Optical film and preparation method thereof, camera module and electronic device

Abstract

The application relates to the technical field of optical elements, in particular to an optical film, a preparation method thereof, a camera module and electronic equipment. The preparation method of the optical film comprises the following steps: forming a first film layer on a first surface of a base material, cutting the base material to form the first film layer to form a plurality of sub-base materials, and the adjacent two sub-base materials are arranged at intervals, the sub-base material comprises the first surface, a second surface and a side surface, a second film layer is formed on the plurality of sub-base materials, so that the second film layer covers the second surface and the side surface of the sub-base material, wherein the first surface and the second surface are arranged in opposite directions in the thickness direction of the sub-base material, and the side surface is connected to the first surface and the second surface. Therefore, the first surface, the second surface and the side surface of the sub-base material can be covered by the film layer, so that the sub-base material can be prevented from being exposed to air, corrosion of the sub-base material is prevented, the service life of the optical film is effectively prolonged, and the light filtering effect of the optical film is improved.

Description

Technical Field

[0001] This application relates to the field of optical element technology, and in particular to an optical film and its preparation method, a camera module, and an electronic device. Background Technology

[0002] In photographic systems, to achieve image quality from silicon-based image sensors that closely resembles that of the human eye, optical films (such as filters) are used to filter light. To achieve higher-quality imaging, specific wavelength-absorbing pigments are typically doped into the glass substrate of the filter to improve its filtering performance.

[0003] In related technologies, the glass substrate of filters is mostly made of fluorophosphate glass. Fluorophosphate glass has good corrosion resistance and strong chemical resistance. However, since fluorophosphate glass is a mixture of network structure and linear macromolecular structure, this mixed structure makes it difficult for some pigments to enter the structure due to steric hindrance, or due to its weak chemical bonding, pigment molecules may easily detach from the glass structure under certain conditions, affecting the doping effect of the pigments.

[0004] Based on this, phosphate glass is used as a glass substrate instead of fluorophosphate glass in related technologies. Phosphate glass can achieve a better fusion effect with absorbent pigments. However, phosphate glass has poor weather resistance and is prone to hydrolysis reaction with water vapor, which leads to a deterioration in its optical performance and mechanical stability. Summary of the Invention

[0005] This application discloses an optical film and its preparation method, a camera module, and an electronic device, which can effectively extend the service life of the optical film, improve the filtering effect of the optical film, and make the film layer more uniform and stronger.

[0006] To achieve the above objectives, in a first aspect, this application discloses a method for preparing an optical film, the method comprising:

[0007] A substrate is provided, and a first film layer is formed on a first surface of the substrate;

[0008] The substrate forming the first film layer is cut to form a plurality of sub-substrates, and adjacent sub-substrates are spaced apart. The sub-substrates include a first surface, a second surface, and a side surface.

[0009] A second film layer is formed on the plurality of said sub-substrates such that the second film layer covers the second surface and the side surface of the sub-substrates;

[0010] The first surface and the second surface are disposed opposite to each other in the thickness direction of the sub-substrate, and the side surface is connected to the first surface and the second surface.

[0011] In some possible embodiments, prior to forming the first film layer on the first surface of the substrate, the preparation method further includes:

[0012] An absorbent layer is formed on the first surface of the substrate;

[0013] The first film layer is formed on the side of the absorbent layer opposite to the substrate.

[0014] In some possible implementations, the cutting of the substrate forming the first film layer to form a plurality of sub-substrates, with adjacent sub-substrates spaced apart, includes:

[0015] The substrate forming the first film layer is cut to form a plurality of the sub-substrates;

[0016] The multiple sub-substrates are spaced apart, such that there is a spacing D between two adjacent sub-substrates;

[0017] The plurality of said sub-substrates are immersed in a first solution;

[0018] The sub-substrate is cleaned and soaked.

[0019] In some possible implementations, the first film layer and the second film layer are different film layers, the first film layer includes a plurality of first sublayers, and the second film layer includes a plurality of second sublayers;

[0020] The number of the first sub-layers is less than the number of the second sub-layers; and / or,

[0021] The first film layer includes an antireflective film layer, and the number of the first sub-layers is 5-20; and / or,

[0022] The second film layer includes an infrared cutoff film layer, and the number of the second sub-layers is 20 to 200.

[0023] In some possible implementations, the spacing D between two adjacent sub-substrates is 0.1 mm to 1 cm.

[0024] Secondly, this application discloses an optical film, which is prepared by the optical film preparation method described in the first aspect above, and the optical film comprises:

[0025] Substrate, the substrate including a first surface, a second surface opposite to each other along its thickness direction, and a side surface connected to the first surface and the second surface;

[0026] A first film layer is disposed on the first surface;

[0027] The second film layer is disposed on the second surface and the side surface.

