Integrated semiconductor vehicle refrigerator and control method thereof

Abstract

The application provides an integrated semiconductor vehicle-mounted refrigerator and a control method thereof, and relates to the technical field of automobile refrigeration systems.The refrigerator comprises a box body, a semiconductor refrigeration assembly, an air-cooled evaporator, a fan, a cold storage box and a cold storage evaporator; the semiconductor refrigeration assembly is arranged in a storage space and has a cold end and a hot end, and the cold end is provided with a cooling fin; the air-cooled evaporator is arranged in the storage space; the fan is arranged in cooperation with the air-cooled evaporator, and after air flow passes through the air-cooled evaporator, part of the air flow enters the storage space and the other part of the air flow flows through the cooling fin of the cold end; the cold storage box is in heat conduction connection with the hot end and is filled with a cold storage agent; the cold storage evaporator is immersed in the cold storage agent; and the air-cooled evaporator and the cold storage evaporator are connected in parallel.The application alleviates the technical problems in the prior art that a single heat exchanger cannot simultaneously satisfy rapid cooling in the box and continuous heat dissipation at the hot end, the heat exchange efficiency of the cold storage module is low and the setting position is unreasonable, and the lack of fine and staged control leads to frequent start and stop of the compressor and high energy consumption.

Description

Technical Field

[0001] This invention relates to the field of automotive refrigeration systems, and more specifically, to an integrated semiconductor vehicle refrigerator and its control method. Background Technology

[0002] With the continuous improvement of automotive intelligence and comfort, in-vehicle refrigerators, as an important in-vehicle device to enhance the driving experience, have gradually become standard equipment in mid-to-high-end models. Currently, in-vehicle refrigerators mainly adopt two technologies: compressor refrigeration and semiconductor refrigeration.

[0003] Compressor-cooled car refrigerators use traditional compressor refrigeration technology, offering low cooling temperatures (down to -18℃) and high cooling efficiency. However, they suffer from drawbacks such as high cost, high noise, heavy weight, and low effective volume ratio. Especially when the vehicle is off, the independent compressor needs to run continuously, resulting in significant energy consumption and occupying valuable installation space in the vehicle.

[0004] Semiconductor-cooled car refrigerators utilize the Peltier effect of thermoelectric semiconductors for cooling, offering advantages such as low cost, small size, no vibration or noise, and the ability to switch between cooling and heating modes, making them widely used in the automotive field. However, semiconductor cooling technology is limited by the heat dissipation capacity of the hot end, especially in high-temperature environments, where traditional air-cooling becomes less effective, leading to an increase in the cold end temperature, a decrease in cooling capacity, and an inability to meet actual cooling needs.

[0005] To address the heat dissipation problem at the hot end of thermoelectric semiconductors, existing technologies propose coupling the vehicle refrigerator with the vehicle's air conditioning system. For example, using the low-temperature refrigerant from the vehicle's air conditioning system for active heat dissipation at the hot end of the thermoelectric semiconductor can significantly reduce the hot end temperature and improve cooling efficiency and temperature difference capability. However, existing solutions still have the following shortcomings: On the one hand, existing technologies mostly use a single heat exchanger to dissipate heat from the hot end of thermoelectric semiconductors. The refrigerant completes heat dissipation and cold storage sequentially within a single channel, making it impossible to achieve independent control over cooling of the interior of the chamber and heat dissipation from the hot end. In the initial cooling stage, when a rapid reduction in the internal temperature of the chamber is required, a single heat exchanger cannot simultaneously meet the dual needs of rapid cooling of the interior and continuous heat dissipation from the hot end, resulting in slow cooling speed and a poor user experience.

[0006] On the other hand, existing cold storage modules typically use a thermally conductive connection with the heat exchanger, which limits heat exchange efficiency. Furthermore, cold storage modules are mostly located at the cold end of the thermoelectric semiconductor, storing the cold energy generated at that end. When the vehicle's air conditioning system stops operating, although the cold storage module can release cold energy to maintain the internal temperature, insufficient heat dissipation from the hot end of the thermoelectric semiconductor leads to a sharp drop in its cooling efficiency, making it impossible to achieve truly long-term independent heat preservation operation.

[0007] Furthermore, existing technologies lack sophisticated control over the refrigeration circuit. If cooling continues through the air-cooled evaporator after the internal temperature of the enclosure has dropped to the target temperature, it will absorb the cold energy from the thermoelectric semiconductor's cold junction when it is below 0°C, resulting in wasted cooling energy and potentially causing the internal temperature to become too low. Simultaneously, the lack of an effective phased control strategy leads to frequent start-stop cycles of the vehicle's air conditioning compressor, resulting in high energy consumption and reduced compressor lifespan.

