A high-gain millimeter-wave pattern reconfigurable subarray antenna

Abstract

The present application relates to the technical field of communication, especially to a high-gain millimeter wave directional pattern reconfigurable room-division antenna, comprising a feed port, a ground plate, a dielectric substrate, a radiation patch, a parasitic patch, a metal column, a PIN diode and a dielectric lens, the connection or disconnection between the parasitic patch and the ground plate is controlled by the PIN diode to realize dynamic adjustment of the radiation directional pattern of the room-division antenna and active switching corresponding to multiple working modes; the dielectric lens is used for collimating and converging the spherical electromagnetic wave emitted by the radiation patch into a directional plane wave. The present application realizes dynamic adjustment of the radiation directional pattern of the room-division antenna by controlling the connection or disconnection between the parasitic patch around the radiation patch and the ground plate by the PIN diode, thereby effectively improving the radiation coverage range and anti-interference ability of the room-division antenna, having the advantages of simple structure, high gain, low cost, easy processing and integration, and being suitable for various communication application scenarios.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and in particular to a high-gain millimeter-wave pattern reconfigurable indoor antenna. Background Technology

[0002] Traditional fixed-beam antennas face significant challenges in millimeter-wave applications: their radiated energy is concentrated in a single direction, making them inflexible in adapting to dynamically changing user distributions and complex indoor environments. Pattern-reconfigurable antennas, capable of adjusting beam direction according to real-time communication needs to optimize signal coverage and suppress interference, have thus attracted widespread attention. To achieve pattern reconfiguration, radio frequency switches (such as radio frequency microelectromechanical systems, varactor diodes, or PIN diodes) are typically used to change the current path on the antenna surface. However, in the millimeter-wave band, due to the extremely short wavelength, they are highly sensitive to manufacturing precision, parasitic parameters, and switching performance, making it difficult to design reconfigurable antennas with stable radiation performance, low insertion loss, and high isolation.

[0003] To meet the urgent needs of next-generation mobile communications for extremely high data rates and reliable connections in the millimeter-wave band, the development of antennas with both high gain and dynamic beam scanning capabilities has become an inevitable trend. To improve antenna gain, existing technologies typically employ large-scale array solutions, but this undoubtedly increases system complexity and cost. Another effective approach is to introduce dielectric lenses, leveraging their inherent electromagnetic wave focusing capabilities to enhance radiation directivity. However, efficiently integrating reconfigurable antennas with dielectric lenses and achieving stable multi-beam switching in the millimeter-wave band remains a pressing technical challenge.

[0004] Therefore, there is an urgent need to develop a millimeter-wave indoor antenna solution that is compact, high-gain, low-cost, and has a controllable beam. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a high-gain millimeter-wave pattern reconfigurable indoor distributed antenna, solving the inherent problems of rigid radiation direction and difficulty in dynamically adapting to user distribution faced by traditional fixed-beam antennas in the millimeter-wave band. Existing pattern reconfigurable solutions in the millimeter-wave band generally face technical problems such as complex design, poor performance stability, or insufficient gain. Especially in complex indoor environments, how to balance high gain and flexible beam control capabilities while maintaining low cost and complexity has become a key challenge in the deployment of millimeter-wave indoor distributed antenna systems.

[0006] To address the aforementioned technical problems, this invention provides a high-gain millimeter-wave pattern reconfigurable indoor distributed antenna for receiving signals from a base station or signal source and uniformly distributing them to various areas in a complex indoor environment. The indoor distributed antenna includes: The power supply port is used to provide the input port for radio frequency signals to the indoor distributed antenna. The ground plane is attached above the feed port and serves as the ground plane of the indoor distributed antenna. It is used to provide a stable potential reference and to help shape the radiation pattern of the indoor distributed antenna through the principle of electromagnetic mirroring. A dielectric substrate is attached to the upper surface of the ground plane to provide mechanical support and electrical insulation for the radiating patch; A radiating patch is attached to the upper surface of the dielectric substrate, with the center of the radiating patch corresponding to the center of the ground plane. It is used to convert the radio frequency signal injected by the power supply network into electromagnetic waves and radiate them effectively to various areas of the room. Parasitic patches are attached to the surface of a dielectric substrate adjacent to the radiating patch, including an upper parasitic patch and a lower parasitic patch distributed in layers relative to the dielectric substrate; the parasitic patch and the radiating patch generate electromagnetic coupling through near-field to achieve efficient transmission of electromagnetic waves. Metal pillars are placed within the dielectric substrate to ensure electrical synchronization and efficient coupling of electromagnetic energy between the upper and lower parasitic patches. A PIN diode is disposed between the lower surface of the ground plane and the lower parasitic patch. The PIN diode is used to control the connection or disconnection between the parasitic patch and the ground plane to achieve dynamic adjustment of the radiation pattern of the indoor distributed antenna and to actively switch between multiple operating modes. A dielectric lens is spaced above the radiating patch to collimate and converge the spherical electromagnetic waves emitted by the radiating patch into directional plane waves. The center of the dielectric lens corresponds to the center of the radiating patch.

