Electronic device and protective assembly
Patent Information
- Application Number
- CN202510431331.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-10-16
AI Technical Summary
然而，液态的热界面材料可能会有溢流风险，致使热界面材料溢流至基板上的电子元件(例如，电容)
[0011] In summary, in some embodiments, the electronic device confines the thermal interface fluid within an overflow area. When the thermal interface fluid overflows, it can open a venting channel, allowing external air to enter the overflow area. Subsequently, the thermal interface fluid, external air, and metal components can undergo a curing reaction to solidify within the overflow area. This ensures that the thermal interface fluid remains within the overflow area.
Smart Images
Figure CN122924518A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an electronic device, and more particularly to an electronic device having protective components. Background Technology
[0002] When a computing chip is operating, it generates heat. To maintain the computing chip at a suitable operating temperature, the industry currently coats its surface with thermal interface materials, which then conduct the heat to a heat dissipation module. However, liquid thermal interface materials may pose a risk of overflow, causing them to spill onto electronic components (e.g., capacitors) on the substrate. Summary of the Invention
[0003] In view of this, an electronic device is provided. The electronic device includes a circuit board and a protective component. The circuit board has a board surface, and a chip is disposed on the board surface. The protective component includes a barrier, a metal component, a heat sink, and a thermal interface fluid. The barrier is connected to the board surface and surrounds the chip, forming an overflow area between the barrier and the chip. The barrier has a venting channel connecting the overflow area to the external atmosphere. The metal component is disposed in the overflow area. The heat sink covers the chip and the barrier. The thermal interface fluid is located between the heat sink and the chip. In response to the thermal interface fluid overflowing into the overflow area and reacting with the metal component to solidify, the thermal interface fluid solidifies in the overflow area.
[0004] In some embodiments, the blocking element includes a venting element and an outer colloid. The venting element is connected to the board surface and surrounds the chip, and a venting channel is disposed in the venting element. The outer colloid is connected to the venting element and surrounds the chip, forming an overflow area between the outer colloid, the venting element, the chip, and the heat sink. A metal component is disposed on the venting element and seals the venting channel. In response to the overflow of thermal interface fluid into the overflow area and the opening of the venting channel, the thermal interface fluid and the metal component undergo a curing reaction.
[0005] In some embodiments, the breathable element is a mesh having multiple grids, and air channels are disposed in these grids.
[0006] In some embodiments, the venting element is a porous plate.
[0007] In some embodiments, the porous plate is a sintered metal powder body.
[0008] In some embodiments, the protective component further includes an insulating adhesive disposed on the surface of the board.
[0009] In some embodiments, the blocking element further includes an inner colloid, which is attached to the board surface and directly connected to the four rings around the chip, and the overflow area is located between the inner colloid and the outer colloid.
[0010] In some embodiments, a protective component is provided. The protective component is adapted to form an overflow region between the chip and a heat sink, allowing thermal interface fluid to solidify in the overflow region. The protective component includes a barrier, a venting channel, and a metal component. The barrier surrounds the chip and forms the overflow region with the chip, and the barrier has a venting channel connecting the overflow region to the external atmosphere. The metal component is disposed in the overflow region. In response to the thermal interface fluid overflowing into the overflow region and reacting with the metal component, the thermal interface fluid solidifies in the overflow region.
[0011] In summary, in some embodiments, the electronic device confines the thermal interface fluid within an overflow area. When the thermal interface fluid overflows, it can open a venting channel, allowing external air to enter the overflow area. Subsequently, the thermal interface fluid, external air, and metal components can undergo a curing reaction to solidify within the overflow area. This ensures that the thermal interface fluid remains within the overflow area.
[0012] The following detailed description of the features and advantages of the present invention in the embodiments is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the content disclosed in this specification, the scope of the patent application and the drawings, any person skilled in the art can easily understand the related objectives and advantages of the present invention. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the appearance of the electronic device in some embodiments of the present invention.
[0014] Figure 2 for Figure 1 The cross-sectional view along the AA direction shows that the fluid at the thermal interface has not yet overflowed and the gas guide channel is closed.
[0015] Figure 3 for Figure 1 The partial cross-sectional view along the AA direction shows that the fluid at the thermal interface overflows into the overflow area, and the gas guide channel is opened.
[0016] Figure 4 This is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the breathable element and the outer colloid.
[0017] Figure 5A This is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the breathable element is a mesh.
