An on-line thickness detection apparatus for wave spring detection

Abstract

The application discloses an online thickness detection equipment for waveform spring detection and belongs to the field of waveform spring quality detection.The equipment comprises a support, the end of the support is provided with a thickness detection assembly, and the thickness detection assembly further comprises a flattening detection and control module.The flattening detection and control module is configured to perform waveform spring thickness detection, so as to solve the problems that different positions of multi-turn or multi-layer waveform springs cannot reach a stable contact state synchronously in a compression process, it is difficult to accurately judge the actual flattening degree through single measurement, and the existing detection mode cannot simultaneously consider the thickness detection of multiple positions in the circumferential direction and the identification of local thickness abnormalities, and the accuracy, stability and reliability of the detection result of the online thickness detection of the waveform spring are improved.

Description

Technical Field

[0001] This invention relates to the field of wave spring quality inspection, and more specifically, to an online thickness inspection device for wave spring inspection. Background Technology

[0002] Wave springs are elastic elements made from metal strips through a wave-forming process. They are characterized by small axial dimensions, stable load characteristics, and the ability to provide large elastic force within a small installation space. They are widely used in mechanical seals, bearing preload, valves, and precision machinery. For multi-turn or multi-layer wave springs, the material thickness and its consistency across all circumferential positions affect the spring's compression height, load characteristics, and subsequent assembly accuracy. Therefore, thickness testing is typically required during the wave spring manufacturing process.

[0003] Existing thickness measurement methods typically include manual measurement with measuring tools, contact displacement measurement, and height measurement after compressing the spring to a certain state. Manual measurement with measuring tools is simple to operate, but the measurement positions are limited, and the measurement results are easily affected by the operator, the measurement position, and the natural waveform state of the spring, which is not conducive to automated inspection in continuous production processes. Using displacement sensors or indenters can improve the degree of automation, but for multi-turn or multi-layer wave springs, because their natural state has undulating peaks and troughs along the circumference, the initial height and compressive deformation state at different positions are different, making it difficult to directly and accurately characterize the single-layer thickness of the material itself using the local height in the natural state.

[0004] To reduce the impact of the waveform structure on thickness measurement, some detection methods first apply axial pressure to the waveform spring, causing the layers to gradually approach each other, and then obtain the thickness information based on the overall dimensions after compression. However, the waveform spring undergoes continuous elastic deformation during compression, and the time it takes for different circumferential positions to reach a stable contact state varies. Furthermore, the detection results are easily affected by factors such as clamping position, loading state, and measurement reference. When the compression state is not properly controlled, some positions may not be fully aligned, or some positions may be subjected to excessive force, resulting in a deviation between the obtained compression height and the actual material thickness.

[0005] In addition, existing testing equipment usually focuses more on obtaining the overall compression height of the wave spring or the dimensions of a few testing positions. It is difficult to continuously and stably detect the thickness differences at different circumferential positions of multi-turn or multi-layer wave springs, which is not conducive to further judging local thickness anomalies.

[0006] Therefore, how to establish a stable and repeatable measurement state during the online detection of wave springs and improve the accuracy of thickness detection results at different circumferential positions remains a problem that needs further improvement for wave spring thickness detection equipment. Summary of the Invention

[0007] To address the problems existing in the prior art, this invention aims to solve the problem that in the current wave spring thickness detection process, due to the differences in the initial height and compression deformation state of the wave spring at different circumferential positions, it is difficult to form a stable and consistent flattening detection state, resulting in the local thickness measurement results being easily affected by the loading state, clamping posture, and force changes at adjacent positions. The invention provides an online thickness detection device for wave springs, solving the problems of asynchronous stable contact states at different positions during compression of multi-turn or multi-layer wave springs, making it difficult to accurately determine the actual flattening degree in a single measurement, and the difficulty of existing detection methods in simultaneously handling circumferential multi-position thickness detection and local thickness anomaly identification. This improves the accuracy, stability, and reliability of online thickness detection of wave springs.

[0008] To solve the above problems, the present invention adopts the following technical solution.

[0009] An online thickness detection device for wave spring testing includes a frame, a lifting assembly within the frame, a limiting clamp at the lifting end of the lifting assembly, a temporary clamping assembly and a support at the upper end of the frame, and a thickness detection assembly at the end of the support. The thickness detection component includes a first telescopic component, and the telescopic end of the first telescopic component is provided with a plurality of flattening components that are spaced apart along the circumference of the limiting clamp. The limiting clamp is used to hold and fix the wave spring. The thickness detection component also includes a flattening detection and control module, which is configured to perform waveform spring thickness detection. By using multiple circumferentially distributed flattening components in conjunction with a limiting clamp to perform multi-position flattening detection on the waveform spring, the problem of insufficient representativeness of single-point measurement can be improved, thereby enhancing the stability and applicability of online thickness detection.

