A method and system for testing electronic component quality defects

Abstract

The application discloses an electronic component quality defect testing method and system, and relates to the technical field of quality testing, and comprises the following steps: obtaining a first drawing circle according to a historical target value; obtaining a first screening threshold and a second screening threshold according to the historical target value and the first drawing circle; obtaining a first corresponding function according to a historical temperature and the first screening threshold; obtaining a second corresponding function according to the historical temperature and the second screening threshold; obtaining a first real-time normal threshold according to a real-time comparison temperature and the first corresponding function; obtaining a second real-time normal threshold according to the real-time comparison temperature and the second corresponding function; judging whether the quality of the electronic component appears defects through a real-time target value, the first real-time normal threshold and the second real-time normal threshold; and the application is used for solving the problem that data acquisition and quality normal threshold acquisition under different temperatures are inaccurate in the prior art, thereby causing inaccurate subsequent quality defect testing.

Description

Technical Field

[0001] This invention relates to the field of quality testing technology, specifically to a method and system for testing quality defects in electronic components. Background Technology

[0002] Electronic components are the basic building blocks of electronic circuits. They usually exist in individual packages and are interconnected by leads or metal contacts to form electronic circuits with specific functions. As the basic building blocks of electronic devices, the performance of electronic components is directly related to the stability of the entire system. Any tiny defect in a component may cause the entire system to malfunction, so it is necessary to conduct quality defect testing on electronic components.

[0003] Existing electronic component quality defect testing methods include: static DC parameter testing, AC LCR impedance parameter testing, and high voltage withstand insulation testing. Among these, static DC parameter testing requires maintaining a specific temperature for some electronic components. If the temperature is different, the parameter acquisition will be offset, and the corresponding normal quality threshold will also be offset. In addition, data fluctuations will occur during data acquisition, resulting in inaccurate quality defect testing. In existing technologies, data acquisition and the acquisition of normal quality thresholds at different temperatures are inaccurate, leading to inaccurate subsequent quality defect testing. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in the prior art. It obtains historical temperature and historical target values ​​from a target electronic component; obtains a first plotted circle based on the historical target values; obtains a first screening threshold and a second screening threshold based on the historical target values ​​and the first plotted circle; obtains a first correspondence function based on the historical temperature and the first screening threshold; obtains a second correspondence function based on the historical temperature and the second screening threshold; obtains a real-time target value and a real-time reference temperature from the electronic component to be tested; obtains a first real-time normal threshold based on the real-time reference temperature and the first correspondence function; obtains a second real-time normal threshold based on the real-time reference temperature and the second correspondence function; and determines whether the electronic component has quality defects based on the real-time target value, the first real-time normal threshold, and the second real-time normal threshold. This solves the problem in the prior art where inaccurate data acquisition and the acquisition of normal quality thresholds at different temperatures lead to inaccurate subsequent quality defect testing.

[0005] To achieve the above objectives, this application provides a method for testing quality defects in electronic components, comprising the following steps:

[0006] Step S100: Obtain historical temperature and historical target value through target electronic components; obtain a first drawing circle based on historical target value; obtain a first filtering threshold and a second filtering threshold based on historical target value and first drawing circle;

[0007] Step S200: Obtain a first corresponding function based on historical temperature and a first screening threshold; obtain a second corresponding function based on historical temperature and a second screening threshold;

[0008] Step S300: Obtain the real-time target value and real-time reference temperature through the electronic component to be detected; obtain the first real-time normal threshold based on the real-time reference temperature and the first corresponding function; obtain the second real-time normal threshold based on the real-time reference temperature and the second corresponding function.

[0009] Step S400: Determine whether there is a defect in the quality of the electronic component by using the real-time target value, the first real-time normal threshold, and the second real-time normal threshold.

[0010] Furthermore, step S100 also includes the following sub-steps:

[0011] Obtain the ambient temperature during the electronic component test and mark it as the historical temperature; apply rated DC to the target electronic component and then obtain the corresponding quality qualified test data of the target electronic component and mark it as the historical target value;

[0012] Obtain the first number of historical target values ​​under the same historical temperature.

[0013] Furthermore, step S100 also includes the following sub-steps:

[0014] Establish a Cartesian coordinate system, labeled as the first plane coordinate system;

[0015] Obtain a coordinate point in the first quadrant of the first plane coordinate system and mark it as the first starting coordinate point;

[0016] Define the length relationship in the first plane coordinate system corresponding to the historical target values, and mark it as the real-time transformation relationship;

[0017] By transforming the historical target values ​​in real time, the length corresponding to the first plane coordinate system is marked as the first transformation length.