[0018] Figure 5B for Figure 5A A schematic diagram of the mesh structure.
[0019] Figure 6A This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing the relative positions of the first and second grids of the mesh.
[0020] Figure 6B for Figure 6A A schematic diagram of the first grid in the diagram.
[0021] Figure 6C for Figure 6A A schematic diagram of the second grid in the middle.
[0022] Figure 7 This is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the breathable element consists of a first mesh and a second mesh that overlap each other.
[0023] Figure 8A This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing that the porous plate is a sintered metal powder body.
[0024] Figure 8B This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing that the porous plate is a perforated plate.
[0025] Figure 9 This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing the relative positions of the inner and outer colloids.
[0026] Figure 10A This is a schematic diagram of the appearance of the external colloid in some embodiments of the present invention (I).
[0027] Figure 10B This is a schematic diagram (II) showing the appearance of the external colloid in some embodiments of the present invention.
[0028] Figure 10C This is a schematic diagram (III) showing the appearance of the external colloid in some embodiments of the present invention.
[0029] Figure 10D This is a schematic diagram (four) showing the appearance of the outer colloid in some embodiments of the present invention.
[0030] The attached figures are labeled as follows:
[0031] 100: Electronic devices; 102: Circuit boards
[0032] 104: Protective components 106: Panel surface
[0033] 108: Chip 109: Heating Surface
[0034] 110, 110a, 110b: Blocking components; 112: Metal components
[0035] 112a: First contact surface; 112b: Second contact surface
[0036] 114: Heat sink 116: Thermal interface fluid
[0037] 118: Overflow area; 120: Air guide channel
[0038] 122: Breathable component; 124: Outer colloid
[0039] 124a: First connecting surface; 124b: Second connecting surface
[0040] 124c: Hollowed-out section; 126: Mesh body
[0041] 126a: First mesh; 126b: Second mesh
[0042] 128: Grid 128a: First Grid
[0043] 128b: Second grid; 130a: Sintered metal powder body
[0044] 130b: Perforated plate; 132a, 132b: Holes
[0045] 134a: convex part 134b: concave part
[0046] 136: Inner colloid; 138: Insulating adhesive Detailed Implementation
[0047] Please see Figure 1 and Figure 2 . Figure 1 This is a schematic diagram of the appearance of the electronic device in some embodiments of the present invention. Figure 2 for Figure 1 The cross-sectional view along the AA direction shows that the thermal interface fluid has not yet overflowed and the gas guide channel is closed. In some embodiments, such as Figure 1 and Figure 2 As shown, the electronic device 100 includes a circuit board 102 and a protective assembly 104. The circuit board 102 has a board surface 106, on which a chip 108 is disposed. The protective assembly 104 includes a blocking member 110, a metal member 112, a heat sink 114, and a thermal interface fluid 116. The blocking member 110 is connected to the board surface 106 and surrounds the chip 108, forming an overflow area 118 between itself and the chip 108. The blocking member 110 has a venting channel 120. The venting channel 120 connects the overflow area 118 to an external atmosphere (such as...). Figure 3 (Middle arrow). Metal component 112 is disposed in overflow area 118. Heat sink 114 covers chip 108 and barrier 110. Thermal interface fluid 116 is located between heat sink 114 and chip 108. In response to the thermal interface fluid 116 overflowing into overflow area 118 and reacting with metal component 112, thermal interface fluid 116 solidifies in overflow area 118.
[0048] Circuit board 102 may be, for example, an expansion card circuit board, a laptop circuit board, a computer circuit board, or a circuit board with a computing chip. Chip 108 may be, for example, but not limited to, a central processing unit (CPU), a microcontroller, a graphics processing unit (GPU), or other devices with high thermal design power (TDP). When chip 108 is being processed, the heat generated by chip 108 is conducted to a heat-generating surface 109 of chip 108, and then conducted through heat-generating surface 109 to heat sink 114 for heat dissipation.
[0049] The heat sink 114 has good thermal conductivity, allowing heat from the chip 108 to be conducted to it via the heating surface 109 and the thermal interface fluid 116. The heat sink 114 can exchange heat with the external atmosphere to maintain the chip 108 at its operating temperature. The heat sink 114 can be made of, for example, a metal material, a composite metal material, a ceramic composite material, or a thermally conductive plastic. The heat sink 114 can also be, for example, a heat sink with heat dissipation fins or a water-cooled heat sink. Any heat dissipation method suitable for the chip 108 can be used, and it is not limited to the aforementioned heat dissipation materials.
