Display screen assembly and terminal device

Abstract

The application provides a display screen assembly and a terminal device. The terminal device comprises the display screen assembly, the display screen assembly comprises a display panel, a flexible circuit board and a conductive layer, the display panel is not reversely folded, and the conductive layer is in conduction with the flexible circuit board through the side surface of the display panel. The size of the black border area increased due to the reverse folding of the display panel can be reduced, and the size of the black border area increased due to the protective glue for improving the stress setting can be reduced, so that the screen-to-body ratio is improved. The display screen assembly and the terminal device also have the characteristics of thin thickness and low manufacturing cost.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display screen assembly and a terminal device. Background Technology

[0002] Ultra-narrow bezel displays can enhance the user experience. However, the presence of bending areas in traditional COP (Chip On Plastic) packaging significantly increases the black border area of ​​the display, making it impossible to further reduce the bezel size. This limits the potential for increasing the screen-to-body ratio and has become a key issue that urgently needs to be addressed in the current display technology field. Summary of the Invention

[0003] In view of this, this application provides a display component and terminal device with a large screen-to-body ratio.

[0004] In a first aspect, this application provides a display panel assembly, including a display panel, a flexible circuit board, and a conductive layer. The display panel includes a substrate layer and an electrode layer arranged along a first direction. The electrode layer includes a body portion and a protrusion portion, which are arranged along a second direction. The protrusion portion protrudes from the substrate layer along the second direction. The flexible circuit board is located on the side of the substrate layer opposite to the body portion. The conductive layer electrically connects the protrusion portion and the flexible circuit board to conduct electricity between the electrode layer and the flexible circuit board.

[0005] In the above embodiments, the display panel does not have a bending portion, which effectively reduces the size of the black border area increased by the presence of the bending portion. Simultaneously, the protective adhesive is omitted, reducing both the size of the black border area increased by the presence of the protective adhesive and the size of the black border area increased by the reserved space for excess adhesive, thereby improving the screen-to-body ratio. Furthermore, the absence of a bending portion and a back panel on the display panel effectively reduces the overall area of ​​the display panel, which helps save costs. Moreover, the absence of a back panel on the display panel, along with the omission of the second back film, effectively saves the thickness of the back panel and the second back film along the first direction, which helps reduce the overall thickness of the display assembly.

[0006] In some possible embodiments of this application, the conductive layer includes a first conductive portion, a connecting portion, and a second conductive portion. The connecting portion connects the first conductive portion and the second conductive portion. The first conductive portion connects to the surface of the protrusion facing the substrate layer. The connecting portion connects to the substrate layer. The second conductive portion is electrically connected to the flexible circuit board.

[0007] In the above embodiments, the conductive layer is used to enable the display panel and the flexible circuit board to conduct electricity. The first conductive part and the protruding part are connected to the surface of the substrate layer, which helps to increase the connection area of ​​the first conductive part and the protruding part and increase the electrical connection reliability between the conductive layer and the display panel.

[0008] In some possible embodiments of this application, the display assembly further includes a cover glass, an ink layer, and a protective adhesive. The cover glass is located on the side of the electrode layer away from the substrate layer, and the ink layer is located on the surface of the cover glass facing the display panel. The protective adhesive includes a first protective portion and a second protective portion. The first protective portion covers the protrusion and the side of the substrate layer and connects to the ink layer. The second protective portion extends from the end of the first protective portion away from the ink layer toward the substrate layer and covers the surface of the first conductive portion away from the protrusion.

[0009] In the above embodiments, the protective adhesive not only provides lateral protection but also covers the first conductive part, increasing the connection reliability between the first conductive part and the protruding part.

[0010] In some possible embodiments of this application, the display assembly further includes an optical adhesive, a polarizer, and a first adhesive layer, which are arranged along a first direction and located between the cover glass and the display panel. The protective adhesive also connects the optical adhesive, the polarizer, and the first adhesive layer.

[0011] In the above embodiments, the protective adhesive serves to seal the sides, provide waterproofing, and prevent dust.

[0012] In some possible embodiments of this application, the display assembly further includes a back film and a second adhesive layer, the back film being located between the substrate layer and the second adhesive layer, the second adhesive layer bonding the back film and the flexible circuit board, and the connecting portion also connecting the back film.

[0013] In the above embodiment, the second adhesive layer is used to fix the flexible circuit board. The thickness of the second adhesive layer is approximately the same as the thickness of the conductive layer. Both the thickness of the second adhesive layer and the conductive layer are relatively thin, thus omitting the thicker back adhesive layer found in related technologies.

[0014] In some possible embodiments of this application, the display assembly further includes a back film, a protective layer, and a second adhesive layer. The back film and the protective layer are both located between the substrate layer and the second adhesive layer. The second adhesive layer bonds the protective layer and the flexible circuit board. The connecting portion also connects the back film and the protective layer.

[0015] In the above embodiments, the protective layer has good elasticity and serves as a buffer to reduce the impact of external forces on the display screen assembly.

[0016] In some possible embodiments of this application, the display assembly further includes a driver chip located in the projection area of ​​the substrate layer along a first direction, and the driver chip and the flexible circuit board are electrically connected to the same surface of the conductive layer.

[0017] In the above embodiments, the driver chip and the conductive layer are electrically connected, and the display panel does not need to reserve an area for connecting the driver chip, which can reduce the area of ​​the display panel and reduce the manufacturing cost; there is no need to reserve excess glue space between the driver chip and the display panel, which can reduce the size of the black border area.

