A high-precision 3D solder paste detector

Abstract

This invention discloses a high-precision 3D solder paste inspector, relating to the field of visual inspection technology. It includes a working platform, an xy-axis moving mechanism, and a clamping and transmitting mechanism. It further includes: a 3D inspection module, located at the moving end of the xy-axis moving mechanism, for automatically performing three-dimensional data inspection of the solder paste on the front of the circuit board in the xy-axis direction using CCD vision; a wire-drawing correction mechanism, located above the clamping and transmitting mechanism, for automatically correcting the tilted wire-drawing section at the top of the solder paste during longitudinal reciprocating movement; the wire-drawing correction mechanism includes two symmetrically arranged spiral elastic elements, with elastic ropes evenly spaced and staggered on the inner side of each spiral elastic element; and a drive adjustment mechanism located on both sides of the wire-drawing correction mechanism. This invention can correct the wire-drawing section of the solder paste to a vertically upward state before solder paste inspection, avoiding obstruction affecting measurement accuracy when inspecting the solder paste through the 3D inspection module 3.

Description

Technical Field

[0001] This invention relates to the field of visual inspection technology, specifically a high-precision 3D solder paste inspector. Background Technology

[0002] In PCB manufacturing, solder paste inspection is a core process for ensuring the soldering quality and reliability of electronic products. With the increasing density and miniaturization of electronic assembly, traditional 2D inspection is no longer sufficient. 3D solder paste printing inspection technology has become an essential part of modern SMT production lines. Modern 3D SPI equipment uses a high-precision optical or laser scanning system to generate detailed three-dimensional data for each solder joint. The circuit boards are then transported sequentially with the back side facing up to the 3D solder paste inspector. The 3D solder paste inspector moves along the X and Y axes above the circuit board according to a pre-set program. It utilizes structured light projectors, high-resolution industrial cameras, special optical lenses, and auxiliary sensors to perform 3D inspection of the solder paste on the back of the circuit board. Auxiliary sensors, including laser displacement sensors and spectral confocal sensors, are used to directly measure the height or thickness of the solder paste, providing high-precision measurement data. The measured three-dimensional data can identify defects such as missing solder, insufficient solder, excessive solder, bridging, and solder spikes.

[0003] In the existing technology, the ideal state of normal solder paste should be a short and stout outline. However, some circuit boards may have solder joint stringing during processing. Since there are many solder joints on the circuit board, it is not easy to find and deal with them. When two solder joints are close to each other, a small amount of stringing in the tilt direction of one solder joint will partially block the other solder joint, thereby reducing the accuracy of 3D solder paste inspection data.

[0004] To address the aforementioned issues, there is an urgent need for innovative design based on the existing 3D solder paste inspection instrument. Summary of the Invention

[0005] This invention addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different approach. Specifically, the invention aims to offer a high-precision 3D solder paste inspector to address the issue raised in the background section where solder joints may exhibit stringing during circuit board processing. Furthermore, the numerous solder joints on a circuit board make them difficult to locate and process. Additionally, when two solder joints are close together, stringing on one joint can partially obscure the other, thus reducing the accuracy of the 3D solder paste inspection data.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-precision 3D solder paste inspection instrument, comprising a working platform, an xy-axis moving mechanism, and a clamping and conveying mechanism, and further comprising: The 3D inspection module is located at the moving end of the xy-axis moving mechanism and is used to automatically perform three-dimensional data inspection of the solder paste on the back of the circuit board in the xy-axis direction using sensors. The wire drawing correction mechanism is located above the clamping and conveying mechanism to automatically correct the tilted part of the solder paste top during longitudinal reciprocating movement; The wire drawing correction mechanism includes two symmetrically arranged spiral elastic elements, and elastic ropes are arranged alternately at equal intervals on the inner side of the spiral elastic elements; The drive adjustment mechanism is located on both sides of the wire drawing correction mechanism to simultaneously tighten or expand the gaps formed between the elastic ropes while the spiral elastic element contracts synchronously.

[0007] Preferably, the wire drawing correction mechanism further includes a rectangular frame located above the clamping transmission mechanism. A support rod frame is fixedly installed on the inner side of the rectangular frame. The support rod frame has a grid-shaped structure. Two sets of vertically distributed movable plates are installed at each corner of the inner side of the rectangular frame. Connecting rods with downward ends are fixed on the same horizontal line on the outer edge of the spiral elastic element. The ends of the connecting rods are fixed to the ends of the corresponding elastic ropes.

