Method and system for automatic integration of blocked lots, readable storage medium

Abstract

The application provides an automatic integration method and system for a card-controlled batch of goods, a readable storage medium, and the like, which can automatically integrate a card-controlled batch of goods that has been in a state of inaction for a long time according to preset automatic integration conditions and automatic integration logic rules, thereby vacating the corresponding wafer box, increasing the available resources of the online empty wafer box, maximizing the wafer stock in the wafer box after wafer transfer, saving manpower, reducing human intervention, and reducing the failure of wafer box vacating.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to an automatic integration method and system for controlled batches of goods, and a readable storage medium. Background Technology

[0002] In the semiconductor chip manufacturing process, FOUP (Front Opening Unified Pod, also known as "wafer pod") is a container device used in the automated transfer system within a wafer fab to carry, protect, and transfer wafers. It can transfer and store multiple wafers in batches between the loading ports of wafer processing tools or semiconductor process (such as deposition, coating, exposure, development, etching, etc.) equipment on the production line.

[0003] In the semiconductor chip manufacturing process, some wafers or lots may be held up due to experiments or pending scrapping. These are called held work-in-process (WIP). These held WIPs are stored in the FOUP for a long time without any action, which will occupy a large amount of FOUP resources. This will lead to FOUP resource shortages and low utilization rates when the production line is performing normal operations such as unloading, batching, or replacement, thus affecting the normal operation of the production line.

[0004] Currently, to address this issue, when production line operations such as unloading, batching, or replacement reveal a lack of usable FOUP resources, production line personnel need to combine (multiply) held WIPs that have been inactive for extended periods using the transfer function to free up FOUPs for normal production line use. This solution has the following drawbacks:

[0005] 1. When production line personnel are integrating Hold WIP, they need to manually determine whether the batches in the two FOUPs meet the integration conditions (such as determining the contamination level of the two, the number of wafers in the batch, the FOUP type, the technology, etc.). This not only consumes a lot of time, but may also cause the batch to exceed the waiting time (Q-time) due to untimely processing. In addition, it may also cause the creation of the Sorter Plan to fail.

[0006] 2. When production line personnel complete the integration of Hold WIP and empty FOUP, the emptied FOUP may be immediately selected by other functions of the system for other purposes, which will also cause the emptying of FOUP to fail. Summary of the Invention

[0007] The purpose of this invention is to provide an automatic integration method and system for controlled batches of goods, and a readable storage medium, which can automatically integrate work-in-process that has not been moved for a long time, increase the available resources of empty wafer boxes on the production line, and save manpower and reduce human intervention.

[0008] To achieve the above objectives, the present invention provides an automatic integration method for controlled batches of goods, comprising the following steps:

[0009] The automatic integration conditions and automatic integration logic rules for the controlled batches are pre-configured. The automatic integration logic rules include: prioritizing the emptying of wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch.

[0010] The batches of goods that are stuck on the production line are classified according to the aforementioned automatic integration conditions;

[0011] The classified controlled batches of goods are integrated according to the automatic integration logic rules to determine the one-to-one correspondence between the controlled batches of goods that need to be transferred and the slots of the corresponding target wafer cassettes.

[0012] Automatic dispatching is performed based on the established one-to-one correspondence to transfer the controlled batch of wafers to the slots of their corresponding target wafer cassettes, thereby maximizing the wafer inventory in the target wafer cassettes and freeing up the corresponding wafer cassettes.

[0013] Optionally, the automatic integration conditions include at least one of the following: product identification, wafer box type, card control time, wafer inventory in the wafer box, integration category, and contamination level.

[0014] Optionally, the step of classifying the batches of goods stuck on the production line according to the automatic integration conditions includes:

[0015] The list of goods to be integrated is obtained based on the aforementioned automatic integration conditions;

[0016] Based on the control information of the production execution system and the corresponding filtering conditions, batches that cannot generate a wafer transfer plan in the batch list are filtered out, and wafer cassettes that cannot generate a wafer transfer plan are also filtered out.

[0017] Based on the control information of the production execution system and the automatic integration conditions, a Cartesian matrix is ​​established for the controlled batches of wafers to be transferred and the target wafer cassettes. Invalid data in the Cartesian matrix is ​​deleted. The invalid data includes data where the identification of the wafer cassette of the batch of wafers to be transferred and the identification of the target wafer cassette are the same.

[0018] Optionally, based on the control information of the production execution system and the corresponding wafer cassette filtering conditions, wafer cassettes that cannot generate a wafer transfer plan are filtered out; wherein the wafer cassette filtering conditions include at least one of the following (1) to (5):

[0019] (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out.

[0020] (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out.

[0021] (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out.

[0022] (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out.

[0023] (5) Determine whether the wafer count in the wafer box is less than the set value. If not, the wafer box is filtered out.

[0024] Optionally, based on the control information of the production execution system and the corresponding batch filtering conditions, batches in the batch list that cannot generate a transfer plan are filtered out; wherein, the batch filtering conditions include at least one of the following (1) and (2):

[0025] (1) Determine whether the batch is in the dispatch state, which includes the processing state, reservation state, transfer state, selection state, bank in state or delete state. If so, filter out the batch.

