Method, device and equipment for batch drawing micro-holes of semiconductor gas distribution plate drawing paper

Abstract

The application discloses a micro-hole batch drawing method, device and equipment for semiconductor gas distribution plate drawing paper, and relates to the field of computer-aided design. The method comprises the following steps: obtaining drawing center coordinates corresponding to the semiconductor gas distribution plate drawing paper and a to-be-drawn micro-hole parameter table; performing validity verification on each to-be-drawn micro-hole parameter row in the to-be-drawn micro-hole parameter table to obtain valid to-be-drawn micro-hole parameter rows; for any valid to-be-drawn micro-hole parameter row, determining a corresponding drawing mode according to the pitch circle diameter in the valid to-be-drawn micro-hole parameter row, and generating a corresponding micro-hole pattern based on the valid to-be-drawn micro-hole parameter row and the drawing center coordinates according to the drawing mode. The technical scheme of the application improves the automatic drawing efficiency and drawing result reliability of the semiconductor gas distribution plate design drawing paper.

Description

Technical Field

[0001] This application relates to the field of computer-aided design, specifically to a method, apparatus, and device for batch drawing of micro-holes in semiconductor gas distribution disk drawings. Background Technology

[0002] The micro-holes in a semiconductor gas distribution disk are typically arranged in a multi-ring concentric array. The design and fabrication precision directly affect the uniformity of gas distribution and device performance. Therefore, it is necessary to accurately model and draw the micro-hole array during the design phase.

[0003] Existing technologies typically employ the following approach: During the design phase, engineers determine the pitch circle diameter, aperture, number of apertures, and starting angle of each micro-orifice ring based on gas flow simulation results, and generate an aperture table. During the drawing phase, based on this aperture table, micro-orifices are drawn ring by ring in computer-aided design software. After manually reading the parameters for each ring, the corresponding micro-orifice array is generated using the circular array command with the center of the distribution disk as the array center point, the number of apertures as the total number of items, and 360 degrees as the fill angle. This process is repeated until all micro-orifices are constructed. This method relies on the circular array command in the computer-aided design software to generate micro-orifices ring by ring, and is a commonly used drawing method in the industry. However, because it requires manual parameter reading, object selection, and array settings for each ring, the number of repetitive operations is high, resulting in low drawing efficiency. Furthermore, manually inputting parameters such as the number of apertures and the starting angle is prone to input errors as the number of rings increases, affecting the positional accuracy and consistency of the micro-orifice array.

[0004] Therefore, existing technologies suffer from low automation in micro-hole array fabrication and insufficient reliability of fabrication results. Summary of the Invention

[0005] This application provides a method, apparatus, and equipment for batch drawing of micro-holes in semiconductor gas distribution disk drawings, which improves the efficiency of automated drawing of semiconductor gas distribution disk design drawings and the reliability of drawing results.

[0006] According to one aspect of this application, a method for batch drawing of micro-holes in a semiconductor gas distribution disk pattern is provided, comprising: Obtain the center coordinates of the semiconductor gas distribution disk drawing and the parameter table of the micropores to be drawn; The validity of each row of micro-pore parameters in the table of micro-pore parameters to be drawn is verified to obtain the valid rows of micro-pore parameters to be drawn. For any of the valid micropore parameter rows to be drawn, the corresponding drawing method is determined according to the pitch circle diameter in the valid micropore parameter row to be drawn, and the corresponding micropore pattern is generated according to the drawing method based on the valid micropore parameter row to be drawn and the drawing center coordinates.

[0007] According to another aspect of this application, a micro-hole batch drawing apparatus for semiconductor gas distribution disk patterns is provided, comprising: The drawing parameter acquisition module is used to obtain the drawing center coordinates and the parameter table of the micropores to be drawn corresponding to the semiconductor gas distribution disk drawing; The parameter row validity verification module is used to verify the validity of each micro-hole parameter row in the micro-hole parameter table to be drawn, and to obtain a valid micro-hole parameter row to be drawn. The micropore pattern drawing module is used to determine the corresponding drawing method based on the pitch circle diameter in any of the valid micropore parameter rows to be drawn, and to generate the corresponding micropore pattern based on the valid micropore parameter rows to be drawn and the drawing center coordinates according to the drawing method.

[0008] According to another aspect of this application, an electronic device is provided, the electronic device comprising: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the method for batch drawing of micro-holes in a semiconductor gas distribution disk as described in any embodiment of this application.

[0009] According to another aspect of this application, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the method for batch drawing of micro-holes in a semiconductor gas distribution disk pattern according to any embodiment of this application.

[0010] According to another aspect of this application, a computer program product is provided, comprising a computer program that, when executed by a processor, implements a method for batch drawing micro-holes of any semiconductor gas distribution disk pattern provided in the embodiments of this application.

