A device and method for measuring consistency of thermoelectric conversion of a TEC chip

Abstract

The application discloses a TEC chip thermoelectric conversion consistency measuring device and method, and solves the technical problem of low efficiency in the prior art, wherein the TEC chip thermoelectric conversion consistency measuring device comprises a mounting base, an electric heating film, a programmable constant voltage and constant current source, a pressing plate, a cover plate, a data acquisition and display module and a plurality of pressure sensors; the TEC mounting station on the mounting base is pasted with the electric heating film; the upper surface of the electric heating film is used for mounting the TEC chip to be measured; the output end of the programmable constant voltage and constant current source is connected with the electric pulse input end of the electric heating film; the pressing plate is arranged on the upper portion of the TEC mounting station, the cover plate is arranged on the upper portion of the pressing plate, the plurality of pressure sensors are uniformly distributed between the pressing plate and the cover plate, the signal output end of each pressure sensor is electrically connected with the pressure signal input end of the data acquisition and display module, the data acquisition and display module further has a voltage signal input end and is used for being connected with the voltage signal output end of the TEC chip.

Description

Technical Field

[0001] This invention relates to a thermoelectric conversion measurement device and method for TCE chips, specifically to a thermoelectric conversion consistency measurement device and method for TEC chips. Background Technology

[0002] A TEC chip, or thermoelectric cooler, is an electronic device that utilizes the Peltier effect to achieve solid-state cooling and heating. In thermopile-type energy meters, the TEC chip is a crucial temperature measuring component.

[0003] To measure the energy of large-aperture laser beams using a thermopile-type energy meter, multiple TEC chips are typically connected in series to form a TEC array, which measures the heating temperature of the absorber. In this type of energy meter, besides strictly controlling the uniformity of photothermal conversion of the absorber, the consistency of the thermoelectric conversion efficiency of each TEC chip is also crucial. Poor consistency in the thermoelectric conversion efficiency of the individual TEC chips directly affects the surface response uniformity of the thermopile-type energy meter, thereby reducing its measurement accuracy.

[0004] Chinese invention patent CN110456250A discloses a method and device for measuring TEC refrigeration performance. The measurement method includes:

[0005] S1. Obtain the hot-end temperature of the hot end of the TEC under test, and determine whether the hot-end temperature is within the preset hot-end temperature scanning range. If yes, proceed to step S2; otherwise, the measurement ends.

[0006] S2. Determine whether the operating current of the TEC under test is not greater than the preset current limit. If yes, proceed to step S3; if no, control the hot end temperature of the TEC under test by the temperature control TEC to increase the step temperature and reset the operating current, then proceed to step S1 for the next measurement.

[0007] S3. Adjust the heating power of the heating element to increase the step power by one step;

[0008] S4. Determine whether the cold end temperature of the TEC under test is not greater than its hot end temperature. If yes, proceed to step S5. If no, control the operating current of the TEC under test to increase the step current and then proceed to step S2 to re-determine with the preset current limit.

[0009] S5. Determine whether the current cold end temperature and hot end temperature of the TEC under test are stable. If yes, record the cooling performance data of the TEC under test in this measurement. The cooling performance data includes the current hot end temperature, current cold end temperature, current operating current, current operating voltage and current cooling power of the TEC under test. If not, re-enter step S4 to make the determination.

[0010] The above technical solution can collect the performance curve / steady-state data of a single TEC chip. However, when it is necessary to measure the thermoelectric conversion consistency of multiple TEC chips, it is necessary to measure the performance curve / steady-state data of all TEC chips one by one and then compare them manually. This is extremely inefficient. Furthermore, small fluctuations in test conditions (such as ambient temperature drift) will introduce additional errors and affect the reliability of the comparison results. Summary of the Invention

[0011] The purpose of this invention is to solve the technical problem that in the prior art, after measuring the performance curves / steady-state data of all TEC chips one by one and then performing manual comparison, the efficiency is extremely low, and the slight fluctuations in the test conditions will introduce additional errors, affecting the reliability of the comparison results. The invention provides a device and method for measuring the thermoelectric conversion consistency of TEC chips.

