Measurement method, program, lithography method, article manufacturing method, and lithography apparatus

Abstract

The present disclosure relates to a measurement method, a program, a lithography method, a manufacturing method of an article, and a lithography apparatus. It is a measurement method of a position shift of a reticle with respect to a stage in a lithography apparatus that transfers a pattern of a reticle mounted on a stage to a substrate. It includes a first detection step of detecting a reference mark of the stage with the reticle mounted on the stage using a mark detection section in a first field of view, a second detection step of moving the mark detection section with respect to the stage and detecting a reticle mark of the reticle using the mark detection section in a second field of view different from the first field of view, a third detection step of moving the mark detection section with respect to the stage and detecting a stage correction mark using the mark detection section in a third field of view different from the first and second fields of view, a obtaining step of obtaining information on a position shift of the mark detection section from detection results of the first to third detection steps, and a determination step of determining a position shift of the reticle with respect to the stage based on the obtained information on the position shift of the mark detection section.

Description

Technical Field

[0001] This disclosure relates to a measurement method, a procedure, a photolithography method, a method for manufacturing an article, and a photolithography apparatus. Background Technology

[0002] As one of the photolithography apparatuses used in the manufacturing processes of semiconductor devices, flat panel displays (FPDs), etc., there exists an exposure apparatus that transfers the pattern of a master plate mounted on a stage onto a substrate. In the exposure apparatus, in order to transfer the pattern of the master plate onto the substrate with high precision, the positional offset of the master plate relative to the stage can be measured by detecting the reference mark set on the stage and the master plate mark set on the master plate using an observation instrument of the mark detection unit.

[0003] In exposure apparatuses, it is required to mount various types of original plates on the stage. In this case, the relative position of the reference mark and the original plate mark when the original plate is mounted on the stage may differ depending on the type of original plate. Therefore, it is necessary to measure the positional offset of the original plate relative to the stage with high precision, based on the type of original plate mounted on the stage.

[0004] Japanese Patent Application Publication No. 2003-007609 describes a method of mounting a workpiece smaller than a specified size that can be mounted on a stage using a retainer that retains the peripheral portion of the workpiece. In this publication, the positional offset of the retainer relative to the stage is measured by detecting the difference between a mark on the retainer and a reference mark on the stage, and the positional offset of the workpiece relative to the stage is determined based on this measurement result. Summary of the Invention

[0005] A first solution to the aforementioned problem relates to a measurement method for measuring the positional offset of a master plate mounted on a stage relative to the stage in a photolithography apparatus for transferring a pattern of a master plate mounted on a stage onto a substrate. The measurement method is characterized by comprising: a first detection step, using a mark detection unit to detect a reference mark on the stage in a first field of view with the master plate mounted on the stage; a second detection step, moving the mark detection unit relative to the stage and using the mark detection unit to detect a master plate mark on the master plate in a second field of view different from the first field of view; a third detection step, moving the mark detection unit relative to the stage and using the mark detection unit to detect a correction mark on the stage in a third field of view different from both the first and second fields of view; an acquisition step, acquiring information related to the positional offset of the mark detection unit from the detection results of the first to the third detection steps; and a determination step, determining the positional offset of the master plate relative to the stage based on the acquired information related to the positional offset of the mark detection unit.

[0006] A second solution to the aforementioned problem relates to a photolithography apparatus for transferring a pattern from a master copy onto a substrate. The photolithography apparatus is characterized by comprising: a stage for mounting the master copy; a mark detection unit for detecting a reference mark and a correction mark on the stage, as well as a master copy mark on the master copy; a drive unit for moving the mark detection unit relative to the stage; and a control unit for controlling the drive unit. The control unit uses the mark detection unit to detect, in a first field of view, a reference mark on the stage while the master copy is mounted on the stage, and causes the mark detection unit to... The measuring unit moves relative to the stage, and the mark detection unit is used to detect the original mark of the original in a second field of view different from the first field of view. The mark detection unit is then moved relative to the stage, and the mark detection unit is used to detect the correction mark of the stage in a third field of view different from the first and second fields of view. Information related to the positional offset of the mark detection unit is obtained from the detection results, and the positional offset of the original relative to the stage is determined based on the obtained information related to the positional offset of the mark detection unit.

[0007] The features of this disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments is by way of example. Attached Figure Description

[0008] Figure 1 This is a schematic diagram illustrating one embodiment of the exposure apparatus of this disclosure.

[0009] Figure 2 This is a schematic diagram showing one embodiment of the original model mounted on the original stage.

[0010] Figure 3 (a) is a diagram showing the layout of the reference marks and correction marks on the original stage, (b) is a diagram showing the layout of the original marks on the original, and (c) is a diagram showing the layout of the original stage and the original.

