Method for manufacturing a micro-resistor of a metal plate

Abstract

A manufacturing method of a metal plate micro-resistor includes a preparation step, an attaching step, and a forming step. The preparation step prepares an alloy resistor block. The attaching step attaches an insulating layer to the alloy resistor block, thereby distinguishing a shielding area covered by the insulating layer, and two preparation areas located on opposite sides of the shielding area, and then attaches two heat dissipation members to the preparation areas, respectively. Each of the heat dissipation members includes a base portion attached to the preparation area, and an extension portion extended from the base portion to the insulating layer. The forming step forms two electrode blocks on the alloy resistor block. Each of the electrode blocks includes a side joint portion connected to a side surface of the alloy resistor block, a lap joint portion bent from the side joint portion to the heat dissipation member, and a bottom joint portion bent and extended from the side joint portion to a bottom surface of the alloy resistor block. Thus, better heat dissipation efficiency is achieved to ensure the quality of overall operation.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a passive electronic component, and more particularly to a method for manufacturing a metal plate microresistor. Background Technology

[0002] See Figure 1 A conventional metal plate microresistor 1 includes an alloy plate 11, an insulating layer 12 formed on one surface of the alloy plate 11, two heat sinks 13 spaced apart from each other on the insulating layer 12, and two electrode blocks 14 connected from opposite sides of the alloy plate 11 to the alloy plate 11, the insulating layer 12, and the heat sinks 13. Based on the resistance value of the alloy plate 11, surrounding electronic components and associated circuits can be electrically connected via the electrode blocks 14, thereby utilizing the resistance value provided by the metal plate microresistor 1.

[0003] However, during operation, the metal plate micro-resistor 1 inevitably generates waste heat due to the conduction of current. Under continuous power-on operation, the undissipated waste heat will cause the overall temperature of the metal plate micro-resistor 1 to rise, thereby changing the original resistance value provided by the metal plate micro-resistor 1 and adversely affecting the operation of the overall circuit. Therefore, how to properly address the waste heat dissipation problem in order to manufacture a micro-resistor product with better heat dissipation has become a crucial breakthrough that those skilled in the art urgently need to achieve. Summary of the Invention

[0004] The purpose of this invention is to provide a method for manufacturing a metal plate microresistor, which can produce a metal plate microresistor with good heat dissipation, thereby ensuring the operational quality during configuration and use.

[0005] The present invention provides a method for manufacturing a metal plate microresistor, comprising a preparation step, an attachment step, and a formation step.

[0006] The preparatory step involves preparing an alloy resistor block. The alloy resistor block includes a first surface and a second surface located on opposite sides, and two side contact surfaces respectively connected to opposite sides of the first surface and the second surface.

[0007] The attachment step includes a first procedure and a second procedure. The first procedure involves attaching an insulating layer to a first surface of the alloy resistor block, dividing the first surface into a shielded area covered by the insulating layer and two preparatory areas located on opposite sides of the shielded area. The second procedure involves attaching two heat sinks to the preparatory areas respectively. Each heat sink includes a base portion attached to the corresponding preparatory area and an extension portion extending from the base portion to the insulating layer.

[0008] The forming step involves forming two electrode blocks on the alloy resistor block, extending from the side contact surface toward the first surface and the second surface, respectively. Each electrode block includes a side contact portion connected to the corresponding side contact surface, an overlap portion bent from the side contact portion to the heat sink on the same side, and a bottom contact portion bent from the side contact portion and extending to the second surface.

[0009] In the method for manufacturing a metal plate micro-resistor according to the present invention, in the attachment step, the insulating layer is attached to the alloy resistor block positioned on the base by an attachment mechanism. The attachment mechanism includes at least one alignment structure, and the base includes at least one mating structure for aligning with the alignment structure.

[0010] In the method for manufacturing a metal plate micro-resistor according to the present invention, in the attachment step, the heat sink is attached to the alloy resistor block positioned on the base by an attachment mechanism. The attachment mechanism includes at least one alignment structure, and the base includes at least one mating structure for aligning with the alignment structure.

[0011] In the method for manufacturing a metal plate microresistor according to the present invention, at least one of the alignment structure and the mating structure is a hole.

[0012] In the method for manufacturing a metal plate microresistor according to the present invention, in the forming step, the overlapping portion of each electrode block is flush with the extension portion of the heat sink on the same side.

[0013] The method for manufacturing a metal plate microresistor according to the present invention includes an electrode block formed by electroplating in the forming step.