[0050] The thermal interface fluid 116 is a liquid, paste, or gel thermal interface material that exhibits a flowable state at room temperature or high temperature (e.g., 60°C to 180°C). The thermal interface fluid 116 contains a metal element that can cause the liquid metal to solidify (this metal element may be, for example, any one of gallium (Ga), gallium-indium (Ga-In), or gallium-indium-tin (Ga-In-Sn), or a combination of two or more of the aforementioned metals). The thermal interface fluid 116 is coated on the heating surface 109. When the heat sink 114 covers and presses against the heating surface 109, the thermal interface fluid 116 can fill the rough surfaces of the heating surface 109 and the heat sink 114. Therefore, the contact area between the heating surface 109 and the heat sink 114 is more complete, so as to improve the heat transfer efficiency of the heating surface 109 in transferring heat energy to the heat sink 114.
[0051] Metal component 112 is used to open the gas channel 120 when the hot interface fluid 116 overflows, and to solidify with the hot interface fluid 116 as liquid metal (details to follow). Normally, metal component 112 closes the gas channel 120 of the blocking component 110. When the hot interface fluid 116 undergoes a solidification reaction with metal component 112, the structure of metal component 112 is disrupted, causing it to open the gas channel 120, thus connecting the overflow area 118 to the external atmosphere. Metal component 112 can be a metal sheet (such as aluminum foil) or metal particles (such as aluminum powder).
[0052] The blocking member 110 is used to prevent the thermal interface fluid 116 from overflowing the overflow area 118 and to introduce external atmosphere into the overflow area 118. To distinguish the blocking members 110 located at different positions on the board surface 106, the blocking members 110 are divided into blocking member 110a and blocking member 110b in the figure. Blocking member 110a is located on the side of the overflow area 118 away from the chip 108 and surrounds the chip 108 to close the space between the board surface 106, the chip 108, and the heat sink 114 (this space is the overflow area 118). When the thermal interface fluid 116 overflows, blocking member 110a can block the thermal interface fluid 116 within the overflow area 118 to prevent the thermal interface fluid 116 from contacting other electronic components on the circuit board 102. Blocking member 110b is located between the chip 108 and blocking member 110a and has a venting channel 120. In response to the overflow of the thermal interface fluid 116, the blocking member 110b can open the air passage 120 to introduce external air into the overflow area 118. The blocking member 110 can be made of an elastic material such as rubber, foam, sponge, or silicone. The blocking member 110 can have a compressed state and a released state due to its own elasticity. When the heat sink 114 covers the chip 108, it can compress the blocking member 110, causing the blocking member 110 to fill the gap between the heat sink 114 and the board surface 106.
[0053] For example, the height of the blocking member 110a is substantially equal to that of the chip 108, while the height of the blocking member 110b is lower than that of the blocking member 110a. Here, the blocking member 110b can receive the thermal interface fluid 116 overflowing from the heating surface 109. It should be noted that the height of the blocking member 110a when not compressed exceeds the height of the chip 108. After the blocking member 110a is compressed by the heat sink 114, the height of the blocking member 110a can be aligned with the height of the chip 108 to ensure airtightness between the blocking member 110a and both the board surface 106 and the heat sink 114.
[0054] Metal component 112 is disposed on barrier component 110b to shield the air duct 120 of barrier component 110b, temporarily preventing external air from entering overflow area 118 through air duct 120. After metal component 112 undergoes a solidification reaction with thermal interface fluid 116, air duct 120 will be opened, allowing external air to enter overflow area 118 (details to follow). Air duct 120 may be formed on barrier component 110b by means of sintering, 3D printing, etching, or material bonding.
[0055] In some embodiments, such as Figure 2 As shown, before the heat sink 114 covers the chip 108, the metal component 112 can cover the blocking component 110b. A first contact surface 112a of the metal component 112 contacts the blocking component 110b to shield the air passage 120. A second contact surface 112b of the metal component 112 faces the overflow area 118. After the metal component 112 is installed, the heat sink 114 is then covered to the chip 108, forming a closed space in the overflow area 118. It should be noted that since the air passage 120 is connected to the external atmosphere, the first contact surface 112a may undergo an oxidation reaction upon contact with the external atmosphere (e.g., aluminum reacts with oxygen to form aluminum oxide). The second contact surface 112b is located within the overflow area 118; before the air passage 120 is open, the second contact surface 112b does not have sufficient oxygen for oxidation, thus maintaining the properties of the raw material.