[0011] Figure 4 This is a flowchart illustrating one embodiment of the measurement method of this disclosure.

[0012] Figure 5 (a) is a diagram showing the detection position in the first detection process, (b) is a diagram showing the detection position in the second detection process, and (c) is a diagram showing the detection position in the third detection process. Detailed Implementation

[0013] As described in Japanese Patent Application Publication No. 2003-007609, if the alignment measuring unit can detect the reference mark and the original mark within the same field of view, it is possible to measure the positional offset of the original plate relative to the stage. Because the original mark is directly drawn on the original plate, it is also possible to configure the position of the original mark with high precision.

[0014] However, while it is desirable for the original markings to be made of the same material as the original, there are many cases where the original holder itself is made of a different material. Therefore, it is necessary to mount markings made of the same material as the original onto the original holder, sometimes resulting in lower positional accuracy for direct drawing methods. If positional accuracy decreases, it can become difficult to measure the original markings and the reference markings on the original stage within the same field of view.

[0015] When the original mark and the reference mark cannot converge within the same field of view, it is considered to drive the observation instrument of the mark detection unit to the original mark and the reference mark of the stage respectively, and to correct the offset based on the reference position of the observation instrument (e.g., the center of the field of view) and the mark of the object being measured. However, if the observation instrument is driven repeatedly, the origin position of the observation instrument may sometimes shift compared to before driving due to the influence of heat, etc. That is, the inventors of this application have discovered the problem of needing to eliminate the positional offset caused by driving the observation instrument of the measuring device, i.e., the alignment measuring unit. Below, as an example of measuring the positional offset of the original relative to the stage with higher accuracy, a measurement method that takes into account the positional offset caused by driving the observation instrument is disclosed.

[0016] In this specification and accompanying drawings, directions are represented by the XYZ coordinate system, which defines the X and Y directions as mutually orthogonal directions within a plane parallel to the holding surface of the original stage. Directions parallel to the X, Y, and Z axes of the XYZ coordinate system are defined as the X, Y, and Z directions, respectively, and rotation about the Z-axis is defined as θ. Control and drive (movement) of the X, Y, and Z axes respectively refer to control or drive (movement) about the directions parallel to the X, Y, and Z axes. Furthermore, control or drive of the θ axis refers to control or drive of rotation about an axis parallel to the Z-axis.

[0017] <Photolithography apparatus>

[0018] Embodiments of this disclosure will be described. Exposure apparatuses are known as photolithography apparatuses used in the manufacturing processes of semiconductor devices, flat panel displays (FPDs), etc. An exposure apparatus is a device that performs an exposure process to transfer (form) a pattern formed on a master plate onto a substrate by exposing the substrate with the master plate. In methods where multiple imaging areas on the substrate are exposed separately, there are step-repetition and step-scanning methods. An exposure apparatus using the step-repetition method is sometimes called a stepper, which sequentially performs an exposure process on each imaging area of ​​the substrate to transfer the pattern of the master plate onto the substrate. On the other hand, an exposure apparatus using the step-scanning method is sometimes called a scanner, which sequentially performs an exposure process on each imaging area of ​​the substrate to transfer the pattern of the master plate onto the substrate while scanning the master plate and the substrate relative to each other.

[0019] In this embodiment, an exposure apparatus employing a step-scan method is illustrated, and the relative scanning direction between the master and the substrate in this exposure apparatus is set to the Y direction.

[0020] Figure 1 This is a schematic diagram showing an example of the structure of the exposure apparatus EXP according to this embodiment. The exposure apparatus EXP may include, for example, an illumination optical system 1, a mark detection unit 2, a master stage 4 (stage), a projection optical system 5, a substrate stage 7, and a control unit 15.

[0021] The illumination optical system 1 uses light emitted from a light source (not shown) such as an ultra-high pressure mercury lamp to illuminate the original plate 3. For example, the illumination optical system 1 includes a wavelength selective filter, a lens group, and a shutter, which shapes the light from the light source into exposure light with a wavelength and shape suitable for the exposure of the substrate 6 to illuminate the original plate 3.

[0022] Original version 3 is mounted on original version stage 4. Original version stage 4 is configured to hold original version 3 and move it in the XY direction, and is driven in the XY direction by original version drive mechanism 21 controlled by control unit 15.

[0023] The position of the original stage 4 can be continuously measured (monitored) by the first measuring unit 22. The first measuring unit 22 may include, for example, a laser interferometer. In this case, the first measuring unit 22 illuminates a reflector (not shown) provided on the original stage 4 with measuring light, and measures the position of the original stage 4 based on the measuring light reflected by the reflector. Therefore, the control unit 15 can control the position of the original plate 3 mounted on the original stage 4 based on the position of the original stage 4 measured by the first measuring unit 22. Furthermore, the control unit 15 can control the speed of the original plate 3 mounted on the original stage 4 based on the time change in the position of the original stage 4 measured by the first measuring unit 22.