[0012] To achieve the above objectives, the technical solution provided by this invention is as follows:

[0013] A TEC chip thermoelectric conversion consistency measurement device is characterized by comprising a mounting base, an electric heating film, a programmable constant voltage and constant current source, a pressure plate, a cover plate, a data acquisition and display module, and multiple pressure sensors.

[0014] The mounting base is provided with a TEC installation station, and the electric heating film is attached to the TEC installation station;

[0015] The upper surface of the electric heating film is used to mount the TEC chip to be measured, and its heating area covers the entire calorimetric end of the TEC chip.

[0016] The output terminal of the programmable constant voltage and constant current source is connected to the electrical pulse input terminal of the electric heating film, and is used to provide the electric heating film with an electrical pulse of preset pulse width t and amplitude U to heat the electric heating film;

[0017] The lower surface of the pressure plate is used to bond with the cold end of the TEC chip;

[0018] The cover plate is disposed above the pressure plate, is detachably connected to the upper end face of the mounting base, and is clearance-fitted with the upper end face of the mounting base;

[0019] Multiple pressure sensors are arranged between the pressure plate and the cover plate, with one end connected to the pressure plate and the other end attached to the cover plate. The upper surface of each pressure sensor protrudes from the upper surface of the mounting base by a predetermined distance, and its signal output end is electrically connected to the pressure signal input end of the data acquisition and display module. Tightening the cover plate applies pressure to the pressure plate through the pressure sensors, pressing the TEC chip to detect the pressure value at each corresponding position on the upper surface of the pressure plate.

[0020] The data acquisition and display module also has a voltage signal input terminal, which is used to connect to the voltage signal output terminal of the TEC chip to acquire and display the voltage signal amplitude output by the TEC chip.

[0021] Furthermore, the upper part of the mounting base is provided with a groove, and one side of the groove is an open structure. The groove constitutes a TEC mounting station, and its open structure is a TEC mounting port. The other three side walls are used to fit with the three peripheral side walls of the TEC chip to limit the TEC chip. The electric heating film is pasted on the bottom surface of the groove.

[0022] Furthermore, the cover plate is fixed to the top of the three side walls of the groove by screws, and the upper surfaces of the multiple pressure sensors protrude from the top of the three side walls of the groove by a predetermined distance.

[0023] Furthermore, the pressure sensor is four in number, the cross-section of the pressure plate is rectangular, and the four pressure sensors are respectively set at the four corners of the pressure plate.

[0024] Furthermore, the lower surface area of ​​the pressure plate is greater than or equal to the cold end area of ​​the TEC chip.

[0025] Meanwhile, the present invention also provides a method for measuring the thermoelectric conversion consistency of a TEC chip, which is characterized by including the following steps:

[0026] Step 1: Construct the above-mentioned thermoelectric conversion consistency measurement device for TEC chips;

[0027] Step 2: Based on the theoretical thermoelectric conversion parameters C of the TEC chip to be measured and the internal resistance R of the electric heating film, determine the preset pulse width t and pulse amplitude U of the programmable constant voltage and constant current source output pulse.

[0028] Step 3: Install the TEC chip onto the TEC installation station and connect the voltage signal output terminal of the TEC chip to the voltage signal input terminal of the data acquisition and display module;

[0029] Step 4: Place the pressure plate on the cold end of the TEC chip, then evenly install multiple pressure sensors on the upper surface of the pressure plate, and finally place the cover plate on top of the pressure sensors, close to the upper surface of the pressure sensors.

[0030] Step 5: Adjust the pressure on each corresponding position of the pressure plate by adjusting the distance between the cover plate and the upper surface of the mounting base until the pressure values ​​of multiple pressure sensors are the same and are fixed preset pressure values.

[0031] Step 6: Start the programmable constant voltage and constant current source and output an electrical pulse with a preset pulse width t and pulse amplitude U to heat the electric heating film;

[0032] Step 7: Observe the voltage signal amplitude displayed by the acquisition and display module. When the output stabilizes within a preset time, record the voltage signal amplitude and then disassemble the TEC chip after the measurement is completed.

