Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a flexible display panel, a first substrate and a second substrate. The flexible display panel comprises a first part, a bending part and a second part in sequence. The first substrate is located on one side of the first part facing the second part. The second substrate is located on one side of the second part facing the first part. A buffer structure is located on one side of the bending part facing the first substrate and connected with the bending part. A surface of the buffer structure connected with the bending part is a first surface. The minimum distance between the first surface and the first substrate is greater than zero. The minimum distance between the first surface and the second substrate is greater than zero. Along the bending direction of the bending part, the distance between the buffer structure and the first substrate is equal to the distance between the buffer structure and the second substrate. The display module provided by the application reduces the probability of fracture of the metal layer of the bending part of the flexible display panel and improves the pressure resistance of the flexible display panel at the bending part.

Description

Technical Field

[0001] This application relates to the field of displays, and more particularly to a display module and display device. Background Technology

[0002] To meet market demands and enhance the consumer experience, the bezel width of display panels needs to be increasingly narrow. To achieve ultra-narrow bezels, terminal bending technology has emerged. Terminal bending technology refers to the process of bending the terminal area (also known as the bonding area or pad area) of the display panel to the side of the display panel away from the cover plate.

[0003] In the terminal bending process, with the further development of ultra-narrow bezels in display panels, the bending radius of the display panel needs to be further reduced. However, the reduction of the bending radius can easily lead to the breakage of the metal layer in the bending area, and flexible display panels are more prone to breakage during pressure testing, thereby increasing the risk of display abnormalities in the display panel.

[0004] The information disclosed in this section is only for understanding the background of the concept of the present invention, and therefore may contain information that does not form prior art. Summary of the Invention

[0005] In view of this, embodiments of this application provide a display module and a display device to reduce the probability of metal layer breakage in the bent portion of a flexible display panel and to improve the compressive strength of the flexible display panel in the bent portion.

[0006] In a first aspect, a display module includes: a flexible display panel, a first substrate, and a second substrate. The flexible display panel includes a first portion, a bent portion, and a second portion that are sequentially adjacent to each other; the first substrate is located on the side of the first portion facing the second portion; the second substrate is located on the side of the second portion facing the first portion; a buffer structure is located on the side of the bent portion facing the first substrate and is connected to the bent portion; wherein the surface of the buffer structure connected to the bent portion is a first surface, the minimum distance between the first surface and the first substrate is greater than zero, and the minimum distance between the first surface and the second substrate is greater than zero; along the bending direction of the bent portion, the distance between the buffer structure and the first substrate is equal to the distance between the buffer structure and the second substrate.

[0007] In one possible implementation of the first aspect, the length of the bent portion is L along the bending direction, and the length of the first surface is K1, wherein K1 = (0.3~0.4). L.

[0008] In one possible implementation of the first aspect, the buffer structure is a one-piece molded structure.

[0009] In one possible implementation of the first aspect, the buffer structure includes a first structure and a second structure, the second structure being located on the side of the first structure away from the bent portion, along a direction perpendicular to the plane of the first substrate, and the length of the first structure being less than or equal to the length of the second structure.

[0010] In one possible implementation of the first aspect, the buffer structure includes a second surface opposite to the first surface; wherein the second surface is planar, or the second surface includes a curved surface.

[0011] In one possible implementation of the first aspect, the height H of the buffer structure along the direction from the first surface toward the second surface satisfies: H < 0.06 L, where L is the length of the bent portion along its bending direction.

[0012] In one possible implementation of the first aspect, the maximum length K2 of the buffer structure along the direction from the first substrate to the second substrate satisfies: K2 = (0.3~0.4) L, where L is the length of the bent portion along its bending direction.

[0013] In one possible implementation of the first aspect, the buffer structure includes a foam structure and an elastic structure, the elastic structure being located on the side of the foam structure opposite to the bent portion; the foam structure and the elastic structure are in contact; the elastic modulus of the elastic structure is 0.01 MPa ~ 50 MPa.

[0014] In one possible implementation of the first aspect, the buffer structure includes a hole whose axial direction is perpendicular to the direction in which the bent portion faces the buffer structure and perpendicular to the direction in which the first substrate faces the second substrate.

[0015] In one possible implementation of the first aspect, the buffer structure further includes foam located within the hole.

[0016] In one possible implementation of the first aspect, the surface of the buffer structure facing away from the bent portion contacts the first substrate and the second substrate, respectively.