[0026] (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

[0027] Optionally, when determining the one-to-one correspondence between the controlled batch of wafers to be transferred and the slots of the target wafer cassette, a target wafer cassette is prepared for the controlled batch of wafers to be transferred, based on Qmax-Qty≥Qsize, to maximize the wafer inventory after the transfer. Here, Qmax is the number of slots in the empty wafer cassette, Qty is the number of wafers in the controlled batch of wafers to be transferred, and Qsize is the number of remaining slots in the target wafer cassette before the transfer.

[0028] Optionally, the steps for automatically assigning tasks based on the determined one-to-one correspondence include:

[0029] Create a transfer plan based on the established one-to-one correspondence, and limit the number of transfer plans generated per instance for each integration category;

[0030] According to the wafer transfer plan for each integration category, the wafer transfer machine automatically dispatches the controlled batch of wafers to be transferred to the slot of its corresponding target wafer cassette.

[0031] Optionally, the automatic integration method further includes: monitoring relevant change information, the change information including at least one of the following: the number of wafer transfer plans generated daily, the number of vacated wafer cassettes, and the number of remaining slots in each wafer cassette.

[0032] Based on the same inventive concept, the present invention also provides an automatic integration system for controlled batches of goods, comprising:

[0033] The parameter configuration module is used to pre-configure the automatic integration conditions and automatic integration logic rules for the controlled batches of goods. The automatic integration logic rules include: prioritizing the emptying of wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch of goods.

[0034] The classification module is used to classify the batches of goods that are stuck on the production line according to the automatic integration conditions.

[0035] The wafer transfer logic relationship determination module is used to perform integration logic judgment on the classified controlled batches of goods according to the automatic integration logic rules, so as to determine the one-to-one correspondence between the controlled batches of goods that need to be transferred and the slots of the corresponding target wafer cassettes.

[0036] The real-time dispatch module is used to automatically dispatch wafers according to the determined one-to-one correspondence, so as to transfer the controlled batch of wafers to the slot of the corresponding target wafer box, thereby maximizing the wafer inventory in the target wafer box and freeing up the corresponding wafer box.

[0037] Optionally, the automatic integration system further includes at least one of the following (1) to (6):

[0038] (1) The automatic integration conditions configured by the parameter configuration module include at least one of the following: product identification, wafer box type, card control time, wafer inventory in the wafer box, integration category and contamination level;

[0039] (2) The real-time dispatch module is further used to obtain the list of goods batches that need to be integrated according to the automatic integration conditions, so as to provide it to the classification module;

[0040] (3) The classification module is further used to filter out batches that cannot generate a wafer transfer plan in the batch list based on the control information of the production execution system and the corresponding filtering conditions, and to filter out wafer boxes that cannot generate a wafer transfer plan. Then, based on the control information of the production execution system and the automatic integration conditions, a Cartesian matrix is ​​established for the batches that need to be transferred and the target wafer boxes, and invalid data in the Cartesian matrix is ​​deleted. The invalid data includes data where the identity identifier of the wafer box of the batch that needs to be transferred and the identity identifier of the target wafer box are the same.

[0041] (4) The wafer transfer logic relationship determination module is further used to: based on Qmax-Qty≥Qsize, prepare a target wafer box for the controlled batch of wafers that needs to be transferred, which can maximize the wafer inventory after the transfer, where Qmax is the number of slots in the empty wafer box, Qty is the number of wafers in the controlled batch of wafers that needs to be transferred, and Qsize is the number of remaining slots in the target wafer box before the transfer.

[0042] (5) The automatic integration system also includes a perception decision response module, which is used to create a transfer plan based on the determined one-to-one correspondence and limit the number of transfer plans generated at one time for each integration category;

[0043] (6) The automatic integration system also includes an information monitoring module, which is used to monitor the corresponding change information, including at least one of the following: the number of wafer transfer plans generated each day, the number of vacated wafer boxes, and the number of remaining slots in each wafer box.

[0044] Optionally, the classification module is further configured to filter out wafer cassettes that cannot generate a wafer transfer plan based on the control information of the production execution system and the corresponding wafer cassette filtering conditions, wherein the wafer cassette filtering conditions include at least one of the following (1) to (5):

[0045] (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out.

[0046] (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out.

[0047] (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out.

[0048] (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out.

[0049] (5) Determine whether the wafer inventory in the wafer box is less than the set value. If not, the wafer box is filtered out.

[0050] And / or, the classification module is further configured to filter out batches in the batch list that cannot generate a transfer plan based on the control information of the production execution system and the corresponding batch filtering conditions, and the batch filtering conditions include at least one of the following (1) and (2):

[0051] (1) Determine whether the batch is in the dispatch state, which includes the processing state, reservation state, transfer state, selection state, bank in state or delete state. If so, filter out the batch.

[0052] (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

[0053] Based on the same inventive concept, the present invention also provides a readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the automatic integration method for controlled batches of goods as described in the present invention.

[0054] Compared with the prior art, the technical solution of the present invention can automatically integrate the held-in work-in-process (WIP) batches that have been idle for a long time according to preset automatic integration conditions and automatic integration logic rules, so as to free up the corresponding wafer boxes, increase the available resources of empty wafer boxes on the production line, and maximize the wafer inventory (FOUP Size) in the wafer boxes after wafer transfer, while saving manpower, reducing human intervention, and reducing the failure of wafer box emptying. Attached Figure Description

[0055] Those skilled in the art will understand that the accompanying drawings are provided to better understand the invention and do not constitute any limitation on the scope of the invention. Wherein:

[0056] Figure 1 This is a flowchart illustrating an embodiment of the automatic integration method for controlled batches of goods according to the present invention.

