A precision wire preparation device and a precision wire preparation method

Abstract

The application discloses a precision wire preparation device and a precision wire preparation method. The device comprises: a winding and unwinding assembly configured to release the enameled wire blank with a controllable tension to a first preset wire diameter, and to make the enameled wire blank sequentially flow through a pretreatment assembly, an etching assembly and a post-treatment assembly to obtain a finished product wire with a second preset wire diameter, and to orderly wind the finished product wire; the pretreatment assembly is configured to perform surface pretreatment on the enameled wire blank to remove grease and impurities on the surface of the enameled wire blank; the etching assembly is configured to make the enameled wire blank wave-shapedly immerse in an etching liquid along a running direction with a controllable tension to perform etching thinning treatment on the enameled wire blank to obtain a semi-finished product wire with the second preset wire diameter; and the post-treatment assembly is configured to sequentially perform cleaning and drying treatment on the semi-finished product wire to obtain the finished product wire. The technical scheme can effectively solve the problem that the existing wire preparation process cannot break through the 7-micron wire diameter limit of the traditional mold pressing process.

Description

Technical Field

[0001] This application relates to the field of wire fabrication technology, and more specifically, to a precision wire fabrication apparatus and a precision wire fabrication method. Background Technology

[0002] In related technologies, enameled wire, as a major type of winding wire, is widely used in electromagnetic components such as motors, transformers, inductors, and touch screens. Traditionally, enameled wire is manufactured through die extrusion molding. The bare wire is annealed and softened, then pressed into the required diameter using a precision die. However, due to limitations in die processing precision, material flow characteristics, and tension fluctuations during the molding process, traditional molding processes face significant technical bottlenecks in producing extremely fine wires. Currently, the finest enameled wire produced by traditional molding methods can only reach approximately 7μm. Further reductions in diameter easily lead to problems such as wire breakage and uneven wire diameter, making it difficult to meet the demands of high-end electronic components for ultra-fine wires. Summary of the Invention

[0003] The purpose of this application is to provide a precision wire preparation apparatus and a precision wire preparation method, which aims to solve the problem that existing wire preparation processes cannot break through the 7μm wire diameter limit of traditional molding processes.

[0004] To achieve this objective, embodiments of this application provide a precision wire fabrication apparatus, which includes a winding / unwinding assembly, a pretreatment assembly, an etching assembly, and a post-treatment assembly, wherein... The winding and unwinding assembly is configured to release the enameled wire blank, which has been molded to a first preset wire diameter, under controllable tension, and to allow the enameled wire blank to flow sequentially through the pretreatment assembly, the etching assembly, and the post-treatment assembly to obtain a finished wire with a second preset wire diameter, and to wind the finished wire in an orderly manner, wherein the second preset wire diameter is smaller than the first preset wire diameter. The pretreatment component is configured to perform surface pretreatment on the enameled wire blank that flows through it, so as to remove grease and impurities from the surface of the enameled wire blank. The etching assembly is configured to immerse the enameled wire blank in the etching solution in a wavy manner with controllable tension, so as to perform etching and thinning treatment on the enameled wire blank to obtain a semi-finished wire with a second preset wire diameter. The post-processing component is configured to sequentially clean and dry the semi-finished wires flowing through it to obtain the finished wires.

[0005] Optionally, in some embodiments of this application, the unwinding and take-up assembly includes an unwinding roller, a take-up roller, a tension sensor, at least one tension regulator, and a servo motor, and the pre-processing assembly, the etching assembly, and the post-processing assembly are sequentially disposed between the unwinding roller and the take-up roller; The unwinding roller is configured to release the enameled wire blank, and the winding roller is configured to wind up the finished wire. The tension sensor is located at the wire exit end of the unwinding roller and is configured to detect the real-time tension of the enameled wire blank and output a tension signal. The tension regulator is disposed at the inlet and / or outlet of the etching assembly and is electrically connected to the tension sensor. The tension regulator is configured to adjust the tension of the enameled wire blank or the tension of the semi-finished wire according to the tension signal. The servo motor is connected to the winding roller and is configured to drive the winding roller to rotate.

[0006] Optionally, in some embodiments of this application, at least one of the tension regulators includes a first tension regulator and a second tension regulator, wherein, The first tension regulator is disposed between the pretreatment component and the etching component, and is configured to adjust the feed tension at the feed end of the etching component according to the tension signal; The second tension regulator is disposed between the etching component and the post-processing component, and is configured to adjust the lead-out tension of the lead-out end of the etching component according to the tension signal.

[0007] Optionally, in some embodiments of this application, the first tension regulator is a servo tensioner or a magnetic powder tensioner; and / or, The second tension regulator is a servo tensioner or a magnetic powder tensioner.

[0008] Optionally, in some embodiments of this application, the pretreatment component includes an ultrasonic cleaning tank and an air knife dryer. The ultrasonic cleaning tank is configured to ultrasonically clean the enameled wire blank to remove grease and impurities from its surface. The air knife dryer is located at the outlet end of the ultrasonic cleaning tank and is configured to air-dry the cleaned enameled wire blank; and / or, The post-processing component includes a multi-stage countercurrent cleaning tank and a hot air drying chamber. The multi-stage countercurrent cleaning tank is disposed between the etching component and the hot air drying chamber. The water inlet direction of the multi-stage countercurrent cleaning tank is opposite to the travel direction of the semi-finished wire, and it is configured to remove residual etching solution from the surface of the semi-finished wire. The hot air drying chamber is configured to dry the cleaned semi-finished wire to obtain the finished wire.

[0009] Optionally, in some embodiments of this application, the etching assembly includes an etching tank and at least three guide rollers disposed within the etching tank, wherein, The etching tank is provided with an inlet and an outlet that are arranged opposite to each other, and is configured to contain the etching solution. At least three of the guide rollers are staggered between the inlet and the outlet, and are configured to immerse the enameled wire blank in the etching solution in a wavy pattern along the direction of travel in the etching tank.

[0010] Optionally, in some embodiments of this application, the etching assembly further includes a circulating filter module disposed outside the etching tank. The circulating filter module includes a circulating pump and a filter. The inlet of the circulating pump is connected to the bottom of the etching tank, and the outlet of the circulating pump is connected to the top of the etching tank. The filter is disposed on the pipeline between the circulating pump and the etching tank and is configured to remove reaction products generated during the etching process; and / or, The etching assembly further includes a temperature control module, which comprises a heater and a temperature sensor. The temperature sensor is disposed within the etching tank and is configured to detect the temperature of the etching solution in real time. The heater is configured to heat the etching solution when the temperature sensor detects that the temperature of the etching solution is lower than a preset temperature value, so as to maintain the temperature of the etching solution within the preset temperature range; and / or, The etching assembly also includes a chemical agitator, which is located at the bottom of the etching tank and configured to maintain a uniform flow of the etching solution.