[0010] As a further technical solution of the present invention, the flattening assembly includes a second telescopic assembly and a housing disposed at the output end of the second telescopic assembly. A pressure rod is slidably disposed inside the housing along the telescopic direction of the second telescopic assembly, and the lower end of the pressure rod extends out of the housing and is provided with a pressure plate. A pressure sensor is provided at the upper end of the housing, and a compression spring is provided between the pressure sensor and the upper end of the pressure rod. The pressure rod, the compression spring and the pressure sensor form an elastic compression detection structure, which can obtain the force change while the pressure plate and the wave spring maintain stable contact, and reduce the impact of rigid contact on the detection process.

[0011] As a further technical solution of the present invention, the flattening detection and control module includes a controller, a first displacement detection unit for obtaining the extension and retraction position of the first telescopic component, and a plurality of second displacement detection units for obtaining the extension and retraction position of the corresponding second telescopic component. The controller is connected to the first telescopic component, each of the second telescopic components, each pressure sensor, the first displacement detection unit, and each of the second displacement detection units, respectively. It is used to acquire the position information of the first telescopic component and each of the second telescopic components, as well as the pressure information of each pressure sensor. Based on the position information and pressure information, it controls the action of the first telescopic component and each of the second telescopic components. By synchronously acquiring the position of the first telescopic component and each of the second telescopic components, as well as the pressure information of each detection position, it can realize the corresponding detection of the flattening position and the stress state, providing a reliable data foundation for multi-position collaborative control and thickness judgment.

[0012] As a further technical solution of the present invention, the waveform spring thickness detection includes the following steps: S1. Control multiple flattening components to contact the wave spring respectively, determine the clamping posture by counter-pressure test, and establish the coupling response relationship between different circumferential detection positions by the movement displacement of each flattening component when it moves in sequence and the pressure change of other flattening components. S2. Control multiple flattening components to load in groups, obtain pressure data and displacement data of the corresponding flattening components at each detection position, correct the pressure data at each detection position according to the coupling response relationship, and combine the corrected pressure data and the corresponding displacement data to form the local flattening response at each detection position, and identify the flattening state change of the waveform spring. S3. Determine the candidate flattening state based on the local flattening response of each detection position and the flattening state of adjacent detection positions, and adjust the loading state of each flattening component according to the coupling response relationship so that each detection position gradually reaches the candidate flattening state. S4. Verify the flattening status of the detection positions that have reached the candidate flattening state to determine whether the corresponding detection positions have reached the effective flattening state. S5. After the effective flattening state is achieved at each detection position, the single-layer thickness of each circumferential position is determined based on the flattening data of each detection position, the clamping posture, and the corresponding effective layer number. The thickness detection result of the wave spring is determined based on the single-layer thickness of each circumferential position. A complete detection closed loop is formed by clamping posture recognition, coupling correction, flattening state judgment, state verification, and thickness calculation. This can reduce the influence of loading and clamping factors on the results and improve the accuracy of circumferential thickness detection.

[0013] As a further technical solution of the present invention, in S4, the flattening state verification includes partially unloading and reloading the detection position that has reached the candidate flattening state, and determining whether the corresponding detection position has reached the effective flattening state based on the consistency of the local flattening response obtained by the first loading and reloading and the local flattening response of the adjacent detection positions. In step S5, the flattening data at each detection position is corrected according to the clamping posture. The single-layer thickness at each circumferential position is determined based on the corrected flattening data and the corresponding effective layer number. The average single-layer thickness of the wave spring and the circumferential thickness anomaly result are determined based on the single-layer thickness at each circumferential position. The candidate flattening state is verified by partial unloading and reloading. By combining the clamping posture with the correction of the flattening data at each position, the reliability of effective flattening judgment and the accuracy of single-layer thickness and circumferential anomaly identification can be improved.

[0014] As a further technical solution of the present invention, in step S1, after determining the clamping posture, each flattening component is restored to the state of contact with the wave spring, and one of the second telescopic components is sequentially controlled to generate a slight displacement, while keeping the other second telescopic components from being actively loaded. The pressure changes of the pressure sensors corresponding to other detection positions are acquired simultaneously. The coupling response coefficient of the current detection position to other detection positions is determined based on the displacement of the current flattening component and the pressure changes of other detection positions. The coupling response relationship between different circumferential detection positions is obtained by sequentially acting each flattening component. By slightly acting a single flattening component and acquiring the pressure changes of other detection positions, the coupling response relationship between circumferential detection positions can be established, providing a basis for distinguishing the influence of local real force from that of other positions.

