Display module, display device and preparation method of display module

Abstract

The application provides a display module, a display device and a preparation method of the display module. The display module comprises a display panel and a buffer structure arranged on a non-display side of the display panel. The buffer structure comprises a silica gel layer, an impact-resistant layer and a buffer layer. The silica gel layer and the buffer layer are respectively arranged on two sides of the impact-resistant layer. The energy storage modulus of the impact-resistant layer is greater than the energy storage modulus of the silica gel layer and the energy storage modulus of the buffer layer. The technical scheme of the application can solve the problem that the back drop ball performance and the film printing performance of the display module in the related art cannot be considered simultaneously.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and specifically to a display module, a display device, and a method for manufacturing the display module. Background Technology

[0002] With the development of display technology, display devices using light-emitting diodes (LEDs) as light sources are increasingly appearing in people's lives, greatly changing their lifestyles. As users use display devices more frequently, their demands for display product performance are also increasing, including display quality and impact resistance.

[0003] In related technologies, drop ball performance testing is generally used to reflect the impact resistance of display products, which is judged by observing the drop ball height on the back of the display module. In existing display products, the back of the display module is generally equipped with a composite material structure composed of multiple film layers. In one solution, the multiple film layers are generally a foam structure. Display modules with foam have virtually no film printing when the screen is off, but the drop ball height on the back of the display module is relatively low. Alternatively, a silicone gel layer can be used instead of foam. Silicone gel has higher cushioning performance, resulting in a higher drop ball height on the back of the display module. However, since silicone gel is a pressure-sensitive adhesive, the film printing effect is poor when the display module is off. How to balance the drop ball performance and film printing performance of the back of the display module has become crucial. Summary of the Invention

[0004] In view of this, the present invention aims to provide a display module, a display device, and a method for manufacturing a display module, so as to solve the problem that the back-side ball drop performance and film printing performance of the display module in the related art cannot be simultaneously achieved.

[0005] This invention provides a display module, comprising: a display panel having a display side and a non-display side disposed opposite to each other; a buffer structure disposed on the non-display side of the display panel, the buffer structure comprising a silicone gel layer, an impact-resistant layer, and a buffer layer, the silicone gel layer and the buffer layer being located on opposite sides of the impact-resistant layer, one of the silicone gel layer and the buffer layer being bonded to the display panel, the energy storage modulus of the impact-resistant layer being greater than the energy storage modulus of the silicone gel layer and the buffer layer, and the loss modulus of the impact-resistant layer being less than the loss modulus of the silicone gel layer and the buffer layer; a shielding layer located on the side of the buffer structure away from the display panel, the other of the silicone gel layer and the buffer layer being bonded to the shielding layer; and a cover plate disposed on the display side of the display panel and bonded to the display panel.

[0006] In one embodiment, the buffer layer is made of silicone gel; or, the buffer layer is made of particle-coated acrylic.

[0007] In one embodiment, both the surface of the silicone gel layer and the surface of the buffer layer are adhesive.

[0008] In one embodiment, when the buffer layer is made of silicone gel, both the silicone gel layer and the buffer layer are made of platinum-catalyzed silicone gel.

[0009] In one embodiment, the impact-resistant layer is made of thermoplastic polyurethane elastomer; or, the impact-resistant layer is made of polyethylene terephthalate; or, the impact-resistant layer is made of polyimide; the storage modulus of the thermoplastic polyurethane elastomer is greater than or equal to 1 MPa and less than or equal to 500 MPa.

[0010] In one embodiment, the thickness of the impact-resistant layer is smaller than the thickness of the silicone gel layer and the thickness of the buffer layer.

[0011] In one embodiment, the display module further includes a support film located between the display panel and the buffer structure; and / or, the display module further includes a polarizing layer and a connecting layer, wherein the polarizing layer is located on the side of the display panel away from the buffer structure, the connecting layer is located on the side of the polarizing layer away from the display panel, and the cover plate is located on the side of the connecting layer away from the polarizing layer.

[0012] In another aspect, the present invention provides a display device including the display module provided above.