[0008] Preferably, the spiral elastic elements are located on the outer side of the support rod frame, and the movable plate is slidably fitted with the support rod frame, and the two ends of the spiral elastic elements are respectively fixed perpendicularly to the outer wall of the corresponding movable plate.

[0009] Preferably, the drive adjustment mechanism includes support side plates symmetrically fixed to the outer wall of the rectangular frame. Each set of support side plates is symmetrically equipped with a cylinder between it and the work platform. The telescopic end of the cylinder is slidably connected to the support side plate, and a guide roller located above the support side plate is fixed to the top of the telescopic end of the cylinder.

[0010] Preferably, the outer wall of the guide roller is longitudinally symmetrically provided with a conical surface, and the outer wall of the telescopic end of the cylinder is fixed with a limiting ring located below the support side plate.

[0011] Preferably, the drive adjustment mechanism further includes a fixed plate symmetrically fixed to the top of the support side plate, and a movable column is slidably fitted inside the fixed plate. One end of the movable column is located on one side of the upper conical surface of the guide roller, and the end of the movable column is provided with a ball bearing that fits against the conical surface of the guide roller.

[0012] Preferably, a connecting plate is fixed to the other end of each movable column, and the connecting plate is located on top of two sets of movable plates that are vertically distributed accordingly.

[0013] Preferably, one set of movable plates is fixed to the bottom of the connecting plate, and the other set of movable plates is fixed to the top of the connecting plate with a sliding column penetrating through the connecting plate. The connecting plate is provided with a sliding groove that slides with the sliding column.

[0014] Preferably, the drive adjustment mechanism further includes bottom columns fixed to the work platform surface and located at the bottom of the support side plate, a top column fixed to the bottom of the support side plate, a cylindrical groove with which the top column slides, and a connecting cylinder communicating with the lower end of the cylindrical groove fixed to the outer wall of the bottom column.

[0015] Preferably, a return spring is fixed to the inner wall end face of the connecting cylinder, and the end of the return spring is connected to a spherical sliding buckle that slides with the inner wall of the connecting cylinder. A groove is provided on the lower outer wall of the top column that fits with the outer wall of the spherical sliding buckle.

[0016] Compared with the prior art, the beneficial effects of the present invention are: In this invention, before the solder paste on the back of the circuit board is inspected by the 3D detection module, the telescopic end of the cylinder is retracted to a fixed displacement and reset. The mesh structure formed by the elastic ropes covers the circuit board, and the pores are respectively fitted onto the bottom of the solder paste on the back of the circuit board. Under the action of the drive adjustment mechanism, the spiral elastic elements in four directions are compressed synchronously. Due to the spiral characteristics of the spiral elastic elements, multiple sets of connecting rods on the same horizontal line on the spiral elastic elements move synchronously closer to the center, so that the pores formed by the interlaced distribution of the elastic ropes shrink synchronously. Since the lower end of the solder paste is a short and stout structure and the side is an inclined arc surface, the elastic rope with the pores shrinking at this time can flexibly clamp the root of the solder paste wire. During the process of the rectangular frame moving upward and resetting, the pores of the elastic ropes can correct the solder paste wire section to a vertical upward state. The above operation can be repeated, so as to correct the inclined wire section of the solder paste during the longitudinal reciprocating stroke of the telescopic end of the cylinder 601, and avoid the obstruction affecting the measurement accuracy when inspecting the solder paste by the 3D detection module 3. Attached Figure Description

[0017] Figure 1 This is a first-view perspective perspective view of the present invention; Figure 2 This is a second-view perspective perspective view of the present invention; Figure 3 This is a perspective view of the clamping transmission mechanism and the wire drawing correction mechanism of the present invention; Figure 4 This is a perspective view of the clamping transmission mechanism of the present invention; Figure 5 This is a plan view of the clamping transmission mechanism of the present invention; Figure 6 For the present invention Figure 5 Enlarged view of point A in the image; Figure 7 This is a perspective view of a portion of the wire drawing correction mechanism of the present invention after cross-section. Figure 8 For the present invention Figure 7Enlarged view of point B in the image; Figure 9 This is a partial cross-sectional plan view of the wire drawing correction mechanism of the present invention; Figure 10 This is a plan view of the initial state of the elastic rope within the rectangular frame of the present invention.