[0007] Furthermore, the dynamic adjustment of the radiation pattern of the indoor distributed antenna is achieved by controlling the DC bias of the PIN diode to switch the electrical connection state between the parasitic patch and the ground plane, including short circuit or open circuit. When the PIN diode is turned on, the corresponding parasitic patch is short-circuited to the ground plane through the metal post and the phase center is pulled low. The parasitic patch acts as a guide for the radiating patch. When the PIN diode is disconnected, the corresponding parasitic patch connects to the ground plane and is in a floating resonant state, acting as a reflector for the radiating patch.

[0008] Furthermore, the grounding plate is provided with a first through hole and a second through hole. The first through hole is located at the center of the grounding plate and is coaxially arranged with the power supply port. The second through hole is spaced apart from the first through hole. The grounding plate also includes a third through hole, which is symmetrically arranged with respect to the second through hole about the center of the grounding plate, and the third through hole and the second through hole have the same size.

[0009] Furthermore, the parasitic patch includes a first parasitic patch and a third parasitic patch attached to the upper surface of the dielectric substrate and spaced apart from the radiation patch, and a second parasitic patch attached to the lower surface of the dielectric substrate and disposed in the second through hole, wherein the center of the second parasitic patch corresponds to the center of the first parasitic patch. The parasitic patch further includes a fourth parasitic patch attached to the lower surface of the dielectric substrate and disposed within the third through hole, wherein the center of the fourth parasitic patch corresponds to the center of the third parasitic patch.

[0010] Furthermore, the third parasitic patch has the same size and shape as the first parasitic patch, and the third parasitic patch and the first parasitic patch are symmetrically arranged about the center of the radiating patch. The fourth parasitic patch has the same size and shape as the second parasitic patch. The side length of the first parasitic patch adjacent to the radiating patch is greater than the side length of the radiating patch adjacent to the first parasitic patch, and the first parasitic patch has a chamfer in the direction away from the radiating patch.

[0011] Furthermore, the metal pillar includes a first metal pillar coaxially arranged with the power supply port, one end of the first metal pillar being connected to the power supply port, and the other end passing through the first through hole and the dielectric substrate in sequence to be connected to the radiating patch; Additionally, one end is connected to the second parasitic patch, and the other end passes through the second metal post and the third metal post connected to the first parasitic patch on the dielectric substrate; The second metal pillar and the third metal pillar are symmetrically arranged along the centerline of the short side of the second parasitic patch; The metal pillar also includes a fourth metal pillar and a fifth metal pillar, one end of which is connected to the fourth parasitic patch and the other end of which passes through the dielectric substrate and is connected to the third parasitic patch; The fourth metal post and the fifth metal post are symmetrically arranged along the central axis of the short side of the fourth parasitic patch.

[0012] Furthermore, the PIN diode includes a first PIN diode and a second PIN diode, one end of which is connected to the ground plane and the other end of which is connected to the second parasitic patch; The first PIN diode and the second PIN diode are symmetrically arranged along the centerline of the short side of the second parasitic patch; The PIN diode also includes a third PIN diode and a fourth PIN diode, one end of which is connected to the ground plane and the other end of which is connected to the fourth parasitic patch; The third PIN diode and the fourth PIN diode are symmetrically arranged along the central axis of the short side of the fourth parasitic patch.

[0013] Furthermore, the active switching corresponding to multiple working modes includes: When the first PIN diode and the second PIN diode are turned on and the third PIN diode and the fourth PIN diode are turned off, the first parasitic patch and the second parasitic patch establish an electrical connection with the ground plane and act as a guide, while the third parasitic patch and the fourth parasitic patch are disconnected from the ground plane and act as a reflector. The maximum radiation direction of the indoor distributed antenna is deflected to the angle between the first parasitic patch and the normal. When the first and second PIN diodes are disconnected and the third and fourth PIN diodes are turned on, the first and second parasitic patches are disconnected from the ground plane and act as reflectors, while the third and fourth parasitic patches are electrically connected to the ground plane and act as guides. The maximum radiation direction of the indoor distributed antenna is deflected to the angle between the third parasitic patch and the normal. When the first PIN diode, the second PIN diode, the third PIN diode, and the fourth PIN diode are all disconnected, the first parasitic patch, the second parasitic patch, the third parasitic patch, and the fourth parasitic patch are all disconnected from the ground plane, and the radiation beam of the indoor distributed antenna is a current beam pointing in the normal direction.

[0014] Furthermore, the diameter of the first through hole is smaller than the outer diameter of the power supply port, the shape of the second through hole is the same as the shape of the second parasitic patch, and the distance between the second through hole and the second parasitic patch is smaller than the length of the PIN diode.