[0011] The technical solution of this application embodiment establishes the basic input data for micro-hole array drawing by acquiring the center coordinates of the drawing center and the parameter table of the micro-holes to be drawn. It then verifies the validity of each row of micro-hole parameters in the parameter table to filter out valid rows that meet the drawing constraints. For valid rows, it determines the corresponding drawing method based on the pitch circle diameter and generates the corresponding micro-hole graphics according to the drawing method, thereby realizing an automated drawing process for micro-hole arrays. This method transforms the micro-hole array drawing process from the traditional manual, ring-by-ring operation to an automated generation method driven by the parameter table, reducing manual step-by-step settings and repetitive operations, and improving the efficiency of micro-hole array drawing. Simultaneously, by verifying the validity of the parameter rows, it avoids parameters that do not meet the drawing constraints from participating in graphic generation, improving the accuracy and consistency of the drawing results. Furthermore, by adaptively matching the drawing method based on the pitch circle diameter, it enables micro-hole arrays of different scales to be constructed using corresponding generation rules, thereby improving the adaptability and reliability of the overall drawing process.

[0012] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0013] Figure 1 This is a flowchart of a method for batch drawing micropores in a semiconductor gas distribution disk pattern according to Embodiment 1 of this application; Figure 2 This is a flowchart of a method for batch drawing micropores in a semiconductor gas distribution disk according to Embodiment 2 of this application; Figure 3 This is a schematic diagram of a micro-hole batch drawing device for a semiconductor gas distribution disk according to Embodiment 3 of this application; Figure 4 This is a schematic diagram of the structure of an electronic device that implements the method for batch drawing micro-holes in semiconductor gas distribution disk patterns according to embodiments of this application. Detailed Implementation

[0014] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0015] It should be noted that the terms "first," "second," etc., used in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0016] Example 1 Figure 1 This is a flowchart illustrating a method for batch drawing micro-holes in semiconductor gas distribution disk drawings according to Embodiment 1 of this application. This embodiment is applicable to the design stage of semiconductor gas distribution disks before industrial production, automating the generation and drawing of micro-hole structures in the design drawings. This method can be executed by a batch drawing device for micro-holes in semiconductor gas distribution disk drawings. This device can be implemented in hardware and / or software and can be configured in a computer device. Figure 1 As shown, the method includes: S101. Obtain the center coordinates of the semiconductor gas distribution disk drawing and the parameter table of the micropores to be drawn.

[0017] It should be noted that the semiconductor gas distribution disk drawing involved in this application specifically refers to the drawing of a two-dimensional design drawing of the micro-hole array set on the upper surface of the semiconductor gas distribution disk in a top-down direction. In this embodiment, the drawing center coordinates are used to determine the coordinates of the common center of the circle around which all the annular micro-hole arrays are surrounded. The micro-hole parameter table to be drawn is used to record the drawing parameters of each ring of annular micro-hole array, with each row of data corresponding to one ring of micro-hole array. For example, the parameters in the micro-hole parameter table to be drawn include, but are not limited to, the ring number, the pitch circle diameter, the number of holes, the starting angle, and the micro-hole diameter. Among them, the ring number, the pitch circle diameter, the number of holes, and the starting angle are used to characterize the annular distribution information of the micro-hole array, and the micro-hole diameter is used to characterize the micro-hole size information. The drawing center coordinates and the micro-hole parameter table to be drawn can be pre-configured by the designer before drawing.

[0018] Specifically, the drawing center coordinates corresponding to the semiconductor gas distribution disk drawing are obtained to establish a unified geometric benchmark for all annular microvia arrays, ensuring that each ring of microvias is spatially positioned with the same common center as a reference. Simultaneously, a parameter table of the microvias to be drawn is obtained for structured storage of the drawing parameters for each ring of the microvia array. This method enables unified, structured management and retrieval of the drawing parameters for each ring of the microvia array, avoiding inconsistencies caused by manual ring-by-ring reading and scattered input. This improves the standardization and data consistency of the microvia array drawing process and provides a standardized input basis for subsequent automated batch drawing.

[0019] S102. Perform validity verification on each row of micropore parameters to be drawn in the table of micropore parameters to be drawn, and obtain valid rows of micropore parameters to be drawn.

[0020] In this embodiment, the row of micro-hole parameters to be drawn refers to a data record in the table of micro-hole parameters to be drawn, which is used to characterize the set of drawing parameters for a micro-hole array to be drawn. A valid row of micro-hole parameters to be drawn refers to a row of micro-hole parameters to be drawn that meets the drawing constraints of the micro-hole array after a preset validity check. The constraints include at least geometric drawing rules and physical constraints, which are used to ensure that the corresponding micro-hole array can be generated normally in the computer-aided design software.

