Base and method of mounting thereof, semiconductor device

Abstract

The application provides a base and a mounting method thereof, and a semiconductor device, and relates to the technical field of semiconductors, and aims to solve the problem that installation errors affect the processing result of a wafer. The base comprises a bearing member and a heat-conducting member, the bearing member has a bearing table, and the heat-conducting member is annularly arranged outside the bearing table; the outer periphery of the bearing table is provided with a plurality of guide grooves and a plurality of first clamping structures, the first clamping structures are arranged in the corresponding guide grooves, and the heat-conducting member is provided with a plurality of second clamping structures which are distributed along the circumferential direction of the heat-conducting member, and each second clamping structure is clamped with a corresponding first clamping structure through a corresponding guide groove. The base provided by the application is used for bearing a wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a base and its mounting method, and a semiconductor device. Background Technology

[0002] In semiconductor equipment, heat-conducting components are typically arranged around the edge of the carrier to help regulate the temperature of the focusing component and improve the processing uniformity of the target wafer surface within the semiconductor equipment's process chamber. However, the installation of heat-conducting components is usually done manually. If misalignment occurs, it can lead to positional deviations in the heat-conducting components and the focusing component mounted on top of them, affecting the processing results of the wafer surface and even causing the wafer to be scrapped. Summary of the Invention

[0003] The purpose of this application is to provide a base and its mounting method, as well as a semiconductor device, to avoid the impact of human installation errors on the wafer processing results, or even the scrapping of the wafer.

[0004] To achieve the above objectives, this application provides the following technical solution: a base, the base comprising: a support member and a heat-conducting member, the support member having a support platform, and the heat-conducting member being arranged around the outside of the support platform;

[0005] The outer periphery of the support platform has multiple guide grooves and multiple first snap-fit ​​structures. The first snap-fit ​​structures are disposed in the corresponding guide grooves. The heat-conducting component has multiple second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component. Each second snap-fit ​​structure is snapped into the corresponding first snap-fit ​​structure through the corresponding guide groove.

[0006] This application also provides a base installation method, including:

[0007] A carrier and a heat-conducting component are provided. The carrier has a support platform. The outer periphery of the support platform has a plurality of guide grooves and a plurality of first snap-fit ​​structures. The first snap-fit ​​structures are disposed in the corresponding guide grooves. The heat-conducting component has a plurality of second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component.

[0008] Each of the plurality of second snap-fit ​​structures is snapped into the first snap-fit ​​structure through the corresponding guide groove, so that the heat-conducting component is arranged around the outside of the support platform.

[0009] Compared with the prior art, the beneficial effects of the base installation method provided in this application are the same as the beneficial effects of the base described in the above technical solutions, and will not be repeated here.

[0010] This application also provides a semiconductor device, including: a process chamber and a base as described in this application and any possible implementation thereof, the base being located within the process chamber.

[0011] Compared with the prior art, the beneficial effects of the semiconductor device provided in this application are the same as the beneficial effects of the base described in the above technical solution, and will not be repeated here. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0013] Figure 1 A schematic diagram of the structure of a semiconductor device provided in an exemplary embodiment of this application is shown;

[0014] Figure 2 A schematic diagram of the structure of the carrier provided in an exemplary embodiment of this application is shown;

[0015] Figure 3 A schematic diagram of the structure of the heat-conducting component provided in an exemplary embodiment of this application is shown;

[0016] Figure 4 A schematic diagram of the first snap-fit ​​structure provided in an exemplary embodiment of this application is shown;

[0017] Figure 5 A schematic diagram of the second snap-fit ​​structure provided in an exemplary embodiment of this application is shown. Figure 1 ;

[0018] Figure 6A A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 2 ;

[0019] Figure 6B A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 3 ;

[0020] Figure 6C A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 4 ;

[0021] Figure 7 A flowchart illustrating a base installation method provided by an exemplary embodiment of this application is shown.

[0022] Figure label:

[0023] 100-Semiconductor equipment, 101-Process chamber, 102-Base, 1021-Carrier, 1021a-Guide groove, 1022-Heat-conducting component, 1023-Focusing component, 103-Target wafer, 104-Gas spray head, 1024-Drive mechanism, 1024a-Rotating component, 1025-First snap-fit ​​structure, 1025a-Snap-fit ​​groove, 1025b-First snap-fit ​​part, 1025c-Through hole, 1026-Second snap-fit ​​structure, 1026a-Limiting component, 1026b-Second snap-fit ​​part, 1026c-Snap-fit ​​post. Detailed Implementation

[0024] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0025] The accompanying drawings illustrate various structural schematics according to embodiments of this application. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0026] In the context of this application, when a layer / element is referred to as being "on top of" another layer / element, the layer / element can be directly on top of the other layer / element, or there can be an intermediate layer / element between them. Furthermore, if a layer / element is "on top of" another layer / element in one orientation, then when the orientation is reversed, the layer / element can be "below" the other layer / element. To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] Semiconductor equipment is used to process a target wafer on a carrier located in a process chamber. The process chamber of the semiconductor equipment is provided with a carrier for supporting the wafer to be processed. A focusing member is arranged around the carrier. The focusing member can be used to adjust the distribution of the radio frequency electric field in the process chamber, especially the electric field distribution at the edge of the wafer, so as to achieve uniform control of the radio frequency electric field and ensure the uniformity of the wafer surface after processing by the semiconductor equipment.

[0030] Besides adjusting the RF electric field distribution within the process chamber, the temperature of the focusing component also affects the wafer processing results, leading to differences in micro-critical dimensions. It should be understood that wafer fabrication processes typically performed within the process chamber include deposition and etching. Taking wafer etching as an example, the carrier component can adjust the wafer temperature according to process requirements and conduct heat away for rapid heat dissipation. However, the focusing component lacks a good heat dissipation path, which will increase the temperature difference between the focusing component and the internal region of the carrier component, causing detuning of the wafer edge etching process and affecting the uniformity of wafer etching.