[0057] Figure 2 This is a schematic diagram of the priority emptying wafer box rule in the automatic integration method for controlled batches according to an embodiment of the present invention.

[0058] Figure 3 This is a schematic diagram illustrating the rules for maximizing wafer inventory in a wafer cassette in an automatic integration method for controlled batches according to an embodiment of the present invention.

[0059] Figure 4 This is a schematic diagram of the rules for avoiding duplicate transmission of the same controlled Lot in the automatic integration method of controlled Lots according to an embodiment of the present invention.

[0060] Figure 5 This is a schematic diagram illustrating the relationship between the batch list and the possible target wafer cells of each batch obtained by the automatic integration method of controlled batches according to an embodiment of the present invention.

[0061] Figure 6 This is a schematic diagram of the Cartesian matrix data established in the automatic integration method for controlled batches of goods according to an embodiment of the present invention.

[0062] Figure 7 This is a schematic diagram of the architecture of an automatic batch integration system under control according to an embodiment of the present invention. Detailed Implementation

[0063] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the invention. It should be understood that the invention can be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals denote the same elements throughout. It should be understood that when an element is referred to as "connected to" or "coupled to" other elements, it may be directly connected to other elements, or there may be intervening elements. Conversely, when an element is referred to as "directly connected to" other elements, there are no intervening elements. As used herein, the singular forms "a," "an," and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "comprising" is used to identify the presence of features, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. When used herein, the term "and / or" includes any and all combinations of the associated listed items.

[0064] The technical solution proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0065] Please refer to Figure 1 An embodiment of the present invention provides an automatic integration method for controlled batches of goods, which includes the following steps:

[0066] S1, pre-configure the automatic integration conditions and automatic integration logic rules for the controlled batches of goods. The automatic integration logic rules include: prioritizing the emptying of wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch of goods.

[0067] S2, classify the batches of goods that are stuck on the production line according to the automatic integration conditions;

[0068] S3, according to the automatic integration logic rules, perform integration logic judgment on the classified controlled batches of goods to determine the one-to-one correspondence between the controlled batches of goods that need to be transferred and the slots of the corresponding target wafer cassettes.

[0069] S4. Automatic dispatching is performed based on the determined one-to-one correspondence to transfer the controlled batch of wafers to the slot of the corresponding target wafer box, thereby maximizing the wafer inventory in the target wafer box and freeing up the corresponding wafer box.

[0070] In one example, in step S1, the conditions for automatic multiplication of held lots (i.e., automatic multiplication conditions) can be set through the user configuration interface. These automatic multiplication conditions may optionally include at least one of the following parameters: Product ID, FOUP Type, Hold Time, FOUP Size, Multi Category, and Contamination Level of the FOUP. By setting these automatic multiplication conditions, it can be ensured that only lots with the same automatic multiplication conditions can be multiplied together.

[0071] A single FOUP (Front-of-Pack) wafer cassette can have multiple slots, with each slot storing one wafer. Each slot in each FOUP can have a unique slot identifier (e.g., Slot No.) to ensure accurate placement and retrieval of wafers within the FOUP. For the same Lot, wafers from the same Lot are stored in the same FOUP.

[0072] In one example, in step S1, the logic rules for the automatic integration of the controlled batches of goods (i.e., the automatic integration logic rules) can be set in any suitable way. These automatic integration logic rules can have three rules:

[0073] (1) Prioritize empty wafer pods (FOUP). This rule helps maximize the number of empty wafer pods. For example, ... Figure 2As shown, there are three wafer cassettes: FOUP1, FOUP2, and FOUP3. FOUP3 is a 25-slot wafer cassette, currently containing batches LotD to LotF, with a FOUP size (also the total number of wafers in the batch, Lot Qty) of 17 pieces. FOUP1 currently contains batches LotA to LotB, with LotA containing 1 piece (Lot Qty) and LotB containing 8 pieces (Lot Qty). FOUP2 currently contains batch LotC, with LotC containing 8 pieces (Lot Qty). Setting the rule of prioritizing emptying wafer cassettes will transfer batch LotB (from Lot) to FOUP3 (the target wafer cassette, To Lot). In FOUP), FOUP3 is fully loaded (i.e., FOUP3 has the maximum wafer storage capacity), while FOUP2 is emptied. That is, after LotC is transferred to the target wafer FOUP3, a usable FOUP (i.e., an empty FOUP2) can be freed up for the production line.

[0074] (2) Maximize the FOUP size. This rule helps improve FOUP utilization and maximizes the number of vacated FOUPs. For example, ... Figure 3 As shown, there are four wafer cassettes: FOUP1, FOUP2, FOUP3, and FOUP4. FOUP4 is a 25-slot wafer cassette, currently containing batches LotG to LotI, with a total wafer count (ToFOUP Size) of 15 pieces. FOUP1 currently contains batches LotA to LotB, with LotA containing 2 wafers (Lot Qty) and LotB containing 3 wafers (Lot Qty). FOUP2 currently contains batches LotC to LotD, with LotC containing 1 wafer (Lot Qty) and LotD containing 10 wafers (Qty). FOUP3 currently contains batches LotE to LotF, with LotE containing 5 wafers (Lot Qty) and LotF containing 10 wafers (Lot Qty). Qty = 6 pieces (pcs) Setting this rule to maximize the wafer inventory in the wafer cassette will transfer the LotD in FOUP2 to FOUP4, making FOUP4 fully loaded (i.e., after the transfer, the wafer inventory in FOUP4 reaches the maximum value of 25 pieces).