[0015] Furthermore, the dielectric substrate is provided with a first via, a second via, a third via, a fourth via, and a fifth via, which are coaxially arranged with the first metal pillar, the second metal pillar, the third metal pillar, the fourth metal pillar, and the fifth metal pillar and have the same diameter. The first metal pillar is offset from the center of the radiation patch, and the diameter of the first metal pillar is greater than or less than the diameter of the second metal pillar. The second metal pillar has the same diameter as the third, fourth, and fifth metal pillars. The second metal pillar and the third metal pillar are symmetrically arranged at both ends of the long side centerline of the first parasitic patch, and the fourth, second, fifth and third metal pillars are symmetrically arranged about the radiation patch.

[0016] By employing the above technical solution, the present invention provides a high-gain millimeter-wave pattern reconfigurable indoor distribution antenna, which has at least the following beneficial effects: 1. The present invention achieves dynamic adjustment of the radiation pattern of an indoor distributed antenna by using PIN diodes on a single-layer dielectric substrate to control the connection or disconnection of parasitic patches around the radiating patch and the ground plane, thereby effectively improving the radiation coverage and anti-interference capability of the indoor distributed antenna. It has the advantages of simple structure, high gain, low cost, easy processing and integration, and is suitable for a variety of communication application scenarios.

[0017] 2. By using PIN diodes to switch the operating mode of the parasitic structure around the radiating patch, the radiation aperture field distribution of the antenna can be dynamically changed. This method has the advantages of simple structure, high gain, low cost, light weight, and easy integration.

[0018] 3. By electronically switching the three different maximum radiation directions of the indoor distributed antenna, the maximum beam direction can be dynamically switched, concentrating energy on high-capacity demand areas, thereby significantly improving spectrum utilization efficiency and edge user signal quality, and effectively overcoming the inherent defects of large path loss and weak penetration of millimeter wave signals.

[0019] 4. The agile beam reconfiguration capability of indoor distributed antennas can be used to build secure physical layer communication links. By using directional beams to avoid eavesdropping nodes in non-target directions, communication confidentiality is enhanced, meeting the dual requirements of high capacity and high reliability for future wireless networks.

[0020] 5. By collimating and focusing electromagnetic waves through a dielectric lens, the antenna gain in each beam state is significantly improved, ultimately achieving a simple, high-performance, and cost-effective millimeter-wave dynamic coverage solution. It can be widely applied in 5G / 6G millimeter-wave indoor distribution systems, fixed wireless access, satellite communication, and radar sensing. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is an exploded view of the indoor distribution antenna in this invention; Figure 2 This is a top view of the indoor distribution antenna in this invention; Figure 3 This is a side view of the indoor distribution antenna in this invention; Figure 4 This is a top perspective view of the indoor distribution antenna in this invention; Figure 5 The diagram shows the return loss of the indoor distribution antenna in this invention when it operates in modes 1, 2 and 3. Figure 6 This is a gain diagram of the indoor distribution antenna in this invention when it operates in modes 1, 2 and 3; Figure 7 This is the radiation pattern of the H-plane when the indoor distribution antenna operates in mode 1 in this invention; Figure 8 This is the radiation pattern of the H-plane when the indoor distributed antenna operates in mode 2 in this invention; Figure 9 This is the radiation pattern of the H-plane when the indoor distributed antenna operates in mode 3 in this invention.

[0022] In the picture: 100. Power supply port; 200, Grounding plate; 210, First through hole; 220, Second through hole; 230, Third through hole; 300, dielectric substrate; 310, first via; 320, second via; 330, third via; 340, fourth via; 350, fifth via; 400. Radiation patch; 500. Parasitic patch; 510. First parasitic patch; 520. Second parasitic patch; 530. Third parasitic patch; 540. Fourth parasitic patch; 600, Metal column; 610, First metal column; 620, Second metal column; 630, Third metal column; 640, Fourth metal column; 650, Fifth metal column; 700, PIN diode; 710, First PIN diode; 720, Second PIN diode; 730, Third PIN diode; 740, Fourth PIN diode; 800, Medium Lens. Detailed Implementation

[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. This will allow for a full understanding of how the present application uses technical means to solve technical problems and achieve technical effects, and to facilitate its implementation.

[0024] This embodiment proposes a high-gain millimeter-wave pattern reconfigurable indoor distributed antenna. It utilizes PIN diodes to switch the operating modes of parasitic structures surrounding the radiating patch, thereby dynamically altering the antenna's radiating aperture field distribution. Simultaneously, a dielectric lens above collimates and focuses the electromagnetic waves, significantly improving the antenna gain in each beam state. Ultimately, this achieves a simple, high-performance, and cost-effective millimeter-wave dynamic coverage solution. It boasts advantages such as simple structure, high gain, low cost, light weight, and easy integration, and can be widely applied in 5G / 6G millimeter-wave indoor distributed systems, fixed wireless access, satellite communication, and radar sensing.

