An active optical chip, an opto-electric conversion module and related devices

Abstract

Embodiments of the present application provide an active optical chip, an optoelectronic conversion module and related equipment, which can improve the coupling efficiency between the active optical chip and the optical transmission medium, and reduce the coupling insertion loss. The substrate surface of the active optical chip includes an active module and a coupling module arranged in sequence along a first plane, along a second plane, the first waveguide module, the active module and the substrate are arranged in sequence, and along the second plane, the second waveguide module, the coupling module and the substrate are arranged in sequence. The coupling module includes a first end and a second end arranged along the first plane, the first end of the coupling module is coupled with the active module, the second end of the coupling module passes out from between the second waveguide module and the substrate, the orthographic projection of the second end of the coupling module on the second plane is located within the coverage range of the orthographic projection of the second waveguide module and the substrate on the second plane, the refractive index of the coupling module is greater than the refractive index of the second waveguide module, and the refractive index of the coupling module is greater than the refractive index of the substrate.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication, and in particular to an active optical chip, a photoelectric conversion module, and related equipment. Background Technology

[0002] With the advent of the digital age and the rapid development of the internet industry, the optical equipment industry is also accelerating its development, leading to higher power budget requirements. Reducing the coupling insertion loss between active optical chips and optical fibers can effectively lower the power requirements of active optical chips. Coupling insertion loss is caused by a significant mismatch between the mode size of the active optical chip and the spot size of the optical fiber. Typically, active optical chips have a large far-field divergence angle, meaning a larger far-field spot size, which results in low coupling efficiency between the active optical chip and the optical fiber.

[0003] Figure 1 This is an example side view of an existing active optical chip. The active optical chip includes a substrate 101, an active module 102, a ridge waveguide 103, and an upper cladding 104 arranged longitudinally, perpendicular to the direction of optical signal propagation. The optical signal emitted from the active module 102 is emitted from the active optical chip and coupled to the optical fiber. The ridge waveguide 103 is used to confine the optical field longitudinally, reducing the coupling insertion loss of the optical signal coupled from the active module 102 to the optical fiber.

[0004] However, the ridge waveguide 103 is weakly confined, and the optical field is confined to the ridge region. Due to the asymmetry of the transverse (propagation direction of the optical signal) and longitudinal confinement of the active module 102, the light spot distribution is asymmetrical and the light spot area is small, that is, the far-field divergence angle is large and asymmetrical, so the coupling efficiency with the optical fiber is low, which increases the coupling insertion loss. Summary of the Invention

[0005] This application provides an active optical chip, a photoelectric conversion module, and related devices, which can improve the coupling efficiency between the active optical chip and the optical transmission medium and reduce coupling insertion loss.

[0006] In a first aspect, this application provides an active optical chip, including a substrate, an active module, a coupling module, a first waveguide module, and a second waveguide module. The substrate surface includes the active module and the coupling module arranged sequentially along a first plane, which is parallel to the substrate surface. Along a second plane, the first waveguide module, the active module, and the substrate are arranged sequentially, and along the second plane, the second waveguide module, the coupling module, and the substrate are arranged sequentially. The second plane intersects the substrate surface and also intersects the extension direction of the first waveguide module. The coupling module includes a first end and a second end arranged along the first plane. The first end of the coupling module is coupled to the active module, and the second end of the coupling module extends through the space between the second waveguide module and the substrate. The orthographic projection of the second end of the coupling module on the second plane is within the coverage area of ​​the orthographic projections of the second waveguide module and the substrate on the second plane. The refractive index of the coupling module is greater than that of the second waveguide module, and the refractive index of the coupling module is greater than that of the substrate.

[0007] As shown in this aspect, the refractive index of the coupling module is greater than that of the second waveguide module, and the refractive index of the coupling module is greater than that of the substrate. Therefore, the high-refractive-index coupling module is embedded in the low-refractive-index second waveguide module and the substrate material. The second waveguide module restricts the optical field of the emitted optical signal from the coupling module along a third direction (perpendicular to the propagation direction of the optical signal in the active optical chip), thereby reducing coupling insertion loss, improving the uniformity of the optical field distribution at the coupling module, resulting in a more circular light spot from the emitted optical signal, reducing the far-field divergence angle, and improving coupling efficiency and mode quality. Furthermore, the active module and the coupling module are arranged side-by-side along the first plane, avoiding the problem of reduced reliability of the active optical chip's optical port caused by oxidation of the active module.

[0008] Based on the first aspect, in one optional implementation, the second waveguide module includes a first end and a second end arranged along the first plane, the first end of the second waveguide module is coupled to the first waveguide module, the second end of the coupling module extends out from between the second end of the second waveguide module and the substrate, and the cross-sectional dimension of the second end of the coupling module along the second plane is smaller than the cross-sectional dimension of the second end of the second waveguide module along the second plane.

[0009] In this implementation, since the cross-sectional dimension of the second end of the coupling module along the second plane is smaller than that of the second end of the second waveguide module along the second plane, the high-refractive-index coupling module is buried in the low-refractive-index second waveguide module. As a result, the light spot of the optical signal emitted from the coupling module is relatively round, thereby reducing the insertion loss of optical signal coupling, improving the uniformity of the optical field distribution at the coupling module, reducing the far-field divergence angle, and improving coupling efficiency and mode quality.

[0010] Based on the first aspect, in one optional implementation, the second waveguide module includes a first end and a second end arranged along the first plane, the first end of the second waveguide module is coupled to the first waveguide module, and the cross-sectional dimension of the first end of the second waveguide module along the second plane is smaller than the cross-sectional dimension of the second end of the second waveguide module along the second plane.

[0011] In this implementation, since the cross-sectional dimension of the first end of the second waveguide module along the second plane is smaller than the cross-sectional dimension of the second end of the second waveguide module along the second plane, the limiting effect of the second waveguide module on the optical field becomes weaker and weaker along the direction away from the active module. This reduces the insertion loss of optical signal coupling, improves the uniformity of the optical field distribution at the coupling module, makes the spot of the optical signal emitted from the coupling module more round, reduces the far-field divergence angle, and improves coupling efficiency and mode quality.