[0056] Please see Figure 2 and Figure 3 , Figure 3 for Figure 1 A partial cross-sectional view along the AA direction shows the thermal interface fluid overflowing into the overflow area, and the air guide channel being opened. In some embodiments, such as Figure 2 and Figure 3 As shown, when the thermal interface fluid 116 overflows into the overflow area 118, it comes into contact with the second contact surface 112b of the metal component 112. The thermal interface fluid 116 can undergo a solidification reaction with the contacted metal component 112, causing the contacted portion of the metal component 112 to be eroded and thus opening the gas channel 120, allowing external air to enter the overflow area 118 through the gas channel 120. Next, the thermal interface fluid 116 can undergo a solidification reaction with the metal component 112 and the external air, transforming the thermal interface fluid 116 from a liquid into a solid solution or a solid compound (e.g., a gallium aluminum alloy (GaAl3)). This serves to retain the thermal interface fluid 116 within the overflow area 118 or prevent the thermal interface fluid 116 from permeating out of the barrier 110.
[0057] In some embodiments, when gallium (Ga) in the thermal interface fluid 116 undergoes an alloying reaction with aluminum (Al), gallium atoms diffuse into the aluminum lattice structure, forming new compounds through metallic bonds, such as, but not limited to, gallium-aluminum alloys (GaAl3). This process involves chemical reactions and rearrangement of atomic levels, generating a solid alloy with a specific stoichiometric ratio, as shown in the following reaction formula: Ga(l) + 3Al(s) → GaAl3(s). When liquid gallium comes into contact with aluminum powder, gallium rapidly penetrates and dissolves some of the aluminum, subsequently forming a solid alloy through an exothermic reaction. The resulting GaAl3 is an intermetallic compound, a form of alloy, with a fixed crystal structure and distinct physical properties (e.g., hardness and melting point), which are quite different from pure gallium or pure aluminum. Strictly speaking, this is a spontaneous alloying reaction, producing a gallium-aluminum alloy (GaAl3). Furthermore, the gallium-aluminum alloy (GaAl3) formed after the reaction can also act as an effective barrier, preventing further overflow of the thermal interface fluid 116.
[0058] In some embodiments, when the gas channel 120 is open, the first contact surface 112a can undergo an oxidation reaction with the external atmosphere, and the resulting alumina can effectively block the thermal interface fluid 116. This is because alumina (Al2O3) is a very stable compound with a high melting point (approximately 2072°C) and chemical inertness. Gallium or gallium-based liquid metals cannot undergo a significant chemical reaction with alumina at room temperature or under normal conditions, as alumina will not be reduced or decomposed by gallium. Therefore, it can still prevent the thermal interface fluid 116 from continuously corroding the metal or other electronic components.
[0059] In some embodiments, when outside air enters the overflow zone 118, the thermal interface fluid 116 can undergo an oxidation reaction with the outside air to form an oxide film (not shown) on the surface of the thermal interface fluid 116. This oxide film can coat the unoxidized thermal interface fluid 116, causing the thermal interface fluid 116 to stop or slow its flow in the overflow zone 118. Furthermore, because the thermal interface fluid 116 is coated with the oxide film, the thermal interface fluid 116 cannot permeate out of the barrier 110.
[0060] In some embodiments, the metal component 112 and the thermal interface fluid 116 may undergo oxidation reactions with atmospheric air, after which the thermal interface fluid 116 mixes with the oxides of the metal component 112 and the external atmosphere, increasing the viscosity of the thermal interface fluid 116. This allows the thermal interface fluid 116 to remain in the overflow area 118 or prevents the thermal interface fluid 116 from permeating out of the barrier 110.
[0061] Please see Figure 4 , Figure 4This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing the relative positions of the breathable element and the outer adhesive. In some embodiments, such as Figure 4 As shown, the blocking member 110 includes a venting member 122 and an outer colloid 124. The venting member 122 is connected to the board surface 106 and surrounds the chip 108, and a venting channel 120 is disposed in the venting member 122. The outer colloid 124 is connected to the venting member 122 and surrounds the chip 108. An overflow area 118 is formed between the outer colloid 124, the venting member 122, the chip 108, and the heat sink 114. A metal member 112 is disposed on the venting member 122 and seals the venting channel 120. In response to the overflow of the thermal interface fluid 116 into the overflow area 118 and the opening of the venting channel 120, the thermal interface fluid 116 and the metal member 112 undergo a curing reaction.
