Thermoelectric refrigerator module

Abstract

The application discloses a thermoelectric refrigerator module, which comprises a refrigerator, a heat end radiator is attached to the refrigerator, the heat end radiator comprises a radiator cavity, a flow channel cavity and an evaporation cavity are arranged in the radiator cavity, the evaporation cavity comprises an upwardly-inclined evaporation opening, heat exchange foam metal is detachably connected in the flow channel cavity, evaporation foam metal is detachably connected in the evaporation cavity, a plurality of seepage holes are arranged on the heat exchange foam metal and the evaporation foam metal, the evaporation foam metal abuts against the heat exchange foam metal, and the evaporation cavity is communicated with the flow channel cavity. The application provides a thermoelectric refrigerator module, which can simplify the structure of the flow channel, reduce the production cost, make the heat dissipation mode more various, and improve the heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigeration technology, and more particularly to a thermoelectric refrigeration module. Background Technology

[0002] For example, publication number "CN222927021U" discloses "a portable water-cooled radiator," which includes a support frame. The inner wall of the support frame is provided with a portable mechanism for easy carrying. The four corners of the upper surface of the portable mechanism are provided with protective mechanisms to improve the protection effect. The portable mechanism includes a cooling radiator, a heat exchange fan, and a retractable plate. However, in practical applications, water-cooled radiators require the use of relatively complex water-cooling channels, and the heat dissipation method is relatively simple, resulting in low heat dissipation efficiency. Summary of the Invention

[0003] In view of the problems mentioned in the background art, such as the need for complex flow channels and the limited heat dissipation methods in existing water cooling technologies, this invention provides a thermoelectric cooler module that simplifies the flow channel structure, reduces production costs, and makes heat dissipation methods more diverse and improves heat dissipation efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution.

[0005] A thermoelectric cooler module includes a cooler with a hot-end heat sink attached to it. The hot-end heat sink includes a heat sink cavity, a flow channel cavity and an evaporation cavity are provided in the heat sink cavity, the evaporation cavity includes an upwardly inclined evaporation opening, a heat exchange foam metal is detachably connected to the flow channel cavity, and an evaporation foam metal is detachably connected to the evaporation cavity. Both the heat exchange foam metal and the evaporation foam metal are provided with a plurality of seepage holes. The evaporation foam metal abuts against the heat exchange foam metal, and the evaporation cavity communicates with the flow channel cavity.

[0006] Preferably, the hot-end heat sink includes an inlet and an outlet communicating with the flow channel cavity, the inlet being located at the top of the hot-end heat sink and the outlet being located at the bottom of the hot-end heat sink.

[0007] Preferably, the hot end radiator includes a radiator end cap, which is connected to the top of the flow channel cavity.

[0008] Preferably, the inlet and outlet are located on the side of the hot-end radiator away from the evaporation chamber.

[0009] Preferably, the radiator end cover is provided with a connection hole, the radiator cavity is provided with a mating hole, and metal screws are connected to the connection hole and the mating hole.

[0010] Preferably, the porosity of the evaporating foam metal is less than that of the heat exchange foam metal.

[0011] Preferably, the heat sink includes an outer plate, and a connecting unit is provided on the outer plate.

[0012] Preferably, the evaporation chamber includes an inclined bottom plate and an inclined top plate, both of which are inclined upward at the ends away from the flow channel cavity, and an evaporation opening is formed between the inclined top plate and the inclined bottom plate.

[0013] Preferably, the cooler includes an outer substrate disposed on both sides, a plurality of PN junctions disposed between the outer substrates, and a flow guide plate disposed between the PN junctions and the outer substrates.

[0014] Preferably, the plane containing the evaporation opening is arranged parallel to the direction of gravity.