[0015] As a further technical solution of the present invention, in step S2, during the group loading process of multiple flattening components, the coupling pressure component generated by the actions of other flattening components on the current detection position is determined based on the action displacement and corresponding coupling response coefficient of the other flattening components that have taken action, and the pressure data of the current detection position is corrected according to the following formula: In the formula, For the first Pressure data after coupling effect correction at each detection location; For the first Each detection location corresponds to pressure data acquired by a pressure sensor; The number of flattening components participating in the current loading process; For the first The detection location for the first The coupling response coefficients at each detection location; For the current sampling period, the first The movement displacement of the flattening component; the corrected pressure data and the displacement data of the corresponding flattening component together form the first... By calculating the local flattening response at each detection location using the coupling response coefficient and removing the coupling pressure component generated by the actions of other flattening components, pressure data that is closer to the actual pressure state at the current detection location can be obtained, thus improving the accuracy of local flattening response judgment.

[0016] As a further technical solution of the present invention, in step S2, the waveform deformation state, interlayer contact state, and overall flattening state are identified based on the local flattening response of each detection position. Specifically, when the pressure gradually increases with displacement during the loading process of the flattening component, the corresponding detection position is determined to be in a waveform deformation state. When the pressure increase after correction increases under similar displacement changes and adjacent detection positions produce corresponding response changes, the corresponding detection position is determined to enter an interlayer contact state. When multiple adjacent detection positions enter an interlayer contact state, and the displacement change decreases while the pressure continues to increase with continued micro-loading, the waveform spring is determined to enter an overall flattening state. By combining the pressure change with displacement and the response of adjacent detection positions, the waveform deformation, interlayer contact, and overall flattening states are identified in stages, which can reduce misjudgments of the flattening state caused by a single pressure or displacement condition.

[0017] As a further technical solution of the present invention, in step S3, for the detection position that has reached the candidate flattening state, the active loading of the corresponding second telescopic component is reduced or stopped, and during the process of other flattening components continuing to load, the coupling influence on the detection position that has reached the candidate flattening state is determined according to the coupling response relationship; when the pressure of the detection position increases due to the loading of other flattening components, the corresponding second telescopic component is controlled to retract along the unloading direction; when the pressure of the detection position decreases, the corresponding second telescopic component is controlled to follow along the loading direction, so that the detection position that has reached the candidate flattening state remains stable, while the remaining detection positions continue to be loaded to the candidate flattening state. By implementing stop, retraction or follow-up adjustment for the position that has reached the candidate flattening state, different circumferential positions can be loaded in a coordinated manner according to their respective flattening processes, reducing the detection error caused by local overpressure or insufficient flattening.

[0018] As a further technical solution of the present invention, in step S4, when the detection position first reaches the candidate flattening state, the corresponding displacement data, the corrected pressure data, and the local flattening response of the adjacent detection position are recorded. Then, the corresponding second telescopic component is controlled to retract slightly, so that the pressure detected by the corresponding pressure sensor is reduced and the pressure plate is kept in contact with the wave spring. Then, the corresponding second telescopic component is controlled to reload along the original loading direction. The displacement position, the pressure growth trend with displacement, and the response change of the adjacent detection position are compared when the corresponding detection position reaches the candidate flattening state during the first loading and reloading. When the difference between the two candidate flattening positions is within the preset allowable range, the pressure growth trend with displacement is consistent during the two loading processes, and the response direction and change sequence of the adjacent detection positions are consistent, the corresponding detection position is determined to have reached the effective flattening state. When at least one of them is not satisfied, the flattening state verification of the corresponding detection position is determined to have failed, and the loading adjustment, local unloading, and reloading verification are performed again. By unloading and reloading the candidate flattening position and comparing the two displacement, pressure changes, and responses of the adjacent positions, accidental judgments caused by local slippage and contact instability can be eliminated, and the reliability of flattening confirmation can be improved.

[0019] Compared with the prior art, the advantages of this invention are: By setting up lifting components, limiting clamps, temporary clamping components, and multiple flattening components spaced circumferentially along the limiting clamps on the frame, the wave spring can perform multi-position synchronous or group flattening detection under stable clamping conditions, avoiding the problem that traditional single-point measurement cannot reflect the overall circumferential thickness state.

[0020] Each flattening component drives the pressure plate to load through the second telescopic component, and uses the pressure rod, compression spring and pressure sensor to obtain the force change at the corresponding detection position. At the same time, it combines the first displacement detection unit and the second displacement detection unit to obtain the overall and local position information, thereby forming the detection data corresponding to the pressure and displacement.

[0021] During the testing process, the clamping posture of the wave spring is determined by opposing pressure tests, and the coupling response relationship between different circumferential testing positions is established by sequentially performing small movements of a single flattening component. This allows for the identification of the additional pressure influence of an action at one testing position on other testing positions. Furthermore, the actual testing pressure is corrected using the coupling response relationship, which helps to reduce the mutual force interference caused by the circumferential continuous elastic structure, making the obtained local flattening response closer to the actual pressure state of the corresponding testing position.

[0022] Based on this, by observing the changes in pressure with displacement and the response of adjacent detection positions, waveform deformation and interlayer contact with the overall flattening state are identified sequentially. According to the actual flattening process of different detection positions, the corresponding flattening components are controlled to continue loading, stop, retract, or follow up, so that each detection position can gradually reach the candidate flattening state, reducing local overpressure or insufficient flattening caused by uniform loading.

