A chip testing apparatus

Abstract

The application provides a chip testing device and relates to the technical field of chip testing. In the application, each conductive part is electrically connected with a corresponding receiving position, thereby being electrically connected with a negative electrode pad on the bottom surface of a corresponding measured chip, and a first driving part is used to synchronously drive the movement of a probe assembly and a docking part, so that the probe assembly is in contact with a positive electrode pad and the docking part is in contact with the conductive part at the same time, thereby establishing a complete testing loop, which can be applied to the testing of a chip with a negative electrode pad arranged on the bottom surface of the chip, and can ensure the synchronous establishment of positive and negative testing paths, thereby improving the stability of the establishment of the testing loop and the reliability of the chip testing. Meanwhile, the two receiving positions are switched between a loading and unloading station and a testing station by using a rotating disc, so that one receiving position can be tested while the other receiving position completes the loading and unloading, which is beneficial to improving the chip testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip testing device. Background Technology

[0002] With the increasing variety of chip packaging methods, the electrode layouts of different types of chips vary considerably. For some chips, both the positive and negative electrode pads are located on the top surface of the chip. Therefore, during testing, a complete test circuit can be established simply by using a probe assembly to contact each pad on the top surface of the chip, thus enabling the testing of the chip's electrical performance.

[0003] However, for another type of chip, the positive electrode pad is located on the top surface, while the negative electrode pad is located on the bottom surface. For this type of chip, if the testing method still relies solely on the probe assembly contacting the top surface, a reliable electrical connection cannot be established with the negative electrode pad on the bottom surface, making it difficult to form a complete test circuit and thus preventing chip testing. Therefore, it is necessary to design a corresponding conductive structure for chips with a negative electrode pad on the bottom surface to achieve an electrical connection between the testing instrument and the negative electrode pad on the bottom surface of the chip, ensuring a stable test circuit and meeting chip testing requirements. Summary of the Invention

[0004] The purpose of this invention is to provide a chip testing device that solves the technical problem in the prior art of making it difficult to establish a stable test circuit for chips with negative electrode pads located on the bottom surface of the chip.

[0005] Specifically, the present invention provides a chip testing device, comprising: A feeding device is used to feed the chip under test, wherein the chip under test has a positive electrode pad on the top surface and a negative electrode pad on the bottom surface. At least one testing device is provided, each of which includes a turntable, a testing mechanism, and a grounding component. The turntable has two opposite receiving positions for placing the chip under test (DUT), each electrically connected to the negative pad of the DUT. Under controlled rotation of the turntable, the positions of the two receiving positions are switched, thereby switching the DUT between a loading / unloading station and a testing station. The grounding component includes a docking member and two conductive members, each electrically connected to one of the receiving positions. The testing mechanism includes a first driving member and a probe assembly. The first driving member drives the probe assembly and the docking member to move synchronously vertically, causing the probe assembly to contact the positive pad of the DUT and the docking member to contact the corresponding conductive member. Both the probe assembly and the docking member are connected to a testing instrument, allowing the testing instrument to form a test circuit via the probe assembly, the DUT, the conductive member, and the docking member. The unloading device is used to unload the tested chip after it has completed the test; A transport device is used to transport the chip under test between the loading mechanism, the loading / unloading station of the testing device, and the unloading mechanism.

[0006] Optionally, the testing device further includes a base, and the testing mechanism further includes: A bracket is vertically slidably mounted on the base and located at the test station; both the probe assembly and the docking piece are mounted on the bracket. The first driving component is mounted on the base and connected to the bracket, and can controllably drive the bracket to move vertically, thereby driving the probe assembly and the docking component to move synchronously vertically.

[0007] Optionally, the testing facility further includes: At least one first adjustment component is mounted on the bracket, and each first adjustment component corresponds to one probe component for adjusting the position of the probe component in the first horizontal direction, the second horizontal direction, and the vertical direction, respectively.

[0008] Optionally, there are two of each of the first adjustment components and the probe components. The two first adjustment components are configured to adjust the position of the corresponding probe components so that the two probe components are at the same horizontal height and aligned.

[0009] Optionally, the testing facility further includes: The second adjustment component is mounted on the bracket and connected to the docking member, and is used to adjust the vertical position of the docking member.

[0010] Optionally, the testing facility further includes: A photodetector is used to collect light emitted from the first optical port of the chip under test during the testing process. The third adjustment component is mounted on the bracket and connected to the photodetector, and is used to adjust the vertical position of the photodetector.