[0075] (3) Avoid duplicate transfers of the same controlled lot, and avoid having the same wafer inventory in the from-FOUP wafer cassette and the target wafer cassette ... Figure 4 As shown, there are two wafer cassettes, FOUP1 and FOUP2. FOUP1 currently contains batches LotA to LotB, with LotA containing 2 wafers (Lot Qty) and LotB containing 3 wafers (Lot Qty). FOUP2 currently contains batch LotC, with LotC containing 2 wafers (Lot Qty). If LotB is transferred from FOUP1 to FOUP2, the wafer inventory (FOUP Size) of FOUP2 after the transfer will be the same as the wafer inventory of FOUP1 before the transfer. This rule setting can prevent this situation from occurring.

[0076] Optionally, in step S1 of this embodiment, the method can further be configured by setting the time interval for triggering the automatic integration task (i.e., the time interval for triggering step S2) through the user configuration interface based on the daily utilization rate of the wafer transfer machine (also known as a "sorter" or "wafer transfer machine") on the production line. For example, it can be triggered once every 2 hours. Therefore, the subsequent step S2 includes: S2.0, which enables the scheduled task through the Sense Response Decide (SDR) module.

[0077] In other embodiments of the present invention, step S2 can also be triggered by setting a lower limit value for the number of empty wafer cells of each type on the production line. That is, step S2 is triggered once whenever the number of empty wafer cells of a certain type on the production line reaches or falls below the lower limit value.

[0078] Please continue to refer to this. Figure 1 In step S2, the batches that are stuck on the production line are classified according to the automatic integration conditions preset in step S1 (such as integration category, wafer cell type and contamination level) to ensure that only batches that have the same automatic integration conditions can be integrated (Multi) together.

[0079] In one example, step S2, which involves classifying the batches of goods stuck on the production line according to the preset automatic integration conditions in step S1, includes:

[0080] S2.1, a Real-Time Dispatching (RTD) module can be used to obtain the list of lots to be integrated based on the automatic integration conditions set in step S1 (e.g., Product ID, Lot Type, FOUP Type, Hold Time, etc.). For specific controlled lots that do not require automatic integration, a special hold code can be set. This allows for the automatic filtering out of lots with such hold codes in this step, preventing them from entering the lot list.

[0081] S2.2, based on the corresponding control information and wafer cassette filtering conditions of the Manufacturing Execution System (MES), filter out wafer cassettes that cannot generate a sorter plan, and based on the corresponding control information and batch filtering conditions of the MES, filter out batches in the batch list that cannot generate a sorter plan.

[0082] The Manufacturing Execution System (MES) is the core information system and command center for wafer fabrication. It can send work orders to various sites and collect production data from each site to manage and monitor the wafer fabrication process. This includes managing wafer production data, tracking production progress, controlling the operating status of equipment on the production line, and ensuring the correct execution of wafer fabrication processes. The production data collected by the MES system can be processed and stored in a database for further production scheduling, quality management, and historical production data analysis.

[0083] The wafer cassette filtration conditions used in this step include at least one of the following (1) to (5):

[0084] (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out.

[0085] (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out.

[0086] (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out.

[0087] (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out.

[0088] (5) Determine whether the wafer count in the wafer box is less than the set value. If not, the wafer box is filtered out.

[0089] The batch filtering conditions used in this step include at least one of the following (1) and (2):

[0090] (1) Determine whether the batch is in the dispatch state, which includes the processing state, reservation state, transfer state, selection state, bank in state or delete state. If so, filter out the batch.

[0091] (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

[0092] S2.3, based on the control information of the production execution system and the automatic integration conditions set in step S1, establish a Cartesian matrix of the controlled batches (denoted as "From Lot", or simply "Source Lot") and target wafer pods (denoted as "ToFOUP") that need to be transferred. Among them, the Cartesian matrix contains: (1) the contamination level of all Lots in To FOUP must be consistent with the contamination level of the Source Lot; (2) the integration category and wafer pod type of the wafer pods (denoted as "From FOUP", or "Source Wafer Pod") in From Lot and the target wafer pods To FOUP must be consistent; (3) the wafer pod identifiers (FOUP ID) of From FOUP and To FOUP cannot be the same; (4) the integration category of all batches in From FOUP and To FOUP must be consistent.

[0093] S2.4, Delete invalid data from the Cartesian matrix. Invalid data deleted in this step includes data where the IDs (identifiers) of the From FOUP (i.e., the wafer cassette containing the batch to be transferred) and the To FOUP (i.e., the target wafer cassette) are identical. Deleting invalid data from the Cartesian matrix in this step prevents subsequent failures in creating the transfer plan (SorterPlan Failed).