[0017] In one possible implementation of the first aspect, the length L of the bent portion along its bending direction satisfies: L = (1.2~1.4) π D / 2, where D is the distance between the first part and the second part.

[0018] Secondly, embodiments of this application also provide a display device, including the display module provided in the first aspect.

[0019] In the display module provided in this embodiment, the minimum distance between the first surface and the first substrate / second substrate is greater than zero. This helps to avoid the bending portion squeezing the buffer structure during the bending process of the flexible display panel. Squeezing the buffer structure during bending causes a compressive reaction force from the buffer structure, resulting in a large bending force in the bending area. This large bending force can easily cause warping at the connection point between the first part (or the second part) and the bending portion, i.e., splitting between the flexible circuit board and the first substrate (or the second part) near the connection point. Furthermore, the centerline of the buffer structure coincides with the centerline between the first substrate and the second substrate, ensuring that the buffer structure only functions in the necessary areas during bending, thus providing targeted support without affecting the bending process. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a display module provided in an embodiment of this application; Figure 2 This application provides a schematic diagram of a display module before bending, as shown in the embodiment of the present application. Figure 3 A schematic diagram of a buffer structure provided in an embodiment of this application; Figure 4 A schematic diagram of a buffer structure provided in an embodiment of this application; Figure 5a A schematic diagram of a buffer structure provided in an embodiment of this application; Figure 5b A schematic diagram of a buffer structure provided in an embodiment of this application; Figure 6 A schematic diagram of a buffer structure provided in an embodiment of this application; Figure 7 This application provides a schematic diagram of a display module before bending, as shown in the embodiment of the present application. Figure 8 This application provides a schematic diagram of a display module before bending, as shown in the embodiment of the present application. Figure 9This application provides a schematic diagram of a display module before bending, as shown in the embodiment of the present application. Figure 10 This is a schematic diagram of a display module provided in an embodiment of this application; Figure 11 This is a schematic diagram of a display module provided in an embodiment of this application; Figure 12 This is a schematic diagram of a display module provided in an embodiment of this application; Figure 13 This is a schematic diagram of a display module provided in an embodiment of this application; Figure 14 This is a schematic diagram of a display device provided in an embodiment of this application.

[0022] Label Explanation 100. Display module; 110. Flexible display panel; 111. First part; 112. Bending part; 113. Second part; 101. First substrate; 102. Second substrate; 120. Buffer structure; 121. First structure; 1211. First surface; 122. Second structure; 1221. Second surface; 123. Foam structure; 124. Elastic structure; 103. Foam; 104. Polarizing film; 105. Optical adhesive; 106. Cover plate; 107. Double-sided adhesive; 108. Adhesive layer; 200. Display device. Detailed Implementation

[0023] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0024] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0025] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0027] To address the aforementioned problems, this application provides a display module and display device to solve these issues. The inventive concept of this application can be summarized as follows: by providing a buffer structure at the opening of the supporting substrate, with the center of the buffer structure coinciding with the center of the opening of the supporting substrate, a symmetrical structure is formed after bending, thereby balancing the forces acting on the buffer structure and achieving the purpose of protecting the metal layer in the bending area and improving the compressive strength of the bending area.

[0028] Specifically, such as Figure 1 As shown, this application embodiment provides a display module 100, including: a flexible display panel 110, a first substrate 101, and a second substrate 102. The second substrate 102 and the first substrate 101 serve to support the flexible display panel 110. Figure 2 As shown, in the manufacturing process of the display module 100, the first substrate 101 and the second substrate 102 are each part of the support substrate 1001. In order to achieve an extremely narrow bezel, the flexible display panel 110 needs to be bent to create an opening in the support substrate 1001. That is, a portion of the substrate is removed from the support substrate to form an opening at that location, and the first substrate 101 and the second substrate 102 are formed on both sides of the opening.

[0029] like Figure 1 As shown, the flexible display panel 110 includes a first portion 111, a bent portion 112, and a second portion 113 that are sequentially adjacent to each other. For example, the first portion 111 is located on the light-emitting side of the display module 100, the second portion 113 is located on the backlight side of the display module 100, and the bent portion 112 is located between the first portion 111 and the second portion 113, and is bent.