[0011] Optionally, the testing apparatus further includes: A second driving member is mounted on the base, and the turntable is mounted on the second driving member and configured to rotate under the drive of the second driving member.

[0012] Optionally, the testing apparatus further includes: A cleaning component is mounted on the turntable and can move with the turntable to below the probe assembly. After the probe assembly moves downward until the test probe contacts the cleaning component, the second drive unit drives the turntable to rotate back and forth so that the cleaning component removes dirt from the test probe.

[0013] Optionally, each of the receiving positions is provided with a stage assembly, the stage assembly comprising: The stage body is used to place the chip under test; The fourth adjustment component is connected to the platform body and is used to adjust the position of the platform body in the first horizontal direction, the second horizontal direction, and the vertical direction.

[0014] Optionally, the conductive element is a copper block.

[0015] In this invention, each conductive element is electrically connected to its corresponding receiving position, thereby connecting to the negative electrode pad on the bottom surface of the chip under test. A first driving element synchronously drives the probe assembly and the contact element, ensuring that the probe assembly contacts the positive electrode pad while the contact element contacts the conductive element, thus establishing a complete test circuit. This invention is suitable for testing chips with negative electrode pads on the bottom surface and ensures the synchronous establishment of positive and negative test paths, improving the stability of the test circuit and the reliability of chip testing. Furthermore, a turntable switches the two receiving positions between the loading / unloading station and the testing station, allowing testing to be performed at one receiving position while loading / unloading is completed at the other, thus improving chip testing efficiency.

[0016] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0017] The following sections will describe some specific embodiments of the invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic top view of a chip testing device according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a testing device according to an embodiment of the present invention at one angle; Figure 3 This is a schematic structural diagram of a testing apparatus according to an embodiment of the present invention from another angle; Figure 4 This is a schematic structural diagram of a probe assembly, a docking device, and a photodetector according to an embodiment of the present invention; Figure 5This is a schematic structural diagram of a probe assembly and a grounding assembly according to an embodiment of the present invention; Figure 6 This is a schematic structural diagram of an opening and closing component according to an embodiment of the present invention.

[0018] Figure label: 100-Chip testing equipment, 10-Feeding device, 20-Transferring device, 30-Testing device, 40-Unloading device, 11-Backlight, 12-Gripper, 13-Feeding box, 14-Opening and closing assembly, 141-Third driving component, 142-Sliding plate, 143-Fourth driving component, 144-Door, 31-Testing mechanism, 311-Bracket, 312-First driving component, 313-Probe assembly, 314-First adjustment assembly, 315-Third adjustment assembly, 316-Photodetector, 32-Base, 33-Second driving component, 34-Receiving position, 35-Turntable, 36-Grounding assembly, 37-Cleaning assembly, 361-Grounding post, 362-Conductive component, 363-Connecting component, 364-Second adjustment assembly, 371-Mounting base, 372-Cleaning component. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0021] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0022] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] Figure 1 This is a schematic top view of a chip testing apparatus 100 according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of a testing apparatus 30 according to an embodiment of the present invention at one angle. Figure 3 This is a schematic structural diagram of the testing apparatus 30 according to an embodiment of the present invention from another angle. Figure 4 This is a schematic structural diagram of a probe assembly 313, a docking member 363, and a photodetector 316 according to an embodiment of the present invention. Figure 5 This is a schematic structural diagram of a probe assembly 313 and a grounding assembly 36 according to an embodiment of the present invention.

[0025] like Figures 1 to 5 As shown, in one specific embodiment, the chip testing equipment 100 includes a loading device 10, at least one testing device 30, an unloading device 40, and a conveying device 20. The loading device 10 is used to load the chip under test, which has a positive electrode pad on its top surface and a negative electrode pad on its bottom surface. Each testing device 30 includes a turntable 35, a testing mechanism 31, and a grounding component 36. The turntable 35 has two receiving positions 34 opposite each other for placing the chip under test, and both positions are electrically connected to the negative electrode pad of the chip under test. Under controlled rotation of the turntable 35, the positions of the two receiving positions 34 are switched, thereby driving the chip under test to switch between the loading / unloading station and the testing station.

[0026] The grounding component 36 includes a docking member 363 and two conductive members 362. Each conductive member 362 is disposed on one side of each receiving position 34 and is electrically connected to the corresponding receiving position 34. The probe component 313 moves synchronously with the docking member 363. When the probe component 131 is connected to the chip under test, it can drive the docking member 363 to connect with the conductive member 362, thereby electrically connecting to the negative electrode pad of the corresponding chip under test.

