A vacuum drying system for large-sized substrates

Abstract

The application relates to a vacuum drying system for a large-size substrate, comprising a box body, a vacuum pumping device for pumping the box body, two action plates, each of which comprises a hot plate for carrying the substrate and a cooling plate, the hot plate is provided with a heating structure, the cooling plate is located in the box body and directly above the hot plate, the cooling plate is provided with a cooling structure, two sets of leveling components, each of which acts on the mutually facing installation surfaces of the hot plate and the cooling plate, and each of which adjusts the flatness of the mutually facing surfaces of the hot plate and the cooling plate so that the surfaces of the hot plate and the cooling plate are parallel everywhere, wherein the heating structure and the cooling structure make the temperature difference between the hot plate and the cooling plate at any vertical corresponding position within a preset standard temperature difference range. The flatness of the hot plate and the cooling plate is adjusted, the temperature difference between the hot plate and the cooling plate at any vertical corresponding position is consistent, the evaporation rate of the solvent at each position on the substrate surface is consistent, and the film forming uniformity is ensured.

Description

Technical Field

[0001] This application relates to the field of vacuum drying technology, and in particular to a vacuum drying system for large-size substrates. Background Technology

[0002] Vacuum Chamber Dryers (VCDs) are core process equipment in semiconductor, flat panel display, photovoltaic cell, and flexible electronics manufacturing, widely used in key processes such as photoresist curing, thin film dehydration, coating drying, and solvent replacement. With the evolution of semiconductor wafers to 12 inches and larger, the development of OLED panels towards higher generation lines such as G8.5 / G10.5, and the rapid rise of perovskite solar cells and large flexible substrates, the area of ​​the substrate to be dried has significantly increased, and the requirements for the consistency of vacuum drying have also risen dramatically.

[0003] The stage (hot plate) is used to support the substrate, and the cold plate is located above the hot plate and parallel to it. The temperature of the hot plate is higher than that of the cold plate, so when the solvent evaporates and forms a film on the substrate surface, it rises, increasing the evaporation rate.

[0004] In related technologies, the substrate size to be processed is small, so the corresponding hot plate and cold plate sizes are also small. The temperature uniformity of the hot plate and cold plate is easy to control, and the flatness of the hot plate and cold plate is also easy to control, so as to ensure that the temperature difference between the hot plate and cold plate is consistent throughout the substrate, and also to ensure the consistency of solvent evaporation throughout the substrate surface, making it easy to ensure film formation consistency.

[0005] However, when the substrate size is large, the areas of the hot and cold plates need to be expanded accordingly. Under the combined effects of weight, thermal stress, and vacuum pressure, the flatness of a large, monolithic hot or cold plate is difficult to guarantee. Poor flatness of the hot or cold plates results in varying spacing between them, leading to different solvent evaporation rates at different locations on the substrate, thus causing uneven film formation. Furthermore, it is difficult to ensure temperature uniformity for large-sized hot and cold plates, resulting in temperature differences at different locations on the hot and cold plates. Consequently, different solvent evaporation rates occur at different locations on the substrate, affecting film quality. Summary of the Invention

[0006] This application provides a vacuum drying system for large-size substrates to solve the technical problem in related technologies where the flatness and temperature consistency of hot and cold plates are difficult to guarantee, resulting in poor consistency of solvent evaporation rates at different locations on the substrate, which adversely affects film quality.

[0007] A vacuum drying system for large-size substrates, comprising: A housing, the housing being sealed and used to house a substrate; A vacuum device is used to evacuate the housing. Two working plates, each comprising a hot plate and a cold plate, are located within the housing. The hot plate supports the substrate and contains a heating structure for adjusting the temperature at various points on the hot plate. The cold plate is located within the housing, directly above the hot plate, and contains a cooling structure for adjusting the temperature at various points on the cold plate. Two sets of leveling components are provided. The two sets of leveling components act on the mounting surfaces of the hot plate and the cold plate that are opposite to each other. The two sets of leveling components adjust the flatness of the working surfaces of the hot plate and the cold plate so that the working surfaces of the hot plate and the cold plate are parallel at all points. The heating structure and the cooling structure ensure that the temperature difference between the hot plate and the cold plate remains consistent at any corresponding vertical position.

[0008] In some embodiments, the heating structure includes heating channels that are distributed throughout the hot plate, and heating liquid is supplied to the heating channels to heat the surface of the hot plate. The cooling structure includes cooling channels that are distributed throughout the cold plate. Cooling liquid is supplied to the cooling channels to cool the surface of the cold plate. The heating channel and the cooling channel have the same shape and are vertically aligned. The flow direction of the heating liquid in the heating channel is opposite to that of the cooling liquid in the cooling channel, so that the temperature difference at each corresponding point in the heating channel and the cooling channel is consistent in the vertical direction, and the temperature difference between the hot plate and the cold plate at any corresponding point in the vertical direction is within a preset standard temperature difference range.

[0009] In some embodiments, the heating channel includes multiple heating sub-channels, each of which has an independent inlet and outlet; the cooling channel includes multiple cooling sub-channels, each of which has an independent inlet and outlet. Each of the heating sub-channels corresponds to a cooling sub-channel in the vertical direction, forming a group, and the liquid flow direction in each group of heating sub-channels and cooling sub-channels is opposite.

[0010] In some embodiments, each of the heating sub-channels and each of the cooling sub-channels includes multiple channels, with the multiple channels of each heating sub-channel arranged adjacent to each other at intervals, and the multiple channels of each cooling sub-channel arranged adjacent to each other at intervals; the liquid flow direction in adjacent channels is opposite.

[0011] In some embodiments, the liquid flow directions in two adjacent heating sub-channels that are close to each other are opposite; the liquid flow directions in two adjacent cooling sub-channels that are close to each other are opposite.

[0012] In some embodiments, the leveling component includes: Mounting bracket, the mounting bracket being located on one side of the mounting surface of the functional plate; Multiple adjustment components are provided, and the action plate is connected to the mounting frame through the multiple adjustment components respectively. The multiple adjustment components are evenly distributed on the mounting surface of the action plate. The plurality of adjustment components are used to adjust the distance between the position of the action plate and the mounting bracket at various points, so as to make the action surface of the action plate flat.

