Electronic paper display device

Abstract

The present application provides an electronic paper display device including an electronic paper carrier structure, an electronic paper display layer, and an edge conductive pattern. The electronic paper carrier structure has a display surface, a bonding surface, and a side connecting surface. The display surface is opposite to the bonding surface, and the side connecting surface is connected between the display surface and the bonding surface. The electronic paper carrier structure includes a display surface contact pad exposed on the display surface and a bonding surface contact pad exposed on the bonding surface. The electronic paper display layer is disposed on the display surface of the electronic paper carrier structure. The edge conductive pattern is in physical contact with the electronic paper carrier structure. The edge conductive pattern is in physical contact with the side connecting surface and continuously extends between the display surface and the bonding surface on the side connecting surface to contact the display surface contact pad and the bonding surface contact pad.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic paper display device. Background Technology

[0002] In electronic paper displays, the driver circuit chip is often bonded to the display panel via chip-on-glass (COG) or chip-on-film (COF) packaging, and simultaneously connected to external systems using flexible circuit boards. Reducing bezel width is one of the development directions for various display devices, but the methods mentioned above cannot meet the demand for narrow bezels. Therefore, there is still room for improvement in electronic paper displays. Summary of the Invention

[0003] This invention relates to an electronic paper display device that may have a narrow bezel structure.

[0004] According to an embodiment of the present invention, an electronic paper display device includes an electronic paper carrier structure, an electronic paper display layer, and an edge conductive pattern. The electronic paper carrier structure has a display surface, a bonding surface, and a side connecting surface. The display surface and the bonding surface face each other, and the side connecting surface connects between the display surface and the bonding surface. The electronic paper carrier structure includes a display surface pad exposed on the display surface and a bonding surface pad exposed on the bonding surface. The electronic paper display layer is disposed on the display surface of the electronic paper carrier structure. The edge conductive pattern solid contacts the electronic paper carrier structure. The edge conductive pattern solid contacts the side connecting surface and extends continuously on the side connecting surface between the display surface and the bonding surface to contact the display surface pad and the bonding surface pad.

[0005] In the electronic paper display device according to an embodiment of the present invention, the aforementioned edge conductive pattern includes a first part, a second part, and a third part. The first part is disposed on the display surface, the second part is disposed on the bonding surface, and the third part is disposed on the side connecting surface. The first part and the second part extend outward from the third part in the same direction in the lateral direction. The first part and the second part extend outward from the third part in opposite directions in the lateral direction.

[0006] In an electronic paper display device according to an embodiment of the present invention, the electronic paper display device further includes an edge isolation pattern and another edge conductive pattern. The edge isolation pattern covers the edge conductive pattern, and the other edge conductive pattern is disposed on the edge isolation pattern. The edge conductive pattern and the other edge conductive pattern are staggered along the extending direction of the side connection surface of the electronic paper carrier structure. The edge conductive pattern, the edge isolation pattern, and the other edge conductive pattern are respectively continuously compliant with the display surface, the side connection surface, and the bonding surface. The electronic paper carrier structure further includes another display surface pad exposed on the display surface, and the other edge conductive pattern contacts the other display surface pad. The lateral distance between the display surface pad and the side connection surface is smaller than the lateral distance between the other display surface pad and the side connection surface. The electronic paper carrier structure further includes another bonding surface pad exposed on the bonding surface, and the other edge conductive pattern contacts the other bonding surface pad. The lateral distance between the bonding surface pad and the side connection surface is smaller than the lateral distance between the other bonding surface pad and the side connection surface.

[0007] In an electronic paper display device according to an embodiment of the present invention, the aforementioned electronic paper carrier structure includes a pixel array substrate, the pixel array substrate having a display surface and including display surface pads. The electronic paper carrier structure further includes a driving circuit carrier board and an adhesive layer. The adhesive layer adheres the driving circuit carrier board to the pixel array substrate, and the driving circuit carrier board has a bonding surface and includes bonding surface pads. The driving circuit carrier board protrudes outward relative to the pixel array substrate. The electronic paper display device also includes a reinforcing substrate. The reinforcing substrate is attached to the driving circuit carrier board. The bonding surface faces the pixel array substrate. The side connection surface includes the sidewall of the pixel array substrate, the sidewall of the driving circuit carrier board, and the sidewall of the adhesive layer. The electronic paper carrier structure further includes a reinforcing substrate and an adhesive layer. The reinforcing substrate is attached to the pixel array substrate via the adhesive layer. The side connection surface includes the sidewall of the pixel array substrate, the sidewall of the reinforcing substrate, and the sidewall of the adhesive layer.

[0008] In the electronic paper display device according to an embodiment of the present invention, the side connecting surface of the electronic paper carrier structure includes a side segment and two chamfered segments. The two chamfered segments extend between the side segment and the display surface and between the side segment and the joint surface, respectively, and the two chamfered segments are inclined relative to the side segment.

