Electronic paper display device and method of manufacturing the same

Abstract

The application provides an electronic paper display device and a manufacturing method thereof. The electronic paper display device comprises a substrate, an active element array layer, an electronic paper display layer, a driving circuit board and a printed circuit. The substrate has a first surface, a second surface and a side surface. The active element array layer is arranged on the first surface. The electronic paper display layer is attached to the active element array layer. The driving circuit board is arranged on the second surface. The printed circuit comprises a continuous longitudinal portion, a first extension portion and a second extension portion. The longitudinal portion directly contacts the side surface and extends between the first surface and the second surface. The first extension portion extends inwardly and transversely from one end of the longitudinal portion by a first distance and contacts the active element array layer. The second extension portion extends inwardly and transversely from the other end of the longitudinal portion by a second distance and overlaps the driving circuit board. The driving circuit board is electrically connected to the printed circuit within the area of the second extension portion.

Description

Technical Field

[0001] This invention relates to a display device, and more particularly to an electronic paper display device and its manufacturing method. Background Technology

[0002] Reducing bezel width and expanding display area are common R&D directions for various display devices. In electronic paper displays, the driver circuit chip is often bonded to the device using chip-on-glass (COG) or chip-on-film (COF) packaging. However, these methods may occupy display area and increase bezel width, thus making it difficult to easily achieve a narrow bezel design. Summary of the Invention

[0003] This invention relates to an electronic paper display device and its manufacturing method, which achieves a narrow bezel design.

[0004] According to an embodiment of the present invention, an electronic paper display device includes a substrate, an active element array layer, an electronic paper display layer, a driving circuit board, and printed circuit boards. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. The active element array layer is disposed on the first surface. The electronic paper display layer is attached to the active element array layer. The driving circuit board is disposed on the second surface. The printed circuit boards include a continuous, integral longitudinal portion, a first extension portion, and a second extension portion. The longitudinal portion directly contacts the side surface and extends between the first surface and the second surface. The first extension portion extends laterally inward from one end of the longitudinal portion away from the side surface by a first distance and contacts the active element array layer. The second extension portion extends laterally inward from the other end of the longitudinal portion away from the side surface by a second distance and overlaps the driving circuit board. The driving circuit board is electrically connected to the printed circuit boards within the area of ​​the second extension portion.

[0005] In the electronic paper display device according to an embodiment of the present invention, the second distance described above is greater than the first distance.

[0006] In the electronic paper display device according to an embodiment of the present invention, the second distance described above is 2 to 5 times the first distance.

[0007] In an electronic paper display device according to an embodiment of the present invention, the aforementioned driving circuit board is attached to a second surface. The driving circuit board is located between a second extension and the second surface. The second extension directly contacts the pads of the driving circuit board. A first portion of the second extension contacts the second surface, and a second portion contacts the pads of the driving circuit board, with the first portion located between the second portion and a longitudinal portion. The second extension also has a third portion extending along a sidewall of the driving circuit board and connecting the first portion and the second portion. The sidewall of the driving circuit board is not aligned with the side surface.

[0008] In the electronic paper display device according to an embodiment of the present invention, the second extension is located between the driving circuit board and the second surface. The electronic paper display device also includes conductive adhesive disposed between the second extension and the driving circuit board, with the pads of the driving circuit board contacting the conductive adhesive. The second extension directly contacts the second surface.

[0009] In the electronic paper display device according to an embodiment of the present invention, the thickness of the longitudinal portion is greater than the thickness of the first extension portion.

[0010] In the electronic paper display device according to an embodiment of the present invention, the thickness of the longitudinal portion is greater than the thickness of the second extension portion.

[0011] In the electronic paper display device according to an embodiment of the present invention, the thickness of the printed lines is greater than 1 micrometer.

[0012] In the electronic paper display device according to an embodiment of the present invention, the material of the printed circuit includes a composite conductive material.

[0013] In the electronic paper display device according to an embodiment of the present invention, the sidewall of the driving circuit board described above is aligned with the side surface.