[0008] Therefore, there is an urgent need for a new type of integrated semiconductor vehicle refrigerator structure that can achieve independent control of rapid cooling inside the refrigerator and continuous heat dissipation at the hot end, improve cold storage and heat exchange efficiency, and reduce compressor start-stop frequency based on a phased control strategy, thereby reducing energy consumption and improving user experience. Summary of the Invention

[0009] The purpose of this invention is to provide an integrated semiconductor vehicle refrigerator and its control method, so as to alleviate the technical problems in the prior art where a single heat exchanger cannot simultaneously meet the requirements of rapid cooling inside the refrigerator and continuous heat dissipation at the hot end, the heat exchange efficiency of the cold storage module is low and its placement is unreasonable, and the lack of refined staged control leads to frequent start-stop of the compressor and high energy consumption.

[0010] This invention provides an integrated semiconductor vehicle refrigerator, comprising a cabinet, a semiconductor refrigeration component, an air-cooled evaporator, a fan, a cold storage box, and a cold storage evaporator. The cabinet interior forms a storage space. The semiconductor refrigeration component is disposed within the storage space, having a cold end and a hot end, with a heat sink on the cold end. The air-cooled evaporator is disposed within the storage space. The fan cooperates with the air-cooled evaporator, having a blowing end and a suction end. The fan blows airflow into the storage space through the blowing end, the airflow passes through the heat sink of the cold end of the air-cooled evaporator and the semiconductor refrigeration component, and then flows back into the storage space through the suction end, forming an air-cooled circulation within the storage space. The cold storage box is thermally connected to the hot end of the semiconductor refrigeration component, and is filled with a cold storage refrigerant. The cold storage evaporator is immersed in the cold storage refrigerant in the cold storage box. The air-cooled evaporator and the cold storage evaporator are connected in parallel.

[0011] In some embodiments, the air-cooled evaporator is equipped with a shut-off valve on its piping to cut off or allow refrigerant to enter the air-cooled evaporator.

[0012] In some embodiments, the integrated semiconductor vehicle refrigerator also includes an electronic expansion valve for controlling the refrigerant flow into the air-cooled evaporator and the cold storage evaporator.

[0013] In some embodiments, the cold end of the semiconductor refrigeration component is further provided with a cooling block for dissipating heat into the housing; the hot end of the semiconductor refrigeration component is thermally connected to the cold storage box, and the cold storage evaporator is immersed in the cold storage agent in the cold storage box for absorbing heat from the hot end of the semiconductor refrigeration component.

[0014] In some embodiments, the air-cooled evaporator and the fan are both located at the upper part of the storage space. The fan blows air into the storage space through the blowing end. The airflow flows along the air-cooled evaporator and the heat sink of the cold end of the semiconductor refrigeration component. An air duct is formed inside the housing. The cooled air enters the storage space downward through the air duct. The cold air sinks in the storage space, and the hot air rises and flows back to the suction end, and is then drawn in through the suction end to form a circulating air path.

[0015] In some embodiments, the fan is tilted relative to the cold end of the semiconductor cooling component, with the suction end of the fan facing the heat sink of the cold end of the semiconductor cooling component, so that airflow is forced to flow through the heat sink.

[0016] In some embodiments, the refrigerant is used to absorb and store cold energy during the cold storage phase when the compressor is operating, and to release the cold energy during the cold release phase when the compressor is shut down, so as to maintain the cooling operation of the semiconductor refrigeration component during compressor shutdown.

[0017] The present invention also provides a control method for an integrated semiconductor vehicle refrigerator, applicable to any of the above-mentioned integrated semiconductor vehicle refrigerators, comprising the following steps: Initial cooling phase: The compressor is turned on and the semiconductor refrigeration component is started. The air-cooled evaporator and the cold storage evaporator work simultaneously. The air-cooled evaporator, in conjunction with the fan, rapidly cools the inside of the housing. The airflow generated by the fan is forced to flow through the heat sink of the cold end of the semiconductor refrigeration component, so that the semiconductor refrigeration component cools rapidly. The cold storage evaporator dissipates heat from the hot end of the semiconductor refrigeration component, so that the cold end of the semiconductor refrigeration component continues to be cooled at a low temperature, thereby reducing the internal temperature of the housing to the first critical temperature. Deep cooling stage: When the internal temperature of the chamber drops to the first critical temperature, the air-cooled evaporator stops working and only the semiconductor refrigeration component cools the inside of the chamber. At the same time, the cold storage evaporator continues to dissipate heat from the hot end of the semiconductor refrigeration component so that the cold end of the semiconductor refrigeration component is kept at a low temperature, thereby allowing the internal temperature of the chamber to reach the second critical temperature. Cold storage and release stage: When the internal temperature of the chamber reaches the second critical temperature, the cold storage evaporator uses its surplus cold energy to store cold in the cold storage agent; when the cold storage agent has completed cold storage, the compressor stops working, the cold storage agent releases cold and continuously cools and dissipates heat to the hot end of the semiconductor refrigeration component, so as to maintain the refrigeration operation of the semiconductor refrigeration component during the compressor shutdown period.

[0018] In some embodiments, during the initial cooling phase, when the internal temperature of the housing is higher than a first preset temperature, the air-cooled evaporator and the semiconductor refrigeration component simultaneously cool the housing, causing the internal temperature to rapidly drop to a first critical temperature. When the internal temperature of the housing reaches the first critical temperature, the air-cooled evaporator stops working to prevent it from absorbing the cold energy from the semiconductor refrigeration component when its cold end is below zero degrees Celsius, and then enters the deep cooling phase.