[0015] The beneficial effects of this invention are as follows: (1) By setting heat exchange foam metal and evaporation foam metal in the flow channel cavity and evaporation cavity, the production steps required for processing the flow channel can be avoided, the processing efficiency can be improved, and the flow rate of the coolant can be controlled by the flow channel inside the foam metal to fully realize the heat exchange effect. (2) By the diffusion effect of the coolant in the evaporating foam metal through the surface tension, the coolant can achieve multiple heat dissipation through heat exchange with the foam metal and its own evaporation, thereby improving the heat dissipation efficiency. (3) By setting an inclined bottom plate and an inclined top plate, the leakage of coolant can be reduced, and the coolant can diffuse into the evaporating foam metal only after exchanging heat with the heat exchange foam metal, thus avoiding ineffective diffusion of coolant before complete heat exchange. Attached Figure Description

[0016] Figure 1 This is an exploded view of the present invention.

[0017] Figure 2 This is the first isometric view of the present invention.

[0018] Figure 3 This is an isometric sectional view of the present invention.

[0019] Figure 4 This is the second isometric view of the present invention.

[0020] Figure 5 This is an exploded view of the refrigerator in this invention.

[0021] In the picture: 1. Cooler, 11. Outer substrate, 12. PN junction, 13. Flow deflector; 2. Hot end radiator, 21. Radiator cavity, 211. Outlet, 22. Flow channel cavity, 23. Evaporation cavity, 231. Evaporation opening, 232. Inclined bottom plate, 233. Inclined top plate, 24. Heat exchange foam metal, 25. Evaporation foam metal, 26. Seepage hole, 27. Radiator end cover, 271. Inlet, 28. Outer plate, 281. Connection hole, 282. Butt hole, 283. Metal screw; 3. Cold end connector. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Example 1:

[0023] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a thermoelectric cooler module 1 includes a cooler 1, a hot-end heat sink 2 attached to the cooler 1, the hot-end heat sink 2 includes a heat sink cavity 21, a flow channel cavity 22 and an evaporation cavity 23 are provided in the heat sink cavity 21, the evaporation cavity 23 includes an upwardly inclined evaporation opening 231, a heat exchange foam metal 24 is detachably connected in the flow channel cavity 22, and an evaporation foam metal 25 is detachably connected in the evaporation cavity 23. Both the heat exchange foam metal 24 and the evaporation foam metal 25 are provided with a plurality of seepage holes 26, the evaporation foam metal 25 abuts against the heat exchange foam metal 24, and the evaporation cavity 23 is connected to the flow channel cavity 22.

[0024] Semiconductor coolers (also known as Peltier coolers) are solid-state heat pumps based on the Peltier effect. They achieve cooling or heating by directionally transferring heat from one end to the other through the application of direct current. Due to their advantages such as no moving parts, rapid response, precise temperature control, and flexible size, they have been widely used in key fields such as lasers, optical communications, and medical equipment. With the rapid increase in the power density of the cooled devices, the heat flow that needs to be dissipated at the hot end of the cooler has increased dramatically, and the heat dissipation efficiency directly limits the temperature difference and stability of the entire system. Therefore, developing a high-performance, highly reliable heat dissipation solution is the core challenge driving this technology towards higher power levels.

[0025] Currently, mainstream heat dissipation technologies mainly rely on forced air cooling or active liquid cooling. Forced air cooling requires a fan drive, which often results in large size and significant noise when dealing with large heat flows, and there is also a risk of fan failure. While active liquid cooling is more powerful, it relies on water pumps and complex piping, introducing energy consumption, noise, and cost, as well as the risk of leakage. The common drawback of both is that they rely on external power, increasing the complexity of the system and potential points of failure.

[0026] To improve the performance of heat sinks, traditional approaches focus on expanding the surface area (e.g., using fins) or employing heat pipe technology. The former offers limited enhancement in terms of fluid disturbance, while the latter suffers from complex manufacturing processes, insufficient long-term reliability, and the risk of complete failure upon leakage. For high-power applications, relying solely on sensible heat exchange has reached its limits. Utilizing the latent heat of liquid phase change is an effective way to overcome heat dissipation limitations; however, a mature solution for constructing a stable, efficient, and maintainable phase change heat dissipation structure under non-powered conditions remains lacking.

[0027] Furthermore, existing high-performance heat sinks generally face the challenge of poor maintainability. Liquid cooling systems are prone to scaling and are difficult to clean. Once sealed components such as heat pipes experience performance degradation or leakage, they cannot be repaired, leading to the scrapping of the entire heat sink unit and increasing the total life cycle cost.

