Chip test packaging method, controller, device, and medium

Abstract

The application discloses a chip testing packaging method, a controller, equipment and a storage medium, and relates to the technical field of chip testing. The method comprises the following steps: placing a to-be-tested chip in a placing groove of each testing fixture; adjusting the pressing degree of a pressing assembly according to the thickness of the to-be-tested chip, so that the to-be-tested chip is pressed by the pressing assembly and connected with a testing circuit board; testing the to-be-tested chip through the testing circuit board; acquiring the temperature of the to-be-tested chip through a temperature measuring assembly during the testing process; adjusting the heat dissipation gear of a heat dissipation assembly according to the temperature, and dissipating heat of the to-be-tested chip through the heat dissipation assembly; dissipating heat of the testing table through a heat dissipation mechanism; and after the testing is completed, performing ribbon packaging on the to-be-tested chip that passes the test through a packaging mechanism. The method can efficiently dissipate heat of the testing equipment and accurately control the pressing degree of the chip.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip testing packaging method, controller, device, and medium. Background Technology

[0002] Chip testing is a crucial part of the modern electronics industry, a key step in ensuring chip quality and performance. In chip testing, testing equipment evaluates the quality and reliability of chips by performing electrical and functional tests. When testing multiple chips simultaneously, the equipment can generate significant heat, which can negatively impact the chips and thus the final test results. Furthermore, ensuring a tight connection between the chip and the test circuit board is essential during testing. This typically requires clamping components to secure the chip; however, current clamping components struggle to accurately control the pressure applied, leading to either insufficient pressure causing unstable connections or excessive pressure damaging the chip. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a chip test packaging method, controller, device, and storage medium, which can efficiently dissipate heat from the test equipment and accurately control the downward pressure on the chip.

[0004] In a first aspect, a chip testing and packaging method according to an embodiment of the present invention is applied to a chip testing and packaging equipment. The chip testing and packaging equipment includes a testing mechanism and a packaging mechanism. The testing mechanism includes a testing platform, on which multiple testing fixtures are provided. Each testing fixture is provided with a placement slot, a clamping component, a test circuit board, a temperature measuring component, and a heat dissipation component. A heat dissipation vent is provided in the placement slot, and the heat dissipation vent communicates with the heat dissipation component. A heat dissipation mechanism is provided at the bottom of the testing platform, and the placement slot communicates with the test circuit board. The chip testing and packaging method includes: The chip to be tested is placed in the placement slot of each of the test fixtures; The clamping degree of the clamping component is adjusted according to the thickness of the chip under test, so that the clamping component presses the chip under test and connects the chip under test to the test circuit board. The chip under test is tested using the test circuit board. During the test, the temperature of the chip under test is obtained through the temperature measuring component; Based on the temperature, adjust the heat dissipation level of the heat dissipation component to dissipate heat from the chip under test. The heat dissipation mechanism dissipates heat from the test bench. After the test is completed, the tested chips are packaged by the packaging mechanism.

[0005] According to some embodiments of the present invention, the test fixture includes a base, on which the test circuit board is disposed, and on which the test circuit board is disposed a test seat; the clamping assembly includes: A mounting base is disposed on the test base, the mounting base has a placement slot, and the test base is provided with a conductive component that is electrically connected to the test circuit board at the position corresponding to the placement slot; A pressure seat is disposed within the mounting base; An adjusting seat is disposed within the pressure seat, the adjusting seat is provided with a threaded hole, and a pressure block is provided at the bottom of the adjusting seat; An adjusting screw, the lower end of which is threadedly connected to the threaded hole; A rotary block, wherein the upper end of the adjusting screw is connected to the rotary block, and a knob is provided on the surface of the rotary block; A rotating rod is located at the bottom of the rotating block; A rotating block is disposed between the pressure seat and the rotating block. The inner side of the rotating block is provided with a limiting groove to limit the rotation stroke of the rotating rod. The outer wall of the rotating block is provided with multiple slots. One side of the pressure seat is provided with a pressable block, which is adapted to the slot.

[0006] According to some embodiments of the present invention, one side of the pressure seat is hinged to one side of the mounting seat, and the other side of the pressure seat is snap-fitted to the other side of the mounting seat. The other side of the pressure seat is provided with a first hinge rod and a snap-fit ​​member. The first hinge rod passes through the middle of the snap-fit ​​member, and a first elastic member is provided between the upper part of the snap-fit ​​member and the pressure seat. The bottom of the snap-fit ​​member is provided with a snap-fit ​​block. The other side of the test seat is provided with a snap-fit ​​groove, and the snap-fit ​​block is used to snap-fit ​​with the snap-fit ​​groove. Placing the chip under test in the placement slot of each of the test fixtures includes: Press the upper part of the buckle to disengage the buckle block from the buckle groove, open the pressure seat, and release the upper part of the buckle; After placing the chip under test in the placement slot, press down the upper part of the latching component, cover the pressure seat, and then release the upper part of the latching component so that the latching block is engaged in the latching slot, thereby connecting the other side of the mounting base with the other side of the pressure seat.