[0013] In another aspect, the present invention provides a method for preparing a display module, which includes: obtaining a silicone gel material; coating the silicone gel material on one side of an impact-resistant layer; drying and curing the silicone gel material to form a silicone gel layer; preparing a buffer layer on the side of the impact-resistant layer away from the silicone gel layer, wherein the buffer layer, the impact-resistant layer, and the buffer layer together form a buffer structure; and attaching the buffer structure to the non-display side of the display panel.

[0014] In one embodiment, the step of preparing a buffer layer on the side of the impact-resistant layer away from the silicone gel layer includes: coating a silicone gel material on the side of the impact-resistant layer away from the silicone gel layer; drying and curing the silicone gel material to form a buffer layer; or, attaching the buffer layer to the side of the impact-resistant layer away from the silicone gel layer.

[0015] The display module using the technical solution of this invention includes a display panel, a buffer structure, a shielding layer, and a cover plate. The buffer structure is positioned on the non-display side of the display panel. Because the loss modulus of the impact-resistant layer is lower than that of the silicone gel layer and the buffer layer, the silicone gel layer and the buffer layer exhibit excellent buffering performance. During drop ball testing, they can withstand a higher drop height, providing good cushioning for the display panel. Furthermore, because the rheological modulus of the impact-resistant layer is greater than that of the silicone gel layer and the buffer layer, during back pressure testing, the impact-resistant layer can absorb most of the impact force acting on the non-display side of the display panel and produce minimal deformation. This results in less impact force and deformation on the silicone gel layer or buffer layer of the buffer structure closer to the display panel, thereby reducing film printing and ensuring good film printing even when the screen is off. Compared to related technologies using foam or silicone gel, this solution enhances the buffering performance of the display module and provides a good film printing effect, meeting users' requirements for product display performance. Attached Figure Description

[0016] Figure 1 The diagram shown is a structural schematic of a display module provided in an embodiment of the present invention.

[0017] Figure 2 The diagram shown is a schematic diagram of the buffer structure of a display module provided in an embodiment of the present invention.

[0018] Figure 3 The diagram shown is a structural schematic of a display module provided in a specific embodiment of the present invention.

[0019] Figure 4 The diagram shown is a schematic diagram of the buffer structure of a display module provided in another embodiment of the present invention.

[0020] Figure 5 The diagram shown is a structural schematic of a display module provided in another specific embodiment of the present invention.

[0021] Figure 6 The image shown is an exploded view of the buffer structure of a display module provided in an embodiment of the present invention.

[0022] Figure 7 The diagram shows a flowchart of a method for preparing a display module according to an embodiment of the present invention.

[0023] Figure 8 The diagram shows a flowchart of a method for preparing a display module according to a specific embodiment of the present invention.

[0024] Figure 9 The diagram shows a flowchart of a method for preparing a display module according to another specific embodiment of the present invention.

[0025] Figure label:

[0026] 10. Display panel; 20. Buffer structure; 21. Silicone gel layer; 22. Impact-resistant layer; 23. Buffer layer; 30. Support film; 40. Shielding layer; 50. Polarizing layer; 60. Connecting layer; 70. Cover plate. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figure 1 and Figure 6 As shown, an embodiment of the present invention provides a display module, which includes a display panel 10, a buffer structure 20, a shielding layer 40, and a cover plate 70. The display panel 10 has a display side and a non-display side disposed opposite to each other, and the buffer structure 20 is disposed on the non-display side of the display panel 10. The buffer structure 20 includes a silicone gel layer 21, an impact-resistant layer 22, and a buffer layer 23. The silicone gel layer 21 and the buffer layer 23 are respectively located on both sides of the impact-resistant layer 22. One of the silicone gel layer 21 and the buffer layer 23 is attached to the display panel. The energy storage modulus of the impact-resistant layer 22 is greater than the energy storage modulus of the silicone gel layer 21 and the buffer layer 23, and the loss modulus of the impact-resistant layer 22 is less than the loss modulus of the silicone gel layer 21 and the buffer layer 23. The shielding layer 40 is located on the side of the buffer structure 20 away from the display panel 10, and the other of the silicone gel layer 21 and the buffer layer 23 is attached to the shielding layer 40. The cover plate 70 is disposed on the display side of the display panel 10 and is attached to the display panel 10.