[0018] Using the first starting coordinate point as the center, draw line segments of the first transformation length in each 360° direction around it, and mark them as the first transformation line segments; obtain the other endpoint of each first transformation line segment that is not the first starting coordinate point, and mark it as the first transformation point;

[0019] Let the first data function be: (x1-a1) 2 +(y1-a2) 2 =r 2 Where x1 represents the horizontal axis value of the first plane coordinate system, y1 represents the vertical axis value of the first plane coordinate system, and a1, a2, and r are constants to be fitted to the first data function;

[0020] The first transformation point is fitted with a first data function to obtain a1, a2 and r as specific values ​​of the first data function, and is marked as the first drawing circle.

[0021] Furthermore, step S100 also includes the following sub-steps:

[0022] Find the first transformation point that is closest to the first starting coordinate point and mark it as the second transformation point;

[0023] Obtain the straight line passing through the first starting coordinate point and the second transformation point, and mark it as the first target straight line;

[0024] Obtain the closest distance from the second conversion point to the first drawn circle, and mark it as the first data distance;

[0025] Starting from the second conversion point, draw a line segment twice the first data distance on the first target line in the direction outward from the first drawing circle, and mark it as the first set line segment;

[0026] Obtain the end point of the first defined line segment and mark it as the first search point;

[0027] Draw a circle with the first starting coordinate point as the center and passing through the second transformation point, and mark it as the second drawn circle;

[0028] Then, the first transformation point on or inside the second drawing circle is marked as the first target point;

[0029] Obtain the first target point that is farthest from the first starting coordinate point and mark it as the second target point;

[0030] Obtain the historical target value corresponding to the second target point and mark it as the first filtering threshold.

[0031] Furthermore, step S100 also includes the following sub-steps:

[0032] Obtain the straight line passing through the first starting coordinate point and the second target point, and mark it as the second target line;

[0033] Obtain the closest distance from the second target point to the first drawn circle, and mark it as the second data distance;

[0034] Starting from the second target point, draw a line segment twice the second data distance on the straight line of the second target point in the direction of the center of the first drawn circle, and mark it as the second set line segment;

[0035] Obtain the end point of the second defined line segment and mark it as the second search point;

[0036] Draw a circle with the first starting coordinate point as the center and passing through the second search point, and mark it as the third drawn circle;

[0037] Then, the first transformation point on or outside the third drawing circle is marked as the third target point;

[0038] Obtain the third target point that is closest to the first starting coordinate point and mark it as the fourth target point;

[0039] Obtain the historical target value corresponding to the fourth target point and mark it as the second filtering threshold;

[0040] Obtain the first and second filtering thresholds corresponding to different historical temperatures.

[0041] Furthermore, step S200 also includes the following sub-steps:

[0042] A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the first screening threshold as the vertical axis value, and it is marked as the first corresponding coordinate system.

[0043] Obtain the coordinates of the historical temperature and the corresponding first filtering threshold as the x-axis and y-axis points, respectively, and mark them as the first corresponding coordinate points;

[0044] Plot all the first corresponding coordinate points in the first corresponding coordinate system, perform polynomial fitting on all the first corresponding coordinate points to obtain the function, and mark it as the first corresponding function.

[0045] Furthermore, step S200 also includes the following sub-steps:

[0046] A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the second screening threshold as the vertical axis value, and it is marked as the second corresponding coordinate system.

[0047] Obtain the coordinates of the historical temperature and the corresponding second filtering threshold as the x-axis and y-axis points, respectively, and mark them as the second corresponding coordinate points;

[0048] Plot all the second corresponding coordinate points in the second corresponding coordinate system, perform polynomial fitting on all the second corresponding coordinate points to obtain the function, and label it as the second corresponding function.

[0049] Furthermore, step S300 also includes the following sub-steps:

[0050] A rated DC current is applied to the electronic component to be tested, and then the test data corresponding to the electronic component to be tested is acquired and marked as the real-time target value.

[0051] Obtain the temperature of the environment where the electronic component to be tested is located and mark it as the real-time reference temperature;

[0052] Substitute the real-time reference temperature into the first corresponding function to obtain the vertical axis value, which is marked as the first real-time normal threshold.