[0028] In some possible implementations, the first film layer and the second film layer are different film layers, the first film layer includes a plurality of first sublayers, and the second film layer includes a plurality of second sublayers;

[0029] The number of the first sub-layers is less than the number of the second sub-layers; and / or,

[0030] The first film layer includes an antireflective film layer, and the number of the first sub-layers is 5-20; and / or,

[0031] The second film layer includes an infrared cutoff film layer, and the number of the second sub-layers is 20 to 200.

[0032] In some possible implementations, the optical film further includes an absorption layer disposed between the first film layer and the sub-substrate.

[0033] Thirdly, this application also discloses a camera module, including the optical film as described in the second aspect above.

[0034] Fourthly, this application also discloses an electronic device, including a device housing and a camera module as described in the third aspect above, the camera module being disposed in the device housing.

[0035] Fifthly, this application also discloses a method for preparing an optical film, the method comprising:

[0036] A substrate is provided, and the substrate is cut to form a plurality of sub-substrates, with adjacent sub-substrates spaced apart. Each sub-substrate includes a first surface, a second surface, and a side surface.

[0037] A first film layer is formed on the plurality of said sub-substrates such that the first film layer covers the first surface and the side surface of the sub-substrates;

[0038] A second film layer is formed on the plurality of said sub-substrates such that the second film layer covers the second surface of the sub-substrates and the side surface covered by the first film layer;

[0039] The first surface and the second surface are disposed opposite to each other in the thickness direction of the sub-substrate, and the side surface is connected to the first surface and the second surface.

[0040] Compared with the prior art, the beneficial effects of this application are:

[0041] This application discloses a method for preparing an optical film and the optical film itself. The method includes: forming a first film layer on a first surface of a substrate; cutting the substrate to form the first film layer to form multiple sub-substrates, with adjacent sub-substrates spaced apart; each sub-substrate including a first surface, a second surface, and a side surface; and forming a second film layer on the multiple sub-substrates to cover the second surface and side surface of the sub-substrates. The first and second surfaces are arranged opposite to each other in the thickness direction of the sub-substrates, and the side surface is connected to the first and second surfaces. Thus, the first surface, second surface, and side surface of the sub-substrates are all covered by a film layer, preventing the sub-substrates from being exposed to air and preventing corrosion, thereby effectively extending the service life of the optical film and improving its filtering effect. Furthermore, since the cut sub-substrates effectively release the film stress generated by the first film layer, and the surface area of ​​the cut sub-substrates is reduced, the film stress of the second film layer is also reduced accordingly, resulting in more uniform and stronger film adhesion. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 A flowchart illustrating one embodiment of the method for preparing an optical film according to an example of this application;

[0044] Figure 2 A flowchart illustrating another embodiment of the method for preparing an optical film according to one embodiment of this application;

[0045] Figure 3 A flowchart illustrating yet another embodiment of the method for preparing an optical film provided in one embodiment of this application;

[0046] Figure 4 A schematic diagram of the structure of the substrate provided in the embodiments of this application after being cut;

[0047] Figure 5 A schematic diagram of the structure of the substrate provided in the embodiments of this application after spacing is set;

[0048] Figure 6 This is a schematic diagram of the structure of an optical film provided in an embodiment of this application;

[0049] Figure 7 Another structural schematic diagram of the optical film provided in the embodiments of this application;

[0050] Figure 8 This is a schematic diagram of the structure of the first film layer provided in an embodiment of this application;

[0051] Figure 9 for Figure 7 A magnified view of a section at point A in the middle;

[0052] Figure 10 A flowchart illustrating an embodiment of a method for preparing an optical film according to another embodiment of this application;

[0053] Figure 11 This is a schematic diagram of the structure of an optical film provided in another embodiment of this application;

[0054] Figure 12 This is a schematic diagram of the structure of the camera module provided in the embodiments of this application;

[0055] Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0056] Explanation of reference numerals in the attached figures:

[0057] 100 - Optical film; 10 - Substrate; 11 - Sub-substrate; 111 - First surface; 112 - Second surface; 113 - Side surface; 20 - First film layer; 21 - First sub-layer; 30 - Second film layer; 31 - Second sub-layer; 40 - Absorption layer;

[0058] 200-Camera Module;

[0059] 300 - Electronic equipment; 301 - Equipment housing. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] In this application, the terms "upper," "lower," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0062] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0063] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0064] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0065] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0066] Please see Figure 1 ,in, Figure 1 This is a flowchart illustrating one embodiment of a method for preparing an optical film according to an example of this application. In a first aspect, this application discloses a method for preparing an optical film 100, the method comprising:

[0067] 401. Provide a substrate and form a first film layer on a first surface of the substrate.