[0014] In the electronic paper display device according to an embodiment of the present invention, the electronic paper display device further includes a protective material covering the printed circuit, such that the printed circuit is located between the protective material and the substrate.

[0015] In the electronic paper display device according to an embodiment of the present invention, the electronic paper display device further includes a circuit board coupled to a driving circuit board.

[0016] In the electronic paper display device according to an embodiment of the present invention, the electronic paper display device further includes a protective cover disposed on the electronic paper display layer.

[0017] According to an embodiment of the present invention, a method for manufacturing an electronic paper display device includes the following steps: An active element array layer is disposed on a first surface of a substrate, the substrate having a first surface, a second surface, and a side surface connecting the first surface and the second surface; printed circuits are formed on the substrate by printing, the printed circuits directly contacting the side surface of the substrate and directly contacting the active element array layer; and a driving circuit board is disposed on the second surface of the substrate, such that the printed circuits electrically connect the driving circuit board to the active element array layer, wherein the printed circuits overlap and contact the driving circuit board.

[0018] In the method for manufacturing an electronic paper display device according to an embodiment of the present invention, after the aforementioned driving circuit board is attached to the second surface of the substrate, a printed circuit is formed to bond the driving circuit board to the printed circuit line.

[0019] In the method for manufacturing an electronic paper display device according to an embodiment of the present invention, the above-mentioned printed lines contact the pads of the driving circuit board on the side of the driving circuit board away from the substrate.

[0020] In a method for manufacturing an electronic paper display device according to an embodiment of the present invention, the method further includes attaching a circuit board to a second surface of a substrate and bonding a drive circuit board to the circuit board.

[0021] In the method for manufacturing an electronic paper display device according to an embodiment of the present invention, the method further includes attaching an electronic paper display layer to an active element array layer.

[0022] In the method for manufacturing an electronic paper display device according to an embodiment of the present invention, the printing method includes plate printing or inkjet printing.

[0023] In the method for manufacturing an electronic paper display device according to an embodiment of the present invention, the material of the printed circuit includes a composite conductive material.

[0024] Based on the above, the electronic paper display device of this embodiment connects the active element array layer and the driving circuit board located on opposite surfaces of the substrate by printing lines arranged along the substrate, thereby achieving a narrow bezel design. Attached Figure Description

[0025] Figures 1A to 1E A cross-sectional structure is shown during the manufacturing process of the electronic paper display device according to an embodiment of this disclosure.

[0026] Figures 2A to 2C They are respectively Figures 1A to 1C A top view of the structure;

[0027] Figures 3A to 3D A cross-sectional structure is shown during the manufacturing process of the electronic paper display device according to an embodiment of this disclosure.

[0028] Figures 4A to 4B They are respectively Figures 3A to 3B A top view of the structure. Detailed Implementation

[0029] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0030] Figures 1A to 1E This illustration shows a cross-sectional structure during the manufacturing process of the electronic paper display device according to an embodiment of this disclosure. Figures 2A to 2C They are respectively Figures 1A to 1C A top view of the structure. Please refer to 1A and... Figure 2AA substrate 110 is provided, and the substrate 110 has a first surface 112, a second surface 114, and a side surface 116. The first surface 112 and the second surface 114 are opposite to each other, and the side surface 116 is connected between the first surface 112 and the second surface 114. In some embodiments, the side surface 116 may be a surface parallel to the thickness direction of the substrate 110, and the normals of the first surface 112 and the second surface 114 may be substantially parallel to the thickness direction of the substrate 110.

[0031] In addition, Figure 1A and Figure 2A In this configuration, an active element array layer 120 is disposed on a first surface 112. The active element array layer 120 includes pads 122 disposed around its periphery and alignment marks 124. In some embodiments, the active element array layer 120 may include multiple conductive pattern layers, at least one semiconductor material layer, and multiple insulating layers, wherein the conductive pattern layers and semiconductor material layers may constitute components for implementing pixel structures, such as scan lines, data lines, active elements (e.g., thin-film transistors), capacitor structures, and power lines. The pads 122 may be connected to lines such as scan lines, data lines, and power lines to transmit signals to these components. In some embodiments, the pads 122 may be composed of conductive patterns exposed on the surface, and their material may include transparent conductive materials, metals, etc.