[0094] In one example, please refer to Figure 5 and Figure 6Assume there are four wafer cassettes: FOUP1, FOUP2, FOUP3, and FOUP4. Their maximum wafer inventory (total slots) Qmax is 25 wafers. FOUP1 currently holds lots LotA to LotB, with a total of 15 wafers (Lot Qty) in LotA and LotB. FOUP1's current wafer inventory is FOUP SIZE 15. FOUP2 currently holds lot LotC, with 12 wafers (Lot Qty). FOUP3 currently holds lot LotD, with 8 wafers (Lot Qty). FOUP4 currently holds lot LotE, with 5 wafers (Lot Qty). The lots in FOUP1, FOUP2, FOUP3, and FOUP4 are designated as source lots. Lot takes the three wafer boxes from FOUP1, FOUP2, FOUP3, and FOUP4 other than the wafer box containing the source batch as the target wafer box To FOUP, and establishes a Cartesian matrix composed of From Lot and To FOUP. In this matrix, data exceeding Qmax (i.e., 25 wafers) after wafer transfer is further deleted.

[0095] In step S3, the data in the Cartesian matrix established in step S2 is integrated according to the automatic integration logic rules set in step S1 to determine the one-to-one correspondence between the controlled batch (From Lot) to be transferred and the corresponding target wafer pod (To FOUP) slot (Slot No). That is, a correspondence is established between the source batch (From Lot), the source wafer pod's identifier (From FOUP ID), the target wafer pod's identifier (To FOUP ID), and the target wafer pod's slot No.

[0096] Optionally, in step S3, when determining the one-to-one correspondence between the controlled batch From Lot to be transferred and the corresponding target wafer pod To FOUP slots, a target wafer pod To FOUP can be prepared for the controlled batch From Lot to be transferred, based on Qmax-Qty≥Qsize, to maximize the wafer inventory FOUP size after transfer. Here, Qmax is the number of slots in the empty wafer pod, Qty is the number of wafers in the controlled batch From Lot to be transferred, and Qsize is the number of remaining slots in the target wafer pod To FOUP before transfer, Qsize=Qmax-FOUPsize.

[0097] It should be understood that the one-to-one correspondence determined in step S3 includes at least one of the following: a one-to-one relationship between a source batch and a target wafer pod, and a many-to-one relationship between multiple source batches and a target wafer pod. In the many-to-one relationship, multiple source batches may originate from the same wafer pod (From FOUP) or from different wafer pods (From FOUP).

[0098] In step S4, the step of automatically assigning tasks based on the one-to-one correspondence determined in step S3 includes:

[0099] S4.1 The Sorter Plan can be created by calling the MES interface through the Sensing Decision Response Module (SDR) based on the one-to-one correspondence determined in step S3. The number of Sorter Plans generated at one time for each integration category is limited to ensure that the Sorter Plans generated for integrating the controlled batches will not affect the normal use of the Sorter Plan machine on the production line.

[0100] S4.2, MES automatically dispatches the corresponding source batch (i.e. the controlled batch that needs to be transferred) to the wafer transfer machine according to the wafer transfer plan of each integration category, so as to transfer it to the slot of the corresponding target wafer cassette.

[0101] Optionally, the automatic integration method in this example further includes step S5: monitoring relevant change information in real time through any suitable means such as data reports. This change information includes at least one of the following: the number of wafer transfer plans generated daily, the number of vacated wafer cassettes, and the number of remaining slots in each wafer cassette. This facilitates data aggregation and anomaly analysis.

[0102] Therefore, through the above steps S2 to S5, the batch of goods that have been stuck and have not moved for a long time can be automatically integrated according to the preset automatic integration conditions and rules, thereby increasing the wafer inventory FOUP Size in the corresponding wafer cassettes and providing the production line with the available resources of various types of empty wafer cassettes FOUPs in a timely manner, reducing the failure of emptying, saving manpower and reducing human intervention.

[0103] Please continue to refer to this. Figure 5 and Figure 6In the example described, each FOUP has 25 slots when it is empty. In step S3, according to the automatic integration logic rules set in step S1, the one-to-one correspondence between LotE and LotD and the slots (SlotNo) of the wafer cassette FOUP2 is determined. In step S4, LotE and LotD are automatically dispatched on the wafer transfer machine to transfer LotE and LotD to the wafer cassette FOUP2 respectively, thereby freeing up FOUP4 and FOUP3 and making FOUP2 fully loaded (i.e., the wafer storage in FOUP2 reaches 25 wafers).

[0104] In other embodiments, when a one-to-one wafer transfer between wafer cassettes is preset to be allowed, please refer to [the relevant documentation]. Figure 5 and Figure 6 In the example described above, in step S3, based on the settings in step S1, a one-to-one correspondence is determined between LotD and the slot No of wafer pod FOUP1, and a one-to-one correspondence is determined between LotE and the slot No of wafer pod FOUP2. In step S4, LotD is first automatically dispatched on the wafer transfer machine to transfer LotD to wafer pod FOUP1, thereby freeing up FOUP3 and maximizing the wafer storage in FOUP1 (i.e., the wafer storage in FOUP1 reaches 23 wafers after the transfer). Then, LotE is automatically dispatched on the wafer transfer machine to transfer LotE to wafer pod FOUP2, thereby freeing up FOUP4, and the wafer storage in FOUP2 reaches 20 wafers after the transfer.

[0105] The automatic integration of the controlled batches in this embodiment can automatically integrate the controlled batches that have been inactive for a long time according to preset automatic integration conditions and automatic integration logic rules, thereby freeing up corresponding wafer boxes, increasing the available resources of empty wafer boxes on the line, and maximizing the wafer foupsize in the wafer boxes after wafer transfer. At the same time, it saves manpower, reduces human intervention, and reduces the failure of wafer box emptying.