[0068] Optionally, the first film layer 20 may be an anti-reflection film layer or an infrared cutoff film layer, and the embodiments of this application do not limit this.

[0069] 402. Cut the substrate to form the first film layer to form a plurality of sub-substrates, with adjacent sub-substrates spaced apart, the sub-substrates including a first surface, a second surface and a side surface.

[0070] It is understood that the first surface and the second surface are disposed opposite to each other in the thickness direction of the sub-substrate, and the side surface is connected to the first surface and the second surface. In addition, since the sub-substrate 11 is formed by cutting the substrate 10, the first surface 111 of the substrate 10 corresponds to the first surface 111 of the sub-substrate 11.

[0071] 403. A second film layer is formed on a plurality of sub-substrates such that the second film layer covers the second surface and side surface of the sub-substrates.

[0072] Optionally, the second film layer 30 can be an infrared cutoff film layer or an anti-reflection film layer; the embodiments of this application do not limit this.

[0073] For example, the second film layer 30 and the first film layer 20 can be film layers of the same material or film layers of different materials, and the embodiments of this application do not limit this. For example, when the second film layer 30 is an infrared cutoff film layer, the first film layer 20 can be an antireflection film layer, or the first film layer 20 can be an infrared cutoff film layer; as another example, when the second film layer 30 is an antireflection film layer, the first film layer 20 can be an antireflection film layer, or the first film layer 20 can be an infrared cutoff film layer.

[0074] As can be seen, the method for preparing the optical film 100 provided in this application involves first forming a first film layer 20 on the first surface 111 of a substrate 10, cutting it to form a sub-substrate 11, and then forming a second film layer 30 on the second surface 112 of the sub-substrate 11. This allows the first surface 111, the second surface 112, and the side surface 113 of the sub-substrate 11 to be covered by film layers, thus protecting the entire surface of the sub-substrate 11 from damage caused by the external environment. This effectively extends the service life of the optical film 100 and improves its filtering effect. Furthermore, since the cut sub-substrate 11 effectively releases the film stress generated by the first film layer 20, and the reduced surface area of ​​the cut sub-substrate 11 reduces the film stress of the second film layer 30, effectively improving the adhesion of the first film layer 20 and the second film layer 30 to the sub-substrate 11.

[0075] Optionally, when forming the first film layer 20 on the first surface 111 of the substrate 10, a coating process can be used, which can precisely control the thickness and composition of the first film layer 20, improve the adhesion and uniformity of the first film layer 20, thereby improving the optical performance of the optical film 100. At the same time, the coating process can also adapt to substrates 10 of different shapes, thereby improving the production efficiency of the optical film 100 and reducing the manufacturing cost of the optical film 100.

[0076] Optionally, when forming the second film layer 30 on the second surface 112 of the sub-substrate 11, a coating process can be used. When two adjacent sub-substrates 11 are spaced apart, the second film layer 30 can be deposited on the side surface 113 at the same time as depositing the second film layer 30 on the second surface 112. This allows the entire surface of the sub-substrate 11 to be protected by the film layer without adding process steps, thereby effectively preventing the sub-substrate 11 from being damaged by the external environment, thus effectively extending the service life of the optical film 100, and also improving the filtering effect of the optical film 100.

[0077] Please see Figure 2 ,in, Figure 2 A flowchart illustrating another embodiment of the method for preparing an optical film according to an embodiment of this application. In some embodiments, before step 401, where a first film layer is formed on a first surface of the substrate, the preparation method further includes:

[0078] 400. An absorbent layer is formed on the first surface of the substrate.

[0079] It is understood that the first film layer 20 is formed on the side of the absorption layer 40 facing away from the substrate 10. When the first film layer 20 is an anti-reflection film layer, placing the absorption layer 40 between the substrate 10 and the anti-reflection film layer can further reduce the intensity of reflected light and improve the shielding performance of the optical film 100. In addition, by placing the first film layer 20 as the outermost layer of the optical film 100, it can also provide corrosion protection, moisture protection, and damp protection for the absorption layer 40 and the substrate 10, thereby improving the product quality and service life of the optical film 100. Of course, as another embodiment, the absorption layer 40 of this application can also be formed between the substrate 10 and the second film layer 30, and this application embodiment does not limit this.

[0080] Optionally, by adding an absorption layer 40 between the first film layer 20 and the sub-substrate 11, the material of the absorption layer 40 can be an absorbing pigment. This absorption layer is used to absorb light of a specific wavelength, so that the optical film 100 can absorb light of a specific wavelength, thereby improving the light transmission and filtering effect of the optical film 100.