[0009] Based on the above, the electronic paper display device of the present invention achieves electrical connection between different substrates or opposite surfaces of substrates by using conductive patterns disposed on the sidewall of the substrate, thereby realizing a narrow bezel design. Attached Figure Description

[0010] Figure 1 This is a schematic diagram illustrating the manufacturing method of an electronic paper display device according to an embodiment of the present invention;

[0011] Figure 2This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention;

[0012] Figure 3 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention;

[0013] Figure 4 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention;

[0014] Figure 5 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention;

[0015] Figure 6 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention;

[0016] Figure 7 for Figure 6 A partial three-dimensional schematic diagram of an electronic paper display device;

[0017] Figure 8 for Figure 6 Another implementation of the electronic paper support structure in an electronic paper display device. Detailed Implementation

[0018] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0019] Figure 1 This is a schematic diagram illustrating the manufacturing method of an electronic paper display device according to an embodiment of the present invention. Figure 1 The electronic paper display device 100 includes at least a pixel array substrate 110, an electronic paper display layer 120, a driving circuit carrier 130, an adhesive layer 140, and an edge conductive pattern 150. The pixel array substrate 110 has a display surface 110A, a back surface 110B, and a sidewall 110C. The display surface 110A and the back surface 110B face each other, and the sidewall 110C connects the display surface 110A and the back surface 110B. The electronic paper display layer 120 is disposed on the display surface 110A of the pixel array substrate 110, and the driving circuit carrier 130 is disposed on the back surface 110B of the pixel array substrate 110. The adhesive layer 140 adheres the driving circuit carrier 130 to the back surface 110B of the pixel array substrate 110. The edge conductive pattern 150 physically contacts the pixel array substrate 110, the adhesive layer 140, and the driving circuit carrier 130. In addition, the electronic paper display device 100 also includes a driving circuit chip 160 bonded to the driving circuit carrier board 130 and a connection circuit board 170, wherein the connection circuit board 170 is used to connect the electronic paper display device 100 to an external system, and the connection circuit board 170 is, for example, a printed circuit board.

[0020] The pixel array substrate 110 can be a substrate on which a pixel circuit array 112 is provided. For ease of explanation, Figure 1 The specific structure of the pixel circuit array 112 is not shown in detail, but it is understood that the pixel circuit array 112 includes, for example, multiple active elements (e.g., thin-film transistors), associated circuit elements (e.g., storage capacitors), and conductive lines (e.g., scan lines, data lines) corresponding to the active elements and / or associated circuit elements. Furthermore, the pixel array substrate 110 may include a display surface pad 114 exposed on the display surface 110A. The display surface pad 114 may be integrated into at least one layer of conductive lines in the pixel circuit array 112 and is disposed adjacent to the sidewall 110C of the pixel array substrate 110. The sidewall 110C of the pixel array substrate 110 may be connected between the display surface 110A and the back surface 110B and extends along the thickness direction of the pixel array substrate 110. In some embodiments, the display surface pad 114 and the sidewall 110C may be separated by a distance in the lateral direction L. In this embodiment, "lateral" can be understood as the direction extending from the sidewall 110C toward the electronic paper display layer 120.

[0021] In some embodiments, the electronic paper display layer 120 may selectively include a plurality of microcapsules and electronic ink filled within the microcapsules. In some embodiments, the electronic paper display layer 120 may selectively include a plurality of microcup structures and electronic ink filled within the microcup structures. The electronic paper display layer 120 may be an electrophoretic layer. In other embodiments, the electronic paper display layer 120 may be a QuickResponse Liquid Powder Layer, a Cholesteric Liquid Crystal Layer, or an Electrowetting Layer, etc. The display medium (e.g., electrophoretic particles in electronic ink) in the electronic paper display layer 120 may be arranged or in different states under the drive of the pixel circuit array 112 to provide the desired display effect.

[0022] In this embodiment, the driving circuit carrier 130 can be considered as a circuit board carrying the driving circuit chip 160. The driving circuit carrier 130 can be a substrate with multiple signal transmission lines. For example, the driving circuit carrier 130 may include a carrier substrate and signal transmission lines disposed on the carrier substrate. The driving circuit carrier 130 may also include bonding pads 132, 134, and 136 exposed on the bonding surface 130A. The bonding pad 132 is used for electrical connection with the display surface pad 114 of the pixel array substrate 110, the pad 134 is used for electrical connection with the driving circuit chip 160, and the pad 136 is used for electrical connection with the connection circuit board 170. In this embodiment, the driving circuit carrier 130 protrudes outward relative to the pixel array substrate 110, and the bonding pad 132 is disposed on the protruding portion of the driving circuit carrier 130 and faces the pixel array substrate 110. That is, the bonding pad 132 is located in the area outside the pixel array substrate 110.