[0031] To improve the heat transfer efficiency between the focusing component and the carrier, a thermally conductive component is typically provided. For example, in one embodiment, the carrier may include a support stage and a mounting surface. The support stage supports the target wafer, and the mounting surface is used to mount the thermally conductive component and the focusing component, with the mounting surface located at the edge region of the carrier. The thermally conductive component and the focusing component are stacked on the mounting surface of the carrier, with the thermally conductive component positioned between the focusing component and the carrier. Thermally conductive pads may also be provided between the focusing component and the thermally conductive component, and between the thermally conductive component and the carrier, to assist heat transfer. When mounting the focusing component, typically a first thermally conductive pad is first mounted on the thermally conductive component, then the thermally conductive component with the first thermally conductive pad is mounted on the carrier, a second thermally conductive pad is mounted on the focusing component, and finally, the focusing component with the second thermally conductive pad is mounted on the thermally conductive component. In this case, the temperature transfer flow of the base within the process chamber of the semiconductor etching equipment can be as follows: the carrier transfers heat to the thermally conductive component via the first thermally conductive pad, and the thermally conductive component then transfers heat to the focusing component via the second thermally conductive pad; the heat dissipation process is the reverse.

[0032] In related technologies, heat-conducting components can be installed on carriers by operators manually positioning and tightening screws. However, the inventors discovered that the coating material on the surface of the carrier is relatively soft and easily damaged when installing heat-conducting components. If the coating on the surface of the carrier is damaged, arc discharge is very likely to occur during subsequent work, causing the target wafer placed on the surface of the carrier to be scrapped.

[0033] To prevent damage to the coating on the carrier surface during the installation of the heat-conducting component, a spring is usually fitted under the fixing screws of the heat-conducting component. However, while this method protects the coating from damage, it can easily lead to misalignment between the heat-conducting component and the carrier during actual installation, directly causing deviations in the installation of the focusing component.

[0034] Taking wafer etching as an example, since temperature has a significant impact on the etching rate of oxides on the wafer surface, when a target wafer is supported by a base with a deviation in the mounting using the focusing component and etched, the etching rate at the edge of the wafer will be different from that in the central area, thus affecting the etching result of the wafer. In some cases, arc discharge may even occur due to the close distance between the edge of the wafer and the edge of the focusing component, resulting in damage to the wafer and the focusing component.

[0035] To avoid the above situation, when a deviation in the installation of the focusing component is found, the process chamber is usually opened and the heat-conducting component and the focusing component are reinstalled. This not only wastes human resources, but also affects production capacity.

[0036] To overcome the aforementioned problems, an exemplary embodiment of this application provides a semiconductor device in which a heat-conducting component is mounted on a base within the process chamber of the semiconductor device. The heat-conducting component is engaged with a first snap-fit ​​structure of a carrier via a second snap-fit ​​structure, thus achieving the installation of the heat-conducting component and the carrier. This avoids the difficulty in alignment that occurs with bolt installation, and the heat-conducting component, after being engaged with the first snap-fit ​​structure, can be directly fixed in the centered position. This simplifies installation, overcomes the risk of repeated cavity opening, and improves production capacity. It should be understood that the semiconductor device of this application can be a semiconductor etching device, a film deposition device, etc., and is not limited thereto. The following description primarily uses a semiconductor etching device as an example.

[0037] Figure 1 A schematic diagram of the structure of a semiconductor device provided in an exemplary embodiment of this application is shown. Figure 1 As shown, the semiconductor device 100 provided in this application embodiment may include: a process chamber 101 and a base 102, the base 102 being located inside the process chamber 101, and the target wafer 103 being placed on the base 102.

[0038] In some examples, the aforementioned base 102 includes a carrier 1021, a thermally conductive member 1022, and a focusing member 1023. The carrier 1021 includes a support stage and a mounting surface, wherein the support stage is used to support the target wafer 103, and the mounting surface is used to mount the thermally conductive member 1022 and the focusing member 1023, and the mounting surface is located in the edge region of the carrier 1021. The thermally conductive member 1022 is arranged around the mounting surface of the carrier 1021 to adjust the temperature distribution around the target wafer 103. The semiconductor device 100 can be an inductively coupled plasma etching device. In this case, a gas spray head 104 can also be provided at the top of the process chamber 101 to introduce reactive gas into the process chamber 101. This reactive gas, after being ionized by a radio frequency electric field, can generate plasma to etch the target wafer 103 located on the carrier 1021.

[0039] like Figure 1 As shown, to further improve the heat conduction efficiency of the focusing component 1023, thermally conductive pads (not shown in the figure) can be provided between the focusing component 1023 and the heat-conducting component 1022, and between the heat-conducting component 1022 and the carrier 1021. The thermally conductive pad between the carrier 1021 and the heat-conducting component 1022 can be a first thermally conductive pad, and the thermally conductive pad between the focusing component 1023 and the heat-conducting component 1022 can be a second thermally conductive pad. The material, thickness, and thermal conductivity of the first and second thermally conductive pads can be the same or different. Taking the material as an example, for instance, the first thermally conductive pad can be made of silicone, and the second thermally conductive pad can be made of silicone, aluminum foil, or graphite. By selecting thermally conductive pads with different materials, thicknesses, and thermal conductivity, optimized heating and cooling of the focusing component 1023 can be achieved, thereby adjusting the temperature difference between the center and edge of the target wafer 103, obtaining uniform wafer processing results, and improving product yield.