[0081] It is understandable that a specific wavelength band refers to an artificially defined wavelength range within the wavelength range of light to meet the required functional needs. This absorption layer can absorb light in a specific wavelength band, and the specific absorption wavelength band depends on the type of pigment. For example, the material of the absorption layer can be a near-infrared absorbing pigment that absorbs wavelengths from 780nm to 2526nm.

[0082] Please see Figures 3 to 5 ,in, Figure 3 This is a flowchart illustrating yet another embodiment of the method for preparing an optical film according to one embodiment of this application. Figure 4 This is a schematic diagram of the structure of the substrate provided in the embodiments of this application after being cut. Figure 5 This is a schematic diagram of the structure of the substrate provided in the embodiments of this application after spacing.

[0083] In some embodiments, step 402 above, for cutting the substrate to form the first film layer to form a plurality of sub-substrates, and the adjacent sub-substrates being spaced apart, may include:

[0084] 4021. Cut the substrate to form the first film layer to form multiple sub-substrates.

[0085] 4022. Multiple sub-substrates are spaced apart so that there is a spacing D between two adjacent sub-substrates.

[0086] 4023. Immerse multiple sub-substrates in the first solution.

[0087] Optionally, by immersing multiple sub-substrates 11 in a first solution, the first solution can chemically react with each surface of the sub-substrates 11, thereby removing microcracks on each surface of the sub-substrates 11 and improving the surface quality and strength of the optical film 100.

[0088] It is understood that the first solution may include, but is not limited to, reinforcing solutions such as sodium hydroxide solution, potassium hydroxide solution, potassium nitrate solution, or sodium nitrate solution, and the embodiments of this application do not limit this. For example, the concentration of the sodium hydroxide solution may be 1:5.

[0089] 4024. Clean the sub-substrate after soaking.

[0090] In this step, by cleaning and soaking the sub-substrate 11 after it has been immersed in the first solution, the first solution remaining on each surface of the sub-substrate 11 can be removed, preventing the remaining first solution from continuing to react with the surfaces of the sub-substrate 11 and avoiding any impact on the surface quality and optical performance of the optical film 100. In addition, cleaning and soaking the sub-substrate 11 also ensures that there are no impurities or chemical residues on each surface of the sub-substrate 11, thereby ensuring the smooth progress of subsequent processing steps (such as coating and assembly).

[0091] In some embodiments, the first film layer 20 and the second film layer 30 can be different film layers. The first film layer 20 includes a plurality of first sub-layers 21, and the second film layer 30 includes a plurality of second sub-layers 31. The number of first sub-layers 21 is less than the number of second sub-layers 31.

[0092] Optionally, the first film layer 20 may include an antireflective film layer, and the second film layer 30 may include an infrared cutoff film layer. Since the antireflective film layer is used to reduce the reflection of light in a specific wavelength band, a first film layer 20 with a relatively small number of layers can meet the requirements. However, the infrared cutoff film layer needs to achieve a high cutoff rate over a wider wavelength band, and a second film layer 30 with a larger number of layers can effectively improve the optical performance of the optical film 100. In addition, a smaller number of antireflective film layers can reduce process complexity and manufacturing costs, and a smaller number of layers can reduce the stress between the film layers, thereby improving the adhesion stability of the first film layer 20.

[0093] Please refer to it again. Figure 5In some embodiments, the spacing D between two adjacent sub-substrates 11 is 0.1mm-1cm. For example, the spacing D between two adjacent sub-substrates 11 is 0.1mm-0.5mm, 0.5mm-1mm, 1mm-1.5mm, 1.5mm-2mm, 2mm-2.5mm, 2.5mm-3mm, 4mm-3.5mm, 3.5mm-4mm, 4mm-4.5mm, 4.5mm-5mm, 5mm-5.5mm, 5.5mm-6mm, 6mm-6.5mm, 6.5mm-7mm, 7mm-7.5mm, 7.5mm-8mm, 8mm-8.5mm, 9mm-9.5mm, or 9.5mm-10mm. For example, the spacing D between two adjacent sub-substrates 11 can be 0.1mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, 1.3mm, 1.5mm, 2.0mm, 2.3mm, 2.5mm, 2.8mm, 3.0mm, 3.3mm, 3.5mm, 4.0mm, 4.3mm, 4.5mm, 4.8mm, 5.0mm, 5.3mm, 5.5mm, 6.0mm, 6.3mm, 6.5mm, 6.8mm, 7.0mm, 7.3mm, 7.5mm, 8.0mm, 8.0mm, 8.3mm, 8.5mm, 8.8mm, 9.0mm, 9.3mm, 9.5mm, 9.8mm, 1.0cm, etc., and this application embodiment does not limit this.