[0024] The projection optical system 5 has multiple optical elements, including a mirror and a lens. The projection optical system 5 projects an image of the pattern formed on the original plate 3 onto the substrate 6 at a predetermined magnification by reflecting or refracting the exposure light that has passed through the original plate 3 using multiple optical elements.

[0025] The substrate 6 is mounted on the substrate stage 7. The substrate stage 7 is configured to hold the substrate 6 and move it in the X, Y, Z and θ directions, and is driven in each direction by the substrate driving mechanism 23 controlled by the control unit 15.

[0026] The position of the substrate stage 7 can be continuously measured (monitored) by the second measuring unit 24. The second measuring unit 24 may, for example, include a laser interferometer. In this case, the second measuring unit 24 illuminates a reflector (not shown) disposed on the substrate stage 7 with measuring light, and measures the position of the substrate stage 7 based on the measuring light reflected from the reflector. Therefore, the control unit 15 can control the position of the substrate 6 mounted on the substrate stage 7 based on the position of the substrate stage 7 measured by the second measuring unit 24. Furthermore, the control unit 15 can control the speed of the substrate 6 mounted on the substrate stage 7 based on the time-varying changes in the position of the substrate stage 7 measured by the second measuring unit 24.

[0027] The mark detection unit 2 (alignment detection unit) has an observation instrument for detecting (capturing) the reference mark 8 set on the original stage 4 and the original mark 18 set on the original 3. The observation instrument may be equipped with an objective lens. In addition, the mark detection unit 2 detects the substrate stage mark (not shown) set on the substrate stage 7 and / or the substrate mark (not shown) set on the substrate 6 via the original 3 and the projection optical system 5. The mark detection unit 2 has a focus adjustment mechanism that can adjust the focus according to the position of each mark in the Z direction and detect each mark.

[0028] Furthermore, the mark detection unit 2 is configured to move in the XY direction and is driven in the XY direction by the detection drive mechanism 25 controlled by the control unit 15. For example, when the mark detection unit 2 detects the reference mark 8 and the original mark 18, the mark detection unit 2 is driven by the detection drive mechanism 25 to place the mark within the field of view of the mark detection unit 2 (observation instrument). Here, the movement to place the mark within the field of view of the mark detection unit 2 can also be performed by driving the original stage 4 (original 3) by the original drive mechanism 21. Alternatively, the original stage 4 (original 3) and the mark detection unit 2 can be driven relative to each other by both the detection drive mechanism 25 and the original drive mechanism 21. That is, the detection drive mechanism 25 and the original drive mechanism 21 constitute a drive mechanism that drives the original stage 4 (original 3) and the mark detection unit 2 relative to each other.

[0029] The control unit 15 is, for example, a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls the exposure process by controlling each part of the exposure apparatus EXP. For example, the control unit 15 functions as a processing unit that determines the drive amount of each drive mechanism in the exposure process based on the position information of each mark obtained from the detection results of the mark detection unit 2 (described later). In this embodiment, the control unit 15 may include a data storage unit 12, a drive amount calculation unit 13, and a drive indication unit 14. The data storage unit 12 constitutes at least a part of the storage unit of the control unit 15, storing position information of each mark, drive parameters such as drive bias and sensitivity of various drive axes, and various measurement data obtained from the exposure apparatus EXP. The drive amount calculation unit 13 constitutes at least a part of the processor of the control unit 15, and determines the drive indication amount of various drive axes such as the master stage 4 and the substrate stage 7 in the exposure process based on the various data stored in the data storage unit 12. The drive instruction unit 14 constitutes at least part of the processor of the control unit 15, and outputs drive instructions to each drive mechanism based on the drive instruction quantity determined by the drive quantity calculation unit 13.

[0030] In order to transfer the pattern of the original plate 3 onto the substrate 6 with high precision in the aforementioned exposure apparatus EXP, it is important to drive the original plate 3 mounted on the original plate stage 4 with high precision. As mentioned earlier, the original plate 3 is driven by the original plate drive mechanism 21 based on the position of the original plate stage 4 measured by the first measurement unit 22. Therefore, in order to control the position of the original plate 3 mounted on the original plate stage 4 with high precision, it is desirable to have information indicating the positional offset of the original plate 3 relative to the original plate stage 4. Therefore, in the exposure apparatus EXP, a measurement process is performed to measure the positional offset of the original plate 3 relative to the original plate stage 4 by detecting the reference mark 8 of the original plate stage 4 and the original plate mark 18 of the original plate 3 by the mark detection unit 2.