[0029] According to the technical solution of this invention, the display module includes a display panel 10, a buffer structure 20, a shielding layer 40, and a cover plate 70. The buffer structure 20 is disposed on the non-display side of the display panel 10. Since the loss modulus of the impact-resistant layer 22 is less than that of the silicone gel layer 21 and the buffer layer 23, the silicone gel layer 21 and the buffer layer 23 have excellent buffering performance, allowing for a higher drop height during ball drop tests, thus providing good buffering for the display panel 10. Furthermore, since the rheological modulus of the impact-resistant layer 22 is greater than that of the silicone gel layer 21 and the buffer layer 23, during back pressure tests, the impact-resistant layer 22 can absorb most of the impact force acting on the non-display side of the display panel 10 and produce less deformation. This results in less impact force and deformation on the silicone gel layer 21 or the buffer layer 23 on the side of the buffer structure 20 closest to the display panel 10, thereby reducing film deposition and ensuring good film deposition even when the display module is off. Compared to the foam or silicone gel methods used in related technologies, this solution can enhance the buffering performance of the display module and give the module a good film printing effect, thus meeting users' needs for product display performance.

[0030] Among them, both the silicone gel layer 21 and the buffer layer 23 have excellent buffering properties, such as Figure 2 and Figure 3 As shown, in some embodiments, the silicone gel layer 21 can be located between the display panel 10 and the impact-resistant layer 22, and the buffer layer 23 can be located on the side of the impact-resistant layer 22 away from the display panel 10. Figure 4 and Figure 5 As shown, in some embodiments, the buffer layer 23 can be located between the display panel 10 and the shock-resistant layer 22, and the silicone gel layer 21 can be located on the side of the shock-resistant layer 22 away from the display panel 10.

[0031] Rheological modulus is an important parameter used to describe the deformation and flow behavior of materials under stress or strain. It primarily characterizes the viscous and elastic properties of materials, that is, the properties of materials exhibiting both elasticity and viscosity when deformed under external forces. Rheological modulus typically includes storage modulus and loss modulus. Storage modulus reflects the material's ability to store energy during deformation, reflecting its elastic capacity; a higher storage modulus indicates better elasticity. Loss modulus reflects the energy loss during deformation; the material cannot completely return to its original state, and this energy is lost as heat. A higher loss modulus indicates greater viscosity and greater energy loss.

[0032] Since the energy storage modulus of the impact-resistant layer 22 is greater than that of the silicone gel layer 21 and the buffer layer 23, the impact-resistant layer 22 produces less deformation under greater stress, that is, it has a stronger ability to recover deformation. As a result, it will not cause film imprint residue on the back of the display panel 10, or the film imprint residue is not obvious compared with the silicone gel in related technologies.

[0033] It should be noted that the loss modulus of the silicone gel layer 21 and the loss modulus of the buffer layer 23 are greater than that of the impact-resistant layer 22. This results in a large energy loss when the impact force acts on the silicone gel layer 21 and the buffer layer 23, giving the buffer structure 20 excellent buffering performance.

[0034] In some embodiments, the buffer layer 23 is made of silicone gel. Using silicone gel to form the buffer layer 23 provides excellent cushioning performance.

[0035] Silicone gel is a polymer material mainly composed of silicon-oxygen chains, typically produced from silicon-based materials through hydrolysis and condensation reactions. Silicone gel generally possesses viscosity, giving it excellent cushioning properties. It usually exists in solid or gel form, with gel-like silicone gels solidifying upon heating. Due to its good transparency, light can easily pass through it. Furthermore, silicone gel exhibits good stability and can operate over a wide temperature range.

[0036] In some embodiments, the buffer layer 23 is made of particle-coated acrylic. Using this material gives the buffer layer 23 excellent cushioning and abrasion resistance.

[0037] Among them, particle-coated acrylic layers are composite materials in which particles are added to an acrylic (polymethyl methacrylate, PMMA) base film to improve its properties. Generally, adding particles can further optimize the optical properties of the material, such as transmittance. It can also enhance the hardness and wear resistance of the acrylic layer.

