A jet impingement thermoelectric refrigerator module

Abstract

The application discloses a kind of jet impact type thermoelectric refrigerator module, to solve the unevenness of heat dissipation of thermoelectric refrigerator.The hot end of the application thermoelectric refrigerator is connected with a radiator, a heat dissipation cavity is arranged in the radiator, an inlet is arranged at the top of the heat dissipation cavity, an outlet is arranged at the bottom of the heat dissipation cavity, and a jet screen, an upper layer of foam metal and a lower layer of foam metal are arranged in the heat dissipation cavity from top to bottom.The porosity of the lower layer of foam metal is less than that of the upper layer of foam metal.The cooling liquid in the radiator uniformly enters the heat dissipation cavity through the jet screen, and then flows through the upper layer of foam metal and the lower layer of foam metal.The heat at the bottom of the radiator is transferred to the metal framework of the upper layer of foam metal and the lower layer of foam metal and the radiator shell by heat conduction.The metal framework and the radiator shell then perform convective heat exchange with the cooling liquid, resulting in good heat dissipation uniformity and ensuring the heat dissipation effect of the thermoelectric refrigerator.

Description

Technical Field

[0001] This invention relates to the field of thermoelectric semiconductor technology, and more specifically, to a jet impingement thermoelectric cooler module. Background Technology

[0002] Thermoelectric coolers have been widely used in key fields such as lasers, optical communications, and medical equipment. With the rapid increase in the power density of the cooled devices, the heat flow that needs to be dissipated from the hot end of the cooler has increased dramatically, and the heat dissipation efficiency directly restricts the temperature difference and stability of the entire system. Currently, mainstream heat dissipation technologies mainly rely on forced air cooling or active liquid cooling. Forced air cooling requires a fan drive, which is often bulky and noisy when dealing with large heat flows, and its heat dissipation capacity is limited, failing to meet the heat dissipation requirements of high-power coolers. While active liquid cooling is more powerful, the mainstream heat dissipation method mainly relies on microchannel water-cooled plates, resulting in low inlet temperatures and high outlet temperatures, leading to poor overall temperature uniformity. For example, Chinese patent application number 2025113452109 discloses a fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler component, in which a second 3D vapor chamber unit contacts the hot end of the thermoelectric cooler component, and the liquid-cooled plate component is fixed on the second 3D vapor chamber unit.

[0003] Furthermore, existing high-performance heat sinks rely primarily on adjusting the overall structural dimensions to control their heat dissipation capacity when trying to adjust their cooling capabilities, making it difficult to adjust power while maintaining the existing structural dimensions. Summary of the Invention

[0004] To overcome the above shortcomings, the present invention provides a jet impact thermoelectric cooler module, which has good heat dissipation and temperature uniformity, thereby ensuring the heat dissipation effect of the thermoelectric cooler.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a jet impact thermoelectric cooler module, wherein the hot end of the thermoelectric cooler is connected to a heat sink, a heat dissipation cavity is provided inside the heat sink, an inlet is provided at the top of the heat dissipation cavity, an outlet is provided at the bottom of the heat dissipation cavity, and a jet mesh plate, an upper layer of foam metal and a lower layer of foam metal are arranged from top to bottom inside the heat dissipation cavity; the porosity of the lower layer of foam metal is less than that of the upper layer of foam metal.

[0006] When the thermoelectric cooler starts working, the heat-absorbing surface is in direct contact with the cooled equipment, while the heat from the heat-releasing surface is dissipated by the radiator. Coolant enters through the radiator inlet, passes through the jet mesh plate, and evenly enters the heat dissipation cavity, then flows through the upper and lower foam metal layers. Heat from the bottom of the radiator is transferred via thermal conduction to the metal skeletons of the upper and lower foam metal layers and the radiator shell. The metal skeleton and radiator shell then undergo convective heat exchange with the coolant. The lower foam metal layer has lower porosity and a larger proportion of solid metal skeleton, allowing more heat to be transferred into the radiator cavity via thermal conduction. The upper foam metal layer has higher porosity, increasing turbulence and facilitating coolant entry into the lower foam metal layer for convective heat exchange.

[0007] The uniform pore structure of the mesh plate improves the flow rate of the coolant and the uniformity of heat dissipation. Furthermore, the porous structure of the foam metal efficiently transfers the heat generated by the thermoelectric cooler, thus achieving the cooling effect of the semiconductor cooling chip. Moreover, the porosity and permeability of the foam metal can be adjusted to meet the heat dissipation requirements of different product models.

[0008] Preferably, the bottom surface of the lower foam metal is supported on the bottom surface of the heat dissipation cavity, the upper foam metal is supported on the lower foam metal, and the sidewalls of both the upper and lower foam metals are in contact with the inner wall of the heat dissipation cavity.

