The sliding frame includes two sliding rods 12, and a positioning rod 14 is connected between the two sliding rods 12 to form a U-shaped structure. The positioning rod 14 is detachably connected to one end of the two sliding rods 12. A dovetail groove 29 is provided on the sliding rod 12. A protruding strip 30 that matches the dovetail groove 29 is provided at the end of the positioning rod 14. The protruding strip 30 is slidably connected to the dovetail groove 29. The other end of the two sliding rods 12 is connected to the positioning strip 31 through a tension spring 15. The positioning strip 31 abuts against the side wall of the sieve plate 8. Slots 16 and protruding slide rails 17 are provided on the opposite surfaces of the two sliding rods 12. Slide grooves are provided on the opposite side walls of the sieve plate 8. The slide rail 17 is movably inserted into the slide groove, so that the slide rail 17 can slide along the slide groove. Positioning rod 14 abuts against the side wall of screen plate 8 to position the sliding frame. A spring pin 18 is installed on slide rod 12, with its end abutting against the side wall of screen plate 8. When the positioning rod 14 pulls slide rod 12, the spring pin 18 slides with slide rod 12. After slide rod 12 slides to its final position, the spring pin 18 pops outward and is limited at the end of screen plate 8, thus positioning slide rod 12. Screening baffle 13 is fitted into slots 16 on the two slide rods 12, allowing the screening baffle 13 to move back and forth.

[0055] Screening baffle 13 is provided with screening holes 19. The sliding frame moves left and right to switch the alignment of screening holes 19 with P-type loading holes 9 and N-type loading holes 10. Screening baffle 13 moves back and forth to misalign screening holes 19 with P-type loading holes 9 and N-type loading holes 10. The number of screening holes 19 on screening baffle 13 is the same as the number of P-type loading holes 9 or N-type loading holes 10 on screen plate 8.

[0056] The sieve plate 8 enters the storage tank containing P-type thermoelectric particles 5 and N-type thermoelectric particles 6 respectively for screening, so that the P-type thermoelectric particles 5 are loaded into the P-type loading hole 9 and the N-type thermoelectric particles 6 are loaded into the N-type loading hole 10; then the sieve plate 8 is transferred to the ceramic substrate 1, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and are loaded between the two ceramic substrates 1.

[0057] The sieve plate 8 is provided with negative pressure adsorption holes 32. The bottom of the P-type loading hole 9 and the N-type loading hole 10 are provided with vent holes 33 that communicate with the negative pressure adsorption holes 32. After the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded into the sieve plate 8, they draw air from the negative pressure adsorption holes 32 to generate negative pressure, and achieve negative pressure adsorption and positioning of the P-type thermoelectric particles 5 in the P-type loading hole 9 and the N-type thermoelectric particles 6 in the N-type loading hole 10 through the vent holes 33.

[0058] The sliding frame and screen baffle 13 facilitate the screening operation of the screen plate 8 for P-type thermoelectric particles 5 and N-type thermoelectric particles 6. The sliding frame moves left and right, switching the screen hole 19 between the P-type loading hole 9 and the N-type loading hole 10. When the screen hole 19 is aligned with the P-type loading hole 9, the P-type loading hole 9 is open, and the N-type loading hole 10 is closed. The screen plate 8 then enters the storage tank containing the P-type thermoelectric particles 5, allowing the P-type thermoelectric particles 5 to be loaded into the P-type loading hole 9. The sliding frame moves again, aligning the screen hole 19 with the N-type loading hole 10. At this point, the N-type loading hole 10 is open, and the P-type loading hole 9 is closed. The screen plate 8 then enters the storage tank containing the N-type thermoelectric particles 6, allowing the N-type thermoelectric particles 6 to be loaded into the N-type loading hole 10.

[0059] After the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded into the sieve plate 8, the sieve baffle 13 moves back and forth to make the sieve hole 19 misaligned with the P-type loading hole 9 and the N-type loading hole 10, so that the sieve baffle 13 covers the P-type loading hole 9 and the N-type loading hole 10, preventing the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 from slipping off the sieve plate 8.

[0060] The sieve plate 8 is moved to the ceramic substrate 1, the positioning rod 14 and the slide rod 12 are removed, and negative pressure is generated by evacuating the negative pressure adsorption hole 32. The negative pressure adsorption and positioning of the P-type thermoelectric particles 5 in the P-type loading hole 9 and the N-type thermoelectric particles 6 in the N-type loading hole 10 are achieved through the vent hole 33. The sieve plate 8 is flipped so that the openings of the P-type loading hole 9 and the N-type loading hole 10 face downwards. After the evacuation of the negative pressure adsorption hole 32 stops, the P-type thermoelectric particles 5 and the N-type thermoelectric particles 6 fall and are supported on the ceramic substrate 1 under the action of gravity and come into contact with the solder paste.

