Capacitor assembly with first to fourth independent capacitors arranged in a row

Abstract

A capacitor assembly is provided, having a first to fourth individual capacitor, each individual capacitor having a first cover surface defining a respective normal direction of the individual capacitor and a second cover surface on the opposite side, the first cover surface of the first individual capacitor defining a main direction, a first connection element being arranged on the first cover surface and a second connection element being arranged on the second cover surface, wherein the individual capacitors are arranged adjacent to each other in a 1x4 matrix, the normals of the first and fourth individual capacitor pointing in the main direction and the normals of the second and third individual capacitor pointing in a direction opposite to the main direction, all first connection elements being connected to each other by a first busbar and all second connection elements being connected to each other by a second busbar.

Description

Technical Field

[0001] The present invention describes a capacitor assembly having a first independent capacitor to a fourth independent capacitor, each independent capacitor having a first cover surface defining a corresponding normal direction of the independent capacitor and a second cover surface located on opposite sides, wherein the first cover surface of the first independent capacitor defines a main direction, a first connecting element is arranged on the first cover surface, and a second connecting element is arranged on the second cover surface, wherein the independent capacitors are arranged adjacent to each other in a 1×4 matrix. Background Technology

[0002] DE 10 2019 134 650 A1 discloses a power electronic system having a housing, a cooling device, a power semiconductor module, and a capacitor device, wherein the cooling section of the capacitor connection device is in thermally conductive contact with the cooling surface of the cooling device.

[0003] DE 10 2012 215 787 A1 discloses a power electronic system having a multi-piece housing, multiple power electronic switching devices, a capacitor device, and a liquid cooling device. The multi-piece housing comprises three housing elements having a basic cuboid shape, a central element, and upper and lower cover elements arranged on opposing connecting surfaces of the central element. The housing has inflow and outflow connections for cooling liquid, and at least one cooling chamber is formed between the central element and the upper cover element, and at least two lower cooling chambers are formed between the central element and the lower cover element. Each cooling chamber has at least one cooling surface, and cooling liquid entering through the inflow connection and exiting at the outflow connection can flow through the cooling chambers, thereby forming a liquid cooling device. Summary of the Invention

[0004] The purpose of this invention is to improve the arrangement of capacitors in capacitor assemblies for power electronic systems.

[0005] According to the present invention, this objective is achieved by a capacitor assembly having a first to a fourth independent capacitor, each independent capacitor having a first cover surface defining a corresponding normal direction of the independent capacitor and a second cover surface located on opposite sides, the first cover surface of the first independent capacitor defining a principal direction, wherein first connecting elements are respectively arranged on the first cover surface and second connecting elements are respectively arranged on the second cover surface, the independent capacitors are arranged adjacent to each other in a 1×4 matrix, wherein the normals of the first and fourth independent capacitors point to the principal direction, and the normals of the second and third independent capacitors point to the opposite direction to the principal direction, all the first connecting elements are connected to each other via a first busbar, and all the second connecting elements are connected to each other via a second busbar.

[0006] The term "arranged adjacent to each other" is specifically intended to be understood as, mathematically and technically feasible, the cap surfaces of adjacent independent capacitors forming a planar sub-surface. It goes without saying that, provided the configuration according to the invention is applicable to four of 2+2n capacitors, the arrangement of the 1×4 matrix also includes embodiments in the 1×(2+2n) matrix.

[0007] It may be advantageous to arrange the independent capacitors in the order of first independent capacitor, second independent capacitor, third independent capacitor and fourth independent capacitor, or in the order of first independent capacitor, second independent capacitor, fourth independent capacitor and third independent capacitor.

[0008] It may also be advantageous to arrange the first connecting elements of all the individual capacitors in the first surface section of the first cover surface, and the second connecting elements of all the individual capacitors in the second surface section of the second cover surface. Preferably, the first and second surface sections of the individual capacitors are arranged symmetrically with respect to each other. Particularly preferred is that the symmetry is point symmetry with respect to the center point of the individual capacitor or mirror symmetry with respect to the cut surface of the individual capacitor.

[0009] In principle, it may be advantageous for the first and second busbars to be formed as flat metal molded parts. Here, it is further advantageous for the first and second busbars to be arranged such that they overlap each other in the section and are separated by a first insulating device.

[0010] It may also be advantageous that the first intermediate section of the first busbar and the first intermediate section of the second busbar are arranged between the first independent capacitor and the second independent capacitor, and that the second intermediate section of the first busbar and the second intermediate section of the second busbar are arranged between the third independent capacitor and the fourth independent capacitor, such that they overlap each other and are separated by the second insulating device respectively.