[0023] For detection positions that have reached the candidate flattening state, comparing the consistency of displacement, pressure changes, and responses at adjacent positions through partial unloading and reloading can reduce accidental misjudgments caused by local slippage, contact instability, and elastic hysteresis, thereby improving the reliability of valid flattening state confirmation. Finally, by combining the clamping posture with the flattening data at each circumferential position and determining the single-layer thickness based on the corresponding effective layer number, the average single-layer thickness and circumferential thickness anomaly results can be obtained simultaneously, thereby improving the accuracy, stability, and anomaly identification capability of online thickness detection of wave springs. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the entire invention; Figure 2 This is a three-dimensional schematic diagram of the lifting assembly and the limiting clamping plate of the present invention; Figure 3 This is a three-dimensional schematic diagram of the thickness detection component of the present invention; Figure 4 This is a partial half-section perspective view of the flattening component of the present invention; Figure 5 This is a schematic diagram illustrating the working principle of the present invention; Figure 6 This is a schematic diagram of the waveform spring thickness detection process of the present invention.

[0025] Explanation of the labels in the diagram: 1. Frame; 2. Lifting assembly; 3. Limiting clamp; 4. Temporary clamping assembly; 5. Bracket; 6. First telescopic assembly; 7. Flattening assembly; 701. Second telescopic assembly; 702. Housing; 703. Compression spring; 704. Pressure sensor; 705. Pressure rod; 706. Pressure plate; 8. Wave spring. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1 Please see Figure 1-5 This invention provides an online thickness detection device for wave spring testing, comprising a frame 1, a lifting assembly 2 disposed within the frame 1, and a limiting clamp 3 disposed at the lifting end of the lifting assembly 2 for clamping and fixing the wave spring 8 to be tested. A temporary clamping assembly 4 and a bracket 5 are disposed at the upper end of the frame 1. The temporary clamping assembly 4 is used to temporarily hold the wave spring 8 during clamping, and a thickness detection assembly is disposed at the end of the bracket 5.

[0028] The thickness detection component includes a first telescopic component 6, and the telescopic end of the first telescopic component 6 is provided with a plurality of flattening components 7 distributed circumferentially along the limiting clamp 3. The first telescopic component 6 is used to drive the plurality of flattening components 7 to move closer to or further away from the wave spring 8.

[0029] Each flattening assembly 7 includes a second telescopic assembly 701. The output end of the second telescopic assembly 701 is provided with a housing 702. A pressure rod 705 is slidably arranged inside the housing 702 along the telescopic direction of the second telescopic assembly 701. The lower end of the pressure rod 705 extends out of the housing 702 and is provided with a pressure plate 706. A pressure sensor 704 is provided at the upper end of the interior of the housing 702. A compression spring 703 is provided between the pressure sensor 704 and the upper end of the pressure rod 705.

[0030] During testing, the wave spring 8 is temporarily held by the temporary clamping component 4. The lifting component 2 drives the limit clamping plate 3 to move to the corresponding position and clamp the wave spring 8. Then, the temporary clamping component 4 is released and the wave spring 8 is moved below the thickness detection component.

[0031] The first telescopic component 6 first drives multiple flattening components 7 to move closer to the wave spring 8. Then, each second telescopic component 701 drives the corresponding pressure plate 706 to contact different circumferential positions of the wave spring 8 and apply localized loading. After the pressure plate 706 is subjected to the reaction force of the wave spring 8, it drives the pressure rod 705 to slide relative to the housing 702 and compress the compression spring 703. The pressure is transmitted to the pressure sensor 704 through the compression spring 703, thereby obtaining the pressure information of the corresponding detection position.

[0032] Since each of the second telescopic components 701 can operate independently, the loading position of the corresponding flattening component 7 can be adjusted according to the initial height and compression state of the wave spring 8 at different circumferential positions, without requiring the multiple pressure plates 706 to maintain the same displacement. The pressure and position information of each flattening component 7 are input into the flattening detection and control module, which then controls the first telescopic component 6 and each of the second telescopic components 701 to perform corresponding flattening detection actions.

[0033] After the test is completed, the partial loading of each of the second telescopic components 701 is released, the first telescopic component 6 drives the multiple flattening components 7 to retract as a whole, and the lifting component 2 then drives the limiting clamp 3 to descend and complete the removal of the wave spring 8. Based on the above mechanical structure, the thickness detection process specifically executed by the flattening detection and control module is further described in the following embodiments.

[0034] Example 2 Please see Figure 6 This embodiment, based on Embodiment 1, describes the waveform spring thickness detection process executed by the flattening detection and control module.