[0011] Optionally, in some embodiments of this application, the precision conductor manufacturing apparatus further includes an online conductor diameter detection component, which is disposed at the output end of the post-processing component and configured to detect the conductor diameter of the finished conductor in real time.

[0012] Furthermore, to achieve this objective, embodiments of this application also provide a method for preparing precision wires, applied in any of the precision wire preparation apparatuses described above, the method comprising the following steps: The enameled wire blank, which has been molded to a first preset wire diameter, is loaded onto the unwinding end of the take-up and unwinding assembly, and the enameled wire blank is released with controllable tension. The enameled wire blank is passed through the pretreatment component to remove grease and impurities from the surface of the enameled wire blank; The enameled wire blank is flowed through the etching assembly, and the enameled wire blank is immersed in the etching solution in a wave-like manner with controllable tension in the etching assembly, so as to etch and thin the enameled wire blank to a second preset wire diameter by the etching solution, to obtain a semi-finished wire, wherein the second preset wire diameter is smaller than the first preset wire diameter. The semi-finished wire is passed through the post-processing component to be cleaned and dried sequentially by the post-processing component to obtain the finished wire; The finished wire is wound up in an orderly manner through the winding end of the winding and unwinding assembly.

[0013] Optionally, in some embodiments of this application, the first preset wire diameter is 7 μm to 15 μm, and the second preset wire diameter is 1 μm to 6 μm; and / or, The precision conductor manufacturing method further includes the following steps: based on the wire diameter detection signal fed back by the finished conductor detected by the wire diameter online detection component, the unwinding tension and winding tension of the winding and unwinding component and the etching parameters of the etching component are adjusted in real time to stabilize the wire diameter of the finished conductor at the second preset wire diameter.

[0014] The precision wire fabrication apparatus and method provided in this application, through the aforementioned structural setup and the coordinated operation of the winding / unwinding assembly, pretreatment assembly, etching assembly, and post-treatment assembly, can perform high-precision, uniform etching to thin pre-molded enameled wire blanks. Specifically, the winding / unwinding assembly releases and winds the wire with controllable tension, while the etching assembly uses controllable tension to immerse the wire in the etching solution in a wave-like pattern, effectively extending the etching reaction time and promoting full contact between the etching solution and the wire surface, ensuring uniform etching. Simultaneously, the pretreatment assembly removes surface grease and impurities, and the post-treatment assembly cleans and dries the wire, enabling the stable fabrication of fine wires with diameters smaller than the molding limit, breaking through the 7μm diameter limit of traditional molding processes. Therefore, this technical solution effectively solves the problem that existing wire fabrication processes cannot exceed the 7μm diameter limit of traditional molding processes. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0017] Figure 1 This is a schematic diagram of the structure of the precision wire fabrication apparatus according to an embodiment of this application; Figure 2 for Figure 1 Another schematic diagram of the etching component of the precision wire fabrication apparatus shown; Figure 3 This is a first flowchart of a precision wire fabrication method according to an embodiment of this application; Figure 4 This is a second flowchart of a precision wire fabrication method according to an embodiment of this application.

[0018] Illustrations: 1. Precision wire preparation device; 10. Unwinding / rewinding assembly; 11. Unwinding roller; 12. Rewinding roller; 13. Tension sensor; 14. First tension regulator; 15. Second tension regulator; 20. Pre-treatment assembly; 21. Ultrasonic cleaning tank; 22. Air knife dryer; 30. Etching assembly; 31. Etching tank; 311. Wire inlet; 312. Wire outlet; 32. Guide roller; 33. Circulating filter module; 331. Circulating pump; 332. Filter; 34. Temperature control module; 341. Heater; 342. Temperature sensor; 35. Chemical solution stirrer; 40. Post-treatment assembly; 41. Multi-stage countercurrent cleaning tank; 42. Hot air drying oven; 50. Online wire diameter detection assembly. Detailed Implementation

[0019] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0021] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0022] Please see Figure 1 and Figure 2 As shown, in one embodiment, this application provides a precision wire preparation apparatus 1. The apparatus 1 specifically includes a winding / unwinding assembly 10, a pretreatment assembly 20, an etching assembly 30, and a post-treatment assembly 40. The winding / unwinding assembly 10 is configured to release enameled wire blanks molded to a first preset diameter under controllable tension, and to allow the enameled wire blanks to sequentially flow through the pretreatment assembly 20, the etching assembly 30, and the post-treatment assembly 40 to obtain a finished wire with a second preset diameter. The finished wire is then orderly wound up, with the second preset diameter being smaller than the first preset diameter. The pretreatment assembly 20 is configured to perform surface pretreatment on the flowing enameled wire blanks to remove grease and impurities from their surface. The etching assembly 30 is configured to immerse the enameled wire blanks in an etching solution in a wavy pattern along the direction of travel under controllable tension to perform etching and thinning treatment on the flowing enameled wire blanks, thereby obtaining a semi-finished wire with the second preset diameter. The post-processing component 40 is configured to sequentially clean and dry the semi-finished wires to obtain the finished wires.

[0023] It should be noted that the precision wire preparation apparatus 1 of this application embodiment is mainly applied to the continuous industrial production of ultra-fine circular cross-section wires, especially suitable for secondary precision thinning of enameled wire blanks molded to 7μm-15μm, to prepare high-precision enameled wires with a wire diameter in the range of 1μm-6μm, meeting the needs of high-end consumer electronics, medical devices, precision sensors and other fields for ultra-fine electromagnetic wires. In this application embodiment, the enameled wire blank refers to a metal wire with an insulating layer that has been formed by traditional molding process, and its wire diameter is close to but has not yet reached the target finished wire diameter. The etching solution can be selected according to the wire material (such as copper, copper alloy, etc.), such as acidic copper chloride etching solution or alkaline ammonia etching solution, etc., and this application embodiment does not specifically limit it in this way.