[0021] It is important to note that since the parameters in the micropore parameter table to be drawn can be derived from user presets or external input, there may be parameter data that does not conform to geometric drawing rules or physical constraints during the input process. For example, if the micropore diameter is less than or equal to zero, an effective geometric structure cannot be formed, resulting in the inability to generate the micropore pattern correctly. Therefore, it is necessary to validate the validity of each parameter row to remove invalid data rows that do not meet the drawing conditions. For example, geometric drawing rules are used to constrain the geometric construction legality of the micropore array in the computer-aided design process, including but not limited to constraints such as micropore diameter being greater than zero, angular constraints such as uniform distribution of micropores in the same ring, spatial constraints such as no geometric conflict between the pitch circle diameter and the array space, and angular validity constraints such as the starting angle being within the range of 0 degrees to 360 degrees. Physical constraints are used to constrain the rationality of the micropore array at the engineering design and manufacturing implementation level, including but not limited to process constraints such as micropore diameter meeting the processing capability range, manufacturing constraints such as hole spacing meeting the minimum processing clearance requirement, and functional constraints such as array density meeting the gas flow design requirements.

[0022] Specifically, each row of micro-hole parameters in the micro-hole parameter table to be drawn is read sequentially, and each row undergoes validity verification to determine whether the data in that row meets the validity requirements. If any row of micro-hole parameters meets the preset validity verification conditions, it is determined as a valid row of micro-hole parameters to be drawn; otherwise, it is discarded. This method achieves preprocessing and filtering of the micro-hole parameter table to be drawn, ensuring that the data entering the subsequent drawing process are all valid parameters that meet geometric rules and engineering constraints. This reduces invalid drawing calculations, improves overall drawing efficiency, and reduces the problem of drawing failures or unusable drawing results due to abnormal parameters, thereby improving the accuracy and reliability of the generated micro-hole array.

[0023] S103. For any of the valid micropore parameter rows to be drawn, determine the corresponding drawing method according to the pitch circle diameter in the valid micropore parameter row to be drawn, and generate the corresponding micropore pattern according to the drawing method based on the valid micropore parameter row to be drawn and the drawing center coordinates.

[0024] In this embodiment, the pitch circle diameter is used to characterize the geometric scale of the annular reference circle containing the micropore array to be drawn, in order to determine the spatial distribution radius of each micropore relative to the drawing center coordinates. The annular reference circle is the geometric circle corresponding to the trajectory of the center of each micropore in the micropore array to be drawn. The drawing method is used to characterize the generation rules of the micropore array under different pitch circle diameters, so that the micropore pattern is drawn according to the corresponding generation rules.

[0025] For example, since the nodal circle diameter is used to characterize the annular distribution of the micropore array, when the nodal circle diameter is 0, the corresponding micropore array is located at the center of the drawing and does not form an annular distribution structure, but rather a central circular micropore layout; when the nodal circle diameter is greater than 0, the corresponding micropore array forms an annular distribution structure with the drawing center coordinates as the center, at the position corresponding to the preset nodal circle diameter. Based on this structural difference in the nodal circle diameter, the micropore array is divided into a central circular micropore array and an annular micropore array, and generated using corresponding drawing methods respectively.

[0026] Specifically, for any valid row of micropore parameters to be drawn, the nodal circle diameter parameter is obtained, and the drawing rules for the current micropore array to be generated are matched based on the nodal circle diameter to determine the corresponding drawing method. Combining the drawing center coordinates and the parameters in the valid row of micropore parameters, the corresponding annular micropore array pattern is generated under the determined drawing method. In this way, the generation process of micropore array can automatically match and switch drawing rules based on the nodal circle diameter, improving the automation and drawing efficiency of the generation process of micropore arrays of different scales, while reducing the operational complexity and error probability caused by manual judgment of the drawing method.

[0027] The technical solution of this application embodiment establishes the basic input data for micro-hole array drawing by acquiring the center coordinates of the drawing and the parameter table of the micro-holes to be drawn. It then verifies the validity of each row of micro-hole parameters in the parameter table to filter out valid rows that meet the drawing constraints. For each valid row, the corresponding drawing method is determined based on the pitch circle diameter, and the corresponding micro-hole graphic is generated according to the drawing method, thereby realizing an automated drawing process for the micro-hole array. This method transforms the micro-hole array drawing process from the traditional manual, ring-by-ring operation to an automated generation method driven by the parameter table, reducing manual step-by-step settings and repetitive operations, and improving the efficiency of micro-hole array drawing. Simultaneously, by verifying the validity of the parameter rows, it avoids parameters that do not meet the drawing constraints from participating in graphic generation, improving the accuracy and consistency of the drawing results. Furthermore, by adaptively matching the drawing method based on the pitch circle diameter, micro-hole arrays of different scales can be constructed using corresponding generation rules, thereby improving the adaptability and reliability of the overall drawing process.

[0028] Example 2 Figure 2 This is a flowchart of a method for batch drawing micro-holes in a semiconductor gas distribution disk pattern according to Embodiment 2 of this application. The technical solution of this embodiment further refines the method of drawing micro-hole patterns based on any of the foregoing embodiments. For example... Figure 2 As shown, the method includes: S201. Obtain the center coordinates of the semiconductor gas distribution disk drawing and the parameter table of the micropores to be drawn.

[0029] S202. Perform validity verification on each row of micropore parameters to be drawn in the table of micropore parameters to be drawn, and obtain valid rows of micropore parameters to be drawn.

[0030] The micro-pore parameters to be drawn in the effective micro-pore parameter row include the pitch circle diameter, number of pores, starting angle, and micro-pore diameter.