[0028] In summary, existing technologies struggle to achieve a balance between non-powered operation, high-power heat dissipation capability, and long-term maintainability. Therefore, there is an urgent need for an innovative heat dissipation module design that can achieve efficient heat exchange and phase-change cooling passively without the need for fans or pumps, while also possessing an easily disassembled and cleanable structure to ensure the long-term reliable operation of high-power semiconductor cooling systems.

[0029] In this embodiment, the left and right sides of the cooler 1 are connected to a hot end heat sink 2 and a cold end connector 3. In this embodiment, the cold end heat sink is a finned heat sink. This is used as an example for illustration. The fins and airflow can exchange heat and dissipate heat on the flowing air. In actual applications, different components that need to dissipate heat can be connected according to the heat dissipation requirements.

[0030] Furthermore, in this embodiment, the hot-end radiator 2 and the cooler 1 are connected by a radiator cavity 21 within the hot-end radiator 2. The radiator cavity 21 has a hollow structure and is divided into two parts arranged side by side in the transverse direction: a flow channel cavity 22 and an evaporation cavity 23. A heat exchange foam metal 24 is connected within the flow channel cavity 22, and an evaporation foam metal 25 is disposed within the evaporation cavity 23. Both the heat exchange foam metal 24 and the evaporation foam metal 25 are provided with permeation holes 26, which fill the entire heat exchange foam metal 24 and the evaporation foam metal 25, thereby allowing the heat exchange foam metal 24 and the evaporation foam metal 25 to interact. The foamed metal 25 forms a three-dimensional mesh structure inside, which allows the coolant in the flow channel cavity 22 and evaporation cavity 23 to move from top to bottom and diffuse laterally due to the combined effect of surface tension and gravity, forming a filling effect similar to a sponge absorbing water. Since the foamed metal itself is made of metal, it has good thermal conductivity, and the coolant filled in it can achieve a rapid heat exchange effect. The heat exchange foamed metal 24 exchanges heat with the hot end radiator 2, thereby quickly transferring the heat exchanged from the hot end radiator 2 to the hot end side of the cooler 1 to the heat exchange foamed metal 24.

[0031] Furthermore, since the evaporating foam metal 25 and the heat exchange foam metal 24 are in contact in this embodiment, the evaporating foam metal 25 and the heat exchange foam metal 24 can achieve rapid diffusion through the surface tension of the coolant. The coolant can enter the evaporating foam metal 25 laterally. The evaporating foam metal 25 is located in the evaporation chamber 23. The inner cavity of the flow channel cavity 22 has a regular rectangular structure. The evaporation chamber 23 is not the same structure as the flow channel cavity 22. Instead, it adopts a setting method in which the evaporation opening 231 is tilted upward, thereby forming a structure with a parallelogram cross-section. One end of the evaporation chamber 23 is connected to the flow channel cavity 22, and the other end is the evaporation opening 231, which is connected to the outside.

[0032] During operation, the coolant flows downwards through the heat exchange foam metal 24 due to gravity. The flow resistance can be controlled by adjusting the porosity of the foam metal, thereby regulating the coolant's flow velocity within it. The foam metal, through its high thermal conductivity, conducts heat from the heat-dissipating surface of the cooler 1 to the cavity via its metal framework. It also increases the convective heat transfer area between the solid and liquid components. Furthermore, controlling its PPI value can regulate the coolant's flow velocity, reducing significant coolant loss. Another portion of the coolant enters the evaporating foam metal 25 through the contact effect between the evaporating foam metal 25 and the heat exchange foam metal 24, and diffuses laterally due to its surface tension. As heat accelerates evaporation, the coolant turns into vapor, carrying away more heat through latent heat of phase change. This results in three heat dissipation methods in this embodiment: firstly, heat is conducted and exchanged through the metal skeleton of the foam metal itself; secondly, the coolant flows inside the foam metal and convects with the metal skeleton for heat exchange; and thirdly, the coolant evaporates from the evaporation opening 231 of the evaporation chamber 23 for latent heat exchange, achieving multiple heat exchange effects. Furthermore, the complex arrangement of perforations 26 inside the foam metal forms an interlaced flow channel structure, which provides stable support and increases the contact area of ​​the coolant, enabling faster, more stable, and more uniform heat exchange. Moreover, by using foam metal as a material to replace machined flow channels, processing steps are saved, and production efficiency is improved.