[0040] Figure 2 A schematic diagram of the structure of the carrier provided in an exemplary embodiment of this application is shown. Figure 1 and Figure 2 As shown in the embodiment of this application, the base 102 is used to support a target wafer. The base 102 may include a support member 1021 and a heat-conducting member 1022. The support member 1021 has a support platform, and the heat-conducting member 1022 is arranged around the outside of the support platform. When the heat-conducting member 1022 and the support member 1021 are in the installation state, the heat-conducting member 1022 can be installed on the outside of the support platform. It should be understood that, in order to provide better heat conduction, the material of the heat-conducting member can be a metal such as aluminum, and there is no limitation herein.

[0041] Figure 3 A schematic diagram of the structure of a heat-conducting component provided in an exemplary embodiment of this application is shown. Figure 2 and Figure 3 As shown, the support platform of the carrier 1021 protrudes to form a mesa for supporting the wafer. A mounting surface is formed in the area of ​​the carrier 1021 located on the outer periphery of the support platform, and this mounting surface is recessed relative to the mesa of the support platform. The outer periphery of the support platform (i.e., the mounting surface of the carrier 1021) has a plurality of guide grooves 1021a and a plurality of first snap-fit ​​structures 1025. The plurality of guide grooves 1021a are distributed along the circumferential direction of the mounting surface of the carrier 1021. Each first snap-fit ​​structure 1025 is disposed within a corresponding guide groove 1021a. The heat-conducting member 1022 has a plurality of second snap-fit ​​structures 1026 distributed along the circumferential direction of the heat-conducting member 1022. Each second snap-fit ​​structure 1026 snaps into a corresponding first snap-fit ​​structure 1025 through a corresponding guide groove 1021a.

[0042] As can be seen from the above, the base provided in this application embodiment, by setting a guide groove and a first snap-fit ​​structure on the outer periphery of the support platform, and placing the first snap-fit ​​structure within the corresponding guide groove, can restrict the position of the first snap-fit ​​structure through the guide groove. Based on this, the heat-conducting component has multiple second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component, and each second snap-fit ​​structure snaps with the corresponding first snap-fit ​​structure through the corresponding guide groove. The first and second snap-fit ​​structures fixed by snap-fit ​​can realize the fixation of the heat-conducting component and the support component. Since the guide groove restricts the position of the first snap-fit ​​structure, when the second snap-fit ​​structure and the first snap-fit ​​structure snap-fit, the heat-conducting component can be automatically aligned, avoiding the problem of difficulty in alignment when using bolts to fix the heat-conducting component, making the installation of the heat-conducting component simpler and more convenient, avoiding the risk of repeated cavity opening, and improving production capacity.

[0043] As can be seen, the base provided in this application embodiment fixes the heat-conducting component in the horizontal direction by setting multiple first snap-fit ​​structures on the outer periphery of the support platform, ensuring the automatic alignment of the heat-conducting component, avoiding installation deviations caused by manual installation errors, ensuring the wafer processing results, improving wafer yield, and increasing production capacity.

[0044] As one possible implementation method, Figure 4 This illustration shows a schematic diagram of the first snap-fit ​​structure provided in an exemplary embodiment of this application. Figure 5 A schematic diagram of the second snap-fit ​​structure provided in an exemplary embodiment of this application is shown. Figure 1 .like Figures 2-5As shown, the first snap-fit ​​structure 1025 includes a snap-fit ​​groove 1025a, which is located within a corresponding guide groove 1021a and has a lateral opening. The second snap-fit ​​structure 1026 includes a limiting member 1026a, which enters the groove space of the corresponding snap-fit ​​groove 1025a through the corresponding guide groove 1021a and the corresponding lateral opening. It should be understood that "corresponding" here means that the snap-fit ​​groove 1025a included in the first snap-fit ​​structure 1025 is located within one of the plurality of guide grooves 1021a; when the first snap-fit ​​structure 1025 and the second snap-fit ​​structure 1026 are in the installation state, the limiting member 1026a included in the second snap-fit ​​structure 1026 enters the groove space of the snap-fit ​​groove 1025a through one of the plurality of guide grooves 1021a and the lateral opening of one of the plurality of snap-fit ​​grooves 1025a. After the limiting member 1026a of the second snap-fit ​​structure 1026 enters the groove space of the snap-fit ​​groove 1025a through the lateral opening of the snap-fit ​​groove 1025a, the position of the limiting member 1026a is restricted by the snap-fit ​​groove 1025a in the normal direction of the support member 1021, thereby realizing the limitation of the position between the heat-conducting member 1022 and the support member 1021.

[0045] In some alternative methods, such as Figures 2-5 As shown, the first snap-fit ​​structure 1025 further includes a first snap-fit ​​portion 1025b, which is disposed at the bottom of the corresponding snap-fit ​​groove 1025a. The second snap-fit ​​structure 1026 further includes a second snap-fit ​​portion 1026b, which is disposed at the end of the corresponding limiting member 1026a. The shape of the second snap-fit ​​portion 1026b matches the shape of the corresponding first snap-fit ​​portion 1025b and snaps into each other. It should be understood that "corresponding" here means that the first snap-fit ​​portion 1025b is disposed at the bottom of one of the multiple snap-fit ​​grooves 1025a; the second snap-fit ​​portion 1026b is disposed at the end of one of the multiple limiting members 1026a; when the first snap-fit ​​structure 1025 and the second snap-fit ​​structure 1026 are in the installed state, the shape of the second snap-fit ​​portion 1026b matches the shape of one of the multiple first snap-fit ​​portions 1025b and snaps into each other. By engaging the second engaging part 1026b with the first engaging part 1025b, the second engaging structure 1026 can be fixed in the circumferential direction of the mounting surface of the support member 1021, thereby ensuring that the heat-conducting member 1022 is located at a preset target position and preventing misalignment.