[0038] The cover plate 70 is the outermost protective component of the display module and can be made of the following materials. In some embodiments, the cover plate 70 can be made of glass, which is strengthened by physical or chemical methods to significantly improve its hardness and impact resistance, thus providing high-strength protection. In some embodiments, the cover plate 70 can also be made of plastic, such as polycarbonate, which has good toughness and impact resistance. Alternatively, polymethyl methacrylate (PMMA), which has high hardness, can be used.

[0039] It should be noted that the display panel 10 in this embodiment can be a self-emissive display panel, such as using an organic light-emitting diode (OLED) as the light-emitting layer of the display panel 10. By making the organic material emit light under the action of an electric current, each pixel can achieve independent light emission. Alternatively, a quantum dot light-emitting diode (QLED) can be used, which emits light under the action of an electric current using quantum dot materials. Of course, the display panel 10 can also be a non-self-emissive display panel, which requires the use of an external light source to illuminate the pixels. For example, a liquid crystal display (LCD) that uses a backlight to provide light.

[0040] In some embodiments, both the surface of the silicone gel layer 21 and the surface of the buffer layer 23 are adhesive. Utilizing the adhesive properties of the silicone gel, the buffer structure 20 can be adhered to the non-display side of the display panel 10, while simultaneously adhering the shielding layer 40.

[0041] Among them, the adhesiveness of the silicone gel layer 21 and the buffer layer 23 is greater than that of the impact-resistant layer 22. When the silicone gel layer 21 and the buffer layer 23 are bonded to the impact-resistant layer 22, the generation of air bubbles can be prevented, making the connection between the silicone gel layer 21 and the impact-resistant layer 22 tighter, and the connection between the buffer layer 23 and the impact-resistant layer 22 tighter.

[0042] When the material of the buffer layer 23 is silicone gel, its storage modulus is 100 kPa to 250 kPa.

[0043] In some embodiments, when the buffer layer 23 is made of silicone gel, both the silicone gel layer 21 and the buffer layer 23 are made of platinum-catalyzed silicone gel. Using this material can improve the reaction rate of the silicone gel and increase production efficiency.

[0044] When the material of the buffer layer 23 is acrylic with particles, its energy storage modulus is 50 kPa to 150 kPa.

[0045] Among these features, the platinum catalyst can significantly accelerate the curing reaction of the silicone gel at lower temperatures, thereby improving production efficiency. Furthermore, the platinum-catalyzed silicone gel has a long workability time at room temperature, providing sufficient time for display module assembly. Simultaneously, the platinum-catalyzed silicone gel also exhibits excellent optical and adhesive properties.

[0046] In some embodiments, the impact-resistant layer 22 is made of thermoplastic polyurethane elastomer. Thermoplastic polyurethane elastomer has a high storage modulus and exhibits small deformation under the same impact force, thereby enabling the module to achieve good film printing effect.

[0047] Thermoplastic polyurethane (TPU) is a polymer material that falls between rubber and plastic, possessing both the elasticity of rubber and the processing properties of plastic. In addition to its high storage modulus, TPU also exhibits high strength, toughness, and abrasion resistance. Furthermore, TPU possesses extremely high thermal stability.

[0048] In some embodiments, the impact-resistant layer 22 is made of polyethylene terephthalate (PET). PET has a high storage modulus and exhibits less deformation under the same impact force, thus enabling the module to achieve good film printing results.

[0049] Polyethylene terephthalate (PET) is a widely used thermoplastic polymer with excellent overall properties. In addition to its high storage modulus, it also possesses good mechanical properties, such as high toughness and high strength. Furthermore, PET exhibits good thermal properties and a wide operating temperature range.

[0050] In some embodiments, the impact-resistant layer 22 is made of polyimide. Polyimide has a high energy storage modulus and exhibits small deformation under the same impact force, thereby enabling the module to achieve good film printing effect.

[0051] Polyimide (PI) is a high-performance polymer material that, in addition to its high storage modulus, also possesses excellent high-temperature resistance and mechanical properties. Polyimide can be used at extreme temperatures, with long-term operating temperatures exceeding 200°C and short-term tolerance temperatures reaching 500°C.

