Grounding device defect detection method, system, device, and product

Abstract

The application discloses a grounding device defect detection method, system, equipment and product, belongs to the technical field of power equipment state monitoring, and aims to solve the defect misjudgment problem caused by the coupling of conductor defects and soil environment influence. The method comprises the following steps: injecting a transient excitation signal into a grounding device and collecting a transient response signal; performing double-domain joint decoupling analysis on the response signal, that is, determining the physical position of the defect based on the propagation characteristics, and inversely calculating the environmental parameters of the soil around the defect based on the reflection characteristics; finally, combining the position and the environmental parameters to generate a visual image representing the defect type. Through decoupling analysis, the application effectively distinguishes the causes of defects, improves the diagnostic accuracy, and realizes intuitive and visual diagnostic effect.

Description

Technical Field

[0001] This application relates to the field of power equipment condition monitoring, and in particular to a method, system, equipment and product for detecting defects in grounding devices. Background Technology

[0002] Grounding devices are key facilities in power systems to ensure the safety of equipment and personnel. Because they are buried underground for a long time, they are susceptible to defects caused by factors such as metal corrosion, fracture, and changes in the surrounding soil environment (such as moisture content and density), which threaten the safe and stable operation of the power grid.

[0003] Existing technologies for detecting grounding devices have many limitations. Traditional grounding resistance meters are cumbersome, requiring the grounding lead to be disconnected and auxiliary electrodes to be laid, resulting in low detection efficiency. Clamp-on meters are prone to significant measurement errors due to the uncertainty of current distribution in complex grounding networks and cannot pinpoint defects. Transient response detection technology, developed in recent years, diagnoses defects by injecting pulse signals into the grounding device and analyzing its reflected waves, representing an improvement over traditional methods. However, a core technological bottleneck remains: the physical defects of the grounding device itself (such as corrosion or fracture) and anomalies in the surrounding soil environment (such as localized water accumulation, cracks, or cavities) are coupled in their effects on the transient response signal. For example, a corrosion point and a small area of ​​water accumulation may both exhibit similar impedance discontinuities in the reflected signal, making it difficult for existing technologies to accurately distinguish the root cause of the defect, resulting in a high false alarm rate and severely impacting the reliability of diagnosis and the accuracy of subsequent maintenance decisions.

[0004] Therefore, there is an urgent need for a detection technology that can effectively decouple the effects of grounding conductor defects and soil environmental anomalies, thereby accurately distinguishing defect types and achieving high-precision positioning and intuitive diagnosis. Summary of the Invention

[0005] The purpose of this application is to provide a method, system, device and product for detecting defects in grounding devices, which aims to solve the technical problem of misjudging the type of defect caused by the coupling of conductor defects and soil environment in the prior art.

[0006] To achieve the above objectives, this application provides the following solution: Firstly, this application provides a method for detecting defects in a grounding device, including: Inject a transient excitation signal into the grounding device; The transient response signal generated in the grounding device by the transient excitation signal is acquired; The transient response signal is subjected to dual-domain joint decoupling analysis, which includes: determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal, and retrieving the environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal. Based on the physical location of the defect and the environmental parameters, a visual image is generated to characterize the defect type.

[0007] In some embodiments, the transient excitation signal is a square wave signal modulated by a Gaussian window function.

[0008] In some embodiments, the pulse width of the square wave signal is between 10 ns and 1 μs and the rise time is no more than 100 ns.

[0009] In some embodiments, determining the physical location of a defect in the grounding device based on the propagation characteristics of the transient response signal specifically includes: The transient response signal is subjected to a short-time Fourier transform (STFT) to obtain a time spectrum, and the physical location of the defect is determined based on the phase abrupt change points in the time spectrum.

[0010] In some embodiments, the environmental parameters include the dielectric constant and / or resistivity of the soil.

[0011] In some embodiments, environmental parameters of the soil surrounding the physical location of the defect are inferred based on the reflection characteristics of the transient response signal, specifically including: The reflection coefficient is calculated based on the transient response signal, and the dielectric constant and / or resistivity of the soil are inferred from the reflection coefficient.

[0012] In some embodiments, the environmental parameters include the dielectric constant and resistivity of the soil; Based on the physical location of the defect and the environmental parameters, a visual image is generated to characterize the defect type, specifically including: At the physical location of the defect, the resistivity is mapped to a first color channel of a color space, and the dielectric constant is mapped to a second color channel of the same color space to synthesize a dual-channel thermogram characterizing the defect type.