[0012] Based on the first aspect, in one optional implementation, the width of the second waveguide module increases along the first direction, the width of the second waveguide module refers to the size of the second waveguide module along the second direction, the first direction refers to the direction from the first end of the coupling module to the second end of the coupling module, the second direction intersects with the first direction, and the first plane includes the first direction and the second direction.

[0013] In this implementation, the increasing width of the second waveguide module along the first direction indicates that the second waveguide module has an inverted tapered structure, which reduces mode mismatch and scattering coupling insertion loss. Because the width of the second waveguide module has an inverted tapered structure, its optical field confinement capability gradually weakens relative to the first waveguide module, resulting in a more expanded optical field distribution and effectively improving the efficiency of coupling optical signals from the active module to the coupling module.

[0014] Based on the first aspect, in one optional implementation, the cross-sectional dimension of the first end of the coupling module along the second plane is greater than the cross-sectional dimension of the second end of the coupling module along the second plane.

[0015] In this implementation, the cross-sectional dimension of the first end of the coupling module along the second plane is larger than the cross-sectional dimension of the second end of the coupling module along the second plane. This indicates that the second end of the coupling module forms a tip. The narrower second end of the coupling module enables high-efficiency coupling of optical signals. Moreover, the tip can also reduce the reflection of optical signals during the coupling process between the optical port of the active optical chip and the optical transmission medium.

[0016] Based on the first aspect, in one optional implementation, the width of the coupling module decreases along the first direction, the width of the coupling module refers to the size of the coupling module along the second direction, the first direction refers to the direction from the first end of the coupling module to the second end of the coupling module, the second direction intersects with the first direction, and the first plane includes the first direction and the second direction.

[0017] By adopting this implementation method, the width of the coupling module decreases along the first direction. As a result, the light spot of the light signal emitted from the coupling module is more round, which improves the uniformity of the light field distribution at the coupling module, reduces the far-field divergence angle, and improves the coupling efficiency and mode quality.

[0018] Based on the first aspect, in one optional implementation, the active optical chip further includes a transition module. Along the first plane, the active module, the transition module, and the coupling module are arranged sequentially, and along the second plane, the first waveguide module, the transition module, and the substrate are arranged sequentially. The width of the transition module along the first direction remains unchanged or approximately unchanged. The width of the transition module refers to the dimension of the transition module along the second direction. The first direction refers to the direction from the first end of the coupling module to the second end of the coupling module. The second direction intersects with the first direction.

[0019] In this implementation, the width of the transition module remains unchanged or approximately unchanged along the first direction. The transition module enables the mode field diameter to gradually change when the optical signal is coupled from the active module to the coupling module, avoiding mode mismatch caused by abrupt changes, reducing coupling insertion loss, and effectively improving the reliability of the active optical chip.

[0020] Based on the first aspect, in one optional implementation, the cross-sectional dimension of the first end of the coupling module along the second plane is equal to or approximately equal to the cross-sectional dimension of the second end of the coupling module along the second plane.

[0021] With this implementation, the cross-sectional dimension of the first end of the coupling module along the second plane is equal to or approximately equal to the cross-sectional dimension of the second end of the coupling module along the second plane, effectively improving the reliability of the active optical chip.

[0022] Based on the first aspect, in one optional implementation, the second waveguide module includes a first end and a second end arranged along the first plane, the first end of the second waveguide module is coupled to the first waveguide module, and the cross-sectional dimension of the first end of the second waveguide module along the second plane is equal to or approximately equal to the cross-sectional dimension of the second waveguide module along the second plane.

[0023] This implementation method effectively reduces the fabrication difficulty of active optical chips and improves fabrication efficiency.

[0024] Based on the first aspect, in one optional implementation, the first waveguide module is a ridge waveguide structure.

[0025] Using this implementation, the first waveguide module with a ridge waveguide structure can effectively limit the optical field along a third direction, improve coupling efficiency, and reduce coupling insertion loss.

[0026] Based on the first aspect, in one optional implementation, the size of the light spot corresponding to the optical port of the active optical chip is related to the size of the second end of the coupling module, and / or, the far-field divergence angle corresponding to the active optical chip is related to the size of the second end of the coupling module, wherein the optical port of the active optical chip includes the second end of the coupling module.

[0027] In this implementation, the dimensions of the second end of the coupling module include its width along the second direction and its height along the third direction. By adjusting the dimensions of the second end of the coupling module, the shape of the light spot corresponding to the optical port of the active optical chip is made approximately circular. This shape helps improve the coupling efficiency between the active optical chip and the optical transmission medium (e.g., optical fiber, optical element, optical device, or chip), and reduces the insertion loss of the optical signal. The far-field divergence angle of the optical signal emitted from the active optical chip refers to the divergence angle of the light field of the light signal emitted from the optical port of the active optical chip as it propagates in free space. By adjusting the dimensions of the second end of the coupling module to adjust the far-field divergence angle, the optical field of the active optical chip is further extended in the vertical direction, effectively improving the coupling efficiency between the optical port of the active optical chip and the optical transmission medium.

[0028] Based on the first aspect, in one optional implementation, along the second plane, the cross-section of the second end of the coupling module is one of a rectangle, triangle, circle, parallelogram, arc, trapezoid, or ridge.

[0029] This implementation method does not limit the shape of the cross-section at the second end of the coupling module, thus improving the flexibility of active optical chip fabrication.

[0030] Based on the first aspect, in one optional implementation, the optical port of the active optical chip is further fixed with a fiber optic adapter, the fiber optic adapter being connected to the second end of the coupling module and the optical fiber, and the optical port of the active optical chip including the second end of the coupling module.

[0031] Using this implementation, the active optical chip, through the fixed fiber optic adapter, can ensure that the optical signal is coupled to the optical fiber with high efficiency and effectively reduce the coupling insertion loss during the coupling process.

[0032] Based on the first aspect, in one optional implementation, the active optical chip further includes an optical modulator. Along the first plane, the active module, the optical modulator, and the coupling module are arranged in sequence. Along the second plane, the first waveguide module, the optical modulator, and the substrate are arranged in sequence. The active module is used to couple an optical signal to the optical modulator. The optical modulator is used to modulate the optical signal to obtain a modulated optical signal and to couple the modulated optical signal to the coupling module.