[0052] The storage modulus of thermoplastic polyurethane elastomers is greater than or equal to 1 MPa and less than or equal to 500 MPa. Thermoplastic polyurethane elastomers with the above storage modulus range can withstand greater impact forces and produce smaller deformations, thereby reducing the formation of film marks.

[0053] The energy storage modulus of thermoplastic polyurethane elastomer can be any value of 1MPa, 10MPa, 100MPa, 200MPa, 300MPa, 400MPa, 500MPa, or greater than or equal to 1MPa and less than or equal to 500MPa.

[0054] The thickness of the impact-resistant layer 22 is smaller than that of the silicone gel layer 21 and the buffer layer 23. This arrangement ensures that each layer of the buffer structure 20 has a suitable thickness, achieving a balance between good buffering performance and good film printing effect.

[0055] In one specific embodiment, the buffer layer 23 is made of platinum-catalyzed silicone gel, and the impact-resistant layer 22 is made of thermoplastic polyurethane elastomer. The thickness of both the silicone gel layer 21 and the buffer layer 23 is 55 μm, and the thickness of the thermoplastic polyurethane elastomer is 15 μm.

[0056] like Figure 1 , Figure 3 as well as Figure 5 As shown, the display module also includes a support film 30, which is located between the display panel 10 and the buffer structure 20. With this structure, the support film 30 provides support and protection for the display panel 10, preventing deformation or damage to the display panel 10 during use due to external forces.

[0057] The support film 30 is generally composed of multiple structures. Generally speaking, the support film 30 includes a substrate, a support layer and a heat dissipation layer. In some embodiments, the support film 30 has functions such as heat dissipation and light shielding in addition to support and protection.

[0058] In some embodiments, the support film 30 includes a heat dissipation structure such as a heat dissipation layer. The heat dissipation layer can effectively conduct and dissipate the heat generated by the display panel 10 during operation, avoiding display problems caused by overheating.

[0059] Furthermore, for flexible display modules, the support film 30 also needs to have good flexibility and bend resistance to adapt to the bending operation of the display panel 10, while maintaining its own integrity and functionality.

[0060] The shielding layer 40 is typically made of copper foil. It possesses excellent thermal conductivity, enabling rapid conduction and dissipation of heat generated by the display module during operation, effectively reducing the module's temperature and thus improving its reliability and lifespan. Furthermore, the conductivity of the shielding layer 40 effectively blocks external electromagnetic interference, protecting the internal circuitry of the display module from interference by external electromagnetic signals and preventing internal signal leakage. The shielding layer 40 also provides additional structural support for the display module, enhancing its structural stability and preventing damage caused by external forces or vibrations.

[0061] In some embodiments, the display module further includes a polarizing layer 50 and a connecting layer 60. The polarizing layer 50 is located on the side of the display panel 10 away from the buffer structure 20, the connecting layer 60 is located on the side of the polarizing layer 50 away from the display panel 10, and the cover plate 70 is located on the side of the connecting layer 60 away from the polarizing layer 50.

[0062] Using the above structure, the polarization direction of light can be controlled by the polarizing layer 50, converting natural light into polarized light, thereby realizing image display. The polarizer is generally made of composite materials, mainly including a PVA film (polyvinyl alcohol film), a protective film, a release film, and pressure-sensitive adhesive.

[0063] The connecting layer 60 is used to connect the polarizing layer 50 and the cover plate 70 to connect the cover plate 70 to the display panel 10.

[0064] In some embodiments, the bonding layer 60 employs OCA (Optically Clear Adhesive), which enables adhesion between various materials and allows for tight bonding between different materials. Furthermore, OCA has high light transmittance, exceeding 90%, ensuring the optical performance of the display module. OCA also possesses excellent high-temperature resistance and UV resistance, maintaining stability in various complex environments.

[0065] The cover plate 70 provides protection for the display panel 10, preventing it from being impacted by external forces and avoiding damage.

[0066] In some embodiments, the cover plate 70 is made of glass, which has high transparency and high hardness. In the touch display module, the cover plate 70 typically integrates a touch sensor, providing good touch performance and enabling touch operation. OCA optical adhesive allows for full lamination between the cover plate 70 and the display panel 10, reducing air gaps and improving display brightness and contrast.