[0007] According to some embodiments of the present invention, each of the test fixtures is provided with an adjustment frame and a pressing frame on its periphery. The adjustment frame is provided with a liftable rotating gripper, and the pressing frame is provided with a liftable pressing rod. A second hinge rod is provided on one side of the pressing base. The locking block includes a locking member and a pressing member. The locking member is disposed on the surface of the pressing member, and the second hinge rod passes through the pressing member. The step of adjusting the clamping degree of the clamping component according to the thickness of the chip under test, so that the clamping component presses against the chip under test, includes: The target slot of the rotating block is determined based on the thickness of the chip to be tested. The pressing rod descends and presses the pressing element, causing the locking element to leave the current locking slot; The rotating jaws open to a first preset angle and lower to clamp the rotating block, rotating the target slot of the rotating block to the position corresponding to the card. The rotating block is released and reset by the rotating gripper; The locking mechanism is released by the push rod rising and resetting, allowing it to engage with the target slot. The rotating jaws open to the second preset angle and lower to clamp the knob. Rotating the knob causes the pressure block to press down and hold the chip under test.

[0008] According to some embodiments of the present invention, the heat dissipation assembly includes a first heat dissipation fan, the first heat dissipation fan is disposed on the test base, the test base is provided with a heat dissipation channel, one side of the heat dissipation channel is connected to the heat dissipation port, and the other side of the heat dissipation channel is connected to the air outlet of the first heat dissipation fan. The step of adjusting the heat dissipation level of the heat dissipation component according to the temperature, and dissipating heat from the chip under test through the heat dissipation component, includes: When the temperature is less than the first preset threshold, the airflow of the first cooling fan is adjusted to the first level, so that the airflow of the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test. When the temperature is greater than the first preset threshold but less than the second preset threshold, the airflow of the first cooling fan is adjusted to the second level, so that the airflow of the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test. When the temperature exceeds the second preset threshold, the airflow of the first cooling fan is adjusted to the third level, so that the airflow from the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test.

[0009] According to some embodiments of the present invention, the bottom of the test bench is provided with a heat dissipation channel and a second heat dissipation fan, the surface of the heat dissipation channel is covered with a baffle plate, the second heat dissipation fan is located at one end of the heat dissipation channel, and the width of the heat dissipation channel gradually narrows from the end near the second heat dissipation fan to the end away from the second heat dissipation fan. The cooling of the test bench through the heat dissipation mechanism includes: Start the second cooling fan; The second cooling fan blows air into the heat dissipation channel, causing the air from the second cooling fan to flow along the heat dissipation channel and cool the test bench. During the blowing process of the second cooling fan, the baffle plate prevents the airflow of the second cooling fan from leaving the heat dissipation channel.

[0010] According to some embodiments of the present invention, the packaging mechanism includes a first conveyor belt, a pallet, a transfer robot, a second conveyor belt, a receiving rack, and a cover strip rack; wherein, the transfer robot is provided with multiple suction cups arranged side by side, multiple tension rollers are provided between the cover strip rack and the second conveyor belt, one of the target tension rollers is provided on a slider, the slider is provided on a slide rail, the slider is connected to a third elastic element, a heat sealing device is provided on the second conveyor belt, a first detection device is provided before the heat sealing device, a second detection device is provided after the heat sealing device, a carrier belt is placed on the second conveyor belt, a cover strip is provided on the cover strip rack, the carrier belt is provided with multiple mounting slots, and one end of the carrier belt is provided on the receiving rack; After the test is completed, the tested chips are packaged using the packaging mechanism, including: The tested chip is placed in the tray after passing the test; Once the tray is full of the chips to be tested, it is transported to the transfer robot via the first conveyor belt. The transfer robot uses multiple suction cups to pick up multiple chips under test and transfer them into the mounting slots of the carrier belt on the second conveyor belt. The carrier tape containing the chip to be tested passes through the first detection device via the second conveyor belt in conjunction with the receiving rack. The first detection device detects whether each chip under test is placed in the corresponding mounting slot. If so, the carrier tape containing the chip to be tested is passed through the heat sealing device by the second conveyor belt in conjunction with the take-up roll; The cover tape is brought into contact with the carrier tape at the heat sealing device by the tension roller in conjunction with the cover tape frame. The heat sealing device heat seals the carrier tape and the cover tape to form a roll. During each heat sealing, the slider pushes the target tension roller to reciprocate, thereby adjusting the tension of the cover tape. After heat sealing is completed, when the tape passes through the second detection device, the second detection device detects whether the cover tape and the carrier tape are properly heat sealed. If so, the tape is collected using the receiving rack.

[0011] In a second aspect, a controller according to an embodiment of the present invention includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, the instructions being executed by the at least one control processor to enable the at least one control processor to perform the chip test packaging method as described in the first aspect embodiment.

[0012] Thirdly, an electronic device according to an embodiment of the present invention includes the controller described in the second aspect embodiment.

[0013] Fourthly, according to an embodiment of the present invention, the storage medium stores computer-executable instructions for causing a computer to perform the chip testing and packaging method described in the first aspect embodiment.