[0033] Using this implementation method, the active optical chip can modulate the optical chip, thereby improving the integration of the active optical chip.

[0034] In a second aspect, this application provides a photoelectric conversion module, including a processor and an active optical chip as described in any of the first aspects above, wherein the active optical chip includes a coupling module whose second end is coupled to an optical transmission medium; the processor is used to load a driving signal onto the active module, the active module is used to couple an optical signal onto the coupling module according to the driving signal, and the coupling module is used to couple the optical signal onto the optical transmission medium.

[0035] Thirdly, this application provides an optical device, including a housing, in which a processing chip is fixed, the processing chip being connected to a photoelectric conversion module, the photoelectric conversion module being as described in the second aspect above; the processing chip is used to load an electrical signal into the photoelectric conversion module, and the photoelectric conversion module is used to generate an optical signal based on the electrical signal.

[0036] Fourthly, this application provides a lidar, including a controller and an active optical chip connected to the controller, the active optical chip being as described in any of the first aspects above; the controller is used to load a detection electrical signal to the active module, the active module is used to convert the detection electrical signal into a detection optical signal, and emit the detection optical signal through the optical port of the active optical chip, the detection optical signal being used to detect relevant information of a target object.

[0037] Fifthly, this application provides a vehicle, including a vehicle body and a lidar fixed to the vehicle body, the lidar being as described in the fourth aspect above. Attached Figure Description

[0038] Figure 1 Example side view of an existing active optical chip structure;

[0039] Figure 2 This is an example diagram of the overall structure of the first embodiment of the active optical chip provided in this application;

[0040] Figure 3 A side view of the first embodiment of the active optical chip provided in this application is shown as an example.

[0041] Figure 4 A top view of the structure of the first embodiment of the active optical chip provided in this application;

[0042] Figure 5 A top-view example of the second type of active optical chip structure provided in this application;

[0043] Figure 6 An example diagram of the structure of the optical port of the active optical chip provided in this application on the second plane;

[0044] Figure 7 This is a side view example of a second embodiment of the active optical chip provided in this application;

[0045] Figure 8 A top view of the third embodiment of the active optical chip provided in this application is shown as an example.

[0046] Figure 9 A side view diagram illustrating a third embodiment of the active optical chip provided in this application;

[0047] Figure 10 A structural example diagram of one embodiment of the photoelectric conversion module provided in this application;

[0048] Figure 11 This is a structural example diagram of one embodiment of the optical device provided in this application;

[0049] Figure 12 A structural example diagram of one embodiment of the lidar provided in this application;

[0050] Figure 13 An example structural diagram of one embodiment of the vehicle provided in this application. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] This application provides an active optical chip that can be applied to various types of optical devices. These optical devices can be optical transmission devices, optical access devices, routers, switches, wireless base stations, wireless remote access devices, wireless baseband signal processing devices, etc., or they can be computing servers (commonly referred to as servers), high-performance computers (HPCs), storage servers, or memory resource pools, etc. For example, if the optical network used by this optical device is a passive optical network (PON), then the optical device can be an optical network unit (ONU), an optical network terminal (ONT), or an optical line terminal (OLT). As another example, if the optical network used by this optical device is an optical transport network (OTN), then the optical device can be an OTN device. Furthermore, if the optical network used by this optical device is a data center network (DCN) or a metropolitan area network, then the optical device can be a server, etc. For example, if the optical network used by the optical equipment is radio-over-fiber (ROF), then the optical equipment can be a central station (CS) or a base station (BS). Similarly, if the optical network used by the optical equipment is fiber-to-the-room (FTTR), then the optical equipment can be a master or slave device deployed in the FTTR. The master device can also be called a "master gateway," "master optical modem," or "master FTTR device," etc., and the slave device can be called a "slave gateway," "slave optical modem," or "slave FTTR device," etc. This application does not limit their specific names. Furthermore, if the optical network used by the optical equipment is also a detection network, then the type of optical equipment can be a distributed fiber-optic acoustic sensor (DAS) device.

[0053] Active optical chips, as a key component in optical networks, undertake many crucial functions in the system, such as high-speed modulation of optical signals, generation of optical signals, and amplification of optical signals. Combined with... Figures 2 to 4 The diagram illustrates the structure of the active optical chip provided in the embodiments of this application. Wherein, Figure 2 This is an example diagram of the overall structure of the first embodiment of the active optical chip provided in this application. Figure 3 This is a side view example of the first embodiment of the active optical chip provided in this application. Figure 4 This is a top view of an example structure of the first embodiment of the active optical chip provided in this application. Specifically, the active optical chip shown in this embodiment includes a substrate 200, an active module 201, a coupling module 202, a transition module 203, a first waveguide module 204, a second waveguide module 205, and an electrode 206. Figure 2 The image shown is an example of the three-dimensional structure of an active optical chip in the XYZ space. Figure 4 This is a top view example of the structure of an active optical chip within a first plane XY. The first plane XY includes a first direction X and a second direction Y. The first direction X is the direction of optical signal propagation in the active optical chip, and the second direction Y intersects with the first direction X, for example, the second direction Y is perpendicular to the first direction X. Figure 3 This is a side view example of an active optical chip structure within a third plane XZ. The third plane XZ intersects the surface of the substrate 200; for example, the third plane XZ is perpendicular to the surface of the substrate 200. Specifically, the third plane XZ includes a first direction X and a third direction Z. The third direction Z intersects the first direction X and the second direction Y, respectively; for example, the third direction Z is perpendicular to the first direction X and the second direction Y, respectively.

[0054] The substrate 200 is typically made of semiconductor materials, such as gallium arsenide (GaAs), indium phosphide (InP), or silicon (Si), providing the active optical chip with mechanical strength and stability. Optionally, the surface of the substrate 200 may also include a cladding layer, which isolates the optical transmission layer (including the first waveguide module 204, the second waveguide module 205, and the coupling module 202 shown above) from the substrate 200 to prevent light field leakage to the substrate 200. Specifically, the refractive index of the cladding layer is lower than that of the optical transmission layer, allowing the optical signal to be confined to the optical transmission layer. For example, the cladding layer can be made of aluminum gallium arsenide (AlGaAs) or InP, etc., without specific limitations.