[0023] The bonding surface 130A of the driving circuit carrier 130 faces the pixel array substrate 110 and the adhesive layer 140, and the adhesive layer 140 adheres the driving circuit carrier 130 to the back surface 110B of the pixel array substrate 110. The adhesive layer 140 can be double-sided adhesive. In addition, the adhesive layer 140 can fill the gap G1 between the driving circuit carrier 130 and the pixel array substrate 110. The driving circuit chip 160 can be located between the driving circuit carrier 130 and the pixel array substrate 110, and the thickness T140 of the adhesive layer 140 can be not less than the thickness T160 of the driving circuit chip 160.

[0024] In this embodiment, the composite structure formed by the pixel array substrate 110, the driving circuit carrier 130, and the adhesive layer 140 can serve as the electronic paper carrier structure 104 for carrying the electronic paper display layer 120. The electronic paper carrier structure 104 has a display surface 110A, a bonding surface 130A, and a side connection surface 100A, and includes a display surface pad 114 exposed on the display surface 110A and a bonding surface pad 132 exposed on the bonding surface 130A. In addition, the sidewall 110C of the pixel array substrate 110 and the sidewall 140A of the adhesive layer 140 can be connected to form the side connection surface 100A. The sidewall 140A of the adhesive layer 140 can extend from the sidewall 110C of the pixel array substrate 110 toward the driving circuit carrier 130 to reach the bonding surface 130A of the driving circuit carrier 130. In some embodiments, the sidewall 110C of the pixel array substrate 110 and the sidewall 140A of the adhesive layer 140 can be coplanar.

[0025] The edge conductive pattern 150 includes a first portion 152, a second portion 154, and a third portion 156. The first portion 152 is disposed on the display surface 110A of the pixel array substrate 110, and the first portion 152 can contact the display surface pad 114 of the pixel array substrate 110. The second portion 154 is disposed on the bonding surface 130A of the driving circuit carrier 130, and the second portion 154 can contact the bonding surface pad 132 of the driving circuit carrier 130. The third portion 156 is disposed on the side connection surface 100A and extends between the first portion 152 and the second portion 154. Furthermore, the first portion 152 and the second portion 154 of the edge conductive pattern 150 extend in opposite directions in the lateral direction L from the third portion 156.

[0026] The third portion 156 of the edge conductive pattern 150 can contact the sidewall 110C of the pixel array substrate 110 and the sidewall 140A of the adhesive layer 140. The sidewall 140A of the adhesive layer 140 and the sidewall 110C of the pixel array substrate 110 can form a smooth side connection surface 100A that extends continuously from the display surface 110A of the pixel array substrate 110 to the bonding surface 130A of the driving circuit carrier 130. Therefore, the third portion 156 of the edge conductive pattern 150 can extend continuously and without breaking between the first portion 152 and the second portion 154.

[0027] In some embodiments, such as Figure 1 As shown, the edge conductive pattern 150 can be fabricated using inkjet printing or coating. For example, the edge conductive pattern 150 can be fabricated by using an inkjet printing or coating nozzle 102 to spray conductive material onto the bonding surface 130A of the driving circuit carrier 130, followed by spraying conductive material onto the sidewalls 110C and 140A of the pixel array substrate 110 to form a third part 156, and then spraying conductive material onto the display surface 110A of the pixel array substrate 110 to form a first part 152. Alternatively, conductive material can be sprayed or coated in the opposite direction. The edge conductive pattern 150 can directly contact the display surface 110A of the pixel array substrate 110 and the bonding surface 130A of the driving circuit carrier 130, thereby electrically connecting the bonding surface pad 132 of the driving circuit carrier 130 and the display surface pad 114 of the pixel array substrate 110. In addition, the sidewall 140A of the adhesive layer 140 and the sidewall 110C of the pixel array substrate 110 can form a smooth side connection surface 100A that extends continuously from the display surface 110A of the pixel array substrate 110 to the bonding surface 130A of the drive circuit carrier board 130. This helps to ensure that the conductive material does not break due to structural changes and / or cause significant thickness changes during the spraying of conductive material, thereby ensuring the continuity of the edge conductive pattern 150.

[0028] The edge conductive pattern 150 is directly printed or sprayed onto the pixel array substrate 110, the adhesive layer 140, and the driving circuit carrier 130. Therefore, the electronic paper display device 100 does not require additional wiring space to achieve the electrical connection between the pixel array substrate 110 and the driving circuit carrier 130, which helps to simplify the overall size of the electronic paper display device 100. For example, the electronic paper display layer 120 may have a display area AA that can actually display an image. In some embodiments, since the edge conductive pattern 150 is directly printed or sprayed onto the pixel array substrate 110, the adhesive layer 140, and the driving circuit carrier 130, the width of the peripheral area PA extending outward from the display area AA to the edge of the entire device in the lateral direction L can be reduced, for example, to 1.9 mm. Compared to existing designs, such as those using wire bonding to achieve the electrical connection between the pixel array substrate 110 and the driving circuit carrier 130, the width of the peripheral area PA often reaches 2.4 mm or more. In addition, the edge conductive pattern 150 is closely attached to the pixel array substrate 110, the adhesive layer 140 and the driving circuit carrier 130. Therefore, the edge conductive pattern 150 is not easily damaged in subsequent manufacturing and use processes, and can stably maintain the electrical connection between the pixel array substrate 110 and the driving circuit carrier 130.