[0014] The chip testing packaging method, controller, device, and storage medium according to embodiments of the present invention have at least the following beneficial effects: through the cooperation of heat dissipation components and heat dissipation mechanisms, efficient heat dissipation of the testing mechanism can be achieved. At the same time, according to the thickness of the chip under test, the pressing degree of the pressing component on the chip under test can be accurately controlled, ensuring a stable connection between the chip under test and the test circuit board while avoiding damage to the chip under test.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flowchart illustrating the steps of a chip testing and packaging method according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the testing mechanism according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the testing mechanism from another perspective in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the test fixture according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the test fixture from another perspective according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the test fixture according to an embodiment of the present invention with the rotating block and knob removed; Figure 7 This is a schematic diagram of the test fixture according to an embodiment of the present invention with the pressure seat removed; Figure 8 This is a schematic diagram of the test fixture according to an embodiment of the present invention with the first cooling fan hidden. Figure 9 This is a schematic diagram of the material feeding and packaging mechanism according to an embodiment of the present invention. Detailed Implementation

[0017] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0018] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0019] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0020] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0021] This invention provides a chip testing and packaging method, controller, device, and medium. Through the cooperation of heat dissipation components and heat dissipation mechanisms, efficient heat dissipation of the testing mechanism can be achieved. At the same time, the pressing degree of the pressing component on the chip under test can be accurately controlled according to the thickness of the chip under test, ensuring a stable connection between the chip under test and the test circuit board while avoiding damage to the chip under test.

[0022] The chip testing and packaging method, controller, device, and medium of the present invention will now be described in detail with reference to the accompanying drawings.

[0023] On one hand, embodiments of the present invention propose a chip testing and packaging method, which is applied to chip testing and packaging equipment, such as... Figure 2 and Figure 9 As shown, the chip testing and packaging equipment includes a testing mechanism 100 and a packaging mechanism 400. The testing mechanism 100 includes a testing table 110, on which multiple testing fixtures 200 are mounted, such as... Figures 3 to 8 As shown, each test fixture 200 is provided with a placement slot 2411, a clamping assembly 240, a test circuit board 220, a temperature measuring assembly (not shown), and a heat dissipation assembly 250. A heat dissipation vent (not shown) is provided in the placement slot 2411, and the vent communicates with the heat dissipation assembly 250. A heat dissipation mechanism 260 is provided at the bottom of the test platform 110. (As shown...) Figure 1 As shown, the chip testing and packaging method of this application embodiment includes the following steps: Step S100: Place the chip to be tested in the placement slot 2411 of each test fixture 110; Step S200: Adjust the clamping degree of the clamping component 240 according to the thickness of the chip under test, so that the clamping component 240 presses the chip under test, and connects the chip under test to the test circuit board 220. Step S300: Test the chip under test using the test circuit board 220; Step S400: During the test, the temperature of the chip under test is obtained through the temperature sensing component; Step S500: Adjust the heat dissipation level of the heat dissipation component 250 according to the temperature, and dissipate heat from the chip under test through the heat dissipation component 250. Step S600: Heat the test bench 110 through the heat dissipation mechanism 260; Step S700: After the test is completed, the tested chips are packaged by the packaging mechanism 400.

[0024] Specifically, in this application, any number of test fixtures 200 can be set on the test bench 110, and the specific number of test fixtures 200 can be set according to actual needs. For example... Figure 6 and Figure 7 As shown, each test fixture 200 can be provided with two mounting slots 2411, each of which can hold one chip under test (DUT). This allows a single test circuit board 220 to connect two DUTs simultaneously. For scenarios requiring the simultaneous mounting of two DUTs, this test fixture 200 can test the consistency of two DUTs mounted on the same test circuit board 220.

[0025] When performing chip testing, a chip under test (DUT) is placed in each mounting slot 2411 of each test fixture 200. Then, the clamping force of the clamping component 240 is adjusted according to the thickness of the DUT to ensure it firmly presses against the chip. By obtaining the thickness of the DUT and adjusting the clamping force of the clamping component 240 accordingly, the pressure level of the clamping component 240 can be accurately controlled for DUTs of different thicknesses. This ensures that after the clamping component 240 presses against the DUT, it guarantees a stable connection between the DUT and the test circuit board 220 without damaging the DUT. It should be noted that before chip testing, the appropriate pressure level of the clamping component 240 for different DUT thicknesses can be determined through pre-testing. This allows for quick adjustment of the pressure level of the clamping component 240 based on the DUT thickness. After the clamping component 240 has clamped the DUT, the chip can be tested through the test circuit board 220.

[0026] During testing, to avoid excessive heat generation and high temperatures, the temperature of the chip under test (DUT) needs to be monitored in real time using a temperature sensing component, which can be a temperature sensor or other element. When excessive temperature is detected, heat dissipation is achieved through the heat dissipation component 250. It should be noted that each test fixture 200 is equipped with an individual heat dissipation component 250, which can dissipate heat from the DUT on that fixture 200. Simultaneously, a heat dissipation mechanism 260 is located at the bottom of the test bench 110, which dissipates heat from the entire test bench 110, quickly removing the heat generated during testing of the DUT. The combined use of the heat dissipation component 250 and the heat dissipation mechanism 260 achieves efficient heat dissipation. After testing, the tested DUTs are packaged using a packaging mechanism 400 for subsequent shipping.

[0027] The chip testing and packaging method according to the embodiments of this application can achieve efficient heat dissipation of the testing mechanism 100, and at the same time, accurately control the pressing degree of the clamping component 240 on the chip under test, ensuring a stable connection between the chip under test and the testing circuit board 220 while avoiding damage to the chip under test.