[0019] In some embodiments, during the deep cooling phase, the cold storage evaporator maintains the hot end temperature of the semiconductor refrigeration component within a set temperature range, and the semiconductor refrigeration component maintains cooling of the interior of the chamber.

[0020] In some embodiments, the determination of the completion of cold storage by the cold storage agent is based on the cold storage agent temperature reaching its cold storage temperature or the cold storage agent reaching cold storage saturation.

[0021] In some embodiments, during the cold storage and release phase, when the internal temperature of the housing rises back to the third critical temperature, the compressor and the semiconductor refrigeration component are restarted to enter the initial cooling phase.

[0022] The beneficial effects of this invention are: The integrated semiconductor vehicle refrigerator and its control method of the present invention achieve the effect of rapidly reducing the temperature inside the refrigerator and accelerating the dissipation of heat from the cold end by blowing air into the storage space through a fan, and making the air flow along the way through the air-cooled evaporator and the heat sink of the cold end of the semiconductor refrigeration component, and then drawing it back in through the suction end to form an air-cooling cycle. This achieves the effect of rapidly reducing the temperature inside the refrigerator in the initial stage and accelerating the dissipation of heat from the cold end. By thermally connecting the cold storage box to the hot end of the semiconductor refrigeration component and immersing the cold storage evaporator in the cold storage refrigerant of the cold storage box, the effect of effectively dissipating heat from the hot end, maintaining a lower refrigeration temperature at the cold end, and achieving deep refrigeration inside the refrigerator is achieved. By absorbing and storing cold energy with a refrigerant, the compressor continuously releases and dissipates heat to the hot end during compressor shutdown, thereby maintaining the cooling operation of the semiconductor refrigeration components, reducing compressor operating time and start-stop frequency, and lowering overall energy consumption. By connecting the air-cooled evaporator and the cold storage evaporator in parallel, a multi-stage synergistic operation is achieved, including rapid cooling during the initial cooling phase, deep cooling, and independent cold storage and release during shutdown. By integrating the semiconductor refrigeration components, air-cooled evaporator, and fan into the housing, a compact overall structure, small footprint, and suitability for use in vehicle environments are achieved. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the integrated semiconductor vehicle refrigerator of the present invention in an exploded state; Figure 2 This is a structural schematic diagram of the integrated semiconductor vehicle refrigerator of the present invention from a frontal viewing angle; Figure 3 This is a top-view cross-sectional structural diagram of the integrated semiconductor vehicle refrigerator of the present invention; Figure 4 This is a schematic diagram of the cold storage box of the present invention; Figure 5 This is a system diagram of the integrated semiconductor vehicle refrigerator of the present invention.

[0025] icon: 100-Enclosure; 110-Storage space; 120-Insulation layer; 200-Semiconductor refrigeration component; 210-Cooling block; 220-Heat sink; 230-Cold end; 240-Hot end; 300-Air-cooled evaporator; 400-Cold storage evaporator; 500-Cold storage box; 510-Cold storage refrigerant; 520-Insulation cotton; 530-Air conditioning low-pressure pipeline; 540-Air conditioning high-pressure pipeline; 600-Stop valve; 700-Electronic expansion valve; 800-Air duct; 810-Fan; 900-Temperature sensor. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] In the description of this invention, it should be noted that the terms "inner," "outer," "upper," "lower," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only used for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] like Figures 1 to 5As shown, this invention provides an integrated semiconductor vehicle refrigerator, comprising a cabinet 100, a semiconductor refrigeration component 200, an air-cooled evaporator 300, a fan 810, a cold storage box 500, and a cold storage evaporator 400; the cabinet 100 forms a storage space 110 inside; the semiconductor refrigeration component 200 is disposed within the storage space 110, and the semiconductor refrigeration component 200 has a cold end 230 and a hot end 240, the cold end 230 being provided with heat sinks 220; the air-cooled evaporator 300 is disposed within the storage space 110; the fan 810 is configured in conjunction with the air-cooled evaporator 300. The fan 810 has a blowing end and a suction end. The fan 810 blows air into the storage space 110 through the blowing end. The airflow flows along the path of the air-cooled evaporator 300 and the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200, and then flows back into the storage space 110 through the suction end, forming an air-cooled circulation. The cold storage box 500 is thermally connected to the hot end 240 of the semiconductor refrigeration component 200. The cold storage box 500 is filled with a cold storage agent 510. The cold storage evaporator 400 is immersed in the cold storage agent 510 in the cold storage box 500. The air-cooled evaporator 300 and the cold storage evaporator 400 are connected in parallel.