[0029] Figure 2 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention. Figure 2 The electronic paper display device 100 is Figure 1 The electronic paper display device 100 is an encapsulated embodiment, and the same component symbols in the two figures can represent the same or equivalently interchangeable components. Specifically, the electronic paper display device 100, in addition to Figure 1In addition to the pixel array substrate 110, driving circuit carrier 130, electronic paper carrier structure 104 with adhesive layer 140, electronic paper display layer 120, edge conductive pattern 150, driving circuit chip 160, and connecting circuit board 170 already described, the device also includes a protective plate 180 and a sealant 190. The protective plate 180 is attached to the electronic paper display layer 120, such that the electronic paper display layer 120 is sandwiched between the protective plate 180 and the pixel array substrate 110. The sealant 190 is disposed along the edge of the electronic paper display device 100, covering the exposed electronic paper display layer 120 and edge conductive pattern 150 at the edge of the electronic paper display device 100. Furthermore, the protective plate 180 and the pixel array substrate 110 may protrude relative to the electronic paper display layer 120, and the sealant 190 may fill the gap G2 between the protective plate 180 and the pixel array substrate 110. The protective plate 180 and the sealant 190 further protect the components of the electronic paper display device 100 from damage caused by the intrusion of external substances. In some embodiments, the sealant 190 may have the property of blocking moisture, thereby preventing damage to the electronic paper display layer 120 and the edge conductive pattern 150 due to the intrusion of moisture.

[0030] Figure 3 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention. Figure 3 Electronic paper display device 200 and Figure 2 In the electronic paper display device 100, the same component symbol can represent the same or equivalent components. Figure 3 The electronic paper display device 200, in addition to Figure 2 In addition to the pixel array substrate 110, driving circuit carrier 130, electronic paper carrier structure 104 with adhesive layer 140, electronic paper display layer 120, edge conductive pattern 150, driving circuit chip 160, connecting circuit board 170, protective board 180, and sealing adhesive 190 already described, the system also includes a reinforcing substrate 202 and adhesive layer 204. The reinforcing substrate 202 is disposed on the back side 130B of the driving circuit carrier 130 and attached to the driving circuit carrier 130 via adhesive layer 204. In some embodiments, the driving circuit carrier 130 may be a flexible circuit board, for example, using a polyamide or polyimide film as the carrier body. Therefore, the driving circuit carrier 130 alone attached to the pixel array substrate 110 may lack sufficient support or mechanical strength. In this embodiment, the reinforcing substrate 202 helps to enhance mechanical strength, allowing the driving circuit carrier 130 to be attached to the pixel array substrate 110 in a good and stable condition. In some embodiments, when the drive circuit carrier 130 is made of a carrier body with high mechanical strength, such as glass or other plastic materials with high mechanical strength, the reinforcing substrate 202 can be omitted and has Figure 2 The structure shown.

[0031] Figure 4 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention. Figure 4 Electronic paper display device 300 and Figure 3 In the electronic paper display device 200, the same component symbol can represent the same or equivalent components. Figure 4 The electronic paper display device 300, in addition to Figure 3 In addition to the previously described pixel array substrate 110, driving circuit carrier 130, electronic paper carrier structure 104 with adhesive layer 140, electronic paper display layer 120, edge conductive pattern 150, driving circuit chip 160, connecting circuit board 170, protective plate 180, sealing adhesive 190, reinforcing substrate 202, and adhesive layer 204, the electronic paper carrier structure 104 in this embodiment also includes a reinforcing substrate 302 and adhesive layer 304. The reinforcing substrate 302 is disposed on the back side 110B of the pixel array substrate 110 and attached to the pixel array substrate 110 via the adhesive layer 304. In some embodiments, the pixel array substrate 110 may be flexible, for example, using a polyamide or polyimide film as the substrate body. Therefore, the pixel array substrate 110 may lack sufficient support or mechanical strength when disposed alone. In this embodiment, the presence of the reinforcing substrate 302 improves mechanical strength, giving the pixel array substrate 110 good support. In some embodiments, when the pixel array substrate 110 uses a substrate body with high mechanical strength, such as glass or other plastic materials with high mechanical strength, the reinforcing substrate 302 can be omitted and a [missing information - likely a specific material or component] can be used. Figure 2 The structure shown.

[0032] like Figure 4 As shown, the sidewalls 302A of the reinforcing substrate 302 and 304A of the adhesive layer 304 extend to approximately flush with the pixel array substrate 110. Thus, the sidewalls 110C of the pixel array substrate 110, 302A of the reinforcing substrate 302, 304A of the adhesive layer 304, and 140A of the adhesive layer 140 can form a smooth side connection surface 300A. The side connection surface 300A is formed by the continuous connection of the sidewalls of multiple components, but is generally smooth. Therefore, the edge conductive pattern 150 can continuously extend along the side connection surface 300A, forming a conductive path between the pixel array substrate 110 and the driving circuit carrier 130.