[0014] The method for manufacturing a metal plate microresistor according to the present invention includes forming the electrode block by sputtering in the forming step.

[0015] The method for manufacturing a metal plate microresistor according to the present invention includes a coating process of applying metal paste and a sintering process of sintering and hardening the metal paste to form the electrode block.

[0016] In the method for manufacturing a metal plate microresistor according to the present invention, in the attachment step, each of the heat sinks is made of copper.

[0017] The beneficial effects of this invention are as follows: because the heat sink is directly attached to the alloy resistor block, a portion of the heat generated by the alloy resistor block can be directly conducted to the heat sink and dissipated from the preparatory area, while another portion can be conducted to the heat sink and dissipated from the alloy resistor block through the electrode block, which has a larger contact area with the alloy resistor block and is made of metal with better thermal conductivity. This significantly increases the area and dissipation path of heat conduction, thereby achieving better heat dissipation efficiency and ensuring the quality of overall operation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram illustrating an existing metal plate resistor;

[0019] Figure 2 This is a block diagram illustrating the first embodiment of the method for manufacturing a metal plate microresistor according to the present invention;

[0020] Figure 3 This is a flowchart illustrating a preparatory step, an attachment step, and a forming step in the first embodiment;

[0021] Figure 4 This is a schematic diagram illustrating the attachment steps of the first embodiment;

[0022] Figure 5 This is a schematic diagram illustrating the heat dissipation effect of the metal plate microresistor manufactured in the first embodiment;

[0023] Figure 6 This is a block diagram illustrating the second embodiment of the method for manufacturing a metal plate microresistor according to the present invention. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] See Figure 2 This is a first embodiment of the manufacturing method of the metal plate micro resistor of the present invention. The first embodiment includes a preparatory step 21, an attachment step 22, and a forming step 23.

[0026] See also Figure 2 and Figure 3 In the preparatory step 21, an alloy resistor block 3 is prepared. Specifically, the alloy resistor block 3 is made of materials such as manganese copper nickel, manganese copper tin, iron chromium aluminum, and nickel chromium aluminum. The alloy resistor block 3 includes a first surface 31 and a second surface 32 located on opposite sides, and two side contact surfaces 33 respectively connected to the opposite sides of the first surface 31 and the second surface 32.

[0027] The attachment step 22 includes a first procedure 221 and a second procedure 222, during which the alloy resistor block 3 is as follows: Figure 4 The device is positioned on a base 91, which is fitted with an attachment mechanism 92 that has an alignment structure 929 for attaching an insulating layer 4. To ensure attachment accuracy, the base 91 has a mating structure 919 for aligning with the alignment structure 929. Specifically, in this first embodiment, the alignment structure 929 and the mating structure 919 are in the form of holes, thereby forming a positioning hole alignment mechanism. In the first procedure 221, the alignment mechanism is formed by the alignment structure 929 and the mating structure 919, and the attachment mechanism 92 attaches the insulating layer 4 to the first surface 31 of the alloy resistor block 3, thereby dividing the first surface 31 into a shielded area 311 covered by the insulating layer 4 and two preparatory areas 312 located on opposite sides of the shielded area 311. The insulating layer 4 is made of epoxy resin, primarily due to its high thermal conductivity and high insulation properties, but not limited to these, thereby providing protection for the alloy resistor block 3 against the external environment. In the second step 222, two heat sinks 5 are respectively attached to the preparation area 312. Each heat sink 5 is made of copper, which has good thermal conductivity, and includes a base portion 51 attached to the corresponding preparation area 312, and an extension portion 52 extending from the base portion 51 to the insulating layer 4.

[0028] It should be noted that, in order to ensure that each heat sink 5 is accurately aligned and attached to the correct position on the alloy resistor block 3, when the heat sink 5 is attached to the alloy resistor block 3 in the second process 222, a mutual alignment mechanism can be formed by the alignment structure 929 and the mating structure 919 corresponding to each other.

[0029] In the forming step 23, two electrode blocks 6 are formed on the alloy resistor block 3, extending from the side contact surface 33 toward the first surface 31 and the second surface 32, respectively. Specifically, the electrode blocks 6 can be formed by electroplating or sputtering. Each electrode block 6 includes a side contact portion 61 connected to the corresponding side contact surface 33, an overlapping portion 62 bent from the side contact portion 61 to the heat sink 5 on the same side, and a bottom contact portion 63 bent from the side contact portion 61 and extending to the second surface 32. The overlapping portion 62 of each electrode block 6 is flush with the extension portion 52 of the heat sink 5 on the same side, thereby matching the shape of the heat sink 5 to form a heat conduction path that is more suitable for the efficient dissipation of heat energy.