[0027] The testing mechanism 31 includes a first driving element 312 and a probe assembly 313. The first driving element 312 drives the probe assembly 313 and the docking piece 363 to move synchronously, so that the probe assembly 313 contacts the positive electrode pad of the chip under test, and the docking piece 363 contacts the corresponding conductive piece 362. Both the probe assembly 313 and the docking piece 363 are connected to the testing instrument, so that the testing instrument forms a test circuit through the probe assembly 313, the chip under test, the conductive piece 362, and the docking piece 363. The unloading device 40 is used to unload the chip under test after the test is completed. The conveying device 20 is used to convey the chip under test between the loading mechanism, the loading / unloading station of the testing mechanism 30, and the unloading mechanism. Here, the first driving element 312 is a motor.

[0028] In this embodiment, each conductive element 362 is electrically connected to its corresponding receiving position 34, thereby connecting to the negative electrode pad on the bottom surface of the chip under test. The first driving element 312 synchronously drives the probe assembly 313 and the contact element 363 to move, ensuring that the probe assembly 313 contacts the positive electrode pad while the contact element 363 contacts the conductive element 362, thus establishing a complete test circuit. This method is suitable for testing chips with negative electrode pads on the bottom surface of the chip, ensuring the synchronous establishment of positive and negative test paths, improving the stability of the test circuit and the reliability of chip testing. Simultaneously, the turntable 35 drives the two receiving positions 34 to switch between the loading / unloading station and the testing station, allowing testing to be performed on one receiving position 34 while loading / unloading is completed on the other, improving chip testing efficiency.

[0029] Meanwhile, in this embodiment, by setting the conductive elements 362 on one side of the corresponding receiving position 34, the closed loop through which the current flows can be shortened, thereby minimizing the negative effects of loop inductance (parasitic inductance) and improving the accuracy of the test.

[0030] In some embodiments, a stage assembly is provided on the receiving position 34, the stage assembly being used to place the chip under test (DUT). Specifically, the stage assembly includes a stage body and a fourth adjustment component. The stage body is used to place the DUT. The fourth adjustment component is connected to the stage body and is used to adjust the position of the stage body in a first horizontal direction, a second horizontal direction, and a vertical direction. The stage body is mounted by screws, and the screws are connected to the grounding post 361 via a grounding wire. When the DUT is placed on the stage body, the negative electrode pad of the DUT is electrically connected to the conductive element 362 through the stage body, the grounding wire, and the grounding post 361.

[0031] This embodiment, by setting a fourth adjustment component, can adjust the position of the stage body in two horizontal directions and in the vertical direction, thereby compensating for the installation error of the stage body, making the chip under test accurately located in the test position, and improving the test alignment accuracy.

[0032] In some embodiments, the stage body includes a temperature control component, which includes a thermoelectric cooler and a water-cooling module located below the thermoelectric cooler. The thermoelectric cooler and the water-cooling module are used to jointly adjust the test temperature of the chip under test.

[0033] This embodiment uses a semiconductor cooling chip to heat or cool the chip under test, and utilizes a water cooling module to remove the heat generated by the semiconductor cooling chip in a timely manner, thereby improving temperature control efficiency and accuracy. This enables the chip under test to be tested stably at the set temperature, improving the consistency and reliability of the test results.

[0034] In some embodiments, the loading device 10 further includes a positioning camera and a backlight 11 located at the visual inspection station. When the wafer is removed from the cassette and moved to the visual inspection station, the positioning camera is positioned above the wafer, and the backlight 11 is positioned below the wafer. The backlight 11 enables the wafer edge to form a clear outline, improving the positioning and recognition accuracy. Here, the wafer has multiple chips under test; it can be understood that the chip testing equipment 100 in this embodiment adopts a wafer loading method.

[0035] This embodiment enables the wafer to form a high-contrast imaging effect at the visual inspection station by setting up a positioning camera and a backlight 11, thereby improving the recognition accuracy of wafer edges and chip positions, providing an accurate position reference for subsequent handling and testing, and improving the reliability of automatic wafer loading.

[0036] In some embodiments, the number of testing devices 30 is two, one testing device 30 is used for room temperature and high temperature testing, and the other testing device 30 is used for low temperature testing. After the test is completed, the chips under test can be classified according to the test results, and chips under test with the same test results can be transported to the same blue film for sorting and unloading.