[0046] In some embodiments, the first latching portion 1025b is, for example, a protrusion formed at the bottom of the latching groove 1025a, and the second latching portion 1026b is, for example, a groove formed at the end of the limiting member 1026a; or, the first latching portion 1025b is, for example, a groove formed at the bottom of the latching groove 1025a, and the second latching portion 1026b is, for example, a protrusion formed at the end of the limiting member 1026a.

[0047] In some alternative methods, such as Figures 2-5 As shown, the second snap-fit ​​structure 1026 further includes a snap-fit ​​post 1026c. One end of the snap-fit ​​post 1026c is disposed on the mounting surface of the heat-conducting member 1022, and the other end of the snap-fit ​​post 1026c is provided with a limiting member 1026a. The snap-fit ​​groove 1025a also has a top opening, through which the snap-fit ​​post 1026c passes. It should be understood that "corresponding" here means that when the first snap-fit ​​structure 1025 and the second snap-fit ​​structure 1026 are in the installed state, the snap-fit ​​post 1026c passes through the top opening of one of the multiple snap-fit ​​grooves 1025a.

[0048] In some alternative methods, such as Figures 2-5 As shown in the preceding description, the base of this embodiment can be matched with the locking groove 1025a of the support member 1021 via the limiting member 1026a of the heat-conducting member 1022, thereby restricting the horizontal displacement of the heat-conducting member 1022 on the plane where the mounting surface of the support member 1021 is located. That is, the space inside the locking groove 1025a can be used to accommodate the limiting member 1026a. Furthermore, the opening size of the top opening of the locking groove 1025a in this application along a predetermined direction is smaller than the width size of the corresponding limiting member 1026a in the same direction. It should be understood that "corresponding" here means that when the first locking structure 1025 and the second locking structure 1026 are in the installed state, the opening size of the top opening of the locking groove 1025a along the predetermined direction is smaller than the width size of one of the multiple limiting members 1026a that is locked with it in the same direction. The predetermined direction can be along a direction parallel to the surface of the wafer. The size of the top opening of the snap-fit ​​groove 1025a is smaller than the size of the limiting member 1026a located in the groove space of the snap-fit ​​groove 1025a, so that the limiting member 1026a and the snap-fit ​​groove 1025a are relatively fixed.

[0049] In some alternative methods, Figure 6A A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 2 .like Figure 6A As shown, the limiting member 1026a is a hemispherical structure. The radial dimension of the limiting member 1026a gradually decreases in the axial direction of the snap-fit ​​post 1026c along the direction away from the mounting surface of the heat-conducting member 1022, so as to facilitate the connection between the limiting member 1026a and the snap-fit ​​groove 1025a.

[0050] In some alternative methods, Figure 6B A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 3 .like Figure 6BAs shown, the aforementioned limiting member 1026a can also be a "T" shaped structure. The side of the "T" shaped structure perpendicular to the locking post 1026c is connected to the opening of the locking groove 1025a, and the side of the "T" shaped structure parallel to the locking post 1026c is connected to the bottom of the locking groove 1025a, so as to realize the locking of the limiting member 1026a and the locking groove 1025a, and to realize the fixation of the limiting member 1026a in the normal direction of the mounting surface of the bearing member 1021.

[0051] like Figure 6C As shown, Figure 6C A schematic diagram of the second snap-fit ​​structure, illustrating an exemplary embodiment of this application, is shown. Figure 4 .like Figure 6C As shown, in Figure 6B Based on the limiting member 1026a shown, the radial dimension of the side of the "T"-shaped limiting member 1026a parallel to the snap-fit ​​post 1026c gradually decreases in the axial direction of the snap-fit ​​post 1026c along the direction away from the mounting surface of the heat-conducting member 1022, so that the limiting member 1026a can slide into the snap-fit ​​groove 1025a more easily.

[0052] In some alternative methods, such as Figures 2-5 As shown, the area surrounding the outer periphery of the support platform in the above-mentioned support member 1021 forms the mounting surface of the support member 1021. The mounting surface of the support member 1021 is recessed relative to the platform surface of the support platform, and multiple guide grooves 1021a are arranged sequentially on the mounting surface around the outer periphery of the support platform.

[0053] In some alternative methods, such as Figures 2-5 As shown, the guide groove 1021a extends along the circumferential direction of the support member 1021. For example, the guide groove 1021a extends in an arc shape in accordance with the arc-shaped edge of the support platform. By providing the guide groove 1021a extending along the circumferential direction of the support member 1021, the limiting member 1026a can be guided into the snap-fit ​​groove 1025a by the guide groove 1021a, ultimately realizing the snap-fit ​​of the first snap-fit ​​structure 1025 and the second snap-fit ​​structure 1026, and fixing the limiting member 1026a in the normal direction of the mounting surface of the support member 1021.

[0054] In some alternative methods, such as Figures 2-5As shown, after alignment, there is a gap between the mounting surface of the heat-conducting member 1022 and the mounting surface of the support member 1021. To reduce this gap and ensure a tight connection between the heat-conducting member 1022 and the support member 1021, thereby improving the heat conduction efficiency of the heat-conducting member 1022, the snap-fit ​​groove 1025a can move along the depth direction of the guide groove 1021a. This movement is used to bring the heat-conducting member 1022 into contact with the support member 1021 when the second snap-fit ​​structure 1026 is engaged. For example, the bottom surface of one end region of the guide groove 1021a is lower than the bottom surface of the adjacent region. The snap-fit ​​groove 1025a is located in this end region, allowing the snap-fit ​​groove 1025a to move the heat-conducting member 1022 along the depth direction of the guide groove 1021a.