[0061] The loading base 11 is provided with several positioning posts 28, and the lower surface of the sieve plate 8 is provided with several positioning holes corresponding to the positioning posts 28. First, the ceramic substrate 1 with the busbar 3 is installed in the positioning groove 34, and the positioning groove 34 is adapted to the ceramic substrate 1 for positioning. The support plate 35 supports the ceramic substrate 1, and at this time, the upper surface of the ceramic substrate 1 is flush with the upper surface of the loading base 11. Then, the sieve plate 8, which is filled with P-type thermoelectric particles 5 and N-type thermoelectric particles 6, is supported on the loading base 11. The negative pressure adsorption hole 32 is evacuated, and the openings of the P-type loading hole 9 and N-type loading hole 10 face downward. The positioning holes on the sieve plate 8 are inserted into the positioning posts 28 on the loading base 11 to achieve positioning. After the negative pressure adsorption hole 32 stops evacuating, the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and support the ceramic substrate 1 under the action of gravity and come into contact with the solder paste. Then the support plate 35 descends, the sieve plate 8 is removed, and the ceramic substrate 1 with the conductive sheet 7 is loaded into the positioning groove 34, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are sandwiched between the two ceramic substrates 1.

[0062] S3, Heating and Welding. The loading seat 11 is transferred into the welding furnace for welding. After welding is completed, the support plate 35 moves upward, pushing the refrigeration module upward for unloading.

[0063] In the manufacturing process of the refrigeration module, all P-type thermoelectric particles 5 and N-type thermoelectric particles 6 are loaded onto the sieve plate 8 through two screenings. Then, the sieve plate 8 is transferred to the ceramic substrate 1, so that the P-type thermoelectric particles 5 and N-type thermoelectric particles 6 fall and are loaded between the two ceramic substrates 1 in one go, which greatly improves the welding efficiency.

[0064] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications may be made without departing from the technical solutions described in the claims.

Claims

1. A cooling module, characterized in that, It includes two ceramic substrates and multiple thermoelectric semiconductor components connected between the two ceramic substrates. Several busbars are spaced apart on one ceramic substrate, and multiple thermoelectric semiconductor components are connected in parallel between adjacent busbars.

2. A refrigeration module according to claim 1, characterized in that, The thermoelectric semiconductor assembly includes P-type thermoelectric particles, N-type thermoelectric particles, and a conductive sheet. The conductive sheet is disposed on another ceramic substrate. One end of each of the P-type and N-type thermoelectric particles is connected to the conductive sheet, and the other end of each of the P-type and N-type thermoelectric particles is connected to two adjacent busbars, respectively.

3. A refrigeration module according to claim 1, characterized in that, Several welding points, each corresponding to a thermoelectric semiconductor component, are spaced apart along the edge of the busbar, with the welding points extending beyond the edge of the busbar.

4. A method for manufacturing a refrigeration module, comprising manufacturing the refrigeration module according to any one of claims 1 to 3, characterized in that, Includes the following steps: S1, apply solder paste to the ceramic substrate; S2, load P-type thermoelectric particles and N-type thermoelectric particles between the two ceramic substrates; S3, heat and solder.

5. The method for manufacturing a refrigeration module according to claim 4, characterized in that, In step S2, the material is first screened using a sieve plate. The sieve plate is equipped with P-type and N-type loading holes. The sieve plate enters the storage tank containing P-type thermoelectric particles and N-type thermoelectric particles respectively to screen the material, so that the P-type thermoelectric particles are loaded into the P-type loading holes and the N-type thermoelectric particles are loaded into the N-type loading holes. Then the sieve plate is transferred to the ceramic substrate, so that the P-type thermoelectric particles and N-type thermoelectric particles fall and are loaded between the two ceramic substrates.

6. The method for manufacturing a refrigeration module according to claim 5, characterized in that, A sliding frame that moves left and right is installed on the sieve plate. A screening baffle that moves back and forth is installed on the sliding frame. Screening holes are provided on the screening baffle. The left and right movement of the sliding frame causes the screening holes to switch and align with the P-type and N-type loading holes. The back and forth movement of the screening baffle causes the screening holes to be misaligned with the P-type and N-type loading holes.

7. The method for manufacturing a refrigeration module according to claim 5, characterized in that, A movable baffle plate is installed inside the sieve plate. The baffle plate is provided with material passage holes. The P-type material passage holes and N-type material passage holes are both misaligned with the material passage holes. The baffle plate moves so that the P-type material passage holes and N-type material passage holes are connected to the material passage holes.

8. The method for manufacturing a refrigeration module according to claim 5, characterized in that, Negative pressure adsorption holes are provided inside the sieve plate, and ventilation holes that communicate with the negative pressure adsorption holes are provided at the bottom of both the P-type and N-type loading holes.

9. The method for manufacturing a refrigeration module according to any one of claims 4 to 8, characterized in that, In step S2, the ceramic substrate is positioned by the loading seat, which has a positioning groove. The ceramic substrate is placed in the positioning groove to complete the loading of P-type and N-type thermoelectric particles. In step S3, the loading seat is transferred to the welding furnace for welding.

10. The method for manufacturing a refrigeration module according to claim 9, characterized in that, A movable support plate is provided at the bottom of the positioning groove, and the ceramic substrate is supported on the support plate.

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