[0030] The integrated semiconductor vehicle refrigerator of the present invention achieves a rapid temperature reduction and accelerated heat dissipation from the cold end by having a fan 810 blow air into the storage space 110 through the blowing end, and by having the airflow pass through the air-cooled evaporator 300 and the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200, and then be drawn back in through the suction end to form an air-cooling cycle. Furthermore, by thermally connecting the cold storage box 500 to the hot end 240 of the semiconductor refrigeration component 200, and immersing the cold storage evaporator 400 in the cold storage refrigerant 510 of the cold storage box 500, effective heat dissipation from the hot end is achieved, maintaining a lower cooling temperature at the cold end and realizing deep cooling within the refrigerator. Effects: By absorbing and storing cold energy through the refrigerant 510, the compressor continuously releases cold energy to the hot end during shutdown, thereby maintaining the cooling operation of the semiconductor refrigeration component 200, reducing compressor operating time and start-stop frequency, and reducing overall energy consumption; By connecting the air-cooled evaporator 300 and the cold storage evaporator 400 in parallel, a multi-stage synergistic operation effect is achieved, including rapid cooling during the initial cooling stage, deep cooling, and independent cold storage and release during shutdown; By integrating the semiconductor refrigeration component 200, the air-cooled evaporator 300, and the fan 810 into the housing 100, a compact overall structure, small footprint, and suitability for use in vehicle environments are achieved.

[0031] In some embodiments, a shut-off valve 600 is provided on the piping of the air-cooled evaporator 300 to cut off or allow the refrigerant entering the air-cooled evaporator 300. By setting the shut-off valve 600 on the piping of the air-cooled evaporator 300, the effect of controlling the opening and closing of the refrigerant passage of the air-cooled evaporator 300 is achieved; by cutting off the refrigerant passage of the air-cooled evaporator 300 when the temperature inside the chamber drops to the first critical temperature, the air-cooled evaporator 300 can be stopped from refrigeration in a timely manner, avoiding its absorption of cold energy from the cold end 230 of the semiconductor refrigeration component 200 when it is below zero degrees Celsius; by making the air-cooled evaporator 300 operate only in the initial cooling stage and stop operating in the deep cooling stage, the effect of achieving phased coordinated control of the refrigeration system, reducing cold energy loss, and improving overall refrigeration efficiency is achieved.

[0032] In some embodiments, the integrated semiconductor vehicle refrigerator also includes an electronic expansion valve 700 for controlling the refrigerant flow into the air-cooled evaporator 300 and the cold storage evaporator 400. By installing the electronic expansion valve 700 on the parallel pipelines of the air-cooled evaporator 300 and the cold storage evaporator 400, the refrigerant flow into the two evaporators can be precisely controlled. By independently adjusting the refrigerant flow of the two circuits according to the internal temperature and different cooling stages, the flow rate of the air-cooled evaporator 300 is increased in the initial cooling stage to accelerate the cooling inside the refrigerator, and the flow rate of the cold storage evaporator 400 is increased in the deep cooling stage to enhance heat dissipation at the hot end 240 and the charging of the cold storage refrigerant 510. By avoiding ineffective refrigerant flow in evaporators that are not in operation, the refrigerator reduces cold energy waste, improves the energy efficiency of the refrigeration system, and achieves refined refrigeration control.

[0033] In some embodiments, the cold end 230 of the semiconductor cooling component 200 is further provided with a cooling block 210 for dissipating heat into the housing 100; the hot end 240 of the semiconductor cooling component 200 is thermally connected to the cold storage box 500, and the cold storage evaporator 400 is immersed in the cold storage agent 510 in the cold storage box 500 for absorbing heat from the hot end 240 of the semiconductor cooling component 200. By setting a cooling block 210 at the cold end 230 of the semiconductor refrigeration component 200, the efficiency of cold energy transfer at the cold end 230 is improved, and the cooling inside the box is achieved quickly and evenly. By directly connecting the hot end 240 of the semiconductor refrigeration component 200 to the cold storage box 500, the heat dissipation path of the hot end 240 is shortened, and the heat conduction efficiency of the hot end 240 is improved. By immersing the cold storage evaporator 400 in the cold storage agent 510 inside the cold storage box 500, the heat exchange area is increased, the absorption of heat from the hot end 240 of the semiconductor refrigeration component 200 is enhanced, and the temperature of the hot end 240 is effectively reduced, thereby maintaining a lower cooling temperature at the cold end 230 to achieve the effect of deep cooling inside the box.

[0034] In some embodiments, the air-cooled evaporator 300 and the fan 810 are both located at the upper part of the storage space 110. The fan 810 blows air into the storage space 110 through the blowing end. The airflow flows along the air-cooled evaporator 300 and the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200. An air duct 800 is formed inside the housing 100. The cooled air enters the storage space 110 downward through the air duct 800. The cold air sinks in the storage space 110, and the hot air rises and flows back to the suction end, and is then drawn in through the suction end to form a circulating air path. By placing both the air-cooled evaporator 300 and the fan 810 at a slightly higher position in the storage space 110, and by having the fan 810 blow air into the storage space 110 through the air-blowing end, the airflow passes along the air-cooled evaporator 300 and the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200, achieving the effect of promoting air circulation and improving heat exchange efficiency by utilizing the natural convection characteristics of cold air sinking and hot air rising; by forming an air duct 800 in the cabinet 100, and by having the cooled air enter the storage space 110 downward through the air duct 800, the effect of directional delivery of cold air to the lower part of the cabinet and achieving the effect of uniform temperature distribution inside the cabinet; by having cold air sink in the storage space 110 and hot air rise and flow back to the air intake end and then be drawn in through the air intake end to form a circulating air path, the effect of avoiding local temperature differences inside the cabinet and improving the overall cooling uniformity is achieved.