[0018] Figure 11 This is a three-dimensional cross-sectional view of the bottom column, top column, and connecting cylinder of the present invention.

[0019] In the diagram: 1. Working platform; 2. XY axis moving mechanism; 3. 3D detection module; 4. Clamping transmission mechanism; 5. Wire drawing correction mechanism; 501. Rectangular frame; 502. Support rod frame; 503. Movable plate; 504. Spiral elastic element; 505. Connecting rod; 506. Elastic rope; 6. Support side plate; 601. Cylinder; 602. Guide roller; 603. Limiting ring; 604. Fixed plate; 605. Movable column; 606. Connecting plate; 607. Sliding column; 7. Bottom column; 701. Top column; 702. Connecting cylinder; 703. Return spring; 704. Spherical sliding buckle. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1 to 11 This invention provides a technical solution: a high-precision 3D solder paste inspection instrument, comprising a working platform 1, an xy-axis moving mechanism 2, and a clamping and conveying mechanism 4, and further comprising: The 3D inspection module 3 is set at the moving end of the xy-axis moving mechanism 2, and is used to automatically perform three-dimensional data inspection on the solder paste on the back of the circuit board in the xy-axis direction through sensors. The wire drawing correction mechanism 5 is located above the clamping and conveying mechanism 4 and is used to automatically correct the tilted wire drawing at the top of the solder paste during longitudinal reciprocating movement. The wire drawing correction mechanism 5 includes two symmetrically arranged spiral elastic elements 504, and elastic ropes 506 are arranged at equal intervals on the inner side of the spiral elastic elements 504. The drive adjustment mechanism is set on both sides of the wire drawing correction mechanism 5 to simultaneously tighten or expand the gap formed between the elastic ropes 506 while the spiral elastic element 504 contracts synchronously.

[0022] In specific implementation, both the xy-axis moving mechanism 2 and the 3D detection module 3 are existing technologies. The xy-axis moving mechanism 2 controls the movement of the 3D detection module 3 in the xy-axis direction. The 3D detection module 3 then performs three-dimensional data detection on the solder paste at the back of the circuit board. The clamping and transfer mechanism 4 is also existing technology. Figure 4-6 As shown, the two side frames can move towards each other, adjusting the spacing according to the width of the circuit board, and are not clamped. Conveyor belts are installed inside the frames on both sides, and limit strips are present on the top of both frames. Figure 6 The width of the limiting strip shown needs to protrude to the top of the circuit board, which can be placed through the gap between the conveyor belt and the limiting strip.

[0023] The wire drawing correction mechanism 5 also includes a rectangular frame 501 located above the clamping transmission mechanism 4. A support rod frame 502 is fixedly installed on the inner side of the rectangular frame 501. The support rod frame 502 has a grid-shaped structure. Two sets of vertically distributed movable plates 503 are provided at each corner of the inner side of the rectangular frame 501. Connecting rods 505 with downward ends are fixed on the same horizontal line on the outer edge of the spiral elastic element 504. The ends of the connecting rods 505 are fixed to the ends of the corresponding elastic ropes 506.

[0024] In specific implementation, the connecting rod 505 can cause the elastic rope 506 to protrude towards the bottom of the rectangular frame 501, so that when the rectangular frame 501 drives the elastic rope 506 to move down, the elastic rope 506 will first contact the back of the circuit board, and the spiral spacing of the spiral elastic element 504 is the same.

[0025] The spiral elastic elements 504 are located on the outside of the support rod frame 502, and the movable plate 503 is slidably fitted with the support rod frame 502. The two ends of the spiral elastic elements 504 are respectively fixed perpendicularly to the outer wall of the corresponding movable plate 503.

[0026] In practice, the support rod frame 502 can be divided into two symmetrical fixed rods, and each fixed rod is fitted with a spiral elastic element 504 on its outer side.

[0027] The drive adjustment mechanism includes support side plates 6 symmetrically fixed to the outer wall of the rectangular frame 501. Each set of support side plates 6 is symmetrically installed with cylinders 601 between the support side plates 6 and the table surface of the work platform 1. The telescopic end of the cylinder 601 is slidably connected to the support side plate 6, and the top of the telescopic end of the cylinder 601 is fixed with a guide roller 602 located above the support side plate 6.