[0032] The active element array layer 120 can be fabricated on the first surface 112 by means of thin film deposition, photolithography, etc., while the second surface 114 of the substrate 110 is a blank surface. In other words, there are no films, patterns, or structures fabricated on the second surface 114 by means of thin film deposition, photolithography, etc. Therefore, the substrate 110 on which the active element array layer 120 is provided can be a single-sided active element array substrate.

[0033] Next, Figure 1A After flipping the structure upside down, the drive circuit board 130 is attached to the second surface 114 of the substrate 110 to obtain... Figure 1B and Figure 2B The structure. For example... Figure 1B and Figure 2B As shown, the drive circuit board 130 has pads 132 and 134 and a drive circuit chip 136. The drive circuit chip 136 can be located on the side of the drive circuit board 130 away from the second surface 114, and pads 132 and 134 are exposed on the side of the drive circuit board 130 away from the second surface 114. In other words, the back side of the drive circuit board 130 (the side without exposed pads) is attached to the second surface 114 of the substrate 110. A circuit board 140 can be further bonded to the drive circuit board 130, and specifically, the circuit board 140 can be bonded to the pads 134 of the drive circuit board 130 using conductive adhesive 150. Figure 2BAs shown, the drive circuit board 130 may also include alignment marks 138, and when the drive circuit board 130 is attached to the second surface 114 of the substrate 110, it can be positioned by aligning the alignment marks 138 with the alignment marks 124 on the substrate 110.

[0034] exist Figure 1B In this structure, the pads 122 of the active element array layer 120 and the pads 132 of the drive circuit board 130 are exposed on opposite sides. Next, it is possible to... Figure 1B The printed circuit 160 is formed on the structure to obtain Figure 1C and Figure 2C The structure of the printed circuit 160 includes a continuous, integral longitudinal portion 162, a first extension 164, and a second extension 166. The longitudinal portion 162 directly contacts the side surface 116 of the substrate 110 and extends between the first surface 112 and the second surface 114. The first extension 164 extends laterally inward from one end of the longitudinal portion 162 away from the side surface 116 by a first distance D1 and contacts the active element array layer 120. The second extension 166 extends laterally inward from the other end of the longitudinal portion 162 away from the side surface 116 by a second distance D2 and overlaps the drive circuit board 130. In some embodiments, the second distance D2 may be greater than the first distance D1. In some embodiments, the second distance D2 may be 2 to 5 times the first distance D1. In some embodiments, the first distance D1 may not be greater than 100 micrometers.

[0035] In this embodiment, the first extension 164 of the printed circuit 160 can directly contact the pad 122 of the active element array layer 120, and the second extension 166 of the printed circuit 160 can directly contact the pad 132 of the drive circuit board 130. Thus, the drive circuit board 130 can be electrically connected to the printed circuit 160 within the area of ​​the second extension 166 and to the active element array layer 120 within the area of ​​the first extension 164.

[0036] The driving circuit board 130 is located between the second extension 166 and the second surface 114 of the substrate 110. The sidewall S130 of the driving circuit board 130 may not be aligned with the side surface 116 of the substrate 110. For example, the sidewall S130 of the driving circuit board 130 and the side surface 116 of the substrate 110 are separated by a third distance D3 in the lateral direction. In some embodiments, the third distance D3 may be 100 micrometers or less, but is not limited thereto. A first portion 166A of the second extension 166 may contact the second surface 114, and a second portion 166B of the second extension 166 may contact the pad 132 of the driving circuit board 130, with the first portion 166A located between the second portion 166B and the longitudinal portion 162. In addition, the second extension 166 also has a third portion 166C. The third portion 166C extends along the sidewall S130 of the driving circuit board 130 and connects the first portion 166A and the second portion 166B.