[0055] The substrate 200 surface includes an active module 201, a transition module 203, and a coupling module 202 arranged sequentially along a first plane XY. It can be understood that along the first plane XY, the transition module 203 is located between the coupling module 202 and the active module 201. The active module 201 is made of a multilayer semiconductor material, such as indium gallium arsenide phosphide (InGaAsP), InP, GaAs, AlGaAs, etc. For example, the specific structure of the active module 201 can be a multiple quantum well (MQW), without limitation; alternatively, the active module 201 can also adopt a single quantum well structure. Along the second plane YZ, the electrode 206, the first waveguide module 204, the active module 201, and the substrate 200 are arranged sequentially. The second plane YZ includes a second direction Y and a third direction Z. It can be understood that the second plane YZ shown in this embodiment intersects with both the first plane XY and the third plane XZ; for example, the second plane YZ is perpendicular to both the first plane XY and the third plane XZ. The first waveguide module 204 can be made of silicon dioxide (SiO2), silicon nitride (SiN), silicon (Si), lithium niobate (LN), lithium phosphate (LP), indium phosphide (InP), silicon oxynitride (SiON), gallium arsenide (GaAs), germanium (Ge), polymers, fluoride glasses, chalcogenide glasses, etc. The first waveguide module 204 shown in this embodiment can be a ridge waveguide structure. The ridge waveguide structure, formed by an etching process, is a ridge-shaped structure along the third direction Z, located above the active module 201. The sidewalls of the ridge-shaped structure of the first waveguide module 204 can be exposed to air or covered by a low-refractive-index upper cladding 303, which is made of a low-refractive-index material. The upper cladding 303 is used to prevent optical signal leakage, reduce optical signal coupling insertion loss, and protect the active module 201, transition module 203, first waveguide module 204, second waveguide module 205, and coupling module 202.

[0056] In this embodiment, electrode 206 is electrically connected to active module 201, specifically meaning that an electrical path is formed between electrode 206 and active module 201 through a conductive material (such as metal). For example, if the active optical chip is used as a laser chip to emit optical signals, electrode 206 applies an electrical signal (e.g., charge carriers, i.e., electrons and holes) to active module 201 based on the electrical path to drive active module 201 to generate optical signals. Therefore, this active optical chip can be used as a distributed feedback laser (DFB), without limitation. For example, the type of active optical chip can also be a directly modulated laser (DML) or an electro-absorption modulated laser (EML). For example, if an active optical chip is used as an optical amplifier, and the active module 201 receives the optical signal to be amplified, and the electrode 206 injects current into the active module 201 so that the active module 201 is stimulated to emit radiation to amplify the optical power of the optical signal, then the active optical chip can be a semiconductor optical amplifier (SOA). Figures 2 to 4 Taking the example where electrode 206 is located above the active module 201, electrode 206 is a p-type electrode. The active optical chip also includes an n-type electrode (not shown in the figure). The position of the n-type electrode in the active optical chip is not limited; for example, the n-type electrode can be located at the bottom of the substrate. In this embodiment, the wavelength of the light signal emitted by the active optical chip is not limited; for example, the wavelength of the light signal can be located in the O-band or C-band, etc.

[0057] The optical chip shown in this embodiment includes a spot size converter (SSC). Specifically, the SSC includes a first waveguide module 204, a second waveguide module 205, and a coupling module 202. Along a third plane XZ, the second waveguide module 205, the coupling module 202, and the substrate 200 are arranged sequentially. The first waveguide module 204, the second waveguide module 205, and the coupling module 202 are used to confine and guide the light field, causing it to propagate along a specific path to couple to the optical transmission medium to which the active optical chip is connected. This optical transmission medium can be an optical fiber, optical element, optical device, chip, etc. Along the third plane XZ, the first waveguide module 204, the transition module 203, and the substrate 200 are arranged sequentially. The transition module 203 includes a first end and a second end arranged along a first plane XY. The first end of the transition module 203 is coupled to the active module 201, and the second end of the transition module 203 is coupled to the coupling module 202. The coupling module 202 includes a first end and a second end arranged along the first plane XY. The first end of the coupling module 202 is coupled to the second end of the transition module 203, and the second end of the coupling module 202 extends from between the second waveguide module 205 and the substrate 200. Specifically, a target region can be etched on the surface of the substrate 200, adjacent to the active module 201, and a passive waveguide layer (i.e., the transition module 203 and coupling module 202 shown in this embodiment) can be fabricated in the target region. The first ends of the active module 201 and the transition module 203 are precisely aligned to achieve coupling. For example, the active module 201 and the transition module 203 are coupled by butt coupling or end-to-end joint, achieving precise alignment between the active module 201 and the transition module 203 along the first plane XY, improving the coupling efficiency of the optical signal, reducing coupling insertion loss, and improving the performance and integration of the active optical chip. Furthermore, along the first direction X, the width of the transition module 203 remains unchanged or approximately unchanged. The width of the transition module 203 refers to its dimension along the second direction Y. Specifically, the first direction X shown in this embodiment may have a specific orientation; that is, the first direction X refers to the direction from the first end of the coupling module 202 to the second end of the coupling module 202. In this embodiment, the target end of the active module 201 is coupled to the first end of the transition module 203, and the second end of the transition module 203 is coupled to the first end of the coupling module 202.Optionally, along the second direction Y, the width of the first end of the transition module 203 is equal to or approximately equal to the width of the target end of the active module 201, and the width of the second end of the transition module 203 is equal to or approximately equal to the width of the coupling module 202. The transition module 203 enables the mode field diameter to gradually change when the optical signal is coupled from the active module 201 to the coupling module 202, avoiding mode mismatch caused by abrupt changes, reducing coupling insertion loss, and effectively improving the reliability of the SSC. In this embodiment, the refractive index of the transition module 203 is equal to or approximately equal to the refractive index of the coupling module 202, so that the optical signal transmitted by the transition module 203 and the optical signal transmitted by the coupling module 202 maintain phase matching and mode matching, thereby improving the coupling efficiency of optical signal coupling between the transition module 203 and the coupling module 202. It should be noted that the description of the structure of the transition module 203 in this embodiment is an optional example and is not limited, as long as the transition module 203 can efficiently couple the optical signal emitted from the active module 201 to the coupling module 202.