[0013] Secondly, this application provides a grounding device defect detection system, comprising: A signal injection module is used to inject transient excitation signals into the grounding device; The signal acquisition module is used to acquire the transient response signal generated in the grounding device by the transient excitation signal; The signal analysis module is used to perform dual-domain joint decoupling analysis on the transient response signal. The dual-domain joint decoupling analysis includes: determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal, and retrieving the environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal. An image generation module is used to generate a visual image that characterizes the type of defect based on the physical location of the defect and the environmental parameters.

[0014] Thirdly, this application provides a computer device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the grounding device defect detection method described in any one of the above.

[0015] Fourthly, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the grounding device defect detection method described in any one of the above descriptions.

[0016] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the grounding device defect detection method described in any one of the above descriptions.

[0017] According to the specific embodiments provided in this application, the following technical effects are disclosed: This application provides a method, system, device, and product for detecting defects in grounding devices. Through dual-domain joint decoupling analysis, the physical location of the defect is accurately located in the time domain, while the environmental parameters of the soil around the defect are inverted in the frequency domain. This effectively separates the coupling influence of defects in the grounding conductor itself and soil environmental anomalies on the detection signal, solving the problem that traditional transient methods easily misjudge soil problems as conductor corrosion and reducing the false alarm rate. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic flowchart of a grounding device defect detection method in one embodiment of this application; Figure 2 This is a schematic diagram of the architecture of a grounding device defect detection system in one embodiment of this application. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] This application provides a method, system, device, and product for detecting defects in grounding devices, aiming to solve the problem in existing technologies where the influence of defects in the grounding conductor itself and abnormalities in the surrounding soil environment on transient response signals is coupled, making it difficult to accurately distinguish the root cause of defects and resulting in a high false alarm rate. The core idea of ​​this application is to perform dual-domain joint decoupling analysis on the acquired transient response signals, accurately locate the physical location of the defect in the time domain, and simultaneously invert the soil environmental parameters around the defect in the frequency domain. Finally, by combining the location and environmental information, a comprehensive diagnosis and visualization are performed, thereby achieving accurate identification of the defect type (such as conductor corrosion, fracture, or soil water accumulation and cracking).

[0023] The grounding device defect detection method, system, equipment, and product in this application are executed by computer equipment, which can be a terminal computing device or a server. The terminal computing device can be, but is not limited to, various desktop computers, laptops, smartphones, tablets, IoT devices, etc. The server can be a standalone server or a server cluster composed of multiple servers, or it can be a cloud server.

[0024] Reference Figure 1 In one specific embodiment, the grounding device defect detection method provided in this application specifically includes: Step S110: Inject a transient excitation signal into the grounding device.

[0025] Step S120: Acquire the transient response signal generated in the grounding device by the transient excitation signal.

[0026] The purpose of the two steps described above is to excite the grounding device's response at different scales using the rich frequency components of the signal. It should be noted that transient excitation signals with small bandwidths can lead to insensitivity to weak or deep defects. Therefore, this method preferably uses transient excitation signals with larger bandwidths. For example, a transient excitation signal of 0.1–50 MHz can be selected (conventional excitation signals are ≤10 MHz). By injecting a broadband transient excitation signal, sufficient information is ensured for subsequent analysis, creating the prerequisite for accurate diagnosis.

[0027] Step S130: Perform dual-domain joint decoupling analysis on the transient response signal. The dual-domain joint decoupling analysis includes: determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal, and retrieving the environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal.

[0028] The dual-domain joint decoupling analysis is decomposed into two parallel dimensions.

[0029] The first dimension is based on the propagation characteristics of transient response signals to determine the physical location of defects in a grounding system. Electromagnetic waves propagate at a specific speed in a medium, and when they encounter a defect and return, the round-trip propagation time directly corresponds to the physical distance to the defect. By accurately measuring this time delay, precise spatial location of the defect can be achieved.

[0030] The second dimension involves retrieving one or more environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal. The reflection intensity and spectral shape of the signal at the defect are not only related to the defect itself, but also closely related to the electromagnetic properties of the surrounding medium (i.e., the soil). By analyzing frequency domain characteristics such as the reflection coefficient, key environmental parameters such as the soil's dielectric constant and resistivity can be calculated. This step transforms the soil environmental influences, previously considered interference factors, into valuable diagnostic information, thus providing a crucial basis for distinguishing the root cause of the defect.