[0094] When the distance D between two adjacent sub-substrates 11 is less than 0.1 mm, it will be difficult to simultaneously deposit the second film layer 30 on the side surface 113 of the sub-substrate 11 while sputtering the second film layer 30 onto the second surface 112 of the sub-substrate 11. This will cause the sub-substrate 11 to be damaged by the external environment, thereby reducing the service life of the optical film 100. When the distance D between two adjacent sub-substrates 11 is greater than 1 cm, due to the limited space of the worktable supporting the sub-substrate 11, the excessively large distance D will result in a limited number of sub-substrates 11 placed on the worktable in a single processing cycle, thereby increasing the number of processing cycles and wasting manufacturing costs.

[0095] This arrangement allows for a suitable spacing between the side surfaces 113 of two adjacent sub-substrates 11, enabling the second film layer 30 to be sputtered onto the second surface 112 of the sub-substrate 11 while the side surface 113 of the sub-substrate 11 is also coated with the second film layer 30. The suitable spacing ensures that the side surface 113 of the sub-substrate 11 can completely cover the second film layer 30, thereby ensuring that each surface of the sub-substrate 11 is protected, and thus improving the stability and strength of the optical film 100.

[0096] Please see Figure 6 ,in, Figure 6 This is a schematic diagram of the structure of an optical film provided in an embodiment of this application. In a second aspect, this application discloses an optical film 100, which is prepared using the method described in the first aspect above.

[0097] It is understood that the optical film 100 may include, but is not limited to, filters, lenses, beam splitters, polarizers, etc., and the embodiments of this application do not specifically limit it. The following description will take the optical film 100 as a filter as an example.

[0098] In some embodiments, the optical film 100 includes a sub-substrate 11, a first film layer 20, and a second film layer 30. The sub-substrate 11 includes a first surface 111, a second surface 112, and a side surface 113 connected to the first surface 111 and the second surface 112, which are opposite to each other along its thickness direction. The first film layer 20 is disposed on the first surface 111, and the second film layer 30 is disposed on the second surface 112 and the side surface 113.

[0099] By providing a first film layer 20 on the first surface 111 of the sub-substrate 11, and a second film layer 30 on the second surface 112 and the side surface 113, a film layer is provided on each surface of the sub-substrate 11. This not only ensures the optical performance of the optical film 100, but also covers the side surface 113 of the optical film 100 with the second film layer 30, thereby protecting the side surface 113 of the sub-substrate 11 and preventing corrosion of the sub-substrate 11. This effectively improves the product quality and service life of the optical film 100.

[0100] The shape of the sub-substrate 11 may include, but is not limited to, rectangle, circle, triangle, etc., and the embodiments of this application do not limit it.

[0101] The material of the sub-substrate 11 can be fluorophosphate glass or phosphate glass. Of course, as other examples, it can also be other types of glass materials or transparent plastics or other transparent materials. This application embodiment does not limit this.

[0102] Please see Figure 7 ,in, Figure 7 This is another schematic diagram of the structure of the optical film provided in the embodiments of this application. In some embodiments, the optical film 100 further includes an absorption layer 40, which is disposed between the first film layer 20 and the sub-substrate 11. By adding an absorption layer 40 between the first film layer 20 and the sub-substrate 11, the optical film 100 can absorb light of a specific wavelength, thereby improving the light transmission and filtering effects of the optical film 100.

[0103] Specifically, the material of the absorption layer 40 is an absorbing pigment, which is used to absorb light of a specific wavelength so that the optical film 100 can achieve a better light filtering effect.

[0104] The absorption layer 40 can be disposed on the first surface 111 of the sub-substrate 11 by spin coating process, so that the sub-substrate 11 and the absorption layer 40 can be well integrated, thereby achieving a better light filtering effect of the optical film 100. Of course, as another example, the absorption layer 40 can also be disposed on the first surface 111 of the sub-substrate 11 by coating process.

[0105] For example, the material of the absorption layer 40 may include, but is not limited to, near-infrared absorbing pigments, ultraviolet absorbing pigments, ITO (indium tin oxide) particles, ATO (antimony-doped tin oxide) particles, etc., and this application does not limit it.