[0058] Figure 4 As shown, taking the example where the width of the second waveguide module 205 remains unchanged or approximately unchanged along the first direction X, the width of the second waveguide module 205 refers to the dimension of the second waveguide module 205 along the second direction Y. Specifically, the first direction X shown in this example refers to the direction from the first end of the coupling module 202 to the second end of the coupling module 202, and is not limited. Figure 5 As shown, Figure 5 This is a top-view example of the second active optical chip structure provided in this application. This example takes the gradual increase in width of the second waveguide module 205 along the second direction Y along the first direction X as an example. As shown above, the first waveguide module 204 is a ridge waveguide. Therefore, if the width of the first waveguide module 204 remains constant or approximately constant along the first direction X, while the width of the second waveguide module 205 increases, it indicates that the structure of the second waveguide module 205 is an inverted tapered structure. That is, the width of the second waveguide module 205 changes from small to large along the first direction X. This trend of change from small to large can be a linear trend or a non-linear trend (such as exponential, parabolic, etc.). There is no specific limitation, as long as the change in width of the second waveguide module 205 along the first direction X is smooth, to reduce mode mismatch and coupling insertion loss. Since the width of the second waveguide module 205 has an inverted Taper structure, the optical field confinement capability of the second waveguide module 205 gradually weakens relative to the first waveguide module 204, thereby expanding the optical field distribution and effectively improving the efficiency of the active module 201 coupling optical signals to the coupling module 202.

[0059] like Figure 4 as well as Figure 5As shown, the width of the coupling module 202 decreases along the first direction X. The width of the coupling module 202 refers to its dimension along the second direction Y. This indicates that the coupling module 202 has a tapered structure along the first direction X. Furthermore, the second end of the coupling module 202 extends from between the second waveguide module 205 and the substrate 200. It can be understood that the orthographic projection of the second end of the coupling module 202 onto the second plane YZ is within the coverage area of ​​the orthographic projection of the transition module 203 onto the second plane YZ. Moreover, the orthographic projection of the second end of the coupling module 202 onto the second plane YZ is within the coverage area of ​​the orthographic projections of the second waveguide module 205 and the substrate 200 onto the second plane YZ. See [link to details]. Figure 6 As shown, Figure 6 This is an example diagram illustrating the structure of the optical port of the active optical chip provided in this application on a second plane. The second waveguide module 205 includes a first end and a second end arranged sequentially along the first plane XY. The first end of the second waveguide module 205 is coupled to the first waveguide module 204. The active optical chip includes an optical port 600, which includes the side surface of the substrate 200 arranged sequentially along the third plane XZ and the second end 602 of the second waveguide module. The orthographic projection of the second end 601 of the coupling module 202 onto the second plane YZ is located within the coverage area of ​​the second waveguide module 205 on the second plane YZ. In this embodiment, the refractive index of the coupling module 202 is greater than that of the second waveguide module 205, and the refractive index of the coupling module 202 is greater than that of the substrate 200. Therefore, the optical port shown in this embodiment has a structure similar to a buried heterostructure waveguide (BH). It can be understood that the high-refractive-index coupling module 202 shown in this embodiment is buried in the low-refractive-index material of the second waveguide module 205. The second waveguide module 205 confines the optical field of the optical port along the third direction Z, thereby reducing the coupling insertion loss of the optical signal, improving the uniformity of the optical field distribution at the optical port, resulting in a more circular light spot emitted from the optical port, reducing the far-field divergence angle, and improving coupling efficiency and mode quality. The confinement effect of the second waveguide module 205 on the optical field along the first direction X gradually weakens, effectively reducing the far-field divergence angle of the active optical chip. The optical port 600 shown in this embodiment does not include the active module 201, avoiding the problem of reduced reliability of the active optical chip caused by oxidation of the optical port. This embodiment takes an active optical chip including one optical port as an example. Optionally, the active optical chip may include a first optical port and a second optical port arranged along the first direction X. Along the first direction, the active module may be located between the first optical port and the second optical port. For a description of the structure of the first optical port and the second optical port, please refer to the description of the structure of optical port 600. Specific details will not be repeated here.

[0060] This embodiment takes the example of the width of the coupling module 202 gradually decreasing along the first direction X and the second direction Y, without limitation. For example, in other examples, the width of the coupling module 202 along the first direction X and the second direction Y also remains unchanged or approximately unchanged.

[0061] Optionally, the optical port of the active optical chip described in this embodiment is also fixed with a fiber optic adapter. The fiber optic adapter connects the second end of the coupling module and the optical fiber. This embodiment does not limit the type of fiber optic adapter. For example, the fiber optic adapter can be a ferrule connector (FC), a subscriber connector (SC), a lucent connector (LC), a straight tip (ST), a fiber distributed data interface (FDDI), or a multi-fiber push-on connector (MPO), etc. The fiber optic adapter can also be connected to the optical fiber through a movable connector, a modular optical fiber access structure, etc., and the specific connection is not limited.

[0062] In this embodiment, the cross-sectional dimension of the first end of the coupling module along the second plane YZ is larger than that of the second end of the coupling module along the second plane YZ. This indicates that the second end of the coupling module forms a pointed tip. The narrower second end of the coupling module enables high-efficiency coupling of optical signals. Furthermore, the pointed tip can also reduce reflection of optical signals during the coupling process between the optical port of the active optical chip and the optical fiber. This embodiment does not limit the cross-sectional shape of the second end of the coupling module along the second plane YZ. Figure 6 The example shown uses a rectangular cross-sectional shape along the second plane YZ at the second end of the coupling module. In other examples, the cross-sectional shape along the second plane YZ at the second end of the coupling module can also be triangular, circular, parallelogram, arc, trapezoid, ridge, etc.