[0018] Secondly, this application provides a display assembly, including a display panel, a flexible circuit board, a conductive adhesive, and a conductive layer. The display panel includes a substrate layer and an electrode layer arranged along a first direction. The electrode layer includes a first surface and a second surface that are interconnected but not coplanar. The first surface is connected to the substrate layer. The conductive adhesive and the display panel are arranged along a second direction and electrically connected to the second surface. The conductive layer electrically connects the conductive adhesive and the flexible circuit board to conduct electricity between the electrode layer and the flexible circuit board.

[0019] In the above embodiments, the display panel does not have a bending portion, which effectively reduces the size of the black border area increased by the presence of the bending portion. Simultaneously, the protective adhesive is omitted, reducing both the size of the black border area increased by the presence of the protective adhesive and the size of the black border area increased by the reserved space for excess adhesive, thereby improving the screen-to-body ratio. Furthermore, the absence of a bending portion and a back panel in the display panel effectively reduces the overall area of ​​the display panel, which helps save costs. Moreover, the absence of a back panel in the display panel, along with the omission of the second back film and the use of a second adhesive layer instead of a thicker back adhesive, along the Z-axis direction, effectively saves the thickness of the back panel and the second back film, which helps reduce the overall thickness of the display assembly.

[0020] In some possible embodiments of this application, the conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The first conductive portion and the conductive adhesive are arranged along a second direction and are electrically connected to the conductive adhesive. The second conductive portion and the display panel are arranged along a first direction and are electrically connected to the flexible circuit board.

[0021] In the above embodiments, the conductive adhesive and the conductive layer work together to achieve conductivity between the display panel and the flexible circuit board; the conductive adhesive can achieve precise conductivity in one direction; the conductive layer can be bent to achieve conductivity in irregular structures.

[0022] In some possible embodiments of this application, the display assembly further includes a cover glass, an ink layer, and a protective adhesive. The cover glass is located on the side of the electrode layer away from the substrate layer, the ink layer is located on the surface of the cover glass facing the display panel, and the protective adhesive connects the ink layer, the conductive adhesive, and the conductive layer.

[0023] In the above embodiments, the protective adhesive covers the conductive adhesive and the end of the first conductive part that is away from the second conductive part, which can increase the connection reliability of the electrode layer, the conductive adhesive, and the first conductive part.

[0024] In some possible embodiments of this application, the display assembly further includes an optical adhesive, a polarizer, and a first adhesive layer, the optical adhesive, the polarizer, and the first adhesive layer being arranged along a first direction and located between the cover glass and the display panel, the protective adhesive also connecting the optical adhesive, and the conductive adhesive also connecting the polarizer and the first adhesive layer.

[0025] In the above embodiments, the protective adhesive serves to seal the sides, provide waterproofing, and prevent dust.

[0026] In some possible embodiments of this application, the display assembly further includes a back film and a second adhesive layer, the back film being located between the substrate layer and the second adhesive layer, the second adhesive layer bonding the back film and the flexible circuit board, and the conductive adhesive also connecting the back film.

[0027] In the above embodiment, the second adhesive layer is used to fix the flexible circuit board. The thickness of the second adhesive layer is approximately the same as the thickness of the conductive layer. Both the thickness of the second adhesive layer and the conductive layer are relatively thin, thus omitting the thicker back adhesive layer found in related technologies.

[0028] In some possible embodiments of this application, the display assembly further includes a back film, a protective layer, and a second adhesive layer, both of which are located between the substrate layer and the second adhesive layer, and the second adhesive layer bonds the protective layer and the flexible circuit board.

[0029] In the above embodiments, the protective layer has good elasticity and serves as a buffer to reduce the impact of external forces on the display screen assembly.

[0030] In some possible embodiments of this application, the display assembly further includes a driver chip located in the projection area of ​​the substrate layer along a first direction, and the driver chip and the flexible circuit board are electrically connected to the same surface of the conductive layer.

[0031] In the above embodiments, the driver chip and the conductive layer are electrically connected, and the display panel does not need to reserve an area for connecting the driver chip, which can reduce the area of ​​the display panel and reduce the manufacturing cost; there is no need to reserve excess glue space between the driver chip and the display panel, which can reduce the size of the black border area.

[0032] Thirdly, embodiments of this application provide a terminal device, including a display screen assembly.

[0033] In the above embodiments, the terminal device including the display screen component has the characteristics of small black border area and high screen ratio, as well as thinness and low manufacturing cost. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the terminal device provided in the embodiments of this application.

[0035] Figure 2 A cross-sectional schematic diagram of the terminal device provided in the embodiments of this application.

[0036] Figure 3 A schematic cross-sectional view of the display assembly before it is folded back, provided for related technologies.

[0037] Figure 4 A schematic diagram of the cross-section of a display assembly after it has been folded back, as provided for related technologies.

[0038] Figure 5 This is a cross-sectional schematic diagram of a display screen assembly provided in an embodiment of this application.

[0039] Figures 6 to 8 Provided for the embodiments of this application Figure 5 The diagram shows the assembly process of the display screen assembly.

[0040] Figure 9 A cross-sectional schematic diagram of a display assembly provided for other embodiments of this application.

[0041] Figure 10 A cross-sectional schematic diagram of a display assembly provided for some embodiments of this application.

[0042] Explanation of main component symbols

[0043]

[0044]

[0045] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0046] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0048] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0049] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the terminal device 200 provided in the embodiments of this application. The terminal device 200 is an electronic product with display function, including but not limited to mobile phones, tablet computers, and smart wearable devices. Mobile phones include but are not limited to flat-screen phones and foldable phones, and smart wearable devices include but are not limited to smart bracelets and smartwatches.