[0035] In some embodiments, the fan 810 is tilted relative to the cold end 230 of the thermoelectric cooling assembly 200, with the suction end of the fan 810 facing the heat sink 220 of the cold end 230 of the thermoelectric cooling assembly 200, so that the airflow is forced to flow through the heat sink 220. By tilting the fan 810 relative to the cold end 230 of the thermoelectric cooling assembly 200 and having the suction end of the fan 810 facing the heat sink 220 of the cold end 230, the airflow is guided to flow through the heat sink 220, accelerating the heat dissipation of the cold end 230; by tilting the fan 810, the airflow path distance between the suction end of the fan 810 and the heat sink 220 is shortened, thereby reducing airflow loss and improving forced convection efficiency; by accelerating the heat dissipation of the cold end 230 of the thermoelectric cooling assembly 200, the cold end 230 is quickly brought to a lower temperature, improving the cooling efficiency of the thermoelectric cooling assembly 200 and shortening the time it takes for the chamber to reach the target temperature.

[0036] In some embodiments, the cold storage box 500 is wrapped with insulation cotton 520 to reduce heat exchange between the cold storage refrigerant 510 and the outside environment. By wrapping the cold storage box 500 with insulation cotton 520, the heat exchange between the cold storage refrigerant 510 and the external environment is reduced, and the heat loss of the cold storage refrigerant 510 is reduced. By maintaining the low temperature of the cold storage refrigerant 510 during the cold storage stage, the effective heat dissipation of the cold storage evaporator 400 to the hot end 240 of the semiconductor refrigeration component 200 is ensured, and the cold storage efficiency is improved. By slowing down the temperature rise rate of the cold storage refrigerant 510 during the cold release stage, the duration of cold release of the cold storage refrigerant 510 is extended, the compressor shutdown time is extended, the compressor start-stop frequency is reduced, and the overall energy consumption is reduced.

[0037] In some embodiments, the integrated semiconductor vehicle refrigerator also includes a temperature sensor 900 for detecting the internal temperature of the cabinet 100. By installing the temperature sensor 900 inside the cabinet 100, the internal temperature of the cabinet 100 can be detected in real time. By feeding the detected temperature signal back to the control system, the system provides a basis for judging the switching between the initial cooling stage, the deep cooling stage, and the cold storage and release stage, achieving precise temperature control. By adjusting the working state of the compressor and the semiconductor refrigeration component 200 in a timely manner according to the changes in the internal temperature, the system avoids unnecessary start-stop of the compressor, reduces energy consumption, and improves the operating efficiency of the refrigeration system.

[0038] In some embodiments, the refrigerant 510 absorbs and stores cold energy during the cold storage phase when the compressor is running, and releases the cold energy during the cold release phase when the compressor is stopped, thereby maintaining the cooling operation of the thermoelectric refrigeration component 200 during compressor shutdown. By having the refrigerant 510 absorb and store cold energy during the cold storage phase when the compressor is running, and then release the cold energy during the cold release phase when the compressor is stopped, the effect of continuously dissipating heat from the hot end 240 of the thermoelectric refrigeration component 200 and maintaining the low-temperature cooling of the cold end 230 of the thermoelectric refrigeration component 200 is achieved. By replacing the continuous operation of the compressor with the cold release of the refrigerant 510, the compressor's operating time and start-stop frequency are reduced, overall energy consumption is lowered, and the compressor's service life is extended. In some embodiments, an insulation layer 120 is provided on the outside of the housing 100. By providing an insulation layer 120 on the outside of the housing 100, the heat exchange between the inside of the housing 100 and the external environment is reduced, and the loss of cold energy is reduced; by reducing the intrusion of external heat into the storage space 110, the heat load of the refrigeration system is reduced, and the cooling time is shortened; by maintaining a low-temperature environment inside the housing 100, the operating time of the compressor and the semiconductor refrigeration component 200 is reduced, the overall energy consumption is reduced, and the insulation performance is improved.

[0039] In some embodiments, the integrated semiconductor vehicle refrigerator further includes an air conditioning high-pressure pipeline 540 and an air conditioning low-pressure pipeline 530; one end of the air conditioning high-pressure pipeline 540 is connected to the compressor outlet, and the other end is connected to the inlet of the electronic expansion valve 700, for conveying the high-pressure refrigerant discharged from the compressor to the electronic expansion valve 700; one end of the air conditioning low-pressure pipeline 530 is connected to the parallel outlet of the air-cooled evaporator 300 and the cold storage evaporator 400, and the other end is connected to the compressor inlet, for returning the low-pressure refrigerant after heat exchange in the evaporator to the compressor; the air conditioning high-pressure pipeline 540 and the air conditioning low-pressure pipeline 530 respectively form a high-pressure delivery section and a low-pressure return section for the refrigerant, thereby achieving the effect of forming a complete circulation loop for the refrigerant among the compressor, the electronic expansion valve 700, the air-cooled evaporator 300 and the cold storage evaporator 400, ensuring the stable operation of the refrigeration system.