[0106] Because the absorbing pigments and phosphate glass have good fusion effects, when the sub-substrate 11 is phosphate glass, the absorbing pigments disposed on the sub-substrate 11 can achieve good fusion with the sub-substrate 11, thereby enabling the optical film 100 to achieve a good filtering effect. However, due to the poor weather resistance of phosphate glass, it is prone to decomposition and deterioration in strong acid, strong alkali, humid or high temperature environments, resulting in poor optical performance of the sub-substrate 11 and easy damage to its mechanical stability, which in turn leads to a deterioration in the filtering effect of the optical film 100 and damage to the structure of the optical film 100. Therefore, this application also provides a second film layer 30 on the side surface 113 of the sub-substrate 11, so that the second film layer 30 can not only achieve the filtering effect of the optical film 100 on the second surface 112, but also cover the side surface 113 of the optical film 100, thereby achieving a protective effect on the optical film 100 and preventing the sub-substrate 11 with poor weather resistance from being damaged by the external environment.

[0107] The formation of the first film layer 20 on the first surface 111 of the substrate 10 can be achieved using a coating process, such as sputtering, chemical vapor deposition, or physical vapor deposition. These processes can uniformly form one or more dense first film layers 20 with excellent optical properties on the first surface 111 of the substrate 10.

[0108] It is understood that the number of the first film layer 20 can be one or more; the number of the second film layer 30 can also be one or more, and the embodiments of this application do not limit this.

[0109] It is understood that the materials of the first film layer 20 and the second film layer 30 can be the same or different film layer materials, and this application embodiment does not limit this.

[0110] Please see Figure 8,in, Figure 8 This is a schematic diagram of the structure of the first film layer provided in an embodiment of this application. Optionally, the first film layer 20 and the second film layer 30 are different film layers. The first film layer 20 includes a plurality of first sub-layers 21, and the second film layer 30 includes a plurality of second sub-layers 31. The number of first sub-layers 21 is less than the number of second sub-layers 31. The first film layer 20 includes an anti-reflection film layer, and the number of first sub-layers 21 is 5 to 20 layers.

[0111] This configuration ensures the anti-reflection effect of the optical film 100, avoids the increased complexity and cost of the process due to too many layers, and keeps the thickness of the optical film 100 within a reasonable range to reduce the overall thickness of the camera module 200, thereby meeting the requirements of the thin and light design of the electronic device 300.

[0112] For example, the number of first sub-layers 21 may include, but is not limited to, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, and 20 layers.

[0113] When the number of first sub-layers 21 is less than 5, the anti-reflection effect of the optical film 100 will be deteriorated, making it difficult to meet the anti-reflection performance requirements of the optical film 100. When the number of first sub-layers 21 is more than 20, the overall thickness of the optical film 100 will increase, which in turn will increase the thickness of the camera module 200, making it difficult to meet the requirements of the thin and light design of the electronic device 300.

[0114] Please see Figure 9 ,in, Figure 9 for Figure 7 A magnified view of a portion at point A. Optionally, the first film layer 20 and the second film layer 30 are different film layers. The first film layer 20 includes multiple first sublayers 21, and the second film layer 30 includes multiple second sublayers 31. The number of first sublayers 21 is less than the number of second sublayers 31. The second film layer 30 includes an infrared cutoff film layer, and the number of second sublayers 31 is 20-200.

[0115] This configuration allows the optical film 100 to effectively cut off infrared light, thereby preventing infrared light from interfering with the imaging quality of the camera module 200 and improving the image clarity and color reproduction of the camera module 200. Furthermore, by appropriately setting the number of second sub-layers 31, the overall thickness and manufacturing complexity of the optical film 100 can be further balanced while ensuring the infrared cutoff effect, ensuring that the camera module 200 meets both the requirements of a thin and light design and possesses good optical performance.

[0116] For example, the number of second sub-layers 31 may include, but is not limited to, 20-30 layers, 30-40 layers, 40-50 layers, 50-60 layers, 60-70 layers, 70-80 layers, 80-90 layers, 90-100 layers, 100-110 layers, 120-130 layers, 130-140 layers, 140-150 layers, 150-160 layers, 160-70 layers, 170-180 layers, 180-190 layers, 190-200 layers, etc. For example, the number of second sub-layers 31 may include, but is not limited to, 20, 25, 30, 35, 40, 45, 47, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200, etc.

[0117] When the number of second sub-layers 31 is less than 20, the infrared cutoff effect of the optical film 100 will deteriorate, making it difficult to meet the infrared cutoff performance requirements of the optical film 100. When the number of second sub-layers 31 is more than 200, the overall thickness of the optical film 100 will increase, which in turn will increase the thickness of the camera module 200, making it difficult to meet the requirements of the thin and light design of the electronic device 300.

[0118] Please see Figure 10 ,in, Figure 10 A flowchart illustrating an embodiment of a method for preparing an optical film according to another embodiment of this application. In a third aspect, embodiments of this application also disclose a method for preparing an optical film 100, the method comprising:

[0119] 501. A substrate is provided, and the substrate is cut to form a plurality of sub-substrates, wherein adjacent sub-substrates are spaced apart, and the sub-substrates include a first surface, a second surface and a side surface.