[0037] The printed circuit 160 can be fabricated on the substrate 110 using methods such as plate making and inkjet printing, but is not limited thereto. The thickness of the printed circuit 160 can be greater than 1 micrometer. In some embodiments, the thickness of the longitudinal portion 162 can be greater than the thickness of the first extension 164. In some embodiments, the thickness of the longitudinal portion 162 can be greater than the thickness of the second extension 166. In some embodiments, the thickness of the longitudinal portion 162 can be greater than the thickness of both the first extension 164 and the second extension 166. In some embodiments, the material of the printed circuit 160 includes a composite conductive material, such as a composite material made of metal particles and polymer materials. In other words, the material of the printed circuit 160 can be a non-pure metal material or a non-alloy material.

[0038] After that, Figure 1C and Figure 2C The structure is flipped upside down and placed on Figure 1D The active element array layer 120 is positioned upwards on a fixture FX. The fixture FX can be placed on a worktable ST and has a recess TR. The recess TR can accommodate the drive circuit board 130 and circuit board 140 protruding from the second surface 114 of the substrate 110, so that the substrate 110 is oriented on a horizontal plane or a working plane. Next, the electronic paper display layer 170 and the protective cover 180 are sequentially attached to the active element array layer 120 to form the electronic paper display device 100. The display material in the electronic paper display layer 170 may selectively include microcapsule display materials, electrophoretic display materials, electrowetting display materials, etc.

[0039] Figure 1EOptionally, a protective material 190 may be further disposed on the substrate 110. The protective material 190 may cover the printed circuit 160, such that the printed circuit 160 is located between the protective material 190 and the substrate 110. In some embodiments, the substrate 110 may be placed on... Figure 1D Before the fixture FX is applied, the protective material 190 is placed around the substrate 110, but this is not the only option.

[0040] Figure 1E In this electronic paper display device 100, at least a substrate 110, an active element array layer 120, an electronic paper display layer 170, a driving circuit board 130, and printed circuit lines 160 may be included. The substrate 110 is, for example, a glass substrate, and has a first surface 112, a second surface 114, and a side surface 116 connecting the first surface 112 and the second surface 114. The active element array layer 120 is disposed on the first surface 112. The electronic paper display layer 170 is attached to the active element array layer 120 and driven by the pixel structure in the active element array layer 120 to provide a display function. The driving circuit board 130 is disposed on the second surface 114. The printed circuit lines 160 are disposed along the side surface 116 of the substrate 110. The active element array layer 120 may include various signal lines, such as scan lines, data lines, power lines, etc., and the printed circuit lines 160 are used to electrically connect the driving circuit board 130 to the active element array layer 120.

[0041] The printed circuit 160 may specifically include a continuous, integral vertical portion 162, a first extension 164, and a second extension 166. The vertical portion 162 directly contacts the side surface 116 of the substrate 110 and extends between the first surface 112 and the second surface 114. The first extension 164 is laterally spaced from the side surface 116 by a first distance D1 and contacts the pads 122 on the active element array layer 120. The second extension 166 is laterally spaced from the side surface 116 by a second distance D2 and overlaps with and contacts the pads 132 on the drive circuit board 130. Thus, the drive circuit board 130 electrically connects the printed circuit 160 within the area of ​​the second extension 166 without the need for other pad structures. The second distance D2 may be greater than the first distance D1, and may be, for example, 2 to 5 times the first distance D1, but is not limited thereto. The first extension 164 extends from the first surface 112, and the first surface 112 is the side where the display image is provided. Therefore, the reduced extension distance of the first extension 164 helps to achieve a narrow bezel design. The second extension 166 extends on the side not used for display, therefore the second extension 166 is not limited to a short extension distance. The second extension 166 can have an appropriate extension distance to achieve good bonding yield.