[0028] The outer wall of the guide roller 602 is longitudinally symmetrically provided with conical surfaces, and the outer wall of the telescopic end of the cylinder 601 is fixed with a limiting ring 603 located below the support side plate 6.

[0029] In practice, a cylindrical section will be left between the conical surfaces of the outer wall of the guide roller 602.

[0030] The drive adjustment mechanism also includes a fixed plate 604 symmetrically fixed to the top of the support side plate 6. A movable column 605 is slidably fitted inside the fixed plate 604. One end of the movable column 605 is located on the upper conical surface of the guide roller 602, and the end of the movable column 605 is provided with a ball bearing that fits against the conical surface of the guide roller 602.

[0031] In practice, the ball bearings at the end of the movable column 605 can reduce the friction between the end of the movable column 605 and the conical surface of the guide roller 602.

[0032] The other end of each movable column 605 is fixed with a connecting plate 606, which is located on top of the two sets of movable plates 503 that are vertically distributed.

[0033] In practice, the connecting plate 606 is located on top of the two sets of movable plates 503 at the four corners of the rectangular frame 501.

[0034] One set of movable plates 503 is fixed to the bottom of the connecting plate 606, and another set of movable plates 503 is fixed to the top of the connecting plate 606 with a sliding post 607 that passes through the connecting plate 606. The connecting plate 606 is provided with a sliding groove that slides and engages with the sliding post 607.

[0035] In practice, the displacement of the connecting plate 606 when it moves is the same as the displacement of the sliding column 607 pushed by the inclined groove.

[0036] The drive adjustment mechanism also includes a bottom column 7 fixed on the work platform 1 and located at the bottom of the support side plate 6. A top column 701 is fixed at the bottom of the support side plate 6. A cylindrical groove that slides with the top column 701 is opened at the upper end of the bottom column 7. A connecting cylinder 702 that communicates with the lower end of the cylindrical groove is fixed on the outer wall of the bottom column 7.

[0037] A return spring 703 is fixed to the inner wall end face of the connecting cylinder 702. The end of the return spring 703 is connected to a spherical sliding buckle 704 that slides with the inner wall of the connecting cylinder 702. A groove is opened on the lower outer wall of the top column 701 that fits with the outer wall of the spherical sliding buckle 704.

[0038] In practice, when the top post 701 slides to the bottom of the cylindrical groove, the outer wall of the spherical sliding buckle 704 can just fit into the groove on the lower outer wall of the top post 701.

[0039] Working principle: First, circuit boards are placed face down on the clamping and conveying mechanism 4 for transport. This mechanism 4 adapts to circuit boards of different widths by moving in opposite directions. After adjusting the appropriate spacing, the circuit boards can be placed and transported without completely clamping them. Figure 4 The diagram shows the transport of the largest circuit board. According to the set program, the circuit board is transported to a designated position below the rectangular frame 501 and then the transport stops.

[0040] At this time, cylinder 601 is activated, and the telescopic end of cylinder 601 retracts synchronously, fixing its displacement. Since the elastic force of the spiral elastic element 504 is greater than the weight of the rectangular frame 501 itself and its inner components, when cylinder 601 is not activated, the spiral elastic element 504 can elastically limit the movement of the connecting plate 606. The ball bearings at the end of the movable column 605 still adhere to the upper conical surface of the guide roller 602, providing support and limiting the rectangular frame 501 and the supporting side plate 6. Therefore, the retraction of the telescopic end of cylinder 601 causes the entire structure of the rectangular frame 501 to move downwards synchronously. Ultimately, the rectangular frame 501 will drive... Figure 7 The interlaced elastic cords 506 shown are attached to the back of the circuit board, and the mesh structure formed by the elastic cords 506 will cover the circuit board. Since the elastic cords 506 have a certain degree of elasticity, after the elastic cords 506 are attached to the back of the circuit board, the larger gaps of the elastic cords 506 will be respectively fitted to the bottom of the solder paste of the solder joints on the back of the circuit board. Even if the top of the solder paste of the solder joint shows a stringing phenomenon, the lower end of the solder paste of the solder joint is still short and fat, so that the solder joint is located in the gaps of the elastic cords 506.