[0028] In some embodiments of this application, such as Figures 5 to 8 As shown, the test fixture 200 includes a base 210 and a test seat 230; wherein, the test circuit board 220 is disposed on the base 210, and the test seat 230 is disposed on the test circuit board 220. The clamping assembly 240 includes a mounting base 241, a pressure seat 242, an adjusting seat 247, an adjusting screw 248, a rotating block 243, a rotating rod 249, and a rotating block 245; wherein, the mounting base 241 is disposed on the test seat 230, and the mounting base 241 has a placement groove 2411, and the test seat 230 is provided with a conductive element (not shown) that is electrically connected to the test circuit board 220 at the position corresponding to the placement groove 2411; the pressure seat 242 is disposed on the mounting base 241, the adjusting seat 247 is disposed in the pressure seat 242, the adjusting seat 247 is provided with a threaded hole, and the pressure block 246 is disposed on the test circuit board 220. The bottom of the adjusting seat 247; the lower end of the adjusting screw 248 is threadedly connected to the threaded hole, and the upper end of the adjusting screw 248 is connected to the rotating block 243; the rotating rod 249 is located at the bottom of the rotating block 243; the rotating block 245 is located between the pressure seat 242 and the rotating block 243, and the inner side of the rotating block 245 is provided with a limiting groove 2410, which is used to limit the rotation stroke of the rotating rod 249. The outer wall of the rotating block 245 is provided with multiple slots 2416, and one side of the pressure seat 242 is provided with a pressable block 2415, which is adapted to the slots 2416. The surface of the rotating block 243 is provided with a knob 244.

[0029] Since the lower end of the adjusting screw 248 is threadedly connected to the threaded hole of the adjusting seat 247, and the upper end of the adjusting screw 248 is connected to the rotating block 243, rotating the rotating block 243 can cause the adjusting seat 247 to rise or fall via the adjusting screw 248. A knob 244 is provided on the surface of the rotating block 243, which can be turned to rotate the rotating block 243. Since the pressure block 246 is located at the bottom of the adjusting seat 247, when the adjusting seat 247 rises or falls, the pressure block 246 will also rise or fall accordingly. By controlling the rotation angle of the knob 244, the degree of descent of the pressure block 246 can be controlled. It should be noted that since each test fixture 200 has two mounting slots 2411, the bottom of the adjusting seat 247 is provided with two pressure blocks 246, each pressure block 246 corresponding to one mounting slot 2411. After placing the chip under test (DUT) in the mounting slot 2411, rotating the knob 244 rotates the rotating block 243, which in turn lowers the adjusting seat 247 via the adjusting screw 248. The adjusting seat 247 then lowers the pressure block 246, which presses the DUT firmly against the chip, allowing it to connect to the test circuit board 220 via a conductive component. The degree of pressure applied by the pressure block 246 depends on the thickness of the DUT.

[0030] In some embodiments of this application, one side of the pressure seat 242 is hinged to one side of the mounting seat 241, and the other side of the pressure seat 242 is snap-fitted to the other side of the mounting seat 241. The other side of the pressure seat 242 is provided with a first hinge rod 2413 and a snap-fit ​​member 2414. The first hinge rod 2413 passes through the middle of the snap-fit ​​member 2414, and a first elastic member 2412 is provided between the upper part of the snap-fit ​​member 2414 and the pressure seat 242. The bottom of the snap-fit ​​member 2414 is provided with a snap-fit ​​block (not shown). The other side of the mounting seat 241 is provided with a snap-fit ​​groove, and the snap-fit ​​block is used to snap-fit ​​with the snap-fit ​​groove. In this example, step S100 above: placing the chip to be tested in the placement slot 2411 of each test fixture 200 includes the following two steps: Step S110: Press the upper part of the buckle 2414 to make the buckle block leave the buckle groove, open the pressure seat 242, and release the upper part of the buckle 2414; Step S120: After placing the chip to be tested in the placement slot 2411, press the upper part of the buckle 2414, cover the pressure seat 242, and release the upper part of the buckle 2414 so that the buckle block is snapped into the buckle slot, thereby realizing the buckle connection between the other side of the mounting seat 241 and the other side of the pressure seat 242.

[0031] Specifically, in this example, one side of the pressure seat 242 is hinged to one side of the mounting base 241, and the other side of the pressure seat 242 is snap-fitted to the other side of the mounting base 241. To open the pressure seat 242, press the upper part of the snap-fit ​​member 2414 to release the snap-fit ​​connection between the pressure seat 242 and the mounting base 241, thus opening the pressure seat 242. At this time, the chip under test can be placed into the mounting slot 2411. After the chip under test is placed, close the pressure seat 242, so that the other side of the pressure seat 242 is snap-fitted to the other side of the mounting base 241, thereby fixing the pressure seat 242. After closing the pressure seat 242, adjust the knob 244 to press down the pressure block 246 onto the chip under test.

[0032] In some embodiments of this application, such as Figure 2 As shown, an adjustment frame 270 and a pressing frame 280 are arranged around each test fixture 200 on the test bench 110. The adjustment frame 270 is equipped with a height-adjustable rotating gripper 271, and the pressing frame 280 is equipped with a height-adjustable pressing rod 281. A second hinge rod 2419 is provided on one side of the pressing base 242, a locking block 2415 is provided on the surface of the pressing member 2418, the second hinge rod 2419 passes through the pressing member 2418, and a second elastic member 2420 is provided at the bottom of the pressing member 2418. In this example, the above step S200: adjusting the pressing degree of the pressing assembly 240 according to the thickness of the chip to be tested, so that the pressing assembly 240 presses the chip to be tested, includes the following steps: Step S210: Determine the target slot of the rotating block 245 according to the thickness of the chip to be tested; Step S220: Lower the pressing lever 281 and press the pressing member 2418 to make the locking block 2415 leave the current locking slot 2416; Step S230: Open the first preset angle by rotating the gripper 271 and lower the clamping block 245 to rotate the target slot of the rotating block 245 to the position corresponding to the clamping block 2415; Step S240: Control the rotating jaw 271 to release the rotating block 245 and reset it; Step S250: Press the lever 281 to rise and reset, release the locking block 2415, and let the locking block 2415 lock into the target slot; Step S260: Open the second preset angle by rotating the gripper 271 and lower the clamping knob 244. Rotate the knob 244 to press down the pressure block 246 and press down on the chip to be tested.