[0050] In this embodiment, the terminal device 200 is a flat-screen mobile phone. For ease of explanation, the thickness direction of the phone is defined as the first direction L1, and the length direction is defined as the second direction L2. The first direction L1 and the second direction L2 are different (i.e., intersecting). In this embodiment, the first direction L1 and the second direction L2 are perpendicular to each other. It is understood that in other embodiments, the coordinate system of the terminal device 200 can be flexibly set according to actual needs, and no specific limitation is made here. For example, the shape of the terminal device 200 can also be a square plate, a circular plate, an elliptical plate, or an irregular shape, etc., and no specific limitation is made here.

[0051] Please see Figure 2 , Figure 2 This is a cross-sectional schematic diagram of a terminal device 200 provided in an embodiment of this application. In this embodiment, the terminal device 200 may include a mid-frame 210, a battery 220, a motherboard 230, a back cover 240, and a display assembly 100. Figure 2 The illustrations show only a portion of the components of the terminal device 200, not all of them. In other embodiments, the specific components of the terminal device 200 may vary depending on the name and relative position of the specific terminal device 200.

[0052] The mid-frame 210 may include a mid-plate 201 and a bezel 202. The bezel 202 surrounds the mid-plate 201, and the bezel 202 and mid-plate 201 are fixed to each other. In this embodiment, the bezel 202 and mid-plate 201 may be integrally formed. The display assembly 100 and the back cover 240 are located on opposite sides of the mid-plate 201. The side where the display assembly 100 of the terminal device 200 is located is defined as the front, and the side where the back cover 240 is located is defined as the back. The display assembly 100 is connected to the front of the bezel 202, and the back cover 240 is connected to the back of the bezel 202. The battery 220 and the motherboard 230 are located between the mid-plate 201 and the back cover 240. The motherboard 230 and the battery 220 are arranged approximately along the second direction L2.

[0053] Battery 220 supplies power to electrical components such as motherboard 230 and display assembly 100. Display assembly 100 is electrically connected to motherboard 230 via a flexible circuit board (not shown) and performs display functions according to control signals from motherboard 230. The flexible circuit board can be connected to motherboard 230 via vias (not shown) formed in middle plate 201.

[0054] Please see Figure 3 and Figure 4 , Figure 3 A cross-sectional schematic diagram of the display assembly 100 before it is folded back, provided for the related technology. Figure 4 A schematic cross-sectional view of the display assembly 100 after being folded back, provided for related technologies. Figure 4 Specifically, it will Figure 3 A cross-sectional view of the display panel 20 of the display assembly 100 shown, with one end folded back to the rear.

[0055] The display assembly 100 may include a cover glass 10, an ink layer 19, an optical adhesive 11, a polarizer 12, an adhesive layer 13, a display panel 20, a first back film 141, a protective layer 15, a driver chip 16, a second back film 142, a flexible circuit board 17, and a protective adhesive 18. The display assembly 100 may be a flexible OLED (Organic Light-Emitting Diode) display, and may be packaged using COP (Chip On Plastic) encapsulation technology. Taking advantage of the bendable nature of flexible OLED displays, one end of the display assembly 100 is folded back. The display panel 20 includes a front panel portion 21, a bending portion 22, and a back panel portion 23, with the bending portion 22 connecting the front panel portion 21 and the back panel portion 23.

[0056] Before the display panel 20 is folded back, the cover glass 10, optical adhesive 11, polarizer 12, adhesive layer 13, front panel portion 21, first back film 141, and protective layer 15 are arranged along the first direction L1. The polarizer 12 and the front panel portion 21 can be bonded together by the adhesive layer 13. The ink layer 19 is located between the cover glass 10 and the optical adhesive 11. The bent portion 22 and the back panel portion 23 protrude from the optical adhesive 11, polarizer 12, first back film 141, and protective layer 15 along the second direction L2. The driver chip 16 and the flexible circuit board 17 are both electrically connected to the same surface of the back panel portion 23 and are connected to the surface of the back panel portion 23 facing the polarizer 12. The flexible circuit board 17 extends relative to the display panel 20 along the second direction L2. The second back film 142 is connected to the back panel portion 23 and is located on the opposite surfaces of the back panel portion 23 as the driver chip 16. The second back film 142 and the first back film 141 are connected to the same surface of the display panel 20. Protective adhesive 18 is applied to the surface of the bent portion 22 facing the polarizer 12, and is located between the adhesive layer 13 and the driver chip 16. Protective adhesive 18 is used to improve the stress after the bent portion 22 is folded back. Protective adhesive 18 is formed by a dispensing process, i.e., the liquid adhesive is cured. Before dispensing, a certain amount of excess adhesive space 181 needs to be reserved to ensure the uniformity of the thickness of the cured protective adhesive 18 on the surface of the bent portion 22. After dispensing, there can be a gap between the protective adhesive 18 and the driver chip 16, or it can be connected to the driver chip 16.

[0057] After the display panel 20 is folded back, the bending portion 22 bends and forms an arc shape. The protective adhesive 18 bends synchronously with the bending portion 22. The back panel portion 23 is folded back to one side of the front panel portion 21. The back panel portion 23 and the front panel portion 21 are arranged along the first direction L1. The second back film 142 and the protective layer 15 are connected. The driving chip 16 and the flexible circuit board 17 are both located in the projection area of ​​the front panel portion 21 along the first direction L1. The flexible circuit board 17 is fixed by the adhesive 171 and the protective layer 15. The adhesive 171 also serves to support the flexible circuit board 17. The thickness of the adhesive 171 is approximately the sum of the thicknesses of the second back film 142 and the back panel portion 23.