[0106] Based on the same inventive concept, please refer to Figure 7 This embodiment also provides an automatic integration system 1 for controlled batches of goods, which can be used to implement the automatic integration method for controlled batches of goods described in this embodiment. The automatic integration system 1 includes a parameter configuration module 11, a classification module 12, a transfer logic relationship determination module 13, and a real-time dispatch module (RTD) 15.

[0107] The parameter configuration module 11 is used to implement step S1 in the automatic integration method for controlled batches described in this embodiment. Specifically, the parameter configuration module 11 pre-configures the automatic integration conditions and automatic integration logic rules for the controlled batches. These automatic integration logic rules include: prioritizing emptying wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch. Optionally, the automatic integration conditions configured by the parameter configuration module 11 include at least one of the following: product identification, wafer box type, control time, wafer inventory in wafer boxes, integration category, and contamination level.

[0108] The classification module 12 is used to implement step S2 in the automatic integration method for controlled batches described in this embodiment. That is, the classification module 12 is used to classify the controlled batches on the production line according to the automatic integration conditions. In this example, the classification module 12 is further used to filter out batches that cannot generate a wafer transfer plan from the batch list based on the control information of the production execution system (MES system) 2 and the corresponding filtering conditions, and to filter out wafer cassettes that cannot generate a wafer transfer plan. Then, based on the control information of the production execution system 2 and the automatic integration conditions, a Cartesian matrix is ​​established for the batches that need to be transferred and the target wafer cassettes, and invalid data in the Cartesian matrix is ​​deleted. The invalid data includes data where the identity identifier of the wafer cassette of the batch that needs to be transferred is the same as the identity identifier of the target wafer cassette.

[0109] Optionally, the classification module 12 is further configured to filter out wafer cassettes that cannot generate a wafer transfer plan based on the control information of the production execution system 2 and the corresponding wafer cassette filtering conditions, wherein the wafer cassette filtering conditions include at least one of the following (1) to (5):

[0110] (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out.

[0111] (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out.

[0112] (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out.

[0113] (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out.

[0114] (5) Determine whether the wafer count in the wafer box is less than the set value. If not, the wafer box is filtered out.

[0115] Optionally, the classification module 12 is further configured to filter out batches in the batch list that cannot generate a transfer plan based on the control information of the production execution system 2 and the corresponding batch filtering conditions, and the batch filtering conditions include at least one of the following (1) and (2):

[0116] (1) Determine whether the batch is in the dispatch state, which includes the processing state, reservation state, transfer state, selection state, bank in state or delete state. If so, filter out the batch.

[0117] (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

[0118] The chip transfer logic relationship determination module 13 is used to implement step S3 in the automatic integration method of the controlled batch of goods described in this embodiment. That is, the chip transfer logic relationship determination module 13 is used to perform integration logic determination on the classified controlled batch of goods according to the automatic integration logic rules, so as to determine the one-to-one correspondence between the controlled batch of goods that needs to be transferred and the slot of the corresponding target wafer cell.

[0119] Optionally, the wafer transfer logic relationship determination module 13 is further used to: based on Qmax-Qty≥Qsize and the Cartesian matrix created by the classification module 12, prepare a target wafer box for the controlled batch of wafers to be transferred, which can maximize the wafer inventory after the transfer, wherein Qmax is the number of slots in the empty wafer box, Qty is the number of wafers in the controlled batch of wafers to be transferred, and Qsize is the number of remaining slots in the target wafer box before the transfer.

[0120] The real-time dispatch module 15 is used to implement step S4 in the automatic integration method for the controlled batches of goods described in this embodiment. That is, the real-time dispatch module 15 automatically dispatches goods according to the one-to-one correspondence determined by the wafer transfer logic relationship determination module 13, so as to transfer the controlled batches of goods that need to be transferred to the slots of their corresponding target wafer boxes through the wafer transfer machine 3, thereby maximizing the wafer inventory in the target wafer boxes and freeing up the corresponding wafer boxes.

[0121] Optionally, the real-time dispatch module 15 is further configured to obtain a list of goods to be integrated according to the automatic integration conditions set by the parameter configuration module 11, and provide it to the classification module 12.

[0122] Optionally, the automatic integration system for controlled batches in this embodiment further includes a Sensing Decision Response (SDR) module 14, which is used to create a wafer transfer plan based on the one-to-one correspondence determined by the wafer transfer logic relationship determination module 13, and to limit the number of wafer transfer plans generated at one time for each integration category. The SDR module 14 can serve as a communication connection window between the real-time dispatch module 15 and the production execution system 2, transmitting information about the batches and wafer cassettes that the real-time dispatch module 15 needs to dispatch to the production execution system 2, so that the production execution system 2 can automatically dispatch the batches requiring wafer transfer on the wafer transfer machine 3.

[0123] Optionally, the perception decision response module (SDR) 14 also has a corresponding configuration interface, which can be further configured to pre-set the timed film transfer task of the film transfer machine 3 according to the current production capacity of the film transfer machine 3.

[0124] Optionally, the automatic integration system for controlled batches in this embodiment further includes an information monitoring module 16, which is used to monitor corresponding change information, including at least one of the following: the number of wafer transfer plans generated daily, the number of vacated wafer cassettes, and the number of remaining slots in each wafer cassette.