[0033] Specifically, since a limiting groove 2410 is provided on the inner side of the rotating block 245, and a rotating rod 249 is provided at the bottom of the rotating block 243, the limiting groove 2410 can be used to limit the rotational stroke of the rotating rod 249. Therefore, when the position of the rotating block 245 is changed, the position of the limiting groove 2410 will also change, and thus the rotational stroke of the rotating block 243 will also change. Multiple slots 2416 are provided on the outer wall of the rotating block 245. When a locking block 2415 is engaged in a slot 2416, the rotating block 245 can no longer rotate and will remain in a fixed position. Therefore, once the thickness of the chip under test is determined, the pressure level of the pressure block 246 is known, and thus the rotation stroke of the rotating block 243 is determined. To fix the rotation stroke of the rotating block 243, the pressing rod 281 is used to press the locking block 2415, causing the locking block 2415 to leave the slot 2416. At this time, the rotating block 245 can rotate. The rotating jaw 271 drives the rotating block 245 to rotate to the desired position. Then, the pressing rod 281 releases the locking block 2415, causing it to engage with the target slot, thus fixing the position of the rotating block 245. In this way, the rotation stroke of the rotating block 243 is also fixed. Finally, the jaw 271 is rotated to open to the second preset angle, and the clamping knob 244 is lowered. Rotating the knob 244 causes the pressure block 246 to drop to a preset height, pressing down on the chip under test. By setting the adjustment bracket 270 and the pressing bracket 280, the position of the rotating block 245 can be automatically adjusted according to the thickness of the chip under test, thereby limiting the rotation stroke of the knob 244 and controlling the pressing stroke of the pressing block 246. This ensures that the pressing stroke of the pressing block 246 is consistent for chips under test of the same thickness, avoiding different pressing degrees of different test fixtures due to adjustment errors.

[0034] In some embodiments of this application, the heat dissipation assembly 250 includes a first cooling fan 251, which is mounted on a test socket 230. The test socket 230 has a heat dissipation channel 252, one side of which communicates with a heat dissipation vent in the mounting slot 2411, and the other side of which communicates with the air outlet of the first cooling fan 251. In this example, step S500 above, which involves adjusting the heat dissipation level of the heat dissipation assembly 250 according to the temperature to dissipate heat from the chip under test, includes the following steps: Step S510: When the temperature is less than the first preset threshold, adjust the airflow of the first cooling fan 251 to the first level, so that the airflow of the first cooling fan 251 passes through the heat dissipation channel 252 and the heat dissipation port to dissipate heat from the chip under test. Step S520: When the temperature is greater than the first preset threshold but less than the second preset threshold, adjust the airflow of the first cooling fan 251 to the second level so that the airflow of the first cooling fan passes through the heat dissipation channel 252 and the heat dissipation port to dissipate heat from the chip under test. Step S530: When the temperature is greater than the second preset threshold, adjust the airflow of the first cooling fan 251 to the third level so that the airflow of the first cooling fan 251 passes through the heat dissipation channel 252 and the heat dissipation port to dissipate heat from the chip under test.

[0035] In this example, the first cooling fan 251 is set to have different speed levels. When the heat dissipation of the chip under test is low, the first cooling fan 251 can be set to the first speed level to save energy. As the heat dissipation of the chip under test gradually increases, the speed of the first cooling fan 251 is also gradually increased to ensure that the chip under test in the test fixture 200 can be effectively cooled.

[0036] In some embodiments of this application, such as Figure 3 As shown, the heat dissipation mechanism 260 includes a heat dissipation channel 262 and a second cooling fan 261. A baffle plate 130 is provided on the surface of the heat dissipation channel 262. The second cooling fan 261 is located at one end of the heat dissipation channel 262. The width of the heat dissipation channel 262 gradually narrows from the end near the second cooling fan 261 to the end away from the second cooling fan 261. In this example, step S600 above: dissipating heat from the test bench 110 through the heat dissipation mechanism 260 includes the following steps: Step S610: Start the second cooling fan 261; Step S620: The second cooling fan 261 blows air into the heat dissipation channel 262, so that the air from the second cooling fan 261 flows along the heat dissipation channel 262 to dissipate heat from the test bench 110. Step S630: During the blowing process of the second cooling fan 261, the airflow of the second cooling fan 261 is blocked from leaving the heat dissipation channel 262 by the baffle plate 263.