[0031] S203. For any of the valid micropore parameter rows to be drawn, if the pitch circle diameter is zero, then the corresponding micropore pattern is generated with the drawing center coordinates as the center and the micropore diameter as the diameter.

[0032] S204. If the pitch circle diameter is greater than zero, then based on the pitch circle diameter, the number of holes, the starting angle, and the drawing center coordinates, determine the micro-hole center coordinates of each micro-hole to be drawn corresponding to the effective micro-hole parameter row, and generate the corresponding micro-hole pattern with the micro-hole center coordinates as the center and the micro-hole diameter as the diameter.

[0033] In this embodiment, the micro-orifice parameters to be drawn in the effective micro-orifice parameter row include the pitch circle diameter, number of holes, starting angle, and micro-orifice diameter. The number of holes characterizes the number of micro-orifices to be drawn in the corresponding annular micro-orifice array; the starting angle characterizes the angular position of the first micro-orifice to be drawn relative to the reference coordinate system.

[0034] Specifically, when generating micropore patterns, the drawing method of the current micropore is determined based on the pitch circle diameter in the row of valid micropore parameters. When the pitch circle diameter is zero, it indicates that the micropore to be drawn does not participate in the ring array distribution and only corresponds to a single-point micropore structure at the drawing center position. In this case, the micropore does not need to be processed for angular distribution or circumferential arrangement; a single micropore pattern can be generated directly at the drawing center position. That is, the micropore pattern is generated with the drawing center coordinates as the center and the micropore diameter as the diameter. When the pitch circle diameter is greater than zero, it indicates that the micropore to be drawn belongs to the ring array structure. A circumferential distribution structure needs to be formed around the drawing center based on the pitch circle diameter. At this time, the pitch circle diameter, number of holes, starting angle, and drawing center coordinates are combined to determine the micropore center coordinates on the circumference of each micropore to be drawn. The micropore center coordinates corresponding to each micropore to be drawn are used as the center and the micropore diameter is used as the diameter, thus forming a ring-shaped arrangement of micropore patterns. This method enables the differentiation between central micropores and annular micropores based on different pitch circle diameters, thereby ensuring the correct construction of micropore patterns with different distributions, avoiding structural mismatch problems caused by a uniform drawing method, and improving the accuracy and consistency of micropore pattern generation.

[0035] This embodiment further refines the method for drawing micro-hole patterns. It differentiates the drawing method based on whether the pitch circle diameter is zero or greater than zero. When the pitch circle diameter is zero, the corresponding micro-hole pattern is directly generated based on the drawing center coordinates and the micro-hole diameter. When the pitch circle diameter is greater than zero, the center coordinates of each micro-hole corresponding to the valid micro-hole parameter row are determined based on the pitch circle diameter, number of holes, starting angle, and drawing center coordinates. The corresponding micro-hole pattern is then generated using the micro-hole center coordinates as the center and the micro-hole diameter as the diameter. This method automatically switches the drawing method for the corresponding micro-hole based on the pitch circle diameter, avoiding the problem of incorrectly drawing the central micro-hole when all micro-holes are processed using a uniform ring array method. This improves the reliability of batch drawing of micro-holes in semiconductor gas distribution disk patterns.

[0036] In one optional embodiment, determining the center coordinates of each micro-hole corresponding to the effective row of micro-hole parameters to be drawn, based on the pitch circle diameter, the number of holes, the starting angle, and the drawing center coordinates, includes: determining the annular radius corresponding to each micro-hole to be drawn based on the pitch circle diameter; determining the angle increment between adjacent micro-holes in each micro-hole to be drawn based on the number of holes; determining the target angle corresponding to each micro-hole to be drawn based on the starting angle and the angle increment; and determining the center coordinates of each micro-hole to be drawn based on the target angle, the annular radius, and the drawing center coordinates.

[0037] In this embodiment, the annular radius is used to characterize the distance of the annular distribution trajectory of the micropores relative to the drawing center. The angle increment is used to characterize the angular interval between adjacent micropores in the annular distribution. For example, when the number of pores is 4, the angle increment is 90 degrees, and the micropores are distributed sequentially at 90-degree intervals on the circumference; when the number of pores is 6, the angle increment is 60 degrees, and the micropores are distributed sequentially at 60-degree intervals on the circumference. The target angle is used to characterize the specific angular position of each micropore in the annular distribution. For example, when the initial angle is 0 degrees and the number of pores is 4, the target angles corresponding to each micropore are 0 degrees, 90 degrees, 180 degrees, and 270 degrees respectively, thereby determining the specific distribution direction of each micropore on the circumference.