[0031] Figure 2 This illustrates one embodiment of the original 3 mounted on the original stage 4. Figure 3 (a) shows the layout of reference mark 8 and correction mark 11 at the original stage 4, (b) shows the layout of original mark 18 at the original 3, and (c) shows the layout of the original stage 4 and the original 3.

[0032] In the exposure apparatus EXP, the specified size of the original plate that can be mounted on the original plate stage 4 is usually determined. However, sometimes a retainer 30 that holds the edge portion of the original plate 3 is used to mount an original plate 3 that is smaller than the specified size on the original plate stage 4. In this embodiment, the original plate 3 is smaller than the specified size.

[0033] exist Figure 3The following section describes configuration examples for each tag.

[0034] The reference marks 8a and 8b of the original stage 4 can be configured in the same positions as the reference marks when using an original of a specified size. Regarding these marks, the XY direction position of 8a with the center О1 of the original stage 4 as the origin is set to (XL1, YL1), and the XY direction position of 8b with the center О1 of the original stage 4 as the origin is set to (XR1, YR1).

[0035] Two original markings 18a and 18b are positioned on the original plate 3 in the X direction. Regarding these markings, the XY direction position of 18a with the center O2 of the original plate 3 as the origin is set to (XL2, YL2), and the XY direction position of 18b with the center O2 of the original plate 3 as the origin is set to (XR2, YR2). However, it is desirable that the center O1 of the original plate stage at the mounting position of the original plate is aligned with the center O2 of the original plate. A light-transmitting portion 34 is provided in a part of the retainer corresponding to the positions of markings 8a and 8b when the retainer 30 is mounted on the original plate stage. The light-transmitting portion 34 may also be a through hole. Furthermore, in order to ensure that the focus adjustment amount obtained by the marking detection unit 2 when measuring markings 8a and 8b with the original plate 3 is consistent with the focus adjustment amount when measuring the markings with the retainer 30, the light-transmitting portion 34 is expected to be made of the same material and have the same thickness as the original plate.

[0036] The calibration mark 11 of the original stage 4 is positioned at a distance SY in the Y direction, originating from the center of the original stage 4, starting from the mounting portion of the original stage 3 and the holder 30. Furthermore, relative to the position SY in the Y direction, originating from the center O1 of the original stage 4, marks 11a and 11b are positioned at distances YL3 and YR3, respectively, in the Y direction. That is, regarding the calibration marks of the original stage 4, the position of 11a in the XY direction, originating from the center O1 of the original stage 4, is set to (XL3, YL3+SY), and the position of 11b in the XY direction, originating from the center O1 of the original stage 4, is set to (XR3, YR3+SY).

[0037] The original stage 4 may include a main body 4a and a chuck 4b. The main body 4a is driven in the XY direction by the original drive mechanism 21, and a reference mark 8 and a correction mark 11 are provided on the main body 4a. The chuck 4b is a mechanism that attracts and holds the original 3 by vacuum attraction, electrostatic attraction, etc. In addition, an opening 4c is provided on the original stage 4 for light from the pattern set in the central part of the original 3 to pass through.

[0038] The retainer 30 may include a first part 31 held by the original stage 4 (chuck 4b), a second part 32 connected to the first part and holding (supporting) the small-sized original 3, and a fixing member 33 for fixing the original 3 held by the second part 32. The first part 31 and the second part 32 of the retainer 30 may be made of opaque materials such as metal, but may also be made of translucent materials. When the first part 31 and the second part 32 are made of opaque materials, the retainer 30 has a translucent part 34 at the position (first part 31) where it overlaps with the reference mark 8 when mounted on the original stage 4. In order to make the focus of the mark detection unit 2 consistent when the reference mark 8 is detected via the original 3 and when the reference mark 8 is detected via the translucent part 34, a translucent part of the same material and thickness as the original 3 may be provided at the translucent part 34 of the retainer 30. Additionally, the fixing member 33 is a component that fixes the original plate 3 to the retainer 30 (second part 32) by pressing the small-sized original plate 3 onto the second part 32. For example, it may be made of a leaf spring.

[0039] A template mark 18 is provided at the template 3. If a template 3 smaller than the specified size is used, when the template 3 is mounted on the template stage 4 via the retainer 30, it is sometimes impossible to simultaneously converge the reference mark 8 of the template stage 4 and the template mark 18 of the template 3 within the field of view of the mark detection unit 2 (observation instrument). Therefore, the mark detection unit 2 independently converges the reference mark 8 of the template stage 4 and the template mark 18 of the template 3 within its field of view for detection by relative movement between the template stage 4 and the mark detection unit 2. Similarly, the mark detection unit 2 independently converges the correction mark 11 of the template stage 4 and the template mark 18 of the template 3 within its field of view for detection by relative movement between the template stage 4 and the mark detection unit 2.