[0013] In some embodiments, the adjustment assembly includes an adjustment screw, the adjustment screw having a first threaded section and a second threaded section, the adjustment screw passing through the mounting bracket, and the first threaded section of the adjustment screw threadedly engaging with the actuating plate, and the second threaded section of the adjustment screw threadedly engaging with the mounting bracket; Wherein, the pitch of the first threaded segment is less than the pitch of the second threaded segment, and the distance between the action plate and the mounting bracket at the adjustment component is changed by rotating the adjustment screw; and the action surface of the action plate is made flat by adjusting all the adjustment components.

[0014] In some embodiments, the adjustment component further includes: A first mating block is fixed to the mounting surface of the functional plate; The second mating block is fixed to the side of the mounting bracket away from the function plate; The adjusting screw is adapted to pass through the second mating block and the mounting bracket in sequence, and the first threaded section of the adjusting screw is threadedly engaged with the first mating block, and the second threaded section of the adjusting screw is threadedly engaged with the second mating block.

[0015] In some embodiments, the vacuum drying system for the large-size substrate further includes a stress structure disposed on the mounting surface of the action plate. The stress structure includes multiple stress ring grooves arranged sequentially from the inside out.

[0016] In some embodiments, the vacuum drying system for the large-size substrate further includes a lifting assembly and a ejector assembly, wherein the lifting assembly is used to drive the hot plate to move up and down; the ejector assembly includes: Ejector pin holder, the ejector pin holder being located below the hot plate; Multiple ejector pins are mounted on the ejector pin holder and pass through the hot plate; In this configuration, the lifting assembly drives the hot plate to descend, and the hot plate descends relative to the ejector pins. Multiple ejector pins extend above the hot plate and are used to support the substrate for loading and unloading. The hot plate rises relative to the ejector pins, and the ejector pins descend to a position below the working surface of the hot plate. The substrates on the multiple ejector pins are supported by the hot plate.

[0017] In some embodiments, the ejector pin assembly further includes a plurality of limiting rods, all of which are mounted on the ejector pin holder. The limiting rods are located on the periphery of the hot plate, and the top surface of the limiting rod is higher than the top surface of the ejector pin. When the hot plate is in its highest position, the top of the limiting rod still extends above the hot plate. The limiting rod is used by the side of the substrate to abut against, thereby limiting the position of the substrate.

[0018] The beneficial effects of the technical solution provided in this application include: This application provides a vacuum drying system for large-size substrates. By setting leveling components on the mounting surfaces of the hot and cold plates, which are opposite to each other, the system independently and actively corrects the flatness of the opposing surfaces of the hot and cold plates. This allows the opposing surfaces of the hot and cold plates to overcome the inherent bending and warping tendencies of large-area substrates, restoring and maintaining an ideal planar state. Furthermore, this active leveling mechanism can dynamically or periodically compensate for deformation under actual working conditions, ensuring that the opposing surfaces of the hot and cold plates remain precisely parallel throughout the entire surface area. This results in uniform spacing between the hot and cold plates across the entire surface area, ensuring consistent solvent evaporation rates across the substrate surface and guaranteeing film uniformity.

[0019] Furthermore, by incorporating heating structures within the hot plate and cooling structures within the cold plate, the temperatures of each part of the hot and cold plates can be independently controlled, ensuring a consistent temperature difference between the hot and cold plates at any corresponding vertical position. This guarantees consistent solvent evaporation driving force across the substrate surface, thereby ensuring consistent film formation.

[0020] Therefore, by controlling the flatness of the hot and cold plates, the spacing between any corresponding vertical positions of the hot and cold plates is kept consistent, as is the temperature difference at any corresponding vertical positions of the hot and cold plates. This ensures a consistent environment for the solvent throughout the substrate, consistent evaporation driving force for the solvent, and improves the film uniformity on the substrate surface. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of a vacuum drying system for a large-size substrate provided in an embodiment of this application; Figure 2 A three-dimensional schematic diagram of a vacuum drying system for a large-size substrate provided in an embodiment of this application; Figure 3 A schematic diagram of the cold plate, hot plate, and leveling assembly provided in an embodiment of this application; Figure 4 A schematic diagram of the cold plate and hot plate provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of the cold plate and hot plate provided in an embodiment of this application; Figure 6 This is a schematic diagram of the internal structure of the cold plate provided in an embodiment of this application; Figure 7 This is a schematic diagram of the internal structure of the hot plate provided in an embodiment of this application; Figure 8 A schematic diagram of the hot plate and leveling assembly provided in an embodiment of this application; Figure 9 A partial longitudinal sectional view of the hot plate and leveling assembly provided in an embodiment of this application; Figure 10 A schematic diagram of the lifting assembly, leveling assembly, and hot plate provided in the embodiments of this application; Figure 11 A schematic diagram of the hot plate and ejector pin assembly provided in an embodiment of this application; Figure 12 A schematic diagram showing the ejector pin extending above the hot plate, as provided in an embodiment of this application; Figure 13 This is a schematic diagram showing that the top of the ejector pin is flush with the top of the hot plate, as provided in an embodiment of this application.

[0023] In the diagram: 1. Housing; 2. Evacuation device; 21. Dry pump; 22. Molecular pump; 3. Action plate; 31. Hot plate; 31a. Heating channel; 31a1. Heating sub-channel; 32. Cold plate; 32a. Cooling channel; 32a1. Cooling sub-channel; 3a. Stress structure; 4. Leveling assembly; 41. Adjustment assembly; 411. Adjustment screw; 4111. First threaded section; 4112. Second threaded section; 412. First mating block; 413. Second mating block; 414. Locking nut; 42. Mounting bracket; 5. Visual monitoring component; 6. Bellows; 7. Maintenance door; 8. Lifting assembly; 81. Push frame; 81a. Spherical groove; 82. Lifting drive component; 9. Ejector pin assembly; 91. Ejector pin frame; 92. Ejector pin; 93. Limiting rod. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] This application provides a vacuum drying system for large-size substrates. By adjusting the flatness of the hot and cold plates and ensuring a consistent temperature difference between them at any corresponding vertical position, the system guarantees a consistent solvent evaporation rate across the substrate surface, thus ensuring film uniformity. This application addresses the technical problem in related technologies where the flatness and temperature consistency of the hot and cold plates are difficult to guarantee, leading to inconsistent solvent evaporation rates at different locations on the substrate and negatively impacting film quality.

[0026] Reference Figures 1-3 A vacuum drying system for large-size substrates includes a housing 1, an air extraction device 2, two action plates 3, and two sets of leveling components 4.