[0058] The assembly of the display assembly 100 may include the following steps: sequentially placing the cover glass 10, optical adhesive 11, polarizer 12, adhesive layer 13, display panel 20, and first back film 141 along the first direction L. The components are arranged and stacked, with the second back film 142 and the back panel portion 23 connected. The driver chip 16 and the flexible circuit board 17 are both bound to the surface of the back panel portion 23 opposite to the second back film 142, and the ends of the driver chip 16 and the flexible circuit board 17 are sealed with adhesive to fix them. Protective adhesive 18 is applied to the surface of the bent portion 22, and the two ends of the protective adhesive 18 arranged along the second direction L2 have gaps between them and the adhesive layer 13 and the driver chip 16, respectively. A protective layer 15 is attached to the surface of the first back film 141. The bent portion 22 of the display panel 20 is folded back so that the back panel portion 23 is located in the projection area of ​​the front panel portion 21 along the first direction L1. The flexible circuit board 17, the driver chip 16, and the second back film 142 move synchronously, and the second back film 142 is connected to the protective layer 15. The flexible circuit board 17 and the protective layer 15 are fixed with adhesive 171.

[0059] After the display assembly 100 is assembled, the display assembly 100 can be divided into a display area A and a black border area B. Figure 4 In a portion of the display assembly 100 shown, the display area A and the black border area B are arranged along the second direction L2. The black border area B can be divided into a wiring area B1 and a bending area B2, which are arranged along the second direction L2. The ink layer 19, the flexible circuit board 17, the driver chip 16, and the second back film 142 are all located in the wiring area B1.

[0060] Due to the presence of the bent portion 22 in the display panel 20, a protective adhesive 18 is applied to the surface of the bent portion 22 to adjust the stress of the bent portion 22 and prevent it from being damaged due to excessive stress. During the assembly of the display panel assembly 100, it is necessary to apply the protective adhesive 18 and fold the display panel 20 in reverse. After the display panel 20 is folded back, the bending portion 22 has a certain bending radius (approximately 0.2 mm), which needs to occupy the size of the display assembly 100 along the second direction L2, thereby increasing the size D1 of the black border area B of the display assembly 100. In addition, the thickness of the bending portion 22 (approximately 0.04 mm), the thickness of the protective adhesive 18 (approximately 0.09 mm), and the reserved space 181 for excess adhesive (increasing the size of the bending area B2 by approximately 0.1 mm) all further increase the size D1 of the black border area B. Furthermore, at the starting end of the bending portion 22, a buffer zone (approximately 0.07 mm) is also required to achieve a smooth transition of the display panel 20 from a flat surface to a curved surface. The setting of the buffer zone further increases the size D1 of the black border area B. It is equivalent to the size increase of the bending area B2 due to the setting of the bending portion 22 and the protective adhesive 18 being approximately 0.5 mm. After the display panel 20 is folded back, the thickness of the display assembly 100 along the first direction L1 needs to be calculated twice, and the thickness of the second back film 142 also needs to be added. The display panel 20 includes a substrate layer 24 and an electrode layer 25 stacked together. The substrate layer 24 and the electrode layer 25 are both located in the front panel portion 21, the bent portion 22 and the back panel portion 23, so the area of ​​the display panel 20 is larger and the manufacturing cost increases accordingly.

[0061] Please see Figure 5 , Figure 5 This is a cross-sectional schematic diagram of the display assembly 100a provided in an embodiment of this application. The display assembly 100a is divided into a display area A and a black border area B. The black border area B includes a wiring area B1, relative to... Figure 4 The display assembly 100 shown omits the bending area B2, thereby effectively reducing the size of the black border area B; at the same time, the protective adhesive 18 used to protect the bending part 22 and the overflow space 181 can also be omitted, further reducing the size of the black border area B; in addition, the thickness of the display assembly 100a and the manufacturing cost can also be reduced.

[0062] The display assembly 100a may include a cover glass 10, an ink layer 19, an optical adhesive 11, a polarizer 12, a first adhesive layer 131, a display panel 20a, a back film 143, a second adhesive layer 132, a flexible circuit board 17, a driver chip 16, a conductive layer 30a, and a protective adhesive 40a. The cover glass 10, ink layer 19, optical adhesive 11, polarizer 12, first adhesive layer 131, display panel 20a, back film 143, second adhesive layer 132, and flexible circuit board 17 are arranged along a first direction L1. The conductive layer 30a conducts electricity between the display panel 20a and the flexible circuit board 17. The protective adhesive 40a is located on the sides of the polarizer 12 and the display panel 20a, serving a protective function. The first adhesive layer 131 is located between the polarizer 12 and the display panel 20a, used to bond the polarizer 12 and the display panel 20a. The second adhesive layer 132 is located between the flexible circuit board 17 and the back film 143, and is used to bond the flexible circuit board 17 and the back film 143.

[0063] The cover glass 10 is typically the outermost element of the display assembly 100a, and the cover glass 10 protrudes in the second direction L2 from the optical adhesive 11, the polarizer 12, the display panel 20a and the back film 143. The cover glass 10 serves to protect the polarizer 12 and the display panel 20a, protecting them from physical damage such as scratches, impacts, and abrasions. The cover glass 10 isolates the internal components of the display assembly 100a from the external environment, reducing the corrosive effects of dust, moisture, oil, and other substances on the internal components, thus extending the lifespan of the display assembly 100a. The cover glass 10 has excellent optical properties and surface flatness, providing a smooth surface for touch operations, making touch and swiping operations on the display assembly 100a more precise and fluid, enhancing the user's touch experience. The cover glass 10 has high light transmittance, allowing maximum light transmission from the display panel 20a while reducing light reflection and refraction, thereby improving the clarity and viewing angle of the display assembly 100a, ensuring users can clearly see the content displayed on the display panel 20a under different angles and lighting conditions. In this embodiment, the thickness of the cover glass 10 is approximately 0.55 mm.