[0024] The etching solution mentioned above refers to a chemical solution that can chemically react with the metal material on the surface of the enameled wire blank, thereby gradually dissolving and thinning the metal layer. The specific composition of the etching solution can be selected according to the material of the enameled wire blank (i.e., the conductor): for copper or copper alloy conductors, an acidic copper chloride etching solution can be used, whose main components are copper chloride and hydrochloric acid, achieving uniform dissolution of the copper layer through the redox reaction between copper ions and metallic copper; an alkaline ammonia etching solution can also be used, whose main components are ammonia and ammonium chloride, promoting the dissolution reaction of copper by forming a complex between copper ions and ammonia molecules. For conductors of other materials, such as gold, silver, or aluminum conductors, a special etching solution suitable for that metal material can be selected accordingly. The etching and thinning process of the conductor by the etching solution is essentially a chemical process controlled by both diffusion and reaction kinetics. The etching rate depends on the solution temperature, the concentration of the effective components, and the efficiency of mass exchange between the conductor surface and the solution.

[0025] The aforementioned phrase, "using controllable tension to immerse the enameled wire blank in the etching solution in a wave-like pattern along the direction of travel," specifically refers to the fact that, as the enameled wire blank flows through the etching assembly 30, its path is not a straight horizontal line through the etching solution, but rather a wavy, undulating trajectory within the etching area. Specifically, after entering the etching solution, the enameled wire blank is repeatedly lowered and raised vertically by several alternately arranged guide components, forming continuous peaks and troughs. This wave-like movement significantly increases the actual immersion path length of the enameled wire blank in the etching solution compared to the straight length of the etching tank 31, thereby effectively extending the contact reaction time between the enameled wire blank and the etching solution without increasing the equipment's footprint. Meanwhile, during the bending and traveling process, the enameled wire blank experiences relative movement and disturbance between its surface and the etchant, which helps to break down the reaction boundary layer adhering to the surface of the enameled wire blank. This promotes continuous contact between the fresh etchant and the surface of the enameled wire blank, as well as the timely removal of reaction products, thereby ensuring uniform etching rates across all parts of the conductor's circumference. Furthermore, by controlling the traveling speed of the enameled wire blank and the spacing between the peaks and troughs of the wavy path, the degree of etching reaction can be flexibly adjusted to meet the preparation requirements of different target wire diameters.

[0026] Thus, the precision wire preparation apparatus 1 of this application embodiment, through the above-described structural configuration and the coordinated operation of the winding / unwinding assembly 10, the pretreatment assembly 20, the etching assembly 30, and the post-treatment assembly 40, can perform high-precision uniform etching to thin the pre-molded enameled wire blank. Specifically, the winding / unwinding assembly 10 can release and wind the wire with controllable tension, and the etching assembly 30 can immerse the wire in the etching solution in a wave-like pattern with controllable tension, effectively extending the etching reaction time and promoting full contact between the etching solution and the wire surface, ensuring the uniformity of etching. Simultaneously, the pretreatment assembly 20 removes surface grease and impurities, and the post-treatment assembly 40 cleans and dries the wire, enabling the stable preparation of fine wires with a diameter smaller than the molding limit, breaking through the 7μm diameter limit of traditional molding processes.

[0027] In some examples, such as Figure 1 As shown, the unwinding / taking-up assembly 10 includes an unwinding roller 11, a taking-up roller 12, a tension sensor 13, at least one tension regulator, and a servo motor (not shown). A pre-processing assembly 20, an etching assembly 30, and a post-processing assembly 40 are sequentially arranged between the unwinding roller 11 and the taking-up roller 12. The unwinding roller 11 is configured to release the enameled wire blank, and the taking-up roller 12 is configured to wind up the finished wire. The tension sensor 13 is located at the wire exit end of the unwinding roller 11 and is configured to detect the real-time tension of the enameled wire blank and output a tension signal. The tension regulator is located at the wire inlet end and / or the wire outlet end of the etching assembly 30 and is electrically connected to the tension sensor 13. The tension regulator is configured to adjust the tension of the enameled wire blank or the tension of the semi-finished wire according to the tension signal. The servo motor is drively connected to the taking-up roller 12 and is configured to drive the taking-up roller 12 to rotate. Thus, the tension of the enameled wire blank at the unwinding end is detected in real time by the tension sensor 13, and the tension signal is fed back to the tension regulator. The tension regulator dynamically adjusts the wire tension at the inlet and / or outlet ends of the etching assembly 30 according to the signal, thereby forming a closed-loop tension control system throughout the entire wire travel path. This control method can promptly compensate for tension disturbances caused by factors such as speed fluctuations between the unwinding roller 11 and the take-up roller 12, changes in the weight of the wire itself, and fluctuations in the viscosity resistance of the etching solution. It effectively prevents the ultra-fine wire from undergoing plastic stretching or even breakage due to excessive tension during the etching process, and also avoids problems such as wire slack, entanglement, or jamming due to insufficient tension. This significantly improves the operational stability and product yield of the ultra-fine wire preparation process.

[0028] It should be noted that the tension sensor 13 in this example is located at the lead-out end of the unwinding roller 11 rather than at other locations. This is because this location is at the beginning of the entire conductor travel path, and the tension signal detected here can reflect the state changes of the unwinding process most promptly, allowing sufficient reaction time for tension adjustment in subsequent stages. The tension signal received by the tension regulator in this example is an electrical signal, which can be processed and compared by a built-in or external controller (such as a programmable logic controller). The controller has a pre-stored target tension value matching the current process. When the detected real-time tension deviates from the target tension value, the controller outputs an adjustment command to the tension regulator. The transmission connection between the servo motor and the take-up roller 12 can be a direct drive or an indirect drive through a reducer or synchronous belt transmission mechanism. Its rotational speed can be dynamically adjusted according to the change in the take-up diameter to ensure a constant take-up linear speed.

[0029] In some examples, such as Figure 1 As shown, at least one tension regulator includes a first tension regulator 14 and a second tension regulator 15. The first tension regulator 14 is disposed between the pretreatment component 20 and the etching component 30, and is configured to adjust the inlet tension of the inlet end of the etching component 30 according to a tension signal. The second tension regulator 15 is disposed between the etching component 30 and the post-treatment component 40, and is configured to adjust the outlet tension of the outlet end of the etching component 30 according to a tension signal. Thus, by providing independent tension regulators at the inlet and outlet ends of the etching component 30, the tension of the wire (i.e., enameled wire blank or semi-finished wire) entering and leaving the etching area can be controlled separately. Since the wire diameter and cross-sectional area decrease after etching and thinning, its tensile strength decreases accordingly. Therefore, the target tension value required at the outlet end should be adaptively lower than that at the inlet end to avoid breakage of the etched thin wire during the outlet traction process. The two tension regulators work independently, which can meet the different tension requirements of the wires before and after etching, ensuring that the wires are always in their appropriate tension state throughout the etching process. This not only ensures the stability of the etching process, but also effectively reduces the risk of wire breakage.