[0033] Furthermore, in this embodiment, the connection methods between the evaporating foam metal 25 and the heat exchange foam metal 24 and the evaporation chamber 23 and the flow channel chamber 22 include, but are not limited to, snap-fit ​​connections, sleeve connections, and other connection methods that enable quick disassembly, separation, and installation. This allows for the replacement of the evaporating foam metal 25 and the heat exchange foam metal 24 during subsequent maintenance, improving operational efficiency and reducing operational difficulty.

[0034] like Figure 1As shown, the hot-end radiator 2 includes an inlet 271 and an outlet 211 communicating with the flow channel cavity 22. The inlet 271 is located at the top of the hot-end radiator 2, and the outlet 211 is located at the bottom of the hot-end radiator 2. The hot-end radiator 2 includes an inlet 271 and an outlet 211, wherein the inlet 271 is used for injecting coolant, and the outlet 211 is used for discharging coolant. The inlet 271 and outlet 211 are respectively located on both sides of the flow channel cavity 22, and both are communicating with the flow channel cavity 22. In the direction of gravity, the inlet 271 is located above the outlet 211. Further, the inlet 271 is located at the top of the hot-end radiator 2, and the outlet 211 is located at the bottom of the hot-end radiator 2. Preferably, the inlet 271 and outlet 211 are vertically aligned. This design allows the coolant to move downwards in the heat exchange foam metal 24 under gravity after being injected into the inlet 271. This eliminates the need for a power source such as a water pump in the hot-end radiator 2, simplifies the structure and number of components of the hot-end radiator 2, simplifies the assembly process, and reduces production costs. Furthermore, the coolant's own gravity and the porous structure of the foam metal control the rate of its descent. The complex flow channels reduce the flow velocity of the coolant, ensuring sufficient heat exchange between the coolant and the foam metal.

[0035] like Figure 1 As shown, the hot-end radiator 2 includes a radiator end cap 27, which is connected to the top of the flow channel cavity 22. The radiator end cap 27 is provided on the hot-end radiator 2, making it separate from the radiator cavity 21. The radiator end cap 27 is located at the top of the flow channel cavity 22, sealing the top of the flow channel cavity 22. By disassembling and installing the radiator end cap 27, the replacement of the heat exchange foam metal 24 inside the flow channel cavity 22 can be quickly completed, thus achieving convenient replacement of the heat exchange foam metal 24.

[0036] like Figure 3 As shown, the inlet 271 and outlet 211 are located on the side of the hot-end radiator 2 away from the evaporation chamber 23. By positioning the inlet 271 and outlet 211 on the side of the hot-end radiator 2 away from the evaporation chamber 23, the coolant can exchange heat on the side closer to the refrigerator 1, quickly removing the heat exchanged between the hot surface of the refrigerator 1 and the hot-end radiator 2. When the coolant diffuses on the side away from the refrigerator 1 (diffusion on the side closer to the evaporation chamber 23), the diffused coolant has already undergone some heat exchange and has a higher temperature, thereby improving the subsequent evaporation efficiency in the evaporating foam metal 25.

[0037] like Figure 1As shown, the radiator end cap 27 has a connecting hole 281, and the radiator cavity 21 has a mating hole 282. Metal screws 283 are connected to the connecting hole 281 and the mating hole 282. The connecting hole 281 on the radiator end cap 27 connects to the radiator cavity 21, and the mating hole 282 on the radiator cavity 21 aligns with the connecting hole 281 when the radiator end cap 27 is attached to the radiator cavity 21. The metal screws 283 are then used to connect and secure the connecting hole 281 and the mating hole 282. After prolonged use, scale or impurities may appear inside the foamed metal, and oxidation may even occur. This can be addressed by removing the metal screws 283 to separate the radiator cavity 21 from the radiator end cap 27, removing the foamed metal, and cleaning or reprocessing it to extend the service life of the entire device.