[0035] Each flattening assembly 7 includes a second telescopic assembly 701 and a housing 702 disposed at the output end of the second telescopic assembly 701. A pressure rod 705 is slidably disposed inside the housing 702 along the telescopic direction of the second telescopic assembly 701. The lower end of the pressure rod 705 extends out of the housing 702 and is fitted with a pressure plate 706. A pressure sensor 704 is installed at the upper end of the interior of the housing 702. A compression spring 703 is disposed between the pressure sensor 704 and the upper end of the pressure rod 705. When the pressure plate 706 is subjected to the reaction force of the wave spring 8, the pressure rod 705 moves into the housing 702 and compresses the compression spring 703. The pressure sensor 704 obtains the pressure information at the corresponding detection position.

[0036] The flattening detection and control module includes a controller, a first displacement detection unit for acquiring the extension position of the first telescopic component 6, and multiple second displacement detection units for acquiring the extension positions of corresponding second telescopic components 701. The controller is connected to the first telescopic component 6, each of the second telescopic components 701, each pressure sensor 704, the first displacement detection unit, and each of the second displacement detection units, respectively, to acquire the position information of the first telescopic component 6 and each of the second telescopic components 701, as well as the pressure information of each pressure sensor 704, and to control the operation of the first telescopic component 6 and each of the second telescopic components 701 based on the above information.

[0037] Before testing, standard parts of known thickness can be used to establish positional references for each pressure plate 706 relative to the support reference surface of the limiting clamp 3, and the compression deformation of the compression spring 703 under different pressure states can be recorded to correct for positional changes caused by the compression retraction of the pressure rod 705. After clamping the wave spring 8, the specific testing includes the following steps: S1. The controller first controls the first telescopic component 6 to move multiple flattening components 7 as a whole closer to the wave spring 8, and then performs slight movements through each of the second telescopic components 701. When the pressure of the corresponding pressure sensor 704 reaches the preset contact condition, it is determined that the flattening component 7 has made contact with the wave spring 8, and the positions of the first telescopic component 6 and the corresponding second telescopic component 701 are recorded.

[0038] After multiple flattening components 7 complete contact, the flattening components 7 arranged circumferentially opposite each other along the wave spring 8 form opposing detection groups. Each opposing detection group is controlled to perform micro-pressure tests, and the contact position and pressure response at different opposing detection positions are compared. If there is a continuous directional height difference between different circumferential positions, the clamping tilt direction and corresponding position offset of the wave spring 8 are determined based on this difference, forming clamping posture information.

[0039] Subsequently, each flattening component 7 is restored to the contact state, and one of the second telescopic components 701 is sequentially controlled to generate a predetermined micro-displacement, while the other second telescopic components 701 are kept unloaded. Simultaneously, pressure changes from other pressure sensors 704 are collected. Since the wave spring 8 is continuous circumferentially, deformation at one detection position will affect the force state at other detection positions. Therefore, the displacement of the current flattening component 7 is recorded in correspondence with the pressure changes of other flattening components 7. After the pressure tests of each flattening component 7 are completed sequentially, a coupling response relationship between different circumferential detection positions is established to characterize the pressure impact of an action at one detection position on other detection positions.

[0040] Within the micro-pressure testing range, the coupling response coefficient between the detection positions is determined based on the current displacement of the flattening component 7 and the pressure changes corresponding to other detection positions: In the formula, For the first The detection location for the first The coupling response coefficient at the nth detection location is used to characterize the nth detection location. When the first detection position generates a unit displacement, the first... The pressure effect generated at each detection location; For the first The displacement of the flattening component 7 during the micro-pressure test process; For the first When the flattening component 7 generates a displacement, the first... Each detection location corresponds to the pressure change detected by pressure sensor 704; This is the detection position number of the current active action; For other detection locations affected by coupling, and Sequentially determine the relationships between different detection locations. This establishes a coupled response relationship between different circumferential detection positions; The larger the absolute value of , the greater the number of . The action at the detection location is related to the first... The more pronounced the coupling effect at each detection location, the more significant the impact.

[0041] S2. The controller groups multiple flattening components 7 according to their opposing positions and controls different groups to be loaded sequentially or alternately. During loading, the controller synchronously acquires the pressure information detected by each pressure sensor 704 and the position information of the second telescopic component 701 detected by each second displacement detection unit according to a preset sampling frequency. The pressure information detected by each pressure sensor 704 is used as the pressure data of the corresponding detection position. The displacement data of the corresponding flattening component 7 is determined according to the position change of the corresponding second telescopic component 701 during loading. According to the correspondence between each flattening component 7 and the circumferential detection position, the pressure data and displacement data are associated with the corresponding detection positions respectively. The overall position of multiple flattening components 7 is obtained through the first displacement detection unit.