[0064] The ink layer 19 is located in the black border area B. Part of the ink layer 19 is located between the cover glass 10 and the optical adhesive 11, and the remaining part protrudes with the cover glass 10 relative to the optical adhesive 11. The ink layer 19 plays a role in blocking light.

[0065] Optical adhesive 11 is an optically transparent special double-sided adhesive, such as OCA (Optical Clear Adhesive). Optical adhesive 11 has the characteristics of high clarity, strong light transmittance, high adhesion, and good bonding strength. In this embodiment, the thickness of optical adhesive 11 is approximately 125 μm.

[0066] The polarizer 12 is located on the side of the display panel 20a facing the cover glass 10, and is bonded to the display panel 20a by the first adhesive layer 131. The main function of the polarizer 12 is to polarize light in a specific direction. When the display panel 20a is an LCD, the polarizer 12 is used to control the modulation of light by the liquid crystal molecules to achieve image display. When the display panel 20a is an organic light-emitting diode (OLED), due to its self-emissive characteristics, the polarizer 12 is not needed to achieve the display function; that is, the polarizer 12 and the first adhesive layer 131 can be omitted depending on the type of display panel 20a.

[0067] The display panel 20a includes a substrate layer 24a and an electrode layer 25a, which are arranged along a first direction L1. The electrode layer 25a is located on the surface of the substrate layer 24a facing the polarizer 12. The thickness of the display panel 20a is approximately 30 μm.

[0068] The substrate layer 24a can exist as a thin film, and its thickness can be between a few micrometers and tens of micrometers. As the bottom substrate, various functional layers, such as electrode layer 25a and organic light-emitting layer, can be sequentially formed on the surface of the substrate layer 24a. In this embodiment, the display panel 20a does not need to be folded back, therefore, the substrate layer 24a does not need to be bent. The material of the substrate layer 24a can be either flexible or rigid. Compared to the display panel 20, which requires folding back, the substrate layer 24a in this embodiment has a wider range of choices, and suitable materials can be selected according to specific application scenarios, such as polyimide (PI), polyethylene terephthalate (PET), glass, etc. In this embodiment, the substrate layer 24a includes two layers of PI, and its thickness is approximately 20 μm.

[0069] The electrode layer 25a can be a transparent conductive electrode, a metal electrode, etc. The electrode layer 25a is used to connect the display panel 20a to the external driving circuit, transmitting various control signals and power signals to ensure that the display panel 20a can accurately receive and execute instructions from the driving chip 16, enabling the entire display system to function normally. The electrode layer 25a is also used to control pixel display; for example, by applying different voltage signals, the electrode layer 25a can control the brightness and color of each pixel.

[0070] The electrode layer 25a includes a body portion 251a and a protruding portion 252a, which are connected to the body portion 251a and are arranged along the second direction L2. The body portion 251a is located between the first adhesive layer 131 and the substrate layer 24a. The protruding portion 252a is bonded to the first adhesive layer 131. The protruding portion 252a protrudes relative to the substrate layer 24a along the second direction L2, that is, the substrate layer 24a is recessed relative to the electrode layer 25a along the second direction L2.

[0071] The back film 143 is located on the surface of the substrate layer 24a opposite to the electrode layer 25a. The back film 143 lies within the projection area of ​​the substrate layer 24a along the first direction L1, i.e., along the second direction L2, and does not extend beyond the substrate layer 24a. The flexible circuit board 17 is located on the side of the back film 143 opposite to the display panel 20a, and the second adhesive layer 132 fixes the flexible circuit board 17 and the back film 143. The thickness of the back film 143 is approximately 88 μm.

[0072] The conductive layer 30a can be a chip-on-film (COF) film. The conductive layer 30a is bendable and can achieve conductivity in irregularly shaped structures. The conductive layer 30a includes a first conductive portion 31a, a connecting portion 32a, and a second conductive portion 33a. The connecting portion 32a connects the first conductive portion 31a and the second conductive portion 33a. The first conductive portion 31a connects to the surface of the protrusion 252a facing the substrate layer 24a. The connecting portion 32a connects the side of the substrate layer 24a and the side of the back film 143. The second conductive portion 33a is electrically connected to the flexible circuit board 17 to achieve conductivity between the flexible circuit board 17 and the display panel 20a. The connection between the first conductive portion 31a and the protrusion 252a facing the surface of the substrate layer 24a increases the connection area between the first conductive portion 31a and the protrusion 252a, thereby increasing the reliability of the electrical connection between the conductive layer 30a and the display panel 20a. The thickness of the second adhesive layer 132 is approximately the same as the thickness of the conductive layer 30a. The thickness of the second adhesive layer 132 and the second conductive portion 33a of the conductive layer 30a are both relatively thin. The thicker backing adhesive 171 in the related art is omitted.

[0073] A first included angle θ1 exists between the first conductive part 31a and the connecting part 32a. The first included angle θ1 can be in the range of 90°-170°, for example, 95°, 102°, 105°, 125°, 140°, 160°, or any value within the range of any two of the above values. A second included angle θ2 exists between the connecting part 32a and the second conductive part 33a. The second included angle θ2 can be in the range of 80°-120°, for example, 95°, 102°, 105°, 125°, 140°, 160°, or any value within the range of any two of the above values. Both the first conductive part 31a and the second conductive part 33a extend along the second direction L2. When the connecting part 32a intersects with the first conductive part 31a and the second conductive part 33a, the first included angle θ1 and the second included angle θ2 are equal within the error range. In this embodiment, both the first included angle θ1 and the second included angle θ2 are obtuse angles, which helps to ensure the uniformity of force on the first conductive part 31a, the connecting part 32a and the second conductive part 33a, and avoid stress concentration in the included angle area; in addition, it can increase the connection area between the connecting part 32a and the substrate layer 24a and the back film 143, thereby increasing the bonding strength.