[0053] Substitute the real-time reference temperature into the second corresponding function to obtain the vertical axis value, which is then marked as the second real-time normal threshold.

[0054] Further, step S400 includes the following steps:

[0055] Determine whether the real-time target value is within the range of the second real-time normal threshold to the first real-time normal threshold. If it is, the electronic component quality test result is normal; otherwise, the electronic component quality test result is abnormal.

[0056] This application also provides an electronic component quality defect testing system, including: a historical data acquisition module, a function acquisition module, a real-time data acquisition module, and a quality judgment module;

[0057] The historical data acquisition module is used to acquire historical temperature and historical target value through target electronic components; acquire a first drawing circle based on the historical target value; and acquire a first filtering threshold and a second filtering threshold based on the historical target value and the first drawing circle.

[0058] The function acquisition module is used to acquire a first corresponding function based on historical temperature and a first filtering threshold; and to acquire a second corresponding function based on historical temperature and a second filtering threshold.

[0059] The real-time data acquisition module is used to acquire real-time target values ​​and real-time reference temperatures through the electronic components to be detected; to acquire a first real-time normal threshold based on the real-time reference temperature and a first corresponding function; and to acquire a second real-time normal threshold based on the real-time reference temperature and a second corresponding function.

[0060] The quality judgment module is used to determine whether there are defects in the quality of electronic components by using real-time target values, a first real-time normal threshold, and a second real-time normal threshold.

[0061] The beneficial effects of this invention are as follows: This invention obtains historical temperature and historical target value of the target electronic component; obtains a first drawing circle based on the historical target value; obtains a first screening threshold and a second screening threshold based on the historical target value and the first drawing circle; obtains a first correspondence function based on the historical temperature and the first screening threshold; obtains a second correspondence function based on the historical temperature and the second screening threshold; obtains real-time target value and real-time reference temperature of the electronic component to be tested; obtains a first real-time normal threshold based on the real-time reference temperature and the first correspondence function; obtains a second real-time normal threshold based on the real-time reference temperature and the second correspondence function; and determines whether the electronic component has quality defects by using the real-time target value, the first real-time normal threshold, and the second real-time normal threshold. The advantage is that it obtains accurate quality normal thresholds at different temperatures, improving the accuracy of quality defect testing.

[0062] This invention obtains a first screening threshold and a second screening threshold based on historical target values ​​and a first drawn circle. The advantage is that by filtering out data with abnormal fluctuations that are too large or too small through the first drawn circle, the accuracy of obtaining normal quality thresholds is improved, thereby improving the accuracy of subsequent quality defect testing. Attached Figure Description

[0063] Figure 1 This is a schematic diagram of the system of the present invention;

[0064] Figure 2 This is a schematic diagram of the second and fourth target points of the present invention;

[0065] Figure 3 This is a schematic diagram of the first corresponding function of the present invention;

[0066] Figure 4 This is a schematic diagram of the second corresponding function of the present invention;

[0067] Figure 5 This is a flowchart of the steps of the method of the present invention. Detailed Implementation

[0068] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] Example 1, please refer to Figure 1 As shown, this application provides an electronic component quality defect testing system, including: a historical data acquisition module, a function acquisition module, a real-time data acquisition module, and a quality judgment module;

[0070] The historical data acquisition module is used to acquire historical temperature and historical target values ​​through target electronic components; to acquire a first drawing circle based on the historical target values; and to acquire a first filtering threshold and a second filtering threshold based on the historical target values ​​and the first drawing circle.

[0071] The historical data acquisition module is configured with historical data acquisition strategies, which include:

[0072] Acquire the ambient temperature during electronic component testing and mark it as historical temperature; apply rated DC to the target electronic component and then acquire the corresponding quality-compliant test data of the target electronic component and mark it as historical target value; suitable for electronic components for static DC parameter testing, such as electronic components that are 10kΩ chip resistors;

[0073] Acquire a first number of historical target values ​​at the same historical temperature; for example, the first number is 100; the range of historical target values ​​is convenient for acquisition; the range of historical target values ​​when the electronic components are of normal quality;

[0074] Establish a Cartesian coordinate system, labeled as the first plane coordinate system;

[0075] Obtain a coordinate point in the first quadrant of the first plane coordinate system and mark it as the first starting coordinate point;

[0076] Define the length relationship in the first plane coordinate system corresponding to the historical target values, and mark it as the real-time transformation relationship; for example, 1kΩ corresponds to 1cm.