[0067] Another embodiment of the present invention provides a display device including the display module provided above. The silicone gel layer 21 and the buffer layer 23 have excellent buffering performance, allowing for a high drop height during ball drop tests, thus providing good cushioning for the display panel 10. Furthermore, since the rheological modulus of the impact-resistant layer 22 is greater than that of the silicone gel layer 21 and the buffer layer 23, during back pressure tests, the impact-resistant layer 22 can absorb most of the impact force acting on the non-display side of the display panel 10 and produce minimal deformation. This results in less impact force and less deformation on the silicone gel layer 21 or buffer layer 23 on the side of the buffer structure 20 closest to the display panel 10, thereby reducing the formation of film marks and ensuring good film mark performance even when the display module is off.

[0068] Since the principle of solving the problem in the display device embodiment is similar to that in the above-described display module embodiment, the implementation of the display device embodiment can refer to the implementation of the above-described display module embodiment, and repeated details will not be repeated.

[0069] like Figure 7As shown, another embodiment of the present invention provides a method for preparing a display module, which is used to prepare the display module provided above. The preparation method includes the following steps.

[0070] Obtaining silica gel materials. Since silica gel is composed of a mixture of multiple materials, obtaining silica gel materials, mixing multiple silica gel materials, and stirring them can prepare for the subsequent preparation of buffer structures.

[0071] The silicone gel material is coated onto one side of the impact-resistant layer. Using the above steps, the silicone gel material can be directly coated onto the impact-resistant layer, a mature and easy-to-operate process.

[0072] In one specific embodiment, the silicone gel material can be prepared by coating.

[0073] The silicone gel material is dried and cured to form a silicone gel layer. Using the above steps, a silicone gel layer can be formed by drying and curing the silicone gel material; the process is mature and easy to operate.

[0074] A buffer layer is prepared on the side of the impact-resistant layer away from the silicone gel layer. The buffer layer, the impact-resistant layer, and the buffer layer together form a buffer structure. By using the above steps, a buffer layer can be formed on both sides of the impact-resistant layer, enabling the display module to have excellent buffering performance and achieving a balance between buffering effect and film printing effect.

[0075] The buffer structure is attached to the non-display side of the display panel. By employing the above steps, the buffer structure achieves a balance between buffering performance and film printing effect. During drop ball testing, it allows for a higher drop height, providing excellent buffering for the display panel. Furthermore, because the rheological modulus of the impact-resistant layer is greater than that of the silicone gel layer and the buffer layer, during back pressure testing, the impact-resistant layer can absorb most of the impact force acting on the non-display side of the display panel and produce minimal deformation. This results in less impact force and deformation on the silicone gel layer or buffer layer closer to the display panel, thereby reducing film printing and ensuring good film printing effect even when the display module is off.

[0076] like Figure 8 As shown, in this embodiment, when the material of the buffer layer is silicone gel, the step of preparing the buffer layer on the side of the impact-resistant layer away from the silicone gel layer includes the following steps.

[0077] A silicone gel material is coated on the side of the impact-resistant layer away from the silicone gel layer. By using the above steps, a silicone gel buffer layer can be prepared on the other side of the impact-resistant layer by coating the silicone gel material on the other side.

[0078] The silicone gel material is dried and cured to form a buffer layer. Using the above steps, a silicone gel layer can be formed by drying and curing the silicone gel material; the process is mature and easy to operate.

[0079] It should be noted that after the buffer structure is prepared, it is generally rolled up. When it needs to be bonded to the display panel, the rolled buffer structure is first cut to obtain a buffer structure of appropriate size.

[0080] The display module prepared by this method has a greater adhesion between the impact-resistant layer and the silicone gel than the display module that uses silicone gel alone. This is because the silicone gel is bonded to the display panel by a cold-applied method, which helps to make the buffer structure suitable for display modules with larger curvatures.

[0081] In related technologies, display modules using single-layer silicone gel are employed. The preparation process of single-layer silicone gel is as follows: Multiple materials for forming the silicone gel are mixed and stirred. The resulting mixture is then coated onto a fluoroplastic film, dried, and cured to form a single-layer silicone gel. After preparation, the buffer structure is typically rolled up. When bonding to the display panel, the rolled buffer structure is first cut to obtain a suitable size.