[0033] Step 8: After the electric heating film cools to room temperature, use the method in Steps 3-7 to measure the voltage signal amplitude of the next TEC chip to be measured within a preset time, until all TEC chips to be measured have been measured.

[0034] Step 9: Compare the voltage signal amplitudes of all the TEC chips to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets. Then, select TEC chips with consistent thermoelectric conversion efficiency from each set of voltage signal amplitude datasets to complete the thermoelectric conversion consistency measurement of TEC chips.

[0035] Furthermore, in step 2, the preset pulse width t < 0.5s.

[0036] Furthermore, step 9 specifically includes:

[0037] Step 9.1: Compare the voltage signal amplitudes of all the TEC chips to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets;

[0038] Step 9.2: Calculate the average value for each voltage signal amplitude dataset. Then, select the voltage signal amplitude closest to the average value from each dataset as the reference value for that dataset. Finally, select the corresponding reference value and the value differing from the reference value from each dataset. If the amplitude of all voltage signals within a certain range is used as the consistency dataset for each group, then the thermoelectric conversion efficiency of the TEC chip corresponding to the consistency dataset of each group is determined to be consistent, thus completing the thermoelectric conversion consistency measurement of the TEC chip.

[0039] Compared with the prior art, the present invention has the following beneficial technical effects:

[0040] 1. The present invention provides a thermoelectric conversion consistency measurement device for TEC chips. By setting a pressure plate and a pressure sensor, the pressure environment of each TEC chip is highly consistent. Furthermore, a programmable constant voltage and constant current output of an electrical pulse with a preset pulse width and amplitude is used to heat the electric heating film, so that the TEC chip outputs a stable voltage signal amplitude. This provides a highly consistent temperature environment for multiple TEC chips and improves the accuracy of thermoelectric conversion consistency measurement of multiple TEC chips.

[0041] 2. The present invention provides a thermoelectric conversion consistency measurement device for TEC chips, which has a simple structure and high measurement performance stability.

[0042] 3. The present invention provides a thermoelectric conversion consistency measurement device for TEC chips. By setting a groove on the upper part of the mounting base, it provides a uniform mounting position and size for multiple TEC chips, thereby improving the mounting accuracy and avoiding the problem of measurement accuracy reduction caused by installation errors.

[0043] 4. The present invention provides a thermoelectric conversion consistency measurement device for TEC chips. By setting four pressure sensors, which are evenly distributed at the four corners of the pressure plate, the pressure plate can be subjected to more uniform force, thereby improving the measurement accuracy.

[0044] 5. This invention provides a method for measuring the thermoelectric conversion consistency of a TEC chip. An electrical pulse with a preset pulse width t and amplitude U is input to an electric heating module to heat the calorimetric terminal of the TEC chip. The amplitude of the voltage signal displayed on the acquisition and display module is observed. When the output stabilizes within a preset time, the amplitude of the voltage signal is recorded. A reference value and the difference from the reference value are selected from each set of voltage signal amplitude datasets. If the amplitude of all voltage signals within a certain range is used as the consistency dataset for each group, then the thermoelectric conversion efficiency of the TEC chip corresponding to the consistency dataset of each group is determined to be consistent. The measurement method is simple, convenient, and fast, less affected by environmental factors, and has high measurement accuracy.

[0045] 6. The present invention provides a method for measuring the thermoelectric conversion consistency of a TEC chip. By using a preset pulse width t < 0.5s, a stable output voltage signal amplitude can be obtained, and the measurement efficiency can be improved. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of an embodiment of the thermoelectric conversion consistency measurement device for TEC chips according to the present invention;

[0047] Figure 2 This is a longitudinal sectional view of a TEC chip thermoelectric conversion consistency measurement device embodiment of the present invention, after the TEC chip is mounted on the mounting base.