[0011] It may also be preferred that the first busbar has an additional first connection section and the second busbar has an additional second connection section, the connection sections being arranged such that they overlap each other in a section, and the connection sections being designed to supply energy to all individual capacitors simultaneously.

[0012] It may be advantageous that the first bus has an additional first module section and the second bus has an additional second module section, and these module sections are designed to simultaneously supply energy from independent capacitors to the power semiconductor module.

[0013] Finally, it may be advantageous that the corresponding contact sections of the associated connecting elements of the busbar and the independent capacitor are materially bonded to each other, preferably welded.

[0014] In the capacitor assembly according to the invention, features or groups of features mentioned in the singular may appear multiple times unless explicitly excluded, excluded by themselves, or inconsistent with the concept of the invention.

[0015] It goes without saying that the features and configurations of the capacitor assembly mentioned above and below can be implemented independently or in any desired combination to achieve improvements. Specifically, without departing from the scope of the invention, the features mentioned above or explained herein or below can be used not only in the specified combinations, but also in other non-exclusive combinations or independently. Attached Figure Description

[0016] Further explanation, advantageous details and features of the invention can be found in the description of the invention. Figures 1 to 7 The exemplary embodiments of the invention or corresponding portions thereof, which are schematically illustrated, can be found in the following description.

[0017] Figure 1 An exploded view shows a schematic diagram of a power electronic system with a capacitor assembly according to the present invention.

[0018] Figure 2 A side view of a first embodiment of a capacitor assembly according to the present invention is shown.

[0019] Figure 3 A side view of a second embodiment of a capacitor assembly according to the present invention is shown.

[0020] Figure 4 and Figure 5 A busbar according to a first embodiment of a capacitor assembly based on the present invention is shown.

[0021] Figure 6 A three-dimensional diagram of a second embodiment of a capacitor assembly according to the present invention is shown.

[0022] Figure 7 The individual capacitors of the capacitor assembly are shown. Detailed Implementation

[0023] Figure 1 An exploded view shows a schematic diagram of a power electronic system with a capacitor assembly according to the present invention. Viewed from bottom to top, the system has an arrangement of stacked components along the main direction H, including a slot-shaped first housing portion 40, a capacitor assembly 1, a cooling device 5, an insulating layer 7, a power semiconductor module 6, a control switching device 660, and a second housing portion 42.

[0024] See Figure 2The capacitor assembly 1 here includes a first independent capacitor, a second independent capacitor 12, a third independent capacitor 13, and a fourth independent capacitor 14. Each independent capacitor has a first cover surface 111, 121, 131, 141 defining a corresponding normal direction N1, N2, N3, N4 of the independent capacitor, and a second cover surface 112, 122, 132, 142 located on opposite sides of the first cover surfaces 111, 121, 131, 141, wherein the first cover surface 111 of the first independent capacitor 11 defines a principal direction H. The independent capacitors 11, 12, 13, 14 of the capacitor assembly 1 each have first connecting elements 113, 123, 133, 143 arranged on the associated first cover surfaces 111, 121, 131, 141, and second connecting elements 114, 124, 134, 144 arranged on the associated second cover surfaces 112, 122, 132, 142. Independent capacitors 11, 12, 13, and 14 are arranged adjacent to each other in a 1×4 matrix. The normals N1 and N4 of the first independent capacitor 11 and the fourth independent capacitor 14 point towards the principal direction H, while the normals N2 and N3 of the second independent capacitor 12 and the third independent capacitor 13 point in the opposite direction to the principal direction H. All first connecting elements 113, 123, 133, and 143 are connected to each other via a first busbar 30. All second connecting elements 114, 124, 134, and 144 are also connected to each other via a second busbar 32.

[0025] The cooling device 5 has a first cooling contact surface 500 that is in direct thermal contact with the capacitor assembly 1. Without limiting the general nature of the invention, the direct thermal contact with the first main section 300 and the second main section 320 (i.e., separated only by the insulating layer 7) is here constituted by a portion of the first busbar 30 and the second busbar 32. Without limiting the general nature of the invention, the individual capacitors 11, 12, 13, and 14 are further indirectly in thermal contact with the first cooling contact surface 500 via the main sections 300 and 320.