[0030] It should be noted that in this example, the first tension regulator 14 and the second tension regulator 15 independently receive the tension signal from the tension sensor 13 and independently adjust the tension. Although they share the same tension detection signal source, their target adjustment value (i.e., the set tension) can be set separately according to the different states of the conductor before and after etching, and the two do not affect each other. Typically, the set tension value of the second tension regulator 15 is lower than that of the first tension regulator 14 to accommodate the physical characteristic of the conductor's strength decreasing after etching. The specific installation positions of the two tension regulators should be as close as possible to the inlet 311 and outlet 312 of the etching assembly 30 to reduce the length of the free section of the conductor between the tension regulator and the etching assembly 30, thereby improving the response speed and accuracy of tension control.

[0031] In some examples, such as Figure 1 As shown, the first tension regulator 14 is either a servo tensioner or a magnetic powder tensioner. Thus, the servo tensioner features fast response and high control precision, enabling real-time adjustment based on changes in the tension signal, making it suitable for high-speed operation or production scenarios with large tension fluctuations. The magnetic powder tensioner, on the other hand, features simple structure, reliable operation, low cost, and stable torque output, making it suitable for production applications with relatively stable operating speeds or cost-sensitive conditions. Flexibly selecting the appropriate tension regulator type based on actual working conditions helps optimize equipment configuration and reduce manufacturing costs while ensuring tension control accuracy.

[0032] It should be noted that the servo tensioner in this example typically includes a servo motor and a drive roller or swing arm assembly driven by it. It achieves precise adjustment of the conductor tension by changing the motor's output torque or rotation angle, with a control accuracy within ±0.5%. The magnetic powder tensioner in this example utilizes an electromagnetic field to control the shear force between magnetic powder particles to transmit torque. Its output torque can be linearly adjusted by regulating the excitation current, thus achieving tension control. Both types of tensioners can be electrically connected to a controller, receiving analog or digital command signals from the controller to achieve automated closed-loop regulation without manual intervention.

[0033] In some examples, such as Figure 1 As shown, the second tension regulator 15 is a servo tensioner or a magnetic powder tensioner. Thus, similar to the first tension regulator 14, the second tension regulator 15 employs a servo tensioner or a magnetic powder tensioner, also possessing the advantages of fast response or stable control. Depending on the actual tension control requirements and operating conditions at the output end of the etching assembly 30, a tensioner of the same or different type as the first tension regulator 14 can be flexibly configured to ensure the accuracy and stability of the tension control at the output end.

[0034] It should be noted that the specific type of the second tension regulator 15 in this example can be the same as or different from the first tension regulator 14. The two can be selected independently without affecting each other. For example, on production lines requiring high-speed operation and high tension control, both the first tension regulator 14 and the second tension regulator 15 can be servo tensioners to achieve precise tension control throughout the entire process. In scenarios where cost is more sensitive and the operating speed is relatively stable, both can be magnetic powder tensioners. Furthermore, a hybrid configuration can be used, for example, using a servo tensioner at the inlet end to ensure precise tension control before etching, and a magnetic powder tensioner at the outlet end to meet the smooth traction requirements of lower tension after etching, thereby achieving an optimal balance between performance and cost.

[0035] In some examples, such as Figure 1 As shown, the pretreatment component 20 includes an ultrasonic cleaning tank 21 and an air knife dryer 22. The ultrasonic cleaning tank 21 is configured to ultrasonically clean the enameled wire blank to remove grease and impurities from its surface. The air knife dryer 22 is located at the outlet of the ultrasonic cleaning tank 21 and is configured to air-dry the cleaned enameled wire blank. Thus, through the cleaning action of the ultrasonic cleaning tank 21, the cavitation effect generated by ultrasound in the cleaning solution effectively peels off and removes oil, dust, and other microparticle contaminants that have adhered to the surface of the enameled wire blank during molding, storage, and transportation. This restores the surface of the enameled wire blank to a clean metallic state, providing a fresh and uniform activated surface for subsequent etching reactions. This avoids insufficient etching or differences in etching rate caused by localized contamination, thereby ensuring the uniformity and repeatability of the etching thinning. Meanwhile, the air knife dryer 22 quickly dries the enameled wire blank immediately after cleaning, which can effectively prevent the cleaning solution from being carried into the subsequent etching tank 31 and contaminating the etching solution. This avoids the components in the cleaning solution from adversely affecting the concentration and composition of the etching solution. It also prevents the water film remaining on the surface of the enameled wire blank from diluting the etching solution and causing abnormal local etching rates, further ensuring the stability and consistency of the etching process.

[0036] It should be noted that the ultrasonic cleaning tank 21 in this example contains a cleaning agent suitable for removing grease and impurities, such as a weakly alkaline water-based cleaning agent or a neutral degreaser. The specific type can be selected according to the nature of the contaminants on the surface of the blank. A guiding structure (such as guide roller 32, see the description of guide roller 32 in the etching tank 31 below) can be provided in the ultrasonic cleaning tank 21 to allow the enameled wire blank to be immersed in the tank in a wave-like motion for a certain distance, ensuring sufficient cleaning time. The ultrasonic frequency can usually be controlled within the range of 20kHz to 80kHz. The lower the frequency, the stronger the cavitation effect, suitable for removing larger particulate contaminants; the higher the frequency, the gentler the cleaning effect, suitable for cleaning precision surfaces. The specific frequency can be adjusted according to the wire diameter and the degree of surface contamination. The air knife dryer 22 in this example generates a high-speed airflow through a high-pressure blower, forming a flat, high-speed air curtain through a narrow nozzle. This air curtain is blown at a certain angle onto the surface of the enameled wire blank, effectively peeling off and blowing away the liquid film adhering to the surface of the enameled wire blank. The outlet air temperature of the air knife dryer 22 can be set to room temperature or slightly heated (e.g., 30°C to 50°C) to avoid adverse effects of high temperature on the mechanical properties or insulation layer of the ultra-fine wires.