[0027] Reference Figures 1-3 The enclosure 1 is used to house the substrate. The enclosure 1 is sealed, and the vacuum pump 2 is connected to the enclosure 1 to evacuate the enclosure 1. In this embodiment, the vacuum pump 2 includes a dry pump 21 and a molecular pump 22. The dry pump 21 is used to evacuate first, and then the molecular pump 22 is used to evacuate, so as to achieve a high vacuum level inside the enclosure 1.

[0028] By placing the substrate inside the housing 1 and evacuating the housing 1 using the vacuum pump 2, the evacuation rate of the solvent on the substrate surface is increased, thereby improving the film quality.

[0029] Preferably, the suction port of the molecular pump 22 is connected to the inside of the housing 1 from the side of the housing 1, and the suction port of the dry pump 21 is connected to the inside of the housing 1 from the bottom of the housing 1.

[0030] Additionally, it should be noted that at least one side of the housing 1 is provided with an automatic door to enable the opening and closing of the housing 1, thereby enabling the loading and unloading of substrates.

[0031] Reference Figure 3 and Figure 4 The two working plates 3 include a hot plate 31 and a cold plate 32, both of which are located inside the housing 1. The hot plate 31 is located below the cold plate 32, and the hot plate 31 and the cold plate 32 are directly opposite each other.

[0032] Hot plate 31 is used to support the substrate and heats the substrate to accelerate the evaporation of solvent on the substrate. The temperature of hot plate 31 is higher than that of cold plate 32. By utilizing the temperature difference between cold plate 32 and hot plate 31, the solvent on the substrate surface is subjected to thermal driving conditions and cold traction conditions to accelerate the solvent evaporation rate. The evaporated solvent rises, avoiding the solvent from falling back to the substrate surface and affecting the film formation quality.

[0033] Reference Figure 4 and Figure 5 The hot plate 31 has a heating structure for adjusting the temperature at various points on the hot plate 31. The cold plate 32 has a cooling structure for adjusting the temperature at various points on the cold plate 32. The heating and cooling structures maintain the temperature difference between the hot plate 31 and the cold plate 32 at any corresponding vertical position within a preset standard temperature difference range. In this embodiment, the deviation range of the temperature difference between the hot plate 1 and the cold plate 2 at corresponding points in the vertical direction does not exceed 1°C, and preferably does not exceed 0.5°C, to ensure a high degree of consistency in temperature difference.

[0034] This configuration, by incorporating a heating structure within the hot plate 31 and a cooling structure within the cold plate 32, allows for independent temperature control at various points on both plates, ensuring a consistent temperature difference between them at any corresponding vertical position. This guarantees uniform solvent evaporation driving force across the substrate surface, thereby ensuring consistent film formation.

[0035] Reference Figure 4 and Figure 5 Specifically, the heating structure includes heating channels 31a, which are distributed throughout the hot plate 31. Heating liquid is supplied to the heating channels 31a to heat the surface of the hot plate 31. The cooling structure includes cooling channels 32a, which are distributed throughout the cold plate 32. Cooling liquid is supplied to the cooling channels 32a to cool the surface of the cold plate 32.

[0036] Specifically, the heating channel 31a is formed inside the hot plate 31, and the cooling channel 32a is formed inside the cold plate 32. In this embodiment, the temperature of the heating liquid includes a temperature between 30°C and 70°C. In this embodiment, the temperature of the cooling liquid includes a temperature between 0°C and 20°C.

[0037] This configuration allows for temperature control of the hot plate 31 and cold plate 32 through heating and cooling liquids, making it easier to adjust the temperatures of the hot plate 31 and cold plate 32 themselves. This facilitates adjusting the temperature difference between the hot plate 31 and cold plate 32 to adapt to different film-forming processes.

[0038] Reference Figure 4 and Figure 5 Furthermore, the heating channel 31a and the cooling channel 32a have the same shape and are vertically aligned. The flow direction of the heating liquid in the heating channel 31a is opposite to the flow direction of the cooling liquid in the cooling channel 32a. That is, the heating channel 31a and the cooling channel 32a are arranged symmetrically in a horizontal plane. Figure 6 and Figure 7 The direction of liquid flow in the heating channel 31a and the cooling channel 32a has been marked.

[0039] This configuration ensures that the temperature difference between the heating channel 31a and the cooling channel 32a is consistent at corresponding points in the vertical direction, and that the temperature difference between the hot plate 31 and the cold plate 32 is consistent at corresponding points in the vertical direction.

[0040] It is important to note that during the flow of the heating liquid, because its temperature is higher than the ambient temperature, it loses heat as it flows, thus lowering its temperature. Conversely, the cooling liquid, whose temperature is lower than the ambient temperature, heats up as it flows. By reversing the flow directions of the heating and cooling liquids, the positions of the hotter heating liquid in heating channel 31a and the hotter coolant in cooling channel 32a are vertically aligned, and the positions of the colder heating liquid in heating channel 31a and the colder coolant in cooling channel 32a are vertically aligned. Therefore, at any vertically corresponding position, the temperature difference between the liquids in heating channel 31a and cooling channel 32a remains constant.

[0041] This configuration, with heating channels 31a and cooling channels 32a distributed throughout the hot plate 31 and cold plate 32 respectively, and the heating channels 31a and cooling channels 32a having the same shape and facing each other vertically, while the flow directions of the heating liquid and cooling liquid are opposite, forms a "counter-convection" heat exchange mode. When the heating liquid flows along the heating channel 31a, its temperature gradually decreases due to heat loss; when the cooling liquid flows in the opposite direction along the cooling channel 32a, its temperature gradually increases due to heat absorption. Because the two channels have the same shape, are vertically facing each other, and flow in opposite directions, the temperature difference between the liquid in the heating channel 31a and the liquid in the cooling channel 32a remains constant at any corresponding vertical position. The counter-convection design ensures that the temperature difference at corresponding points on the hot plate 31 and cold plate 32 is highly consistent in the vertical direction, eliminating the temperature gradient problem caused by the increase in plate size.