[0055] In some alternative methods, such as Figures 2-5 As shown, the heat-conducting component 1022 provided in this embodiment may further include multiple driving mechanisms 1024, which can be connected to the corresponding first snap-fit ​​structure 1025. Each driving mechanism 1024 drives the corresponding first snap-fit ​​structure 1025 to move along the depth direction of the guide groove 1021a, thereby causing the heat-conducting component 1022 to adhere to the carrier 1021 when snapping into the second snap-fit ​​structure 1026. It should be understood that the depth of the guide groove 1021a can be set according to actual conditions and is not limited here. Each driving mechanism 1024 drives one of the multiple first snap-fit ​​structures 1025 to move along the depth direction of the guide groove 1021a.

[0056] Since the guide groove provides space for the first snap-fit ​​structure to move along the depth direction of the guide groove, a drive mechanism can be used to drive the corresponding first snap-fit ​​structure to move within the guide groove along the depth direction of the guide groove, thereby causing the heat-conducting component to adhere to the carrier, reducing the gap between the heat-conducting component and the carrier, and completing the installation of the heat-conducting component. Based on this, when the base includes the heat-conducting component and the carrier in the installation state, since the heat-conducting component has a second snap-fit ​​structure and the carrier has a first snap-fit ​​structure that snaps into the corresponding second snap-fit ​​structure, the heat-conducting component and the carrier can be fixed through the snap-fit ​​of the first and second snap-fit ​​structures, achieving automatic centering of the heat-conducting component. Then, the drive mechanism drives the first snap-fit ​​structure, which is movably disposed within the corresponding guide groove, and the heat-conducting component snapped into the first snap-fit ​​structure, to move together along the depth direction of the guide groove to the target position within the guide groove, thereby completing the installation of the heat-conducting component.

[0057] As one possible implementation, such as Figure 2 and Figure 4As shown, each drive mechanism 1024 may include a rotating member 1024a, a conversion mechanism (not shown in the figure), and a connecting rod (not shown in the figure). The connecting rod is disposed within the bearing member 1021, and a first snap-fit ​​structure 1025 is disposed at the end of the connecting rod. The rotating member is drively connected to the conversion mechanism, and the end of the connecting rod away from the first snap-fit ​​structure 1025 is disposed at the drive end of the conversion mechanism. The operation of the conversion mechanism connected to the rotating member can be controlled by rotating the rotating member 1024a, converting horizontal rotation into vertical displacement, so that the connecting rod can drive the first snap-fit ​​structure 1025 to move, thereby reducing the gap between the heat-conducting member 1022 and the bearing member 1021 and realizing the installation of the heat-conducting member 1022. It should be understood that the drive mechanism 1024 of this application is a conventional technical means, and will not be described in detail here. For example, the drive mechanism can be a crank-connecting rod mechanism, a worm gear mechanism, etc.

[0058] In some alternative methods, such as Figure 2 and Figure 4 As shown, the aforementioned conversion mechanism can be housed within the support member 1021, and the rotating member 1024a is located on the outer wall of the support member 1021. In this case, a torque wrench can be used to twist the rotating member 1024a according to a preset torque to achieve the driving effect of the drive mechanism 1024.

[0059] In practical applications, such as Figures 2-5 As shown, each of the aforementioned drive mechanisms 1024 can be driven to the bottom or sidewall of a corresponding snap-fit ​​groove 1025a. This drives the first snap-fit ​​structure 1025 to move the second snap-fit ​​structure 1026, which is snapped to the first snap-fit ​​structure 1025, along the normal direction of the mounting surface of the support member 1021. This causes the heat-conducting component 1022 to adhere to the support member 1021, reducing the distance between the mounting surface of the heat-conducting component 1022 and the mounting surface of the support member 1021, thus completing the installation of the heat-conducting component 1022. The following explanation uses the example of each drive mechanism 1024 being driven to the bottom of a corresponding snap-fit ​​groove 1025a.

[0060] In some alternative methods, such as Figures 2-5As shown, the connection between the first latching part 1025b and the bottom of the corresponding latching groove 1025a can be a fixed connection. In this case, the first latching part 1025b can be a protrusion integrally formed with the bottom of the latching groove 1025a, and there is no relative displacement between the first latching part 1025b and the latching groove 1025a. The second latching part 1026b of the limiting member 1026a can be a groove with a target depth, the depth of which can match the height of the first latching part 1025b, so as to achieve automatic centering of the heat-conducting member 1022 on the support member 1021. Each drive mechanism 1024 can be drivenly connected to the bottom of the corresponding latching groove 1025a. When the heat-conducting component 1022 and the carrier 1021 are in the installation state, by placing the limiting member 1026a into the snap-fit ​​groove 1025a, the first snap-fit ​​portion 1025b and the second snap-fit ​​portion 1026b are in a snap-fit ​​state. The drive mechanism 1024 drives the first snap-fit ​​structure 1025 and the heat-conducting component 1022 snapped with the first snap-fit ​​structure 1025 to move along the normal direction of the mounting surface of the carrier 1021, thus completing the automatic alignment and installation of the heat-conducting component 1022. During disassembly, the operator can control the drive mechanism 1024 to move the snap-fit ​​groove 1025a along the normal direction of the mounting surface of the carrier 1021 to a certain height, and then remove the second snap-fit ​​structure 1026 of the heat-conducting component 1022 from the snap-fit ​​groove 1025a.

[0061] It should be noted that, as Figures 2-5 As shown, the position of the first snap-fit ​​portion 1025b on the mounting surface of the snap-fit ​​groove 1025a, i.e., the side of the snap-fit ​​groove 1025a away from the carrier member 1021, can be designed according to factors such as the size of the second snap-fit ​​structure 1026 and the size of the snap-fit ​​groove 1025a, as long as the heat-conducting member 1022 is in a centered position after the second snap-fit ​​portion 1026b snaps into the first snap-fit ​​portion 1025b. Meanwhile, for ease of disassembly, the first snap-fit ​​portion 1025b at the bottom of the snap-fit ​​groove 1025a and the second snap-fit ​​portion 1026b on the heat-conducting member 1022 can be in a tangential fit. That is, the operator can disassemble and install the carrier member 1021 and the heat-conducting member 1022 by applying a certain force to the circumferential direction of the mounting surface of the carrier member 1021. The dimensions of the second snap-fit ​​portion 1026b and the first snap-fit ​​portion 1025b can be designed according to actual conditions and are not limited here.