[0037] In some examples, such as Figure 1 As shown, the post-processing component 40 includes a multi-stage counter-current cleaning tank 41 and a hot air drying chamber 42. The multi-stage counter-current cleaning tank 41 is located between the etching component 30 and the hot air drying chamber 42. The water inlet direction of the multi-stage counter-current cleaning tank 41 is opposite to the travel direction of the semi-finished wire, and it is configured to remove residual etching solution from the surface of the semi-finished wire. The hot air drying chamber 42 is configured to dry the cleaned semi-finished wire to obtain the finished wire. In this way, by adopting a multi-stage counter-current cleaning method, fresh water flows in from the last cleaning tank and flows in the opposite direction to the previous cleaning tank, while the semi-finished wire travels in the forward direction from the first cleaning tank to the last cleaning tank. This counter-current arrangement ensures that the semi-finished wire comes into contact with fresher and cleaner cleaning water as it gets closer to the outlet during its journey. This ensures that the residual etching solution on the surface of the semi-finished wire is completely removed when it finally exits the tank, effectively preventing acidic or alkaline components in the etching solution from remaining on the surface of the semi-finished wire and causing continuous corrosion. It also prevents the residual solution from affecting the subsequent insulation or welding performance of the wire. After cleaning, the hot air drying oven 42 rapidly heats and dries the semi-finished wires, which can completely remove the surface moisture of the semi-finished wires and prevent moisture residue from causing oxidation and discoloration or adhesion between adjacent turns during the winding and storage of the finished wires, thus ensuring the surface quality and long-term storage stability of the finished wires.

[0038] It should be noted that the multi-stage countercurrent cleaning tank 41 in this example can have two, three, or more stages, the specific number of stages being determined based on the properties of the etching solution and the cleaning difficulty. Each cleaning tank can be equipped with a guide structure to ensure the semi-finished wire travels in an immersed state, guaranteeing thorough rinsing. The countercurrent water flow results in the water in the first cleaning tank (near the etching component 30) containing a higher concentration of residual solution, while the water in the last cleaning tank (near the hot air drying chamber 42) is fresh replenishment water. This gradient water quality distribution ensures full utilization of the water in each cleaning tank, significantly saving water consumption while maintaining cleaning effectiveness. The drying temperature in the hot air drying chamber 42 can be set according to the wire material and the temperature resistance rating of the insulation layer, typically controlled within the range of 80℃ to 150℃. Multiple guide structures can be installed in the hot air drying chamber 42 to extend the wire's travel path within the chamber, ensuring sufficient drying time and effect. Simultaneously, the hot air in the hot air drying chamber 42 can be circulated for heating to improve energy efficiency.

[0039] In some examples, such as Figure 1 As shown, the etching assembly 30 includes an etching tank 31 and at least three guide rollers 32 disposed within the etching tank 31. The etching tank 31 has an inlet 311 and an outlet 312 disposed opposite to each other and is configured to contain etching solution. The at least three guide rollers 32 are staggered between the inlet 311 and the outlet 312 and are configured to immerse the enameled wire blank in the etching solution in a wavy pattern along the direction of travel within the etching tank 31. Thus, through the staggered arrangement of the at least three guide rollers 32 within the etching tank 31, for example, one guide roller 32 is positioned near the bottom of the tank, and adjacent guide rollers 32 are positioned near the top of the tank, and so on, the travel path of the enameled wire blank within the etching tank 31 is no longer a straight line, but forms a continuous undulating wavy trajectory. This wavy travel method significantly increases the actual travel path of the enameled wire blank in the etching solution without increasing the length of the etching tank 31 or the equipment footprint. This extends the effective contact and reaction time between the enameled wire blank and the etching solution, resulting in a more complete etching reaction and enabling a greater etching thinning amount within the same tank size. Simultaneously, the repeated bending of the enameled wire blank during its wavy travel creates relative movement and flow disturbance between the blank's surface and the etching solution. This effectively breaks down the concentration boundary layer formed on the blank's surface due to reaction consumption, promoting continuous contact between fresh etching solution and the blank's surface, as well as the timely diffusion and detachment of reaction products. This ensures a uniform etching rate in both the circumferential and length directions, preventing localized over-etching or under-etching and significantly improving etching quality.

[0040] It should be noted that the number of guide rollers 32 in this example can be three, four, or more. The specific number can be optimized based on factors such as the required etching time, the reactivity of the etching solution, the travel speed of the enameled wire blank, and the size of the etching tank 31. Generally, the more guide rollers 32 there are, the more alternations of peaks and troughs in the wavy path, the longer the actual immersion path of the enameled wire blank within the etching tank 31, and the longer the etching reaction time. The guide rollers 32 should be made of materials resistant to etching solution corrosion, such as polytetrafluoroethylene, ceramics, titanium alloys, or acid and alkali resistant stainless steel. Their surfaces should have a high degree of smoothness to reduce frictional damage to the traveling enameled wire blank. The guide rollers 32 are rotatably mounted on the support structure within the etching tank 31, and their rotational flexibility should be good to ensure that the enameled wire blank can smoothly drive the guide rollers 32 to rotate during travel, avoiding scratches to the enameled wire blank due to sliding friction. The inlet 311 and outlet 312 may be provided with guide holes or guide nozzles to guide the enameled wire blank accurately into the first guide roller 32 and out from the last guide roller 32. At the same time, a sealing structure may be provided to reduce the leakage of etching solution from the inlet and outlet.

[0041] In some examples, such as Figure 1 and Figure 2 As shown, the etching assembly 30 also includes a circulating filter module 33, which is disposed outside the etching tank 31. The circulating filter module 33 includes a circulating pump 331 and a filter 332. The inlet of the circulating pump 331 is connected to the bottom of the etching tank 31, and the outlet of the circulating pump 331 is connected to the top of the etching tank 31. The filter 332 is disposed on the pipeline between the circulating pump 331 and the etching tank 31 and is configured to remove reaction products generated during the etching process. In this way, the circulating filter module 33 can continuously circulate the etching solution in the etching tank 31. The forced convection of the etching solution effectively avoids uneven solution concentration caused by local etching reaction consumption, keeping the solution composition in each area of ​​the etching tank 31 basically consistent, thereby ensuring that the etching solution in contact with different positions of the enameled wire blank has similar etching ability. Meanwhile, filter 332 can capture and remove metal ions, reaction precipitates and other suspended impurities generated by the etching reaction in a timely manner, avoiding the accumulation of these reaction products in the tank, which would affect the activity of the etching solution or adhere to the surface of the semi-finished wires and form stains. This effectively extends the service life of a single batch of etching solution, reduces the frequency of etching solution replacement, and maintains the long-term stability of the etching rate.