[0042] Because the temperature difference between the hot plate 31 and the cold plate 32 remains consistent at any corresponding position, the thermal driving conditions (heating intensity of the lower surface) and cold traction conditions (cooling intensity of the upper surface) experienced by each area of ​​the substrate surface are at the same level, resulting in uniform evaporation driving force of the solvent from all parts of the substrate surface. This ensures that the solvent evaporation rate is synchronized and balanced across the entire substrate area, avoiding defects such as film cracking caused by localized over-drying and film flow or pinholes caused by localized under-drying. This significantly improves the film thickness uniformity, surface smoothness, and microstructure consistency, meeting the extremely high manufacturing requirements for film quality in semiconductor wafers, high-generation OLED panels, and large-area perovskite solar cells.

[0043] Reference Figures 5-7 The heating channel 31a includes multiple heating sub-channels 31a1, each with its own inlet and outlet. The cooling channel 32a includes multiple cooling sub-channels 32a1, each with its own inlet and outlet.

[0044] Reference Figures 5-7 Specifically, each heating sub-channel 31a1 is paired with a cooling sub-channel 32a1 in the vertical direction, and the liquid flow direction in each pair of heating sub-channels 31a1 and cooling sub-channels 32a1 is opposite.

[0045] This configuration, by arranging multiple heating sub-channels 31a1, shortens the flow distance of the heating liquid within the hot plate 31, resulting in smaller temperature changes during the flow process. This makes it easier to ensure temperature uniformity throughout the hot plate 31.

[0046] By arranging multiple cooling sub-channels 32a1, the flow distance of the cooling liquid within the cold plate 32 is shortened, resulting in smaller temperature changes during the flow of the cooling liquid. This makes it easier to ensure temperature uniformity throughout the cold plate 32.

[0047] The hot plate 31 is divided into multiple heating zones from its edge to its center, and each heating zone is provided with multiple heating sub-channels 31a1.

[0048] Specifically, the heating zones are arranged in concentric circles from the center to the edge of the hot plate 31, and each heating zone has multiple heating sub-channels 31a1 laid inside.

[0049] This configuration, by dividing the hot plate 31 into multiple heating zones from the center to the edge, allows for independent control of the multiple heating zones of the hot plate 31. This makes it easier to ensure temperature consistency throughout the hot plate 31.

[0050] It is understandable that, due to the large size of the hot plate 31, the heat loss in the middle and the edge of the hot plate 31 is different. By controlling the temperature of different heating areas, the temperature consistency of the hot plate 31 can be ensured.

[0051] The cold plate 32 is divided into multiple cooling zones from its edge to its center, and each cooling zone is provided with multiple cooling sub-channels 32a1.

[0052] Specifically, the cooling zones are arranged in concentric circles from the center to the edge of the cold plate 32, and each cooling zone has multiple cooling sub-channels 32a1 laid inside.

[0053] This configuration, by dividing the cold plate 32 into multiple cooling zones from the center to the edge, allows for independent control of these multiple cooling zones. This makes it easier to ensure temperature consistency throughout the cold plate 32.

[0054] It is understandable that, due to the large size of the cold plate 32, the heat loss in the middle and the edge of the cold plate 32 is different. By controlling the temperature of different cooling areas, the temperature consistency of the cold plate 32 can be ensured.

[0055] By controlling the temperature zones of the hot plate 31 and the cold plate 32, the temperature uniformity of each part of the hot plate 31 and the cold plate 32 is ensured, thereby improving the uniformity of solvent evaporation rate on the substrate surface and ensuring film formation uniformity.

[0056] Furthermore, each heating sub-channel 31a1 includes multiple channels, and the multiple channels of each heating sub-channel 31a1 are arranged adjacent to each other. For ease of understanding, the heating sub-channel 31a1 forms different channels by bending 180 degrees each time, and the two channels formed by each 180-degree bend are adjacent.

[0057] Reference Figures 5-7Correspondingly, each cooling sub-channel 32a1 includes multiple channels, and the multiple channels of each cooling sub-channel 32a1 are arranged adjacent to each other. For ease of understanding, the cooling sub-channel 32a1 forms different channels by bending 180 degrees each time, and the two channels formed by each 180-degree bend are adjacent.

[0058] The liquid flows in opposite directions in adjacent channels of each heating subchannel 31a1, and the liquid flows in opposite directions in adjacent channels of each cooling subchannel 32a1.

[0059] This configuration ensures that the portion of the heating sub-channel 31a1 near the inlet is adjacent to the portion near the outlet, and the portion of the heating sub-channel 31a1 furthest from the inlet is adjacent to the portion furthest from the outlet. Therefore, the heating liquid entering the heating sub-channel 31a1 provides temperature compensation to the heating liquid flowing out of the heating sub-channel 31a1, resulting in better temperature uniformity of the heating liquid throughout the heating sub-channel 31a1, and thus improving the temperature uniformity throughout the hot plate 31.

[0060] Correspondingly, the portion of the cooling sub-channel 32a1 near the inlet is adjacent to the portion near the outlet, and the portion of the cooling sub-channel 32a1 away from the inlet is adjacent to the portion away from the outlet. Therefore, the cooling liquid entering the cooling sub-channel 32a1 provides temperature compensation to the cooling liquid flowing out of the cooling sub-channel 32a1, resulting in better temperature uniformity of the cooling liquid throughout the cooling sub-channel 32a1, thus improving the temperature uniformity throughout the cold plate 32.

[0061] Reference Figures 5-7 Furthermore, the liquid flows in opposite directions in the two adjacent heating sub-channels 31a1 that are close to each other.

[0062] With this configuration, the flow direction of the heating liquid in adjacent channels of all heating sub-channels 31a1 is opposite. This ensures that the temperature of the heating liquid in adjacent channels is complementary, resulting in better temperature consistency across channels and guaranteeing the temperature consistency of the hot plate 31.

[0063] The liquid flows in opposite directions in the two adjacent cooling sub-channels 32a1 that are close to each other.

[0064] With this configuration, the coolant flows in opposite directions in all adjacent channels of the entire cooling sub-channel 32a1. This ensures that the temperature of the coolant in adjacent channels is complementary, resulting in better temperature consistency across all channels and guaranteeing the temperature uniformity of the cold plate 32.

[0065] The inlet and outlet of the heating sub-channel 31a1 are connected to the same corner of the top surface of the box 1 through pipes, and the inlet and outlet of multiple heating sub-channels 31a1 are respectively connected to multiple corners of the top surface of the box 1 through pipes.

[0066] The inlet and outlet of the cooling sub-channel 32a1 are connected to the same corner of the bottom surface of the box 1 through pipes, and the inlet and outlet of multiple cooling sub-channels 32a1 are respectively connected to multiple corners of the bottom surface of the box 1 through pipes.