[0041] Simultaneously, as the supporting side plate 6 moves downward along with the rectangular frame 501, it will cause the top column 701 to slide downward into the cylindrical groove of the connecting cylinder 702. When the bottom of the top column 701 slides to the bottom of the cylindrical groove, the outer wall of the top column 701 will press the spherical sliding buckle 704. The spherical sliding buckle 704 slides in the connecting cylinder 702 and presses the return spring 703 until the groove on the outer wall of the top column 701 slides to the spherical sliding buckle 704. Then, the return spring 703 resets and pushes the spherical sliding buckle 704 into the groove. Since the elastic force of the return spring 703 is slightly greater than the elastic force of the spiral elastic element 504, and the cylinder 601 pushes the supporting side plate 6 downward through the guide roller 602 at the telescopic end, the top column 701 will press the spherical sliding buckle 704 to slide.

[0042] Then, after the telescopic end of cylinder 601 retracts to its fixed displacement, it begins to extend and reset. At this time, the telescopic end of cylinder 601 slides upward inside the support side plate 6. Under the limiting action of the reset spring 703, the upper conical surface of the guide roller 602 pushes the movable column 605 to slide to one side inside the fixed plate 604. The movable column 605 pushes the connecting plate 606 to move. In the two sets of movable plates 503 inside one corner of the rectangular frame 501, the connecting plate 606 drives the bottom fixed set of movable plates 503 to slide on the outer wall of the support rod frame 502. The connecting plate 606 pushes the sliding column 607 through the inclined sliding groove. The sliding column 607 then drives the other set of movable plates 503 to slide synchronously on the outer wall of the support rod frame 502. Similarly, in the two sets of movable plates 503 inside the four corners of the rectangular frame 501... 03. Simultaneously, the two sets of movable plates 503 on the same side of the support rod frame 502 will slide and squeeze the spiral elastic element 504. When the spiral elastic elements 504 in four directions are compressed simultaneously, due to the spiral characteristics of the spiral elastic element 504, multiple sets of connecting rods 505 located on the same horizontal line on the spiral elastic element 504 move towards the center simultaneously. Then, the connecting rods 505 will drive the corresponding elastic ropes 506 to move towards the center simultaneously, so that the gaps formed by the staggered distribution of the elastic ropes 506 will shrink simultaneously. Since the lower end of the solder paste is a short and stout structure and the side is an inclined arc surface, the elastic ropes 506 will form a protrusion and be located at the top of the solder paste. At this time, the elastic ropes 506 with the shrinking gaps can flexibly clamp the root of the solder paste.

[0043] After the gaps formed by the interlaced distribution of elastic ropes 506 shrink, the ball bearings at the end of the movable column 605 are located at the lowest point of the upper conical surface of the guide roller 602. The elastic force of the spiral elastic element 504 gradually increases after compression. If the elastic force of the spiral elastic element 504 is greater than that of the return spring 703, the guide roller 602 can push the movable column 605, causing the rectangular frame 501 to move the elastic ropes 506 upward a short distance. This allows the gaps in the elastic ropes 506, which are flexibly clamped at the root of the solder paste, to correct the solder paste drawing section to a vertically upward state. As the groove on the outer wall of the top column 701 disengages from the spherical sliding buckle 704, the spherical sliding buckle 704 abuts against the outer wall of the top column 701. At this time, the return spring 703 is compressed and its elastic force is greater than that of the spiral elastic element 504 after compression. The upper conical surface of the guide roller 602 will then... The movable column 605 is moved by a small displacement, and the guide roller 602 continues to move upward. The ball bearing at the end of the movable column 605 rolls along the outer wall of the guide roller 602 to the bottom of the lower conical surface. During this process, the spiral elastic element 504 is deformed and reset, and the gap of the elastic rope 506 is also reset to its initial size. At this time, the limiting ring 603 just moves to the bottom of the support side plate 6. The limiting ring 603 finally pushes the support side plate 6 to reset the rectangular frame 501 to its initial height. At the same time, the top column 701 slides to its initial position in the cylindrical groove of the bottom column 7. Since the outer wall of the guide roller 602 has a symmetrical conical surface, the above operation can be repeated in reverse. In this way, the tilting and wire drawing of the solder paste is corrected during the longitudinal reciprocating stroke of the cylinder 601 extension end, so as to avoid the obstruction affecting the measurement accuracy when the solder paste is detected by the 3D detection module 3.

