A heat pump device

Abstract

The application discloses a kind of heat pump device, it is related to heat pump technical field.The heat pump device includes evaporator, first compressor, cooler, second compressor, condenser and heating pipeline.Heating pipeline is sequentially connected with cooler and condenser, heating pipeline is used for the flow of water to be heated, first compressor is used to compress refrigerant from low-pressure gaseous state to intermediate-pressure gaseous state, cooler is used to heat exchange intermediate-pressure gaseous state refrigerant with water to be heated, to preliminarily heat water to be heated, second compressor is used to compress refrigerant from intermediate-pressure gaseous state to high-pressure gaseous state, condenser is used to heat release high-pressure gaseous state refrigerant and condense into high-pressure liquid state refrigerant, to heat water to be heated again.The heat pump device provided by the application can improve the energy efficiency ratio, reduce energy consumption, improve economic benefits under the condition of guaranteeing heating effect, and avoid the occurrence of compressor overload, improve safety and reliability.

Description

Technical Field

[0001] This invention relates to the field of heat pump technology, and in particular to a heat pump device. Background Technology

[0002] Currently, heat pump devices achieve "reverse heat transfer" through the phase change cycle of the refrigerant and external work. Their high efficiency and energy-saving characteristics make them widely used in heating, cooling, and hot water supply, especially suitable for scenarios pursuing low-carbon and environmentally friendly practices. When heating water, current heat pump devices typically use a condenser to directly release heat from the high-temperature, high-pressure gaseous refrigerant to the water, thus raising its temperature. However, if the required heating temperature is high, this necessitates increasing the power of the compressor in the heat pump device, leading to a lower energy efficiency ratio, increased energy consumption, and even compressor overload, resulting in poor safety. Summary of the Invention

[0003] The problem solved by this invention is how to improve the energy efficiency ratio, reduce energy consumption, and improve economic benefits while ensuring heating effect, and also to avoid compressor overload and improve safety and reliability.

[0004] To solve the above problems, the technical solution of the present invention is implemented as follows:

[0005] This invention provides a heat pump device, including an evaporator, a first compressor, a cooler, a second compressor, a condenser, and heating pipes. The evaporator, first compressor, cooler, second compressor, and condenser are connected end-to-end, forming a circulation pipeline for refrigerant flow. The heating pipeline is sequentially connected to the cooler and condenser for supplying water to be heated. The first compressor compresses the refrigerant from a low-pressure gaseous state to an intermediate-pressure gaseous state. The cooler exchanges heat between the intermediate-pressure gaseous refrigerant and the water to be heated for initial heating. The second compressor compresses the refrigerant from an intermediate-pressure gaseous state to a high-pressure gaseous state. The condenser releases heat and condenses the high-pressure gaseous refrigerant into a high-pressure liquid refrigerant for further heating the water. Compared with existing technologies, the heat pump device provided by this invention, by employing a first and second compressor located within the circulation pipeline and heating pipes sequentially connected to the cooler and condenser, can improve the energy efficiency ratio, reduce energy consumption, and increase economic benefits while ensuring heating effect. Furthermore, it avoids compressor overload, improving safety and reliability.

[0006] Furthermore, the heat pump device also includes a heat source pipeline connected to an evaporator. The heat source pipeline supplies heat source water, and the evaporator exchanges heat between the refrigerant and the heat source water to heat the refrigerant. This causes the refrigerant temperature to rise while the heat source water temperature to fall.

[0007] Furthermore, the heat pump device also includes a first temperature sensor. The heating pipe is provided with a water outlet, and the first temperature sensor is installed at the water outlet. The first temperature sensor is used to detect the temperature of the water to be heated in the water outlet, thereby detecting the outlet water temperature of the heating pipe.

[0008] Furthermore, the heat pump device also includes a first controller, which is electrically connected to both a first temperature sensor and a second compressor. The first controller is used to adjust the power of the second compressor according to the temperature of the water to be heated at the outlet, so that the temperature of the water to be heated at the outlet reaches a preset temperature. This ensures that the outlet water temperature of the heating pipeline meets the user's needs.

[0009] Furthermore, the heat pump device also includes a second temperature sensor. The heating pipe has a water inlet, and the second temperature sensor is installed at the water inlet. The second temperature sensor is used to detect the temperature of the water to be heated in the water inlet, thereby detecting the inlet water temperature of the heating pipe.