[0025] For example, this indoor distributed antenna can serve as a high-performance coverage unit, deployed in complex indoor environments with dense user populations and dynamic distribution, such as large shopping malls, smart office buildings, and transportation hubs. By electronically switching between three different operating modes with maximum radiation directions, this indoor distributed antenna can dynamically switch the maximum beam direction, concentrating energy towards areas with high capacity requirements. This significantly improves spectrum utilization efficiency and signal quality for edge users, effectively overcoming the inherent defects of millimeter-wave signals, such as high path loss and weak penetration. Simultaneously, its agile beam reconfiguration capability can be used to build secure physical layer communication links, avoiding eavesdropping nodes in non-target directions through directional beams, enhancing communication confidentiality, and meeting the dual requirements of high capacity and high reliability for future wireless networks.

[0026] Combination Figure 1 , Figure 2 , Figure 3 As shown, the indoor distributed antenna proposed in this invention comprises a feed port 100, a ground plane 200, a dielectric substrate 300, a radiating patch 400, a parasitic patch 500, a metal pillar 600, a PIN diode 700, and a dielectric lens 800, wherein: The feed port 100 is used to provide an input port for radio frequency signals to the indoor distributed antenna.

[0027] The ground plane 200 is attached above the feed port 100 and serves as the ground plane of the indoor distributed antenna. It is used to provide a stable potential reference and to help shape the radiation pattern of the indoor distributed antenna through the principle of electromagnetic mirroring.

[0028] The ground plane 200 provides the necessary electrical grounding for the indoor distributed antenna while effectively suppressing back radiation, thereby reducing electromagnetic interference to co-located equipment and improving the antenna's front-to-back ratio. The ground plane 200 is made of highly conductive material, and its shape, such as square, circular, or polygonal, needs to be determined based on the antenna's operating frequency, target radiation pattern, installation space, and manufacturing process.

[0029] In a preferred embodiment, the ground plane 200 is provided with a first through hole 210 and a second through hole 220. The first through hole 210 is located at the center of the ground plane 200 and is coaxially arranged with the power supply port 100. The second through hole 220 is spaced apart from the first through hole 210. The ground plane 200 also includes a third through hole 230. The third through hole 230 and the second through hole 220 are symmetrically arranged about the center of the ground plane 200. The third through hole 230 and the second through hole 220 have the same size.

[0030] The dielectric substrate 300 is attached to the upper surface of the ground plane 200, providing mechanical support and electrical insulation for the radiating patch 400. The dielectric constant and loss tangent of its material are key electromagnetic parameters: a higher dielectric constant helps reduce the physical size of the antenna, while a lower dielectric constant is beneficial for widening the operating bandwidth. By optimizing the selection of the substrate material, the size, bandwidth, and radiation efficiency of the antenna can be balanced.

[0031] The radiating patch 400 is attached to the upper surface of the dielectric substrate 300 and serves as the core radiator of the antenna. The center of the radiating patch 400 corresponds to the center of the ground plane 200 and is used to convert the radio frequency signal injected by the feed network into electromagnetic waves and effectively radiate them to various areas of the room.

[0032] The radiating patch 400 functions to convert the radio frequency signal energy injected by the feed network into electromagnetic waves and achieve effective radiation. The radiating patch 400 is typically made of low-resistivity metals such as copper or aluminum to ensure high radiation efficiency and good conductivity. Its geometry, size, and relative position to the feed point together determine the antenna's fundamental resonant frequency and initial radiation characteristics. The radiating patch 400 can adopt various configurations such as square, rectangular, circular, annular, and polygonal. This embodiment does not limit its specific shape to provide design flexibility for different performance optimization goals.

[0033] In a preferred embodiment, the parasitic patch 500 is attached to the surface of the dielectric substrate 300 adjacent to the radiating patch 400. The parasitic patch 500 and the radiating patch 400 generate electromagnetic coupling through near-field to achieve efficient transmission of electromagnetic waves. The parasitic patch 500 includes an upper parasitic patch and a lower parasitic patch that are distributed hierarchically relative to the dielectric substrate 300. The upper parasitic patch consists of a first parasitic patch 510 and a third parasitic patch 530; the lower parasitic patch consists of a second parasitic patch 520 and a fourth parasitic patch 540.

[0034] In a preferred embodiment, the parasitic patch 500 includes a first parasitic patch 510 and a third parasitic patch 530 disposed on the upper surface of the dielectric substrate 300 and spaced apart from the radiating patch 400, and a second parasitic patch 520 disposed on the lower surface of the dielectric substrate 300 and disposed within the second through hole 220, the center of the second parasitic patch 520 corresponding to the center of the first parasitic patch 510; the parasitic patch 500 also includes a fourth parasitic patch 540 disposed on the lower surface of the dielectric substrate 300 and disposed within the third through hole 230, the center of the fourth parasitic patch 540 corresponding to the center of the third parasitic patch 530.