[0042] It should be noted that the specific type of filter 332 in this example can be selected according to the properties of the etching solution and the size of the impurity particles to be removed. For example, a cartridge filter 332, a bag filter 332, or an activated carbon filter 332 can be used, with a filtration accuracy typically between 1 μm and 10 μm. The flow rate of the circulation pump 331 in this example should be reasonably selected based on the volume of the etching tank 31 and the required number of cycles, generally ensuring that the etching solution circulates 2 to 5 times per hour. The inlet of the circulation pump 331 is located at the bottom of the etching tank 31, which facilitates the timely removal of heavier reaction precipitates deposited at the bottom. The outlet is located at the top of the etching tank 31, which helps to form a top-to-bottom circulating flow path within the tank, promoting uniform mixing of the etching solution throughout the tank and avoiding dead zones.

[0043] In some examples, such as Figure 1 and Figure 2 As shown, the etching assembly 30 also includes a temperature control module 34, which includes a heater 341 and a temperature sensor 342. The temperature sensor 342 is located inside the etching tank 31 and is configured to detect the temperature of the etching solution in real time. The heater 341 is configured to heat the etching solution when the temperature sensor 342 detects that the temperature of the etching solution is lower than a preset temperature value, so as to keep the temperature of the etching solution within the preset temperature range. Thus, the etching reaction rate is closely positively correlated with temperature; a certain change in temperature will cause a significant fluctuation in the etching rate. Through the real-time monitoring and heating adjustment of the temperature control module 34, the temperature of the etching solution can be accurately maintained within the preset process window range, effectively eliminating temperature drift caused by factors such as changes in ambient temperature, heat dissipation from solution circulation, or the thermal effect of the etching reaction itself, ensuring a constant and controllable etching rate, thereby ensuring the wire diameter accuracy and batch-to-batch consistency of the finished wires.

[0044] It should be noted that the heater 341 in this example can be an immersion electric heating tube, a plate heat exchanger, or a tubular heat exchanger, etc. Its heating power should be rationally designed based on the volume of the etching tank 31, the specific heat capacity of the etching solution, environmental heat dissipation conditions, and the required heating rate. The temperature sensor 342 can be a thermocouple or a resistance temperature detector (RTD) (such as a PT100 platinum RTD). Its detection accuracy is generally not less than ±0.5℃. The probe of the temperature sensor 342 should be completely immersed in the etching solution and positioned to represent the temperature of the main fluid in the tank, such as in the middle of the etching tank 31 or near the path of the enameled wire blank. The specific value of the preset temperature range in this example can be determined based on the optimal operating temperature range of the selected etching solution. For example, for acidic copper chloride etching solution, it can be set to 45℃ to 55℃, and for alkaline ammonia etching solution, it can be set to 40℃ to 50℃. The temperature control module 34 may further include a cooling device, such as a cooling coil or heat exchanger, for cooling down the liquid when the temperature exceeds a preset upper limit, thereby achieving bidirectional constant temperature control.

[0045] In some examples, such as Figure 1 and Figure 2 As shown, the etching assembly 30 also includes a chemical agitator 35, which is located at the bottom of the etching tank 31 and is configured to maintain a uniform flow of the etching solution. Thus, the chemical agitator 35 generates continuous agitation at the bottom of the etching tank 31, effectively eliminating potential solution stagnation at the bottom and corners of the etching tank 31, and preventing localized concentration or temperature differences in these areas due to poor flowability. The chemical agitator 35 works in conjunction with the circulation filter module 33 to enhance the uniformity of the solution within the etching tank 31 from different perspectives—the circulation filter module 33 achieves macroscopic circulation of the solution inside and outside the tank, while the chemical agitator 35 focuses on microscopic mixing and convection in various areas of the tank, especially the bottom area. The combined effect of both ensures uniform concentration and temperature throughout the entire chemical solution system within the etching tank 31, thereby providing a stable and uniform etching environment for the enameled wire blank and further improving the etching uniformity along the entire length of the enameled wire blank.

[0046] It should be noted that the chemical agitator 35 in this example can specifically take the form of a mechanical agitator, driven by a motor located outside the etching tank 31, rotating the agitator shaft and blades; it can also take the form of a magnetic agitator, driven by a magnetic field to rotate a stirrer located at the bottom of the tank; or it can take the form of jet agitation, where a portion of the chemical solution is diverted from the bottom of the tank by a circulating pump 331 to form a jet for agitation. The agitator speed should not be too high to avoid violent fluctuations in the liquid surface that could impact and disturb the moving enameled wire blank, or cause the etching solution to splash. Generally, it is best to have a stable flow of the etching solution without obvious vortices or splashing. The specific speed can be adjusted appropriately according to the size of the etching tank 31 and the viscosity of the chemical solution.

[0047] In some examples, such as Figure 1 and Figure 2 As shown, the precision conductor preparation device 1 also includes an online conductor diameter detection component 50. This component is located at the outlet end of the post-processing component 40 and is configured to detect the diameter of the finished conductor in real time. Thus, the online conductor diameter detection component 50 can measure the actual diameter of the finished conductor in real time in a non-contact manner after cleaning and drying but before winding, providing continuous and timely conductor diameter data for production and quality control. Operators can use this detection data to monitor product size fluctuations, promptly identify conductor diameter deviations, and adjust the process accordingly. Combined with an automated control system, the detection signal can also be used as feedback input to automatically adjust relevant process parameters to achieve closed-loop control of the conductor diameter. This effectively avoids conductor diameter drift caused by factors such as changes in solution concentration and temperature fluctuations during long-term production, ensuring the consistency of conductor diameter across the entire roll and batch-to-batch repeatability.

[0048] It should be noted that the online wire diameter detection component 50 in this example can specifically employ a laser diameter gauge, which achieves high-precision diameter measurement through laser scanning or laser diffraction principles. The measurement accuracy typically reaches ±0.1μm or even higher, with a fast response speed, making it suitable for online real-time detection on high-speed production lines. Alternatively, a CCD diameter gauge can be used, which acquires projected images of the wire through a high-resolution image sensor and performs image processing and analysis. It can not only measure the diameter but also simultaneously analyze information such as the wire's roundness and surface defects. The online wire diameter detection component 50 should be installed at a position after the hot air drying oven 42 and before the take-up roller 12 to ensure that the wire being inspected is a completely dry, finished product free of liquid film or moisture interference. The installation of the online wire diameter detection component 50 should ensure that the finished wire passes through the center of the detection area and is equipped with an anti-vibration device to prevent vibration of the finished wire during the inspection process from affecting the measurement accuracy.