[0067] This configuration allows the inlet and outlet of the heating sub-channel 31a1 and the cooling sub-channel 32a1 to be led to the corner of the housing 1 via pipes, making it convenient to lead the pipes out of the housing 1 to supply liquid to each channel.

[0068] Reference Figure 1 and Figure 2 Corrugated pipes 6 are arranged at the corners of the top and bottom surfaces of the housing 1. The corrugated pipes 6 are connected to the interior of the housing 1. The pipes connected to the inlet and outlet of the cooling sub-channel 32a1 and the heating sub-channel 31a1 are extended to the outside of the housing 1 through the corrugated pipes 6.

[0069] This configuration, with the corrugated pipe 6 leading the pipe out of the housing 1, prevents air leakage at the point where the pipe exits from the housing 1, thus ensuring the sealing of the housing 1.

[0070] Reference Figure 1 and Figure 2 Furthermore, maintenance doors 7 are provided on both opposite sides of the housing 1, and the maintenance doors 7 are arranged close to the corrugated pipe 6.

[0071] With this configuration, since the corrugated pipes 6 on the top and bottom surfaces of the housing 1 are located at the corners of the housing 1, a single maintenance door 7 allows for easy access and maintenance of the corrugated pipes 6 located at the same corner of the housing 1, on both the top and bottom surfaces. It also facilitates the routing of pipes connected to the heating sub-channel 31a1 and the cooling sub-channel 32a1 from the corrugated pipes 6. The single maintenance door 7 for accessing the heating sub-channel 31a1 and the cooling sub-channel 32a1 reduces the number of openings on the housing 1, making it easier to ensure the sealing performance of the housing 1.

[0072] Reference Figure 1 and Figure 3 The two sets of leveling components 4 act on the mounting surfaces of the hot plate 31 and the cold plate 32 that are opposite to each other. The two sets of leveling components 4 adjust the flatness of the working surfaces of the hot plate 31 and the cold plate 32 that are facing each other, so that the working surfaces of the hot plate 31 and the cold plate 32 are parallel at all points.

[0073] Reference Figure 3 and Figure 8Specifically, both the hot plate 31 and the cold plate 32 include an active surface and a mounting surface. The mounting surface is the one facing away from the hot plate 31 and the cold plate 32, and it is used to mount the leveling component 4. The active surface is the one facing the hot plate 31 and the cold plate 32, and the active surfaces of the hot plate 31 and the cold plate 32 face the substrate to accelerate the evaporation of the substrate solvent.

[0074] Reference Figure 8 and Figure 9 The leveling component 4 includes a mounting bracket 42 and multiple adjustment components 41.

[0075] Mounting bracket 42 is located on one side of the mounting surface of the action plate 3. The action plate 3 is connected to the mounting bracket 42 by multiple adjustment components 41, which are evenly distributed on the mounting surface of the action plate 3.

[0076] With this configuration, multiple adjustment components 41 are used to adjust the distance between the position of the action plate 3 and the mounting bracket 42 at various points, so as to make the action surface of the action plate 3 flat.

[0077] By installing leveling components 4 on the opposing mounting surfaces of the hot plate 31 and the cold plate 32, independent and active flatness correction is performed on the facing surfaces of the hot plate 31 and the cold plate 32. This allows the facing surfaces of the hot plate 31 and the cold plate 32 to overcome the inherent bending deformation and warping tendency of large-area materials, restoring and maintaining an ideal planar state. Furthermore, this active leveling mechanism can dynamically or periodically compensate for deformation under actual working conditions, ensuring that the facing surfaces of the hot plate 31 and the cold plate 32 remain precisely parallel throughout. This ensures uniform spacing between the hot plate 31 and the cold plate 32 across the entire surface area, guaranteeing consistent solvent evaporation rates across the substrate surface and ensuring film uniformity.

[0078] Reference Figure 8 and Figure 9 Specifically, the action plate 3 is connected to the mounting bracket 42 via multiple adjustment components 41. Each adjustment component 41 adjusts the distance between the corresponding position of the action plate 3 and the mounting bracket 42, thereby making the action surface of the action plate 3 flat. That is, this leveling system is used for leveling the hot plate 31 and the cold plate 32.

[0079] This configuration, using multiple adjustment components 41 to fix the action plate 3 to the mounting bracket 42, allows for precise local and point-by-point correction of the action plate 3's surface based on actual deformation. The active leveling mechanism of the adjustment components 41 compensates for flatness deviations caused by factors such as self-weight deflection, uneven thermal expansion, and vacuum negative pressure deformation. Even in applications with large-size substrates, the flatness of the action plate 32 or hot plate 31's surface can be controlled within an extremely high precision range, completely solving the core defect of difficulty in guaranteeing the flatness of large-area cold plates 32 and hot plates 31.

[0080] After adjusting component 41 to level the working surfaces of the hot plate 31 and the cold plate 32 to an ideal plane, the substrate can be flatly attached to the surface of the hot plate 31, ensuring uniform thermal contact between all areas of the substrate and the hot plate 31, eliminating heat transfer temperature differences caused by local gaps or warping. Simultaneously, the leveled cold plate 32 has a uniform spacing with the hot plate 31 at all points, resulting in a uniform airflow and temperature field distribution in the space above the substrate surface. Solvent vapor can migrate upwards from all locations on the substrate at a consistent rate and be removed. This uniform heat transfer on the lower surface and uniform evaporation on the upper surface ensures a highly consistent solvent evaporation rate at different locations on the substrate, effectively avoiding film thickness unevenness, color difference, orange peel, and other film formation defects. This significantly improves the uniformity of the thin film and the final film quality, meeting the extremely high manufacturing requirements for film layer consistency in semiconductor wafers, high-generation OLED panels, and large-area perovskite solar cells.

[0081] Reference Figure 8 and Figure 9 Specifically, the adjustment assembly 41 includes an adjustment screw 411, which includes a first threaded section 4111 and a second threaded section 4112. The adjustment screw 411 passes through the mounting bracket 42, and the first threaded section 4111 of the adjustment screw 411 is threadedly engaged with the actuating plate 3. The second threaded section 4112 of the adjustment screw 411 is threadedly engaged with the mounting bracket 42.