[0042] When the action of a certain flattening component 7 causes pressure changes at other detection positions, the coupling pressure generated by the action of other positions is determined according to the coupling response relationship established in S1, and corrected from the pressure data of the corresponding detection positions. Within the micro-loading range, the pressure data of the current detection position is corrected according to the displacement of other flattening components 7 that act simultaneously and their corresponding coupling response coefficients. In the formula, For the first Pressure data after coupling effect correction at each detection location; For the first Each detection location corresponds to the actual pressure data acquired by pressure sensor 704; The number of flattening components 7 participating in the current loading process; To exclude the first Other detection location serial numbers besides the one detection location; The first one determined in S1 The detection location for the first The coupling response coefficients at each detection location; For the current sampling period, the first The displacement of the flattening component 7; For the other flattening components 7 actions to the first The coupling pressure component generated by the detection locations.

[0043] The corrected pressure data is combined with the displacement data of the corresponding flattening component 7 to form the local flattening response at each detection location.

[0044] In the initial loading stage, the second telescopic component 701 experiences displacement and a gradual increase in pressure, with the corresponding position primarily in a waveform deformation state. As loading continues, when the pressure increase corresponding to similar displacement changes intensifies, and adjacent detection positions gradually exhibit corresponding changes, it is determined that the corresponding position has entered an interlayer contact state. As multiple adjacent detection positions enter this state, and the displacement change decreases while the pressure continues to increase with further minor loading, it is determined that the waveform spring 8 gradually enters an overall flattening state. This allows for the identification of the flattening state change of the waveform spring 8 during the loading process.

[0045] S3. The controller determines whether a corresponding position has reached a candidate flattening state based on the local flattening response of each detection position and the flattening state of adjacent detection positions. When a detection position has undergone waveform deformation and entered the flattening stage after interlayer contact, and adjacent detection positions are also in the corresponding flattening stage, the detection position is determined to have reached a candidate flattening state.

[0046] For positions that have not yet reached the candidate flattening state, the corresponding second telescopic component 701 continues to load; for positions that have already reached the candidate flattening state, the active loading is reduced or stopped. When other flattening components 7 continue to operate, causing the positions that have reached the candidate flattening state to be affected by coupling, the controller adjusts the loading state of the corresponding second telescopic component 701 according to the coupling response relationship. When the pressure at this position increases due to loading at other positions, a moderate retraction is performed; when the pressure decreases, a moderate follow-up is performed, thereby stabilizing the positions that have reached the candidate flattening state, while the remaining positions continue to load, until each detection position gradually reaches the candidate flattening state.

[0047] S4. To reduce the impact of local slippage of the waveform spring 8, unstable contact of the pressure plate 706, and elastic hysteresis on the judgment of the candidate flattening state during a single loading process, after the detection position reaches the candidate flattening state, the detection position is partially unloaded and reloaded to verify the candidate flattening state.

[0048] The controller first records the displacement data, the corrected pressure data, and the local flattening response of the adjacent detection position when the first loading reaches the candidate flattening state. Then, it controls the corresponding second telescopic component 701 to retract slightly, so that the pressure detected by the corresponding pressure sensor 704 is reduced, while keeping the pressure plate 706 in contact with the wave spring 8. After the partial unloading is completed, the corresponding second telescopic component 701 is controlled to reload along the original loading direction, and the displacement data, corrected pressure data, and local flattening response of adjacent detection positions are obtained in the same sampling method as the first loading.

[0049] The controller uses the displacement data obtained during the initial loading and reloading processes, along with the corrected pressure data, to generate corresponding local flattening responses. It then compares the displacement position at the two points where candidate flattening states are reached, the pressure increase trend with displacement, and the response changes at adjacent detection locations. To comprehensively characterize the consistency of the local flattening responses obtained during the initial loading and reloading processes, a consistency deviation index is determined for each detection location. In the formula, For the first Consistency deviation index between initial loading and reloading at each detection location The smaller the value, the higher the consistency between the two local flattening responses; For the first The displacement position corresponding to the first loading of each detection position to reach the candidate flattening state; For the first The displacement position corresponding to the candidate flattening state when each detection position is reloaded; and These are the first and second loading stages, respectively. The degree of pressure increase with displacement at each detection location near the candidate flattening state; In order to be with the first A set of adjacent detection locations; For set The number of adjacent detection locations included; For the first loading process When the detection position moves, the adjacent first... The change in response pressure generated at each detection location; For the first time during the reload process When the detection position moves, the adjacent first... The change in response pressure generated at each detection location; A preset normalization benchmark for displacement differences; A preset normalized benchmark for the difference in the degree of pressure increase with displacement; A preset normalized benchmark for the difference in response pressure between adjacent detection locations; , and These are preset weights corresponding to the differences in candidate flattening positions, differences in pressure growth characteristics, and differences in response at adjacent detection positions, respectively, and satisfying the following: When the difference between two candidate flattening positions is within a preset allowable range, the pressure-displacement change growth trend is consistent during the two loading processes, and the response direction and change sequence of adjacent detection positions are consistent, it is determined that the two local flattening responses are consistent, and the corresponding detection positions are confirmed to have reached an effective flattening state; among them, the consistency deviation index can also be included. Compared with a preset consistency threshold, when If the response is not greater than the preset consistency threshold, the two local flattening responses at the corresponding detection location are determined to meet the consistency requirements.