[0074] The driver chip 16 is located on the side of the second conductive portion 33a opposite to the back film 143 and is electrically connected to the second conductive portion 33a. The driver chip 16 is located within the projection area of ​​the substrate layer 24a along the first direction L1, and the driver chip 16 and the flexible circuit board 17 are electrically connected to the same surface of the second conductive portion 33a. Since the driver chip 16 is electrically connected to the conductive layer 30a, the display panel 20a does not need to reserve an area for connecting the driver chip 16, which can reduce the area of ​​the display panel 20a and reduce manufacturing costs; there is no need to reserve an excess adhesive space 181 between the driver chip 16 and the display panel 20, which can reduce the size of the black border area B.

[0075] The protective adhesive 40a may include a first protective portion 41a and a second protective portion 42a, which are connected. The second protective portion 42a extends from the end of the first protective portion 41a away from the cover glass 10 toward the substrate layer 24a. The first protective portion 41a connects the ink layer 19, optical adhesive 11, polarizer 12, first adhesive layer 131, protrusion 252a, substrate layer 24a, and the side of the first conductive portion 31a. The second protective portion 42a covers the surface of the first conductive portion 31a away from the protrusion 252a and the connecting portion 32a. The protective adhesive 40a serves to provide side sealing, waterproofing, and dustproofing; simultaneously, the second protective portion 42a covers the first conductive portion 31a, increasing the connection reliability between the first conductive portion 31a and the protrusion 252a. The thickness of the first protective part 41a along the second direction L2 can be less than or equal to 0.1mm. The thickness of the first protective part 41a is small, so it has little impact on the size of the black border area B. The thickness of the second protective part 42a along the second direction L2 can be less than or equal to 0.1mm. The thickness of the second protective part 42a is small, and it is located in the recessed area of ​​the display panel 20, so it has no impact on the size of the black border area B and the thickness of the display assembly 100a.

[0076] In this embodiment, the conductive layer 30a used to connect the flexible circuit board 17 and the display panel 20a is located in the wiring area B1. This means the flexible circuit board 17 and the display panel 20a are connected via the wiring area B1. Compared to the display assembly 100, the display assembly 100a omits the bending area B2, i.e., omits the bending radius, the thickness of the bending portion 22, the thickness of the protective adhesive 18, the size of the overflow space 181, and the size of the buffer zone in related technologies. This effectively reduces the size of the black border area B, thereby increasing the screen-to-body ratio. Furthermore, the display panel 20a in this embodiment does not have the bending portion 22 and the back panel portion 23, which reduces the overall area of ​​the display panel 20a, thus saving costs. Moreover, the display panel 20a omits the back panel portion 23 and the second back film 142, and uses a second adhesive layer 132 instead of the thicker back adhesive 171 along the first direction L1. This effectively saves the thickness of the back panel portion 23 and the second back film 142, further reducing the overall thickness of the display assembly 100a.

[0077] Please see Figure 6 , Figure 7 and Figure 8 and combined Figure 5 The assembly of the display assembly 100a may include the following steps:

[0078] Step S1: Please refer to Figure 6The cover glass 10, ink layer 19, optical adhesive 11, polarizer 12, first adhesive layer 131, display panel 20a and back film 143 are arranged and stacked sequentially along the first direction L1, and the sides of optical adhesive 11, polarizer 12, first adhesive layer 131, display panel 20a and back film 143 are all on the same surface.

[0079] Step S2: Please refer to Figure 7 Laser processing is performed on the ends of the back film 143 and the substrate layer 24a of the display panel 20a to remove parts of the back film 143 and the substrate layer 24a, exposing the connection terminals of the electrode layer 25a.

[0080] Step S3: Please refer to Figure 8 The first conductive portion 31a of the conductive layer 30a is connected to the connection terminal of the electrode layer 25a. The connection portion 32a of the conductive layer 30a is connected to the side of the substrate layer 24a and the side of the back film 143. The second conductive portion 33a is connected to the surface of the back film 143 away from the substrate layer 24a. The driving chip 16 is bound to the second conductive portion 33a. Protective adhesive 40a is provided on the side of the optical adhesive 11, the polarizer 12, the first adhesive layer 131, and the electrode layer 25a. The protective adhesive 40a is connected to the ink layer 19 and also to the surface of the first conductive portion 31a away from the electrode layer 25a.

[0081] Step S4: Please refer to Figure 5 The flexible circuit board 17 is bonded to the back film 143 using the second adhesive layer 132, and the flexible circuit board 17 and the second conductive part 33a are bound together to conduct the flexible circuit board 17 and the display panel 20a.

[0082] The assembly steps of the display assembly 100a omit the steps of applying protective adhesive 18 and flipping the display panel 20a, which helps to reduce assembly costs.

[0083] Please see Figure 9 , Figure 9 This is a cross-sectional schematic diagram of a display assembly 100a' provided in some other embodiments of this application. Unlike display assembly 100a, display assembly 100a' may further include a protective layer 15. The protective layer 15 is located on the surface of the back film 143 facing away from the display panel 20a. A second adhesive layer 132 bonds the protective layer 15 and the flexible circuit board 17. A connecting portion 32a also connects to the protective layer 15. The protective layer 15 has good elasticity and serves as a buffer, reducing the impact of external forces on the display assembly 100a'. The protective layer 15 can be selectively included or omitted depending on the specific application scenario of the display assembly 100a'. When the display assembly 100a' includes the protective layer 15, the assembly steps of the display assembly 100a' correspondingly include the step of attaching the protective layer 15, which precedes the step of bonding the flexible circuit board 17 using the second adhesive layer 132.