[0035] In a preferred embodiment, the third parasitic patch 530 has the same size and shape as the first parasitic patch 510. The third parasitic patch 530 and the first parasitic patch 510 are arranged symmetrically about the center of the radiating patch 400. The fourth parasitic patch 540 has the same size and shape as the second parasitic patch 520. The side length of the first parasitic patch 510 adjacent to the radiating patch 400 is greater than the side length of the radiating patch 400 adjacent to the first parasitic patch 510. The first parasitic patch 510 has a chamfer in the direction away from the radiating patch 400.

[0036] The shape of the parasitic patch 500 can be selected as square, polygon, etc., according to actual design requirements. For example, the parasitic patch 500 can be rectangular, wherein the first parasitic patch 510 and the third parasitic patch 530 are chamfered rectangles to increase the deflection angle of the maximum radiation direction of the antenna.

[0037] In a preferred embodiment, the metal pillar 600 is placed within the dielectric substrate 300 to ensure efficient electrical synchronization and electromagnetic energy coupling between the upper and lower parasitic patches. The metal pillar 600 includes a first metal pillar 610 coaxially arranged with the power supply port 100, one end of which is connected to the power supply port 100, and the other end passing through the first through-hole 210, the dielectric substrate 300, and connecting to the radiating patch 400. It also includes a second metal pillar 620 and a third metal pillar 630, one end of which is connected to the second parasitic patch 520, and the other end passing through the dielectric substrate 300 and connecting to the first parasitic patch 510. The second metal pillar 620 and the third metal pillar 630 are symmetrically arranged along the centerline of the short side of the second parasitic patch 520.

[0038] In a preferred embodiment, the metal pillar 600 further includes a fourth metal pillar 640 and a fifth metal pillar 650, one end of which is connected to the fourth parasitic patch 540 and the other end of which passes through the dielectric substrate 300 and is connected to the third parasitic patch 530; the fourth metal pillar 640 and the fifth metal pillar 650 are symmetrically arranged along the central axis of the short side of the fourth parasitic patch 540.

[0039] In a preferred embodiment, the second metal post 620 and the third metal post 630 are symmetrically arranged near the center of the two shorter sides of the first parasitic patch 510, and the fourth metal post 640 and the fifth metal post 650 are symmetrically arranged near the center of the two shorter sides of the third parasitic patch 530.

[0040] In addition, the dielectric substrate 300 is also provided with a first via 310, a second via 320, a third via 330, a fourth via 340, and a fifth via 350. The first via 310 is used to insert a first metal pillar 610, the second via 320 is used to insert a second metal pillar 620, the third via 330 is used to insert a third metal pillar 630, the fourth via 340 is used to insert a fourth metal pillar 640, and the fifth via 350 is used to insert a fifth metal pillar 650.

[0041] In a preferred embodiment, the first metal post 610 is offset from the center of the radiating patch 400. The diameter of the first metal post 610 is greater than or less than the diameter of the second metal post 620. The second metal post 620 has the same diameter as the third metal post 630, the fourth metal post 640, and the fifth metal post 650. The second metal post 620 and the third metal post 630 are symmetrically arranged at both ends of the long side centerline of the first parasitic patch 510. The fourth metal post 640, the second metal post 620, the fifth metal post 650, and the third metal post 630 are symmetrically arranged about the radiating patch 400.

[0042] The PIN diode 700 is located between the lower surface of the ground plane 200 and the lower parasitic patch, and is the core actuator for realizing electronic control reconfiguration in this embodiment. The PIN diode 700 is used to control the connection or disconnection between the parasitic patch 500 and the ground plane 200 to achieve dynamic adjustment of the radiation pattern of the indoor distributed antenna and to actively switch between various operating modes.

[0043] In a preferred embodiment, the electrical connection state between the parasitic patch 500 and the ground plane 200, including short circuit or open circuit, is switched by controlling the DC bias of the PIN diode 700.

[0044] When the PIN diode 700 is turned on, the corresponding parasitic patch 500 is short-circuited with the ground plane 200 through the metal post 600 and the phase center is pulled low. The parasitic patch 500 acts as a conductor of the radiating patch 400. When the PIN diode 700 is turned off, the corresponding parasitic patch 500 is connected to the ground plane 200 and is in a floating resonant state. The parasitic patch 500 acts as a reflector of the radiating patch 400.

[0045] This dynamic switching of functionality is the physical basis for beam deflection. For example, a first PIN diode 710 and a second PIN diode 720 are respectively disposed at the center of the two shorter sides of the second parasitic patch 520, for selectively connecting the first parasitic patch 510 and the second parasitic patch 520 to the ground plane 200; a third PIN diode 730 and a fourth PIN diode 740 are respectively disposed at the center of the two shorter sides of the fourth parasitic patch 540, for selectively connecting the third parasitic patch 530 and the fourth parasitic patch 540 to the ground plane 200.