[0050] If at least one of the above conditions is not met, the flattening status verification of the detection position is determined to have failed. The corresponding flattening component 7 is then reloaded and adjusted, and the partial unloading and reloading verification is performed again until the corresponding detection position is confirmed to have reached an effective flattening state. The above method is used to verify each detection position in sequence to determine the effective flattening state of each detection position.

[0051] S5. After all detection positions have reached the effective flattening state, the controller acquires the position information of the first telescopic component 6, the position information of each second telescopic component 701, and the pressure information of each pressure sensor 704 to form flattening data for each detection position.

[0052] Based on the position reference established before the test and the compression deformation of the compression spring 703 corresponding to the pressure sensor 704, the flattening data is corrected for position. Based on the clamping posture obtained by S1, the position offset caused by clamping tilt at different circumferential test positions is further removed, thereby obtaining the flattening position of each circumferential test position under a unified reference, and determining the local flattening total thickness of the corresponding position accordingly.

[0053] The effective number of layers corresponding to each circumferential detection position is predetermined based on the structural parameters of the waveform spring 8 to be tested. When the number of layers at each position is the same, a uniform effective number of layers is used. When there is end overlap or local layer variation, the corresponding effective number of layers is used according to the corresponding circumferential position. The single-layer thickness at each circumferential position is determined based on the corrected local flattening total thickness and the corresponding effective number of layers.

[0054] Finally, the average single-layer thickness of the wave spring 8 is determined based on the single-layer thickness at each circumferential position, and the differences in single-layer thickness at different circumferential positions are compared. When the single-layer thickness at a certain position or several consecutive positions deviates from the allowable range, it is identified as a circumferential thickness abnormality position, and the circumferential thickness abnormality result is output, thereby completing the online thickness detection of the wave spring 8.

[0055] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. An online thickness detection device for wave spring detection, comprising a frame (1), wherein a lifting assembly (2) is provided inside the frame (1), a limiting clamp (3) is provided at the lifting end of the lifting assembly (2), a temporary clamping assembly (4) and a bracket (5) are provided at the upper end of the frame (1), and a thickness detection assembly is provided at the end of the bracket (5), characterized in that: The thickness detection component includes a first telescopic component (6), and the telescopic end of the first telescopic component (6) is provided with a plurality of flattening components (7) distributed circumferentially along the limiting clamp (3). The limiting clamp (3) is used to clamp and fix the wave spring (8). The thickness detection component also includes a flattening detection and control module, which is configured to perform waveform spring thickness detection.

2. The online thickness detection device for wave spring detection according to claim 1, characterized in that: The flattening assembly (7) includes a second telescopic assembly (701) and a housing (702) disposed at the output end of the second telescopic assembly (701). A pressure rod (705) is slidably disposed inside the housing (702) along the telescopic direction of the second telescopic assembly (701). The lower end of the pressure rod (705) extends out of the housing (702) and is provided with a pressure plate (706). A pressure sensor (704) is provided at the upper end of the inner part of the housing (702), and a compression spring (703) is provided between the pressure sensor (704) and the upper end of the pressure rod (705).

3. The online thickness detection device for wave spring detection according to claim 2, characterized in that: The flattening detection and control module includes a controller, a first displacement detection unit for obtaining the extension position of the first telescopic component (6), and multiple second displacement detection units for obtaining the extension position of the corresponding second telescopic component (701). The controller is connected to the first telescopic component (6), each of the second telescopic components (701), each of the pressure sensors (704), the first displacement detection unit and each of the second displacement detection units respectively, and is used to obtain the position information of the first telescopic component (6) and each of the second telescopic components (701) and the pressure information of each pressure sensor (704), and control the first telescopic component (6) and each of the second telescopic components (701) to move according to the position information and pressure information.

4. The online thickness detection device for wave spring detection according to claim 3, characterized in that: The thickness detection of the waveform spring includes the following steps: S1. Control multiple flattening components (7) to contact the wave spring (8) respectively, determine the clamping posture by counter-pressure test, and establish the coupling response relationship between different circumferential detection positions by the movement displacement of each flattening component (7) when it moves in sequence and the pressure change of other flattening components (7). S2. Control multiple flattening components (7) to load in groups, obtain pressure data and displacement data of the corresponding flattening components (7) at each detection position, correct the pressure data at each detection position according to the coupling response relationship, and combine the corrected pressure data and the corresponding displacement data to form the local flattening response at each detection position, and identify the flattening state change of the waveform spring (8). S3. Determine the candidate flattening state based on the local flattening response of each detection position and the flattening state of adjacent detection positions, and adjust the loading state of each flattening component (7) according to the coupling response relationship so that each detection position gradually reaches the candidate flattening state. S4. Verify the flattening status of the detection positions that have reached the candidate flattening state to determine whether the corresponding detection positions have reached the effective flattening state. S5. After the effective flattening state is achieved at each detection position, the single layer thickness at each circumferential position is determined according to the flattening data at each detection position, the clamping posture and the corresponding effective number of layers, and the thickness detection result of the wave spring (8) is determined according to the single layer thickness at each circumferential position.