[0062] Of course, such as Figures 2-5 As shown, the connection between the first snap-fit ​​part 1025b and the bottom of the corresponding snap-fit ​​groove 1025a can also be a movable connection, that is, the first snap-fit ​​part 1025b and the bottom of the corresponding snap-fit ​​groove 1025a can have relative displacement. At this time, the drive mechanism 1024 can be connected to the first snap-fit ​​part 1025b in a transmission manner.

[0063] For example, such as Figures 2-5 As shown, when the drive mechanism 1024 is connected to the first latching part 1025b, there can be a relative displacement between the first latching part 1025b and the bottom of the corresponding latching groove 1025a. In this case, the bottom of the latching groove 1025a can have a through hole 1025c that penetrates the mounting surface of the latching groove 1025a. The size of the through hole 1025c matches the size of the first latching part 1025b, so that the first latching part 1025b can move along the depth direction of the guide groove 1021a within the through hole 1025c. The second engaging portion 1026b of the limiting member 1026a can be a groove with a target depth, the depth of which can match the length of the first engaging portion 1025b. The first engaging portion 1025b located within the through hole 1025c on the mounting surface of the engaging groove 1025a can be moved to engage with the second engaging portion 1026b of the limiting member 1026a, thus connecting the first engaging structure 1025 and the second engaging structure 1026. At this time, since the first engaging portion 1025b is in the target alignment position, the second engaging portion 1026b, which engages with the first engaging portion 1025b in the target alignment position, is also in the target alignment position, thereby achieving the alignment of the heat-conducting member 1022.

[0064] like Figures 2-5 As shown, when the drive mechanism 1024 is connected to the first latching part 1025b, the installation method of the heat-conducting member 1022 and the carrier 1021 can be as follows: Firstly, the first latching part 1025b is determined to be in its initial position. At this time, the second latching part 1026b of the heat-conducting member 1022 can be connected to the first latching part 1025b, fixing the position of the heat-conducting member 1022 on the mounting surface of the carrier 1021, thus achieving the centering of the heat-conducting member 1022. Then, the drive mechanism 1024 can drive the first latching part 1025b to move along the normal direction of the mounting surface of the carrier 1021 to reduce the gap between the heat-conducting member 1022 and the carrier 1021, so that the limiting member 1026a is placed in the groove space of the latching groove 1025a, completing the centering and installation of the heat-conducting member 1022.

[0065] like Figures 2-5As shown, to assist the operator in aligning the heat-conducting component 1022, the initial position of the first snap-fit ​​portion 1025b can be a position extending into the snap-fit ​​groove 1025a to a certain depth. The depth of the first snap-fit ​​portion 1025b extending into the snap-fit ​​groove 1025a can be set according to actual conditions, as long as the operator can apply a certain force to the mounting surface of the carrier 1021 in the circumferential direction, ensuring that the second snap-fit ​​portion 1026b of the heat-conducting component 1022 and the first snap-fit ​​portion 1025b on the carrier 1021 are initially snapped together. Furthermore, when the carrier 1021 and the heat-conducting component 1022 are not in the installed state, the dimension of the end of the first snap-fit ​​portion 1025b extending into the snap-fit ​​groove 1025a is larger than the dimension of the through hole 1025c to prevent the first snap-fit ​​portion 1025b from disengaging from the through hole 1025c. The heat-conducting component 1022 is moved toward the support member 1021 by controlling the drive mechanism 1024 to reduce the gap between the heat-conducting component 1022 and the support member 1021, thereby realizing the installation of the heat-conducting component 1022.

[0066] like Figures 2-5 As shown, during disassembly, the operator can control the drive mechanism 1024 to move the heat-conducting component 1022 away from the carrier component 1021, and then disconnect the second snap-fit ​​portion 1026b of the heat-conducting component 1022 from the first snap-fit ​​portion 1025b of the carrier component 1021. The second snap-fit ​​portion 1026b can then be moved out of the snap-fit ​​groove 1025a. The initial snap-fit ​​state here refers to the detachable state between the second snap-fit ​​portion 1026b of the heat-conducting component 1022 and the first snap-fit ​​portion 1025b on the carrier component 1021. That is, in the initial snap-fit ​​state, the operator can achieve the connection or disconnection of the second snap-fit ​​portion 1026b of the heat-conducting component 1022 and the first snap-fit ​​portion 1025b on the carrier component 1021 by applying a certain force to the circumferential direction of the mounting surface of the carrier component 1021.

[0067] In some alternative methods, such as Figures 2-5As shown, in order to further limit the displacement of the heat-conducting member 1022 and prevent misalignment of the heat-conducting member 1022, the first snap-fit ​​portion 1025b of the bearing member 1021 extending into the end of the heat-conducting member 1022 may have a third snap-fit ​​portion (not shown in the figure). The third snap-fit ​​portion is connected to the drive mechanism 1024. In the circumferential direction of the mounting surface of the bearing member 1021, the third snap-fit ​​portion is telescopically disposed on the first snap-fit ​​portion 1025b. The heat-conducting component 1022 has a third snap-fit ​​groove (not shown in the figure) that matches the third snap-fit ​​part within the limiting member 1026a. When the operator determines that the third snap-fit ​​part is located within the corresponding third snap-fit ​​groove, the third snap-fit ​​part can be driven into an unfolded state by controlling the drive mechanism 1024, so that the third snap-fit ​​part is located within the groove space of the third snap-fit ​​groove. Then, by controlling the drive mechanism 1024, the third snap-fit ​​part moves the heat-conducting component 1022 connected to it along the normal direction of the mounting surface of the support member 1021 to the target position, thereby achieving automatic centering and installation of the heat-conducting component 1022. It should be understood that the driving method of the third snap-fit ​​part and the drive mechanism 1024 is a conventional technical means and will not be elaborated on here.