[0063] Continue to combine Figure 6As shown, the size of the light spot at the optical port of the active optical chip is related to the size of the second end 601 of the coupling module, and / or, the far-field divergence angle of the optical signal emitted by the active optical chip is related to the size of the second end 601 of the coupling module. The size of the second end 601 of the coupling module includes the width W along the second direction Y and the height H along the third direction Z. The light spot size corresponding to the optical port of the active optical chip refers to the light spot size near the output surface of the optical port of the active optical chip. The light spot size is specifically described by the light spot size along the vertical (V) and horizontal (H) directions of the light port of the active optical chip. In this example, the light spot size along V of the light port of the active optical chip is 2.04 μm, and along H it is 2.16 μm. The distribution range of the light spot size along H and V of the light port of the active optical chip is similar, indicating that the light spot shape is close to a circle. This shape of light spot helps to improve the coupling efficiency between the active optical chip and the optical transmission medium (such as optical fiber, optical element, optical device, or chip) and reduce the coupling insertion loss of optical signal. It should be clarified that the specific size and shape of the light spot corresponding to the optical port of the active optical chip described in this embodiment are optional examples and are not limited. The specific size and shape of the light spot corresponding to the optical port of the active optical chip can be adjusted as needed by adjusting the width W along the second direction Y and the height H along the third direction Z of the second end 601 of the coupling module. The far-field divergence angle of the optical signal emitted by the active optical chip refers to the divergence angle of the light field of the optical signal emitted from the optical port of the active optical chip when it propagates in free space. The far-field divergence angle of the optical signal emitted by the active optical chip is usually described by the divergence angles V and H. In this example, the far-field divergence angle along V is 14.6° and the angle along H is 10.4°. The far-field divergence angle of the optical signal emitted by the active optical chip shown in this example is relatively large along H and relatively small along V, indicating that the optical field has a stronger vertical extension, effectively improving the coupling efficiency between the optical port of the active optical chip and the optical transmission medium. This example of the far-field divergence angle of the active optical chip's optical port is optional and not limited. As long as the far-field divergence angle can be adjusted by changing the width W of the second end 601 of the coupling module along the second direction Y and the height H along the third direction Z, the purpose of adjusting the far-field divergence angle of the optical signal emitted by the active optical chip can be achieved.

[0064] The above embodiment uses an active optical chip including a transition module as an example. The transition module shown in this embodiment is an optional structure; for details, please refer to [link / reference needed]. Figure 7 as well as Figure 8 As shown, where, Figure 7 This is a side view example of the second embodiment of the active optical chip provided in this application. Figure 8This is a top view example of the third embodiment of the active optical chip provided in this application.

[0065] The active optical chip shown in this embodiment includes a substrate 700, an active module 701, a coupling module 702, a first waveguide module 704, a second waveguide module 705, an upper cladding layer 703, and an electrode 706. For details, please refer to the above embodiment. The difference between this embodiment and the above embodiment is that the active optical chip shown in this embodiment does not include a transition module. That is, the first end of the coupling module 702 is directly coupled to the active module 701.

[0066] This embodiment does not limit the number of coupling modules. The above embodiment uses one coupling module as an example. In other examples, the number of coupling modules can be N, where N is any integer greater than 1. Each of the N coupling modules is coupled to a transition module, or each coupling module is directly coupled to an active module. The specific number is not limited. When the active optical chip includes multiple coupling modules, the active optical chip can achieve the purpose of emitting multiple optical signals, thereby improving the transmission bandwidth.

[0067] Figure 9 This is a side view example of the third embodiment of the active optical chip provided in this application. The active optical chip shown in this embodiment includes a substrate 900, an active module 901, a coupling module 902, a first waveguide module 904, a second waveguide module 905, an upper cladding layer 903, and electrodes 906. For detailed descriptions, please refer to the embodiments described above; further details are omitted here. The difference between the active optical chip shown in this embodiment and the embodiments described above is that the active optical chip shown in this embodiment also includes an optical modulator 910, and the optical modulator 910 is included between the active module 901 and the coupling module 902 along the first plane XY. Furthermore, the first waveguide module 904, the optical modulator 910, and the substrate 900 are arranged sequentially along the second plane YZ. The optical signal emitted by the active module 901 is coupled to the optical modulator 910. The optical modulator 910 modulates the optical signal to output a modulated optical signal. This embodiment does not limit the type of the optical modulator 910; for example, it can be a Mach-Zehnder modulator (MZM) or a micro-ring modulator (MRM). The optical modulator 910 then couples the modulated optical signal to the coupling module 902. Optionally, a transition module may be included between the optical modulator 910 and the coupling module 902 in this embodiment. For a description of the transition module, please refer to the above embodiment; further details are omitted here.

[0068] Figure 10This is a structural example diagram of one embodiment of the photoelectric conversion module provided in this application. The photoelectric conversion module 1000 provided in this embodiment can also be called an optical transceiver module or an optical module, etc. The photoelectric conversion module 1000 shown in this embodiment specifically includes a processor 1001 and an active optical chip 1002. This embodiment does not limit the type of processor 1001. For example, the processor 1001 can be one or more chips, or one or more integrated circuits. For example, the processor 1001 can be one or more optical digital signal processors (oDSP), field-programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), system-on-chips (SoC), central processing units (CPU), network processors (NP), microcontroller units (MCU), programmable logic devices (PLD), network interface cards (NICs), storage interface chips, or other integrated chips, or any combination of the above chips or processing modules, etc., which will not be elaborated further. For a description of the structure of the active optical chip 1002, please refer to the above embodiment; specific details will not be repeated here. The processor 1001 shown in this embodiment is used to load a drive signal to the active module of the active optical chip 1002. The active module is used to couple an optical signal to the coupling module according to the drive signal. The coupling module is used to couple the optical signal to the optical transmission medium (e.g., optical fiber). This embodiment does not limit the description of the function of the processor 1001. For example, the processor 1001 can also be used for protocol processing, data encapsulation, performance monitoring, etc.

[0069] This application also provides an optical device. Figure 11 This is a structural example diagram of an embodiment of the optical device provided in this application. The optical device includes a housing 1100, within which a processing chip 1101 is fixed. The processing chip 1101 is connected to a photoelectric conversion module 1102. For a description of the photoelectric conversion module 1102, please refer to [link to relevant documentation]. Figure 10 As shown, details will not be elaborated further. For a description of the processing chip type 1101, please refer to [link to relevant documentation]. Figure 10The specific processor type will not be elaborated further. The processing chip 1101 is used to load electrical signals into the photoelectric conversion module 1102, and the photoelectric conversion module 1102 is used to generate optical signals based on the electrical signals. For a description of the specific device type of the optical device in this embodiment, please refer to the above embodiment; specific details will not be repeated here.