[0084] Please see Figure 10 , Figure 10 This is a cross-sectional schematic diagram of a display assembly 100b provided in some embodiments of this application. The display assembly 100b may include a cover glass 10, an ink layer 19, an optical adhesive 11, a polarizer 12, a first adhesive layer 131, a display panel 20b, a back film 143, a protective layer 15, a second adhesive layer 132, a flexible circuit board 17, a driver chip 16, conductive adhesive 50b, a conductive layer 30b, and a protective adhesive 40b. The cover glass 10, ink layer 19, optical adhesive 11, polarizer 12, first adhesive layer 131, display panel 20b, back film 143, second adhesive layer 132, and flexible circuit board 17 are arranged along a first direction L1. The conductive adhesive 50b and conductive layer 30b conduct electricity between the display panel 20b and the flexible circuit board 17. The protective adhesive 40b is located on the sides of the polarizer 12 and the display panel 20b, serving a protective function. The first adhesive layer 131 is located between the polarizer 12 and the display panel 20b, and is used to bond the polarizer 12 and the display panel 20b. The second adhesive layer 132 is located between the flexible circuit board 17 and the protective layer 15, and is used to bond the flexible circuit board 17 and the protective layer 15.

[0085] In this embodiment, the display panel 20b includes a substrate layer 24b and an electrode layer 25b arranged along a first direction L1. The electrode layer 25b includes a first surface 253b and a second surface 254b that are interconnected but not coplanar. The first surface 253b is connected to the substrate layer 24b. The dimensions of the electrode layer 25b and the substrate layer 24b perpendicular to the first direction L1 are substantially the same.

[0086] The conductive adhesive 50b and the display panel 20b are arranged along the second direction L2. The conductive adhesive 50b is electrically connected to the second surface 254b and the conductive layer 30b. The conductive layer 30b is electrically connected to the flexible circuit board 17 to achieve conductivity between the flexible circuit board 17 and the display panel 20b.

[0087] The conductive adhesive 50b can be anisotropic conductive film (ACF), enabling precise conductivity in one direction and preventing short circuits between adjacent electrodes. The conductive adhesive 50b, polarizer 12, first adhesive layer 131, display panel 20b, back film 143, and protective layer 15 are arranged along the second direction L2. The conductive adhesive 50b connects the sides of the polarizer 12, the first adhesive layer 131, the display panel 20b, the back film 143, and the protective layer 15. The conductive adhesive 50b is electrically connected to the second surface 254b, which can increase the thickness of the electrode layer 25b along the first direction L1, thereby increasing the reliability of the electrical connection between the conductive adhesive 50b and the second surface 254b. In this embodiment, the conductive adhesive 50b enables electrical conductivity in the second direction L2 and planar insulation perpendicular to the second direction L2. The thickness of the conductive adhesive 50b along the second direction L2 can be less than or equal to 0.1 mm, for example, 0.03 mm to 0.07 mm.

[0088] The conductive layer 30b can be COF. The conductive layer 30b includes a first conductive portion 31b and a second conductive portion 33b interconnected, the first conductive portion 31b and the second conductive portion 33b being approximately L-shaped. The first conductive portion 31b is located on the side of the conductive adhesive 50b facing away from the display panel 20b, and the first conductive portion 31b and the conductive adhesive 50b are arranged along a second direction L2 and electrically connected to the conductive adhesive 50b; the second conductive portion 33b and the display panel 20b are arranged along a first direction L1 and electrically connected to the flexible circuit board 17. The thickness of the first conductive portion 31b along the second direction L2 can be less than or equal to 0.1mm, for example, 0.15mm-0.07mm; the thickness of the second conductive portion 33b along the first direction L1 can be less than or equal to 0.1mm, for example, 0.15mm-0.07mm.

[0089] The protective adhesive 40b connects the ink layer 19, optical adhesive 11, conductive adhesive 50b, and the surface of the first conductive portion 31b away from the conductive adhesive 50b. The conductive adhesive 50b connects the side of the polarizer 12, the side of the first adhesive layer 131, and the side of the display panel 20b, providing a certain degree of side sealing, waterproofing, and dustproofing. The protective adhesive 40b, connecting the optical adhesive 11, conductive adhesive 50b, and the first conductive portion 31b, further enhances these functions. Additionally, the protective adhesive 40b covers the ends of the conductive adhesive 50b and the first conductive portion 31b away from the second conductive portion 33b, increasing the connection reliability of the electrode layer 25b, conductive adhesive 50b, and the first conductive portion 31b. The thickness of the protective adhesive 40b along the second direction L2 can be slightly greater than the sum of the thicknesses of the conductive adhesive 50b and the first conductive portion 31b along the second direction L2, and a portion of the protective adhesive 40b can be located on the surface of the first conductive portion 31b away from the conductive adhesive 50b.

[0090] The display assembly 100b also includes a driver chip 16, which is located in the projection area of ​​the substrate layer 24b along the first direction L1. The driver chip 16 and the flexible circuit board 17 are electrically connected to the same surface of the second conductive part 33b.