[0062] The breathable element 122 can be made of a material with multiple pores, such as hydrophobic polymer foams composed of polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyurethane (PU), or polystyrene (PS); or hydrophobic fiber-based structures composed of carbon fiber, aramid fiber, or glass fiber, and specially treated to form a microporous structure. In other embodiments, hydrophobic microporous membranes may also be coated on the surface of the breathable element 122. However, the main purpose of these arrangements is to allow gas molecules to pass through while repelling moisture to prevent liquid penetration. The outer colloid 124 can be an elastic material such as glue, silicone, polyurethane, aerogel, or epoxy resin.
[0063] Please see Figure 5A and Figure 5B , Figure 5A This is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the breathable element is a mesh. Figure 5B for Figure 5A A schematic diagram of the mesh structure. In some embodiments, such as... Figure 5A and Figure 5BAs shown, the ventilated component is a mesh 126 with multiple grids 128, and air channels 120 are disposed within these grids 128. Specifically, the connections between these grids 128 have gaps to allow external airflow; the gaps connecting the overflow area 118 and the outside of the mesh 126 are the air channels 120. Taking aluminum powder as an example, the aluminum powder can fill the gaps between the grids 128, temporarily preventing external air from entering the overflow area 118 through the air channels 120 (in this case, the gaps). The size of the grids 128 of the mesh 126 can be determined based on the airtightness between the metal component 112 and the air channels 120. For example, if the metal component 112 is aluminum powder, the grids 128 can be selected to correspond to the size of the aluminum powder. If the selected grid size is large, more aluminum powder needs to be filled into each grid 128. Conversely, if the selected mesh 128 is smaller, each mesh 128 can be filled with smaller aluminum powder. In some embodiments, the vent 122 can be a single mesh 126 or multiple overlapping meshes 126.
[0064] Please see Figure 6A , Figure 6B and Figure 6C . Figure 6A This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing the relative positions of the first and second grids of the mesh. Figure 6B for Figure 6A A schematic diagram of the first grid in the diagram. Figure 6C for Figure 6A A schematic diagram of the second grid. In some embodiments, such as Figure 6A , Figure 6B and Figure 6CAs shown, the grid 128 includes multiple first grids 128a and multiple second grids 128b. The first grids 128a are adjacent to the chip 108, and the second grids 128b are located between the first grids 128a and the outer colloid 124. Air channels 120 are disposed in the second grids 128b, and a metal component 112 is disposed in the second grids 128b. The size of the first grids 128a is larger than the size of the second grids 128b. Specifically, the first grids 128a do not have air channels 120, preventing external air from entering the overflow area 118 through the first grids 128a. The gap between the second grids 128b and the outside of the mesh 126 constitutes the air channel 120. When no overflow occurs, the metal component 112 can seal the air channel 120 of the second grids 128b. Since the size of the first grid 128a is larger than that of the second grid 128b, the metal component 112 can be made of metal particles or metal sheets to tightly seal the air passage 120. Furthermore, when the thermal interface fluid 116 overflows into the first grid 128a, the first grid 128a can absorb part or all of the thermal interface fluid 116 through capillary action. Thus, even when the overflow of the thermal interface fluid 116 exceeds the absorption capacity of the first grid 128a, the thermal interface fluid 116 can still undergo a solidification reaction with the metal component 112 and the external atmosphere when the air passage 120 is open in the second grid 128b.
[0065] Please see Figure 7 , Figure 7 This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing that the venting element consists of overlapping first and second meshes. In some embodiments, such as Figure 7 As shown, the ventilator 122 is a mesh 126. The mesh 126 includes a first mesh 126a and a second mesh 126b. The first mesh 126a has a plurality of first grids 128a, and the second mesh 126b has a plurality of second grids 128b. The first mesh 126a overlaps with the second mesh 126b, and the second mesh 126b is located between the first mesh 126a and the plate surface 106. The metal part 112 is disposed in these second grids 128b, and the air guiding channel 120 is disposed in these second grids 128b.