[0031] Step S140: Based on the physical location of the defect and environmental parameters, generate a visualization image to characterize the defect type.

[0032] This step integrates abstract location data and environmental parameters, presenting them in an intuitive graphical format. For example, different colors or markers are assigned to the located defect locations based on combinations of environmental parameter values. In this way, the two core diagnostic questions of "where" and "what" are answered simultaneously in a single view, improving the readability of diagnostic results and decision-making efficiency, and solving the problems of traditional detection methods that produce results that are singular and unintuitive.

[0033] In summary, this invention uses dual-domain joint decoupling analysis to accurately locate the physical location of the defect in the time domain, while simultaneously inverting the environmental parameters of the soil surrounding the defect in the frequency domain. This effectively separates the coupling influence of the grounding conductor's own defects and soil environmental anomalies on the detection signal, solving the problem that traditional transient methods easily misjudge soil problems as conductor corrosion and reducing the false alarm rate.

[0034] In some embodiments, the transient excitation signal is a square wave signal modulated by a Gaussian window function.

[0035] Square wave signals, rich in harmonic components, are inherently broadband signals. Modulating them with a Gaussian window function smooths their spectrum, reduces spectral leakage, and concentrates energy within the desired frequency band, while generating waveforms with quasi-impulse characteristics. This specific signal form better excites the high-frequency response of grounding systems, offering higher energy utilization and a better signal-to-noise ratio compared to ordinary square or sine waves, thus improving detection sensitivity and accuracy.

[0036] For example, modulating a square wave signal using a Gaussian window function to generate a quasi-impulse can be expressed as: ; in, and These represent pulse width and window width, respectively. For time delay. This is achieved by dynamically adjusting the pulse width. and window width To adapt to different soil depth detection needs. By setting the time delay It can precisely control the pulse emission phase.

[0037] Furthermore, the pulse width of the square wave signal is... to Between and the rise time is not greater than .

[0038] Pulse width determines the balance between signal energy and detection resolution. to Its range can adapt to various needs, from shallow high-resolution detection to deep penetrating detection. The rise time is no greater than... This ensures that the signal has a sufficiently steep leading edge, capable of generating a rich enough array of high-frequency harmonic components (e.g., up to tens of MHz), which is crucial for capturing reflection signals from minute defects. Precisely defining the signal parameters ensures that the excitation source provides a solid signal foundation for subsequent high-precision diagnostics.

[0039] In some embodiments, determining the physical location of a defect in a grounding device based on the propagation characteristics of a transient response signal specifically includes: performing a short-time Fourier transform (STFT) on the transient response signal to obtain a time spectrum, and determining the physical location of the defect based on the phase abrupt change points in the time spectrum.

[0040] STFT is a classic time-frequency analysis tool that can simultaneously display the energy distribution of a signal in time and frequency. When an electromagnetic wave encounters a defect point where impedance is discontinuous, the phase of the reflected wave changes abruptly. This phenomenon appears as a clear and identifiable feature point in the STFT time spectrum. By capturing this phase abrupt change point, the arrival time of the reflected signal can be accurately determined, thus providing a reliable basis for physical positioning. Compared to simple time-domain peak detection, this method has stronger noise resistance and higher positioning accuracy.

[0041] Specifically, it can be based on the formula Calculate the distance between the defect and the signal injection point. .in, The time when the phase abrupt change occurs. This represents the propagation speed of the transient response signal in the soil. This step transforms the time information obtained from the aforementioned time-frequency analysis into actual physical spatial information. The factor "2" in the formula is because the signal propagates along a round-trip path (from the injection point to the defect point and back to the injection point). By establishing this explicit mathematical model, the results of signal processing are directly correlated with distances in the physical world, giving the positioning results clear physical meaning and quantifiable values, thus completing the crucial transformation from the signal domain to the physical domain.

[0042] In some embodiments, environmental parameters include the dielectric constant and / or resistivity of the soil.

[0043] These two parameters are important physical quantities characterizing the electromagnetic properties of soil. The dielectric constant of soil is mainly affected by its water content, while resistivity is related to factors such as soil conductivity, density, and ion concentration. By specifying these two parameters as the inversion target, a solid physical foundation is provided for the qualitative analysis of the soil environment. For example, a high dielectric constant usually indicates high water content (waterlogging), while an extremely low dielectric constant may indicate air gaps (cracking, voids). Obtaining these two parameters provides important evidence for accurately determining the cause of defects (whether it is a conductor problem or an environmental problem).