[0125] It should be understood that the parameter configuration module 11, classification module 12, slice transfer logic relationship determination module 13, perception decision response module 14, real-time dispatch module (RTD) 15, and information monitoring module 16 in the automatic integration system of this embodiment can be implemented in one device, or any one of the modules can be split into multiple devices, or at least part of the function of one module can be combined with at least part of the function of another module and implemented in one device, or at least part of the function of at least one module can be combined with at least part of the function of an EAP system or a MES system and implemented in one device.

[0126] Furthermore, at least one of the parameter configuration module 11, classification module 12, chip transfer logic relationship determination module 13, perception decision response module 14, real-time dispatch module (RTD) 15, and information monitoring module 16 can be at least partially implemented as hardware circuits, such as field-programmable gate arrays (FPGAs), programmable logic arrays (PLAs), systems-on-a-chip, systems-on-a-substrate, systems-on-package, application-specific integrated circuits (ASICs), or any other reasonable way of integrating or packaging circuits, or as a suitable combination of software, hardware, and firmware implementations.

[0127] Alternatively, at least one of the parameter configuration module 11, classification module 12, slice transfer logic relationship determination module 13, perception decision response module 14, real-time dispatch module (RTD) 15, and information monitoring module 16 can be at least partially implemented as a computer program module, which can perform the functions of the corresponding module when the program is run by a computer and can be upgraded by software.

[0128] In summary, the automatic integration system for blocked batches in this embodiment interacts with the MES system to automatically integrate blocked batches that have been inactive for a long time (such as experimental or scrapped blocked batches) according to preset automatic integration conditions and automatic integration logic rules. This frees up corresponding wafer boxes, increases the available resources of empty wafer boxes on the production line, and maximizes the wafer inventory (FOUP Size) in the wafer boxes after wafer transfer. At the same time, it saves manpower, reduces human intervention, reduces wafer box emptying failures, and avoids production line interruptions caused by inaccurate human judgment leading to a shortage of empty wafer boxes.

[0129] Based on the same inventive concept, one embodiment of the present invention also provides a readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the automatic integration method for controlled batches of goods as described in the present invention.

[0130] The readable storage medium can be a tangible device capable of holding and storing instructions used by an instruction execution device, such as, but not limited to, electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. More specific examples of the readable storage medium (a non-exhaustive list) include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. The computer program described herein can be downloaded from the readable storage medium to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. Each computing / processing device's network adapter card or network interface receives the computer program from the network and forwards it for storage in a readable storage medium within the respective computing / processing device. The computer program used to perform the operations of this invention can be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as "C" or similar languages. The computer program can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuits, such as programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), are personalized by utilizing state information from a computer program. These electronic circuits can execute computer-readable program instructions, thereby realizing various aspects of the present invention.

[0131] Various aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, systems, and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by a computer program. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. These computer programs can also be stored in a readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the readable storage medium storing the computer program comprises an article of manufacture including instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams.

[0132] A computer program may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the computer program executing on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0133] The above description is only a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the present invention.

Claims

1. A method for automatically integrating controlled batches of goods, characterized in that, Includes the following steps: The automatic integration conditions and automatic integration logic rules for the controlled batches are pre-configured. The automatic integration logic rules include: prioritizing the emptying of wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch. The batches of goods that are stuck on the production line are classified according to the aforementioned automatic integration conditions; The classified controlled batches of goods are integrated according to the automatic integration logic rules to determine the one-to-one correspondence between the controlled batches of goods that need to be transferred and the slots of the corresponding target wafer cassettes. Automatic dispatching is performed based on the established one-to-one correspondence to transfer the controlled batch of wafers to the slots of their corresponding target wafer cassettes, thereby maximizing the wafer inventory in the target wafer cassettes and freeing up the corresponding wafer cassettes.

2. The automatic integration method as described in claim 1, characterized in that, The automatic integration conditions include at least one of the following: product identification, wafer box type, card control time, wafer inventory in the wafer box, integration category, and contamination level.

3. The automatic integration method as described in claim 1, characterized in that, The steps for classifying the batches of goods stuck on the production line according to the aforementioned automatic integration conditions include: The list of goods to be integrated is obtained based on the aforementioned automatic integration conditions; Based on the control information of the production execution system and the corresponding filtering conditions, batches that cannot generate a wafer transfer plan in the batch list are filtered out, and wafer cassettes that cannot generate a wafer transfer plan are also filtered out. Based on the control information of the production execution system and the automatic integration conditions, a Cartesian matrix is ​​established for the controlled batches of wafers to be transferred and the target wafer cassettes. Invalid data in the Cartesian matrix is ​​deleted. The invalid data includes data where the identification of the wafer cassette of the batch of wafers to be transferred and the identification of the target wafer cassette are the same.

4. The automatic integration method as described in claim 3, characterized in that, Based on the control information of the production execution system and the corresponding wafer cassette filtering conditions, wafer cassettes that cannot generate a wafer transfer plan are filtered out. The wafer cell filtration conditions include at least one of the following (1) to (5): (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out. (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out. (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out. (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out. (5) Determine whether the wafer count in the wafer box is less than the set value. If not, the wafer box is filtered out.