[0070] This application also provides a co-packaged-optics (CPO) chip, which includes a switching substrate, a logic processing chip, and multiple optoelectronic conversion modules. This embodiment does not limit the number of optoelectronic conversion modules included in the CPO chip. The logic processing chip and each optoelectronic conversion module are packaged on the same switching substrate to achieve opto-packaging between the logic processing chip and each optoelectronic conversion module. This shortens the distance between the logic processing chip and each optoelectronic conversion module, reduces the power consumption of electrical signal transmission between the logic processing chip and each optoelectronic conversion module, and thus reduces the bit error ratio (BER) of the optical communication device. For a description of the structure of each optoelectronic conversion module, please refer to [link to relevant documentation]. Figure 10 As shown, no specific limitations are imposed. For a description of the logic processing chip type, please refer to the above description of processor types; details will not be repeated here. The switching substrate shown in this embodiment may include one or more layers of substrate material, with conductive traces arranged on one or both sides of each substrate. This embodiment does not limit the type of substrate material; for example, the substrate may be paper-based, glass fiber cloth-based, composite-based, ceramic-based, metal-core-based, etc. Based on the conductive traces of the switching substrate, electrical connections between any two devices packaged on the switching substrate are achieved.

[0071] Figure 12 This is a structural example diagram of one embodiment of the lidar provided in this application. LiDAR is a target detection technology. LiDAR emits a detection light signal for detection; when this light signal encounters a target object, it undergoes diffuse reflection. The lidar determines the target object's distance, azimuth, height, speed, attitude, shape, and other characteristics based on the reflected light signal. LiDAR is applied in fields such as intelligent driving vehicles, intelligent aircraft, 3D printing, virtual reality (VR), augmented reality (AR), and service robots. The intelligent driving in this embodiment can be autonomous driving, automatic driving, or assisted driving.

[0072] The lidar 1200 shown in this embodiment includes a controller 1201 and an active optical chip 1202 connected to the controller 1201. For a description of the structure of the active optical chip 1202, please refer to the above embodiment; details will not be repeated here. For a description of the type of the controller 1201, please refer to the above description of the processor type; details will not be repeated here. The controller 1201 is used to send a detection electrical signal to the active optical chip 1202. The active optical chip 1202 is used to convert the detection electrical signal into a detection optical signal and emit the detection optical signal towards the target object. The detection optical signal is used to detect relevant information about the target object. When the detection optical signal encounters the target object, it is reflected on the surface of the target object. Optionally, the lidar shown in this embodiment may also include a detector. The target object reflects an echo optical signal back to the lidar. The detector is connected to the controller 1201. The detector is used to receive the echo optical signal and convert it into a detection electrical signal. The detector sends the detection electrical signal to the controller 1201, and the controller 1201 obtains relevant information about the target object based on the detection electrical signal. Specifically, the controller 1201 can determine the location information of the target object by calculating the time delay between the emission time of the probe light signal and the return time of the echo light signal.

[0073] The above embodiment illustrates the application of active optical chips to lidar in transportation vehicles. In other examples, active optical chips can also be applied to fixed radar (e.g., radar fixed on highways, surveillance radar, radar in industrial settings, etc.). Active optical chips can also be applied to radar in unmanned transport vehicles in logistics warehouses or radar in smart home appliances (e.g., automatic cleaning robots), etc., without specific limitations.

[0074] This embodiment also provides a means of transportation; for a detailed description of its structure, please refer to [link / reference needed]. Figure 13 As shown, where, Figure 13 This is a structural example diagram of one embodiment of the vehicle provided in this application. The vehicle shown in this example may be a car, truck, motorcycle, public vehicle, lawnmower, recreational vehicle, amusement park vehicle, tram, golf cart, train, handcart, or drone, etc. This embodiment configures the vehicle 1300 in a fully or partially automated driving mode. The vehicle shown in this embodiment includes a vehicle body, which is used to fix a sensor system 1320, an advanced driving assistance system (ADAS) 1310, peripheral devices 1330, and a computer system 1340.

[0075] Sensing system 1320 includes one or more sensors that sense environmental information about the vicinity of vehicle 1300. For example, sensing system 1320 may include a positioning system, such as a Global Positioning System (GPS) or BeiDou Navigation Satellite System. Sensing system 1320 also includes an inertial measurement unit (IMU), a lidar sensor, and a camera. For a description of lidar, please refer to [link to lidar documentation]. Figure 12 The specific embodiments are not limited. The sensing system 1320 may also include sensors for monitoring the internal systems of the vehicle 1300 (e.g., an in-vehicle air quality monitor, fuel gauge, oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). A positioning system can be used to estimate the geographical location of the vehicle 1300. An IMU is used to sense changes in the position and orientation of the vehicle 1300 based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. A lidar can use radio signals to detect target objects in the surrounding environment of the vehicle 1300, such as pedestrians, vehicles, or buildings.

[0076] The ADAS1310 continuously senses the surrounding environment during vehicle operation, collects data, identifies, detects, and tracks static and dynamic objects, and combines this data with navigation map data for system calculations and analysis. This allows the driver to anticipate potential hazards, effectively increasing driving comfort and safety. For example, the ADAS1310 can control the vehicle using data acquired by the sensor system 1320. Furthermore, the ADAS1310 can control the vehicle using vehicle driving-related information, such as key data displayed on the vehicle's dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed, steering wheel angle information, or vehicle attitude data.

[0077] Vehicle 1300 interacts with external sensors, other vehicles, other computer systems, or users via peripheral device 1330. Peripheral device 1330 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of vehicle 1300. A user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touchscreen. In other cases, peripheral device 1330 may provide a means for vehicle 1300 to communicate with other devices located within the vehicle. For example, a microphone may receive audio (e.g., voice commands or other audio input) from the user of vehicle 1300. A speaker may output audio to the user of vehicle 1300. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0078] Some or all of the functions of the vehicle 1300 are controlled by a computer system 1340. The computer system 1340 can control the functions of the vehicle 1300 based on input received from various systems (e.g., sensor system 1320, ADAS 1310, peripheral devices 1330) and from a user interface. The computer system 1340 may include at least one processor that executes instructions stored in memory.