[0033] Figure 5 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention. Figure 5 Electronic paper display device 400 and Figure 2 In the electronic paper display device 100, the same component symbol can represent the same or equivalent components. Figure 5 The electronic paper display device 400 includes, for example, an electronic paper display device 400. Figure 2The described components include a pixel array substrate 110, a driving circuit carrier 130, an electronic paper carrier structure 104 with an adhesive layer 140, an electronic paper display layer 120, a driving circuit chip 160, a connecting circuit board 170, a protective board 180, and a sealing adhesive 190. Furthermore, the electronic paper display device 400 also includes an edge conductive pattern 450, wherein the edge conductive pattern 450 provides a similar... Figure 2 The middle edge conductive pattern 150 has a function, but with a different structural design.

[0034] Specifically, in this embodiment, the orientation of the drive circuit carrier 130 is... Figure 2 The embodiments differ. The bonding surface 130A of the driving circuit carrier 130 is configured to face away from the pixel array substrate 110 and the adhesive layer 140, and the back surface 130B of the driving circuit carrier 130 contacts the adhesive layer 140. Therefore, the driving circuit chip 160 is bonded to the bonding surface 130A of the driving circuit carrier 130, and the driving circuit carrier 130 is located between the driving circuit chip 160 and the adhesive layer 140. In this embodiment, in addition to the sidewalls 110C of the pixel array substrate 110 and 140A of the adhesive layer 140 being configured to conform to each other, the sidewalls 130C of the driving circuit carrier 130 and 140A of the adhesive layer 140 are also configured to conform to each other. The sidewalls 110C of the pixel array substrate 110, 140A of the adhesive layer 140, and 130C of the driving circuit carrier 130 can be continuously connected to form a smooth side connection surface 400A.

[0035] The edge conductive pattern 450 includes a first portion 152, a second portion 454, and a third portion 156. The first portion 152 is disposed on the display surface 110A of the pixel array substrate 110, the second portion 454 is disposed on the bonding surface 130A of the driving circuit carrier 130, and the third portion 156 extends between the first portion 152 and the second portion 454. The third portion 156 of the edge conductive pattern 450 can contact the sidewall 110C of the pixel array substrate 110, the sidewall 140A of the adhesive layer 140, and the sidewall 130C of the driving circuit carrier 130, and extends continuously on the side bonding surface 400A. Furthermore, the first portion 152 and the second portion 454 of the edge conductive pattern 450 both extend outward from the third portion 156 in the same direction (e.g., towards the electronic paper display layer 120) in the lateral direction L, forming a roughly "C"-shaped structure in the side view.

[0036] Figure 6 This is a schematic diagram of an electronic paper display device according to an embodiment of the present invention. Figure 6 Electronic paper display device 500 and Figure 2 In the electronic paper display device 100, the same component symbol can represent the same or equivalent components. Figure 6 The electronic paper display device 500 includes, for example, Figure 2 The electronic paper display layer 120, protective plate 180, and sealing material 190 have already been described. In addition, Figure 6 The electronic paper display device 500 further includes an electronic paper carrier structure 510, a first edge conductive pattern 520, a second edge conductive pattern 530, an edge isolation pattern 540, and an edge protection pattern 550. The electronic paper carrier structure 510 has a display surface 510A, a bonding surface 510B, and a side connecting surface 510C connecting the display surface 510A and the bonding surface 510B. An electronic paper display layer 120 is disposed on the display surface 510A of the electronic paper carrier structure 510. The first edge conductive pattern 520 is disposed on the side connecting surface 510C of the electronic paper carrier structure 510 and conforms to the display surface 510A, the side connecting surface 510C, and the bonding surface 510B. The edge isolation pattern 540 conforms to the display surface 510A, the side connecting surface 510C, and the bonding surface 510B and covers the first edge conductive pattern 520. Thus, the first edge conductive pattern 520 is sandwiched between the edge isolation pattern 540 and the electronic paper carrier structure 510. An edge isolation pattern 540 extends laterally (L) toward the electronic paper display layer 120 beyond the first edge conductive pattern 520 to partially contact the display surface 510A and the bonding surface 510B. A second edge conductive pattern 530 is disposed compliant with the display surface 510A, the side connection surface 510C, and the bonding surface 510B. The second edge conductive pattern 530 extends laterally (L) toward the electronic paper display layer 120 beyond the edge isolation pattern 540 to partially contact the display surface 510A and the bonding surface 510B. An edge protection pattern 550 is disposed compliant with the display surface 510A, the side connection surface 510C, and the bonding surface 510B and covers the second edge conductive pattern 530. In this embodiment, "lateral" can be understood as the direction extending from the side connection surface 510C toward the electronic paper display layer 120.