[0120] Optionally, the first surface 111 and the second surface 112 are disposed opposite to each other in the thickness direction of the sub-substrate 11, and the side surface 113 is connected to the first surface 111 and the second surface 112.

[0121] 502. A first film layer is formed on a plurality of sub-substrates such that the first film layer covers the first surface and side surface of the sub-substrates.

[0122] Optionally, the first film layer 20 may be an anti-reflection film layer or an infrared cutoff film layer, and the embodiments of this application do not limit this.

[0123] 503. A second film layer is formed on a plurality of sub-substrates such that the second film layer covers a second surface of the sub-substrates and a side surface covered by the first film layer;

[0124] Optionally, the second film layer 30 can be an infrared cutoff film layer or an anti-reflection film layer; the embodiments of this application do not limit this.

[0125] For example, the second film layer 30 and the first film layer 20 can be film layers of the same material or film layers of different materials, and the embodiments of this application do not limit this. For example, when the second film layer 30 is an infrared cutoff film layer, the first film layer 20 can be an antireflection film layer, or the first film layer 20 can be an infrared cutoff film layer; as another example, when the second film layer 30 is an antireflection film layer, the first film layer 20 can be an antireflection film layer, or the first film layer 20 can be an infrared cutoff film layer.

[0126] As can be seen, the method for preparing the optical film 100 provided in this application involves first cutting the substrate 10 to form multiple sub-substrates 11, then forming a first film layer 20 on the first surface 111 and side surface 113 of the sub-substrates 11, and then forming a second film layer 30 on the second surface 112 and side surface 113 of the sub-substrates 11. Thus, the first surface 111, second surface 112, and side surface 113 of the sub-substrates 11 are all covered by film layers, thereby protecting the entire surface of the sub-substrates 11 from damage caused by the external environment, effectively extending the service life of the optical film 100, and improving the filtering effect of the optical film 100. Furthermore, the sequential formation of the first film layer 20 and the second film layer 30 on the side surface of the sub-substrates 11 further enhances the protection of the side surface 113 of the sub-substrates 11.

[0127] Please see Figure 11 ,in, Figure 11 This is a schematic diagram of the structure of an optical film provided in another embodiment of this application. In a fourth aspect, this application also discloses an optical film 100, which is prepared using the method described in the third aspect above.

[0128] In some embodiments, the optical film 100 includes a sub-substrate 11, a first film layer 20, and a second film layer 30. The sub-substrate 11 includes a first surface 111, a second surface 112, and a side surface 113 connected to the first surface 111 and the second surface 112, which are opposite to each other along its thickness direction. The first film layer 20 is disposed on the first surface 111 and the side surface 113, and the second film layer 30 is disposed on the second surface 112 and the side surface 113. The first film layer 20 disposed on the side surface 113 is located between the side surface 113 of the sub-substrate 11 and the second film layer 30 disposed on the side surface 113.

[0129] As can be seen, the optical film of this application embodiment also has a first surface 111, second surface 112 and side surface 113 of the sub-substrate 11, all of which can be covered by a film layer. Thus, all surfaces of the sub-substrate 11 can be protected by the film layer, thereby effectively preventing the sub-substrate 11 from being damaged by the external environment, thereby effectively extending the service life of the optical film 100, and also improving the filtering effect of the optical film 100.

[0130] Please see Figure 12 ,in, Figure 12 This is a schematic diagram of the structure of a camera module provided in an embodiment of this application. In a fifth aspect, this application also discloses a camera module 200, including an optical film 100 as described in the second aspect above. The camera module 200 having this optical film 100 can, as described in the second aspect above, not only ensure the optical performance of the optical film 100, but also cover the side surface 113 of the optical film 100 with a second film layer 30, thereby protecting the side surface 113 of the sub-substrate 11 and preventing corrosion of the sub-substrate 11, thus effectively improving the product quality and service life of the optical film 100.

[0131] Please see Figure 13 ,in, Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. In a sixth aspect, this application also discloses an electronic device 300, including a device housing 301 and a camera module 200 as described in the third aspect above, the camera module 200 being disposed within the device housing 301.

[0132] The electronic device 300 with the camera module 200 can also achieve, as described in the fifth aspect above, not only ensuring the optical performance of the optical film 100, but also covering the side surface 113 of the optical film 100 with the second film layer 30, thereby protecting the side surface 113 of the sub-substrate 11 and preventing corrosion of the sub-substrate 11, thus effectively improving the product quality and service life of the optical film 100.

[0133] Specifically, the electronic device 300 may include, but is not limited to, smartphones, smartwatches, cameras, monitors, action cameras, laptops, dashcams, tablets, PDAs, gaming devices, drones, and other electronic devices 300. This application embodiment does not specifically limit this.