[0044] Based on the above, the environmental parameters of the soil surrounding the physical location of the defect are inferred from the reflection characteristics of the transient response signal. Specifically, this includes: calculating the reflection coefficient based on the transient response signal, and inferring the dielectric constant and / or resistivity of the soil based on the reflection coefficient.

[0045] Reflectance coefficient This describes the relationship between the intensity and frequency of signal reflection at a defective interface. The value of this reflection is determined by the impedance of the media on both sides of the interface, which is directly related to the dielectric constant and resistivity. Therefore, by establishing a physical model or mathematical inversion relationship between the reflection coefficient and these two environmental parameters, the dielectric constant can be inversely solved from the measured reflection coefficient spectrum. and resistivity .

[0046] In an example process: STFT processing is performed on the transient response signal in the time domain, and the timing of the phase transition point is determined by detecting the phase transition point in the time spectrum. Subsequently, according to the formula Calculate the distance between the defect and the signal injection point. The wave speed here It can be dynamically calibrated, based on the dielectric constant obtained from subsequent frequency domain analysis. Through formula Real-time corrections are performed. Among them, At the speed of light, Permeability, It is a soil correction factor, thereby achieving high-precision positioning.

[0047] Calculate the reflection coefficient of the reflected signal in the frequency domain. Its calculation formula is .in, The equivalent impedance of the defect point. This is the system characteristic impedance. Then, by... By performing inverse Fourier transform or other inversion algorithms, the dielectric constant of the soil at the defect location can be accurately determined. and resistivity .

[0048] In one example, the relationship between defect type and dielectric constant, resistivity, and reflection coefficient is shown in Table 1.

[0049] Table 1 Defect Type Judgment Rules

[0050] As shown in Table 1, the reflection coefficient at the defect location exhibits a sudden change. If the dielectric constant at the defect location is [value missing], then the defect type can be determined as metal fracture. and resistivity If the defect type is determined to be localized water accumulation, and the dielectric constant at the defect location is... Furthermore, there are abrupt changes in resistivity. If the defect type is determined to be either a crack or a void, and if there is a sudden change in the dielectric constant at the defect location... If so, the defect type can be determined to be uneven distribution of drag-reducing agent.

[0051] In some embodiments, environmental parameters include the dielectric constant and resistivity of the soil; based on the physical location of the defect and the environmental parameters, a visualization image for characterizing the defect type is generated, specifically including: at the physical location of the defect, mapping the resistivity to a first color channel of a color space and mapping the dielectric constant to a second color channel of a color space to synthesize a dual-channel heatmap characterizing the defect type.

[0052] This step is crucial for the intuitive diagnosis achieved by this method. It encodes two independent physical quantities (resistivity and dielectric constant) into a single color. For example, high resistivity might result in a reddish hue, while high dielectric constant might result in a greenish hue; thus, a defect point with both high resistivity and high dielectric constant would appear yellow. Through this multi-dimensional information fusion visualization method, different defect types (such as water corrosion, dry cracks, and cavities) exhibit unique and distinguishable color characteristics, transforming complex parameter combinations into a readily understandable visual language, allowing users to intuitively determine the defect type or its tendency.

[0053] Furthermore, the color space is RGB, with the first color channel being the R (red) channel, the second color channel being the G (green) channel, and the B (blue) channel set to a preset value (e.g., 0). By mapping resistivity to the R channel and dielectric constant to the G channel, an intuitive color system can be formed: pure red areas represent defects with high resistivity and low dielectric constant; pure green areas represent defects with low resistivity and high dielectric constant; and yellow areas (red + green) represent defects with high resistivity and high dielectric constant. This explicit mapping rule standardizes the interpretation of visualization results, enhancing the consistency and reliability of diagnosis.

[0054] The above describes the grounding device defect detection method provided in this application. As can be seen from the above description, this invention has the following technical effects: 1. By using dual-domain joint decoupling analysis, the physical location of the defect is accurately located in the time domain, while the dielectric constant and resistivity of the soil around the defect are inverted in the frequency domain. This effectively separates the coupling influence of the grounding conductor's own defects and soil environmental anomalies on the detection signal, solving the problem that traditional transient methods easily misjudge soil problems as conductor corrosion and reducing the false alarm rate.