[0048] The annotations in the attached figures are explained as follows:

[0049] 1. Programmable constant voltage and constant current source; 2. Electric heating film; 3. Mounting base; 4. Pressure plate; 5. Pressure sensor; 6. Cover plate; 7. Data acquisition and display module; 8. TEC chip. Detailed Implementation

[0050] To make the objectives, advantages, and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0051] like Figure 1-2 As shown, this embodiment provides a TEC chip thermoelectric conversion consistency measurement device, including a mounting base 3, an electric heating film 2, a programmable constant voltage and constant current source 1, a pressure plate 4, a cover plate 6, a data acquisition and display module 7, and multiple pressure sensors 5;

[0052] The mounting base 3 is equipped with a TEC mounting station, on which an electric heating film 2 is attached. The upper surface of the electric heating film 2 is used to mount the TEC chip 8 to be measured, and its heating area covers the entire calorimetric end of the TEC chip 8. The output end of the programmable constant voltage and constant current source 1 is connected to the electric pulse input end of the electric heating film 2, which is used to provide the electric heating film 2 with an electric pulse of preset pulse width t and amplitude U to heat the electric heating film 2. The lower surface of the pressure plate 4 is used to fit against the cold end of the TEC chip 8, and the area of ​​the lower surface of the pressure plate 4 is greater than or equal to the area of ​​the cold end of the TEC chip 8. The cover plate 6 is positioned above the pressure plate 4 and is detachably connected to the upper surface of the mounting base 3, with a clearance fit. Multiple pressure sensors 5 are evenly distributed between the pressure plate 4 and the cover plate 6, with one end connected to the pressure plate 4 and the other end attached to the cover plate 6. The upper surface of each pressure sensor 5 protrudes from the upper surface of the mounting base 3 by a predetermined distance, and its signal output terminal is electrically connected to the pressure signal input terminal of the data acquisition and display module 7. Tightening the cover plate 6 applies pressure to the pressure plate 4 through the pressure sensors 5, pressing the TEC chip 8 to detect the pressure value at each corresponding position on the upper surface of the pressure plate 4. The data acquisition and display module 7 also has a voltage signal input terminal, which is used to connect to the voltage signal output terminal of the TEC chip 8 to acquire and display the voltage signal amplitude output by the TEC chip 8.

[0053] In this embodiment, the upper part of the mounting base 3 is provided with a groove, and one side of the groove is an open structure. The groove constitutes the TEC mounting station, and its open structure is the TEC mounting port. The other three side walls are used to fit against the three peripheral side walls of the TEC chip 8 to limit the TEC chip 8. An electric heating film 2 is pasted inside the groove. The cover plate 6 is fixed to the top of the three side walls of the groove with screws. The upper surfaces of the multiple pressure sensors 5 protrude from the top of the three side walls of the groove by a predetermined distance.

[0054] There are four pressure sensors 5. The cross-section of the pressure plate 4 is rectangular, and the four pressure sensors 5 are respectively set at the four corners of the pressure plate 4.

[0055] Meanwhile, the present invention also provides a method for measuring the thermoelectric conversion consistency of a TEC chip, comprising the following steps:

[0056] Step 1: Construct the above-mentioned thermoelectric conversion consistency measurement device for TEC chips;

[0057] Step 2: Based on the theoretical thermoelectric conversion parameters C of the TEC chip 8 to be measured and the internal resistance R of the electric heating film 2, determine the preset pulse width t and pulse amplitude U of the output electric pulse of the programmable constant voltage and constant current source 1; wherein, the preset pulse width t < 0.5s.

[0058] Step 3: Install the TEC chip 8 onto the TEC installation station and connect the voltage signal output terminal of the TEC chip 8 to the voltage signal input terminal of the data acquisition and display module 7.

[0059] Step 4: Place the pressure plate 4 on the cold end of the TEC chip 8, then evenly install multiple pressure sensors 5 on the upper surface of the pressure plate 4, and finally place the cover plate 6 on top of the pressure sensors 5, close to the upper surface of the pressure sensors 5.