[0077] By using real-time transformation relationships, the length corresponding to the historical target value in the first plane coordinate system is marked as the first transformation length; the size of the first transformation length represents the size of the historical target value.

[0078] Using the first starting coordinate point as the center, draw line segments of the first transformation length in each 360° direction and mark them as the first transformation line segments; obtain the other endpoint of each first transformation line segment that is not the first starting coordinate point and mark it as the first transformation point; the first transformation points are used to observe the distribution of historical target values;

[0079] Let the first data function be: (x1-a1) 2 +(y1-a2) 2 =r 2 Where x1 represents the horizontal axis value of the first plane coordinate system, y1 represents the vertical axis value of the first plane coordinate system, and a1, a2, and r are constants to be fitted to the first data function;

[0080] The first transformation point is fitted with a first data function to obtain a1, a2 and r as specific values. The first data function is marked as the first drawing circle; the first drawing circle represents the distribution pattern of historical target values.

[0081] In practical applications, please refer to [link / reference]. Figure 2 As shown, the first drawn circle is obtained.

[0082] Obtain the first transformation point that is closest to the first starting coordinate point and mark it as the second transformation point; the second transformation point represents the point corresponding to the minimum value of the historical target value collected.

[0083] Obtain the straight line passing through the first starting coordinate point and the second transformation point, and mark it as the first target straight line;

[0084] Obtain the closest distance from the second conversion point to the first drawn circle, and mark it as the first data distance; the first data distance represents the minimum value.

[0085] Starting from the second conversion point, draw a line segment twice the distance of the first data point on the first target line in the direction outward from the first drawing circle, and mark it as the first set line segment; because the normal historical target value is close to a value, the historical target value will fluctuate around this value; when there are many historical target values, the normal data historical target values ​​are symmetrical in the middle; therefore, the symmetry relationship of the first set line segment can be obtained when the default minimum value is normal.

[0086] Obtain the end point of the first defined line segment and mark it as the first search point;

[0087] Draw a circle with the first starting coordinate point as the center and passing through the second transformation point, and mark it as the second drawn circle;

[0088] Then, the first transformation point on or inside the second drawing circle is marked as the first target point; the first target point is the first transformation point after excluding historical target values ​​that are abnormally large.

[0089] Obtain the first target point that is farthest from the first starting coordinate point and mark it as the second target point;

[0090] Obtain the historical target value corresponding to the second target point and mark it as the first screening threshold; the initial maximum value of the first screening threshold.

[0091] Obtain the straight line passing through the first starting coordinate point and the second target point, and mark it as the second target line;

[0092] Obtain the closest distance from the second target point to the first drawn circle, and mark it as the second data distance;

[0093] Starting from the second target point, draw a line segment twice the second data distance on the straight line of the second target point in the direction of the center of the first drawn circle, and mark it as the second set line segment;

[0094] Obtain the end point of the second defined line segment and mark it as the second search point;

[0095] Draw a circle with the first starting coordinate point as the center and passing through the second search point, and mark it as the third drawn circle;

[0096] Then, the first transformation point on or outside the third drawing circle is marked as the third target point; the third target point is the first transformation point after excluding historical target values ​​that are abnormally small.

[0097] Obtain the third target point that is closest to the first starting coordinate point and mark it as the fourth target point;

[0098] Obtain the historical target value corresponding to the fourth target point and mark it as the second filtering threshold;

[0099] Obtain the first and second filtering thresholds corresponding to different historical temperatures; the first and second filtering thresholds respectively exclude individual abnormal noise data that are too large or too small.

[0100] The function acquisition module is used to obtain a first corresponding function based on historical temperature and a first filtering threshold; and to obtain a second corresponding function based on historical temperature and a second filtering threshold.

[0101] The function retrieval module is configured with a function retrieval strategy, which includes:

[0102] A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the first screening threshold as the vertical axis value, and it is marked as the first corresponding coordinate system.