[0055] 2. By employing a broadband excitation signal modulated by a Gaussian window and combining it with high-resolution STFT time-frequency analysis, the defect location accuracy can reach ±0.3 meters, which is an improvement over traditional methods. At the same time, the quantitative inversion of environmental parameters provides reliable data support for assessing the degree of corrosion, soil cracking, and other factors.

[0056] 3. By mapping two key environmental parameters, resistivity and dielectric constant, to a dual-channel thermogram, different types of defects (such as water corrosion, dry cracks and cavities) exhibit unique color characteristics, transforming abstract detection data into intuitive diagnostic images, thereby improving diagnostic efficiency and the readability of results.

[0057] Reference Figure 2 In one specific embodiment, the grounding device defect detection system provided in this application specifically includes: a signal injection module, a signal acquisition module, a signal analysis module, and an image generation module.

[0058] The signal injection module is used to inject transient excitation signals into the grounding device.

[0059] This module is the source of the entire detection process, responsible for generating an excitation signal that meets specific requirements (such as a square wave modulated by a Gaussian window) and effectively coupling it to the grounding device.

[0060] The signal acquisition module is used to acquire the transient response signal generated by the transient excitation signal in the grounding device.

[0061] This module is the system's "sensor," responsible for accurately capturing weak electrical signals carrying defect information. Its performance directly determines the sensitivity and accuracy of the detection.

[0062] The signal analysis module is used to perform dual-domain joint decoupling analysis on transient response signals. The dual-domain joint decoupling analysis includes: determining the physical location of defects in the grounding device based on the propagation characteristics of transient response signals, and retrieving the environmental parameters of the soil surrounding the physical location of the defects based on the reflection characteristics of transient response signals.

[0063] This module is the "brain" of the system, responsible for executing core algorithms such as STFT analysis, reflection coefficient calculation, and parameter inversion, completing the key processing steps from raw signals to diagnostic information.

[0064] The image generation module generates visual images that characterize the type of defect based on the physical location and environmental parameters of the defect.

[0065] This module is the system's "human-computer interaction interface," responsible for converting the complex data output by the signal analysis module into an intuitive dual-channel heatmap and presenting it to the user.

[0066] Preferably, the signal acquisition module is a distributed sensing unit, comprising multiple sensors arranged around the grounding device. In large or complex grounding grids (such as substation grounding grids), signals acquired from a single point may not cover the entire network. Adopting a distributed, multi-sensor layout allows for the simultaneous acquisition of response signals from different locations and angles, forming a "sensor array." This not only covers a wider detection range but also provides the possibility of tomographic imaging by processing multiple signals, thereby obtaining a two-dimensional or three-dimensional health status map of the entire grounding grid, improving the comprehensiveness and accuracy of the detection.

[0067] It should be noted that the above system is the physical carrier for implementing the grounding device defect detection method in this application, and each module therein is used to implement each step in the grounding device defect detection method. Therefore, for a detailed description of the function of each module, please refer to the detailed description of the grounding device defect detection method in this application. This grounding device defect detection system and the grounding device defect detection method have the same technical effect and solve the same technical problem.

[0068] In conjunction with a grounding device defect detection system, the grounding device defect detection method provided in this application will be illustrated in more detail through several application scenarios.

[0069] In one application scenario, the grounding device defect detection method can locate and identify fracture defects in the grounding device. The principle behind this location and identification is as follows: by injecting a high-voltage square wave into the grounding device, the fracture point is located using the traveling wave reflection principle. When the injected electromagnetic wave propagates along the grounding conductor, if it encounters a fracture point where the impedance changes drastically, a strong reflected wave will be generated. By accurately capturing this reflected wave and analyzing its propagation time, the location of the fracture point can be calculated.