[0030] like Figure 1 As shown, the first substrate 101 is located on the side of the first portion 111 facing the second portion 113. The first substrate 101 is located on the backlight side of the flexible display panel 110, and the first substrate 101 is bonded to the first portion 111 of the flexible display panel 110.

[0031] like Figure 1 As shown, the second substrate 102 is located on the side of the second portion 113 facing the first portion 111. The second substrate 102 is located on the backlight side of the flexible display panel 110, and the second substrate 102 is bonded to the second portion 113 of the flexible display panel 110.

[0032] The buffer structure 120 is located on the side of the bent portion 112 facing the first substrate 101 and is connected to the bent portion 112. The buffer structure 120 is located on the backlight side of the flexible display panel 110 and is connected to the bent portion 112. For example, the buffer structure 120 is attached to the bent portion 112 of the flexible display panel 110; in one possible implementation, an adhesive is included between the buffer structure 120 and the flexible display panel 110, and the adhesive bonds the buffer structure 120 to the flexible circuit board; the adhesive can be a pressure-sensitive adhesive.

[0033] like Figure 1 As shown, the surface where the buffer structure 120 connects to the bent portion 112 is the first surface 1211. The minimum distance between the first surface 1211 and the first substrate 101 is greater than zero, meaning the area of ​​the bent portion 112 is greater than the area of ​​the first surface 1211. The first surface 1211 does not completely fill the bent portion 112, leaving a gap in the bent portion 112 to prevent the bent portion 112 from squeezing the buffer structure 120 during bending 13 in the fabrication process of the flexible display panel 110. The squeezing of the buffer structure 120 by the bent portion 112 during bending will cause the buffer structure 120 to have a squeezing reaction force on the bent portion 112, resulting in a large bending force in the bending area. A large bending force in the bending area can easily cause warping at the connection position between the first portion 111 and the bent portion 112, that is, splitting between the flexible circuit board and the first substrate 101 near the connection position between the first portion 111 and the bent portion 112.

[0034] like Figure 1 or Figure 2 As shown, the minimum distance between the first surface 1211 and the second substrate 102 is greater than zero. That is, the bent portion 112 leaves a gap between the buffer structure 120 and the second substrate 102 to avoid the bent portion 112 pressing against the buffer structure 120 when the flexible display panel 110 is bent during the manufacturing process of the flexible display panel 110. When the bent portion 112 presses against the buffer structure 120 during bending, it will cause the buffer structure 120 to have a compressive reaction force on the bent portion 112, resulting in a large bending force in the bending area. The large bending force in the bending area is likely to cause warping at the connection position between the second portion 113 and the bent portion 112, that is, splitting between the flexible circuit board and the second substrate 102 near the connection position between the second portion 113 and the bent portion 112.

[0035] like Figure 1As shown, along the bending direction of the bent portion 112, the distance between the buffer structure 120 and the first substrate 101 is equal to the distance between the buffer structure 120 and the second substrate 102. This means that the centerline L1 of the buffer structure 120 coincides with the centerline L1' between the first substrate 101 and the second substrate 102. The centerline of the buffer structure 120 is parallel to the plane of the first substrate 101 and passes through the midpoint of the buffer structure 120 in the first direction X, which is perpendicular to the plane of the first substrate 101. In other words, in the manufacturing process of the display module 100, the centerline of the buffer structure 120 coincides with the centerline of the substrate opening. It should be understood that, as... Figure 2 As shown, in the manufacturing process of the display module 100, and before the flexible display panel 110 is bent, the center line L1 of the buffer structure 120 is parallel to the first direction X. The center line L1 of the buffer structure 120 coincides with the center line L1' between the first substrate 101 and the second substrate 102, ensuring that the buffer structure 120 only functions in the necessary areas during the bending process, without affecting the bending process, and can provide targeted support.

[0036] Combination Figures 1 to 3 In one possible implementation, the length of the bent portion 112 is L along the bending direction of the bent portion 112, and the length of the first surface 1211 is K1, where K1 = (0.3~0.4). L. (e.g.) Figure 2 As shown, the length L of the bent portion 112 can be understood as the length of the opening of the support substrate 1001 in the second direction Y.