[0009] The lower layer of foamed metal is in direct contact with the bottom surface of the heat dissipation cavity, while the upper and lower layers of foamed metal provide support and contact. Furthermore, the sidewalls of both the upper and lower layers of foamed metal are in contact with the inner wall of the heat dissipation cavity, resulting in excellent heat conduction and improved heat dissipation. Heat is transferred to the entire radiator through heat conduction, thereby increasing the contact area with the coolant and enhancing heat dissipation.

[0010] Preferably, the inlet is located at the center of the top of the heat dissipation cavity, and several outlets are arranged at circumferential intervals.

[0011] The inlet is located at the center of the heat dissipation cavity, and several outlets are arranged at circumferential intervals, which facilitates the flow of coolant in all directions, thereby improving the temperature uniformity within the heat dissipation cavity.

[0012] Preferably, a cross-shaped outflow groove is provided on the bottom surface of the heat dissipation cavity, and an outflow port is provided on the side wall of the heat dissipation cavity corresponding to the end of the outflow groove, and the outflow port is connected to an outflow pipe.

[0013] After the lower layer of foam metal supports the bottom surface of the heat dissipation cavity, the outflow space of the coolant is limited. However, the design of the outflow groove provides space for the coolant to drain, which is conducive to the rapid discharge of the coolant.

[0014] Preferably, the surface of the jet mesh plate has an arc-shaped curved structure, and the surface of the jet mesh plate slopes downward from the center to the edge.

[0015] The arc-shaped curved surface structure of the jet mesh plate, which slopes downward from the center to the edge, facilitates the diffusion of coolant to the surrounding area, thereby improving the temperature uniformity within the heat dissipation cavity.

[0016] Preferably, an adjustment plate is placed on top of the jet mesh plate, the adjustment plate is movable, the adjustment plate is provided with adjustment holes corresponding to the mesh holes on the jet mesh plate, a rack is provided on the adjustment plate, and an adjustment gear is installed on the radiator, the adjustment gear meshes with the rack for transmission.

[0017] A movable adjusting plate, with its adjusting holes misaligned with the mesh openings on the jet spray screen, partially obscures the mesh, thus adjusting the flow area of ​​the jet spray screen. During adjustment, rotating the adjusting gear, through the meshing of the gear and rack, moves the adjusting plate, thereby adjusting the exposed area of ​​the mesh openings on the jet spray screen, and thus adjusting the flow area. The flow area of ​​the jet spray screen is maximized when the adjusting holes on the adjusting plate are perfectly aligned with the mesh openings on the jet spray screen. This structural design allows for adjustment of the coolant flow rate, thereby adjusting the heat dissipation effect of the radiator to meet different usage requirements.

[0018] Preferably, several heat dissipation fins are provided at intervals on the outer wall of the radiator.

[0019] Heat dissipation fins can increase the heat dissipation area of ​​a heat sink and improve its heat dissipation effect.

[0020] Preferably, a heat dissipation duct is provided inside the radiator, and the heat dissipation duct passes through the heat dissipation cavity.

[0021] The installation of a heat dissipation duct can increase the heat dissipation area of ​​the radiator, and the airflow through the heat dissipation duct carries away heat, thereby improving the heat dissipation effect.

[0022] Preferably, the outer ring of the heat dissipation wind tunnel is rotated around the periphery, with several blades spaced circumferentially on the outer ring. The outer ring and blades are placed in the heat dissipation cavity. The inner ring is rotated inside the heat dissipation wind tunnel, with several fan blades spaced circumferentially on the inner ring. An outer magnetic block is installed on the outer ring, and an inner magnetic block is installed on the inner ring. The inner and outer magnetic blocks attract each other, and the rotation of the outer ring drives the rotation of the inner ring, causing the fan blades to blow out airflow.

[0023] As the coolant flows through the heat dissipation chamber, it drives the blades to rotate, which in turn causes the outer ring to rotate. Since the outer magnetic block on the outer ring and the inner magnetic block on the inner ring attract each other, the rotation of the outer ring can drive the rotation of the inner ring, thereby causing the fan blades to rotate and generate airflow to cool the heat dissipation tunnel and improve the cooling effect.

[0024] Preferably, the thermoelectric cooler includes a cold side substrate, a hot side substrate, and a plurality of thermoelectric semiconductor particles, wherein the thermoelectric semiconductor particles are connected between the cold side substrate and the hot side substrate.

[0025] When adjacent thermoelectric semiconductor particles connect to the PN junction formed on the cold-side substrate, a cooling effect is achieved when energized. When adjacent thermoelectric semiconductor particles connect to the PN junction formed on the hot-side substrate, a heat is generated when energized, and the heat is dissipated through a heat sink.