[0040] The control unit 15 moves the original stage 4 relative to the mark detection unit 2, thereby converging the reference mark 8a into the field of view (first field of view) of the mark detection unit 2 via the light-transmitting portion 34 of the holding member 30. In this state, the mark detection unit 2 detects the reference mark 8a.

[0041] Next, the control unit 15 moves the mark detection unit 2 relative to the original stage 4, thereby bringing the original mark 18a into the field of view (second field of view) of the mark detection unit 2, and in this state, the mark detection unit 2 detects the original mark 18a.

[0042] Then, the control unit 15 moves the original stage 4 relative to the mark detection unit 2, thereby bringing the correction mark 11a into the field of view (third field of view) of the mark detection unit 2, and in this state, the mark detection unit 2 detects the correction mark 11a.

[0043] Similarly, the control unit 15 moves the original stage 4 relative to the mark detection unit 2, thereby converging the reference mark 8b into the field of view (first field of view) of the mark detection unit 2 via the light-transmitting portion 34 of the holding member 30. In this state, the mark detection unit 2 detects the reference mark 8b.

[0044] Next, the control unit 15 moves the mark detection unit 2 relative to the original stage 4, thereby bringing the original mark 18b into the field of view (second field of view) of the mark detection unit 2, and in this state, the mark detection unit 2 detects the original mark 18b.

[0045] Then, the control unit 15 moves the original stage 4 relative to the mark detection unit 2, thereby bringing the correction mark 11b into the field of view (third field of view) of the mark detection unit 2, and in this state, the mark detection unit 2 detects the correction mark 11b.

[0046] The control unit 15 can determine the positional offset of the original plate 3 relative to the original plate stage 4 based on the reference mark 8 detected by the mark detection unit 2, the corresponding original plate mark 18, and the relative position with the correction mark 11. Detailed processing for determining the positional offset will be described later in the description of the measurement method.

[0047] <Measurement Method>

[0048] Next, the measurement method of this disclosure using the exposure apparatus EXP will be described. Figure 4 The flowchart can be executed by the control unit 15.

[0049] First, in step S101, the control unit 15 drives the original stage 4 and the mark detection unit 2 relative to each other, so that the reference mark 8 of the original stage 4 converges into the first field of view of the mark detection unit 2 via the light-transmitting part 34 of the holding member 30. In this state, the observer detects (captures) the reference mark 8 in the first field of view (first detection step). At the initial position of the mark detection unit 2, if the reference mark 8 converges into the first field of view, the relative driving between the original stage 4 and the mark detection unit 2 can be omitted. Furthermore, the original mark 18 and the correction mark 11 cannot converge into the first field of view. When driving the original stage 4 and the mark detection unit 2, if necessary, the focus adjustment mechanism of the mark detection unit 2 can also be used to adjust the focus so that it is aligned with the reference mark 8 of the original stage 4. That is, the position of the objective lens can also be adjusted. Here, the offset of the reference mark 8 relative to a predetermined part of the mark detection unit 2 is measured. The predetermined part is, for example, the center of the first field of view. The measured value of reference mark 8a is set to (dxL1, dyL1), and the measured value of reference mark 8b is set to (dxR1, dyR1).

[0050] Alternatively, the mark detection unit 2 can be driven in a manner that brings the reference marks 8a and 8b to the center of the first field of view of the mark detection unit 2 for final driving. Furthermore, an allowable value for the offset of the reference marks 8a and 8b relative to the center of the first field of view of the mark detection unit 2 can be set.

[0051] Figure 5 (a) shows the measurement position of the mark detection unit 2 when measuring the reference mark 8 on the original stage 4 in step S101. The mark detection units 2a and 2b can be driven to a position where the reference marks 8a and 8b can be measured, which in this case is directly above the location where the reference marks 8a and 8b are arranged. The distance between the mark detection units 2a and 2b is the same as the X-direction distance between the marks of the reference marks 8a and 8b, Xspan1.

[0052] Next, in step S102, to bring the original mark 18 of the original plate 3 into the second field of view of the mark detection unit 2, the control unit 15 drives the mark detection unit 2, and the observer detects (captures) the original mark 18 within the second field of view (second detection step). Furthermore, the second field of view is different from the first field of view; the reference mark 8 and the correction mark 11 do not converge within the second field of view. When driving the mark detection unit 2, if necessary, the focus adjustment mechanism of the mark detection unit 2 can be used to adjust the focus so that it is aligned with the original mark 18 of the original plate 3. That is, the position of the objective lens can also be adjusted. Here, the offset of the original mark 18 relative to a predetermined location of the mark detection unit 2 is measured. The predetermined location is, for example, the center of the second field of view. The measured value of the original mark 18a is set as (dxL2, dyL2), and the measured value of the original mark 18b is set as (dxR2, dyR2).