[0049] In one embodiment, such as Figure 3 As shown in the figure, this application embodiment also provides a method for preparing a precision wire, applied in the precision wire preparation apparatus 1 in the above embodiment. The precision wire preparation method includes the following steps: Step S110: The enameled wire blank, which has been molded to the first preset wire diameter, is loaded onto the unwinding end of the take-up and unwinding assembly, and the enameled wire blank is released with controllable tension.

[0050] Step S120: Pass the enameled wire blank through the pretreatment assembly to remove grease and impurities from the surface of the enameled wire blank.

[0051] Step S130: The enameled wire blank is flowed through the etching assembly, and the enameled wire blank is immersed in the etching solution in a wave-like manner with controllable tension in the etching assembly, so as to etch and thin the enameled wire blank to a second preset wire diameter by the etching solution, and obtain a semi-finished wire, wherein the second preset wire diameter is smaller than the first preset wire diameter.

[0052] Step S140: The semi-finished wires are passed through the post-processing unit to be cleaned and dried in sequence to obtain the finished wires.

[0053] Step S150: The finished wire is wound up in an orderly manner through the winding end of the winding and unwinding assembly.

[0054] It should be noted that the precision wire preparation method of this application embodiment is mainly applied to the continuous mass production of ultra-fine circular cross-section enameled wires, and is particularly suitable for the industrial preparation of high-precision electromagnetic wires with wire diameters ranging from 1μm to 6μm. This method uses enameled wire blanks molded to 7μm to 15μm as starting material, and achieves further refinement of the wire diameter through an integrated online etching thinning process. Throughout the entire process, controllable tension is the core control element across all steps. Precise management of the wire tension is required at every stage, from unwinding, traveling, etching to rewinding, to ensure that the ultra-fine wires are not broken or loosened during travel. Simultaneously, "wave-shaped immersion travel" is a key process for achieving high-efficiency and high-uniformity etching. This method allows for sufficient etching reaction time within a limited equipment length and ensures uniform thinning of the wire circumferentially. Furthermore, all the above steps are completed automatically and sequentially on the same continuous preparation device, without manual intervention or material transfer, thus ensuring production efficiency and product consistency.

[0055] Thus, the precision wire fabrication method of this application embodiment, through the above-described steps, uses pre-molded enameled wire blanks as raw materials, and undergoes continuous processing including surface purification, wavy dynamic etching for thinning, cleaning, and drying, ultimately obtaining finished precision wires with a wire diameter smaller than the traditional molding limit. The controllable tension release and winding throughout the process effectively ensure the mechanical safety of the ultra-fine wires during long-stroke travel; the wavy immersion etching ensures etching uniformity while achieving sufficient thinning; and the cleaning and drying steps guarantee the surface cleanliness and dryness of the finished wires. The organic combination of these steps enables the stable fabrication of wires with diameters below 7μm, which were previously difficult to achieve in molding processes, effectively breaking through the wire diameter limit of traditional molding processes.

[0056] In some examples, the first preset wire diameter is 7μm to 15μm, and the second preset wire diameter is 1μm to 6μm. By setting the first preset wire diameter within the range of 7μm to 15μm, the high efficiency and good quality stability of existing mature molding processes within this wire diameter range can be fully utilized to obtain enameled wire blanks with uniform quality. Subsequent precision etching thinning further reduces the wire diameter to the range of 1μm to 6μm, effectively avoiding the wire breakage and uneven wire diameter problems caused by insufficient mold precision and material flowability when the molding process produces wire diameters below 7μm. This combination of wire diameter ranges allows the entire manufacturing method to utilize both the high efficiency of the molding process and the high precision thinning capability of the etching process, achieving a complementary advantage of the two processes.

[0057] It should be noted that the specific values ​​of the first and second preset wire diameters in this example can be flexibly set according to the application requirements of the final product. The first preset wire diameter can be, for example, 7μm, 8μm, 10μm, 12μm, or 15μm, and the second preset wire diameter can be, for example, 1μm, 2μm, 3μm, 4μm, 5μm, or 6μm. The difference between the first and second preset wire diameters is the etching thinning amount, which is typically between 1μm and 10μm, depending on the specifications of the incoming blank and the target specifications of the finished product. Under the same etching conditions, a larger first preset wire diameter or a smaller second preset wire diameter requires a larger etching thinning amount, and correspondingly, it may be necessary to adjust process parameters such as the enameled wire blank travel speed or the etching solution temperature to match the required etching amount.

[0058] In some examples, such as Figure 4 As shown, the precision wire fabrication method also includes the following steps: Step S160: Based on the wire diameter detection signal fed back by the finished wire from the wire diameter online detection component, adjust the unwinding tension and winding tension of the unwinding and winding components and the etching parameters of the etching component in real time to stabilize the wire diameter of the finished wire at the second preset wire diameter.

[0059] It should be noted that in this method, the online wire diameter detection component 50 continuously performs real-time measurements before the finished wire is wound up, and transmits the measured wire diameter data to the control system in the form of an electrical signal. The control system compares the measured wire diameter value with a preset second target wire diameter value. When a deviation occurs, the system automatically calculates the required adjustment amount and outputs the corresponding adjustment command. Adjustable etching parameters include, but are not limited to, the temperature of the etching solution, the travel speed of the enameled wire blank (which directly affects the etching time), and the circulation flow rate of the etching solution. For example, if the wire diameter of the finished wire is detected to be too large, it indicates insufficient etching. The control system can correspondingly increase the temperature of the etching solution or decrease the travel speed of the enameled wire blank to increase the etching amount. If the wire diameter of the finished wire is detected to be too small, the opposite adjustment is performed. The adjustment of the unwinding tension and winding tension is used to ensure the stability of the finished wire during the journey, avoiding the risk of wire breakage due to tension fluctuations affecting etching uniformity.

[0060] In this way, through the above-described methods and steps, a real-time closed-loop adjustment mechanism based on the measured wire diameter is established, enabling the entire preparation process to possess adaptive intelligent control capabilities. Even when faced with disturbances such as slow changes in the concentration of the etching solution due to long-term use, fluctuations in ambient temperature, and batch-to-batch differences in the wire diameter of the incoming blank, this feedback adjustment mechanism can respond promptly and provide targeted compensation, ensuring that the wire diameter of the finished conductor is always precisely controlled within the target specification range. This significantly improves product yield, reduces scrap rate, and guarantees product consistency and batch-to-batch repeatability under long-cycle continuous production conditions.