[0037] The electronic paper carrier structure 510 includes a first display surface pad 512A, a second display surface pad 512B, a first bonding surface pad 514A, and a second bonding surface pad 514B. The first display surface pad 512A and the second display surface pad 512B are exposed on the display surface 510A, while the first bonding surface pad 514A and the second bonding surface pad 514B are exposed on the bonding surface 510B. A first edge conductive pattern 520 electrically connects the first display surface pad 512A to the first bonding surface pad 514A. A second edge conductive pattern 530 electrically connects the second display surface pad 512B to the second bonding surface pad 514B. In this way, the first edge conductive pattern 520 and the second edge conductive pattern 530 can achieve electrical connection paths on opposite sides of the electronic paper carrier structure 510 without fabricating the electronic paper carrier structure 510 or requiring additional external wires or circuit boards.

[0038] In some embodiments, the first edge conductive pattern 520, the second edge conductive pattern 530, the edge isolation pattern 540, and the edge protection pattern 550 can be fabricated on the electronic paper carrier structure 510 by printing, spraying, or other methods. The first edge conductive pattern 520, the second edge conductive pattern 530, the edge isolation pattern 540, and the edge protection pattern 550 all have non-planar structures and can be continuously disposed on the display surface 510A, the side connection surface 510C, and the bonding surface 510B of the electronic paper carrier structure 510. The first edge conductive pattern 520, the edge isolation pattern 540, the second edge conductive pattern 530, and the edge protection pattern 550 are continuously and closely attached to the display surface 510A, the side connection surface 510C, and the bonding surface 510B; therefore, the three-dimensional transmission structure formed by the first edge conductive pattern 520, the edge isolation pattern 540, the second edge conductive pattern 530, and the edge protection pattern 550 requires only a narrow space. For example, the bezel width in the horizontal direction L of the electronic paper display device 500 can be reduced to approximately 1.9 mm.

[0039] The first edge conductive pattern 520 is disposed in close contact with the display surface 510A, side connecting surface 510C, and bonding surface 510B of the electronic paper carrier structure 510, and is connected to the first display surface pad 512A and the first bonding surface pad 514A, and directly contacts the display surface 510A, side connecting surface 510C, and bonding surface 510B of the electronic paper carrier structure 510. The first edge conductive pattern 520 may include a first part 522, a second part 524, and a third part 526. The first part 522 is disposed on the display surface 510A of the electronic paper carrier structure 510, the second part 524 is disposed on the bonding surface 510B of the electronic paper carrier structure 510, and the third part 526 extends between the first part 522 and the second part 524. The third part 526 of the first edge conductive pattern 520 can contact the side connecting surface 510C of the electronic paper carrier structure 510. Furthermore, the first part 522 and the second part 524 of the first edge conductive pattern 520 both extend in the lateral direction L from the third part 526 in the same direction (towards the electronic paper display layer 120), forming a roughly "C"-shaped structure in the side view.

[0040] In some embodiments, the electronic paper display device 500 may include a plurality of first edge conductive patterns 520 sequentially disposed along a side connection surface 510C. In some embodiments, an edge isolation pattern 540 may extend between the plurality of first edge conductive patterns 520. The edge isolation pattern 540 covers the first edge conductive patterns 520 such that the first edge conductive patterns 520 are disposed between the edge isolation pattern 540 and the side connection surface 510C of the electronic paper carrier structure 510. The extension length of the edge isolation pattern 540 in the lateral direction L may exceed the first display surface pad 512A and the first bonding surface pad 514A to completely cover the first edge conductive pattern 520, the first display surface pad 512A, and the first bonding surface pad 514A.

[0041] The second edge conductive pattern 530 is disposed on the electronic paper carrier structure 510 and the edge isolation pattern 540. Specifically, the edge isolation pattern 540 is located between the second edge conductive pattern 530 and the side connection surface 510C of the electronic paper carrier structure 510. The second edge conductive pattern 530 may include a first part 532, a second part 534, and a third part 536. The first part 532 extends from the edge isolation pattern 540 toward the electronic paper display layer 120 on the display surface 510A of the electronic paper carrier structure 510 to contact the second display surface pad 512B. The second part 534 extends from the edge isolation pattern 540 toward the electronic paper display layer 120 on the bonding surface 510B of the electronic paper carrier structure 510 to contact the second bonding surface pad 514B. The third part 536 is entirely located on the edge isolation pattern 540 and extends between the first part 532 and the second part 534. The third portion 536 of the second edge conductive pattern 530 can be separated from the side connection surface 510C of the electronic paper carrier structure 510 by the edge isolation pattern 540. That is, the edge isolation pattern 540 is located between the second edge conductive pattern 530 and the side connection surface 510C of the electronic paper carrier structure 510. In addition, the first portion 532 and the second portion 534 of the second edge conductive pattern 530 both extend in the same direction (towards the electronic paper display layer 120) from the third portion 536 in the lateral direction L, forming a roughly "C"-shaped structure in the side view.