[0026] Compared with the prior art, the beneficial effects of the present invention are: (1) The coolant in the radiator of the jet impact thermoelectric cooler module enters the heat dissipation cavity evenly through the jet mesh plate, and then flows through the upper foam metal and the lower foam metal. The heat at the bottom of the radiator is transferred to the metal skeleton of the upper foam metal and the lower foam metal and the radiator shell through heat conduction. The metal skeleton and the radiator shell then exchange heat with the coolant through convection. The heat dissipation uniformity is good, which ensures the heat dissipation effect of the thermoelectric cooler; (2) During the flow of the coolant in the heat dissipation cavity, the blades are driven to rotate, thereby causing the outer ring to rotate. The rotation of the outer ring can drive the inner ring to rotate, thereby causing the fan blades to rotate and generate airflow to blow and cool the heat dissipation wind tunnel, thus improving the cooling effect. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the present invention.

[0028] Figure 2 This is an exploded view of the thermoelectric cooler of the present invention.

[0029] Figure 3 This is an exploded view of the present invention.

[0030] Figure 4 This is a cross-sectional view of Embodiment 1 of the present invention.

[0031] Figure 5 This is a cross-sectional view of Embodiment 2 of the present invention.

[0032] Figure 6 This is a cross-sectional view of Embodiment 3 of the present invention.

[0033] Figure 7 This is a side view of Embodiment 4 of the present invention.

[0034] Figure 8 This is a cross-sectional view of Embodiment 4 of the present invention.

[0035] Figure 9 This is a side view of Embodiment 5 of the present invention.

[0036] In the diagram: 1. Thermoelectric cooler, 2. Radiator, 3. Base plate, 4. Cold side substrate, 5. Hot side substrate, 6. Thermoelectric semiconductor particle, 7. Conductive sheet, 8. Heat dissipation cavity, 9. Inlet, 10. Outlet, 11. Inlet pipe, 12. Jet mesh plate, 13. Upper foam metal, 14. Lower foam metal, 15. Mesh, 16. Outlet groove, 17. Outlet pipe, 18. Adjusting plate, 19. Adjusting hole, 20. Rack, 21. Adjusting gear, 22. Shaft, 23. Handle, 24. Heat dissipation tunnel, 25. Heat dissipation sleeve, 26. Outer ring, 27. Blade, 28. Inner ring, 29. Fan blade, 30. Outer magnet, 31. Inner magnet, 32. Heat dissipation fins. Detailed Implementation

[0037] The technical solution of the present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Example 1: A jet impingement thermoelectric cooler module (see...) Figures 1 to 4 The thermoelectric cooler 1 has its hot end connected to a heat sink 2. A base plate 3 is installed at the bottom of the heat sink 2, and the base plate 3 is welded to the bottom of the heat sink 2. After welding, waterproof adhesive is used for secondary reinforcement. The base plate 3 is fixedly connected to the hot end of the thermoelectric cooler 1, and thermally conductive silicone grease is applied to the surface of the hot end of the thermoelectric cooler 1. The thermoelectric cooler 1 includes a cold surface substrate 4, a hot surface substrate 5, and several thermoelectric semiconductor particles 6, which are connected between the cold surface substrate 4 and the hot surface substrate 5. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the cold surface substrate 4, a cooling effect is achieved. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the hot surface substrate 5, they generate heat when energized, which is dissipated through the heat sink 2. Conductive sheets 7 are provided on both the cold surface substrate 4 and the hot surface substrate 5, which connect adjacent thermoelectric semiconductor particles 6. The hot surface substrate 5 is connected to the base plate 3 at the bottom of the heat sink 2.

[0038] The radiator 2 is provided with a heat dissipation cavity 8. The top of the heat dissipation cavity 8 is provided with an inlet 9 and the bottom of the heat dissipation cavity 8 is provided with an outlet 10. The inlet 9 is located at the center of the top of the heat dissipation cavity 8, and several outlets 10 are arranged circumferentially. An upwardly extending inlet pipe 11 is provided at the inlet 9, and the inlet pipe 11 is connected to the cooling flow path.

[0039] Inside the heat dissipation cavity 8, from top to bottom, there are a jet mesh plate 12, an upper layer of foam metal 13, and a lower layer of foam metal 14; the porosity of the lower layer of foam metal 14 is less than that of the upper layer of foam metal 13. The jet mesh plate 12 has a flat plate structure, and a number of mesh holes 15 are provided on the jet mesh plate 12, which are distributed throughout the plane of the jet mesh plate 12.

[0040] The lower layer of foam metal 14 rests on the bottom surface of the heat dissipation cavity 8, while the upper layer of foam metal 13 rests on top of the lower layer. The sidewalls of both the upper and lower layers of foam metal 13 are in contact with the inner wall of the heat dissipation cavity 8. The lower layer of foam metal 14 is in direct contact with the bottom surface of the heat dissipation cavity 8, while the upper and lower layers of foam metal 13 are in support contact. Furthermore, the sidewalls of both layers are in contact with the inner wall of the heat dissipation cavity 8, resulting in good heat conduction and improved heat dissipation. Heat is transferred to the entire radiator 2 through heat conduction, thereby increasing the contact area with the coolant and enhancing the heat dissipation effect.