[0037] K1 = 0.3L~0.4L, meaning the length of the buffer structure 120 in the bending direction is 30% to 40%. Controlling the length of the buffer structure 120 in the bending direction to between 30% and 40% of the total length of the bending portion 112 ensures sufficient support area without excessively hindering the bending process. If K1 is too small (<0.3L), the support effect is insufficient; if K1 is too large (>0.4L), it will hinder bending, increase the difficulty of bending, and may lead to metal layer breakage. Experimental data shows that within this range, the maximum strain of the metal layer can be reduced by approximately 3% in the terminal bending process and by approximately 10% in the extrusion test.

[0038] like Figure 3 or Figure 4 As shown, in one possible implementation, the buffer structure 120 is a one-piece molded structure.

[0039] In this implementation, the buffer structure 120 adopts a one-piece molded structure. This one-piece molded structure eliminates the connection gaps and interface problems that may exist in a split structure, improving overall stability and reliability. Furthermore, the one-piece molded structure avoids the tolerance accumulation problems that may arise from assembling multiple components, ensuring the consistency and predictability of buffer performance. At the same time, the one-piece molded structure simplifies the manufacturing process, reduces production costs, and decreases potential failure points, thereby improving the long-term reliability of the product.

[0040] like Figures 4 to 6 As shown, in one possible implementation, the buffer structure 120 includes a first structure 121 and a second structure 122. The second structure 122 is located on the side of the first structure 121 away from the bent portion 112, along a direction perpendicular to the plane of the first substrate 101. The length of the first structure 121 is less than or equal to the length of the second structure 122.

[0041] In this implementation, the length of the first structure 121 is equal to the length of the second structure 122, which helps to reduce the design difficulty and manufacturing cost of the product. The first structure 121, closer to the bending portion 112, is shorter, reducing interference with the bending process; the second structure 122, farther from the bending portion 112, is longer, providing stronger support. Furthermore, this gradual structural design makes the stress distribution more uniform, avoiding localized stress concentration, and effectively dispersing pressure, especially under external compression. Experimental verification shows that compared to a single-thickness buffer layer, having the first structure 121 shorter than the second structure 122 can improve the compression resistance by approximately 15%.

[0042] like Figure 4 or Figure 5a As shown, in one possible implementation, the first structure 121 is made of the same material as the second structure 122, and the buffer structure 120 is a one-piece molded structure. It should be understood that the first structure 121 and the second structure 122 in the buffer structure 120 are two parts artificially divided for the convenience of describing the shape of the buffer structure 120.

[0043] In this configuration, along a direction perpendicular to the plane of the first substrate 101, the length of the first structure 121 is equal to the length of the second structure 122. For example, as shown... Figure 5a As shown, the first structure 121 is a cylindrical structure, and the second structure 122 is a spherical structure; or, as... Figure 5b As shown, the first structure 121 is a cuboid structure, and the second structure 122 is a semi-cylindrical structure.

[0044] like Figure 4As shown, along the direction perpendicular to the plane where the first substrate 101 is located, the length of the first structure 121 is less than the length of the second structure 122. For example, the buffer structure 120 is a mushroom-shaped structure or an umbrella-shaped structure, wherein the first structure 121 is the umbrella handle portion and the second structure 122 is the umbrella surface portion.

[0045] like Figure 6 As shown, in one possible implementation, the materials of the first structure 121 and the second structure 122 are different. The first structure 121 and the second structure 122 are bonded together by an adhesive layer 108. The adhesive layer 108 includes a pressure-sensitive adhesive; in one possible implementation, the adhesive layer 108 also includes a PET (polyethylene terephthalate) film, with the pressure-sensitive adhesive located on both sides of the PET film. Specifically, the pressure-sensitive adhesive on the PET film facing the first structure 121 is used to bond the PET film and the first structure 121, and the pressure-sensitive adhesive on the PET film facing the second structure 122 is used to bond the PET film and the second structure 122.

[0046] In this implementation, the different materials of the first structure 121 and the second structure 122 result in a layered design for the buffer structure 120. This layered design allows the buffer structure 120 to provide differentiated support for different areas. It should be understood that, in addition to the composite structure described above, the buffer structure 120 can also be a composite structure combining multiple materials, such as: PSA + foam + PSA + silicone, or PSA + PET + PSA + silicone, or PSA + silicone + PSA + PET. The silicone and foam can also use materials with an elastic modulus between 0.01 and 50 MPa, and the PET can also use materials with an elastic modulus between 50 and 5000 MPa. PSA refers to pressure-sensitive adhesive.