[0042] In some embodiments, the lateral distance D1 between the first display surface pad 512A and the side connection surface 510C is smaller than the lateral distance D2 between the second display surface pad 512B and the side connection surface 510C. Therefore, the first portion 532 of the second edge conductive pattern 530 extends laterally beyond the first edge conductive pattern 520 on the display surface 510A to contact the second display surface pad 512B. Similarly, the lateral distance D3 between the first bonding surface pad 514A and the side connection surface 510C is smaller than the lateral distance D4 between the second bonding surface pad 514B and the side connection surface 510C. Therefore, the second portion 534 of the second edge conductive pattern 530 also extends laterally beyond the first edge conductive pattern 520 on the bonding surface 510B to contact the second bonding surface pad 514B.

[0043] The edge protection pattern 550 covers the second edge conductive pattern 530 such that the second edge conductive pattern 530 is positioned between the edge isolation pattern 540 and the edge protection pattern 550. The extension length of the edge protection pattern 550 in the lateral direction L may exceed the second display surface pad 512B and the second mating surface pad 514B to completely cover the second edge conductive pattern 530, the second display surface pad 512B, and the second mating surface pad 514B. The sealant 190 may cover the edge protection pattern 550 and fill the gap G3 between the electronic paper carrier structure 510 and the protective plate 180.

[0044] The electronic paper display device 500 may also include a driving circuit chip (not shown, but referenced) bonded to the bonding surface 510B of the electronic paper carrier structure 510. Figures 1 to 5 (as described in the description) and, for example, a connecting circuit board, which is a flexible circuit board (not shown, but can be referenced). Figures 1 to 5 (as described in the description) or similar. In some embodiments, the driver circuit chip may be packaged on a flexible circuit board, and the flexible circuit board may be bonded to the bonding surface 510B. In some embodiments, the electronic paper carrier structure 510 may include a separate pixel array substrate, which is composed of a substrate, a pixel circuit array, and associated conductive lines. For example, the electronic paper carrier structure 510 may be... Figure 2 The pixel array substrate 110 shown further includes a first bonding surface pad 514A and a second bonding surface pad 514B disposed on the bonding surface 510B. In some embodiments, the electronic paper carrier structure 510 may include a multilayer bonding. For example, the electronic paper carrier structure 510 may include... Figure 5 The pixel array substrate 110, adhesive layer 140, and driving circuit carrier 130 constitute a multilayer structure. Thus, the first bonding surface pad 514A and the second bonding surface pad 514B can be the pads exposed on the bonding surface 130A of the driving circuit carrier 130. Furthermore, the side connection surface 510C can be understood as... Figure 5 The side connection surface 400A in the middle.

[0045] Figure 7 for Figure 6 A partial three-dimensional schematic diagram of an electronic paper display device. For ease of explanation, Figure 7 Only the electronic paper carrier structure 510, the first edge conductive pattern 520, the second edge conductive pattern 530, and the edge isolation pattern 540 are shown. Figure 7 The illustrated electronic paper display device 500 may include multiple first edge conductive patterns 520 and multiple second edge conductive patterns 530. The first edge conductive patterns 520 and second edge conductive patterns 530 are staggered, for example, along the extending direction E of the side connection surface 510C of the electronic paper carrier structure 510. In some embodiments, the areas of the first edge conductive patterns 520 and second edge conductive patterns 530 may not completely overlap or may not overlap at all. The first edge conductive pattern 520 is located between the edge isolation pattern 540 and the side connection surface 510C of the electronic paper carrier structure 510, and the edge isolation pattern 540 is located, for example, between the second edge conductive pattern 530 and the side connection surface 510C of the electronic paper carrier structure 510. Both the first edge conductive pattern 520 and the second edge conductive pattern 530 extend inward from the side connection surface 510C along the lateral direction L (e.g., towards) the display surface 510A (or the bonding surface 510B). Figure 6 (The electronic paper display layer 120 shown extends). The first display surface pad 512A and the second display surface pad 512B are also shown. Figure 7 As shown, the first display surface pad 512A connected to the first edge conductive pattern 520 and the second display surface pad 512B connected to the second edge conductive pattern 530 are also staggered along the extension direction E of the side connection surface 510C. The second display surface pad 512B can be further away from the side connection surface 510C than the first display surface pad 512A.

[0046] Figure 8 for Figure 6Another embodiment of the electronic paper support structure in the electronic paper display device. In this embodiment, the side connecting surface 510C' of the electronic paper support structure 510' can be divided into multiple segments, such as a side segment 510C1 and two chamfered segments 510C2 and 510C3. The two chamfered segments 510C2 and 510C3 extend between the side segment 510C1 and the display surface 510A, and between the side segment 510C1 and the mating surface 510B, respectively. Furthermore, the two chamfered segments 510C2 and 510C3 can be inclined relative to the side segment 510C1. At this time, the angle between the chamfered segment 510C2 and the side segment 510C1 is an obtuse angle, the angle between the chamfered segment 510C3 and the side segment 510C1 is an obtuse angle, the angle between the chamfered segment 510C2 and the display surface 510A is an obtuse angle, and the angle between the chamfered segment 510C3 and the mating surface 510B is an obtuse angle. Thus, when the first edge conductive pattern 620 is made by printing or coating, it only undergoes a gentler transition, which helps to improve the production yield.