[0060] Step 5: Adjust the distance between the cover plate 6 and the upper surface of the mounting base 3 to adjust the pressure on each corresponding position of the pressure plate 4 until the pressure values ​​of multiple pressure sensors 5 are the same and are fixed preset pressure values, so as to ensure that the pressure between each TEC chip 8 and the electric heating film 2 is consistent.

[0061] Step 6: Start the programmable constant voltage and constant current source 1, and output an electrical pulse with a preset pulse width t and pulse amplitude U to heat the electric heating film 2;

[0062] Step 7: Observe the voltage signal amplitude displayed by the data acquisition and display module 7. When the output is stable within a preset time, record the voltage signal amplitude and then disassemble the TEC chip 8 after the measurement is completed.

[0063] Step 8: After the electric heating film 2 cools to room temperature, measure the voltage signal amplitude of the next TEC chip 8 to be measured within a preset time using the method in steps 3-7, until all TEC chips 8 to be measured have been measured. The pulse interval between two electrical pulses is longer than the time required for the electric heating film 2 to cool to room temperature, to ensure that the TEC chip 8 has been installed when the next electrical pulse is triggered. The preset pulse width t, pulse amplitude U, and pulse interval are all set based on experience.

[0064] Step 9: Compare the voltage signal amplitudes of all the TEC chips 8 to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets. Then, select TEC chips 8 with consistent thermoelectric conversion efficiency from each set of voltage signal amplitude datasets to complete the thermoelectric conversion consistency measurement of TEC chips.

[0065] Specifically as follows:

[0066] Step 9.1: Compare the voltage signal amplitudes of all the TEC chips 8 to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets;

[0067] Step 9.2: Calculate the average value for each voltage signal amplitude dataset. Then, select the voltage signal amplitude closest to the average value from each dataset as the reference value for that dataset. Finally, select the corresponding reference value and the value differing from the reference value from each dataset. If the amplitude of all voltage signals within the range is taken as the consistency dataset of each group, then the thermoelectric conversion efficiency of the TEC chip 8 corresponding to the consistency dataset of each group is determined to be consistent, thus completing the thermoelectric conversion consistency measurement of the TEC chip.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the present invention.

Claims

1. A thermoelectric conversion consistency measurement device for TEC chips, characterized in that: It includes a mounting base (3), an electric heating film (2), a programmable constant pressure and constant current source (1), a pressure plate (4), a cover plate (6), a data acquisition and display module (7), and multiple pressure sensors (5); The mounting base (3) is provided with a TEC installation station, and the electric heating film (2) is pasted on the TEC installation station. The upper surface of the electric heating film (2) is used to mount the TEC chip (8) to be measured, and its heating area covers the entire calorimetric end of the TEC chip (8); The output terminal of the programmable constant voltage and constant current source (1) is connected to the electrical pulse input terminal of the electric heating film (2) to provide the electric heating film (2) with an electrical pulse of preset pulse width t and amplitude U to heat the electric heating film (2). The lower surface of the pressure plate (4) is used to bond with the cold end of the TEC chip (8); The cover plate (6) is located above the pressure plate (4), is detachably connected to the upper end face of the mounting base (3), and is clearance-fitted with the upper end face of the mounting base (3); Multiple pressure sensors (5) are arranged between the pressure plate (4) and the cover plate (6). One end of each sensor is connected to the pressure plate (4), and the other end is attached to the cover plate (6). The upper surface of each pressure sensor (5) protrudes from the upper surface of the mounting base (3) by a predetermined distance, and its signal output end is electrically connected to the pressure signal input end of the data acquisition and display module (7). Tightening the cover plate (6) applies pressure to the pressure plate (4) through the pressure sensor (5), pressing the TEC chip (8) to detect the pressure value at each corresponding position on the upper surface of the pressure plate (4). The data acquisition and display module (7) also has a voltage signal input terminal, which is used to connect to the voltage signal output terminal of the TEC chip (8) to acquire and display the voltage signal amplitude output by the TEC chip (8).