[0041] The bottom surface of the heat dissipation cavity 8 is provided with a cross-shaped outflow groove 16. The cross-section of the outflow groove 16 is semi-circular. Outflow ports 10 are provided on the side wall of the heat dissipation cavity 8 and at the ends of the outflow groove 16, and the outflow ports 10 are connected to the outflow pipes 17. The radiator 2 has a rectangular columnar structure, and an outflow port 10 is provided at the bottom of each of the four sides of the radiator 2. After the bottom surface of the lower foam metal 14 is supported on the bottom surface of the heat dissipation cavity 8, the outflow space of the coolant is restricted. However, the outflow grooves 16 provide a discharge space for the coolant, which is conducive to the rapid discharge of the coolant.

[0042] When thermoelectric cooler 1 starts working, the heat-absorbing surface is in direct contact with the cooled equipment, and the heat from the heat-releasing surface is dissipated by radiator 2. Coolant enters through inlet 9 of radiator 2, passes through jet mesh 12 and enters heat dissipation cavity 8 evenly, then flows through upper foam metal 13 and lower foam metal 14. Heat from the bottom of radiator 2 is transferred via thermal conduction to the metal skeleton of upper and lower foam metal 13 and the outer shell of radiator 2. The metal skeleton and the outer shell of radiator 2 then undergo convective heat exchange with the coolant. Lower foam metal 14 has lower porosity and a larger proportion of solid metal skeleton, allowing more heat to be transferred into the radiator 2 cavity via thermal conduction. Upper foam metal 13 has higher porosity, increasing turbulence while facilitating coolant entry into lower foam metal 14 for convective heat exchange.

[0043] The uniform pore structure of the mesh plate improves the flow rate of the coolant and the uniformity of heat dissipation. Furthermore, the porous structure of the foam metal efficiently transfers the heat generated by the thermoelectric cooler 1, thus achieving the cooling effect of the semiconductor cooling chip. Moreover, the porosity and permeability of the foam metal can be adjusted to meet the heat dissipation requirements of different product models.

[0044] Example 2: A jet impingement thermoelectric cooler module (see...) Figure 1 , Figure 2 , Figure 3 , Figure 5The thermoelectric cooler 1 has its hot end connected to a heat sink 2. A base plate 3 is installed at the bottom of the heat sink 2, and the base plate 3 is welded to the bottom of the heat sink 2. After welding, waterproof adhesive is used for secondary reinforcement. The base plate 3 is fixedly connected to the hot end of the thermoelectric cooler 1, and thermally conductive silicone grease is applied to the surface of the hot end of the thermoelectric cooler 1. The thermoelectric cooler 1 includes a cold surface substrate 4, a hot surface substrate 5, and several thermoelectric semiconductor particles 6, which are connected between the cold surface substrate 4 and the hot surface substrate 5. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the cold surface substrate 4, a cooling effect is achieved. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the hot surface substrate 5, they generate heat when energized, which is dissipated through the heat sink 2. Conductive sheets 7 are provided on both the cold surface substrate 4 and the hot surface substrate 5, which connect adjacent thermoelectric semiconductor particles 6. The hot surface substrate 5 is connected to the base plate 3 at the bottom of the heat sink 2.

[0045] The radiator 2 is provided with a heat dissipation cavity 8. The top of the heat dissipation cavity 8 is provided with an inlet 9 and the bottom of the heat dissipation cavity 8 is provided with an outlet 10. The inlet 9 is located at the center of the top of the heat dissipation cavity 8, and several outlets 10 are arranged circumferentially. An upwardly extending inlet pipe 11 is provided at the inlet 9, and the inlet pipe 11 is connected to the cooling flow path.

[0046] The heat dissipation cavity 8 is provided with a jet mesh plate 12, an upper layer of foam metal 13 and a lower layer of foam metal 14 from top to bottom; the porosity of the lower layer of foam metal 14 is less than that of the upper layer of foam metal 13.

[0047] The jet mesh plate 12 has a plurality of mesh holes 15, which are distributed throughout the plane of the jet mesh plate 12. The surface of the jet mesh plate 12 has an arc-shaped curved surface structure, and the surface of the jet mesh plate 12 slopes downward from the center to the edge. The arc-shaped curved surface structure of the jet mesh plate 12, which slopes downward from the center to the edge, facilitates the diffusion of coolant to the surrounding area, thereby improving the temperature uniformity within the heat dissipation cavity 8.