[0047] In one possible implementation, the maximum length of the buffer structure 120 along the axial direction Z of the bent portion 112 is equal to the length of the bent portion 112. That is, as... Figure 7 As shown, the display module 100 includes a buffer structure 120, which extends through the bent portion 112 along its axial direction. This design reduces the difficulty of attaching the buffer structure 120 to the bent portion 112, thereby saving production costs.

[0048] In one possible implementation, such as Figure 8As shown, the display module 100 includes a buffer structure 120. Along the axial direction Z of the bent portion 112, the maximum length of the buffer structure 120 is less than the length of the bent portion 112. For example, along the axial direction Z of the bent portion, the minimum distances from both sides of the buffer structure 120 to the edge of the flexible display panel 110 are the same. This design helps to balance the forces during bending and disperse stress.

[0049] like Figure 9 As shown, in one possible implementation, the display module 100 includes a plurality of buffer structures 120 arranged along the axial direction Z of the bent portion 112. For example, the plurality of buffer structures 120 are evenly arranged along the axial direction Z of the bent portion 112. This design can reduce the contact area between the bent portion 112 and the buffer structures 120, thereby reducing the rebound force of the buffer structures 120 on the bent portion 112 during the terminal bending process, thus helping to protect the metal layer of the bent portion 112.

[0050] like Figure 3 In one possible implementation, the buffer structure 120 includes a second surface 1221, which is opposite to the first surface 1211. The second surface 1221 is planar, and planar design is simple and easy to implement, suitable for standardized production, applicable to common bending scenarios, and cost-effective.

[0051] like Figure 4 As shown, in one possible implementation, the buffer structure 120 includes a second surface 1221, which is opposite to the first surface 1211. The second surface 1221 includes a curved surface, for example, a cylindrical surface, a spherical surface, an ellipsoidal surface, etc. In this implementation, the curved surface design of the second surface 1221 can be customized according to the actual bending radius, which can better fit the bending shape, provide a more uniform stress distribution, and avoid local stress concentration. In addition, in applications with small bending radii, the curved surface design of the second surface 1221 can further reduce the strain of the metal layer by about 2-3%, significantly improving the bending performance.

[0052] In one possible implementation, the height H of the buffer structure 120 along the direction from the first surface 1211 toward the second surface 1221 satisfies: H < 0.06 L, where L is the length of the bent portion 112 along its bending direction.

[0053] In this implementation, the height of the buffer structure 120 is limited to within 6% of the length L of the bent portion 112, ensuring that the buffer structure 120 is not too tall and thus does not hinder the bending process. When H > 0.06L, the buffer structure 120 will hinder bending, resulting in an increase in bending force. This range has been verified through simulation and achieves the best balance between bending performance and compression resistance.

[0054] like Figure 4 As shown, in one possible implementation, the maximum length K2 of the buffer structure 120 along the direction from the first substrate 101 toward the second substrate 102 satisfies: K2 = (0.3~0.4) L, where L is the length of the bent portion 112 along its bending direction. K2 can be the maximum length of the second structure 122 in the direction from the first substrate 101 to the second substrate 102. K2 ≥ K1.

[0055] In this implementation, the width of the buffer structure 120 in the direction from the first substrate 101 to the second substrate 102 is 30%-40% of the length L of the bent portion 112, ensuring that the buffer structure 120 provides an appropriate support area in the width direction. Furthermore, maintaining this ratio between the maximum width of the buffer structure 120 and the length of the bent portion 112 ensures that the buffer structure 120 has sufficient width to withstand external pressure without excessively occupying space and affecting the layout of other components. Actual testing shows that when K2 is within this range, the overall rigidity of the module increases by approximately 18%, while maintaining good bending performance.

[0056] like Figure 6 As shown, in one possible implementation, the cushioning structure 120 includes a foam structure 123 and an elastic structure 124, with the elastic structure 124 located on the side of the foam structure 123 opposite to the bent portion 112. The foam structure 123 and the elastic structure 124 are in contact. The elastic modulus of the elastic structure 124 is 0.01 MPa to 50 MPa. For example, the first structure 121 is the foam structure 123, and the second structure 122 is the elastic structure 124.

[0057] In this implementation, the foam structure 123 provides good initial cushioning performance and lightweight, while the elastic structure 124 provides the necessary support. The combination of these two elements achieves a "soft and hard" cushioning effect. The elastic modulus is selected within the range of 0.01-50 MPa to ensure that the material has sufficient elasticity to absorb impact energy and sufficient rigidity to maintain structural integrity. Experimental data show that the combined structure reduces the metal layer strain by approximately 12% compared to the single material during extrusion testing and by approximately 3.5% during bending.