[0037] Figure 6 This is a schematic structural diagram of an opening / closing component 14 according to an embodiment of the present invention. Figure 6 As shown, and see Figures 1 to 5 In some embodiments, the loading mechanism further includes a loading box 13, grippers 12, and an opening / closing assembly 14. The grippers 12 are capable of removing the wafers from the loading box 13 and transporting them to the vision inspection station. See also Figure 1The dotted area indicated by A is the test area, which is a sealed environment and requires a dryness level of -45°C. The dotted area indicated by B is the storage area, i.e., the internal area of ​​the loading box 13. This storage area is also a sealed environment and is independent of the test area. During wafer loading, the opening / closing component 14 needs to be switched to the open state so that the grippers 12 can reach into the storage area to grab the wafer and move it into the test area. Afterward, the opening / closing component 14 switches to the closed state to maintain the test environment in the test area. When the opening / closing component 14 is open, there will be a brief environmental connection between the test area and the storage area. Therefore, to ensure the test effect, compressed air with a dew point meeting the requirements needs to be continuously supplied to the storage area to maintain a low-humidity environment and avoid affecting the test area when connected. In addition, compressed air meeting the test dew point requirements will also be continuously supplied to the test area.

[0038] In some embodiments, the chip testing equipment 100 includes a housing, and portions of the testing device 30, the conveying device 20, the loading device 10, and the unloading device 40 are all located inside the housing. An opening is provided at a position corresponding to the loading box 13. The opening / closing assembly 14 includes a third driving member 141, a sliding plate 142, a door 144, and at least one fourth driving member 143. The third driving member 141 is mounted on the housing and connected to the sliding plate 142, which is connected to the housing via a slide rail. Under the drive of the third driving member 141, the sliding plate 142 can slide vertically relative to the housing. The fourth driving member 143 is mounted on the sliding plate 142, and the door 144 is connected to the fourth driving member 143. Under the drive of the fourth driving member 143, the door 144 can move horizontally. Here, there are two fourth driving members 143, and both the third driving member 141 and the fourth driving member 143 are cylinders. In other embodiments, the number of fourth driving members 143 can be determined according to specific design requirements.

[0039] Specifically, when loading is required, the fourth drive unit 143 first drives the door 144 to extend horizontally. Then, the third drive unit 141 drives the sliding plate 142 to move upward, thereby moving the door 144 upward to expose the opening. The gripper 12 extends from the opening, enters the loading box 13 to grip the wafer, and moves the wafer to the testing area. Then, the third drive unit 141 drives the sliding plate 142 to move downward, thereby moving the door 144 downward. Finally, the fourth drive unit 143 drives the door 144 to retract to close the opening. Similarly, a corresponding opening and closing assembly 14 is also provided in the unloading area.

[0040] This embodiment, by incorporating an opening / closing component 14 capable of opening and closing the opening, allows the opening to be opened only when needed during wafer handling, remaining closed the rest of the time. This reduces gas exchange between the test area and the external environment, helping to maintain a low dew point environment in the test area. Simultaneously, by continuously supplying compressed air that meets dew point requirements to the storage area, even when the test area and storage area are briefly connected when the opening / closing component 14 is open, the risk of humid air entering the test area is reduced, thereby ensuring the stability of the test environment and improving the consistency and accuracy of chip testing.

[0041] In some embodiments, the conductive element 362 is a copper block. The copper block has good electrical conductivity. Specifically, the grounding assembly 36 includes a grounding post 361, which is vertically mounted on the turntable 35, and the conductive element 362 is mounted on top of the grounding post 361.

[0042] This embodiment uses a copper block as the conductive component 362. By utilizing the excellent conductivity of copper, the contact resistance of the conductive path can be reduced, and the conductivity reliability between the negative electrode pad and the test instrument can be improved, thereby ensuring the stable establishment of the test circuit and improving the accuracy of the test results.

[0043] In some embodiments, the mating member 363 is a spring probe. This embodiment uses a spring probe as the mating member 363 to form an elastic contact between the mating member 363 and the conductive member 362, which can compensate for assembly errors and height deviations, avoid poor contact or wear of parts caused by rigid collisions, and improve the reliability and service life of the conductive contact.

[0044] In some embodiments, the testing device 30 further includes a base 32, and the testing mechanism 31 further includes a bracket 311. The bracket 311 is slidably mounted vertically on the base 32 and located at the testing station. The probe assembly 313 and the docking member 363 are both mounted on the bracket 311. A first driving member 312 is mounted on the base 32 and connected to the bracket 311, and can controllably drive the bracket 311 to move vertically, thereby driving the probe assembly 313 and the docking member 363 to move synchronously vertically.