[0038] For example, for the pitch circle diameter For any valid row of parameters to be drawn, the center coordinates of the drawing are... The number of holes is Starting angle (Unit: degrees), the calculation method for the center coordinates of each micro-hole to be drawn is as follows: based on the pitch circle diameter. The annular radius corresponding to each micropore to be drawn is determined as follows: Based on the number of pores, determine the angular increment between adjacent pores in each micropore to be drawn. Based on the initial angle and angle increment, determine the first... The target angle corresponding to each micropore to be drawn is: ( ); convert the target angle from degrees to radians. , so the first The x and y coordinates of the center of each micropore are respectively , .in, and These are the cosine and sine functions, respectively. Using the micropore diameter divided by 2 as the radius, the corresponding micropore pattern is generated.

[0039] Specifically, based on the pitch circle diameter, the annular radius corresponding to each micro-hole to be drawn is determined, thus defining the radial position of the micro-hole around the drawing center. Based on the number of holes, the angular increment between adjacent micro-holes is determined, thus defining the uniform distribution interval of the micro-holes in the circumferential direction. The target angle corresponding to each micro-hole to be drawn is calculated sequentially based on the initial angle and the angular increment, thus determining the specific angular position of each micro-hole in the annular distribution. Combining the target angle, annular radius, and drawing center coordinates, the micro-hole center coordinates of each micro-hole to be drawn are calculated, and the corresponding micro-hole pattern is generated based on these center coordinates. This method automatically determines the spatial position of the micro-holes through parameter calculation, reducing the operational complexity of calling the annular array command circle by circle in traditional methods and improving execution efficiency. A unified angular increment calculation method achieves a uniform distribution of annular micro-holes. The radius determination method based on the pitch circle diameter allows different micro-hole arrays to be generated according to unified calculation rules, thereby improving the consistency of micro-hole pattern drawing.

[0040] In one optional implementation, the step of validating each row of micro-hole parameters in the table of micro-hole parameters to be drawn to obtain valid rows of micro-hole parameters to be drawn includes: for any row of micro-hole parameters to be drawn, determining the row of micro-hole parameters to be drawn that meets the preset verification rules as a valid row of micro-hole parameters to be drawn; wherein, the preset verification rules include that the pitch circle diameter of the micro-hole parameters to be drawn is greater than or equal to zero, the aperture of the micro-hole parameters to be drawn is greater than zero, the number of apertures of the micro-hole parameters to be drawn is greater than zero, and if the pitch circle diameter of the micro-hole parameters to be drawn is equal to zero, then the number of apertures of the micro-hole parameters to be drawn is equal to 1.

[0041] For example, when validating the micro-orifice parameter row to be drawn, the following situations may exist: When a specific micro-orifice parameter row to be drawn has a pitch circle diameter of 20, an aperture diameter of 0.5, and 8 apertures, since the pitch circle diameter is greater than 0, the aperture diameter is greater than 0, and the number of apertures is greater than 0, and the constraint condition that the number of apertures must be equal to 1 when the pitch circle diameter is equal to 0 is met, the micro-orifice parameter row to be drawn meets the preset validation rules and is determined to be a valid micro-orifice parameter row to be drawn; When a specific micro-orifice parameter row to be drawn has a pitch circle diameter of 0, an aperture diameter of 0.5, and 1 aperture, since the pitch circle diameter is equal to 0, the number of apertures is equal to 1, and the aperture diameter is greater than 0, it also meets the preset validation rules and is determined to be a valid micro-orifice parameter row to be drawn; When a specific micro-orifice parameter row to be drawn has a pitch circle diameter of 0, an aperture diameter of 0.5, and 6 apertures, since the number of apertures is not equal to 1 when the pitch circle diameter is equal to 0, the preset validation rules are not met, and therefore the micro-orifice parameter row to be drawn is determined to be an invalid micro-orifice parameter row to be drawn.

[0042] Specifically, for any row of micro-hole parameters to be drawn, the parameter values ​​in the row are validated according to preset validation rules. Rows that pass the validation are determined as valid rows. Specific preset validation rules include, but are not limited to, rules that the pitch circle diameter of the micro-hole parameters to be drawn is greater than or equal to zero, the aperture diameter is greater than zero, the number of apertures is greater than zero, and if the pitch circle diameter is zero, the number of apertures is 1. By setting these preset validation rules, parameters such as pitch circle diameter, aperture diameter, and number of apertures can be effectively constrained before the micro-hole pattern is generated. This avoids situations such as non-positive aperture values, unreasonable aperture numbers, and the mixing of central micro-hole structures and ring array structures, which do not conform to the drawing logic. This ensures the consistency between the micro-hole parameters and their corresponding spatial structures, reduces micro-hole pattern anomalies caused by incorrect parameters, and improves the accuracy and reliability of micro-hole pattern generation.

[0043] In one optional implementation, before obtaining the micropore parameter table to be drawn, the method further includes: obtaining an initial micropore parameter table input by the user; determining the mapping relationship between each preset field name and each initial field by matching each preset field name with the initial field name in the initial micropore parameter table; and extracting the parameter information corresponding to each preset field name from the initial micropore parameter table based on the mapping relationship to generate the micropore parameter table to be drawn.