[0030] See Figure 5In the metal plate microresistor manufactured according to this first embodiment, the heat generated by the alloy resistor block 3 is conducted outward to the electrode block 6 and the heat sink 5, which is in direct contact with the preparatory area 312, and dissipates outward along a shorter conduction path, thereby accelerating the heat dissipation speed. In each electrode block 6, in addition to the bottom contact portion 63 that is typically provided for connection with other electronic components, the heat generated by the alloy resistor block 3 is first transferred to the side contact portion 61, whose contact area covers the side contact surface 33, and then transferred to the heat sink 5 for outward dissipation, thus forming another heat dissipation path. Overall, in the manufactured metal plate microresistor, the areas where the alloy resistor block 3 directly contacts the heat sink 5 and the areas that contact the electrode block 6 can all form heat dissipation conduction paths. Therefore, combined with the tendency of the electrode block 6 to easily conduct heat to the heat sink 5 for dissipation, the overall heat dissipation performance can be significantly optimized, thereby ensuring stable performance during configuration and operation.

[0031] See Figure 6 This is a second embodiment of the method for manufacturing a metal plate microresistor of the present invention. The difference between this second embodiment and the first embodiment is that the forming step 23 includes a coating process 231 of applying metal paste and a sintering process 232 of sintering and hardening the metal paste to form the electrode block 6. In other words, this second embodiment differs from the first embodiment only in the way the electrode block 6 is formed. When manufacturing a metal plate microresistor of the same type, this second embodiment can achieve the same effect as the first embodiment, producing a metal plate microresistor with good thermal conductivity.

Claims

1. A method for manufacturing a metal plate microresistor, comprising a preparatory step, wherein the preparatory step prepares an alloy resistor block, the alloy resistor block comprising a first surface and a second surface located on opposite sides, and two side contact surfaces respectively connected to opposite sides of the first surface and the second surface; characterized in that: The method for manufacturing the metal plate microresistor further includes: The application process includes: The first step involves attaching an insulating layer to the first surface of the alloy resistor block. The first surface is divided into a shielded area covered by the insulating layer, and two preparatory areas located on opposite sides of the shielded area. The second procedure involves attaching two heat sinks to the preparatory area, each heat sink including a base portion attached to the corresponding preparatory area and an extension portion extending from the base portion to the insulating layer; and In the forming step, two electrode blocks are formed on the alloy resistor block, extending from the side contact surface to the first surface and the second surface respectively. Each electrode block includes a side contact portion connected to the corresponding side contact surface, an overlap portion bent from the side contact portion to the heat sink on the same side, and a bottom contact portion bent from the side contact portion and extending to the second surface.

2. The method for manufacturing a metal plate microresistor according to claim 1, characterized in that: In the attachment step, the insulating layer is attached to the alloy resistor block positioned on the base by an attachment mechanism, the attachment mechanism including at least one alignment structure, and the base including at least one mating structure for aligning with the alignment structure.

3. The method for manufacturing a metal plate microresistor according to claim 1, characterized in that: In the attachment step, the heat sink is attached to the alloy resistor block positioned on the base by an attachment mechanism. The attachment mechanism includes at least one alignment structure, and the base includes at least one mating structure for aligning with the alignment structure.

4. The method for manufacturing a metal plate microresistor according to claim 2, characterized in that: At least one of the alignment structure and the mating structure is a hole.

5. The method for manufacturing a metal plate microresistor according to claim 3, characterized in that: At least one of the alignment structure and the mating structure is a hole.

6. The method for manufacturing a metal plate microresistor according to any one of claims 1 to 5, characterized in that: In the forming step, the overlapping portion of each electrode block is flush with the extension portion of the heat sink on the same side.

7. The method for manufacturing a metal plate microresistor according to claim 1, characterized in that: The electrode block is formed by electroplating in the formation step.

8. The method for manufacturing a metal plate microresistor according to claim 1, characterized in that: The electrode block is formed by sputtering in the formation step.

9. The method for manufacturing a metal plate microresistor according to claim 1, characterized in that: The forming steps include a coating process of applying metal paste and a sintering process of sintering and hardening the metal paste to form the electrode block.

10. The method for manufacturing a metal plate microresistor according to any one of claims 1, 7 to 9, characterized in that: In the attachment step, each of the heat sinks is made of copper.

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