[0068] It should be noted that the displacement of the drive mechanism's drive locking slot or first locking part along the depth direction of the guide groove can be set according to the actual situation and is not limited here. For example, when using a torque wrench to install the heat-conducting component on the drive mechanism, the target torque of the torque wrench can be determined according to factors such as the material and thickness of the heat-conducting component. Using the torque wrench to tighten the drive mechanism according to the target torque allows the locking slot or first locking part, which is connected to the drive structure, to move the second locking structure it engages with along the depth direction of the guide groove to the target position, achieving a tight connection between the heat-conducting component and the carrier, ensuring that the heat-conducting component can be heated evenly, and improving the heat conduction efficiency of the heat-conducting component.

[0069] In some alternative embodiments, the aforementioned drive mechanism may further include a main drive mechanism and an auxiliary drive mechanism. The main drive mechanism may be connected to the first snap-fit ​​part, and the auxiliary drive mechanism may be connected to the bottom or sidewall of the snap-fit ​​groove. Based on the aforementioned description, when the heat-conducting component and the carrier are in the installation state, the main drive mechanism can achieve snap-fit ​​between the first snap-fit ​​part and the second snap-fit ​​part to limit the displacement of the heat-conducting component in the circumferential direction of the mounting surface of the carrier. After determining that the first snap-fit ​​part and the second snap-fit ​​part are in the snap-fit ​​state, the auxiliary drive mechanism can drive the snap-fit ​​groove to move along the depth direction of the guide groove to the target position, completing the automatic alignment and installation of the heat-conducting component. During disassembly, the operator can control the auxiliary drive mechanism to move the snap-fit ​​groove along the normal direction of the mounting surface of the carrier to a certain height, and then control the main drive mechanism to move the first snap-fit ​​part, which extends into the second snap-fit ​​part of the heat-conducting component, downward until the second snap-fit ​​part of the heat-conducting component is disconnected from the first snap-fit ​​part of the carrier, and the heat-conducting component can then be removed from the snap-fit ​​groove.

[0070] In some alternative methods, such as Figures 2-5 As shown, the bottom surface of one end region of the guide groove 1021a is recessed relative to the bottom surface of the adjacent region. The snap-fit ​​groove 1025a is provided in the end region, and the height of the snap-fit ​​groove 1025a is less than the depth of the end region. By providing an end region with a bottom surface recessed relative to the bottom surface of the adjacent region, displacement space can be provided for the snap-fit ​​groove 1025a to achieve a tight connection between the carrier 1021 and the heat-conducting member 1022.

[0071] To facilitate orientation differentiation during installation, reference points are typically set in semiconductor equipment. This facilitates automated wafer processing while ensuring consistency between each process step and the previous one, improving process accuracy and consistency. Based on this, the carrier and heat-conducting component provided in this application embodiment can have reference positions, with the largest dimension among multiple guide slots located near the reference position of the carrier; and / or, the largest dimension among multiple first snap-fit ​​structures located near the reference position of the carrier; and / or, the largest dimension among multiple second snap-fit ​​structures located near the reference position of the heat-conducting component. For example, the snap-fit ​​groove of the first snap-fit ​​structure near the reference point is 2mm larger than the snap-fit ​​grooves of the other first snap-fit ​​structures. Since the guide slot is used to accommodate the first snap-fit ​​structure, and the size of the guide slot matches the size of the first snap-fit ​​structure, the size of the guide slot near the reference point is 2mm larger than the size of the other guide slots. Similarly, since the second snap-fit ​​structure of the heat-conducting component snaps into the first snap-fit ​​structure, the dimensions of the second snap-fit ​​structure match those of the first snap-fit ​​structure. Among the multiple second snap-fit ​​structures, the one closest to the reference point is 2mm larger than the others. It should be noted that the specific dimensional difference can be determined based on the actual situation, as long as the operator can visually determine the orientation of each structure during installation.

[0072] As one possible implementation, the base in this application embodiment further includes a focusing member disposed on the heat-conducting member. When the base of this application is used in an inductively coupled plasma semiconductor device, the focusing member can control the plasma uniformity by adjusting the radio frequency electric field distribution in the reaction chamber, especially the electric field distribution at the wafer edge.

[0073] To further improve the heat conduction of the components on the base, the base may also include multiple heat-conducting pads. These pads are distributed along the circumferential direction of the mounting surface of the heat-conducting component between the mounting surface of the carrier and the mounting surface of the heat-conducting component. When the base of this application also includes a focusing component, the multiple heat-conducting pads are distributed along the circumferential direction of the mounting surface of the heat-conducting component between the mounting surface of the focusing component and the mounting surface of the heat-conducting component. It should be understood that the mounting surface involved in the embodiments of this application refers to the surface where two components are in contact when installed. For example, the mounting surface of the carrier is the side of the carrier facing and in contact with the heat-conducting component when the carrier and the heat-conducting component are in the installed state; the mounting surface of the heat-conducting component is the side of the heat-conducting component facing and in contact with the carrier when the carrier and the heat-conducting component are in the installed state, and so on, which will not be elaborated here.

[0074] Figure 7 A flowchart illustrating a base mounting method provided in an exemplary embodiment of this application is shown. Figure 7 As shown in the figure, this application embodiment also provides a base installation method, including the following steps.