[0045] In this embodiment, by setting up a bracket 311, the probe assembly 313 and the docking piece 363 are mounted on the same bracket 311, and the bracket 311 is driven vertically by the first driving member 312, thereby ensuring that the probe assembly 313 and the docking piece 363 move synchronously, which is conducive to the synchronous establishment of positive and negative test paths and improves the stability of test circuit establishment.

[0046] In some embodiments, the testing mechanism 31 further includes at least one first adjustment component 314, which is mounted on the support 311. Each first adjustment component 314 corresponds to a probe component 313 and is used to adjust the position of the probe component 313 in a first horizontal direction, a second horizontal direction, and a vertical direction, respectively. It can be understood that the first adjustment component 314 can adjust the position of the probe component 313 in the X-axis, Y-axis, and Z-axis directions.

[0047] This embodiment, by setting the first adjustment component 314, can adjust the position of the probe component 313 in two horizontal directions and in the vertical direction respectively, thereby compensating for the installation error of the probe component 313, making the probe accurately correspond to the chip pad, improving the probe contact accuracy and test reliability.

[0048] In some embodiments, there are two first adjustment components 314 and two probe components 313. The two first adjustment components 314 are configured to adjust the position of the corresponding probe components 313 so that the two probe components 313 are at the same horizontal height and aligned. Here, the two probe components 313 are arranged opposite to each other. After the height adjustment is completed, the two probe components 313 then move up and down synchronously with the bracket 311.

[0049] This embodiment adjusts the positions of the two probe components 313 respectively, so that the two probe components 313 are kept at the same height and aligned with each other. This ensures that multiple probe components 313 contact the corresponding pads synchronously, avoiding premature stress or poor contact of any probe component 313 due to height difference, and improving the consistency of multi-channel testing.

[0050] In some embodiments, the testing mechanism 31 further includes a second adjustment component 364, which is mounted on the bracket 311 and connected to the docking member 363, for adjusting the vertical position of the docking member 363. Here, after the positions of the docking member 363 and the two probe assemblies 313 are adjusted, they move up and down synchronously with the bracket 311.

[0051] This embodiment, by setting a second adjustment component 364, can adjust the height of the docking member 363, so that the docking member 363 and the conductive member 362 maintain a suitable contact pressure, avoiding excessive contact pressure causing wear or insufficient pressure causing unstable contact, thereby improving the reliability of conductivity.

[0052] In some embodiments, the testing mechanism 31 further includes a photodetector 316 and a third adjustment component 315. The photodetector 316 is used to collect light emitted from the first optical port of the chip under test during the testing process. The third adjustment component 315 is mounted on the bracket 311 and connected to the photodetector 316, used to adjust the vertical position of the photodetector 316. Here, the first optical port is the PD light-emitting window. After the positions of the docking piece 363, the two probe assemblies 313, and the photodetector 316 are all adjusted, they are raised and lowered synchronously with the bracket 311.

[0053] This embodiment uses a photodetector 316 to collect the light emitted by the chip under test, and uses a third adjustment component 315 to adjust the position of the photodetector 316 so that the photodetector 316 can be accurately aligned with the first optical port after it descends with the bracket 311, thereby improving the efficiency of optical signal acquisition and the accuracy of testing.

[0054] In other embodiments, if the chip under test has multiple PD light-emitting windows, for example, PD light-emitting windows are provided on both sides of the chip under test, then photodetectors 316 need to be installed on both sides of the chip under test to collect the light emitted from the corresponding light ports respectively.

[0055] In some embodiments, the testing device 30 further includes a second driving member 33, which is mounted on the base 32. The turntable 35 is mounted on the second driving member 33 and configured to rotate under the drive of the second driving member 33. Here, the second driving member 33 is a rotary drive motor, preferably a DD motor, eliminating the need for an intermediate transmission mechanism.

[0056] This embodiment uses a rotary drive motor to drive the turntable 35 to rotate, enabling the turntable 35 to accurately switch between the loading / unloading station and the testing station, thereby improving the positioning accuracy and switching efficiency of the receiving position 34 and ensuring the alignment accuracy between the probe assembly 313 and the chip under test.