[0037] Specifically, the test bench 110 can be made of aluminum alloy, which has good heat dissipation performance. Meanwhile, to quickly dissipate heat from the test bench 110, a heat dissipation mechanism 260 is provided at the bottom of the test bench 110. The heat dissipation mechanism 260 includes a heat dissipation channel 262, a second cooling fan 261, and a baffle plate 263. When the second cooling fan 261 blows air along the heat dissipation channel 262, it can quickly dissipate heat through the heat dissipation channel 262. At the same time, the baffle plate 263 is provided on the surface of the heat dissipation channel 262 to ensure that the airflow from the second cooling fan 261 flows along the heat dissipation channel 262, improving the heat dissipation effect. In addition, since the width of the heat dissipation channel 262 gradually narrows from the end near the second cooling fan 261 to the end away from the second cooling fan 261, the airflow from the second cooling fan 261 will be more concentrated as it flows along the heat dissipation channel 262, ensuring the heat dissipation effect at the end of the heat dissipation channel 262 and preventing the airflow from the second cooling fan 261 from gradually weakening after traveling a long distance, thus affecting the heat dissipation effect.

[0038] In some embodiments of this application, the packaging mechanism 400 includes a first conveyor belt 410, a pallet 420, a transfer robot 430, a second conveyor belt 440, a receiving rack 450, and a cover strip rack 460. The transfer robot 430 has multiple suction cups 431 arranged side-by-side. Multiple tension rollers 470 are arranged between the cover strip rack 460 and the second conveyor belt 440. One target tension roller is mounted on a slider 471, which is mounted on a slide rail 472. The slider 471 is connected to a third elastic element 473. A heat-sealing device 480 is mounted on the second conveyor belt 440. A first detection device 490 is positioned before the heat-sealing device 480, and a second detection device 500 is positioned after the heat-sealing device 480. A carrier belt 600 is placed on the second conveyor belt 440, and a cover strip (not shown) is mounted on the cover strip rack 460. The carrier belt 600 has multiple mounting slots, and one end of the carrier belt 600 is mounted on the receiving rack 450. In this example, step S700 above: After the test is completed, the tested chip is packaged by the packaging mechanism 400, which includes the following steps: Step S710: Place the tested chip into the tray 420; Step S720: After the tray 420 is filled with the chip to be tested, the tray 420 is transferred to the transfer robot 430 via the first conveyor belt 410. Step S730: By using multiple suction cups 431 of the transfer robot 430, multiple chips to be tested are picked up each time and placed into the placement slot of the carrier tape 600 on the second conveyor belt 440; Step S740: The carrier tape 600 containing the chip to be tested passes through the first detection device 490 via the second conveyor belt 440 in conjunction with the receiving rack 450. Step S750: The first detection device 490 detects whether each chip under test is placed in the corresponding mounting slot; Step S760: If so, the carrier tape 600 containing the chip to be tested passes through the heat sealing device 480 via the second conveyor belt 440 in conjunction with the take-up roll. Step S770: The cover tape is brought into contact with the carrier tape 600 at the heat sealing device 480 by the cover tape frame 460 and the tension roller 470. Step S780: The carrier belt 600 and the cover belt are heat-sealed by the heat-sealing device 480 to form a roll. During each heat sealing, the target tension roller is pushed to reciprocate by the slider 471 to adjust the tension of the cover belt. Step S790: After heat sealing is completed, when the tape roll passes through the second detection device 500, the second detection device 500 detects whether the cover tape and the carrier tape 600 are properly heat sealed. Step S800: If so, the tape roll is collected by the take-up rack 450.

[0039] Specifically, after the testing unit 100 tests the chip under test, the tested chip is placed in the tray 420. After the tray 420 is full of chips under test, it is transported to the transfer robot 430 by the first conveyor belt 410. The transfer robot 430 drives multiple suction cups 431 to pick up multiple chips under test each time and place them into the mounting slots of the carrier belt 600 on the second conveyor belt 440. The second conveyor belt 440 and the receiving rack 450 drive the carrier belt 600 forward. When the carrier belt 600 passes the first detection device 490, the first detection device 490 performs visual inspection on the chips under test to check whether each chip under test is placed in the corresponding mounting slot. If a chip under test is found to be not accurately placed in the mounting slot, the transfer robot 430 puts the deviated chip under test back into the corresponding mounting slot or sounds an alarm to allow the operator to check. Simultaneously, when the chip under test has identification information, the first detection device 490 can also detect whether the identification information on the chip under test is accurate, preventing chips from different batches from being packaged on the same reel. After the first detection device 490 detects that there is no error, the carrier tape 600 continues to advance to the heat-sealing position 480. At the same time, the cover tape on the cover tape holder 460 also moves to the heat-sealing position 480 under the action of the tension roller 470 and the cover tape holder 460. The heat-sealing device 480 heat-seales the carrier tape 600 and the cover tape, so that the cover tape adheres to the carrier tape 600 to form a reel. Each time heat-sealing is performed, the target tension roller is pushed back and forth by the slider 471 to adjust the tension of the cover tape. This can prevent the cover tape from being pulled too far or jamming. At the same time, since the heat-sealing device 480 exerts a certain force on the cover tape when heat-sealing the cover tape and the carrier tape 600, pushing the cover tape to move can play a buffering role. After heat sealing, the tape roll is visually inspected by the second inspection device 500 to check for accurate heat sealing, cover misalignment, wrinkles, and indentations. If any issues are found, the machine needs to be adjusted to address them. If the second inspection device 500 detects no problems, the tape roll is collected by the take-up rack 450.

[0040] The chip testing and packaging method according to the embodiments of this application can achieve efficient heat dissipation of the testing mechanism 100, while accurately controlling the pressing degree of the clamping component 240 on the chip under test. This ensures a stable connection between the chip under test and the testing circuit board 220 while avoiding damage to the chip under test. After the test is passed, the packaging mechanism 400 can unload and package the tested chip under test. This method can realize automatic picking, conveying, testing, and packaging of the chip under test, saving labor costs for operators and improving chip testing efficiency.