[0042] In this embodiment, the back side of the drive circuit board 130 is attached to the second surface 114, such that the pads 132 of the drive circuit board 130 are located on the side of the drive circuit board 130 away from the substrate 110. Simultaneously, the pads 122 of the active element array layer 120 are located on the side of the active element array layer 120 away from the substrate 110. In some embodiments, the drive circuit board 130 may be recessed relative to the side surface 116. In other embodiments, the drive circuit board 130 may be aligned with the side surface 116. When the drive circuit board 130 is recessed relative to the side surface 116, the second extension 166 of the printed circuit 160 may have bends to differentiate it as follows: Figure 1C The three parts are described, but not limited to them. When the drive circuit board 130 is aligned with the side surface 116, the longitudinal portion 162 can continuously contact the side surface 116 of the substrate 110 and the side wall S130 of the drive circuit board 130.

[0043] In this embodiment, the driving circuit board 130 may include a driving circuit chip 136, and the driving circuit board 130 may be equipped with a chip-on-film (COF) package to carry the driving circuit chip 136. The electronic paper display device 100 may also include a circuit board 140, and the circuit board 140 may be bonded to another pad 134 of the driving circuit board 130 by conductive adhesive 150. In some embodiments, the conductive adhesive 150 may be anisotropic conductive film (ACF), anisotropic conductive paste (ACP), etc. Depending on the stacking relationship, the driving circuit board 130 is located between the circuit board 140 and the substrate 110. In addition, the electronic paper display device 100 may also include a protective cover 180 disposed on the electronic paper display layer 170 and a protective material 190 covering the printed circuit 160.

[0044] Figures 3A to 3D This illustration shows a cross-sectional structure during the manufacturing process of the electronic paper display device according to an embodiment of this disclosure. Figures 4A to 4B They are respectively Figures 3A to 3B A top view of the structure. Figures 3A to 3D In the implementation of the method, some components may be substantially equivalent to Figures 1A to 1E Therefore, in both embodiments, these equivalent components are labeled with the same element symbols, and the descriptions of these components in both embodiments may reference and / or refer to each other.

[0045] Please refer to 3A and Figure 4AA substrate 110 is provided, and the substrate 110 has a first surface 112, a second surface 114, and a side surface 116. Furthermore, an active element array layer 120 is disposed on the first surface 112. The active element array layer 120 includes pads 122 disposed on its periphery and alignment marks 124. The description of the substrate 110 and the active element array layer 120 is as described in the foregoing embodiments and will not be repeated. Similar to the foregoing embodiments, the substrate 110 and the active element array layer 120 constitute a single-sided active element array substrate, and the second surface 114 of the substrate 110 does not have any film layers, patterns, or structures formed by thin film deposition, photolithography, or other methods.

[0046] In this embodiment, the printed circuit 260 is directly printed on the substrate 110. The fabrication method of the printed circuit 260 may include plate printing or inkjet printing. Therefore, the thickness of the printed circuit 260 is approximately 1 micrometer, or even thicker. In some embodiments, the printed circuit 260 may be fabricated using sputtering. The printed circuit 260 includes a continuous longitudinal portion 262, a first extension 264, and a second extension 266. The longitudinal portion 262 directly contacts the side surface 116 and extends between the first surface 112 and the second surface 114. The first extension 264 extends laterally from one end of the longitudinal portion 262 inwards away from the side surface 116 by a first distance D1 and contacts the pad 122 of the active element array layer 120. The second extension 266 extends laterally from the other end of the longitudinal portion 262 inwards away from the side surface 116 by a second distance D2 and entirely contacts the second surface 114. The first distance D1 may be less than the second distance D2. In some embodiments, the second distance D2 may be 2 to 5 times the first distance D1. For example, the first distance D1 can be approximately 100 micrometers or less. The first extension 264 extends from the first surface 112, which is the side where the display image is provided. Therefore, reducing the extension distance of the first extension 264 helps to achieve a narrow bezel design. The second extension 266 extends on the side not used for display, so the extension distance of the second extension 266 does not need to be limited. The second extension 266 can have an appropriate extension distance to achieve good bonding yield. In this embodiment, the second extension 266 is disposed directly along the second surface 114, so the extension paths of the longitudinal portion 262 and the second extension 266 can substantially conform to the surface contour of the substrate 110.