[0040] The present invention also provides a control method for an integrated semiconductor vehicle refrigerator, applicable to any of the above-mentioned integrated semiconductor vehicle refrigerators, comprising the following steps: Initial cooling phase: The compressor is turned on, and the semiconductor refrigeration component 200 is started. The air-cooled evaporator 300 and the cold storage evaporator 400 work simultaneously. The air-cooled evaporator 300, in conjunction with the fan 810, rapidly cools the inside of the cabinet 100. The airflow generated by the fan 810 is forced to flow through the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200, so that the semiconductor refrigeration component 200 cools down quickly. The cold storage evaporator 400 dissipates heat from the hot end 240 of the semiconductor refrigeration component 200, so that the cold end 230 of the semiconductor refrigeration component 200 continues to be cooled at a low temperature, thereby reducing the internal temperature of the cabinet 100 to the first critical temperature. Deep cooling stage: When the internal temperature of the cabinet 100 drops to the first critical temperature, the air-cooled evaporator 300 stops working and only the semiconductor refrigeration component 200 cools the inside of the cabinet 100. At the same time, the cold storage evaporator 400 continues to dissipate heat to the hot end 240 of the semiconductor refrigeration component 200 so that the cold end 230 of the semiconductor refrigeration component 200 is kept at a low temperature, thereby making the internal temperature of the cabinet 100 reach the second critical temperature. Cold storage and release stage: When the internal temperature of the housing 100 reaches the second critical temperature, the cold storage evaporator 400 uses the surplus cold energy to store cold in the cold storage agent 510; when the cold storage agent 510 has completed cold storage, the compressor stops working, the cold storage agent 510 releases cold and continuously cools and dissipates heat to the hot end 240 of the semiconductor refrigeration component 200, so as to maintain the refrigeration operation of the semiconductor refrigeration component 200 during the compressor shutdown period.

[0041] This invention achieves rapid cooling of the chamber temperature to the first critical temperature by simultaneously operating the air-cooled evaporator 300 and the semiconductor refrigeration component 200 during the initial cooling stage, and by forcing the airflow generated by the fan 810 through the heat sink 220 of the cold end 230 of the semiconductor refrigeration component 200. During the deep cooling stage, when the chamber temperature drops to the first critical temperature, the air-cooled evaporator 300 stops operating, and only the semiconductor refrigeration component 200 provides cooling. Simultaneously, the cold storage evaporator 400 continuously dissipates heat to the hot end 240, preventing the air-cooled evaporator 300 from absorbing cold energy from the cold end 230 when it is below zero degrees Celsius, thus allowing the chamber temperature to continue to drop to the second critical temperature. The system achieves deep cooling by utilizing surplus cooling capacity to store cold energy in the refrigerant 510 after the internal temperature reaches the second critical temperature during the cold storage and release phase. After the cold storage 510 has completed its cold storage, the compressor is stopped, and the refrigerant 510 releases cold energy to continuously dissipate heat to the hot end 240. This maintains continuous cooling of the semiconductor refrigeration component 200 during compressor shutdown, reduces compressor operating time and start / stop frequency, and lowers overall energy consumption. Through phased and progressive coordinated control of the initial cooling phase, deep cooling phase, and cold storage and release phase, the system matches the optimal cooling strategy according to changes in internal temperature, achieving a balance between rapid cooling and deep cooling, and improving cooling efficiency and energy saving.

[0042] In some embodiments, during the initial cooling phase, when the internal temperature of the housing 100 is higher than the first preset temperature, the air-cooled evaporator 300 and the semiconductor refrigeration component 200 simultaneously cool, causing the internal temperature of the housing 100 to drop rapidly to the first critical temperature; when the internal temperature of the housing 100 reaches the first critical temperature, the air-cooled evaporator 300 stops working to prevent the air-cooled evaporator 300 from absorbing the cold energy of the cold end 230 of the semiconductor refrigeration component 200 when it is below zero degrees Celsius, and enters the deep cooling phase. By setting a first preset temperature during the initial cooling phase as the start-up condition for simultaneous cooling by the air-cooled evaporator 300 and the semiconductor refrigeration component 200, the system can fully utilize the synergistic cooling capabilities of both components when the internal temperature is high, allowing the internal temperature to drop rapidly to the first critical temperature. By stopping the air-cooled evaporator 300 when the internal temperature of the cabinet 100 reaches the first critical temperature, the system can prevent the air-cooled evaporator 300 from continuing to absorb cold energy when the cold end 230 of the semiconductor refrigeration component 200 is below zero degrees Celsius, thus preventing cold energy waste and the risk of frost formation. By promptly exiting the air-cooled evaporator 300 and entering the deep cooling phase, the system can achieve a smooth switching of cooling modes, allow the semiconductor refrigeration component 200 to independently perform deep cooling, and optimize the operating strategy of the cooling system.