[0091] In this embodiment, the flexible circuit board 17 and the display panel 20b are connected by conductive adhesive 50b and conductive layer 30b. The thickness of both conductive adhesive 50b and conductive layer 30b along the second direction L2 is relatively small, smaller than the size of the bending area B2 in related technologies, which can effectively reduce the size of the black border area B, thereby improving the screen-to-body ratio. In addition, the display panel 20b does not have a bending portion 22 and a back panel portion 23, which is equivalent to reducing the overall area of ​​the display panel 20b and saving costs. Furthermore, the display panel 20b does not have a back panel portion 23, and the second back film 142 is omitted. Instead, a second adhesive layer 132 is used to replace the thicker back adhesive 171 along the first direction L1, which is equivalent to saving the thickness of the back panel portion 23 and the second back film 142, which is beneficial to reducing the overall thickness of the display assembly 100b.

[0092] In this embodiment, no structures different from those in the previous embodiment are explicitly shown; the description of the previous embodiment can be used as well, and will not be repeated here. For example, the protective layer 15 can be selected or omitted depending on the specific application scenario of the display component 100b.

[0093] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A display screen assembly, characterized in that, include: The display panel includes a substrate layer and an electrode layer arranged along a first direction. The electrode layer includes a body portion and a protruding portion. The protruding portion and the body portion are arranged along a second direction, and the protruding portion protrudes from the substrate layer along the second direction. A flexible circuit board is located on the side of the substrate layer opposite to the body portion; as well as A conductive layer electrically connects the protrusion and the flexible circuit board to conduct electricity between the electrode layer and the flexible circuit board.

2. The display assembly according to claim 1, characterized in that, The conductive layer includes a first conductive portion, a connecting portion, and a second conductive portion. The connecting portion connects the first conductive portion and the second conductive portion. The first conductive portion connects to the surface of the protrusion facing the substrate layer. The connecting portion connects to the substrate layer. The second conductive portion is electrically connected to the flexible circuit board.

3. The display assembly according to claim 2, characterized in that, The display assembly further includes a cover glass, an ink layer, and a protective adhesive. The cover glass is located on the side of the electrode layer facing away from the substrate layer, and the ink layer is located on the surface of the cover glass facing the display panel. The protective adhesive includes a first protective portion and a second protective portion. The first protective portion covers the protrusion and the side of the substrate layer and connects to the ink layer. The second protective portion extends from the end of the first protective portion facing away from the ink layer toward the substrate layer and covers the surface of the first conductive portion facing away from the protrusion.

4. The display assembly according to claim 3, characterized in that, The display assembly further includes an optical adhesive, a polarizer, and a first adhesive layer. The optical adhesive, the polarizer, and the first adhesive layer are arranged along the first direction and located between the cover glass and the display panel. The first protective layer also connects the sides of the optical adhesive, the polarizer, and the first adhesive layer.

5. The display assembly according to claim 2, characterized in that, The display assembly further includes a back film and a second adhesive layer. The back film is located between the substrate layer and the second adhesive layer. The second adhesive layer bonds the back film and the flexible circuit board. The connecting portion also connects the back film.

6. The display assembly according to claim 2, characterized in that, The display assembly further includes a back film, a protective layer, and a second adhesive layer. The back film and the protective layer are both located between the substrate layer and the second adhesive layer. The second adhesive layer bonds the protective layer and the flexible circuit board. The connecting portion also connects the back film and the protective layer.

7. The display assembly according to any one of claims 1-6, characterized in that, The display assembly further includes a driver chip located in the projection area of ​​the substrate layer along the first direction, and the driver chip and the flexible circuit board are electrically connected to the same surface of the conductive layer.

8. A display screen assembly, characterized in that, include: The display panel includes a substrate layer and an electrode layer arranged along a first direction. The electrode layer includes a first surface and a second surface that are interconnected but not coplanar, and the first surface is connected to the substrate layer. A flexible circuit board is located on the side of the substrate layer opposite to the electrode layer; The conductive adhesive and the display panel are arranged along the second direction and electrically connected to the second surface; as well as A conductive layer electrically connects the conductive adhesive and the flexible circuit board to conduct electricity between the electrode layer and the flexible circuit board.

9. The display assembly according to claim 8, characterized in that, The conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The first conductive portion and the conductive adhesive are arranged along the second direction and are electrically connected to the conductive adhesive. The second conductive portion and the display panel are arranged along the first direction and are electrically connected to the flexible circuit board.

10. The display assembly according to claim 8, characterized in that, The display assembly further includes a cover glass, an ink layer, and a protective adhesive. The cover glass is located on the side of the electrode layer away from the substrate layer, the ink layer is located on the surface of the cover glass facing the display panel, and the protective adhesive connects the ink layer, the conductive adhesive, and the conductive layer.

11. The display assembly according to claim 10, characterized in that, The display assembly further includes an optical adhesive, a polarizer, and a first adhesive layer. The optical adhesive, the polarizer, and the first adhesive layer are arranged along the first direction and located between the cover glass and the display panel. The protective adhesive also connects the optical adhesive, and the conductive adhesive also connects the polarizer and the first adhesive layer.

12. The display assembly according to claim 8, characterized in that, The display assembly further includes a back film and a second adhesive layer. The back film is located between the substrate layer and the second adhesive layer. The second adhesive layer bonds the back film and the flexible circuit board. The conductive adhesive also connects the back film.

13. The display assembly according to claim 8, characterized in that, The display assembly further includes a back film, a protective layer, and a second adhesive layer. The back film and the protective layer are both located between the substrate layer and the second adhesive layer. The second adhesive layer bonds the protective layer and the flexible circuit board.

14. The display assembly according to any one of claims 8-13, characterized in that, The display assembly further includes a driver chip located in the projection area of ​​the substrate layer along the first direction, and the driver chip and the flexible circuit board are electrically connected to the same surface of the conductive layer.

15. A terminal device, characterized in that, Includes the display assembly as described in any one of claims 1-14.

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