[0038] The porosity of the evaporating foam metal 25 is less than that of the heat exchange foam metal 24. The porosity of the foam metal affects the degree of capillary action dominated by the surface tension of the coolant. In this embodiment, the porosity of the evaporating foam metal 25 is set to be less than that of the heat exchange foam metal 24, thereby enhancing the evaporation capacity of the coolant in the evaporating foam metal 25, improving the evaporation effect of the coolant in the evaporating foam metal 25, and improving the heat exchange efficiency.

[0039] like Figure 2 , Figure 4 As shown, the hot-end radiator 2 includes an outer extension plate 28, on which connecting units are provided. The outer extension plate 28 extends to both sides of the body of the hot-end radiator 2. Connecting units are provided on the outer extension plate 28, including connecting holes 281 on the radiator end cover 27, mating holes 282 on the radiator cavity 21, and metal screws 283 connecting the connecting holes 281 and the mating holes 282. Furthermore, the hot-end radiator 2, the cooler 1, and the cold-end connector 3 need to be connected. The hot-end radiator 2 and the cold-end connector 3 clamp the cooler 1 in the middle. The hot-end radiator 2 and the cold-end connector 3 are provided with through holes that can be passed through the screws. The three are connected and fixed by screws. In this embodiment, the screws connecting the hot-end radiator 2 and the cold-end connector 3 are made of polyethylene. Since the hot-end radiator 2 and the cold-end connector 3 are connected by screws, the material is set to polyethylene, which can reduce the heat transfer between the hot and cold ends.

[0040] like Figure 3As shown, the evaporation chamber 23 includes an inclined bottom plate 232 and an inclined top plate 233. The ends of both the inclined bottom plate 232 and the inclined top plate 233 that are away from the flow channel cavity 22 are both inclined upwards, forming an evaporation opening 231 between the inclined top plate 233 and the inclined bottom plate 232. The ends of the inclined bottom plate 232 and the inclined top plate 233 that are away from the flow channel cavity 22 are inclined upwards compared to the ends that are close to the flow channel cavity 22. This results in the inclined bottom plate 232 being lower than the end away from the flow channel cavity 22 in the direction of gravity, and similarly, the end of the inclined top plate 233 being lower than the end away from the flow channel cavity 22. Because the inclined bottom plate 232 is inclined and the side close to the flow channel cavity 22 is at a lower position, the inclined... The inclined bottom plate 232 can shield the coolant flowing to the bottom, preventing it from overflowing from the evaporation opening 231 when it flows or diffuses to the bottom of the radiator cavity 21. This reduces coolant loss and allows for more evaporation time for the evaporating foam metal 25. The inclined top plate 233 is positioned such that the side of the inclined top plate 233 closest to the flow channel cavity 22 is lower, and the space above the end of the inclined top plate 233 near the flow channel cavity 22 prevents coolant from diffusing into the evaporation cavity 23. Inside, the coolant can only diffuse into the evaporation chamber 23 by surface tension when it flows to the space below the end of the inclined top plate 233 near the flow channel cavity 22. Since there is a local part of the evaporation foam metal 25 in the evaporation chamber 23 located above the lower end of the inclined top plate 233, this part of the evaporation foam metal 25 can diffuse by surface tension of the coolant, so that the entire evaporation foam metal 25 can be completely filled by the coolant. By setting the inclined top plate 233 as an inclined structure, the coolant can only diffuse laterally under the action of surface tension after moving to a specific position under the action of gravity. This can avoid the coolant from diffusing laterally at a low temperature without heat exchange, so that the coolant diffused onto the evaporation foam metal 25 is at a higher temperature, thus promoting evaporation efficiency and improving heat dissipation. An evaporation opening 231 is formed between the inclined top plate 233 and the inclined bottom plate 232. The evaporation opening 231 is connected to the outside, so that the evaporation foam metal 25 can achieve the evaporation effect.