[0026] In the configuration of buses 30 and 32, the first intermediate section 302 of the first bus 30 and the first intermediate section 322 of the second bus 32 are arranged between the first independent capacitor 11 and the second independent capacitor 12, and the second intermediate section 302' of the first bus 30 and the second intermediate section 322' of the second bus 32 are arranged between the third independent capacitor 13 and the fourth independent capacitor 14, such that they overlap each other and are separated by the second insulating device.

[0027] The second cooling contact surface 520 of the cooling device 5, located on the opposite side of the first cooling contact surface, is in direct thermal contact with the power semiconductor module 6. The power semiconductor module 6 is directly disposed on the second cooling contact surface 520. Conventionally, thermal paste may also be disposed between the power semiconductor module 6 and the second cooling contact surface 520.

[0028] The power semiconductor module 6 has DC load connection elements 60, 62 that are electrically connected to the associated module segments 306, 326 of the first bus 30 and the second bus 32 with the correct polarity.

[0029] The power semiconductor module 6 is connected to the control switch device 660 via an auxiliary contact element 66. The control switch device 660 is in the form of a conventional printed circuit board and is used to activate the power semiconductor module 6 and to receive associated control signals from a higher-level control system (particularly a vehicle control system) via a plug connection (not shown), if the power electronics system is part of the powertrain of an electric vehicle.

[0030] A second housing portion 42, which interacts with the first housing portion 40, covers the cooling device 5, the power semiconductor module 6, and the control switching device 660. This second housing portion 42 has an opening 420 for an AC load connection element 64 and a plug connection (not shown) for control signals.

[0031] Figure 2 A side view of a first embodiment of a capacitor assembly 1 arranged in a first housing portion 40 according to the present invention is shown. The first housing portion 40 is filled with an insulating compound 400, which covers the entire capacitor assembly 1 and the main sections 300, 320 of the busbars 30, 32. Additionally, another section of the cooling device 5 facing the capacitor assembly 1 is embedded in the insulating compound 400.

[0032] Here, independent capacitors 11, 12, 13, and 14 are arranged in the order of first independent capacitor 11, second independent capacitor 12, third independent capacitor 13, and fourth independent capacitor 14, and have the normals N1, N2, N3, and N4 shown. The normals N1 and N4 of the first independent capacitor 11 and the fourth independent capacitor 14 are oriented towards the main direction H, while the normals N2 and N3 of the second independent capacitor 12 and the third independent capacitor 13 are oriented in the opposite direction to the main direction H.

[0033] Figure 3 A side view of a second embodiment of the capacitor assembly 1 according to the present invention is shown. Compared to... Figure 2In the first embodiment, the independent capacitors 11, 12, 13, and 14 are arranged in the order of first independent capacitor 11, second independent capacitor 12, fourth independent capacitor 14, and third independent capacitor 13, and the normals N1, N2, N3, and N4 are shown to have a specific orientation. Figure 2 The orientation mentioned.

[0034] Figure 4 and Figure 5 From cooling device 5 (see Figure 1 A three-dimensional view from the perspective of the capacitor assembly 1 according to the present invention is shown in the figure (see [reference]). Figure 2 Busbars 30 and 32. A capacitor assembly 1 in a 1×6 matrix form is shown here, comprising a capacitor assembly 1 according to the invention in a 1×4 matrix form, the capacitor assembly having a first independent capacitor, a second independent capacitor 12, a third independent capacitor 13, and a fourth independent capacitor 14. Figure 4 The capacitor assembly 1 shown has a second busbar 32 but not a first busbar 30. The first busbar 30 is additionally located in... Figure 5 As shown in the figure. The rest of this embodiment is substantially corresponding to Figure 2 Examples are shown in the text.

[0035] Figure 6 From cooling device 5 (see Figure 1 A three-dimensional view from the perspective of the capacitor assembly 1 according to the present invention shows a second embodiment (see) Figure 3 A three-dimensional diagram of the capacitor assembly is shown here. The capacitor assembly 1 is presented in a 1×6 matrix form, comprising a capacitor assembly 1 according to the invention in a 1×4 matrix form, the capacitor assembly having a first independent capacitor, a second independent capacitor 12, a third independent capacitor 13, and a fourth independent capacitor 14. The remainder of this embodiment substantially corresponds to... Figure 3 Examples are shown in the text.

[0036] Figure 7 The individual capacitors 11, 12, 13, and 14 of the capacitor assembly 1 are shown, and in the case of the generally cuboid embodiment of the individual capacitors 11, 12, 13, and 14, the positions of the first surface segments 115, 125, 135, and 145 on the first cover surfaces 111, 121, 131, and 141 relative to the second surface segments 116, 126, 136, and 146 on the second cover surfaces 112, 122, 132, and 142 are shown.