[0134] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for preparing an optical film (100), characterized in that, The preparation method includes: A substrate (10) is provided, and a first film layer (20) is formed on a first surface (111) of the substrate (10); The substrate (10) forming the first film layer (20) is cut to form a plurality of sub-substrates (11), and adjacent sub-substrates (11) are spaced apart. The sub-substrates (11) include a first surface (111), a second surface (112) and a side surface (113). A second film layer (30) is formed on the plurality of said sub-substrates (11) such that the second film layer (30) covers the second surface (112) and the side surface (113) of the sub-substrates (11); The first surface (111) and the second surface (112) are disposed opposite to each other in the thickness direction of the sub-substrate (11), and the side surface (113) is connected to the first surface (111) and the second surface (112).

2. The method for preparing the optical film (100) according to claim 1, characterized in that, Before forming the first film layer (20) on the first surface (111) of the substrate (10), the preparation method further includes: An absorbent layer (40) is formed on the first surface (111) of the substrate (10); The first film layer (20) is formed on the side of the absorber layer (40) opposite to the substrate (10).

3. The method for preparing the optical film (100) according to claim 1, characterized in that, The cutting of the substrate (10) forming the first film layer (20) to form a plurality of sub-substrates (11), wherein adjacent sub-substrates (11) are spaced apart, includes: The substrate (10) forming the first film layer (20) is cut to form a plurality of the sub-substrates (11); The multiple sub-substrates (11) are spaced apart such that there is a spacing D between two adjacent sub-substrates (11); The plurality of said sub-substrates (11) are immersed in the first solution; The sub-substrate (11) is cleaned and soaked.

4. The method for preparing the optical film (100) according to claim 1, characterized in that, The first film layer (20) and the second film layer (30) are different film layers. The first film layer (20) includes a plurality of first sublayers (21), and the second film layer (30) includes a plurality of second sublayers (31). The number of the first sublayer (21) is less than the number of the second sublayer (31); and / or, The first film layer (20) includes an antireflective film layer, and the number of the first sublayers (21) is 5-20; and / or, The second film layer (30) includes an infrared cutoff film layer, and the number of the second sub-layers (31) is 20 to 200.

5. The method for preparing the optical film (100) according to any one of claims 1-4, characterized in that, The spacing D between two adjacent sub-substrates (11) is 0.1 mm to 1 cm.

6. An optical film (100), characterized in that, The optical film (100) is prepared by the method for preparing an optical film (100) as described in any one of claims 1-5, and the optical film (100) comprises: Substrate (11), the substrate (11) includes a first surface (111), a second surface (112) opposite to each other in its thickness direction, and a side surface (113) connected to the first surface (111) and the second surface (112); A first film layer (20) is disposed on the first surface (111); A second film layer (30) is disposed on the second surface (112) and the side surface (113).

7. The optical film (100) according to claim 6, characterized in that, The first film layer (20) and the second film layer (30) are different film layers. The first film layer (20) includes a plurality of first sublayers (21), and the second film layer (30) includes a plurality of second sublayers (31). The number of the first sublayer (21) is less than the number of the second sublayer (31); and / or, The first film layer (20) includes an antireflective film layer, and the number of the first sublayers (21) is 5-20; and / or, The second film layer (30) includes an infrared cutoff film layer, and the number of the second sub-layers (31) is 20 to 200.

8. The optical film (100) according to claim 6, characterized in that, The optical film (100) further includes an absorption layer (40) disposed between the first film layer (20) and the sub-substrate (11).

9. A camera module (200), characterized in that, Includes the optical film (100) as described in any one of claims 6-8.

10. An electronic device (300), characterized in that, It includes a device housing (301) and a camera module (200) as described in claim 9, the camera module (200) being disposed on the device housing (301).

11. A method for preparing an optical film (100), characterized in that, The preparation method includes: A substrate (10) is provided, and the substrate (10) is cut to form a plurality of sub-substrates (11), and adjacent sub-substrates (11) are spaced apart. The sub-substrates (11) include a first surface (111), a second surface (112) and a side surface (113). A first film layer (20) is formed on the plurality of said sub-substrates (11) such that the first film layer (20) covers the first surface (111) and the side surface (113) of the sub-substrates (11); A second film layer (30) is formed on the plurality of said sub-substrates (11) such that the second film layer (30) covers the second surface (112) of the sub-substrate (11) and the side surface (113) covered by the first film layer (20); The first surface (111) and the second surface (112) are disposed opposite to each other in the thickness direction of the sub-substrate (11), and the side surface (113) is connected to the first surface (111) and the second surface (112).

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