[0010] Furthermore, the heat pump device also includes a pressure sensor installed in the circulation pipeline and located between the first compressor and the cooler. The pressure sensor is used to detect the gas pressure of the intermediate-pressure gaseous refrigerant output by the first compressor.

[0011] Furthermore, the heat pump device also includes a second controller, which is electrically connected to a second temperature sensor, a pressure sensor, and a first compressor. The second controller is used to adjust the power of the first compressor according to the pressure of the intermediate-pressure gaseous refrigerant, so that the pressure of the intermediate-pressure gaseous refrigerant reaches the saturation pressure corresponding to the temperature of the water to be heated in the inlet, thereby maximizing the preheating effect of the cooler on the water to be heated.

[0012] Furthermore, the heat pump unit also includes a throttling device, which is installed in the circulation pipeline and positioned between the condenser and the evaporator. The throttling device is used to throttle the high-pressure liquid refrigerant flowing from the condenser into low-pressure liquid refrigerant and deliver it to the evaporator, thereby achieving the throttling function.

[0013] Furthermore, the heat pump device also includes a third temperature sensor and a fourth temperature sensor, both of which are installed in the circulation pipeline. The third temperature sensor is located between the throttling device and the evaporator, and the fourth temperature sensor is located between the evaporator and the first compressor. The third temperature sensor is used to detect the temperature of the low-pressure liquid refrigerant, and the fourth temperature sensor is used to detect the temperature of the low-pressure gaseous refrigerant.

[0014] Furthermore, the heat pump unit also includes a third controller, which is electrically connected to a third temperature sensor, a fourth temperature sensor, and a throttling device. The third controller is used to adjust the opening of the throttling device so that the superheat corresponding to the temperature difference between the low-pressure gaseous refrigerant and the low-pressure liquid refrigerant reaches a preset superheat. This improves the energy efficiency ratio and reduces energy consumption. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the heat pump device according to an embodiment of the present invention.

[0016] Explanation of reference numerals in the attached figures:

[0017] 100-Heat pump unit; 110-Evaporator; 120-First compressor; 130-Cooler; 140-Second compressor; 150-Condenser; 160-Heating pipeline; 161-Water outlet; 162-Water inlet; 170-Circulation pipeline; 180-Heat source pipeline; 190-First temperature sensor; 200-First controller; 210-Second temperature sensor; 220-Pressure sensor; 230-Second controller; 240-Throttling device; 250-Third temperature sensor; 260-Fourth temperature sensor; 270-Third controller. Detailed Implementation

[0018] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0019] Please refer to Figure 1 ( Figure 1 (The solid arrows in the diagram indicate the direction of water flow, while the dashed arrows indicate the direction of data transmission or circuit control.) This embodiment of the invention provides a heat pump device 100 for heat energy transfer. It can improve the energy efficiency ratio, reduce energy consumption, and increase economic benefits while ensuring heating effect, and also avoid compressor overload, thus improving safety and reliability.

[0020] The heat pump device 100 includes an evaporator 110, a first compressor 120, a cooler 130, a second compressor 140, a condenser 150, and a heating pipe 160. The evaporator 110, first compressor 120, cooler 130, second compressor 140, and condenser 150 are connected end-to-end, forming a circulation pipe 170 for supplying refrigerant. The heating pipe 160 is connected sequentially to the cooler 130 and condenser 150, and is used to supply water to be heated; that is, the water to be heated in the heating pipe 160 flows sequentially through the cooler 130 and condenser 150. Specifically, the power of the first compressor 120 is lower than that of the second compressor 140. The first compressor 120 is used to compress the refrigerant from a low-pressure gaseous state to an intermediate-pressure gaseous state. Since the gaseous refrigerant heats up during compression, the temperature of the intermediate-pressure gaseous refrigerant is higher. Cooler 130 is used to exchange heat between the intermediate-pressure gaseous refrigerant and the water to be heated, thus initially heating the water. After heat exchange, the temperature of the water to be heated initially rises, while the temperature of the intermediate-pressure gaseous refrigerant decreases, achieving preheating of the water. Second compressor 140 is used to compress the refrigerant from the intermediate-pressure gaseous state to the high-pressure gaseous state. Similarly, since the gaseous refrigerant heats up during compression, the temperature of the high-pressure gaseous refrigerant reaches its maximum. Condenser 150 is used to release heat and condense the high-pressure gaseous refrigerant into high-pressure liquid refrigerant, thereby reheating the water to be heated, achieving secondary heating of the water. In this way, by using cooler 130 to preheat the water and condenser 150 to reheat it, the energy efficiency ratio can be improved, energy consumption reduced, and economic benefits increased while ensuring heating effect. Furthermore, because of the two compression processes (compression by first compressor 120 and second compressor 140 respectively), the single compression power is reduced, thus avoiding compressor overload and improving safety and reliability.