[0053] The XY direction drive amount of the mark detection unit 2 here can be determined based on the relative distance from the reference mark 8a to the original mark 18a and from the reference mark 8b to the original mark 18b. In this case, the relative distance from the reference mark 8a to the original mark 18a can be calculated as (XL2-XL1, YL2-YL1), and the relative distance from the reference mark 8b to the original mark 18b can be calculated as (XR2-XR1, YR2-YR1).

[0054] Figure 5 (b) shows the measurement position of the mark detection unit 2 when measuring the original mark 18 of the original plate 3. The mark detection units 2a and 2b can be driven to a position where the original marks 18a and 18b can be measured, which in this case is directly above the part where the original marks 18a and 18b are located. The distance between the mark detection units 2a and 2b is Xspan2, which is the same as the distance in the X direction between the marks 18a and 18b.

[0055] Next, in step S103, to bring the correction mark 11 of the original stage 4 into the third field of view of the mark detection unit 2, the control unit 15 drives the original stage 4 and the mark detection unit 2 relative to each other. In this state, the observation instrument detects (captures) the correction mark 11 in the third field of view (third detection step). Furthermore, the third field of view is different from the first and second fields of view; the reference mark 8 and the original mark 18 do not converge in the third field of view. If necessary, the focus adjustment mechanism of the mark detection unit 2 can also be used to adjust the focus so that it is aligned with the correction mark 11 of the original stage 4.

[0056] That is, the position of the objective lens can also be adjusted. Here, the offset of the correction mark 11 relative to a predetermined location of the mark detection unit 2 is measured. The predetermined location is, for example, the center of the third field of view. The measured value of the correction mark 11 is set as (dxL3, dyL3), and the measured value of the correction mark 11 is set as (dxR3, dyR3).

[0057] The X-direction drive amount of the mark detection unit 2 can be determined based on the relative distances from the original mark 18a to the correction mark 11a and from the original mark 18b to the correction mark 11b. In this case, the relative distances from the original mark 18a to the correction mark 11a in the X direction can be calculated as XL3-XL2, and the relative distances from the original mark 18b to the correction mark 11b in the X direction can be calculated as XR3-XR2. Furthermore, the Y-direction drive amount of the mark detection unit 2 can be determined based on the relative distances from the original mark 18a to the correction mark 11a and from the original mark 18b to the correction mark 11b, and the Y-direction drive amount SY of the original stage 4. In this case, the relative distances from the original mark 18a to the correction mark 11a in the Y direction are YL3+SY-YL2, and the relative distances from the original mark 18b to the correction mark 11b in the Y direction are YR3+SY-YR2. Therefore, the driving amount in the Y direction from the original mark 18a to the correction mark 11a can be calculated as YL3-YL2, and the driving amount in the Y direction from the original mark 18b to the correction mark 11b can be calculated as YR3-YR2.

[0058] Figure 5 (c) shows the measurement position of the mark detection unit 2 when measuring the calibration mark 11 on the original stage 4. The mark detection units 2a and 2b can be driven to a position where the calibration marks 11a and 11b can be measured, which in this case is directly above the part where the calibration marks 11a and 11b are located. The distance between the mark detection units 2a and 2b is the same as the X-direction distance between the marks 11a and 11b.

[0059] Next, in step S104, the position offset of the mark detection unit 2 is calculated based on the measured value of the reference mark 8 obtained in the first detection step of step S101 and the measured value of the correction mark 11 obtained in step S103. That is, information related to the position offset of the observation instrument is obtained (acquisition step). The position offset when the mark detection unit 2 is driven to the measured position of the reference mark 8a of the original stage 4 and the measured position of the correction mark 11a of the original stage can be calculated as (dxL3-dxL1, dyL3-dyL1). The position offset when the mark detection unit 2 is driven to the measured position of the reference mark 8b of the original stage 4 and the measured position of the correction mark 11b of the original stage 4 can be calculated as (dxR3-dxR1, dyR3-dyR1).

[0060] The positional offset of the reference mark 8 on the original stage 4 detected in the first inspection process and the positional offset of the correction mark 11 detected in the third inspection process are determined by the mark detection unit 2 from... Figure 5 The position of Xspan1 in (a) is driven to Figure 5 The offset of Xspan3 at position (c). Additionally, the position offset of the reference mark 8 detected in the first detection step and the position offset of the original mark 18 detected in the second detection step are the offsets from the mark detection unit 2 at position (c). Figure 5 The position of Xspan1 in (a) is driven to Figure 5 The offset of Xspan2 at position (b).