[0075] Step 710: Provide a carrier and a heat-conducting component. The carrier has a support platform. The outer periphery of the support platform has multiple guide grooves and multiple first snap-fit ​​structures. The first snap-fit ​​structures are disposed in the corresponding guide grooves. The heat-conducting component has multiple second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component.

[0076] Step 720: Connect each of the multiple second snap-fit ​​structures to the first snap-fit ​​structure through the corresponding guide groove, so that the heat-conducting component is arranged around the outside of the support platform.

[0077] The base installation method provided in this application involves setting a guide groove and a first snap-fit ​​structure on the outer periphery of the support platform, with the first snap-fit ​​structure positioned within the corresponding guide groove. The guide groove restricts the position of the first snap-fit ​​structure. Therefore, when the second snap-fit ​​structure of the heat-conducting component is snapped into place with the corresponding first snap-fit ​​structure via the guide groove, the horizontal position of the second snap-fit ​​structure is fixed because the guide groove restricts its horizontal position. This achieves automatic alignment of the heat-conducting component on the support, avoiding the problem of misalignment when using bolts to fix the heat-conducting component. This simplifies and facilitates the installation of the heat-conducting component, avoids the risk of repeated cavity opening, and improves production capacity.

[0078] In some optional embodiments, there is still a gap between the mounting surfaces of the heat-conducting component and the carrier. In this case, the mounting method of the base provided in this application embodiment may further include: controlling the interlocking second snap-fit ​​structure and the first snap-fit ​​structure to move in the depth direction of the guide groove so as to drive the heat-conducting component to fit onto the carrier.

[0079] Compared with the prior art, the beneficial effects of the base installation method provided in this application embodiment are the same as the beneficial effects of the base described above, and will not be repeated here.

[0080] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0081] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. The scope of this application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this application, and all such substitutions and modifications should fall within the scope of this application.

Claims

1. A base, characterized in that, The base includes a support member and a heat-conducting member, wherein the support member has a support platform and the heat-conducting member is arranged around the outside of the support platform; The outer periphery of the support platform has multiple guide grooves and multiple first snap-fit ​​structures. The first snap-fit ​​structures are disposed in the corresponding guide grooves. The heat-conducting component has multiple second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component. Each second snap-fit ​​structure is snapped into the corresponding first snap-fit ​​structure through the corresponding guide groove.

2. The base according to claim 1, characterized in that, The first snap-fit ​​structure includes a snap-fit ​​groove, which is located in the corresponding guide groove and has a lateral opening; the second snap-fit ​​structure includes a limiting member, which enters the groove space of the snap-fit ​​groove through the corresponding guide groove and the corresponding lateral opening.

3. The base according to claim 2, characterized in that, The first snap-fit ​​structure further includes a first snap-fit ​​part, which is disposed at the bottom of the corresponding snap-fit ​​groove; the second snap-fit ​​structure further includes a second snap-fit ​​part, which is disposed at the end of the corresponding limiting member, and the shape of the second snap-fit ​​part matches the shape of the first snap-fit ​​part and snaps into each other.

4. The base according to claim 3, characterized in that, The second snap-fit ​​structure further includes a snap-fit ​​post, one end of which is disposed on the mounting surface of the heat-conducting component, and the other end of which is provided with the limiting member; the snap-fit ​​groove also has a top opening, and the snap-fit ​​post passes through the top opening of the corresponding snap-fit ​​groove.

5. The base according to claim 4, characterized in that, The opening size of the top opening of the snap-fit ​​groove along the predetermined direction is smaller than the width size of the corresponding limiting member in the same direction.

6. The base according to claim 1, characterized in that, The guide groove extends along the circumferential direction of the support member.

7. The base according to claim 2, characterized in that, The snap-fit ​​groove is movable along the depth direction of the guide groove, and is used to drive the heat-conducting component to adhere to the carrier when snapping the second snap-fit ​​structure.

8. The base according to claim 7, characterized in that, The bottom surface of one end region of the guide groove is recessed relative to the bottom surface of the adjacent region, the snap-fit ​​groove is disposed in the end region, and the height of the snap-fit ​​groove is less than the depth of the end region.

9. The base according to any one of claims 1 to 8, characterized in that, The carrier has a reference position, and the one of the plurality of guide slots closest to the reference position of the carrier has the largest size; and / or, The carrier has a reference position, and the one closest to the reference position of the carrier among the plurality of first snap-fit ​​structures has the largest size.

10. The base according to any one of claims 1 to 8, characterized in that, The base also includes a focusing component, which is disposed on the heat-conducting component.

11. The base according to any one of claims 1 to 8, characterized in that, The area surrounding the outer periphery of the support platform in the support member forms the mounting surface of the support member. The mounting surface of the support member is recessed relative to the platform surface of the support platform. The plurality of guide grooves are arranged sequentially on the mounting surface around the outer periphery of the support platform.

12. A method for installing a base, characterized in that, include: A carrier and a heat-conducting component are provided. The carrier has a support platform. The outer periphery of the support platform has a plurality of guide grooves and a plurality of first snap-fit ​​structures. The first snap-fit ​​structures are disposed in the corresponding guide grooves. The heat-conducting component has a plurality of second snap-fit ​​structures distributed along the circumferential direction of the heat-conducting component. Each of the plurality of second snap-fit ​​structures is snapped into the first snap-fit ​​structure through the corresponding guide groove, so that the heat-conducting component is arranged around the outside of the support platform.

13. The method for installing the base according to claim 12, characterized in that, Also includes: The second snap-fit ​​structure and the first snap-fit ​​structure, which are mutually engaged, are moved toward the depth of the guide groove to drive the heat-conducting component to adhere to the carrier.

14. A semiconductor device, characterized in that, include: The process chamber and the base according to any one of claims 1 to 11, wherein the base is located within the process chamber.

Images