[0070] The specific process is as follows: First, a Gaussian window modulated square wave pulse is injected into the lead wire of the grounding device under test through the signal injection module, and its pulse width is... The time can be set to 50ns, with a rise time not exceeding 100ns. Subsequently, distributed sensing units (e.g., including Rogowski coils and voltage probes) positioned near the injection point acquire the reflected echo signal. Upon receiving the acquired signal, the signal analysis module performs a short-time Fourier transform (STFT) analysis. In the analyzed time spectrum, if a breakpoint exists, a clear phase jump is typically observed at a specific frequency (e.g., 12MHz). The signal analysis module automatically detects this phase jump point and determines the time of its occurrence. For example, detected = 45 ns. Next, the signal analysis module uses the formula... Calculate the distance between the break point and the signal injection point. Velocity. Adaptive corrections can be made through pre-calibration or based on a preliminary inversion of the soil dielectric constant. For example, in this embodiment, it is possible to take... = 0.16 m / ns. Therefore, the distance between the break point and the signal injection point is calculated to be 0.16 m / ns. 45 / 2 = 3.6 meters. Finally, the image generation module marks the fracture defect at 3.6 meters on the display interface. This application example demonstrates that this method can achieve rapid and accurate location of grounding electrode fracture defects. Field excavation verification showed that the location error is less than 0.3 meters, which is more accurate than traditional detection methods.

[0071] In another application scenario, grounding device defect detection methods can quantitatively assess corrosion defects in grounding devices. Unlike fracture defects, corrosion defects typically manifest as a gradual decrease in conductor cross-sectional area and changes in surface impedance, resulting in more complex reflected signal characteristics. The core of this application lies in assessing the severity of corrosion by analyzing the frequency domain characteristics of the reflected signal, particularly the reflection coefficient.

[0072] The specific process is as follows: First, a broadband transient excitation signal is injected by the signal injection module. After the distributed sensing unit acquires the transient response signal, the signal analysis module processes it. A key step is to apply a digital bandpass filter to extract the signal components in a specific frequency band (e.g., 1-5 MHz), because this frequency band is more sensitive to impedance changes caused by common metal corrosion and has a better signal-to-noise ratio. Next, the signal analysis module calculates the average reflection coefficient within this frequency band. This calculation can be performed using the following formula: ,in In order to reflect the signal energy of the echo from the corroded area, The energy of a reference signal (e.g., end reflection or theoretical total internal reflection from an intact portion of the grounding system). This is obtained by averaging measurements taken at multiple points within the suspected corrosion area. Finally, based on the pre-established empirical model, the calculated... Substitute the values ​​into the formula to estimate the corrosion rate. For example, an empirical formula can be obtained by fitting a large amount of experimental data: corrosion rate. If measured If the coefficient of corrosion is 0.62, the estimated corrosion rate is approximately 40%. This empirical model needs to be calibrated for specific materials and corrosion types to ensure the accuracy of the assessment. This method not only identifies corrosion defects but also quantifies their severity, providing data support for prioritizing maintenance decisions.

[0073] In another application scenario, grounding device defect detection methods can diagnose anomalies in the surrounding soil environment (such as cracks or cavities). The core principle lies in the dielectric constant of the soil. It is extremely sensitive to its moisture content, and the dielectric constant of dry soil or air ( ≈1-5) is much lower than that of moist soil ( >10). Therefore, by accurately inverting the dielectric constant around the defect location, it is possible to effectively diagnose whether there are cracks or cavities in the soil.

[0074] The specific process is as follows: After the signal analysis module locates a suspected defect location through time-domain analysis (such as STFT) (for example, in the 12.5-13.0 meter range), it will focus on performing frequency-domain analysis on the reflected signal at that location. This is done by calculating the reflection coefficient. The inversion algorithm is then executed to solve for the equivalent dielectric constant of the soil at that location. If the calculation result shows The value is abnormally low, for example, when an abnormally low value is detected. If the value is less than 4, the signal analysis module will determine that there is a crack or cavity at that location. Subsequently, the image generation module will mark a high-risk warning at the corresponding location on the heat map (12.5-13.0 meter section), for example, by highlighting it in dark red or black.

[0075] In a more complex application scenario, such as the inspection of large grounding grids in substations, the grounding device defect detection method can achieve simultaneous diagnosis of multiple defects.