[0061] Therefore, the position offset of the reference mark 8 detected in the first detection step and the position offset of the correction mark 11 detected in the third detection step, as well as the position offset of the reference mark 8 detected in the first detection step and the position offset of the original mark 18 detected in the second detection step, can be converted into the position offset of the mark detection unit 2.

[0062] At this time, when the position offset of the marker detection unit 2 is proportional to the driving distance of the marker detection units 2a and 2b, the coefficient K used in the conversion is as follows.

[0063] Formula 1

[0064]

[0065] If Formula 1 is used, the positional offset of the mark detection unit 2 relative to the measurement position of the original mark 18a can be expressed as ((dxL3-dxL1)×K, (dyL3-dyL1)×K). Similarly, the positional offset of the mark detection unit 2 relative to the measurement position of the original mark 18b can be expressed as ((dxR3-dxR1)×K, (dyR3-dyR1)×K).

[0066] In step S105, based on the measured value of the reference mark 8 obtained in S101, the measured value of the original mark 18 obtained in S102, and the positional offset of the mark detection unit 2 relative to the measured position of the original mark 18 calculated in S104, the relative position information between the original mark 18 and the reference mark 8 is calculated. This determines the positional offset of the original 3 relative to the stage 4 (determination process). The relative position between the reference mark 8a and the original mark 18a can be calculated using (dxL2-dxL1, dyL2-dyL1), and the relative position between the reference mark 8b and the original mark 18b can be calculated using (dxR2-dxR1, dyR2-dyR1).

[0067] Furthermore, regarding the relative position information between the original mark 18 and the reference mark 8 obtained by measuring the position offset of the calibration mark detection unit 2 relative to the original mark 18, for the reference mark 8a and the original mark 18a, it can be calculated as ((dxL2-dxL1)-(dxL3-dxL1)×K, (dyL2-dyL1)-(dyL3-dyL1)×K). For the reference mark 8b and the original mark 18b, it can be calculated as ((dxR2-dxR1)-(dxR3-dxR1)×K, (dyR2-dyR1)-(dyR3-dyR1)×K). The control unit 15 determines the position offset of the original 3 relative to the original stage 4 based on this relative position information. When there are multiple groups of reference mark 8 and original mark 18, the positional offset of original 3 relative to original stage 4 can also be determined based on representative values ​​(such as average, mode, etc.) of the relative positional offset obtained for each of the multiple groups.

[0068] Here, in the above measurement process, the position of the substrate stage 7 is arbitrary when calculating the relative positional offsets with reference mark 8, correction mark 11, and original mark 18, respectively. From the viewpoint of throughput, the above measurement process is preferably performed in parallel with other processes, for example, it can be performed during the process of changing the substrate 6 on the substrate stage 7.

[0069] Furthermore, the control unit 15 can perform an exposure process that exposes the substrate 6 to transfer the pattern of the original plate 3 onto the substrate 6. During the exposure process, the alignment of the original plate 3 and the substrate 6 is controlled based on the positional offset determined in step S105. For example, the control unit 15 controls the position of the original plate 3 mounted on the original plate stage 4 based on the position of the original plate stage 4 measured by the first measuring unit 22 and the positional offset determined in S105, thereby controlling the alignment of the original plate 3 and the substrate 6.

[0070] <Implementation Method of the Article Manufacturing Method>

[0071] The article manufacturing method of this disclosure is suitable for manufacturing articles such as micro-devices like semiconductor devices and components with fine structures. It is also suitable for manufacturing articles such as large components like displays. The article manufacturing method of this embodiment includes a transfer step of transferring a pattern from a master image onto a substrate using the aforementioned photolithography method (photolithography apparatus), a processing step of processing the substrate after the transfer step, and a manufacturing step of manufacturing an article from the processed substrate. The transfer step can also be understood as a step of exposing the substrate using the aforementioned exposure method (exposure apparatus). Furthermore, the processing step can also be understood as a step of developing the photosensitive material (photoresist) on the substrate on which the master image has been transferred as a latent image pattern. Further, the article manufacturing method includes other known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, encapsulation, etc.).

[0072] The article manufacturing method of this embodiment is advantageous in at least one aspect of article performance, quality, productivity, and production cost compared to conventional methods.

[0073] <Other Implementation Methods>

[0074] This disclosure can also be implemented by supplying a program that implements one or more functions of the above embodiments to a system or device via a network or storage medium, and having one or more processors in the computer of the system or device read out the program and execute it. Alternatively, it can be implemented by a circuit (e.g., an ASIC) that implements one or more functions.