[0046] When the first PIN diode 710 and the second PIN diode 720 are turned on and the third PIN diode 730 and the fourth PIN diode 740 are turned off, the first parasitic patch 510 and the second parasitic patch 520 establish an electrical connection with the ground plane 200 and act as a conductor, while the third parasitic patch 530 and the fourth parasitic patch 540 are disconnected from the ground plane 200 and act as a reflector. At this time, the radio frequency excitation signal applied to the feed port 100 can achieve mode 1, in which the maximum radiation direction deviates from the normal and deflects towards the first parasitic patch 510.

[0047] When the first PIN diode 710 and the second PIN diode 720 are disconnected and the third PIN diode 730 and the fourth PIN diode 740 are turned on, the first parasitic patch 510 and the second parasitic patch 520 are disconnected from the ground plane 200 and act as reflectors, while the third parasitic patch 530 and the fourth parasitic patch 540 are electrically connected to the ground plane 200 and act as conductors. At this time, the maximum radiation direction of the indoor distributed antenna deviates from the normal and deflects towards the third parasitic patch 530, mode 2.

[0048] When the first PIN diode 710, the second PIN diode 720, the third PIN diode 730, and the fourth PIN diode 740 are all disconnected, the first parasitic patch 510, the second parasitic patch 520, the third parasitic patch 530, and the fourth parasitic patch 540 are all disconnected from the ground plane 200 and are in a floating resonance state. At this time, the radiation aperture field distribution of the indoor distributed antenna is most symmetrical, forming a wide beam pointing in the normal direction, which is suitable for wide-area coverage mode 3.

[0049] The dielectric lens 800 is spaced above the radiating patch 400, which can improve the gain of the radiating patch 400 and effectively avoid the complexity and high cost of traditional array antennas. It is used to collimate and converge the spherical electromagnetic waves emitted by the radiating patch 400 into directional plane waves, and the center of the dielectric lens 800 corresponds to the center of the radiating patch 400.

[0050] In a preferred embodiment, the dielectric lens 800 is the core enhancement component for achieving high gain performance. Its conical structure, made of low-loss polymer material or ceramic, acts as an independent phase correction element, collimating and focusing the spherical electromagnetic waves emitted from the radiating patch 400, converting them into more directional plane waves. This concentrates the radiated energy towards the target direction, significantly improving antenna gain. This passive gain enhancement method effectively avoids the complex feeding network and high cost associated with traditional large arrays.

[0051] This embodiment cleverly integrates reconfigurable parasitic element technology with dielectric lens gain enhancement technology. By using a PIN diode 700 to control the operating state of the parasitic patch 500 on a single-layer dielectric substrate 300, dynamic electrical adjustment of the radiation pattern is achieved, avoiding a complex phased array architecture. Simultaneously, the introduction of the dielectric lens 800 significantly improves the antenna gain by 5-6 dB without increasing active complexity or cost. This indoor distributed antenna structure provides a high-performance, low-cost ideal solution for next-generation high-speed indoor millimeter-wave coverage.

[0052] This embodiment uses a high-gain millimeter-wave pattern reconfigurable indoor antenna with a center frequency of 26 GHz as an example for testing.

[0053] Figure 4 This is a top perspective view of the indoor distributed antenna in this embodiment. Combined with... Figures 1 to 4 In this embodiment, the ground plane 200 is square, the radiating patch 400 is rectangular, the second parasitic patch 520 and the fourth parasitic patch 540 are rectangular, and the first parasitic patch 510 and the third parasitic patch 530 are chamfered rectangles. The optimized dimensions of the indoor distributed antenna are: the length and width of the ground plane 200 are G... W =20mm, G L =20mm. The dielectric substrate 300 has a relative permittivity of 2.2 and a thickness H1 = 0.508mm. The length and width of the radiating patch 400 are W = 4.6mm and L = 3.6mm, respectively. The length and width of the parasitic patch 500 are L... p =5.3mm, W p =3.2mm. The radius of the first metal pillar 610 is R. o =0.28mm, the radius of the second metal column 620 is R e =0.2mm. The PIN diode 700 has a length of 0.15mm and a width of 0.075mm. The total height of the dielectric lens 800 is H2=19mm, of which the cylindrical portion has a height of H1=11mm.

[0054] Figure 5 This is a return loss diagram for the indoor distributed antenna in this embodiment when it operates in modes 1, 2 and 3. Figure 6 This diagram shows the gain of the indoor distributed antenna in this embodiment when operating in modes 1, 2, and 3. Due to the structural symmetry, the reflection coefficient remains consistent in modes 1 and 2, with a -10dB impedance bandwidth of 1.98 GHz, ranging from 24.55 to 26.53 GHz; the -10dB impedance bandwidth in mode 3 is 1.60 GHz, ranging from 24.70 to 26.30 GHz. Within the operating frequency band, the gain in all three modes is greater than 10.6 dBi. Compared to a patch antenna without a lens, the gain is improved by 5-6 dB.

[0055] Figure 7 This is the radiation pattern of the H-plane when the indoor distributed antenna operates in mode 1 in this embodiment. Figure 8 This is the radiation pattern of the H-plane when the indoor distributed antenna operates in mode 2 in this embodiment. Figure 9 This is the radiation pattern of the H-plane when the indoor distributed antenna operates in mode 3 in this embodiment.