[0103] Obtain the coordinates of the historical temperature and the corresponding first filtering threshold as the x-axis and y-axis points, respectively, and mark them as the first corresponding coordinate points;

[0104] Plot all the first corresponding coordinate points in the first corresponding coordinate system, perform polynomial fitting on all the first corresponding coordinate points to obtain a function, and mark it as the first corresponding function; the first corresponding function is the maximum value of the real-time target value when the electronic component is of normal quality at different temperatures;

[0105] In practical applications, for example, if the electronic component to be tested is a 10kΩ surface mount resistor, and the data to be tested is the resistance value, please refer to [link / reference needed]. Figure 3 The diagram shown illustrates the acquisition of the first corresponding function.

[0106] A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the second screening threshold as the vertical axis value, and it is marked as the second corresponding coordinate system.

[0107] Obtain the coordinates of the historical temperature and the corresponding second filtering threshold as the x-axis and y-axis points, respectively, and mark them as the second corresponding coordinate points;

[0108] Plot all the second corresponding coordinate points in the second corresponding coordinate system, perform polynomial fitting on all the second corresponding coordinate points to obtain a function, and mark it as the second corresponding function; the second corresponding function is the minimum real-time target value when the electronic component is of normal quality at different temperatures;

[0109] In practical applications, for example, if the electronic component to be tested is a 10kΩ surface mount resistor, and the data to be tested is the resistance value, please refer to [link / reference needed]. Figure 4 The diagram shown is a schematic of the second corresponding function obtained.

[0110] The real-time data acquisition module is used to acquire real-time target values ​​and real-time reference temperatures through the electronic components to be detected; to acquire a first real-time normal threshold based on the real-time reference temperature and a first corresponding function; and to acquire a second real-time normal threshold based on the real-time reference temperature and a second corresponding function.

[0111] The real-time data acquisition module is configured with a real-time data acquisition strategy, which includes:

[0112] A rated DC current is applied to the electronic component to be tested, and then the test data corresponding to the electronic component to be tested is acquired and marked as the real-time target value.

[0113] Obtain the temperature of the environment where the electronic component to be tested is located and mark it as the real-time reference temperature;

[0114] Substitute the real-time reference temperature into the first corresponding function to obtain the vertical axis value, which is marked as the first real-time normal threshold; the maximum real-time target value corresponding to the normal mass at the real-time reference temperature.

[0115] Substitute the real-time reference temperature into the second corresponding function to obtain the vertical axis value, which is marked as the second real-time normal threshold; the minimum real-time target value corresponding to the normal mass at the real-time reference temperature.

[0116] In practical applications, for example, if the real-time target value is 9.92kΩ and the real-time control temperature is 10℃, substituting the real-time control temperature of 10℃ into the first corresponding function yields a vertical axis value of 10.12kΩ, then the first real-time normal threshold is 10.12kΩ; substituting the real-time control temperature of 10℃ into the second corresponding function yields a vertical axis value of 9.88kΩ, then the second real-time normal threshold is 9.88kΩ.

[0117] The quality judgment module is used to determine whether there are defects in the quality of electronic components by using real-time target values, a first real-time normal threshold, and a second real-time normal threshold.

[0118] The quality assessment module is configured with quality assessment strategies, which include:

[0119] Determine whether the real-time target value is within the range of the second real-time normal threshold to the first real-time normal threshold. If it is, the electronic component quality test result is normal; otherwise, the electronic component quality test result is abnormal.

[0120] In practical applications, if the real-time target value of 9.92kΩ is within the range of the second real-time normal threshold of 9.88kΩ to the first real-time normal threshold of 10.12kΩ, then the electronic component quality test is normal.

[0121] Example 2, please refer to Figure 5 As shown, this application provides a method for testing quality defects in electronic components, including the following steps:

[0122] Step S100 involves obtaining historical temperature and historical target values ​​through the target electronic components; obtaining a first drawing circle based on the historical target values; obtaining a first filtering threshold and a second filtering threshold based on the historical target values ​​and the first drawing circle; Step S100 also includes the following sub-steps:

[0123] Step S101: Obtain the ambient temperature during the electronic component test and mark it as the historical temperature; apply rated DC to the target electronic component, and then obtain the corresponding quality qualified test data of the target electronic component and mark it as the historical target value;

[0124] Step S102: Obtain the first number of historical target values ​​under the same historical temperature.