[0047] In summary, the electronic paper display device of the present invention has an edge conductive pattern made by precision printing or coating, thereby achieving a narrow bezel structural design.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic paper display device, characterized in that, include: An electronic paper carrier structure has a display surface, a bonding surface, and a side connection surface, wherein the display surface and the bonding surface are opposite to each other, and the side connection surface is connected between the display surface and the bonding surface, wherein the electronic paper carrier structure includes a display surface pad exposed on the display surface and a bonding surface pad exposed on the bonding surface. An electronic paper display layer is disposed on the display surface of the electronic paper carrier structure; as well as An edge conductive pattern is physically in contact with the electronic paper carrier structure, wherein the edge conductive pattern physically contacts the side connection surface and extends continuously on the side connection surface between the display surface and the bonding surface to contact the display surface pad and the bonding surface pad.

2. The electronic paper display device according to claim 1, characterized in that, The edge conductive pattern includes a first part, a second part, and a third part. The first part is disposed on the display surface, the second part is disposed on the bonding surface, and the third part is disposed on the side connection surface.

3. The electronic paper display device according to claim 2, characterized in that, The first part and the second part extend laterally from the third part in the same direction.

4. The electronic paper display device according to claim 2, characterized in that, The first part and the second part extend in opposite directions from the third part in the lateral direction.

5. The electronic paper display device according to claim 1, characterized in that, It also includes an edge isolation pattern and another edge conductive pattern, the edge isolation pattern covering the edge conductive pattern, and the other edge conductive pattern disposed on the edge isolation pattern, wherein the edge conductive pattern and the other edge conductive pattern are staggered along the extension direction of the side connection surface of the electronic paper carrier structure.

6. The electronic paper display device according to claim 5, characterized in that, The edge conductive pattern, the edge isolation pattern, and the other edge conductive pattern are respectively arranged continuously to conform to the display surface, the side connecting surface, and the bonding surface.

7. The electronic paper display device according to claim 5, characterized in that, The electronic paper carrier structure also includes another display surface pad exposed on the display surface, and the other edge conductive pattern contacts the other display surface pad.

8. The electronic paper display device according to claim 7, characterized in that, The lateral distance between the display surface pad and the side connection surface is less than the lateral distance between the other display surface pad and the side connection surface.

9. The electronic paper display device according to claim 5, characterized in that, The electronic paper carrier structure also includes another bonding surface pad exposed on the bonding surface, and the other edge conductive pattern contacts the other bonding surface pad.

10. The electronic paper display device according to claim 9, characterized in that, The lateral distance between the mating surface pad and the side connecting surface is less than the lateral distance between the other mating surface pad and the side connecting surface.

11. The electronic paper display device according to claim 1, characterized in that, The electronic paper carrier structure includes a pixel array substrate, the pixel array substrate having the display surface and including the display surface pad.

12. The electronic paper display device according to claim 11, characterized in that, The electronic paper carrier structure further includes a driving circuit carrier board and an adhesive layer. The adhesive layer adheres the driving circuit carrier board to the pixel array substrate, and the driving circuit carrier board has the bonding surface and includes the bonding surface pad.

13. The electronic paper display device according to claim 12, characterized in that, The driving circuit carrier plate protrudes outward relative to the pixel array substrate.

14. The electronic paper display device according to claim 12, characterized in that, The electronic paper carrier structure also includes a reinforced substrate attached to the drive circuit carrier board.

15. The electronic paper display device according to claim 12, characterized in that, The bonding surface faces the pixel array substrate.

16. The electronic paper display device according to claim 12, characterized in that, The bonding surface faces away from the pixel array substrate.

17. The electronic paper display device according to claim 12, characterized in that, The side connection surface includes the sidewall of the pixel array substrate, the sidewall of the driving circuit carrier board, and the sidewall of the adhesive layer.

18. The electronic paper display device according to claim 11, characterized in that, The electronic paper carrier structure further includes a reinforcing substrate and an adhesive layer, wherein the reinforcing substrate is attached to the pixel array substrate through the adhesive layer.

19. The electronic paper display device according to claim 18, characterized in that, The side connection surface includes the sidewall of the pixel array substrate, the sidewall of the reinforcing substrate, and the sidewall of the adhesive layer.

20. The electronic paper display device according to claim 1, characterized in that, The side connecting surface of the electronic paper carrier structure includes a side segment and two beveled segments. The two beveled segments extend between the side segment and the display surface and between the side segment and the joint surface, respectively, and the two beveled segments are inclined relative to the side segment.

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