[0056] Reference Figures 7 to 9 This indicates that the high-gain millimeter-wave pattern reconfigurable indoor antenna achieves three different beam pointing radiation patterns at 26 GHz. When operating in mode 1, the antenna's maximum beam pointing deviates from the normal and tilts to -30°; when operating in mode 2, the antenna's maximum beam pointing deviates from the normal and tilts to +30°; and when operating in mode 3, the beam exhibits a uniform current beam along the normal direction.

[0057] The high-gain millimeter-wave pattern reconfigurable indoor distributed antenna provided in this embodiment creatively combines the flexibility of beam reconfiguration with the high-gain characteristics of a lens antenna by integrating an electrically adjustable parasitic element and a passive dielectric lens, aiming to solve the aforementioned technical contradictions. Its core lies in using PIN diodes to switch the operating mode of the parasitic structure around the radiating patch, thereby dynamically changing the antenna's radiation aperture field distribution; simultaneously, the dielectric lens above collimates and focuses the electromagnetic waves, significantly improving the antenna gain in each beam state, ultimately achieving a simple, high-performance, and cost-effective millimeter-wave dynamic coverage solution.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Since the above embodiments are substantially similar to the method embodiments, their descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0060] The above embodiments provide a detailed description of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A high-gain millimeter-wave pattern reconfigurable indoor distributed antenna, used to receive signals from a base station or signal source and uniformly distribute them to various areas in a complex indoor environment, characterized in that, The indoor distributed antenna includes: The feed port (100) is used to provide an input port for radio frequency signals to the indoor distributed antenna; Ground plane (200) is attached above the feed port (100) and serves as the ground plane of the indoor distributed antenna to provide a stable potential reference; A dielectric substrate (300) is attached to the upper surface of the ground plane (200) to provide mechanical support and electrical insulation for the radiating patch (400); A radiating patch (400) is attached to the upper surface of the dielectric substrate (300), with the center of the radiating patch (400) corresponding to the center of the ground plane (200), and is used to convert the radio frequency signal injected by the power supply network into electromagnetic waves and radiate them effectively to various areas of the room. Parasitic patch (500) is attached to the surface of dielectric substrate (300) adjacent to the radiating patch (400), including an upper parasitic patch and a lower parasitic patch that are distributed hierarchically relative to the dielectric substrate (300). Metal pillars (600) are placed within the dielectric substrate (300) for electrical synchronization and electromagnetic energy coupling between the upper and lower parasitic patches; A PIN diode (700) is disposed between the lower surface of the ground plane (200) and the lower parasitic patch. The PIN diode (700) is used to control the connection or disconnection between the parasitic patch (500) and the ground plane (200) to realize the dynamic adjustment of the radiation pattern of the indoor distributed antenna and to correspond to the active switching of multiple working modes. A dielectric lens (800) is disposed at intervals above the radiation patch (400) to collimate and converge the spherical electromagnetic waves emitted by the radiation patch (400) into directional plane waves. The center of the dielectric lens (800) corresponds to the center of the radiation patch (400).

2. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 1, characterized in that, The dynamic adjustment of the radiation pattern of the indoor distributed antenna is achieved by controlling the DC bias of the PIN diode (700) to switch the electrical connection state between the parasitic patch (500) and the ground plane (200), including short circuit or open circuit. When the PIN diode (700) is turned on, the corresponding parasitic patch (500) is short-circuited with the ground plane (200) through the metal post (600) and the phase center is pulled low. The parasitic patch (500) acts as a guide for the radiating patch (400). When the PIN diode (700) is disconnected, the corresponding parasitic patch (500) is connected to the ground plane (200) and is in a floating resonance state. The parasitic patch (500) acts as a reflector of the radiating patch (400).

3. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 1, characterized in that, The grounding plate (200) is provided with a first through hole (210) and a second through hole (220). The first through hole (210) is located at the center of the grounding plate (200) and is coaxially arranged with the power supply port (100). The second through hole (220) is spaced apart from the first through hole (210). The ground plane (200) also includes a third through hole (230), which is symmetrically arranged with respect to the center of the ground plane (200) with respect to the second through hole (220), and the third through hole (230) and the second through hole (220) have the same size.

4. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 3, characterized in that, The parasitic patch (500) includes a first parasitic patch (510) and a third parasitic patch (530) attached to the upper surface of the dielectric substrate (300) and spaced apart from the radiation patch (400), and a second parasitic patch (520) attached to the lower surface of the dielectric substrate (300) and disposed in the second through hole (220), wherein the center of the second parasitic patch (520) corresponds to the center of the first parasitic patch (510); The parasitic patch (500) further includes a fourth parasitic patch (540) attached to the lower surface of the dielectric substrate (300) and disposed in the third through hole (230), the center of the fourth parasitic patch (540) corresponding to the center of the third parasitic patch (530).

5. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 4, characterized in that, The third parasitic patch (530) has the same size and shape as the first parasitic patch (510). The third parasitic patch (530) and the first parasitic patch (510) are arranged symmetrically about the center of the radiation patch (400). The fourth parasitic patch (540) has the same size and shape as the second parasitic patch (520). The side length of the first parasitic patch (510) adjacent to the radiation patch (400) is greater than the side length of the radiation patch (400) adjacent to the first parasitic patch (510), and the first parasitic patch (510) is provided with a chamfer in the direction away from the radiation patch (400).

6. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 4, characterized in that, The metal pillar (600) includes a first metal pillar (610) coaxially arranged with the power supply port (100). One end of the first metal pillar (610) is connected to the power supply port (100), and the other end passes through the first through hole (210) and the dielectric substrate (300) in sequence and is connected to the radiation patch (400). In addition, a second metal post (620) and a third metal post (630) are connected at one end to the second parasitic patch (520) and at the other end through the dielectric substrate (300) and connected to the first parasitic patch (510). The second metal post (620) and the third metal post (630) are symmetrically arranged along the center line of the short side of the second parasitic patch (520); The metal pillar (600) further includes a fourth metal pillar (640) and a fifth metal pillar (650), one end of which is connected to the fourth parasitic patch (540) and the other end of which passes through the dielectric substrate (300) and is connected to the third parasitic patch (530). The fourth metal post (640) and the fifth metal post (650) are symmetrically arranged along the central axis of the short side of the fourth parasitic patch (540).

7. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 4, characterized in that, The PIN diode (700) includes a first PIN diode (710) and a second PIN diode (720) with one end connected to the ground plane (200) and the other end connected to the second parasitic patch (520). The first PIN diode (710) and the second PIN diode (720) are symmetrically arranged along the center line of the short side of the second parasitic patch (520); The PIN diode (700) also includes a third PIN diode (730) and a fourth PIN diode (740), one end of which is connected to the ground plane (200) and the other end of which is connected to the fourth parasitic patch (540). The third PIN diode (730) and the fourth PIN diode (740) are symmetrically arranged along the central axis of the short side of the fourth parasitic patch (540).

8. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 7, characterized in that, The active switching corresponding to multiple working modes includes: When the first PIN diode (710) and the second PIN diode (720) are turned on and the third PIN diode (730) and the fourth PIN diode (740) are turned off, the first parasitic patch (510) and the second parasitic patch (520) establish an electrical connection with the ground plane (200) to act as a guide, and the third parasitic patch (530) and the fourth parasitic patch (540) are disconnected from the ground plane (200) to act as a reflector. The maximum radiation direction of the indoor distributed antenna is deflected to the angle between the first parasitic patch (510) and the normal. When the first PIN diode (710) and the second PIN diode (720) are disconnected and the third PIN diode (730) and the fourth PIN diode (740) are turned on, the first parasitic patch (510) and the second parasitic patch (520) are disconnected from the ground plane (200) and act as reflectors, while the third parasitic patch (530) and the fourth parasitic patch (540) are electrically connected to the ground plane (200) and act as guides. The maximum radiation direction of the indoor distributed antenna is deflected to the angle between the third parasitic patch (530) and the normal. When the first PIN diode (710), the second PIN diode (720), the third PIN diode (730), and the fourth PIN diode (740) are all disconnected, the first parasitic patch (510), the second parasitic patch (520), the third parasitic patch (530), and the fourth parasitic patch (540) are all disconnected from the ground plane (200), and the radiation beam of the indoor distributed antenna is a current beam pointing in the normal direction.

9. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 7, characterized in that, The diameter of the first through hole (210) is smaller than the outer diameter of the power supply port (100), the shape of the second through hole (220) is the same as the shape of the second parasitic patch (520), and the distance between the second through hole (220) and the second parasitic patch (520) is smaller than the length of the PIN diode (700).

10. The high-gain millimeter-wave pattern reconfigurable indoor distribution antenna according to claim 6, characterized in that, The dielectric substrate (300) is provided with a first via (310), a second via (320), a third via (330), a fourth via (340), and a fifth via (350) that are coaxially arranged with the first metal pillar (610), the second metal pillar (620), the third metal pillar (630), the fourth metal pillar (640), and the fifth metal pillar (650) and have the same diameter. The first metal pillar (610) is offset from the center of the radiation patch (400), and the diameter of the first metal pillar (610) is greater than or less than the diameter of the second metal pillar (620). The second metal pillar (620) has the same diameter as the third metal pillar (630), the fourth metal pillar (640), and the fifth metal pillar (650). The second metal pillar (620) and the third metal pillar (630) are symmetrically arranged at both ends of the long side center line of the first parasitic patch (510), and the fourth metal pillar (640), the second metal pillar (620), the fifth metal pillar (650), and the third metal pillar (630) are respectively symmetrically arranged about the radiation patch (400).

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