[0044] In this embodiment, the initial microwell parameter table refers to the original data set used to describe the parameters for microwell drawing, either input by the user or provided by an external system. Its field names may not be standardized. The initial field name refers to the original field identifier corresponding to each data column in the initial microwell parameter table. The preset field name refers to the predefined standard field identifier in the microwell parameter table to be drawn, used to characterize the parameter types necessary for the microwell drawing process.

[0045] For example, the initial field names in the user-input initial micro-orifice parameter table may include "circular distribution radius parameter value", "micro-orifice quantity statistics", "starting angle setting value (unit: degrees)", and "micro-orifice diameter size parameter", etc. These initial field names may come from different design software, simulation systems, or historical data files, and the field naming methods are not uniform. The preset field names, on the other hand, are a standardized set of fields, such as "pitch circle diameter", "number of holes", "starting angle", and "micro-orifice diameter", used to uniformly represent the necessary parameters required for micro-orifice drawing. During data processing, a mapping relationship is established by matching the initial field names with the preset field names. For example, "circular distribution radius parameter value" is mapped to "pitch circle diameter", "micro-orifice quantity statistics" is mapped to "number of holes", "starting angle setting value (unit: degrees)" is mapped to "starting angle", and "micro-orifice diameter size parameter" is mapped to "micro-orifice diameter", thereby converting the initial micro-orifice parameter table into a standardized micro-orifice parameter table to be drawn.

[0046] Specifically, by matching the field names of the initial micropore parameter table input by the user, a mapping relationship is established between the initial field names and preset field names, thereby achieving unified parsing and conversion of data formats from different sources. After completing the field matching, based on the established mapping relationship, the parameter information corresponding to the preset field names is extracted from the initial micropore parameter table, and the table to be drawn is reorganized according to the preset field structure. In this way, it is possible to adapt to initial parameter table inputs from different sources or in different formats, and to automatically identify and standardize data with inconsistent parameter column names or inconsistent arrangement orders, thereby ensuring the consistency of parameters required in the subsequent micropore drawing process.

[0047] In one optional implementation, after generating the corresponding micropore pattern according to the drawing method, the method further includes: counting the generated micropore patterns and compiling them into a pattern set, and determining the overall pattern range of the pattern set; adjusting the graphic display view of the computer-aided design software according to the overall graphic range to fully display the micropore patterns in the pattern set.

[0048] In this embodiment, the graphic set refers to the collection of all generated micropore graphics, used to uniformly represent the drawing results of the currently completed micropores. The overall graphic range refers to the maximum outer bound of all micropore graphics in the graphic set within the drawing coordinate system, used to characterize the overall spatial distribution boundary of the micropore graphics. The graphic display view refers to the visualization window in the computer-aided design software used to display the current graphic content and its display range parameters.

[0049] Specifically, after generating the micropore patterns, the generated patterns are aggregated to form a pattern set. The overall pattern range is determined based on the spatial position of each micropore pattern, thus obtaining the outer enclosing area of ​​all micropore patterns. According to the determined overall pattern range, the graphic display view of the computer-aided design software is adjusted so that the display area covers all micropore patterns, thereby achieving a complete visual display of the pattern set. This method automatically determines the overall spatial range after batch generation of micropore patterns and adjusts the display view based on this range, improving the ease of viewing the micropore pattern drawing results.

[0050] Optionally, the method proposed in this application is not only applicable to the generation of micro-hole patterns for circular arrays, but can also be extended to the drawing of patterns for rectangular arrays or other regular arrays. In the drawing of patterns for rectangular arrays or other regular arrays, only the calculation method of the micro-hole center coordinates needs to be adjusted accordingly. For example, the calculation method can be changed from polar coordinates based on angles and radii to rectangular coordinates based on row and column spacing. This allows for the generation of micro-hole patterns under different array forms without changing the overall parameter acquisition, effective verification, and micro-hole pattern generation process.

[0051] Example 3 Figure 3 This is a schematic diagram of a micro-orifice batch drawing device for semiconductor gas distribution disk drawings according to Embodiment 3 of this application. This embodiment is applicable to the design stage of semiconductor gas distribution disks before industrial production, for the automated generation and drawing of micro-orifice structures in the design drawings. This micro-orifice batch drawing device for semiconductor gas distribution disk drawings can be implemented in hardware and / or software, and can be configured in a computer device. Figure 3 As shown, the micro-hole batch drawing device 300 for semiconductor gas distribution disk patterns includes: The drawing parameter acquisition module 310 is used to acquire the drawing center coordinates and the parameter table of the micro-hole to be drawn corresponding to the semiconductor gas distribution disk drawing; The parameter row validity verification module 320 is used to verify the validity of each micro-hole parameter row in the micro-hole parameter table to be drawn, and to obtain a valid micro-hole parameter row to be drawn. The micropore pattern drawing module 330 is used to determine the corresponding drawing method based on the pitch circle diameter in any of the valid micropore parameter rows to be drawn, and to generate the corresponding micropore pattern based on the valid micropore parameter rows to be drawn and the drawing center coordinates according to the drawing method.