[0125] Step S103: Establish a Cartesian coordinate system and label it as the first plane coordinate system;

[0126] Step S104: Obtain a coordinate point in the first quadrant of the first planar coordinate system and mark it as the first starting coordinate point;

[0127] Step S105: Set the length relationship in the first plane coordinate system corresponding to the historical target values, and mark it as the real-time transformation relationship;

[0128] Step S106: Through real-time transformation relationship, the length corresponding to the historical target value in the first plane coordinate system is marked as the first transformation length;

[0129] Step S107: Using the first starting coordinate point as the center, draw line segments of the first transformation length in 360° directions around the center, and mark them as the first transformation line segments; obtain the other endpoint of each first transformation line segment that is not the first starting coordinate point, and mark it as the first transformation point;

[0130] Step S108: Set the first data function as: (x1-a1) 2 +(y1-a2) 2 =r 2 Where x1 represents the horizontal axis value of the first plane coordinate system, y1 represents the vertical axis value of the first plane coordinate system, and a1, a2, and r are constants to be fitted to the first data function;

[0131] Step S109: Fit the first transformation point with the first data function to obtain the first data function with specific values ​​a1, a2 and r, and mark it as the first drawing circle.

[0132] Step S110: Obtain the first transformation point that is closest to the first starting coordinate point and mark it as the second transformation point;

[0133] Step S111: Obtain the straight line passing through the first starting coordinate point and the second transformation point, and mark it as the first target straight line;

[0134] Step S112: Obtain the closest distance from the second conversion point to the first drawing circle, and mark it as the first data distance;

[0135] Step S113: Starting from the second conversion point, draw a line segment twice the first data distance on the first target line in the direction outward from the first drawing circle, and mark it as the first set line segment;

[0136] Step S114: Obtain the end point of the first set line segment and mark it as the first search point;

[0137] Step S115: Using the first starting coordinate point as the center, draw a circle through the second transformation point and mark it as the second drawn circle;

[0138] Step S116: Then, mark the first transformation point on or inside the second drawing circle as the first target point;

[0139] Step S117: Obtain the first target point that is farthest from the first starting coordinate point and mark it as the second target point;

[0140] Step S118: Obtain the historical target value corresponding to the second target point and mark it as the first screening threshold.

[0141] Step S119: Obtain the straight line passing through the first starting coordinate point and the second target point, and mark it as the second target line;

[0142] Step S120: Obtain the closest distance from the second target point to the first drawn circle, and mark it as the second data distance;

[0143] Step S121: Starting from the second target point, draw a line segment on the second target line that is twice the second data distance in the direction of the center of the first drawn circle, and mark it as the second set line segment.

[0144] Step S122: Obtain the end point of the second set line segment and mark it as the second search point;

[0145] Step S123: Using the first starting coordinate point as the center, draw a circle passing through the second search point and mark it as the third drawn circle;

[0146] Step S124, then mark the first transformation point on or outside the third drawing circle as the third target point;

[0147] Step S125: Obtain the third target point that is closest to the first starting coordinate point and mark it as the fourth target point;

[0148] Step S126: Obtain the historical target value corresponding to the fourth target point and mark it as the second filtering threshold;

[0149] Step S127: Obtain the first and second screening thresholds corresponding to different historical temperatures.

[0150] Step S200: Obtain a first corresponding function based on historical temperature and a first filtering threshold; obtain a second corresponding function based on historical temperature and a second filtering threshold; Step S200 also includes the following sub-steps:

[0151] Step S201: Establish a Cartesian coordinate system with historical temperature as the horizontal axis value and the first screening threshold as the vertical axis value, and mark it as the first corresponding coordinate system;

[0152] Step S202: Obtain the coordinates of the historical temperature and the corresponding first filtering threshold as the horizontal and vertical coordinates, and mark them as the first corresponding coordinate points;

[0153] Step S203: Plot all the first corresponding coordinate points in the first corresponding coordinate system, perform polynomial fitting on all the first corresponding coordinate points to obtain a function, and mark it as the first corresponding function.

[0154] Step S204: Establish a Cartesian coordinate system with historical temperature as the horizontal axis value and the second screening threshold as the vertical axis value, and mark it as the second corresponding coordinate system;

[0155] Step S205: Obtain the coordinates of the historical temperature and the corresponding second filtering threshold as the x-axis and y-axis, respectively, and mark them as the second corresponding coordinate points;

[0156] Step S206: Plot all the second corresponding coordinate points in the second corresponding coordinate system, perform polynomial fitting on all the second corresponding coordinate points to obtain a function, and mark it as the second corresponding function.