[0047] Next, Figure 3A and Figure 4A The structure is flipped upside down, the circuit board 140 is attached to the second surface 114 of the substrate 110, and the drive circuit board 130 is bonded to the printed circuit 260 and the circuit board 140, as follows. Figure 3B and Figure 4BAs shown, the back side of the circuit board 140 is attached to the second surface 114 of the substrate 110, and the drive circuit board 130 can be bonded to the circuit board 140 via conductive adhesive 150. Additionally, the drive circuit board 130 can be bonded to the printed circuit 260 via conductive adhesive 250. In some embodiments, the conductive adhesive 150 and conductive adhesive 250 can be anisotropic conductive film (ACF), anisotropic conductive paste (ACP), etc.

[0048] The pads 132 and 134 of the drive circuit board 130 are located on the side of the drive circuit board 130 facing the substrate 110, and the drive circuit chip of the drive circuit board 130 is also located on the side close to the substrate 110. When the drive circuit board 130 is bonded to the printed circuit 260, it can be connected via the alignment mark 124 on the substrate 110 (shown in...). Figure 4A The driving circuit board 130 is positioned such that its sidewall S130 is flush with the side surface 116 of the substrate 110, but this is not a limitation. In some embodiments, the driving circuit board 130 is positioned such that its sidewall S130 is spaced apart from the side surface 116 of the substrate 110 by a lateral distance.

[0049] After that, Figure 1C and Figure 2C The structure is flipped upside down and placed on Figure 1D On the fixture FX, the active element array layer 120 is positioned with the active element array layer 120 facing upwards. Subsequently, the electronic paper display layer 170 and the protective cover 180 are sequentially attached to the active element array layer 120 to form the electronic paper display device 200. The fixture FX can be placed on a worktable ST and has a recess TR. The recess TR can accommodate the drive circuit board 130 and circuit board 140 protruding from the second surface 114 of the substrate 110, so that the substrate 110 is oriented on a horizontal plane or a working plane.

[0050] The electronic paper display device 200 removed from the self-driving furniture FX Figure 3DAs shown. The electronic paper display device 200 includes at least a substrate 110, an active element array layer 120, a driving circuit board 130, and printed circuit lines 260. The substrate 110 has a first surface 112, a second surface 114 opposite to the first surface 112, and a side surface 116 connecting the first surface 112 and the second surface 114. The active element array layer 120 is disposed on the first surface 112 of the substrate 110, and the driving circuit board 130 is disposed on the second surface 114 of the substrate 110. Therefore, the active element array layer 120 and the driving circuit board 130 are located on opposite sides of the substrate 110 and are separated by the substrate 110. The printed circuit lines 260 are continuously disposed along the first surface 112, the side surface 116, and the second surface 114 to electrically connect the active element array layer 120 and the driving circuit board 130 to each other.

[0051] Specifically, the printed circuit 260 includes a continuous, integral longitudinal portion 262 and a first extension 264. The longitudinal portion 262 directly contacts the side surface 116 and extends between the first surface 112 and the second surface 114. The first extension 264 extends inward from one end of the longitudinal portion 262 along the first surface 112 by a first distance D1 to at least contact the pad 122 of the active element array layer 120. In some embodiments, the first extension 264 may extend beyond the pad 122 to completely cover the pad 122, but is not limited thereto. The first surface 112 is located on the display side of the electronic paper display device 200 where the displayed image is provided, and the inward extension length (first distance D1) of the first extension 264 may, for example, be no greater than 100 micrometers. This helps to reduce the area occupied by undisplayed areas around the perimeter of the display side, thus achieving a narrow bezel design.