[0052] In one optional embodiment, the micropore pattern drawing module 330 is specifically used for: The micro-hole parameters to be drawn in the effective micro-hole parameter row include the pitch circle diameter, number of holes, starting angle, and micro-hole diameter; If the diameter of the nodal circle is zero, then the corresponding micropore pattern is generated with the drawing center coordinates as the center and the micropore diameter as the diameter; If the pitch circle diameter is greater than zero, then based on the pitch circle diameter, the number of holes, the starting angle, and the drawing center coordinates, the micro-hole center coordinates corresponding to each micro-hole to be drawn in the effective micro-hole parameter row are determined, and the corresponding micro-hole pattern is generated with the micro-hole center coordinates as the center and the micro-hole diameter as the diameter.

[0053] In one optional embodiment, the micropore pattern drawing module 330 is specifically used for: Based on the pitch circle diameter, determine the annular radius corresponding to each micro-hole to be drawn; Based on the number of holes, determine the angle increment between adjacent micro-holes in each micro-hole to be drawn; Based on the starting angle and angle increment, determine the target angle corresponding to each micropore to be drawn; The center coordinates of each micro-hole to be drawn are determined based on the target angle, the annular radius, and the drawing center coordinates.

[0054] In one optional implementation, the parameter row validity verification module 320 is specifically used for: For any of the micro-hole parameter rows to be drawn, the micro-hole parameter rows that meet the preset verification rules are determined as valid micro-hole parameter rows to be drawn; wherein, the preset verification rules include the pitch circle diameter of the micro-hole parameters to be drawn being greater than or equal to zero, the aperture of the micro-hole parameters to be drawn being greater than zero, the number of apertures of the micro-hole parameters to be drawn being greater than zero, and if the pitch circle diameter of the micro-hole parameters to be drawn is equal to zero, then the number of apertures of the micro-hole parameters to be drawn is equal to 1.

[0055] In one optional embodiment, the micro-orifice batch drawing device 300 for the semiconductor gas distribution disk pattern further includes a micro-orifice parameter table generation module, which is specifically used for: Obtain the initial micropore parameter table input by the user; The mapping relationship between each preset field name and each initial field is determined by matching each preset field name with the initial field name in the initial micropore parameter table; Based on the mapping relationship, the parameter information corresponding to each preset field name is extracted from the initial micropore parameter table to generate the micropore parameter table to be drawn.

[0056] In one optional embodiment, the micro-hole batch drawing device 300 for the semiconductor gas distribution disk pattern further includes a graphic display view adjustment module, which is specifically used for: The generated micropore patterns are statistically analyzed and compiled into a pattern set, and the overall pattern range of the pattern set is determined. Adjust the graphic display view of the computer-aided design software according to the overall graphic range to fully display the micropore graphics in the graphic set.

[0057] The micro-orifice batch drawing device for semiconductor gas distribution disk drawings provided in this application embodiment can execute the micro-orifice batch drawing method for semiconductor gas distribution disk drawings provided in any embodiment of this application, and has the corresponding functional modules and beneficial effects of the method.

[0058] This application also provides an electronic device, a readable storage medium, and a computer program product. The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method for batch drawing micro-holes in any semiconductor gas distribution disk pattern according to this application.

[0059] Example 4 Figure 4 This is a schematic diagram of the structure of an electronic device that implements the method for batch drawing micro-holes in semiconductor gas distribution disk drawings according to embodiments of this application. Figure 4 A schematic diagram of an electronic device 410 that can be used to implement embodiments of this application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.

[0060] like Figure 4As shown, the electronic device 410 includes at least one processor 411 and a memory, such as a read-only memory (ROM) 412 or a random access memory (RAM) 413, communicatively connected to the at least one processor 411. The memory stores computer programs executable by the at least one processor. The processor 411 can perform various appropriate actions and processes based on the computer program stored in the ROM 412 or loaded from storage unit 418 into the RAM 413. The RAM 413 may also store various programs and data required for the operation of the electronic device 410. The processor 411, ROM 412, and RAM 413 are interconnected via a bus 414. An input / output (I / O) interface 415 is also connected to the bus 414.

[0061] Multiple components in electronic device 410 are connected to I / O interface 415, including: input unit 416, such as keyboard, mouse, etc.; output unit 417, such as various types of displays, speakers, etc.; storage unit 418, such as disk, optical disk, etc.; and communication unit 419, such as network card, modem, wireless transceiver, etc. Communication unit 419 allows electronic device 410 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0062] Processor 411 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 411 include, but are not limited to, central processing unit (CPU), graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 411 performs the various methods and processes described above, such as the method for batch drawing micro-holes in a semiconductor gas distribution disk drawing.

[0063] In some embodiments, the method for batch drawing microvias of a semiconductor gas distribution disk pattern can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 418. In some embodiments, part or all of the computer program can be loaded and / or mounted on electronic device 410 via ROM 412 and / or communication unit 419. When the computer program is loaded into RAM 413 and executed by processor 411, one or more steps of the method for batch drawing microvias of a semiconductor gas distribution disk pattern described above can be performed. Alternatively, in other embodiments, processor 411 can be configured to perform the method for batch drawing microvias of a semiconductor gas distribution disk pattern by any other suitable means (e.g., by means of firmware).