[0044] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision 3D solder paste inspection instrument, comprising a working platform (1), an xy-axis moving mechanism (2), and a clamping and conveying mechanism (4), characterized in that, Also includes: The 3D detection module (3) is set at the moving end of the xy axis moving mechanism (2) to automatically perform three-dimensional data detection on the solder paste on the front of the circuit board in the xy axis direction by means of CCD. The wire drawing correction mechanism (5) is set above the clamping transfer mechanism (4) to automatically correct the wire drawing tilt at the top of the solder paste during longitudinal reciprocating movement; The wire drawing correction mechanism (5) includes two symmetrically arranged spiral elastic elements (504), and elastic ropes (506) are arranged at equal intervals on the inner side of the spiral elastic elements (504). The drive adjustment mechanism is set on both sides of the wire drawing correction mechanism (5) to simultaneously tighten or expand the gap formed between the elastic ropes (506) while the spiral elastic element (504) contracts synchronously.

2. The high-precision 3D solder paste inspector according to claim 1, characterized in that: The wire drawing correction mechanism (5) also includes a rectangular frame (501) located above the clamping transmission mechanism (4). A support rod frame (502) is fixedly installed on the inner side of the rectangular frame (501). The support rod frame (502) has a grid-shaped structure. Two sets of vertically distributed movable plates (503) are provided at each corner of the inner side of the rectangular frame (501). Connecting rods (505) with downward ends are fixed on the same horizontal line on the outer edge of the spiral elastic element (504). The ends of the connecting rods (505) are fixed to the ends of the corresponding elastic ropes (506).

3. The high-precision 3D solder paste inspector according to claim 2, characterized in that: The spiral elastic element (504) is located on the outside of the support rod frame (502), and the movable plate (503) is slidably fitted with the support rod frame (502). The two ends of the spiral elastic element (504) are respectively fixed perpendicularly to the outer wall of the corresponding movable plate (503).

4. The high-precision 3D solder paste inspector according to claim 1, characterized in that: The drive adjustment mechanism includes support side plates (6) symmetrically fixed to the outer wall of the rectangular frame (501). Each set of support side plates (6) is symmetrically installed with cylinders (601) between the support side plates (6) and the table surface of the work platform (1). The telescopic end of the cylinder (601) is slidably connected to the support side plate (6), and the top of the telescopic end of the cylinder (601) is fixed with a guide roller (602) located above the support side plate (6).

5. A high-precision 3D solder paste inspector according to claim 4, characterized in that: The outer wall of the guide roller (602) is longitudinally symmetrically provided with a conical surface, and the outer wall of the telescopic end of the cylinder (601) is fixed with a limiting ring (603) located below the support side plate (6).

6. A high-precision 3D solder paste inspector according to claim 4, characterized in that: The drive adjustment mechanism also includes a fixed plate (604) symmetrically fixed on the top of the support side plate (6). The fixed plate (604) is provided with a movable column (605) in sliding fit. One end of the movable column (605) is located on the upper conical surface of the guide roller (602), and the end of the movable column (605) is provided with a ball that fits the conical surface of the guide roller (602).

7. A high-precision 3D solder paste inspector according to claim 6, characterized in that: The other end of each movable column (605) is fixed with a connecting plate (606), which is located on top of the two sets of movable plates (503) that are vertically distributed.

8. A high-precision 3D solder paste inspector according to claim 7, characterized in that: One set of movable plates (503) is fixed to the bottom of the connecting plate (606), and another set of movable plates (503) is fixed to the top of the connecting plate (606) with a sliding column (607) penetrating through the connecting plate (606). The connecting plate (606) is provided with a sliding groove that slides and engages with the sliding column (607).

9. A high-precision 3D solder paste inspector according to claim 1, characterized in that: The drive adjustment mechanism also includes a bottom column (7) fixed on the work platform (1) and located at the bottom of the support side plate (6). A top column (701) is fixed at the bottom of the support side plate (6). A cylindrical groove that slides with the top column (701) is opened at the upper end of the bottom column (7). A connecting cylinder (702) that communicates with the lower end of the cylindrical groove is fixed on the outer wall of the bottom column (7).

10. A high-precision 3D solder paste inspector according to claim 9, characterized in that: A return spring (703) is fixed to the inner wall end face of the connecting cylinder (702). The end of the return spring (703) is connected to a spherical sliding buckle (704) that slides with the inner wall of the connecting cylinder (702). The lower end outer wall of the top column (701) is provided with a groove that fits with the outer wall of the spherical sliding buckle (704).

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