[0052] The printed circuit 260 also includes a second extension 266 integrally formed with the longitudinal portion 262. The second extension 266 extends inwardly along one end of the longitudinal portion 262 on the second surface 114 by a second distance D2. The second surface 114 is located on the back side of the electronic paper display device 200, therefore the extension length of the second extension 266 does not affect the display area of ​​the electronic paper display device 200. In some embodiments, the inward extension length of the second extension 266 may be greater than the inward extension length of the first extension 264, that is, the second distance D2 may be greater than the first distance D1. In some embodiments, the second distance D2 may be 2 to 5 times the first distance D1. In some embodiments, the inward extension length of the second extension 266 (the second distance D2) may be determined by the manufacturing method of the printed circuit 260. For example, when the printed circuit 260 is manufactured by plate making, the second distance D2 may be determined by the process capability of the printing fixture.

[0053] The drive circuit board 130 can be bonded to the second extension 266 of the printed circuit 260 via conductive adhesive 250. The position of the drive circuit board 130 can be adjusted according to the inward extension length (second distance D2) of the second extension 266. In some embodiments, the drive circuit board 130 can be configured such that its sidewalls are flush with the side surface 116 of the substrate 110. In some embodiments, the drive circuit board 130 can be configured such that its sidewalls are recessed inward relative to the side surface 116 of the substrate 110 by a certain distance.

[0054] The electronic paper display device 200 also includes an electronic paper display layer 170 attached to the active element array layer 120. The area of ​​the electronic paper display layer 170 determines the display area of ​​the electronic paper display device 200. The smaller the inward extension length (first distance D1) of the first extension 264, the larger the area of ​​the electronic paper display layer 170 occupies on the first surface 112, which helps to achieve a narrow bezel design. In some embodiments, the inward extension length (first distance D1) of the first extension 264 is such that the first extension 264 is located outside the electronic paper display layer 170, while the inward extension length (second distance D2) of the second extension 266 is such that the second extension 266 overlaps the area of ​​the electronic paper display layer 170. In some embodiments, the extension lengths of the first extension 264 and the second extension 266 are such that neither the first extension 264 nor the second extension 266 overlaps the electronic paper display layer 170. In addition, the electronic paper display device 200 also includes a circuit board 140 and a protective cover 180, the related descriptions of which can be found in the foregoing embodiments.

[0055] In the above embodiment, the driving circuit board 130 and the electronic paper display layer 170 are located on opposite sides of the substrate 110, and the driving signal provided by the driving circuit board 130 can be transmitted to the active element array layer 120 through the printed lines 160 or 260 with a three-dimensional structure arranged along the contour of the substrate 110. The printed lines 160 or 260 occupy a narrow area (e.g., the first distance D1 is not greater than 100 micrometers) on the first surface 112 where the electronic paper display layer 170 is disposed, thereby achieving a narrow bezel design. The driving circuit board 130 can be directly bonded to the printed lines 160 or 260 extending on the second surface 114 (the back side of the device), so the second surface 114 of the substrate 110 does not need to be provided with films, patterns, or structures made by means of thin film deposition, photolithography, etc., which helps to simplify the fabrication of the substrate 110. In actual manufacturing, substrates 110 with films, patterns, or structures made by means of thin film deposition, photolithography, etc., on only one side are also relatively easy to obtain. Therefore, electronic paper display device 100 or electronic paper display device 200 can be manufactured at a lower cost.

[0056] In summary, the electronic paper display device of this embodiment uses printed circuits to transmit electrical signals on opposite sides of the substrate, achieving a narrow bezel design with low manufacturing cost and simple manufacturing method.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic paper display device, characterized in that, include: The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface; An active element array layer is disposed on the first surface; An electronic paper display layer is attached to the active element array layer; The driver circuit board is positioned on the second surface; as well as The printed circuit includes a continuous longitudinal portion, a first extension portion, and a second extension portion. The longitudinal portion directly contacts the side surface and extends between the first surface and the second surface. The first extension portion extends laterally inward from one end of the longitudinal portion away from the side surface by a first distance and contacts the active element array layer. The second extension portion extends laterally inward from the other end of the longitudinal portion away from the side surface by a second distance and overlaps the driving circuit board. The driving circuit board is electrically connected to the printed circuit within the area of ​​the second extension portion.