[0066] For example, if the metal component 112 is a metal sheet, the metal sheet can be sandwiched between the first mesh 126a and the second mesh 126b, so that the metal sheet seals the air passage 120. If the metal component 112 is metal particles, the metal particles can be applied to the first mesh 126a and filled into the air passage 120, so that the metal particles seal the air passage 120. The size of the first mesh 128a is larger than the size of the second mesh 128b. When the thermal interface fluid 116 overflows to the overflow area 118, the first mesh 128a can absorb the thermal interface fluid 116 through capillary action, thereby slowing down the flow rate of the thermal interface fluid 116 and guiding it to the second mesh 128b. Then, the thermal interface fluid 116 can open the air passage 120 of the second mesh 128b, so that the thermal interface fluid 116 undergoes a solidification reaction between the first mesh 126a and the second mesh 126b.
[0067] Please see Figure 8A and Figure 8B . Figure 8A This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing that the porous plate is a sintered metal powder body. Figure 8B This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing that the porous plate is a perforated plate. In some embodiments, the vent 122 is a porous plate. The porous plate has multiple holes, which can be single-direction through holes or multi-direction interconnected holes. Figure 8A In this embodiment, the porous plate is a sintered metal powder body 130a. The sintered metal powder body 130a is formed by sintering metal powder. After the metal powder is sintered into a ball, multiple interconnected holes 132a will be formed at the joints. The holes 132a that connect the overflow area 118 and the outside of the venting member 122 are the air guiding channels 120.
[0068] For example Figure 8B In this embodiment, the porous plate is a perforated plate 130b, which has a hole 132b. The plate surface 106 has a protrusion 134a and a recess 134b, the recess 134b extending to the side of the circuit board 102 to communicate with the external atmosphere. The perforated plate 130b is connected to the protrusion 134a, and the hole 132b communicates with the overflow area 118 and the external atmosphere. The hole 132b serves as a venting channel 120. When the metal part 112 covers the perforated plate 130b, the metal part 112 can shield the hole 132b to prevent external atmosphere from entering the overflow area 118. When the thermal interface fluid 116 erodes the metal part 112, the hole 132b can be opened to allow external atmosphere to flow into the overflow area 118.
[0069] Please see Figure 9 , Figure 9This is a partial cross-sectional view of an electronic device in some embodiments of the present invention, showing the relative positions of the inner and outer colloids. In some embodiments, such as Figure 9 As shown, the blocking component 110 also includes an inner colloid 136. The inner colloid 136 is connected to the board surface 106 and directly connected to the four rings around the chip 108. The overflow area 118 is located between the inner colloid 136 and the outer colloid 124. The material properties of the inner colloid 136 and the outer colloid 124 are similar; please refer to the description of the outer colloid 124. It should be noted that after the heat sink 114 compresses the inner colloid 136, the inner colloid 136 can fill the space around the chip 108 to form the first flow-blocking structure for the thermal interface fluid 116.
[0070] In some embodiments, such as Figure 2 , Figure 4 , Figure 5A , Figure 6A , Figure 7 , Figure 8A and Figure 8B As shown. The protective component 104 includes an insulating adhesive 138. The insulating adhesive 138 is disposed on the board surface 106. The insulating adhesive 138 can be applied to the board surface 106 to cover electronic components (e.g., capacitors) on the circuit board 102. The insulating adhesive 138 can be, for example, epoxy acrylate (EA), acrylate resin, or silicone.
[0071] Please see Figure 10A , Figure 10B , Figure 10C and Figure 10D . Figures 10A to 10D These are schematic diagrams (I) to (IV) showing the appearance of the external colloid in some embodiments of the present invention. Figure 10A , Figure 10B As shown, in some embodiments, the outer colloid 124 has a first connecting surface 124a and a second connecting surface 124b. The first connecting surface 124a is connected to the plate surface 106, and the heat sink 114 is pressed against the second connecting surface 124b. The second connecting surface 124b is formed as a polygon (e.g., ...). Figure 10A The second connecting surface 124b is serrated. Figure 10B The second connecting surface 124b is wavy. When the heat sink 114 is pressed against the second connecting surface 124b, the shape of the second connecting surface 124b can evenly distribute the pressure applied by the heat sink 114, allowing the outer adhesive 124 to adhere tightly to the plate surface 106 and the heat sink 114. In some embodiments, such as Figure 10C and Figure 10DAs shown, the outer colloid 124 also has a hollow portion 124c. When the heat sink 114 is pressed against the second connecting surface 124b, the hollow portion 124c will be deformed by compression and distribute the pressure, so that the heat sink 114 can be compressed to a uniform height.