[0021] Preferably, the heat pump device 100 further includes a heat source pipeline 180. The heat source pipeline 180 is connected to the evaporator 110 and is used to supply heat source water. The evaporator 110 is used to exchange heat between the refrigerant and the heat source water to heat the refrigerant, thereby increasing the refrigerant temperature and decreasing the heat source water temperature. Specifically, the heat source water can come from various sources, such as waste water discharged during the refrigeration process of a chiller or geothermal water. Since the temperature of the heat source water is higher than the temperature of the refrigerant in the evaporator 110, the heat from the heat source water is transferred to the refrigerant in the evaporator 110 through heat transfer, causing the refrigerant to absorb heat and increase its temperature.

[0022] In this embodiment, during the operation of the evaporator 110, the evaporator 110 can absorb heat and evaporate the low-pressure liquid refrigerant into a low-pressure gaseous refrigerant. In this process, the heat source is heat source water. However, it is not limited to this. In other embodiments, the heat source can be air (similar to the cooling function of an air conditioner, where the refrigerant absorbs heat from the indoor air). The heat source is not specifically limited.

[0023] It should be noted that during the preheating process of the water to be heated using the cooler 130, the amount of heat generated is equal to the heat absorbed by most of the refrigerant (the heat absorbed by the refrigerant from the heat source water in the evaporator 110) plus the heat generated by most of the gaseous refrigerant compressed by the first compressor 120. During the secondary heating process using the condenser 150, the amount of heat generated is equal to the remaining heat absorbed by the refrigerant (the heat absorbed by the refrigerant from the heat source water in the evaporator 110), the remaining heat generated by the gaseous refrigerant compressed by the first compressor 120, and the heat generated by the entirety of the gaseous refrigerant compressed by the second compressor 140. In this way, through two heating processes, as much heat as possible generated by the heat pump device 100 can be transferred to the water to be heated, effectively improving heating efficiency, enhancing heating effect, and increasing the energy efficiency ratio.

[0024] Preferably, the heat pump device 100 further includes a first temperature sensor 190 and a first controller 200. The heating pipe 160 is provided with an outlet 161, and the first temperature sensor 190 is installed at the outlet 161. The first temperature sensor 190 is used to detect the temperature of the water to be heated in the outlet 161, that is, the first temperature sensor 190 is used to detect the outlet water temperature of the heating pipe 160. The first controller 200 is electrically connected to both the first temperature sensor 190 and the second compressor 140. The first temperature sensor 190 is used to send the detected temperature data to the first controller 200. The first controller 200 is used to adjust the power of the second compressor 140 according to the temperature of the water to be heated in the outlet 161, so that the temperature of the water to be heated in the outlet 161 reaches a preset temperature, ensuring that the outlet water temperature of the heating pipe 160 meets the user's needs.

[0025] Preferably, the heat pump device 100 further includes a second temperature sensor 210, a pressure sensor 220, and a second controller 230. The heating pipe 160 is provided with a water inlet 162, and the second temperature sensor 210 is installed at the water inlet 162. The second temperature sensor 210 is used to detect the temperature of the water to be heated in the water inlet 162, that is, the second temperature sensor 210 is used to detect the inlet water temperature of the heating pipe 160. The pressure sensor 220 is installed in the circulation pipe 170 and is located between the first compressor 120 and the cooler 130. The pressure sensor 220 is used to detect the gas pressure of the intermediate-pressure gaseous refrigerant output by the first compressor 120. The second controller 230 is electrically connected to the second temperature sensor 210, the pressure sensor 220, and the first compressor 120. The second temperature sensor 210 is used to send the detected temperature data to the second controller 230, and the pressure sensor 220 is used to send the detected air pressure data to the second controller 230. The second controller 230 is used to adjust the power of the first compressor 120 according to the air pressure of the intermediate pressure gaseous refrigerant, so that the air pressure of the intermediate pressure gaseous refrigerant reaches the saturation air pressure corresponding to the temperature of the water to be heated in the water inlet 162, thereby maximizing the preheating effect of the cooler 130 on the water to be heated.