[0061] In summary, the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A precision wire fabrication apparatus, characterized in that, The precision wire fabrication apparatus includes a winding / unwinding assembly, a pretreatment assembly, an etching assembly, and a post-treatment assembly, wherein... The winding and unwinding assembly is configured to release the enameled wire blank, which has been molded to a first preset wire diameter, under controllable tension, and to allow the enameled wire blank to flow sequentially through the pretreatment assembly, the etching assembly, and the post-treatment assembly to obtain a finished wire with a second preset wire diameter, and to wind the finished wire in an orderly manner, wherein the second preset wire diameter is smaller than the first preset wire diameter. The pretreatment component is configured to perform surface pretreatment on the enameled wire blank that flows through it, so as to remove grease and impurities from the surface of the enameled wire blank. The etching assembly is configured to immerse the enameled wire blank in the etching solution in a wavy manner with controllable tension, so as to perform etching and thinning treatment on the enameled wire blank to obtain a semi-finished wire with a second preset wire diameter. The post-processing component is configured to sequentially clean and dry the semi-finished wires flowing through it to obtain the finished wires.

2. The precision wire preparation apparatus according to claim 1, characterized in that, The unwinding and take-up assembly includes an unwinding roller, a take-up roller, a tension sensor, at least one tension regulator, and a servo motor. The pre-processing assembly, the etching assembly, and the post-processing assembly are sequentially arranged between the unwinding roller and the take-up roller. The unwinding roller is configured to release the enameled wire blank, and the winding roller is configured to wind up the finished wire. The tension sensor is located at the wire exit end of the unwinding roller and is configured to detect the real-time tension of the enameled wire blank and output a tension signal. The tension regulator is disposed at the inlet and / or outlet of the etching assembly and is electrically connected to the tension sensor. The tension regulator is configured to adjust the tension of the enameled wire blank or the tension of the semi-finished wire according to the tension signal. The servo motor is connected to the winding roller and is configured to drive the winding roller to rotate.

3. The precision wire preparation apparatus according to claim 2, characterized in that, At least one of the tension regulators includes a first tension regulator and a second tension regulator, wherein, The first tension regulator is disposed between the pretreatment component and the etching component, and is configured to adjust the feed tension at the feed end of the etching component according to the tension signal; The second tension regulator is disposed between the etching component and the post-processing component, and is configured to adjust the lead-out tension of the lead-out end of the etching component according to the tension signal.

4. The precision wire preparation apparatus according to claim 3, characterized in that, The first tension regulator is a servo tensioner or a magnetic powder tensioner; and / or, The second tension regulator is a servo tensioner or a magnetic powder tensioner.

5. The precision wire fabrication apparatus according to claim 1, characterized in that, The pretreatment assembly includes an ultrasonic cleaning tank and an air knife dryer. The ultrasonic cleaning tank is configured to ultrasonically clean the enameled wire blank to remove grease and impurities from its surface. The air knife dryer is located at the outlet end of the ultrasonic cleaning tank and is configured to air-dry the cleaned enameled wire blank; and / or, The post-processing component includes a multi-stage countercurrent cleaning tank and a hot air drying chamber. The multi-stage countercurrent cleaning tank is disposed between the etching component and the hot air drying chamber. The water inlet direction of the multi-stage countercurrent cleaning tank is opposite to the travel direction of the semi-finished wire, and it is configured to remove residual etching solution from the surface of the semi-finished wire. The hot air drying chamber is configured to dry the cleaned semi-finished wire to obtain the finished wire.

6. The precision wire preparation apparatus according to claim 1, characterized in that, The etching assembly includes an etching tank and at least three guide rollers disposed within the etching tank, wherein... The etching tank is provided with an inlet and an outlet that are arranged opposite to each other, and is configured to contain the etching solution. At least three of the guide rollers are staggered between the inlet and the outlet, and are configured to immerse the enameled wire blank in the etching solution in a wavy pattern along the direction of travel in the etching tank.

7. The precision wire preparation apparatus according to claim 6, characterized in that, The etching assembly further includes a circulating filtration module disposed outside the etching tank. The circulating filtration module includes a circulating pump and a filter. The inlet of the circulating pump is connected to the bottom of the etching tank, and the outlet of the circulating pump is connected to the top of the etching tank. The filter is disposed on the pipeline between the circulating pump and the etching tank and is configured to remove reaction products generated during the etching process; and / or, The etching assembly further includes a temperature control module, which comprises a heater and a temperature sensor. The temperature sensor is disposed within the etching tank and is configured to detect the temperature of the etching solution in real time. The heater is configured to heat the etching solution when the temperature sensor detects that the temperature of the etching solution is lower than a preset temperature value, so as to maintain the temperature of the etching solution within the preset temperature range; and / or, The etching assembly also includes a chemical agitator, which is located at the bottom of the etching tank and configured to maintain a uniform flow of the etching solution.

8. The precision wire preparation apparatus according to any one of claims 1 to 7, characterized in that, The precision conductor manufacturing apparatus further includes an online conductor diameter detection component, which is located at the output end of the post-processing component and is configured to detect the conductor diameter of the finished product in real time.

9. A method for preparing a precision wire, applied in the precision wire preparation apparatus as described in any one of claims 1 to 8, characterized in that, The method for preparing the precision wire includes the following steps: The enameled wire blank, which has been molded to a first preset wire diameter, is loaded onto the unwinding end of the take-up and unwinding assembly, and the enameled wire blank is released with controllable tension. The enameled wire blank is passed through the pretreatment component to remove grease and impurities from the surface of the enameled wire blank; The enameled wire blank is flowed through the etching assembly, and the enameled wire blank is immersed in the etching solution in a wave-like manner with controllable tension in the etching assembly, so as to etch and thin the enameled wire blank to a second preset wire diameter by the etching solution, to obtain a semi-finished wire, wherein the second preset wire diameter is smaller than the first preset wire diameter. The semi-finished wire is passed through the post-processing component to be cleaned and dried sequentially by the post-processing component to obtain the finished wire; The finished wire is wound up in an orderly manner through the winding end of the winding and unwinding assembly.

10. The method for preparing precision wires according to claim 9, characterized in that, The first preset wire diameter is 7 μm to 15 μm, and the second preset wire diameter is 1 μm to 6 μm; and / or, The precision conductor manufacturing method further includes the following steps: based on the wire diameter detection signal fed back by the finished conductor detected by the wire diameter online detection component, the unwinding tension and winding tension of the winding and unwinding component and the etching parameters of the etching component are adjusted in real time to stabilize the wire diameter of the finished conductor at the second preset wire diameter.

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