[0079] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0080] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An active optical chip, characterized in that, The device includes a substrate, an active module, a coupling module, a first waveguide module, and a second waveguide module. The substrate surface includes the active module and the coupling module arranged sequentially along a first plane, which is parallel to the substrate surface. Along a second plane, the first waveguide module, the active module, and the substrate are arranged sequentially, and along the second plane, the second waveguide module, the coupling module, and the substrate are arranged sequentially. The second plane intersects the substrate surface and also intersects the extension direction of the first waveguide module. The coupling module includes a first end and a second end arranged along the first plane. The first end of the coupling module is coupled to the active module, and the second end of the coupling module extends between the second waveguide module and the substrate. The orthographic projection of the second end of the coupling module on the second plane is within the coverage area of ​​the orthographic projections of the second waveguide module and the substrate on the second plane. The refractive index of the coupling module is greater than that of the second waveguide module, and the refractive index of the coupling module is greater than that of the substrate.

2. The active optical chip according to claim 1, characterized in that, The second waveguide module includes a first end and a second end arranged along the first plane. The first end of the second waveguide module is coupled to the first waveguide module. The second end of the coupling module extends from between the second end of the second waveguide module and the substrate. The cross-sectional dimension of the second end of the coupling module along the second plane is smaller than the cross-sectional dimension of the second end of the second waveguide module along the second plane.

3. The active optical chip according to claim 1 or 2, characterized in that, The second waveguide module includes a first end and a second end arranged along the first plane. The first end of the second waveguide module is coupled to the first waveguide module. The cross-sectional dimension of the first end of the second waveguide module along the second plane is smaller than the cross-sectional dimension of the second end of the second waveguide module along the second plane.

4. The active optical chip according to claim 3, characterized in that, The width of the second waveguide module increases along the first direction. The width of the second waveguide module refers to the size of the second waveguide module along the second direction. The first direction refers to the direction from the first end of the coupling module to the second end of the coupling module. The second direction intersects with the first direction, and the first plane includes both the first direction and the second direction.

5. The active optical chip according to any one of claims 1 to 4, characterized in that, The cross-sectional dimension of the first end of the coupling module along the second plane is larger than the cross-sectional dimension of the second end of the coupling module along the second plane.

6. The active optical chip according to claim 5, characterized in that, The width of the coupling module decreases along the first direction. The width of the coupling module refers to the size of the coupling module along the second direction. The first direction refers to the direction from the first end of the coupling module to the second end of the coupling module. The second direction intersects with the first direction, and the first plane includes both the first direction and the second direction.

7. The active optical chip according to any one of claims 1 to 6, characterized in that, The active optical chip further includes a transition module. Along the first plane, the active module, the transition module, and the coupling module are arranged in sequence. Along the second plane, the first waveguide module, the transition module, and the substrate are arranged in sequence. The width of the transition module remains unchanged or approximately unchanged along the first direction. The width of the transition module refers to the size of the transition module along the second direction. The first direction refers to the direction from the first end of the coupling module to the second end of the coupling module. The second direction intersects with the first direction.

8. The active optical chip according to any one of claims 1 to 4, characterized in that, The cross-sectional dimensions of the first end of the coupling module along the second plane are equal to or approximately equal to the cross-sectional dimensions of the second end of the coupling module along the second plane.

9. The active optical chip according to claim 1 or 2, characterized in that, The second waveguide module includes a first end and a second end arranged along the first plane. The first end of the second waveguide module is coupled to the first waveguide module. The cross-sectional dimension of the first end of the second waveguide module along the second plane is equal to or approximately equal to the cross-sectional dimension of the second waveguide module along the second plane.

10. The active optical chip according to any one of claims 1 to 9, characterized in that, The first waveguide module is a ridge waveguide structure.

11. The active optical chip according to any one of claims 1 to 10, characterized in that, The size of the light spot at the optical port of the active optical chip is related to the size of the second end of the coupling module, and / or the far-field divergence angle of the active optical chip is related to the size of the second end of the coupling module, wherein the optical port of the active optical chip includes the second end of the coupling module.

12. The active optical chip according to any one of claims 1 to 11, characterized in that, Along the second plane, the cross-section of the second end of the coupling module is one of the following shapes: rectangle, triangle, circle, parallelogram, arc, trapezoid, and ridge.

13. The active optical chip according to any one of claims 1 to 12, characterized in that, The optical port of the active optical chip is also fixed with a fiber optic adapter, which connects the second end of the coupling module and the optical fiber. The optical port of the active optical chip includes the second end of the coupling module.

14. The active optical chip according to any one of claims 1 to 13, characterized in that, The active optical chip further includes an optical modulator. Along the first plane, the active module, the optical modulator, and the coupling module are arranged in sequence. Along the second plane, the first waveguide module, the optical modulator, and the substrate are arranged in sequence. The active module is used to couple an optical signal to the optical modulator. The optical modulator is used to modulate the optical signal to obtain a modulated optical signal and to couple the modulated optical signal to the coupling module.

15. A photoelectric conversion module, characterized in that, Includes a processor and an active optical chip as described in any one of claims 1 to 14, wherein the active optical chip includes a second end of the coupling module coupled with an optical transmission medium; The processor is used to load a drive signal to the active module, the active module is used to couple an optical signal to the coupling module according to the drive signal, and the coupling module is used to couple the optical signal to the optical transmission medium.

16. An optical device, characterized in that, The device includes an outer casing, in which a processing chip is fixed, and the processing chip is connected to a photoelectric conversion module as described in claim 15; The processing chip is used to load an electrical signal into the photoelectric conversion module, and the photoelectric conversion module is used to generate an optical signal based on the electrical signal.

17. A lidar, characterized in that, It includes a controller and an active optical chip connected to the controller, the active optical chip being as described in any one of claims 1 to 14; The controller is used to load a detection electrical signal into the active module, the active module is used to convert the detection electrical signal into a detection optical signal, and emit the detection optical signal through the optical port of the active optical chip, the detection optical signal is used to detect relevant information of the target object.

18. A means of transportation, characterized in that, The system includes a vehicle body and a lidar fixed to the vehicle body, as described in claim 17.

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