Claims

1. A capacitor assembly (1) having a first independent capacitor (11), a second independent capacitor (12), a third independent capacitor (13), and a fourth independent capacitor (14), each independent capacitor having a first cover surface (111, 121, 131, 141) defining a corresponding normal direction (N1, N2, N3, N4) of the independent capacitor and a second cover surface (112, 122, 132, 142) located on opposite sides, wherein, The first cover surface (111) of the first independent capacitor (11) defines a principal direction (H). First connecting elements (113, 123, 133, 143) are respectively arranged on the first cover surface, and second connecting elements (114, 124, 134, 144) are respectively arranged on the second cover surface. The independent capacitors (11, 12, 13, 14) are arranged adjacent to each other in a 1×4 matrix. The normals (N1, N4) of the first independent capacitor (11) and the fourth independent capacitor (14) point to the principal direction (H), and the normals (N2, N3) of the second independent capacitor (12) and the third independent capacitor (13) point to the opposite direction to the principal direction (H). All the first connecting elements (113, 123, 133, 143) are connected to each other through a first busbar (30), and all the second connecting elements (114, 124, 134, 144) are connected to each other through a second busbar (32).

2. The capacitor assembly according to claim 1, wherein, The independent capacitors (11, 12, 13, 14) are arranged in the order of first independent capacitor (11), second independent capacitor (12), third independent capacitor (13) and fourth independent capacitor (14), or in the order of first independent capacitor (11), second independent capacitor (12), fourth independent capacitor (14) and third independent capacitor (13).

3. The capacitor assembly according to claim 1 or 2, wherein, The first connecting elements (113, 123, 133, 143) of all the independent capacitors (11, 12, 13, 14) are respectively arranged in the first surface section (115, 125, 135, 145) of the first cover surface (111, 121, 131, 141), and the second connecting elements (114, 124, 134, 144) of all the independent capacitors (11, 12, 13, 14) are respectively arranged in the second surface section (116, 126, 136, 146) of the second cover surface (112, 122, 132, 142).

4. The capacitor assembly according to claim 3, wherein, The first surface sections (115, 125, 135, 145) and the second surface sections (116, 126, 136, 146) of the independent capacitors (11, 12, 13, 14) are arranged symmetrically with respect to each other.

5. The capacitor assembly according to claim 4, wherein, The symmetry is a point symmetry with respect to the center point of the independent capacitors (11, 12, 13, 14) or a mirror symmetry with respect to the cut surface of the independent capacitors (11, 12, 13, 14).

6. The capacitor assembly according to claim 1 or 2, wherein, The first busbar (30) and the second busbar (32) are formed as flat metal molded parts.

7. The capacitor assembly according to claim 6, wherein, The first busbar (30) and the second busbar (32) are arranged such that they overlap each other in the section and are separated by a first insulating device.

8. The capacitor assembly according to claim 1 or 2, wherein, The first intermediate section (302) of the first busbar (30) and the first intermediate section (322) of the second busbar (32) are arranged between the first independent capacitor and the second independent capacitor, and the second intermediate section (302') of the first busbar (30) and the second intermediate section (322') of the second busbar (32) are arranged between the third independent capacitor and the fourth independent capacitor, such that they overlap each other and are separated by a second insulating device.

9. The capacitor assembly according to claim 1 or 2, wherein, The first busbar (30) has an additional first connection section (304) and the second busbar (32) has an additional second connection section (324), the connection sections being arranged such that they overlap each other in a section, and the connection sections being designed to simultaneously supply energy to all of the individual capacitors (11, 12, 13, 14).

10. The capacitor assembly according to claim 1 or 2, wherein, The first bus (30) has an additional first module section (306) and the second bus (32) has an additional second module section (326), and these module sections are designed to simultaneously supply energy from the independent capacitors (11, 12, 13, 14) to the power semiconductor module.

11. The capacitor assembly according to claim 1 or 2, wherein, The corresponding contact sections of the busbars (30, 32) are materially bonded to the associated connecting elements (113, 114, 123, 124, 133, 134, 143, 144) of the independent capacitors (11, 12, 13, 14).

12. The capacitor assembly of claim 11, wherein, The corresponding contact sections of the busbars (30, 32) are welded to each other with the associated connecting elements (113, 114, 123, 124, 133, 134, 143, 144) of the independent capacitors (11, 12, 13, 14).

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