[0048] The lower layer of foam metal 14 rests on the bottom surface of the heat dissipation cavity 8, while the upper layer of foam metal 13 rests on top of the lower layer. The sidewalls of both the upper and lower layers of foam metal 13 are in contact with the inner wall of the heat dissipation cavity 8. The lower layer of foam metal 14 is in direct contact with the bottom surface of the heat dissipation cavity 8, while the upper and lower layers of foam metal 13 are in support contact. Furthermore, the sidewalls of both layers are in contact with the inner wall of the heat dissipation cavity 8, resulting in good heat conduction and improved heat dissipation. Heat is transferred to the entire radiator 2 through heat conduction, thereby increasing the contact area with the coolant and enhancing the heat dissipation effect.

[0049] The bottom surface of the heat dissipation cavity 8 is provided with a cross-shaped outflow groove 16. The cross-section of the outflow groove 16 is semi-circular. Outflow ports 10 are provided on the side wall of the heat dissipation cavity 8 and at the ends of the outflow groove 16, and the outflow ports 10 are connected to the outflow pipes 17. The radiator 2 has a rectangular columnar structure, and an outflow port 10 is provided at the bottom of each of the four sides of the radiator 2. After the bottom surface of the lower foam metal 14 is supported on the bottom surface of the heat dissipation cavity 8, the outflow space of the coolant is restricted. However, the outflow grooves 16 provide a discharge space for the coolant, which is conducive to the rapid discharge of the coolant.

[0050] When thermoelectric cooler 1 starts working, the heat-absorbing surface is in direct contact with the cooled equipment, and the heat from the heat-releasing surface is dissipated by radiator 2. Coolant enters through inlet 9 of radiator 2, passes through jet mesh 12 and enters heat dissipation cavity 8 evenly, then flows through upper foam metal 13 and lower foam metal 14. Heat from the bottom of radiator 2 is transferred via thermal conduction to the metal skeleton of upper and lower foam metal 13 and the outer shell of radiator 2. The metal skeleton and the outer shell of radiator 2 then undergo convective heat exchange with the coolant. Lower foam metal 14 has lower porosity and a larger proportion of solid metal skeleton, allowing more heat to be transferred into the radiator 2 cavity via thermal conduction. Upper foam metal 13 has higher porosity, increasing turbulence while facilitating coolant entry into lower foam metal 14 for convective heat exchange.

[0051] The uniform pore structure of the mesh plate improves the flow rate of the coolant and the uniformity of heat dissipation. Furthermore, the porous structure of the foam metal efficiently transfers the heat generated by the thermoelectric cooler 1, thus achieving the cooling effect of the semiconductor cooling chip. Moreover, the porosity and permeability of the foam metal can be adjusted to meet the heat dissipation requirements of different product models.

[0052] Example 3: A jet impingement thermoelectric cooler module (see...) Figure 6 The thermoelectric cooler 1 has its hot end connected to a heat sink 2. A base plate 3 is installed at the bottom of the heat sink 2, and the base plate 3 is welded to the bottom of the heat sink 2. After welding, waterproof adhesive is used for secondary reinforcement. The base plate 3 is fixedly connected to the hot end of the thermoelectric cooler 1, and thermally conductive silicone grease is applied to the surface of the hot end of the thermoelectric cooler 1. The thermoelectric cooler 1 includes a cold surface substrate 4, a hot surface substrate 5, and several thermoelectric semiconductor particles 6, which are connected between the cold surface substrate 4 and the hot surface substrate 5. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the cold surface substrate 4, a cooling effect is achieved. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the hot surface substrate 5, they generate heat when energized, which is dissipated through the heat sink 2. Conductive sheets 7 are provided on both the cold surface substrate 4 and the hot surface substrate 5, which connect adjacent thermoelectric semiconductor particles 6. The hot surface substrate 5 is connected to the base plate 3 at the bottom of the heat sink 2.

[0053] The radiator 2 is provided with a heat dissipation cavity 8. The top of the heat dissipation cavity 8 is provided with an inlet 9 and the bottom of the heat dissipation cavity 8 is provided with an outlet 10. The inlet 9 is located at the center of the top of the heat dissipation cavity 8, and several outlets 10 are arranged circumferentially. An upwardly extending inlet pipe 11 is provided at the inlet 9, and the inlet pipe 11 is connected to the cooling flow path.

[0054] Inside the heat dissipation cavity 8, from top to bottom, there are a jet mesh plate 12, an upper layer of foam metal 13, and a lower layer of foam metal 14; the porosity of the lower layer of foam metal 14 is less than that of the upper layer of foam metal 13. The jet mesh plate 12 has a flat plate structure, and a number of mesh holes 15 are provided on the jet mesh plate 12, which are distributed throughout the plane of the jet mesh plate 12.