5. The online thickness detection device for wave spring detection according to claim 4, characterized in that: In S4, the flattening state verification includes partially unloading and reloading the detection positions that have reached the candidate flattening state, and determining whether the corresponding detection position has reached the effective flattening state based on the consistency of the local flattening response obtained from the first loading and reloading and the local flattening response of adjacent detection positions. In S5, the flattening data of each detection position is corrected according to the clamping posture. The single-layer thickness of each circumferential position is determined according to the corrected flattening data and the corresponding effective layer number. The average single-layer thickness of the wave spring (8) and the circumferential thickness anomaly result are determined according to the single-layer thickness of each circumferential position.

6. The online thickness detection device for wave spring detection according to claim 4, characterized in that: In step S1, after determining the clamping posture, each flattening component (7) is restored to the state of contact with the wave spring (8), and one of the second telescopic components (701) is controlled to generate a small displacement, while the other second telescopic components (701) are kept from being actively loaded. The pressure changes of the pressure sensors (704) corresponding to other detection positions are obtained synchronously. The coupling response coefficient of the current detection position to other detection positions is determined based on the displacement of the current flattening component (7) and the pressure changes of other detection positions. The coupling response relationship between different circumferential detection positions is obtained by the sequential action of each flattening component (7).

7. The online thickness detection device for wave spring detection according to claim 6, characterized in that: In step S2, during the group loading process of multiple flattening components (7), the coupling pressure component generated by the actions of other flattening components (7) on the current detection position is determined based on the displacement of the actions of other flattening components (7) and the corresponding coupling response coefficient, and the pressure data of the current detection position is corrected according to the following formula: In the formula, For the first Pressure data after coupling effect correction at each detection location; For the first Each detection location corresponds to pressure data acquired by the pressure sensor (704); The number of flattening components (7) participating in the current loading process; For the first The detection location for the first The coupling response coefficients at each detection location; The i-th sampling period The displacement of the flattening component (7); the corrected pressure data and the displacement data of the corresponding flattening component (7) together form the first... Local flattening response at each detection location.

8. The online thickness detection device for wave spring detection according to claim 7, characterized in that: In S2, the waveform deformation state, interlayer contact state and overall flattening state are identified based on the local flattening response of each detection position. Specifically, when the pressure gradually increases with displacement during the loading process of the flattening component (7), the corresponding detection position is determined to be in the waveform deformation state. When the pressure increase after correction under similar displacement changes increases and the adjacent detection positions produce corresponding response changes, the corresponding detection position is determined to enter the interlayer contact state. When multiple adjacent detection positions enter the interlayer contact state and the displacement change decreases while the pressure continues to increase when micro-loading continues, the waveform spring (8) is determined to enter the overall flattening state.

9. An online thickness detection device for wave spring detection according to claim 8, characterized in that: In step S3, for a detection position that has reached the candidate flattening state, the active loading of the corresponding second telescopic component (701) is reduced or stopped. While other flattening components (7) continue to load, the coupling effect on the detection position that has reached the candidate flattening state is determined according to the coupling response relationship. When the pressure at the detection position increases due to the loading of other flattening components (7), the corresponding second telescopic component (701) is controlled to retract along the unloading direction. When the pressure at the detection position decreases, the corresponding second telescopic component (701) is controlled to follow along the loading direction, so that the detection position that has reached the candidate flattening state remains stable, while the remaining detection positions continue to be loaded to the candidate flattening state.

10. An online thickness detection device for wave spring detection according to claim 5, characterized in that: In step S4, when the detection position first reaches the candidate flattening state, the corresponding displacement data, the corrected pressure data, and the local flattening response of the adjacent detection position are recorded. Then, the corresponding second telescopic component (701) is controlled to retract slightly, so that the pressure detected by the corresponding pressure sensor (704) is reduced and the pressure plate (706) is kept in contact with the wave spring (8). Then, the corresponding second telescopic component (701) is controlled to reload along the original loading direction. The displacement position, the pressure growth trend with displacement, and the response change of the adjacent detection position are compared when the corresponding detection position reaches the candidate flattening state during the first loading and reloading. When the difference between the two candidate flattening positions is within the preset allowable range, the pressure growth trend with displacement is consistent during the two loading processes, and the response direction and change sequence of the adjacent detection positions are consistent, it is determined that the corresponding detection position has reached the effective flattening state. When at least one of them is not satisfied, it is determined that the flattening state verification of the corresponding detection position has failed, and the loading adjustment, local unloading, and reloading verification are performed again.

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