[0082] Reference Figure 8 and Figure 9 Specifically, the first threaded section 4111 and the second threaded section 4112 have the same thread direction, and the pitch of the first threaded section 4111 is smaller than that of the second threaded section 4112. By rotating the adjusting screw 411, the distance between the working plate 3 and the mounting bracket 42 at the adjusting assembly 41 is changed, thereby adjusting the height of the working surface of the working plate 3 at that location. By adjusting all the adjusting assemblies 41, the working surface of the working plate 3 is made flat. Thus, the flatness adjustment of the hot plate 31 and the cold plate 32 can be achieved using the adjusting assembly 41.

[0083] This configuration allows for adjustment of the distance between the action plate 3 and the mounting bracket 42 by rotating the adjusting screw 411. Since the adjustment of the partial position of the action plate 3 is achieved through the pitch difference between the first threaded section 4111 and the second threaded section 4112, the adjustment precision is high, and it is easy to level out minor deformations of the action plate 3, thus ensuring the flatness of the action surface of the action plate 3. Therefore, it is easy to ensure the parallelism of the hot plate 31 and the cold plate 32 at all points.

[0084] Since the adjustment component 41 acts on the mounting surface of the hot plate 31 or the cold plate 32, it will not have any additional impact on the working surface of the hot plate 31 or the cold plate 32, so as to ensure the normal function of the hot plate 31 and the cold plate 32.

[0085] Reference Figure 8 and Figure 9 Furthermore, the adjustment component 41 also includes a first mating block 412 and a second mating block 413.

[0086] The first mating block 412 is fixed to the mounting surface of the action plate 3, and the second mating block 413 is fixed to the side of the mounting bracket 42 away from the action plate 3.

[0087] The adjusting screw 411 is adapted to pass through the second mating block 413 and the mounting bracket 42 in sequence, and the first threaded section 4111 of the adjusting screw 411 is threadedly engaged with the first mating block 412, and the second threaded section 4112 of the adjusting screw 411 is threadedly engaged with the second mating block 413.

[0088] This configuration, using the first mating block 412 and the second mating block 413 to replace the action plate 3 and the mounting bracket 42 in connection with the adjusting screw 411, does not affect the structure of the action plate 3 and the mounting bracket 42, simplifies the design of the action plate 3 and the mounting bracket 42, and allows for more flexible placement of the adjusting component 41 on the action plate 3.

[0089] In this embodiment, the first mating block 412 is fixed to the mounting surface of the action plate 3 by bolts, and the second mating block 413 is fixed to the side of the mounting bracket 42 away from the action plate 3 by bolts.

[0090] Furthermore, the adjusting assembly 41 also includes a locking nut 414, which is threadedly engaged with the second threaded section 4112 of the adjusting screw 411. The locking nut 414 abuts against the side of the mounting bracket 42 opposite to the actuating plate 3.

[0091] With this configuration, after the flatness of the action plate 3 is adjusted by rotating the adjusting screw 411, the rotation of the adjusting screw 411 is restricted by external force by tightening the locking nut 414. By locking the adjusting screw 411, the state of the action plate 3 after adjustment is maintained, ensuring the flatness of the action surface of the action plate 3, that is, ensuring the flatness of the hot plate 31 and the cold plate 32.

[0092] Reference Figure 4 The vacuum drying system for the large substrate also includes a stress structure 3a, which is provided on the mounting surface of the action plate 3, that is, the mounting surface of the hot plate 31 and the mounting surface of the cold plate 32 are both provided with stress structures 3a.

[0093] By arranging the stress structure 3a, after adjusting the flatness of the hot plate 31 and the cold plate 32, the stress structure 3a eliminates the internal stress of the hot plate 31 and the cold plate 32, preventing the accumulation of stress and deformation inside the hot plate 31 and the cold plate 32, thereby ensuring the flatness of the working surfaces of the hot plate 31 and the cold plate 32.

[0094] In addition, the stress structure 3a eliminates the stress generated when adjusting the temperature changes of the hot plate 31 and the cold plate 32, that is, it reserves space for the deformation of the hot plate 31 and the cold plate 32 themselves, thereby preventing the cold plate 32 and the hot plate 31 from deforming during environmental changes such as temperature and air pressure.

[0095] Specifically, the stress structure 3a includes multiple stress ring grooves, which are arranged sequentially from the inside out.

[0096] It should be noted that if stress accumulates inside the hot plate 31 or the cold plate 32, especially in an environment with alternating temperature changes, it can easily lead to deformation of the hot plate 31 and the cold plate 32.

[0097] Reference Figure 1 and Figure 2 Optionally, the large-scale vacuum drying device for uniform film formation also includes multiple visual monitoring elements 5, all of which are mounted on the top of the housing 1. Multiple through holes are provided on the cold plate 32, allowing the multiple visual monitoring elements 5 to pass through the cold plate 32 and image the film layer on the substrate surface of the hot plate 31.

[0098] Reference Figure 1 and Figure 2 Specifically, a mounting box is installed on the top of the housing 1, the visual monitoring component 5 is installed in the mounting box, and the imaging end of the visual monitoring component 5 extends into the housing 1 and passes through the mounting bracket 42 and the cold plate 32.

[0099] The film formation status is monitored by the visual monitoring component 5, so as to detect uneven film formation in time and adjust the temperature of the cold plate 32 and the hot plate 31 in time.

[0100] The temperature of the corresponding positions of the hot plate 31 and cold plate 32 is adjusted by real-time film formation monitoring to ensure film formation consistency.

[0101] Preferably, multiple visual monitoring elements 5 are used to image the substrate surface film layer located in different heating areas of the hot plate 31.

[0102] Due to the large size of the substrate, the film formation in the middle and edge of the substrate is more likely to be inconsistent. By arranging multiple visual monitoring devices 5 from the middle to the edge of the substrate, the film formation state at different positions of the substrate can be recorded in real time, and the liquid temperature in different heating sub-channels 31a1 and cooling sub-channels 32a1 can be adjusted in time to ensure that the film formation is consistent throughout the substrate.

[0103] When the difference in film formation state is greater at different parts of the substrate, the flatness of the hot plate 31 and the cold plate 32 needs to be checked and adjusted.

[0104] In this embodiment, the visual monitoring device 5 includes a camera.

[0105] Reference Figure 1 The vacuum drying system for the large-size substrate also includes a lifting assembly 8 and a ejector pin assembly 9. The lifting assembly 8 is used to drive the mounting bracket 42 and the hot plate 31 to move up and down.