[0041] Secondly, the present invention also provides a controller, comprising: The processor can be implemented using a general-purpose central processing unit (CPU), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to achieve the technical solutions provided in the embodiments of this application. The memory can be implemented in the form of read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory and called by the processor to execute the chip testing and packaging method of the embodiments of this application. Input / output interfaces are used to implement information input and output; The communication interface is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). A bus is used to transfer information between various components of a device, such as processors, memory, input / output interfaces, and communication interfaces. The processor, memory, input / output interfaces, and communication interfaces communicate with each other within the device via a bus.

[0042] Thirdly, embodiments of this application also provide an electronic device, including the controller described in the second aspect embodiment.

[0043] On the other hand, embodiments of the present invention also provide a storage medium, which is a computer-readable storage medium storing a computer program that, when executed by a processor, implements the chip testing and packaging method described above.

[0044] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0045] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Furthermore, while various exemplary embodiments and architectures have been described according to embodiments of this disclosure, those skilled in the art will recognize that many other modifications to the exemplary embodiments and architectures described herein are also within the scope of this disclosure.

[0046] The foregoing description, with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments, has described certain aspects of this disclosure. It should be understood that one or more blocks in the block diagrams and flowcharts, as well as combinations of blocks in the block diagrams and flowcharts, can be implemented by executing computer-executable program instructions, respectively. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not all need to be executed. Furthermore, additional components and / or operations beyond those shown in the blocks in the block diagrams and flowcharts may exist in some embodiments.

[0047] Therefore, blocks in block diagrams and flowcharts support combinations of means for performing a specified function, combinations of elements or steps for performing a specified function, and program instruction means for performing a specified function. It should also be understood that each block in a block diagram and flowchart, and combinations of blocks in block diagrams and flowcharts, can be implemented by a dedicated hardware computer system or a combination of dedicated hardware and computer instructions that performs a specific function, element, or step.

[0048] The program modules, applications, etc., described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0049] Software components can be coded using any of a variety of programming languages. An exemplary programming language could be a low-level programming language, such as assembly language associated with a specific hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language could be a higher-level programming language that is portable across multiple architectures. Software components including higher-level programming languages ​​may need to be converted into an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages ​​include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, a software component containing instructions from one of the above-described programming language examples can be executed directly by the operating system or other software components without first being converted into another form.

[0050] Software components can be stored as files or other data storage structures. Software components of similar type or related function can be stored together in a specific directory, folder, or library. Software components can be static (e.g., pre-defined or fixed) or dynamic (e.g., created or modified at runtime).

[0051] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A chip testing and packaging method, characterized in that, This invention relates to chip testing and packaging equipment, which includes a testing mechanism and a packaging mechanism. The testing mechanism includes a testing platform with multiple testing fixtures. Each testing fixture has a placement slot, a clamping component, a test circuit board, a temperature measuring component, and a heat dissipation component. The placement slot has a heat dissipation vent connected to the heat dissipation component. The bottom of the testing platform has a heat dissipation mechanism, and the placement slot is connected to the test circuit board. The chip testing and packaging method includes: The chip to be tested is placed in the placement slot of each of the test fixtures; The clamping degree of the clamping component is adjusted according to the thickness of the chip under test, so that the clamping component presses the chip under test and connects the chip under test to the test circuit board. The chip under test is tested using the test circuit board. During the test, the temperature of the chip under test is obtained through the temperature measuring component; Based on the temperature, adjust the heat dissipation level of the heat dissipation component to dissipate heat from the chip under test. The heat dissipation mechanism dissipates heat from the test bench. After the test is completed, the tested chips are packaged by the packaging mechanism.

2. The chip testing and packaging method according to claim 1, characterized in that, The test fixture includes a base, on which the test circuit board is disposed, and on which a test seat is disposed; the clamping assembly includes: A mounting base is disposed on the test base, the mounting base has a placement slot, and the test base is provided with a conductive component that is electrically connected to the test circuit board at the position corresponding to the placement slot; A pressure seat is disposed within the mounting base; An adjusting seat is disposed within the pressure seat, the adjusting seat is provided with a threaded hole, and a pressure block is provided at the bottom of the adjusting seat; An adjusting screw, the lower end of which is threadedly connected to the threaded hole; A rotary block, wherein the upper end of the adjusting screw is connected to the rotary block, and a knob is provided on the surface of the rotary block; A rotating rod is located at the bottom of the rotating block; A rotating block is disposed between the pressure seat and the rotating block. The inner side of the rotating block is provided with a limiting groove to limit the rotation stroke of the rotating rod. The outer wall of the rotating block is provided with multiple slots. One side of the pressure seat is provided with a pressable block, which is adapted to the slot.

3. The chip testing and packaging method according to claim 2, characterized in that, One side of the pressure seat is hinged to one side of the mounting seat, and the other side of the pressure seat is snapped to the other side of the mounting seat. The other side of the pressure seat is provided with a first hinge rod and a snap fastener. The first hinge rod passes through the middle of the snap fastener, and a first elastic element is provided between the upper part of the snap fastener and the pressure seat. The bottom of the snap fastener is provided with a snap fastener block. The other side of the test seat is provided with a snap fastener groove, and the snap fastener block is used to snap fasten to the snap fastener groove. Placing the chip under test in the placement slot of each of the test fixtures includes: Press the upper part of the buckle to disengage the buckle block from the buckle groove, open the pressure seat, and release the upper part of the buckle; After placing the chip under test in the placement slot, press down the upper part of the latching component, cover the pressure seat, and then release the upper part of the latching component so that the latching block is engaged in the latching slot, thereby connecting the other side of the mounting base with the other side of the pressure seat.