[0075] Furthermore, in the above embodiments, the second field of view is outside the first field of view, but the second field of view only needs to be a different field of view from the first field of view; it does not necessarily need to be outside the first field of view. That is, this disclosure can be applied even if the second field of view is included within the first field of view. Additionally, the third field of view is outside both the first and second fields of view, but the third field of view only needs to be a different field of view from both the first and second fields of view; it does not necessarily need to be outside both the first and second fields of view. That is, this disclosure can be applied even if the third field of view is included within both the first and second fields of view.

[0076] According to this disclosure, it is possible to measure the positional offset of the original image relative to the stage with high precision.

[0077] While this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation to cover all such modifications and equivalent structures and functions.

[0078] This application claims the benefit of Japanese Patent Application No. 2025-062992, filed on April 7, 2025, the entire contents of which are incorporated herein by reference.

Claims

1. A measurement method for measuring the positional offset of a master plate relative to a stage in a photolithography apparatus for transferring a pattern of a master plate mounted on a stage onto a substrate. The measurement method is characterized by including: In the first inspection step, a mark detection unit is used to detect a reference mark on the stage when the original is mounted on the stage in the first field of view. In the second detection step, the mark detection unit is moved relative to the stage, and the mark detection unit is used to detect the original mark of the original in a second field of view that is different from the first field of view; In the third detection step, the mark detection unit is moved relative to the stage, and the mark detection unit is used to detect the correction mark of the stage in a third field of view that is different from the first field of view and the second field of view. The acquisition process obtains information related to the positional offset of the marker detection unit from the detection results of the first detection process to the third detection process; as well as The process involves determining the positional offset of the original image relative to the stage based on information obtained related to the positional offset of the mark detection unit.

2. The measurement method according to claim 1, wherein, The first detection step includes detecting the offset of the reference mark relative to a predetermined location in the first field of view. The third detection step includes detecting the offset of the correction mark relative to a predetermined location in the third field of view.

3. The measurement method according to claim 2, wherein, The predetermined location of the first field of view is the center of the first field of view. The predetermined location of the third field of view is the center of the third field of view.

4. The measurement method according to claim 2, wherein, The acquisition process includes obtaining the position offset of the mark detection unit based on the difference between the offset of the reference mark and the offset of the correction mark.

5. The measurement method according to claim 2, wherein, The second detection step includes detecting the offset of the original mark relative to a predetermined location in the second field of view. The determination process includes determining the positional offset of the original plate relative to the stage based on the difference between the offset of the reference mark and the offset of the original mark and the positional offset of the mark detection unit.

6. The measurement method according to claim 5, wherein, The predetermined location of the second field of view is the center of the second field of view.

7. The measurement method according to claim 1, wherein, In the first inspection step, the original mark is positioned outside the first field of view. In the second detection step, the calibration mark is positioned outside both the first and second fields of view.

8. The measurement method according to claim 1, wherein, The original is mounted on the stage via a retainer that holds the edge portion of the original.

9. The measurement method according to claim 8, wherein, In the first detection step, the reference mark is detected by the mark detection unit via the holding member.

10. The measurement method according to claim 9, wherein, The retainer has a light-transmitting portion at the position where it overlaps with the reference mark when mounted on the stage.

11. A program, For causing a computer to perform each step of the measurement method according to any one of claims 1 to 10.

12. A photolithography method for transferring a pattern from a master plate mounted on a stage onto a substrate. The photolithography method is characterized by including: The measurement process involves using the measurement method described in any one of claims 1 to 10 to measure the positional offset of the original plate relative to the stage. as well as The transfer process transfers the pattern from the original plate to the substrate. In the transfer process, the alignment of the original plate with the substrate is controlled based on the positional offset of the original plate relative to the stage measured in the measurement process.

13. A method for manufacturing an article, characterized in that, include: In the transfer process, the photolithography method described in claim 12 is used to transfer the original pattern onto the substrate; The processing step involves processing the substrate that has undergone the transfer process; as well as The manufacturing process involves producing an article from the substrate that has undergone the aforementioned processing steps.

14. A photolithography apparatus for transferring a pattern from an original image onto a substrate. The photolithography apparatus is characterized by having: The stage, housing the original version; The marking detection unit detects the reference markings and correction markings on the stage, as well as the original markings on the original plate. The drive unit moves the mark detection unit relative to the stage; and The control unit controls the drive unit. The control unit A marker detection unit is used to detect a reference marker on the stage when the original is mounted on the stage in the first field of view. The mark detection unit is moved relative to the stage, and the mark detection unit is used to detect the original mark of the original in a second field of view different from the first field of view. The mark detection unit is moved relative to the stage, and the mark detection unit is used to detect the correction mark of the stage in a third field of view, which is different from the first and second fields of view. Information related to the positional offset of the marker detection unit is obtained from the detection results. The positional offset of the original image relative to the stage is determined based on the information obtained related to the positional offset of the mark detection unit.

Images