[0157] Step S300 involves obtaining the real-time target value and real-time reference temperature through the electronic component to be detected; obtaining a first real-time normal threshold based on the real-time reference temperature and a first correspondence function; obtaining a second real-time normal threshold based on the real-time reference temperature and a second correspondence function; step S300 further includes the following sub-steps:

[0158] Step S301: Apply rated DC to the electronic component to be tested, and then acquire the test data corresponding to the electronic component to be tested, and mark it as the real-time target value;

[0159] Step S302: Obtain the temperature of the environment where the electronic component to be tested is located and mark it as the real-time reference temperature;

[0160] Step S303: Substitute the real-time reference temperature into the first corresponding function to obtain the vertical axis value, and mark it as the first real-time normal threshold.

[0161] Step S304: Substitute the real-time reference temperature into the second corresponding function to obtain the vertical axis value, and mark it as the second real-time normal threshold.

[0162] Step S400 involves determining whether a defect has occurred in the electronic component's quality based on the real-time target value, the first real-time normal threshold, and the second real-time normal threshold. Step S400 also includes the following sub-steps:

[0163] Step S401: Determine whether the real-time target value is within the range of the second real-time normal threshold to the first real-time normal threshold. If yes, the electronic component quality test result is normal; otherwise, the electronic component quality test result is abnormal.

[0164] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product implemented on one or more computer-usable storage media containing computer-usable program code. The storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Red-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0165] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings or direct couplings or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

Claims

1. A method for testing quality defects in electronic components, characterized in that, Includes the following steps: Step S100: Obtain historical temperature and historical target value through target electronic components; obtain a first drawing circle based on historical target value; obtain a first filtering threshold and a second filtering threshold based on historical target value and first drawing circle; Step S200: Obtain a first corresponding function based on historical temperature and a first screening threshold; obtain a second corresponding function based on historical temperature and a second screening threshold; Step S300: Obtain the real-time target value and real-time reference temperature through the electronic component to be detected; obtain the first real-time normal threshold based on the real-time reference temperature and the first corresponding function; The second real-time normal threshold is obtained based on the real-time reference temperature and the second corresponding function; Step S400: Determine whether there is a defect in the quality of the electronic component by using the real-time target value, the first real-time normal threshold, and the second real-time normal threshold.

2. The method for testing quality defects in electronic components according to claim 1, characterized in that, Step S100 also includes the following sub-steps: Obtain the ambient temperature during the electronic component test and mark it as the historical temperature; apply rated DC to the target electronic component and then obtain the corresponding quality qualified test data of the target electronic component and mark it as the historical target value; Obtain the first number of historical target values ​​under the same historical temperature.

3. The method for testing quality defects in electronic components according to claim 2, characterized in that, Step S100 also includes the following sub-steps: Establish a Cartesian coordinate system, labeled as the first plane coordinate system; Obtain a coordinate point in the first quadrant of the first plane coordinate system and mark it as the first starting coordinate point; Define the length relationship in the first plane coordinate system corresponding to the historical target values, and mark it as the real-time transformation relationship; By transforming the historical target values ​​in real time, the length corresponding to the first plane coordinate system is marked as the first transformation length. Using the first starting coordinate point as the center, draw line segments of the first transformation length in each 360° direction around it, and mark them as the first transformation line segments; obtain the other endpoint of each first transformation line segment that is not the first starting coordinate point, and mark it as the first transformation point; Let the first data function be: (x1-a1) 2 +(y1-a2) 2 =r 2 Where x1 represents the horizontal axis value of the first plane coordinate system, y1 represents the vertical axis value of the first plane coordinate system, and a1, a2, and r are constants to be fitted to the first data function; The first transformation point is fitted with a first data function to obtain a1, a2 and r as specific values ​​of the first data function, and is marked as the first drawing circle.

4. The method for testing quality defects of electronic components according to claim 3, characterized in that, Step S100 also includes the following sub-steps: Find the first transformation point that is closest to the first starting coordinate point and mark it as the second transformation point; Obtain the straight line passing through the first starting coordinate point and the second transformation point, and mark it as the first target straight line; Obtain the closest distance from the second conversion point to the first drawn circle, and mark it as the first data distance; Starting from the second conversion point, draw a line segment twice the first data distance on the first target line in the direction outward from the first drawing circle, and mark it as the first set line segment; Obtain the end point of the first defined line segment and mark it as the first search point; Draw a circle with the first starting coordinate point as the center and passing through the second transformation point, and mark it as the second drawn circle; Then, the first transformation point on or inside the second drawing circle is marked as the first target point; Obtain the first target point that is farthest from the first starting coordinate point and mark it as the second target point; Obtain the historical target value corresponding to the second target point and mark it as the first filtering threshold.