2. The electronic paper display device according to claim 1, characterized in that, The second distance is greater than the first distance.

3. The electronic paper display device according to claim 1, characterized in that, The second distance is 2 to 5 times the first distance.

4. The electronic paper display device according to claim 1, characterized in that, The drive circuit board is attached to the second surface.

5. The electronic paper display device according to claim 4, characterized in that, The drive circuit board is located between the second extension and the second surface.

6. The electronic paper display device according to claim 4, characterized in that, The second extension directly contacts the pads of the drive circuit board.

7. The electronic paper display device according to claim 4, characterized in that, The first portion of the second extension contacts the second surface, the second portion of the second extension contacts the pad of the drive circuit board, and the first portion is located between the second portion and the longitudinal portion.

8. The electronic paper display device according to claim 7, characterized in that, The second extension also has a third portion that extends along the sidewall of the drive circuit board and connects between the first portion and the second portion.

9. The electronic paper display device according to claim 7, characterized in that, The sidewall of the drive circuit board is not aligned with the side surface.

10. The electronic paper display device according to claim 1, characterized in that, The second extension is located between the drive circuit board and the second surface.

11. The electronic paper display device according to claim 10, further comprising conductive adhesive disposed between the second extension and the driving circuit board, wherein the pads of the driving circuit board are in contact with the conductive adhesive.

12. The electronic paper display device according to claim 10, characterized in that, The second extension directly contacts the second surface.

13. The electronic paper display device according to claim 1, characterized in that, The thickness of the longitudinal portion is greater than the thickness of the first extension portion.

14. The electronic paper display device according to claim 1, characterized in that, The thickness of the longitudinal portion is greater than the thickness of the second extension portion.

15. The electronic paper display device according to claim 1, characterized in that, The thickness of the printed lines is greater than 1 micrometer.

16. The electronic paper display device according to claim 1, characterized in that, The printed circuit is made of composite conductive material.

17. The electronic paper display device according to claim 1, characterized in that, The sidewall of the drive circuit board is aligned with the side surface.

18. The electronic paper display device according to claim 1, characterized in that, It also includes a protective material that covers the printed circuit lines, such that the printed circuit lines are located between the protective material and the substrate.

19. The electronic paper display device according to claim 1, characterized in that, It also includes a circuit board, which is attached to the drive circuit board.

20. The electronic paper display device according to claim 1, characterized in that, It also includes a protective cover disposed on the electronic paper display layer.

21. A method for manufacturing an electronic paper display device, comprising: An active element array layer is disposed on a first surface of a substrate, the substrate having the first surface, a second surface, and a side surface connecting the first surface and the second surface; Printed circuits are formed on the substrate by printing, and the printed circuits directly contact the side surface of the substrate and directly contact the active element array layer. as well as A driving circuit board is disposed on the second surface of the substrate such that the printed lines electrically connect the driving circuit board to the active element array layer, wherein the printed lines overlap and contact the driving circuit board.

22. The method for manufacturing an electronic paper display device according to claim 21, wherein after the driving circuit board is attached to the second surface of the substrate, the printed circuit is formed to bond the driving circuit board to the printed circuit line.

23. The method of manufacturing an electronic paper display device according to claim 22, wherein the printed circuit lines contact the pads of the driving circuit board on the side of the driving circuit board away from the substrate.

24. The method for manufacturing an electronic paper display device according to claim 21 further includes attaching a circuit board to the second surface of the substrate, and the driving circuit board being bonded to the circuit board.

25. The method for manufacturing an electronic paper display device according to claim 21 further includes attaching the electronic paper display layer to the active element array layer.

26. The method for manufacturing an electronic paper display device according to claim 21, wherein the printing method includes plate printing or inkjet printing.

27. The method for manufacturing an electronic paper display device according to claim 21, wherein the material of the printed circuit includes a composite conductive material.

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