5. The automatic integration method as described in claim 3, characterized in that, Based on the control information of the production execution system and the corresponding batch filtering conditions, batches in the batch list that cannot generate a transfer plan are filtered out; wherein, the batch filtering conditions include at least one of the following (1) and (2): (1) Determine whether the batch is in the dispatch state. The dispatch state includes processing state, reservation state, film transfer state, selection state, storage state or deletion state. If so, filter out the batch. (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

6. The automatic integration method as described in claim 1, characterized in that, When determining the one-to-one correspondence between the controlled batch of wafers to be transferred and the slots of the target wafer cassette, a target wafer cassette is prepared for the controlled batch of wafers to be transferred, based on the principle that Qmax-Qty≥Qsize, to maximize the wafer inventory after the transfer. Here, Qmax is the number of slots in the empty wafer cassette, Qty is the number of wafers in the controlled batch of wafers to be transferred, and Qsize is the number of remaining slots in the target wafer cassette before the transfer.

7. The automatic integration method as described in claim 1, characterized in that, The steps for automatic work assignment based on the established one-to-one correspondence include: Create a transfer plan based on the established one-to-one correspondence, and limit the number of transfer plans generated per instance for each integration category; According to the wafer transfer plan for each integration category, the wafer transfer machine automatically dispatches the controlled batch of wafers to be transferred to the slot of its corresponding target wafer cassette.

8. The automatic integration method as described in claim 7, characterized in that, Also includes: Monitor the corresponding change information, which includes at least one of the following: the number of wafer transfer plans generated daily, the number of vacated wafer cassettes, and the number of remaining slots in each wafer cassette.

9. An automated batch integration system for controlled goods, characterized in that, include: The parameter configuration module is used to pre-configure the automatic integration conditions and automatic integration logic rules for the controlled batches of goods. The automatic integration logic rules include: prioritizing the emptying of wafer boxes, maximizing the wafer inventory in wafer boxes, and avoiding duplicate transmission of the same controlled batch of goods. The classification module is used to classify the batches of goods that are stuck on the production line according to the automatic integration conditions. The wafer transfer logic relationship determination module is used to perform integration logic judgment on the classified controlled batches of goods according to the automatic integration logic rules, so as to determine the one-to-one correspondence between the controlled batches of goods that need to be transferred and the slots of the corresponding target wafer cassettes. The real-time dispatch module is used to automatically dispatch wafers according to the determined one-to-one correspondence, so as to transfer the controlled batch of wafers to the slot of the corresponding target wafer box, thereby maximizing the wafer inventory in the target wafer box and freeing up the corresponding wafer box.

10. The automatic integration system as described in claim 9, characterized in that, It also includes at least one of the following (1) to (6): (1) The automatic integration conditions configured by the parameter configuration module include at least one of the following: product identification, wafer box type, card control time, wafer inventory in the wafer box, integration category and contamination level; (2) The real-time dispatch module is further used to obtain the list of goods batches that need to be integrated according to the automatic integration conditions, so as to provide it to the classification module; (3) The classification module is further used to filter out batches that cannot generate a wafer transfer plan in the batch list based on the control information of the production execution system and the corresponding filtering conditions, and to filter out wafer boxes that cannot generate a wafer transfer plan. Then, based on the control information of the production execution system and the automatic integration conditions, a Cartesian matrix is ​​established for the batches that need to be transferred and the target wafer boxes, and invalid data in the Cartesian matrix is ​​deleted. The invalid data includes data where the identity identifier of the wafer box of the batch that needs to be transferred and the identity identifier of the target wafer box are the same. (4) The wafer transfer logic relationship determination module is further used to: based on Qmax-Qty≥Qsize, prepare a target wafer box for the controlled batch of wafers that needs to be transferred, which can maximize the wafer inventory after the transfer, where Qmax is the number of slots in the empty wafer box, Qty is the number of wafers in the controlled batch of wafers that needs to be transferred, and Qsize is the number of remaining slots in the target wafer box before the transfer. (5) The automatic integration system also includes a perception decision response module, which is used to create a transfer plan based on the determined one-to-one correspondence and limit the number of transfer plans generated at one time for each integration category; (6) The automatic integration system also includes an information monitoring module, which is used to monitor the corresponding change information, including at least one of the following: the number of wafer transfer plans generated each day, the number of vacated wafer boxes, and the number of remaining slots in each wafer box.

11. The automatic integration system as described in claim 10, characterized in that, The classification module is further used to filter out wafer cassettes that cannot generate a wafer transfer plan based on the control information of the production execution system and the corresponding wafer cassette filtering conditions, and the wafer cassette filtering conditions include at least one of the following (1) to (5): (1) Determine whether the wafer box is on the overhead crane. If so, the wafer box is filtered out. (2) Determine whether the wafer cassette already has a wafer transfer plan. If so, the wafer cassette is filtered out. (3) Determine whether the wafer cell is stuck or needs cleaning. If the wafer cell is stuck or needs cleaning, the wafer cell is filtered out. (4) Determine if the batch in the wafer box is already in the dispatch state. If so, the wafer box is filtered out. (5) Determine whether the wafer inventory in the wafer box is less than the set value. If not, the wafer box is filtered out. And / or, the classification module is further configured to filter out batches in the batch list that cannot generate a transfer plan based on the control information of the production execution system and the corresponding batch filtering conditions, and the batch filtering conditions include at least one of the following (1) and (2): (1) Determine whether the batch is in the dispatch state, which includes the processing state, reservation state, transfer state, selection state, bank in state or delete state. If so, filter out the batch. (2) Determine whether the time the batch is blocked is greater than the set value. If not, filter out the batch.

12. A readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the automatic integration method for the controlled batch of goods as described in any one of claims 1-8.

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