[0082] like Figure 9 As shown, another embodiment of the present invention provides a method for preparing a display module, which is used to prepare the display module provided above. The difference between the method for preparing the display module provided in this embodiment and the method for preparing the display module described above is that, in this embodiment, the material of the buffer layer is acrylic with particles, and the step of preparing the buffer layer on the side of the impact-resistant layer away from the silicone gel layer includes the following steps.

[0083] The buffer layer is attached to the side of the impact-resistant layer away from the silicone gel layer, and the buffer layer, impact-resistant layer, and buffer layer together form a buffer structure. Utilizing the adhesive properties of particle-containing acrylic material, the buffer layer can be directly adhered to the impact-resistant layer; this process is mature and easy to operate.

[0084] It should be noted that, except for the steps described above, the preparation method of the display module in this embodiment is the same as that in the above embodiment. The repeated steps will not be described again.

[0085] The following description, in conjunction with specific embodiments, illustrates the present application. These embodiments are exemplary and intended only to explain the present application, and should not be construed as limiting the present application. Where specific techniques or conditions are not specified in the embodiments, they shall be performed in accordance with the techniques or conditions described in the literature in this field.

[0086] In Example 1, the buffer layer of the display module's buffer structure is made of silicone gel. Both the silicone gel layer and the buffer layer are 55 μm thick with a storage modulus of 100 kPa to 250 kPa. The impact-resistant layer is made of thermoplastic polyurethane elastomer with a thickness of 15 μm and a storage modulus of 1 MPa to 500 MPa. During the ball drop performance test, the display module was tested three times. Ensuring that no dark lines or other damage appeared on the display side of the module, the maximum distances of the ball drop in the three tests were 65 mm, 63 mm, and 58 mm, respectively.

[0087] In contrast, in Example 2, when the buffer structure of the display module in the related technology uses conventional foam, the thickness of the foam is 220μm and the energy storage modulus of the foam is 50KPa to 200KPa. The display module is tested three times to ensure that no damage such as dark lines appears on the display side of the display module. The maximum distance of the falling ball in the three tests is 38mm, 40mm and 42mm respectively.

[0088] In Example 3, when the buffer structure of the display module in the related technology is made of silicone gel, the thickness of the silicone gel is 130 μm and the energy storage modulus of the silicone gel is 80 kPa to 400 kPa. The display module is tested three times to ensure that no damage such as dark lines appears on the display side of the display module. The maximum distance of the falling ball in the three tests is 53 mm, 57 mm and 54 mm respectively.

[0089] The drop ball performance test data above shows that, with similar thicknesses, the drop ball height of the display module using the buffer structure of this application is similar to that of the display module using silicone gel. Furthermore, the display module using foam requires a greater thickness to achieve a similar drop ball height.

[0090] The specific steps of the ball drop performance test are as follows: a ball is thrown from the non-display side of the display module, and the throwing height of the ball is gradually increased. The display effect of the display module is observed from the display side of the display module until the throwing height of the ball reaches a certain value. If the display effect of the display module shows obvious dark lines or other damage, then the previous value is taken as the final height dimension of the ball drop performance test.

[0091] Similarly, the point impact performance of the display module buffer structures in the three embodiments described above was tested. First, a single piece of glass was taken and dropped from a height of 55mm using an 11.2g ball, and the impact force on the glass was measured. The impact forces measured in Embodiments 1 to 3 were 498.991N, 483.89N, and 484.138N, respectively. Next, the buffer structures used in Embodiments 1 to 3 were glued to the glass, and the same ball was dropped from a height of 55mm again, and the impact force on the glass was measured. Three tests were performed. The impact forces measured in Embodiment 1 were 159.673N, 161.548N, and 157.731N, respectively; the impact forces measured in Embodiment 2 were 174.55N, 173.553N, and 175.051N, respectively; and the impact forces measured in Embodiment 3 were 168.362N, 1683682N, and 169.588N, respectively.