[0106] Reference Figure 1 and Figure 11 The ejector pin assembly 9 includes an ejector pin holder 91 and a plurality of ejector pins 92. The ejector pin holder 91 is located below the hot plate 31. The plurality of ejector pins 92 are all mounted on the ejector pin holder 91 and pass through the hot plate 31.

[0107] Reference Figure 1 , Figure 2 and Figure 10 In this embodiment, the hot plate 31 is connected to the lifting assembly 8 via the mounting bracket 42. That is, the lifting assembly 8 drives the mounting bracket 42 connected to the hot plate 31 to rise and fall, thereby driving the hot plate 31 to rise and fall. The cold plate 32 is connected to the housing 1 via the mounting bracket 42.

[0108] In this configuration, the lifting assembly 8 lowers the hot plate 31 relative to the ejector pins 92, and the ejector pins 92 extend above the hot plate 31 to support the substrate for loading and unloading. Conversely, the lifting assembly 8 raises the hot plate 31 relative to the ejector pins 92, and the ejector pins 92 descend below the working surface of the hot plate 31, with the substrates on the ejector pins 92 supported by the hot plate 31.

[0109] Reference Figure 12 Specifically, when picking up and placing the substrate, the ejector pin 92 extends above the hot plate 31 and is used to support the substrate, so that there is a gap between the substrate and the hot plate 31 to allow space for the robot arm to pick up and place the substrate.

[0110] Reference Figure 13 When drying the substrate, the ejector pin 92 retracts below the top surface of the hot plate 31, at which time the hot plate 31 supports the substrate to heat it.

[0111] Reference Figures 11-13Furthermore, the ejector pin assembly 9 also includes multiple limiting rods 93, all of which are fixed to the ejector pin holder 91. The limiting rods 93 are located on the periphery of the hot plate 31, and the top surface of the limiting rods 93 is higher than the top surface of the ejector pins 92. When the hot plate 31 is in its highest position, the top of the limiting rods 93 still extends above the hot plate 31. The limiting rods 93 are used by the side of the substrate to abut against, thereby limiting the position of the substrate.

[0112] Specifically, during substrate loading, the robot delivers the substrate to a position supported by ejector pin 92, at which point the substrate abuts against the limiting rod 93, thus performing initial positioning of the substrate. As the hot plate 31 rises to receive the substrate, the limiting rod 93 continues to limit the substrate's position while the substrate is supported by the hot plate 31.

[0113] This setup serves several purposes. First, the limiting rod 93 initially positions the substrate, ensuring that the ejector pin 92 supports the non-display area on the substrate and prevents defects. Second, the limiting rod 93 positions the substrate on the hot plate 31, ensuring consistent substrate placement with each loading, resulting in better processing consistency within the same batch and preventing partially suspended substrates, thus guaranteeing film quality. Third, because the limiting rod 93 limits the substrate throughout its movement from near the hot plate 31 until it is supported by it, airflow between the substrate and the hot plate 31 prevents substrate misalignment when approaching, ensuring accurate substrate loading.

[0114] The lifting assembly 8 includes multiple pushers 81 and multiple lifting drive components 82.

[0115] Reference Figure 1 , Figure 2 and Figure 10 Multiple push-up brackets 81 are fixed to the side of the mounting frame 42 away from the hot plate 31, and the push-up brackets 81 abut against the mounting frame 42 at multiple points. Multiple lifting drive components 82 drive the multiple push-up brackets 81 to move up and down, and the drive end of the lifting drive component 82 is arranged near the middle of the bottom surface of the push-up bracket 81.

[0116] Multiple lifting drive components 82 simultaneously push multiple pusher frames 81 to achieve the lifting and lowering of the hot plate 31. When the drive end of the lifting drive component 82 descends, the hot plate 31 descends under the action of gravity, thereby achieving the lifting and lowering of the hot plate 31.

[0117] Due to the arrangement of the pusher 81, the thrust applied by the lifting drive 82 to the mounting frame 42 is not concentrated, and the thrust is evenly distributed on the mounting frame 42. This avoids local stress on the bottom of the mounting frame 42, which could lead to the mounting frame 42 and the hot plate 31 being tilted, and ensures that the hot plate 31 and the cold plate 32 are arranged in parallel.

[0118] Reference Figure 10Furthermore, the bottom surface of the pusher frame 81 is provided with a spherical groove 81a, and the driving end of the lifting drive component 82 is arranged in a spherical head shape, with the driving end of the lifting drive component 82 inserted into the spherical groove 81a.

[0119] The spherical drive end of the lifting drive component 82 acts on the groove wall of the spherical groove 81a of the pusher frame 81.

[0120] This design serves two purposes. First, even if the multiple lifting drive components 82 exhibit slight misalignment, the spherical surface of the spherical groove 81a ensures that the multiple pusher frames 81 rise and fall synchronously, preventing misalignment of the mounting frame 42 and the hot plate 31. This ensures that the cold plate 32 and the hot plate 31 remain parallel and maintain consistent spacing. Second, the spherical drive end of the lifting drive component 82, positioned within the spherical groove 81a of the pusher frame 81, restricts the horizontal movement of the pusher frame 81, preventing lateral displacement of the hot plate 31 during debugging, transportation, or other processes, thus avoiding impacts to the internal structure of the housing 1.

[0121] In this embodiment, the lifting drive component 82 includes a cylinder, a lead screw mechanism, an electric cylinder, etc.

[0122] This application provides a vacuum drying system for large-size substrates. By setting leveling components 4 on the opposing mounting surfaces of the hot plate 31 and cold plate 32, the system independently and actively corrects the flatness of the facing surfaces of the hot plate 31 and cold plate 32. This allows the facing surfaces of the hot plate 31 and cold plate 32 to overcome the inherent bending and warping tendencies of large-area substrates, restoring and maintaining an ideal planar state. Furthermore, this active leveling mechanism can dynamically or periodically compensate for deformation under actual working conditions, ensuring that the facing surfaces of the hot plate 31 and cold plate 32 remain precisely parallel throughout. This results in uniform spacing between the hot plate 31 and cold plate 32 across the entire surface area, ensuring consistent solvent evaporation rates across the substrate surface and guaranteeing film uniformity.