[0058] like Figure 10 As shown, in one possible implementation, the buffer structure 120 includes a hole whose axis is perpendicular to the direction of the bent portion 112 toward the buffer structure 120 and perpendicular to the direction of the first substrate 101 toward the second substrate 102.

[0059] In this implementation, the perforated design effectively reduces the weight of the buffer structure 120 while providing additional deformation space, allowing the buffer structure 120 to deform more flexibly under pressure. Furthermore, the perforated structure helps disperse stress and avoid localized stress concentration, exhibiting particularly superior performance under uneven external forces. Simulation results show that the perforated buffer structure 120 reduces the metal layer strain by approximately 5% compared to the solid structure under the same pressure.

[0060] like Figure 11 As shown, in one possible implementation, the buffer structure 120 also includes foam 103 located within the holes.

[0061] In this implementation, the foam 103 filling the pores combines the advantages of the porous structure with the elastic properties of the foam 103, enabling the buffer structure 120 to deform more uniformly under pressure. Simultaneously, the foam 103 filling enhances the elastic response of the pore area, allowing it to effectively absorb energy during compression and reduce stress transmitted to the bending area. Tests show that the buffer structure 120 with foam 103 filling the pores improves compression resistance by approximately 8% compared to a simple porous structure, while maintaining good bending performance.

[0062] like Figure 1 or Figure 12 As shown, in one possible implementation, the surface of the buffer structure 120 facing away from the bent portion 112 contacts the first substrate 101 and the second substrate 102, respectively. Wherein, Figure 1 In the first direction X, the maximum length of the buffer structure 120 is equal to the length of the first surface 1211; Figure 12 In the first direction X, the maximum length of the buffer structure 120 is greater than the length of the first surface 1211.

[0063] In this implementation, the buffer structure 120 is in direct contact with the first substrate 101 / second substrate 102, which can evenly transmit external pressure to both substrates, avoiding the risk of breakage caused by excessive local stress on the buffer structure 120. Moreover, when subjected to compression, the buffer structure 120 can form a complete "support-buffer-support" path, significantly improving the overall rigidity of the module. In actual testing, this design increases the module's compression resistance by approximately 25% without affecting bending performance, perfectly balancing the two requirements.

[0064] like Figure 13 As shown, in one possible implementation, the distance between the surface of the buffer structure 120 away from the bent portion 112 (i.e., the second surface) and the first substrate 101 is greater than zero, and the minimum distance between the surface of the buffer structure 120 away from the bent portion 112 (i.e., the second surface) and the second substrate 102 is greater than zero. This design provides a compression space to facilitate stress dispersion.

[0065] In one possible implementation, the length L of the bent portion 112 along its bending direction satisfies: L = (1.2 ~ 1.4) π D / 2, where, as Figure 1 As shown, D is the distance between the first part 111 and the second part 113.

[0066] In this implementation, the relationship between L and D satisfies the above formula, ensuring that the length of the bent portion 112 is in a reasonable proportion to the substrate spacing D, and that the bending radius R ≈ 0.5. (BP thickness) (2 + double-sided adhesive thickness + SCF thickness); where BP is the first substrate 101 / second substrate 102, the double-sided adhesive thickness includes two layers of double-sided adhesive, one layer 107 is used to bond the SCF to the second substrate 102, and the other layer 107 is also used to bond the first substrate 101 and the SCF, where SCF is foam 103. In this implementation, the length of the bent portion 112 is precisely controlled, avoiding both excessively small bending radii that could cause metal layer breakage and excessively large bending radii that would waste space. According to simulation data, the L value calculated using this formula can reduce the metal layer strain in the bending process by approximately 4%, significantly improving the yield.

[0067] like Figure 1 As shown, the display module 100 also includes a polarizer 104, an optical adhesive 105, and a cover plate 106, which are stacked sequentially on the light-emitting side of the flexible display panel 110. The polarizer 104 is used to filter ambient light and improve light emission efficiency, and the optical adhesive 105 fixes the cover plate 106, which is used to protect the flexible display panel.

[0068] like Figure 14 As shown, this application embodiment also provides a display device 200, including the display module 100 provided in any of the foregoing embodiments.