2. The TEC chip thermoelectric conversion consistency measurement device according to claim 1, characterized in that: The upper part of the mounting base (3) is provided with a groove, and one side of the groove is an open structure. The groove forms a TEC mounting station, and its open structure is a TEC mounting port. The other three side walls are used to fit with the three peripheral side walls of the TEC chip (8) to limit the TEC chip (8). The electric heating film (2) is pasted on the bottom surface of the groove.

3. The TEC chip thermoelectric conversion consistency measurement device according to claim 2, characterized in that: The cover plate (6) is fixed to the top of the three side walls of the groove by screws, and the upper surfaces of the multiple pressure sensors (5) protrude from the top of the three side walls of the groove by a predetermined distance.

4. The TEC chip thermoelectric conversion consistency measurement device according to claim 1, characterized in that: The pressure sensor (5) is four in number. The cross-section of the pressure plate (4) is rectangular. The four pressure sensors (5) are respectively set at the four corners of the pressure plate (4).

5. The TEC chip thermoelectric conversion consistency measurement device according to claim 1, characterized in that: The area of ​​the lower surface of the pressure plate (4) is greater than or equal to the cold end area of ​​the TEC chip (8).

6. A method for measuring the thermoelectric conversion consistency of a TEC chip, characterized in that, Includes the following steps: Step 1: Construct the thermoelectric conversion consistency measurement device for TEC chips as described in any one of claims 1-5; Step 2: Based on the theoretical thermoelectric conversion parameters C of the TEC chip (8) to be measured and the internal resistance R of the electric heating film (2), determine the preset pulse width t and pulse amplitude U of the output electric pulse of the programmable constant voltage and constant current source (1); Step 3: Install the TEC chip (8) onto the TEC installation station and connect the voltage signal output terminal of the TEC chip (8) to the voltage signal input terminal of the data acquisition and display module (7); Step 4: Place the pressure plate (4) on the cold end of the TEC chip (8), then evenly install multiple pressure sensors (5) on the upper surface of the pressure plate (4), and finally place the cover plate (6) on top of the pressure sensor (5) and close to the upper surface of the pressure sensor (5). Step 5: Adjust the distance between the cover plate (6) and the upper surface of the mounting base (3) to adjust the pressure on each corresponding position of the pressure plate (4) until the pressure values ​​of multiple pressure sensors (5) are the same and are fixed preset pressure values. Step 6: Start the programmable constant voltage and constant current source (1) and output an electrical pulse with a preset pulse width t and pulse amplitude U to heat the electric heating film (2). Step 7: Observe the voltage signal amplitude displayed by the acquisition and display module (7). When the output is stable within a preset time, record the voltage signal amplitude and then disassemble the TEC chip (8) after the measurement is completed. Step 8: After the electric heating film (2) cools down to room temperature, measure the voltage signal amplitude of the next TEC chip (8) to be measured within a preset time using the method in steps 3-7, until all TEC chips (8) to be measured have been measured. Step 9: Compare the voltage signal amplitudes of all the TEC chips (8) to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets. Then, select the TEC chips (8) with consistent thermoelectric conversion efficiency in each set of voltage signal amplitude datasets to complete the thermoelectric conversion consistency measurement of the TEC chips.

7. The method for measuring the thermoelectric conversion consistency of a TEC chip according to claim 6, characterized in that: In step 2, the preset pulse width t < 0.5s.

8. The method for measuring the thermoelectric conversion consistency of a TEC chip according to claim 6, characterized in that, Step 9 specifically includes: Step 9.1: Compare the voltage signal amplitudes of all the TEC chips (8) to be measured, and group the data according to their data distribution concentration to obtain multiple sets of voltage signal amplitude datasets; Step 9.2: Calculate the average value for each voltage signal amplitude dataset. Then, select the voltage signal amplitude closest to the average value from each dataset as the reference value for that dataset. Finally, select the corresponding reference value and the value differing from the reference value from each dataset. If the amplitude of all voltage signals within the range is taken as the consistency dataset of each group, then the thermoelectric conversion efficiency of the TEC chip (8) corresponding to the consistency dataset of each group is determined to be consistent, and the thermoelectric conversion consistency measurement of the TEC chip is completed.

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