[0064] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0065] Computer programs used to implement the methods of this application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0066] In the context of this application, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium can be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0067] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0068] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0069] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0070] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.

[0071] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for batch drawing of micro-holes in a semiconductor gas distribution disk pattern, characterized in that, include: Obtain the center coordinates of the semiconductor gas distribution disk drawing and the parameter table of the micropores to be drawn; The validity of each row of micro-pore parameters in the table of micro-pore parameters to be drawn is verified to obtain the valid rows of micro-pore parameters to be drawn. For any of the valid micropore parameter rows to be drawn, the corresponding drawing method is determined according to the pitch circle diameter in the valid micropore parameter row to be drawn, and the corresponding micropore pattern is generated according to the drawing method based on the valid micropore parameter row to be drawn and the drawing center coordinates.

2. The method according to claim 1, characterized in that, The micro-orifice parameters to be drawn in the effective row of micro-orifice parameters include the pitch circle diameter, number of orifices, starting angle, and micro-orifice diameter; the step of determining the corresponding drawing method based on the pitch circle diameter in the effective row of micro-orifice parameters, and generating the corresponding micro-orifice pattern based on the effective row of micro-orifice parameters and the drawing center coordinates according to the drawing method, includes: If the diameter of the nodal circle is zero, then the corresponding micropore pattern is generated with the drawing center coordinates as the center and the micropore diameter as the diameter; If the pitch circle diameter is greater than zero, then based on the pitch circle diameter, the number of holes, the starting angle, and the drawing center coordinates, the micro-hole center coordinates corresponding to each micro-hole to be drawn in the effective micro-hole parameter row are determined, and the corresponding micro-hole pattern is generated with the micro-hole center coordinates as the center and the micro-hole diameter as the diameter.

3. The method according to claim 2, characterized in that, The step of determining the center coordinates of the micro-holes corresponding to the effective row of micro-hole parameters based on the pitch circle diameter, the number of holes, the starting angle, and the drawing center coordinates includes: Based on the pitch circle diameter, determine the annular radius corresponding to each micro-hole to be drawn; Based on the number of holes, determine the angle increment between adjacent micro-holes in each micro-hole to be drawn; Based on the starting angle and angle increment, determine the target angle corresponding to each micropore to be drawn; The center coordinates of each micro-hole to be drawn are determined based on the target angle, the annular radius, and the drawing center coordinates.

4. The method according to claim 1, characterized in that, The step of validating each row of micropore parameters in the table of micropore parameters to be drawn, to obtain valid rows of micropore parameters to be drawn, includes: For any of the micro-hole parameter rows to be drawn, the micro-hole parameter rows that meet the preset verification rules are determined as valid micro-hole parameter rows to be drawn; wherein, the preset verification rules include the pitch circle diameter of the micro-hole parameters to be drawn being greater than or equal to zero, the aperture of the micro-hole parameters to be drawn being greater than zero, the number of apertures of the micro-hole parameters to be drawn being greater than zero, and if the pitch circle diameter of the micro-hole parameters to be drawn is equal to zero, then the number of apertures of the micro-hole parameters to be drawn is equal to 1.

5. The method according to claim 1, characterized in that, Before obtaining the micropore parameter table to be drawn, the following steps are also included: Obtain the initial micropore parameter table input by the user; The mapping relationship between each preset field name and each initial field is determined by matching each preset field name with the initial field name in the initial micropore parameter table; Based on the mapping relationship, the parameter information corresponding to each preset field name is extracted from the initial micropore parameter table to generate the micropore parameter table to be drawn.

6. The method according to claim 1, characterized in that, After generating the corresponding micropore pattern according to the drawing method, the process further includes: The generated micropore patterns are statistically analyzed and compiled into a pattern set, and the overall pattern range of the pattern set is determined. Adjust the graphic display view of the computer-aided design software according to the overall graphic range to fully display the micropore graphics in the graphic set.

7. A device for batch drawing micro-holes in semiconductor gas distribution disk patterns, characterized in that, include: The drawing parameter acquisition module is used to obtain the drawing center coordinates and the parameter table of the micropores to be drawn corresponding to the semiconductor gas distribution disk drawing; The parameter row validity verification module is used to verify the validity of each micro-hole parameter row in the micro-hole parameter table to be drawn, and to obtain a valid micro-hole parameter row to be drawn. The micropore pattern drawing module is used to determine the corresponding drawing method based on the pitch circle diameter in any of the valid micropore parameter rows to be drawn, and to generate the corresponding micropore pattern based on the valid micropore parameter rows to be drawn and the drawing center coordinates according to the drawing method.

8. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the method for batch drawing of micro-holes in a semiconductor gas distribution disk drawing according to any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method for batch drawing of micro-holes in a semiconductor gas distribution disk drawing as described in any one of claims 1-6.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements a method for batch drawing of micro-holes in a semiconductor gas distribution disk drawing according to any one of claims 1-6.

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