[0069] The display device 200 provided in this embodiment can be a display terminal, such as a mobile phone, computer, monitor, television, smart wearable, advertising display screen, vehicle display, etc.

[0070] In this embodiment, the display module 100 described above is applied to the display device 200, significantly improving the reliability and durability of the entire device. Particularly in flexible display devices such as foldable and curved screens, the display module 100 provided in the aforementioned embodiment helps to significantly reduce the failure rate under bending and compression conditions. Therefore, using the display module 100 provided in the aforementioned embodiment can improve the overall performance of the display device 200. This improved overall performance results in a longer lifespan for the terminal product, a better user experience, and stronger market competitiveness.

[0071] The embodiments of this application also need to be explained as follows: (1) The accompanying drawings corresponding to the embodiments of this application only involve the structures involved in the embodiments of this application. Other structures can be referred to the general design.

[0072] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of this application, i.e., these drawings are not drawn to actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "above" or "below" another element, the element may be "directly" located "above" or "below" the other element or there may be intermediate elements.

[0073] (3) Where there is no conflict, the embodiments of this application and the features in the embodiments can be combined with each other to obtain new embodiments. The new embodiments still fall within the scope of disclosure of the embodiments of this application, and the new embodiments can provide support for the protection scope that this application wants to achieve.

[0074] (4) For the same or similar parts between the various embodiments or implementations in this specification, please refer to each other. In particular, for the device embodiments and terminal embodiments, since they are basically similar to the method embodiments or implementations, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

[0075] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the protection scope of the embodiments of this application.

Claims

1. A display module, characterized in that, include: A flexible display panel includes a first part, a bent part, and a second part that are sequentially adjacent to each other. The first substrate is located on the side of the first portion facing the second portion; The second substrate is located on the side of the second portion facing the first portion; A buffer structure is located on the side of the bent portion facing the first substrate and connected to the bent portion; wherein the surface of the buffer structure connected to the bent portion is a first surface, the minimum distance of the first surface from the first substrate is greater than zero, and the minimum distance of the first surface from the second substrate is greater than zero; Along the bending direction of the bent portion, the distance between the buffer structure and the first substrate is equal to the distance between the buffer structure and the second substrate.

2. The display module according to claim 1, characterized in that, Along the bending direction of the bent portion, the length of the bent portion is L, and the length of the first surface is K1, wherein K1 = (0.3~0.4). L.

3. The display module according to claim 1, characterized in that, The buffer structure is a one-piece molded structure.

4. The display module according to claim 1, characterized in that, The buffer structure includes a first structure and a second structure. The second structure is located on the side of the first structure away from the bent portion, along a direction perpendicular to the plane of the first substrate. The length of the first structure is less than or equal to the length of the second structure.

5. The display module according to claim 1, characterized in that, The buffer structure includes a second surface opposite to the first surface; wherein the second surface is a plane, or the second surface includes a curved surface.

6. The display module according to claim 5, characterized in that, Along the direction from the first surface toward the second surface, the height H of the buffer structure satisfies: H < 0.06 L, where L is the length of the bent portion along its bending direction.

7. The display module according to claim 1, characterized in that, Along the direction from the first substrate to the second substrate, the maximum length K2 of the buffer structure satisfies: K2 = (0.3~0.4) L, where L is the length of the bent portion along its bending direction.

8. The display module according to claim 1, characterized in that, The buffer structure includes a foam structure and an elastic structure, wherein the elastic structure is located on the side of the foam structure opposite to the bent portion; the foam structure and the elastic structure are in contact; the elastic modulus of the elastic structure is 0.01MPa ~ 50MPa.

9. The display module according to claim 1, characterized in that, The buffer structure includes a hole, the axis of which is perpendicular to the direction of the bent portion toward the buffer structure and perpendicular to the direction of the first substrate toward the second substrate.

10. The display module according to claim 9, characterized in that, The buffer structure also includes foam located within the holes.

11. The display module according to claim 1, characterized in that, The surface of the buffer structure facing away from the bent portion contacts the first substrate and the second substrate, respectively.

12. The display module according to claim 1, characterized in that, The length L of the bent portion along its bending direction satisfies: L = (1.2~1.4) π D / 2, where D is the distance between the first part and the second part.

13. A display device, characterized in that, Includes the display module as described in any one of claims 1-12.

Images