5. The method for testing quality defects in electronic components according to claim 4, characterized in that, Step S100 also includes the following sub-steps: Obtain the straight line passing through the first starting coordinate point and the second target point, and mark it as the second target line; Obtain the closest distance from the second target point to the first drawn circle, and mark it as the second data distance; Starting from the second target point, draw a line segment twice the second data distance on the straight line of the second target point in the direction of the center of the first drawn circle, and mark it as the second set line segment; Obtain the end point of the second defined line segment and mark it as the second search point; Draw a circle with the first starting coordinate point as the center and passing through the second search point, and mark it as the third drawn circle; Then, the first transformation point on or outside the third drawing circle is marked as the third target point; Obtain the third target point that is closest to the first starting coordinate point and mark it as the fourth target point; Obtain the historical target value corresponding to the fourth target point and mark it as the second filtering threshold; Obtain the first and second filtering thresholds corresponding to different historical temperatures.

6. The method for testing quality defects of electronic components according to claim 5, characterized in that, Step S200 also includes the following sub-steps: A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the first screening threshold as the vertical axis value, and it is marked as the first corresponding coordinate system. Obtain the coordinates of the historical temperature and the corresponding first filtering threshold as the x-axis and y-axis points, respectively, and mark them as the first corresponding coordinate points; Plot all the first corresponding coordinate points in the first corresponding coordinate system, perform polynomial fitting on all the first corresponding coordinate points to obtain the function, and label it as the first corresponding function.

7. The method for testing quality defects of electronic components according to claim 6, characterized in that, Step S200 also includes the following sub-steps: A Cartesian coordinate system is established with historical temperature as the horizontal axis value and the second screening threshold as the vertical axis value, and it is marked as the second corresponding coordinate system. Obtain the coordinates of the historical temperature and the corresponding second filtering threshold as the x-axis and y-axis points, respectively, and mark them as the second corresponding coordinate points; Plot all the second corresponding coordinate points in the second corresponding coordinate system, perform polynomial fitting on all the second corresponding coordinate points to obtain the function, and label it as the second corresponding function.

8. The method for testing quality defects of electronic components according to claim 7, characterized in that, Step S300 also includes the following sub-steps: A rated DC current is applied to the electronic component to be tested, and then the test data corresponding to the electronic component to be tested is acquired and marked as the real-time target value. Obtain the temperature of the environment where the electronic component to be tested is located and mark it as the real-time reference temperature; Substitute the real-time reference temperature into the first corresponding function to obtain the vertical axis value, which is marked as the first real-time normal threshold. Substitute the real-time reference temperature into the second corresponding function to obtain the vertical axis value, which is then marked as the second real-time normal threshold.

9. The method for testing quality defects of electronic components according to claim 8, characterized in that, Step S400 includes the following steps: Determine whether the real-time target value is within the range of the second real-time normal threshold to the first real-time normal threshold. If it is, the electronic component quality test result is normal; otherwise, the electronic component quality test result is abnormal.

10. An electronic component quality defect testing system, used to implement the electronic component quality defect testing method according to any one of claims 1-9, characterized in that, include: Historical data acquisition module, function acquisition module, real-time data acquisition module, and quality judgment module; The historical data acquisition module is used to acquire historical temperature and historical target value through target electronic components; acquire a first drawing circle based on the historical target value; and acquire a first filtering threshold and a second filtering threshold based on the historical target value and the first drawing circle. The function acquisition module is used to acquire a first corresponding function based on historical temperature and a first filtering threshold; and to acquire a second corresponding function based on historical temperature and a second filtering threshold. The real-time data acquisition module is used to acquire real-time target values ​​and real-time reference temperatures through the electronic components to be detected; and to acquire a first real-time normal threshold based on the real-time reference temperature and a first corresponding function. The second real-time normal threshold is obtained based on the real-time reference temperature and the second corresponding function; The quality judgment module is used to determine whether there are defects in the quality of electronic components by using real-time target values, a first real-time normal threshold, and a second real-time normal threshold.

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