[0026] It is worth noting that the heat pump device 100 also includes a throttling element 240. The throttling element 240 is installed in the circulation pipe 170 and positioned between the condenser 150 and the evaporator 110. The throttling element 240 is used to throttle the high-pressure liquid refrigerant flowing from the condenser 150, converting it into low-pressure liquid refrigerant, and then delivering it to the evaporator 110, thereby achieving a throttling function. In this embodiment, the throttling element 240 is an expansion valve, but it is not limited to this. In other embodiments, the throttling element 240 can be a capillary tube; the type of throttling element 240 is not specifically limited.

[0027] Preferably, the heat pump device 100 further includes a third temperature sensor 250, a fourth temperature sensor 260, and a third controller 270. Both the third temperature sensor 250 and the fourth temperature sensor 260 are installed in the circulation pipe 170. The third temperature sensor 250 is located between the throttling device 240 and the evaporator 110, and the fourth temperature sensor 260 is located between the evaporator 110 and the first compressor 120. The third temperature sensor 250 is used to detect the temperature of the low-pressure liquid refrigerant, and the fourth temperature sensor 260 is used to detect the temperature of the low-pressure gaseous refrigerant. The third controller 270 is electrically connected to the third temperature sensor 250, the fourth temperature sensor 260, and the throttling device 240. The third temperature sensor 250 is used to send the detected temperature data to the third controller 270, and the fourth temperature sensor 260 is used to send the detected temperature data to the third controller 270. The third controller 270 is used to adjust the opening of the throttling device 240 so that the superheat corresponding to the temperature difference between the low-pressure gaseous refrigerant and the low-pressure liquid refrigerant reaches the preset superheat, thereby improving the energy efficiency ratio and reducing energy consumption.

[0028] It should be noted that during the operation of the heat pump device 100, the evaporator 110 first evaporates the low-pressure liquid refrigerant into a low-pressure gaseous refrigerant. During this process, the gaseous refrigerant absorbs heat from the heat source water. Subsequently, the first compressor 120 compresses the low-pressure gaseous refrigerant into an intermediate-pressure gaseous refrigerant. During this process, the temperature of the gaseous refrigerant increases during compression. Then, the cooler 130 exchanges heat between the intermediate-pressure gaseous refrigerant and the water to be heated flowing into the heating pipe 160, thereby lowering the temperature of the intermediate-pressure gaseous refrigerant and raising the temperature of the water to be heated, thus preheating the water. Then, the second compressor 140 compresses the cooled intermediate-pressure gaseous refrigerant into high-pressure gaseous refrigerant. During this process, the temperature of the gaseous refrigerant increases again during compression. Next, the condenser 150 condenses the high-pressure gaseous refrigerant into high-pressure liquid refrigerant. During this process, the refrigerant releases heat to the heating pipe 160, thereby raising the temperature of the water to be heated in the heating pipe 160 and achieving secondary heating of the water. Then, the throttling device 240 throttles the high-pressure liquid refrigerant into low-pressure liquid refrigerant and sends it to the evaporator 110 to achieve a phase change cycle of the refrigerant.

[0029] The heat pump device 100 described in this embodiment of the invention comprises an evaporator 110, a first compressor 120, a cooler 130, a second compressor 140, and a condenser 150 connected end to end, forming a circulation pipeline 170. The circulation pipeline 170 is used to supply refrigerant flow. A heating pipeline 160 is connected sequentially to the cooler 130 and the condenser 150, and is used to supply water to be heated. The first compressor 120 is used to compress the refrigerant from a low-pressure gaseous state to an intermediate-pressure gaseous state. The cooler 130 is used to exchange heat between the intermediate-pressure gaseous refrigerant and the water to be heated for initial heating. The second compressor 140 is used to compress the refrigerant from an intermediate-pressure gaseous state to a high-pressure gaseous state. The condenser 150 is used to exchange heat between the high-pressure gaseous refrigerant and the water to be heated for further heating. Compared with the prior art, the heat pump device 100 provided by the present invention, by employing a first compressor 120 and a second compressor 140 arranged in the circulation pipeline 170 and a heating pipeline 160 connected in sequence to the cooler 130 and the condenser 150, can improve the energy efficiency ratio, reduce energy consumption, improve economic benefits, and avoid compressor overload, thereby improving safety and reliability while ensuring heating effect.