[0092] Therefore, it can be concluded that, after adopting the buffer structure, the impact absorption rates of the buffer structure in the three tests of Example 1 were 68.00%, 67.63%, and 68.39%, respectively; in Example 2, the impact absorption rates were 63.93%, 64.34%, and 63.83%, respectively; and in Example 3, the impact absorption rates were 65.52%, 65.16%, and 64.97%, respectively. From the above data, it can be seen that the impact absorption rate of the buffer structure of this application is significantly greater than that of using silicone gel or foam alone, and the buffer structure of this application has excellent buffering performance.

[0093] Similarly, back pressure tests were conducted on the buffer structures of the display modules in the three embodiments described above. Specifically, an 11.2g ball was dropped from a height of 55mm, and after 24 hours, the diameter of the indentation formed on the non-display side of the display module by the ball was measured. The indentation diameter measured in Embodiment 1 was 2.2mm, in Embodiment 2 was 2.35mm, and in Embodiment 3 was 2.4mm.

[0094] As can be seen from the above data, the diameter of the pit formed by the buffer structure of this application is significantly smaller than the diameter of the pit formed by display modules using silicone gel or foam alone, which makes the display module of this application have excellent film printing effect.

[0095] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0096] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0097] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0098] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A display module, characterized in that, The display module includes: A display panel having a display side and a non-display side disposed opposite to each other; A buffer structure is provided on the non-display side of the display panel. The buffer structure includes a silicone gel layer, an impact-resistant layer, and a buffer layer. The silicone gel layer and the buffer layer are located on opposite sides of the impact-resistant layer. One of the silicone gel layer and the buffer layer is in contact with the display panel. The energy storage modulus of the impact-resistant layer is greater than that of the silicone gel layer and the buffer layer, and the loss modulus of the impact-resistant layer is less than that of the silicone gel layer and the buffer layer. A shielding layer is located on the side of the buffer structure away from the display panel, and the other side of the silicone gel layer and the buffer layer is attached to the shielding layer; A cover plate is disposed on the display side of the display panel and is attached to the display panel.

2. The display module according to claim 1, characterized in that, The buffer layer is made of silicone gel; or... The buffer layer is made of particle-containing acrylic.

3. The display module according to claim 1, characterized in that, Both the surface of the silicone gel layer and the surface of the buffer layer are adhesive.

4. The display module according to claim 2, characterized in that, When the material of the buffer layer is silicone gel, both the silicone gel layer and the buffer layer are made of platinum-catalyzed silicone gel.

5. The display module according to claim 1, characterized in that, The impact-resistant layer is made of thermoplastic polyurethane elastomer; or, The impact-resistant layer is made of polyethylene terephthalate; or... The impact-resistant layer is made of polyimide; The energy storage modulus of the thermoplastic polyurethane elastomer is greater than or equal to 1 MPa and less than or equal to 500 MPa.

6. The display module according to any one of claims 1 to 5, characterized in that, The thickness of the impact-resistant layer is smaller than the thickness of the silicone gel layer and the thickness of the buffer layer.

7. The display module according to any one of claims 1 to 5, characterized in that, The display module further includes a support film, which is located between the display panel and the buffer structure. And / or, the display module further includes a polarizing layer and a connecting layer, the polarizing layer being located on the side of the display panel away from the buffer structure, the connecting layer being located on the side of the polarizing layer away from the display panel, and the cover plate being located on the side of the connecting layer away from the polarizing layer.

8. A display device, characterized in that, The display module includes any one of claims 1 to 7.

9. A method for manufacturing a display module, used to manufacture the display module according to any one of claims 1 to 7, characterized in that, include: Obtaining silica gel materials; The silicone gel material is coated on one side of the impact-resistant layer; The silicone gel material is dried and cured to form the silicone gel layer; A buffer layer is prepared on the side of the impact-resistant layer away from the silicone gel layer, and the buffer layer, the impact-resistant layer, and the buffer layer together form a buffer structure; The buffer structure is attached to the non-display side of the display panel.

10. The method for preparing a display module according to claim 9, characterized in that, The step of preparing a buffer layer on the side of the impact-resistant layer away from the silicone gel layer includes: The silicone gel material is coated on the side of the impact-resistant layer away from the silicone gel layer; The silicone gel material is dried and cured to form the buffer layer; Alternatively, the buffer layer can be attached to the side of the impact-resistant layer away from the silicone gel layer.

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