[0055] An adjusting plate 18 covers the jet mesh plate 12. The adjusting plate 18 is movable and has adjusting holes 19 corresponding to the mesh holes 15 on the jet mesh plate 12. A rack 20 is installed on the adjusting plate 18, and an adjusting gear 21 is installed on the radiator 2. The adjusting gear 21 meshes with the rack 20 for transmission. A rotating shaft 22 is installed on the adjusting gear 21, extending outside the radiator 2. The rotating shaft 22 is connected to a handle 23, and is rotatably connected to the radiator 2. Rotation of the handle 23 causes the adjusting gear 21 to rotate. A mounting hole is provided on the top of the radiator 2, and the rotating shaft 22 is rotatably connected to the mounting hole. A sealing ring is installed between the rotating shaft 22 and the mounting hole.

[0056] The adjusting plate 18 is moved, and the adjusting holes 19 on the adjusting plate 18 are misaligned with the mesh holes 15 on the jet mesh plate 12, partially covering the mesh holes 15, thereby adjusting the flow area of ​​the jet mesh plate 12. During adjustment, the adjusting gear 21 is rotated, and the adjusting plate 18 is moved through the meshing transmission between the adjusting gear 21 and the rack 20, thereby adjusting the exposed area of ​​the mesh holes 15 on the jet mesh plate 12, and thus adjusting the flow area of ​​the jet mesh plate 12. When the adjusting holes 19 on the adjusting plate 18 are completely aligned with the mesh holes 15 on the jet mesh plate 12, the flow area of ​​the jet mesh plate 12 is at its maximum. With this structural arrangement, the flow rate of the coolant can be adjusted, thereby adjusting the heat dissipation effect of the radiator 2 to meet different usage requirements.

[0057] The lower layer of foam metal 14 rests on the bottom surface of the heat dissipation cavity 8, while the upper layer of foam metal 13 rests on top of the lower layer. The sidewalls of both the upper and lower layers of foam metal 13 are in contact with the inner wall of the heat dissipation cavity 8. The lower layer of foam metal 14 is in direct contact with the bottom surface of the heat dissipation cavity 8, while the upper and lower layers of foam metal 13 are in support contact. Furthermore, the sidewalls of both layers are in contact with the inner wall of the heat dissipation cavity 8, resulting in good heat conduction and improved heat dissipation. Heat is transferred to the entire radiator 2 through heat conduction, thereby increasing the contact area with the coolant and enhancing the heat dissipation effect.

[0058] The bottom surface of the heat dissipation cavity 8 is provided with a cross-shaped outflow groove 16. The cross-section of the outflow groove 16 is semi-circular. Outflow ports 10 are provided on the side wall of the heat dissipation cavity 8 and at the ends of the outflow groove 16, and the outflow ports 10 are connected to the outflow pipes 17. The radiator 2 has a rectangular columnar structure, and an outflow port 10 is provided at the bottom of each of the four sides of the radiator 2. After the bottom surface of the lower foam metal 14 is supported on the bottom surface of the heat dissipation cavity 8, the outflow space of the coolant is restricted. However, the outflow grooves 16 provide a discharge space for the coolant, which is conducive to the rapid discharge of the coolant.

[0059] When thermoelectric cooler 1 starts working, the heat-absorbing surface is in direct contact with the cooled equipment, and the heat from the heat-releasing surface is dissipated by radiator 2. Coolant enters through inlet 9 of radiator 2, passes through jet mesh 12 and enters heat dissipation cavity 8 evenly, then flows through upper foam metal 13 and lower foam metal 14. Heat from the bottom of radiator 2 is transferred via thermal conduction to the metal skeleton of upper and lower foam metal 13 and the outer shell of radiator 2. The metal skeleton and the outer shell of radiator 2 then undergo convective heat exchange with the coolant. Lower foam metal 14 has lower porosity and a larger proportion of solid metal skeleton, allowing more heat to be transferred into the radiator 2 cavity via thermal conduction. Upper foam metal 13 has higher porosity, increasing turbulence while facilitating coolant entry into lower foam metal 14 for convective heat exchange.

[0060] The uniform pore structure of the mesh plate improves the flow rate of the coolant and the uniformity of heat dissipation. Furthermore, the porous structure of the foam metal efficiently transfers the heat generated by the thermoelectric cooler 1, thus achieving the cooling effect of the semiconductor cooling chip. Moreover, the porosity and permeability of the foam metal can be adjusted to meet the heat dissipation requirements of different product models.

[0061] Example 4: A jet impingement thermoelectric cooler module (see...) Figure 7 , Figure 8 The thermoelectric cooler 1 has its hot end connected to a heat sink 2. A base plate 3 is installed at the bottom of the heat sink 2, and the base plate 3 is welded to the bottom of the heat sink 2. After welding, waterproof adhesive is used for secondary reinforcement. The base plate 3 is fixedly connected to the hot end of the thermoelectric cooler 1, and thermally conductive silicone grease is applied to the surface of the hot end of the thermoelectric cooler 1. The thermoelectric cooler 1 includes a cold surface substrate 4, a hot surface substrate 5, and several thermoelectric semiconductor particles 6, which are connected between the cold surface substrate 4 and the hot surface substrate 5. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the cold surface substrate 4, a cooling effect is achieved. When adjacent thermoelectric semiconductor particles 6 are connected to the PN junction formed on the hot surface substrate 5, they generate heat when energized, which is dissipated through the heat sink 2. Conductive sheets 7 are provided on both the cold surface substrate 4 and the hot surface substrate 5, which connect adjacent thermoelectric semiconductor particles 6. The hot surface substrate 5 is connected to the base plate 3 at the bottom of the heat sink 2.