[0057] In some embodiments, the testing apparatus 30 further includes a cleaning component 37, which is mounted on a turntable 35 and can move with the turntable 35 to below the probe assembly 313. After the probe assembly 313 moves downward until the test probe contacts the cleaning component 37, a second drive member 33 drives the turntable 35 to reciprocate, so that the cleaning component 37 removes dirt from the test probe. Here, the cleaning component 37 includes a mounting base 371 and a cleaning element 372. The mounting base 371 is mounted on the turntable 35, and the cleaning element 372 is mounted on top of the mounting base 371. Here, the cleaning element 372 can be sandpaper, foam, or a grinding block, etc.

[0058] This embodiment sets up a cleaning component 37 and uses a turntable 35 to move the cleaning component 37 to below the probe component 313. The turntable 35 then rotates back and forth to achieve automatic cleaning of the probe. This can remove oxides and contaminants from the surface of the test probe in a timely manner, reduce contact resistance, improve the contact reliability between the test probe and the chip pad, extend the service life of the test probe, and reduce the frequency of manual maintenance.

[0059] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A chip testing device, characterized in that, include: A feeding device is used to feed the chip under test, wherein the chip under test has a positive electrode pad on the top surface and a negative electrode pad on the bottom surface. At least one testing device is provided, each of which includes a turntable, a testing mechanism, and a grounding component. The turntable has two opposite receiving positions for placing the chip under test (DUT), each electrically connected to the negative pad of the DUT. Under controlled rotation of the turntable, the positions of the two receiving positions are switched, thereby switching the DUT between a loading / unloading station and a testing station. The grounding component includes a docking member and two conductive members, each electrically connected to one of the receiving positions. The testing mechanism includes a first driving member and a probe assembly. The first driving member drives the probe assembly and the docking member to move synchronously, causing the probe assembly to contact the positive pad of the DUT and the docking member to contact the corresponding conductive member. Both the probe assembly and the docking member are connected to a testing instrument, allowing the testing instrument to form a testing circuit via the probe assembly, the DUT, the conductive member, and the docking member. The unloading device is used to unload the tested chip after it has completed the test; A transport device is used to transport the chip under test between the loading mechanism, the loading / unloading station of the testing device, and the unloading mechanism.

2. The chip testing equipment according to claim 1, characterized in that, The testing device also includes a base, and the testing mechanism further includes: A bracket is vertically slidably mounted on the base and located at the test station; both the probe assembly and the docking piece are mounted on the bracket. The first driving component is mounted on the base and connected to the bracket, and can controllably drive the bracket to move vertically, thereby driving the probe assembly and the docking component to move synchronously vertically.

3. The chip testing equipment according to claim 2, characterized in that, The testing facility also includes: At least one first adjustment component is mounted on the bracket, and each first adjustment component corresponds to one probe component for adjusting the position of the probe component in the first horizontal direction, the second horizontal direction, and the vertical direction, respectively.

4. The chip testing equipment according to claim 3, characterized in that, The number of the first adjustment component and the number of the probe component are both two. The two first adjustment components are configured to adjust the position of the corresponding probe component so that the two probe components are at the same horizontal height and aligned.

5. The chip testing equipment according to claim 3, characterized in that, The testing facility also includes: The second adjustment component is mounted on the bracket and connected to the docking member, and is used to adjust the vertical position of the docking member.

6. The chip testing equipment according to claim 3, characterized in that, The testing facility also includes: A photodetector is used to collect light emitted from the first optical port of the chip under test during the testing process. The third adjustment component is mounted on the bracket and connected to the photodetector, and is used to adjust the vertical position of the photodetector.

7. The chip testing equipment according to claim 6, characterized in that, The testing apparatus also includes: A second driving member is mounted on the base, and the turntable is mounted on the second driving member and configured to rotate under the drive of the second driving member.

8. The chip testing equipment according to claim 7, characterized in that, The testing apparatus also includes: A cleaning component is mounted on the turntable and can move with the turntable to below the probe assembly. After the probe assembly moves downward until the test probe contacts the cleaning component, the second drive unit drives the turntable to rotate back and forth so that the cleaning component removes dirt from the test probe.

9. The chip testing equipment according to any one of claims 1-8, characterized in that, Each of the receiving positions is provided with a platform assembly, the platform assembly comprising: The stage body is used to place the chip under test; The fourth adjustment component is connected to the platform body and is used to adjust the position of the platform body in the first horizontal direction, the second horizontal direction, and the vertical direction.

10. The chip testing equipment according to any one of claims 1-8, characterized in that, The conductive component is a copper block.

Images