[0076] Specifically, firstly, broadband transient excitation signals are synchronously injected onto multiple down conductors (e.g., 4-6) of the substation grounding grid using multiple signal injection modules. Numerous distributed sensing units, located at key nodes throughout the grounding grid, synchronously collect all response signals, forming a massive spatiotemporal data matrix. Upon receiving this data matrix, the signal analysis module first rapidly locates all significant reflection sources through STFT analysis. For example, it simultaneously locates three time delay peaks exhibiting energy abrupt changes. Next, the signal analysis module does not merely perform single-point inversion; instead, it combines the preset grounding grid topology and the location information of all sensors to run a ground potential tomography algorithm. This algorithm solves similar... The resistivity of the entire grounding grid coverage area can be reconstructed using a function of the function, or a more complex iterative inversion based on the Poisson equation. and dielectric constant The two-dimensional distribution maps are then combined. Finally, the image generation module synthesizes these two two-dimensional distribution maps into an overview two-channel heatmap. On this map, different defects are clearly presented with their unique spatial morphology and color characteristics. For example, point A... Point B appeared as a diffuse yellow area and was diagnosed as "water accumulation corrosion"; while point B ( This appears as a sharp black spot and is diagnosed as a "cavity." This parallel detection and imaging technology improves overall diagnostic efficiency compared to traditional point-by-point scanning methods.

[0077] The above are examples illustrating the grounding device defect detection method and system provided in this application under different application scenarios.

[0078] Finally, it should be noted that the grounding device defect detection method and system provided in this application can be widely used in the monitoring and maintenance of grounding system safety in various industries such as power, communications, and petrochemicals. For example, it can be used for the periodic inspection of grounding devices on transmission line towers, enabling rapid, non-contact detection of towers in remote mountainous areas by using a drone equipped with this system. It can also be used in online monitoring systems for critical facilities such as substations and power plants, achieving real-time monitoring and early warning of the grounding network's health status through fixedly installed distributed sensing units. In addition, this method also has significant application value for grounding continuity detection in rail transit systems such as railways and subways, as well as for the status assessment of lightning protection grounding systems of large buildings.

[0079] In one embodiment of this application, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0080] In one embodiment of this application, a computer-readable storage medium is also provided, storing a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0081] In one embodiment of this application, a computer program product is also provided, including a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0082] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM).

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for detecting defects in a grounding device, characterized in that, include: Inject a transient excitation signal into the grounding device; The transient response signal generated in the grounding device by the transient excitation signal is acquired; The transient response signal is subjected to dual-domain joint decoupling analysis, which includes: determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal, and retrieving the environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal. Based on the physical location of the defect and the environmental parameters, a visual image is generated to characterize the defect type.

2. The method for detecting defects in a grounding device according to claim 1, characterized in that, The transient excitation signal is a square wave signal modulated by a Gaussian window function.

3. The method for detecting defects in a grounding device according to claim 2, characterized in that, The pulse width of the square wave signal is between 10 ns and 1 μs and the rise time is no more than 100 ns.

4. The method for detecting defects in a grounding device according to claim 1, characterized in that, Determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal specifically includes: The transient response signal is subjected to a short-time Fourier transform (STFT) to obtain a time spectrum, and the physical location of the defect is determined based on the phase abrupt change points in the time spectrum.

5. The method for detecting defects in a grounding device according to claim 1, characterized in that, The environmental parameters include the dielectric constant and / or resistivity of the soil.

6. The method for detecting defects in a grounding device according to claim 5, characterized in that, Based on the reflection characteristics of the transient response signal, environmental parameters of the soil surrounding the physical location of the defect are inferred, specifically including: The reflection coefficient is calculated based on the transient response signal, and the dielectric constant and / or resistivity of the soil are inferred from the reflection coefficient.

7. The method for detecting defects in a grounding device according to claim 1, characterized in that, The environmental parameters include the dielectric constant and resistivity of the soil; Based on the physical location of the defect and the environmental parameters, a visual image is generated to characterize the defect type, specifically including: At the physical location of the defect, the resistivity is mapped to a first color channel of a color space, and the dielectric constant is mapped to a second color channel of the same color space to synthesize a dual-channel thermogram characterizing the defect type.

8. A grounding device defect detection system, characterized in that, include: A signal injection module is used to inject transient excitation signals into the grounding device; The signal acquisition module is used to acquire the transient response signal generated in the grounding device by the transient excitation signal; The signal analysis module is used to perform dual-domain joint decoupling analysis on the transient response signal. The dual-domain joint decoupling analysis includes: determining the physical location of the defect in the grounding device based on the propagation characteristics of the transient response signal, and retrieving the environmental parameters of the soil surrounding the physical location of the defect based on the reflection characteristics of the transient response signal. An image generation module is used to generate a visual image that characterizes the type of defect based on the physical location of the defect and the environmental parameters.

9. A computer device, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that the processor executes the computer program to implement the grounding device defect detection method according to any one of claims 1-7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the grounding device defect detection method according to any one of claims 1-7.

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