[0062] The radiator 2 is provided with a heat dissipation cavity 8. The top of the heat dissipation cavity 8 is provided with an inlet 9 and the bottom of the heat dissipation cavity 8 is provided with an outlet 10. The inlet 9 is located at the center of the top of the heat dissipation cavity 8, and several outlets 10 are arranged circumferentially. An upwardly extending inlet pipe 11 is provided at the inlet 9, and the inlet pipe 11 is connected to the cooling flow path.

[0063] Inside the heat dissipation cavity 8, from top to bottom, there are a jet mesh plate 12, an upper layer of foam metal 13, and a lower layer of foam metal 14; the porosity of the lower layer of foam metal 14 is less than that of the upper layer of foam metal 13. The jet mesh plate 12 has a flat plate structure, and a number of mesh holes 15 are provided on the jet mesh plate 12, which are distributed throughout the plane of the jet mesh plate 12.

[0064] The lower layer of foam metal 14 rests on the bottom surface of the heat dissipation cavity 8, while the upper layer of foam metal 13 rests on top of the lower layer. The sidewalls of both the upper and lower layers of foam metal 13 are in contact with the inner wall of the heat dissipation cavity 8. The lower layer of foam metal 14 is in direct contact with the bottom surface of the heat dissipation cavity 8, while the upper and lower layers of foam metal 13 are in support contact. Furthermore, the sidewalls of both layers are in contact with the inner wall of the heat dissipation cavity 8, resulting in good heat conduction and improved heat dissipation. Heat is transferred to the entire radiator 2 through heat conduction, thereby increasing the contact area with the coolant and enhancing the heat dissipation effect.

[0065] The bottom surface of the heat dissipation cavity 8 is provided with a cross-shaped outflow groove 16. The cross-section of the outflow groove 16 is semi-circular. Outflow ports 10 are provided on the side wall of the heat dissipation cavity 8 and at the ends of the outflow groove 16, and the outflow ports 10 are connected to the outflow pipes 17. The radiator 2 has a rectangular columnar structure, and an outflow port 10 is provided at the bottom of each of the four sides of the radiator 2. After the bottom surface of the lower foam metal 14 is supported on the bottom surface of the heat dissipation cavity 8, the outflow space of the coolant is restricted. However, the outflow grooves 16 provide a discharge space for the coolant, which is conducive to the rapid discharge of the coolant.

[0066] The radiator 2 is equipped with two cooling ducts 24 arranged opposite each other. A cooling sleeve 25 is integrally formed inside the cooling cavity 8, with its inner hole forming the cooling duct 24. Both ends of the cooling sleeve 25 are connected to the outer wall of the radiator 2. The cooling ducts 24 pass through the cooling cavity 8. The cooling ducts 24 increase the heat dissipation area of ​​the radiator 2, and the airflow through the cooling ducts 24 carries away heat, thereby improving the heat dissipation effect.

[0067] The cooling duct 24 is surrounded by a rotating outer ring 26, with several blades 27 spaced circumferentially on the outer ring 26. The outer ring 26 and the blades 27 are placed in the cooling cavity 8. Inside the cooling duct 24, an inner ring 28 is rotatably installed, with several fan blades 29 spaced circumferentially on the inner ring 28. An outer magnetic block 30 is installed on the outer ring 26, and an inner magnetic block 31 is installed on the inner ring 28. The inner magnetic block 31 and the outer magnetic block 30 attract each other, and the rotation of the outer ring 26 drives the rotation of the inner ring 28, causing the fan blades 29 to blow out airflow. On the inner wall of the cooling duct 24, positioning blocks are connected to both sides of the inner ring 28, which achieve axial positioning of the inner ring 28.

[0068] As the coolant flows within the heat dissipation cavity 8, it drives the blades 27 to rotate, thereby causing the outer ring 26 to rotate. Since the outer magnetic block 30 on the outer ring 26 and the inner magnetic block 31 on the inner ring 28 attract each other, the rotation of the outer ring 26 can drive the inner ring 28 to rotate, thereby causing the fan blades 29 to rotate and generate airflow to cool the heat dissipation tunnel 24, thus improving the cooling effect.