[0030] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A heat pump device, characterized in that, The system includes an evaporator (110), a first compressor (120), a cooler (130), a second compressor (140), a condenser (150), and a heating pipe (160). The evaporator (110), the first compressor (120), the cooler (130), the second compressor (140), and the condenser (150) are connected end-to-end and form a circulation pipe (170) for supplying refrigerant. The heating pipe (160) is sequentially connected to the cooler (130). The first compressor (120) is connected to the condenser (150), the heating pipe (160) is used to supply water to be heated, the first compressor (120) is used to compress the refrigerant from a low-pressure gaseous state to an intermediate-pressure gaseous state, the cooler (130) is used to exchange heat between the intermediate-pressure gaseous refrigerant and the water to be heated for initial heating, the second compressor (140) is used to compress the refrigerant from an intermediate-pressure gaseous state to a high-pressure gaseous state, and the condenser (150) is used to release heat from the high-pressure gaseous refrigerant and condense it into a high-pressure liquid refrigerant for reheating the water to be heated.

2. The heat pump device according to claim 1, characterized in that, The heat pump device also includes a heat source pipeline (180), which is connected to the evaporator (110). The heat source pipeline (180) is used to supply heat source water, and the evaporator (110) is used to exchange heat between the refrigerant and the heat source water to heat the refrigerant.

3. The heat pump device according to claim 1, characterized in that, The heat pump device further includes a first temperature sensor (190), the heating pipe (160) is provided with a water outlet (161), the first temperature sensor (190) is installed at the water outlet (161), and the first temperature sensor (190) is used to detect the temperature of the water to be heated in the water outlet (161).

4. The heat pump device according to claim 3, characterized in that, The heat pump device further includes a first controller (200), which is electrically connected to both the first temperature sensor (190) and the second compressor (140). The first controller (200) is used to adjust the power of the second compressor (140) according to the temperature of the water to be heated in the outlet (161) so that the temperature of the water to be heated in the outlet (161) reaches a preset temperature.

5. The heat pump device according to claim 1, characterized in that, The heat pump device further includes a second temperature sensor (210). The heating pipe (160) is provided with a water inlet (162). The second temperature sensor (210) is installed at the water inlet (162) and is used to detect the temperature of the water to be heated in the water inlet (162).

6. The heat pump device according to claim 5, characterized in that, The heat pump device also includes a pressure sensor (220), which is installed in the circulation pipeline (170) and located between the first compressor (120) and the cooler (130). The pressure sensor (220) is used to detect the pressure of the intermediate-pressure gaseous refrigerant output by the first compressor (120).

7. The heat pump device according to claim 6, characterized in that, The heat pump device further includes a second controller (230), which is electrically connected to the second temperature sensor (210), the pressure sensor (220) and the first compressor (120). The second controller (230) is used to adjust the power of the first compressor (120) according to the pressure of the intermediate pressure gaseous refrigerant so that the pressure of the intermediate pressure gaseous refrigerant reaches the saturation pressure corresponding to the temperature of the water to be heated in the water inlet (162).

8. The heat pump device according to claim 1, characterized in that, The heat pump device further includes a throttling element (240), which is installed in the circulation pipeline (170) and located between the condenser (150) and the evaporator (110). The throttling element (240) is used to throttle the high-pressure liquid refrigerant flowing out of the condenser (150) into low-pressure liquid refrigerant and send it to the evaporator (110).

9. The heat pump device according to claim 8, characterized in that, The heat pump device further includes a third temperature sensor (250) and a fourth temperature sensor (260), both of which are installed in the circulation pipeline (170). The third temperature sensor (250) is located between the throttling device (240) and the evaporator (110), and the fourth temperature sensor (260) is located between the evaporator (110) and the first compressor (120). The third temperature sensor (250) is used to detect the temperature of the low-pressure liquid refrigerant, and the fourth temperature sensor (260) is used to detect the temperature of the low-pressure gaseous refrigerant.

10. The heat pump device according to claim 9, characterized in that, The heat pump device also includes a third controller (270), which is electrically connected to the third temperature sensor (250), the fourth temperature sensor (260) and the throttling device (240). The third controller (270) is used to adjust the opening of the throttling device (240) so that the superheat corresponding to the temperature difference between the low-pressure gaseous refrigerant and the low-pressure liquid refrigerant reaches a preset superheat.

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