4. The chip testing and packaging method according to claim 2, characterized in that, Each of the test fixtures is provided with an adjustment frame and a pressing frame on its periphery. The adjustment frame is provided with a liftable rotating gripper, and the pressing frame is provided with a liftable pressing rod. A second hinge rod is provided on one side of the pressing base. The locking block is provided on the surface of the pressing member. The second hinge rod passes through the pressing member. A second elastic member is provided at the bottom of the pressing member. The step of adjusting the clamping degree of the clamping component according to the thickness of the chip under test, so that the clamping component presses against the chip under test, includes: The target slot of the rotating block is determined based on the thickness of the chip to be tested. The pressing rod is lowered and the pressing element is pressed, causing the locking block to leave the current locking slot; The rotating jaws open to a first preset angle and lower to clamp the rotating block, rotating the target slot of the rotating block to the position corresponding to the block. Control the rotating gripper to release the rotating block and reset; The pressing rod is raised and reset to release the locking block, allowing the locking block to engage with the target slot. The rotating jaws open to the second preset angle and lower to clamp the knob. Rotating the knob causes the pressure block to press down and hold the chip under test.

5. The chip testing and packaging method according to claim 1, characterized in that, The heat dissipation component includes a first cooling fan, which is disposed on the test base. The test base is provided with a heat dissipation channel, one side of which is connected to the heat dissipation port, and the other side of which is connected to the air outlet of the first cooling fan. The step of adjusting the heat dissipation level of the heat dissipation component according to the temperature, and dissipating heat from the chip under test through the heat dissipation component, includes: When the temperature is less than the first preset threshold, the airflow of the first cooling fan is adjusted to the first level, so that the airflow of the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test. When the temperature is greater than the first preset threshold but less than the second preset threshold, the airflow of the first cooling fan is adjusted to the second level, so that the airflow of the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test. When the temperature exceeds the second preset threshold, the airflow of the first cooling fan is adjusted to the third level, so that the airflow from the first cooling fan passes through the heat dissipation channel and the heat dissipation port to dissipate heat from the chip under test.

6. The chip testing and packaging method according to claim 1, characterized in that, The heat dissipation mechanism includes a heat dissipation channel and a second heat dissipation fan. The surface of the heat dissipation channel is covered with a baffle plate. The second heat dissipation fan is located at one end of the heat dissipation channel. The width of the heat dissipation channel gradually narrows from the end closer to the second heat dissipation fan to the end farther away from the second heat dissipation fan. The cooling of the test bench through the heat dissipation mechanism includes: Start the second cooling fan; The second cooling fan blows air into the heat dissipation channel, causing the air from the second cooling fan to flow along the heat dissipation channel and cool the test bench. During the blowing process of the second cooling fan, the baffle plate prevents the airflow of the second cooling fan from leaving the heat dissipation channel.

7. The chip testing and packaging method according to claim 1, characterized in that, The packaging mechanism includes a first conveyor belt, a pallet, a transfer robot, a second conveyor belt, a receiving rack, and a cover tape holder. The transfer robot has multiple suction cups arranged side-by-side. Multiple tension rollers are arranged between the cover tape holder and the second conveyor belt, with one target tension roller mounted on a slider. The slider is mounted on a slide rail and connected to a third elastic element. A heat-sealing device is mounted on the second conveyor belt. A first detection device is positioned before the heat-sealing device, and a second detection device is positioned after the heat-sealing device. A carrier belt is placed on the second conveyor belt, and a cover tape is mounted on the cover tape holder. The carrier belt has multiple mounting slots, and one end of the carrier belt is mounted on the receiving rack. After the test is completed, the tested chips are packaged using the packaging mechanism, including: The tested chip is placed in the tray after passing the test; Once the tray is full of the chips to be tested, it is transported to the transfer robot via the first conveyor belt. The transfer robot uses multiple suction cups to pick up multiple chips under test and transfer them into the mounting slots of the carrier belt on the second conveyor belt. The carrier tape containing the chip to be tested passes through the first detection device via the second conveyor belt in conjunction with the receiving rack. The first detection device detects whether each chip under test is placed in the corresponding mounting slot. If so, the carrier tape containing the chip to be tested is passed through the heat sealing device by the second conveyor belt in conjunction with the take-up roll; The cover tape is brought into contact with the carrier tape at the heat sealing device by the tension roller in conjunction with the cover tape frame. The heat sealing device heat seals the carrier tape and the cover tape to form a roll. During each heat sealing, the slider pushes the target tension roller to reciprocate, thereby adjusting the tension of the cover tape. After heat sealing is completed, when the tape passes through the second detection device, the second detection device detects whether the cover tape and the carrier tape are properly heat sealed. If so, the tape is collected using the receiving rack.

8. A controller, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the chip test packaging method as described in any one of claims 1 to 7.

9. An electronic device, characterized in that, Includes the controller as described in claim 8.

10. A storage medium, characterized in that, The storage medium stores computer-executable instructions for causing a computer to perform the chip testing and packaging method according to any one of claims 1-7.

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