[0041] like Figure 5As shown, the cooler 1 includes outer substrates 11 disposed on both sides, a plurality of PN junctions 12 disposed between the outer substrates 11, and a flow guide plate 13 disposed between the PN junctions 12 and the outer substrates 11. The cooler 1 is composed of two outer substrates 11, two flow guide plates 13, and a plurality of PN junctions 12 sandwiched between the two flow guide plates 13. The two outer substrates 11 are disposed on the outermost layer, and the two flow guide plates 13 are respectively disposed on both sides of the PN junctions 12 and sandwiched in the middle by the two outer substrates 11. The outer substrates 11 are made of ceramic material and have good insulation properties. The outer side of the outer substrates 11 is connected to the corresponding hot end heat sink 2 and cold end connector 3, respectively, and thermal grease is applied in the middle to reduce contact thermal resistance. The inner side of the outer substrates 11 is connected to the flow guide plate, which is made of metal and is used to conduct current and form a path. The upper and lower flow guide plates are staggered and connected to the PN junctions 12 to form a series path.

[0042] like Figure 4 As shown, the plane of the evaporation opening 231 is parallel to the direction of gravity. The opening direction of the evaporation opening 231 is horizontal in the diagram, meaning the plane of the evaporation opening 231 is parallel to the direction of gravity. This achieves good evaporation efficiency and prevents coolant from flowing out of the evaporation foam metal 25 through the evaporation opening 231. It allows for rapid evaporation of the coolant diffused into the evaporation foam metal 25, avoiding the situation where, due to the upward-facing opening, evaporation only occurs after the coolant has diffused to the upper surface of the evaporation foam metal 25.

[0043] In addition to the above embodiments, within the scope disclosed in the claims and specification of this invention, the technical features of this invention can be reselected and combined to form new embodiments. These can be achieved by those skilled in the art without creative effort. Therefore, these embodiments not described in detail in this invention should also be regarded as specific embodiments of this invention and within the protection scope of this invention.

Claims

1. A thermoelectric cooler module, characterized in that, The device includes a cooler with a hot-end radiator attached to it. The hot-end radiator includes a radiator cavity, a flow channel cavity and an evaporation cavity are provided inside the radiator cavity, and the evaporation cavity includes an upwardly inclined evaporation opening. A heat exchange foam metal is detachably connected inside the flow channel cavity, and an evaporation foam metal is detachably connected inside the evaporation cavity. Both the heat exchange foam metal and the evaporation foam metal are provided with a plurality of seepage holes. The evaporation foam metal abuts against the heat exchange foam metal, and the evaporation cavity communicates with the flow channel cavity.

2. The thermoelectric cooler module according to claim 1, characterized in that, The hot-end heat sink includes an inlet and an outlet that communicate with the flow channel cavity. The inlet is located at the top of the hot-end heat sink, and the outlet is located at the bottom of the hot-end heat sink.

3. A thermoelectric cooler module according to claim 2, characterized in that, The hot end radiator includes a radiator end cap, which is connected to the top of the flow channel cavity.

4. A thermoelectric cooler module according to claim 2, characterized in that, The inlet and outlet are located on the side of the hot-end radiator away from the evaporation chamber.

5. A thermoelectric cooler module according to claim 3, characterized in that, The radiator end cap is provided with a connection hole, and the radiator cavity is provided with a mating hole. Metal screws are connected to the connection hole and the mating hole.

6. A thermoelectric cooler module according to claim 1, characterized in that, The porosity of the evaporating foam metal is less than that of the heat exchange foam metal.

7. A thermoelectric cooler module according to claim 1, characterized in that, The heat sink includes an outer plate, and a connecting unit is provided on the outer plate.

8. A thermoelectric cooler module according to claim 1, characterized in that, The evaporation chamber includes an inclined bottom plate and an inclined top plate. The ends of the inclined bottom plate and the inclined top plate that are away from the flow channel cavity are both inclined upwards. An evaporation opening is formed between the inclined top plate and the inclined bottom plate. In the direction of gravity, the end of the inclined top plate that is closer to the flow channel cavity is lower than the end of the inclined top plate that is away from the flow channel cavity.

9. A thermoelectric cooler module according to any one of claims 1-8, characterized in that, The cooler includes an outer substrate disposed on both sides, a plurality of PN junctions disposed between the outer substrates, and a flow guide plate disposed between the PN junctions and the outer substrates.

10. A thermoelectric cooler module according to any one of claims 1-8, characterized in that, The plane containing the evaporation opening is parallel to the direction of gravity.

Images