[0043] In some embodiments, during the deep cooling stage, the cold storage evaporator 400 maintains the temperature of the hot end 240 of the semiconductor refrigeration component 200 within a set temperature range, and the semiconductor refrigeration component 200 maintains cooling of the interior of the cabinet 100. By continuously dissipating heat from the hot end 240 of the semiconductor refrigeration component 200 by the cold storage evaporator 400 during the deep cooling stage, the temperature of the hot end 240 is maintained within the set temperature range, preventing overheating. By maintaining a stable temperature of the hot end 240, the cold end 230 of the semiconductor refrigeration component 200 is kept in a low-temperature cooling state, ensuring that the temperature inside the cabinet continues to drop to the second critical temperature. By independently cooling the interior of the cabinet 100 with the cooperation of the cold storage evaporator 400, the semiconductor refrigeration component 200 can effectively maintain deep cooling and achieve a stable low-temperature environment inside the cabinet even after the air-cooled evaporator 300 is deactivated.

[0044] By using the temperature of the refrigerant 510 reaching its storage temperature or the refrigerant 510 reaching storage saturation as the criterion for determining the completion of storage, the system achieves the effect of accurately judging the end of the storage phase and avoiding ineffective compressor operation. By timely and accurately determining the completion status of storage, the system enables the compressor to stop in time when storage is sufficient, allowing the refrigerant 510 to independently handle heat dissipation at the hot end 240, thus reducing compressor energy consumption. By providing a reliable judgment standard for starting the storage and release phase, the system achieves the effect of intelligent control of the refrigeration system and improves overall operating efficiency.

[0045] In some embodiments, the determination of the completion of cold storage by the refrigerant 510 is based on the refrigerant 510 reaching its cold storage temperature or cold storage saturation. By using the refrigerant 510 reaching its cold storage temperature or cold storage saturation as the criteria for determining the completion of cold storage, the system can accurately determine the end of the cold storage phase and avoid excessive compressor operation. By using the temperature state of the refrigerant 510 itself as the standard for the completion of cold storage, the system can ensure that the compressor stops in a timely manner when sufficient cold storage is achieved, reducing ineffective energy consumption. By ensuring that the refrigerant 510 has fully stored cold before entering the cold release phase, the system can ensure that the refrigerant 510 has sufficient cooling capacity to continuously dissipate heat from the hot end 240 of the semiconductor refrigeration component 200 and maintain stable cooling during subsequent compressor shutdown.

[0046] In some embodiments, during the cold storage and release phase, when the internal temperature of the chamber 100 rises to the third critical temperature, the compressor and semiconductor refrigeration component 200 are restarted, entering the initial cooling phase. By setting the third critical temperature as the trigger condition for restarting the compressor and semiconductor refrigeration component 200 during the cold storage and release phase, the effect of timely resumption of active refrigeration when the internal temperature rises to the set threshold is achieved, preventing excessive temperature rise within the chamber. By automatically switching from the cold storage and release phase back to the initial cooling phase, the effect of achieving cyclical operation of the refrigeration system and maintaining the internal temperature within a reasonable range is achieved. By avoiding premature compressor startup while the refrigerant 510 still has the ability to release cold, the effect of fully utilizing the cooling capacity of the refrigerant 510 is achieved, further reducing compressor operating time and lowering overall energy consumption.

[0047] It should be noted that, where there is no conflict, the features in the embodiments of this invention can be combined with each other.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An integrated semiconductor vehicle refrigerator, characterized in that, include: The box (100) forms a storage space (110) inside the box (100); A semiconductor cooling component (200) is disposed within the storage space (110). The semiconductor cooling component (200) has a cold end (230) and a hot end (240). The cold end (230) is provided with a heat sink (220). An air-cooled evaporator (300) is disposed within the storage space (110); A fan (810) is configured in conjunction with the air-cooled evaporator (300). The fan (810) has a blowing end and a suction end. The fan (810) blows air into the storage space (110) through the blowing end. The air flows along the air-cooled evaporator (300) and the heat sink (220) of the cold end (230) of the semiconductor refrigeration component (200), and then flows back into the storage space (110) through the suction end, forming an air-cooled circulation in the storage space (110). The cold storage box (500) is thermally connected to the hot end (240) of the semiconductor refrigeration component (200), and the cold storage box (500) is filled with a cold storage agent (510). A cold storage evaporator (400) is immersed in the cold storage refrigerant (510) in the cold storage box (500); The air-cooled evaporator (300) and the cold storage evaporator (400) are connected in parallel.

2. The integrated semiconductor vehicle refrigerator according to claim 1, characterized in that, The air-cooled evaporator (300) is equipped with a shut-off valve (600) on its pipeline, which is used to cut off or allow the refrigerant to enter the air-cooled evaporator (300).

3. The integrated semiconductor vehicle refrigerator according to claim 1, characterized in that, It also includes an electronic expansion valve (700) for controlling the refrigerant flow into the air-cooled evaporator (300) and the cold storage evaporator (400).