[0123] Furthermore, by setting a heating structure in the hot plate 31 and a cooling structure in the cold plate 32, the temperature of each part of the hot plate 31 and the cold plate 32 can be independently controlled, and the temperature difference between the hot plate 31 and the cold plate 32 at any corresponding vertical position is kept consistent. This ensures that the driving force for solvent evaporation is consistent throughout the substrate surface, thereby ensuring film formation consistency.

[0124] Therefore, by controlling the flatness of the hot plate 31 and the cold plate 32, the spacing between any corresponding vertical positions of the hot plate 31 and the cold plate 32 is kept consistent, and the temperature difference between any corresponding vertical positions of the hot plate 31 and the cold plate 32 is kept consistent. This ensures that the solvent environment is consistent throughout the substrate, the evaporation driving force on the solvent is consistent, and the film uniformity on the substrate surface is improved.

[0125] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0126] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0127] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A vacuum drying system for large-size substrates, characterized in that, It includes: A housing, the housing being sealed and used to house a substrate; A vacuum device is used to evacuate the housing. Two working plates, each comprising a hot plate and a cold plate, are located within the housing. The hot plate supports the substrate and contains a heating structure for adjusting the temperature at various points on the hot plate. The cold plate is located within the housing, directly above the hot plate, and contains a cooling structure for adjusting the temperature at various points on the cold plate. Two sets of leveling components are provided. The two sets of leveling components act on the mounting surfaces of the hot plate and the cold plate that are opposite to each other. The two sets of leveling components adjust the flatness of the working surfaces of the hot plate and the cold plate so that the working surfaces of the hot plate and the cold plate are parallel at all points. The heating structure and the cooling structure ensure that the temperature difference between the hot plate and the cold plate at any corresponding vertical position is within a preset standard temperature difference range.

2. The vacuum drying system for large-size substrates according to claim 1, characterized in that, The heating structure includes heating channels that are distributed throughout the hot plate. Heating liquid is supplied to the heating channels to heat the surface of the hot plate. The cooling structure includes cooling channels that are distributed throughout the cold plate. Cooling liquid is supplied to the cooling channels to cool the surface of the cold plate. The heating channel and the cooling channel have the same shape and are vertically aligned. The flow direction of the heating liquid in the heating channel is opposite to that of the cooling liquid in the cooling channel, so that the temperature difference at each corresponding point in the heating channel and the cooling channel is consistent in the vertical direction, and the temperature difference between the hot plate and the cold plate at any corresponding point in the vertical direction is within a preset standard temperature difference range.

3. The vacuum drying system for large-size substrates according to claim 2, characterized in that, The heating channel includes multiple heating sub-channels, each with an independent liquid inlet and outlet; the cooling channel includes multiple cooling sub-channels, each with an independent liquid inlet and outlet. Each of the heating sub-channels corresponds to a cooling sub-channel in the vertical direction, forming a group, and the liquid flow direction in each group of heating sub-channels and cooling sub-channels is opposite.

4. The vacuum drying system for large-size substrates according to claim 3, characterized in that, Each of the heating sub-channels and each of the cooling sub-channels includes multiple channels, with the multiple channels of each heating sub-channel arranged adjacent to each other at intervals, and the multiple channels of each cooling sub-channel arranged adjacent to each other at intervals; the liquid flow direction in adjacent channels is opposite.

5. The vacuum drying system for large-size substrates according to claim 4, characterized in that, The liquid flows in opposite directions in two adjacent heating sub-channels that are close to each other; the liquid flows in opposite directions in two adjacent cooling sub-channels that are close to each other.

6. The vacuum drying system for large-size substrates according to claim 1, characterized in that, The leveling component includes: Mounting bracket, the mounting bracket being located on one side of the mounting surface of the functional plate; Multiple adjustment components are provided, and the action plate is connected to the mounting frame through the multiple adjustment components respectively. The multiple adjustment components are evenly distributed on the mounting surface of the action plate. The plurality of adjustment components are used to adjust the distance between the position of the action plate and the mounting bracket at various points, so as to make the action surface of the action plate flat.

7. The vacuum drying system for large-size substrates according to claim 6, characterized in that, The adjustment assembly includes an adjustment screw, which includes a first threaded section and a second threaded section. The adjustment screw passes through the mounting bracket, and the first threaded section of the adjustment screw is threadedly engaged with the actuating plate, while the second threaded section of the adjustment screw is threadedly engaged with the mounting bracket. Wherein, the pitch of the first threaded segment is less than the pitch of the second threaded segment, and the distance between the action plate and the mounting bracket at the adjustment component is changed by rotating the adjustment screw; and the action surface of the action plate is made flat by adjusting all the adjustment components.

8. The vacuum drying system for large-size substrates according to claim 7, characterized in that, The adjustment component also includes: A first mating block is fixed to the mounting surface of the functional plate; The second mating block is fixed to the side of the mounting bracket away from the function plate; The adjusting screw is adapted to pass through the second mating block and the mounting bracket in sequence, and the first threaded section of the adjusting screw is threadedly engaged with the first mating block, and the second threaded section of the adjusting screw is threadedly engaged with the second mating block.

9. The vacuum drying system for large-size substrates according to any one of claims 1-8, characterized in that, It also includes a stress structure, which is disposed on the mounting surface of the action plate. The stress structure includes multiple stress ring grooves, which are arranged sequentially from the inside to the outside.

10. The vacuum drying system for large-size substrates according to claim 1, characterized in that, It also includes a lifting assembly and a ejector pin assembly, wherein the lifting assembly is used to drive the hot plate to move up and down; the ejector pin assembly includes: Ejector pin holder, the ejector pin holder being located below the hot plate; Multiple ejector pins are mounted on the ejector pin holder and pass through the hot plate; In this configuration, the lifting assembly drives the hot plate to descend, and the hot plate descends relative to the ejector pins. Multiple ejector pins extend above the hot plate and are used to support the substrate for loading and unloading. The hot plate rises relative to the ejector pins, and the ejector pins descend to a position below the working surface of the hot plate. The substrates on the multiple ejector pins are supported by the hot plate.

11. The vacuum drying system for large-size substrates according to claim 10, characterized in that, The ejector pin assembly also includes multiple limiting rods, all of which are mounted on the ejector pin frame. The limiting rods are located on the periphery of the hot plate, and the top surface of the limiting rod is higher than the top surface of the ejector pin. When the hot plate is in its highest position, the top of the limiting rod still extends above the hot plate. The limiting rod is used by the side of the substrate to abut against, thereby limiting the position of the substrate.

Images