[0069] When thermoelectric cooler 1 starts working, the heat-absorbing surface is in direct contact with the cooled equipment, and the heat from the heat-releasing surface is dissipated by radiator 2. Coolant enters through inlet 9 of radiator 2, passes through jet mesh 12 and enters heat dissipation cavity 8 evenly, then flows through upper foam metal 13 and lower foam metal 14. Heat from the bottom of radiator 2 is transferred via thermal conduction to the metal skeleton of upper and lower foam metal 13 and the outer shell of radiator 2. The metal skeleton and the outer shell of radiator 2 then undergo convective heat exchange with the coolant. Lower foam metal 14 has lower porosity and a larger proportion of solid metal skeleton, allowing more heat to be transferred into the radiator 2 cavity via thermal conduction. Upper foam metal 13 has higher porosity, increasing turbulence while facilitating coolant entry into lower foam metal 14 for convective heat exchange.

[0070] The uniform pore structure of the mesh plate improves the flow rate of the coolant and the uniformity of heat dissipation. Furthermore, the porous structure of the foam metal efficiently transfers the heat generated by the thermoelectric cooler 1, thus achieving the cooling effect of the semiconductor cooling chip. Moreover, the porosity and permeability of the foam metal can be adjusted to meet the heat dissipation requirements of different product models.

[0071] Example 5: A jet impingement thermoelectric cooler module (see...) Figure 9 Its structure is similar to any one of embodiments 1 to 4, the main difference being that in this embodiment, a plurality of heat dissipation fins 32 are spaced apart on the outer wall of the heat sink 2. Multiple heat dissipation fins 32 are spaced apart vertically, which increases the heat dissipation area of ​​the heat sink 2 and improves the heat dissipation effect. Other structures are the same as any one of embodiments 1 to 4.

[0072] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications may be made without departing from the technical solutions described in the claims.

Claims

1. A jet-impact thermoelectric cooler module, characterized in that, The hot end of the thermoelectric cooler is connected to a radiator. A heat dissipation cavity is set inside the radiator. An inlet is set at the top of the heat dissipation cavity and an outlet is set at the bottom of the heat dissipation cavity. From top to bottom, a jet mesh plate, an upper layer of foam metal and a lower layer of foam metal are arranged inside the heat dissipation cavity. The porosity of the lower layer of foam metal is less than that of the upper layer of foam metal.

2. The jet impact thermoelectric cooler module according to claim 1, characterized in that, The bottom surface of the lower foam metal is supported on the bottom surface of the heat dissipation cavity, and the upper foam metal is supported on the lower foam metal. The sidewalls of both the upper and lower foam metals are in contact with the inner wall of the heat dissipation cavity.

3. The jet impact thermoelectric cooler module according to claim 1, characterized in that, The inlet is located at the center of the top of the heat dissipation cavity, and several outlets are arranged at circumferential intervals.

4. The jet impingement thermoelectric cooler module according to claim 1, characterized in that, The bottom surface of the heat dissipation cavity is provided with a cross-shaped outflow groove, and the side wall of the heat dissipation cavity is provided with an outflow port corresponding to the end of the outflow groove. The outflow port is connected to the outflow pipe.

5. A jet-impact thermoelectric cooler module according to claim 1, characterized in that, The surface of the jet mesh plate has an arc-shaped curved structure, and the surface of the jet mesh plate slopes downward from the center to the edge.

6. The jet impingement thermoelectric cooler module according to claim 1, characterized in that, An adjustment plate is placed on top of the jet mesh plate. The adjustment plate is movable and has adjustment holes that correspond to the mesh holes on the jet mesh plate. A rack is installed on the adjustment plate, and an adjustment gear is installed on the radiator. The adjustment gear meshes with the rack for transmission.

7. A jet-impact thermoelectric cooler module according to claim 1, characterized in that, Several heat dissipation fins are spaced apart on the outer wall of the radiator.

8. A jet-impact thermoelectric cooler module according to claim 1, characterized in that, A cooling air duct is installed inside the radiator, and the cooling air duct passes through the cooling cavity.

9. A jet-impact thermoelectric cooler module according to claim 8, characterized in that, The outer ring of the heat dissipation wind tunnel is rotated around the periphery, with several blades spaced circumferentially on the outer ring. The outer ring and blades are placed in the heat dissipation cavity. The inner ring is rotated inside the heat dissipation wind tunnel, with several fan blades spaced circumferentially on the inner ring. An outer magnetic block is installed on the outer ring, and an inner magnetic block is installed on the inner ring. The inner and outer magnetic blocks attract each other, and the rotation of the outer ring drives the rotation of the inner ring, causing the fan blades to blow out airflow.

10. A jet impingement thermoelectric cooler module according to any one of claims 1 to 9, characterized in that, The thermoelectric cooler includes a cold side substrate, a hot side substrate, and several thermoelectric semiconductor particles connected between the cold side substrate and the hot side substrate.

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