4. The integrated semiconductor vehicle refrigerator according to claim 1, characterized in that, The cold end (23) of the semiconductor refrigeration component (200) is provided with a cooling block (210) for dissipating heat into the housing (100); the hot end (240) of the semiconductor refrigeration component (200) is thermally connected to the cold storage box (500), and the cold storage evaporator (400) is immersed in the cold storage agent (510) in the cold storage box (500) for absorbing the heat of the hot end (240) of the semiconductor refrigeration component (200).

5. The integrated semiconductor vehicle refrigerator according to claim 1, characterized in that, The air-cooled evaporator (300) and the fan (810) are both located at the upper part of the storage space (110). The fan (810) blows air into the storage space (110) through the blowing end. The air flows along the air-cooled evaporator (300) and the heat sink (220) of the cold end (230) of the semiconductor refrigeration component (200). An air duct (800) is formed inside the housing (100). The cooled air enters the storage space (110) downward through the air duct (800). The cold air sinks in the storage space (110), and the hot air rises and flows back to the suction end, and is then drawn in through the suction end to form a circulating air path.

6. The integrated semiconductor vehicle refrigerator according to claim 5, characterized in that, The fan (810) is inclined relative to the cold end (230) of the semiconductor cooling component (200), and the suction end of the fan (810) faces the heat sink (220) of the cold end of the semiconductor cooling component (200) so that the airflow is forced to flow through the heat sink (220).

7. The integrated semiconductor vehicle refrigerator according to claim 1, characterized in that, The cold storage agent (510) is used to absorb and store cold energy during the cold storage phase when the compressor is working, and to release cold energy during the cold release phase when the compressor is stopped, so as to maintain the cooling operation of the semiconductor refrigeration component (200) during the compressor shutdown period.

8. A control method for an integrated semiconductor vehicle refrigerator, applied to the integrated semiconductor vehicle refrigerator according to any one of claims 1-7, characterized in that, Includes the following steps: Initial cooling stage: The compressor is turned on and the semiconductor refrigeration component (200) is started. The air-cooled evaporator (300) and the cold storage evaporator (400) work simultaneously. The air-cooled evaporator (300) works with the fan (810) to quickly cool the inside of the box (100). The airflow generated by the fan (810) is forced to flow through the heat sink (220) of the cold end (230) of the semiconductor refrigeration component (200) so that the semiconductor refrigeration component (200) cools down quickly. The cold storage evaporator (400) dissipates heat from the hot end (240) of the semiconductor refrigeration component (200) so that the cold end (230) of the semiconductor refrigeration component (200) continues to be cooled at a low temperature, thereby reducing the internal temperature of the box (100) to the first critical temperature. Deep cooling stage: When the internal temperature of the box (100) drops to the first critical temperature, the air-cooled evaporator (300) stops working and only the semiconductor refrigeration component (200) cools the inside of the box (100). At the same time, the cold storage evaporator (400) continues to dissipate heat to the hot end (240) of the semiconductor refrigeration component (200) so that the cold end (230) of the semiconductor refrigeration component (200) is kept at a low temperature, thereby making the internal temperature of the box (100) reach the second critical temperature. Cold storage and release stage: When the internal temperature of the housing (100) reaches the second critical temperature, the cold storage evaporator (400) uses its surplus cold energy to store cold in the cold storage agent (510); when the cold storage agent (510) has completed cold storage, the compressor stops working, the cold storage agent (510) releases cold and continuously cools and dissipates heat to the hot end (240) of the semiconductor refrigeration component (200) to maintain the refrigeration operation of the semiconductor refrigeration component (200) during the compressor shutdown period.

9. The control method for the integrated semiconductor vehicle-mounted refrigerator according to claim 8, characterized in that, During the initial cooling stage, when the internal temperature of the housing (100) is higher than the first preset temperature, the air-cooled evaporator (300) and the semiconductor refrigeration component (200) simultaneously cool, causing the internal temperature of the housing (100) to drop rapidly to the first critical temperature; when the internal temperature of the housing (100) reaches the first critical temperature, the air-cooled evaporator (300) stops working to prevent the air-cooled evaporator (300) from absorbing the cold energy of the cold end (230) of the semiconductor refrigeration component (200) when it is below zero degrees Celsius, and enters the deep cooling stage.

10. The control method for the integrated semiconductor vehicle-mounted refrigerator according to claim 9, characterized in that, During the deep cooling stage, the cold storage evaporator (400) maintains the hot end temperature of the semiconductor cooling component (200) within a set temperature range, and the semiconductor cooling component (200) maintains cooling of the interior of the housing (100).

11. The control method for the integrated semiconductor vehicle-mounted refrigerator according to claim 9, characterized in that, The criteria for determining whether the cold storage agent (510) has completed cold storage are that the temperature of the cold storage agent (510) reaches its cold storage temperature or the cold storage agent (510) is saturated.

12. The control method for the integrated semiconductor vehicle-mounted refrigerator according to claim 9, characterized in that, During the cold storage and release phase, when the internal temperature of the housing (100) rises to the third critical temperature, the compressor and the semiconductor refrigeration component (200) are restarted, and the initial cooling phase begins.

Images