[0072] In summary, in some embodiments, the electronic device 100 confines the thermal interface fluid 116 within the overflow area 118. When the thermal interface fluid 116 overflows, it can open the venting channel 120, allowing external air to enter the overflow area 118. Subsequently, the thermal interface fluid 116, the external air, and the metal component 112 can undergo a curing reaction to solidify within the overflow area 118. This ensures that the thermal interface fluid 116 is retained within the overflow area 118.
[0073] The embodiments described above are merely illustrative of the technical ideas and features of this case. Their purpose is to enable those skilled in the art to understand the content of this case and implement it accordingly. They should not be used to limit the scope of the patent in this case. That is, all equivalent changes or modifications made to the technical solutions disclosed in this invention should still be covered within the patent protection scope of this invention.
Claims
1. An electronic device, characterized in that, include: A circuit board having a board surface on which a chip is disposed; A protective component, comprising: A blocking element, connected to the surface of the board and surrounding the chip, forming an overflow area between the blocking element and the chip, the blocking element having a venting channel connecting the overflow area to the external atmosphere; and A metal component is disposed in the overflow area; A heat sink covers the chip and the blocking component; and A thermal interface fluid is located between the heat sink and the chip; In this process, in response to the overflow of the thermal interface fluid into the overflow area and its solidification reaction with the metal component, the thermal interface fluid is solidified in the overflow area.
2. The electronic device as claimed in claim 1, characterized in that, The blocking element includes: A ventilated element is connected to the surface of the board and surrounds the chip, and the air guide channel is disposed in the ventilated element; and An outer colloid is connected to the vent and surrounds the chip, and the overflow area is formed between the outer colloid, the vent, the chip and the heat sink; The metal component is disposed on the ventilated component and seals the air passage; in response to the overflow of the thermal interface fluid into the overflow area and opening the air passage, the thermal interface fluid and the metal component undergo a solidification reaction.
3. The electronic device as claimed in claim 2, characterized in that, The breathable component is a mesh body with multiple grids, and the air guide channel is disposed in these grids.
4. The electronic device as claimed in claim 2, characterized in that, The venting component is a porous plate.
5. The electronic device as claimed in claim 4, characterized in that, The porous plate is a sintered metal powder body.
6. The electronic device as claimed in claim 2, characterized in that, The blocking component also includes an inner colloid, which is attached to the surface of the board and directly connected to the four rings around the chip. The overflow area is located between the inner colloid and the outer colloid.
7. The electronic device as claimed in claim 1, characterized in that, The protective component also includes an insulating adhesive disposed on the surface of the plate.
8. A protective component adapted to form an overflow region between a chip and a heat sink, wherein a thermal interface fluid is solidified in the overflow region, characterized in that, The protective component includes: A blocking element surrounds the chip and forms the overflow area between the blocking element and the chip. The blocking element has a venting channel connecting the overflow area to the external atmosphere. A metal component is disposed in the overflow area; In this process, in response to the overflow of the thermal interface fluid into the overflow area and its solidification reaction with the metal component, the thermal interface fluid is solidified in the overflow area.
9. The protective component as claimed in claim 8, characterized in that, The blocking element includes: A ventilated element surrounds the chip, and a venting channel is disposed within the ventilated element; and An outer colloid is connected to the vent and surrounds the chip, and the overflow area is formed between the outer colloid, the vent, the chip and the heat sink; The metal component is disposed on the ventilated component and seals the air passage; in response to the overflow of the thermal interface fluid into the overflow area and opening the air passage, the thermal interface fluid and the metal component undergo a solidification reaction.
10. The protective component as claimed in claim 9, characterized in that, The breathable component is a mesh body with multiple grids, and the air guide channel is disposed in these grids.
11. The protective component as claimed in claim 9, characterized in that, The venting component is a porous plate.
12. The protective component as claimed in claim 11, characterized in that, The porous plate is a sintered metal powder body.
13. The protective component as claimed in claim 9, characterized in that, The blocking component also includes an inner colloid that is directly connected to the four rings around the chip, and the overflow area is located between the inner colloid and the outer colloid.