Active phased array antenna arrays, communication devices and phased array radar systems

Abstract

The application provides an active phased array antenna array, a communication device and a phased array radar system, relates to the technical field of active phased array antenna design, and replaces the ground shielding hole in the periphery of the radio frequency signal via with a power supply via which is conductive with a large-current power supply network, so that the copper skin path of the power supply control layer power supply is not broken, and the situation that the copper skin is cut off by a large number of holes is avoided, compared with the prior art, the effective conduction cross-sectional area of the power supply copper skin is increased, and the line pressure drop under the large-current power supply condition is reduced, so that the power supply voltage pressure difference of the Beform chips at different positions in the antenna array is smaller, the large-current power supply network is used as the electromagnetic shielding of the radio frequency signal via, the anti-interference performance of radio frequency signal transmission is guaranteed, and the technical problem that the power supply voltage pressure difference of the Beform chips at different positions of the large-current multi-array element phased array antenna is excessive is solved.

Description

Technical Field

[0001] This invention relates to the field of active phased array antenna design technology, and in particular to an active phased array antenna array, communication equipment, and phased array radar system. Background Technology

[0002] In existing multi-element high-current active phased array antennas, radio frequency (RF) signal vias need to extend from the RF circuit layer through the intermediate power supply control layer to the antenna layer. To ensure that the RF signal is not interfered with, a ring of grounding shielding holes is usually set around the RF signal vias, extending from the RF circuit layer to the antenna layer. However, when this ring of grounding shielding holes passes through the intermediate power supply control layer, it will interrupt the power supply copper foil in the power supply control layer that is originally used to carry the high current of the Beform (Beam-forming) chip. This significantly reduces the effective cross-sectional area of ​​the copper foil in the power supply control layer. In the scenario of multi-element high-current power supply, the reduction in the effective cross-sectional area of ​​the copper foil will lead to an increase in the resistance of the power supply line, which in turn will increase the voltage drop. This will cause the voltage difference of the Beform chip power supply at different positions of the antenna array to exceed the standard, which will seriously degrade the antenna performance. Summary of the Invention

[0003] The purpose of this invention is to provide an active phased array antenna array, communication equipment, and phased array radar system to alleviate the technical problem of excessive voltage difference in the power supply voltage of the Beform chip at different positions in high-current multi-element phased array antennas in the prior art.

[0004] In a first aspect, the present invention provides an active phased array antenna array, comprising: a radio frequency (RF) circuit layer, a power supply control layer, and an antenna layer stacked sequentially from top to bottom; the RF circuit layer is used to lay out RF chips and RF traces; the power supply control layer is used to control the RF chips and supply power to the RF chips; the antenna layer is used to arrange passive antennas; a through RF signal via is provided between the RF circuit layer and the antenna layer for transmitting RF signals between the RF circuit layer and the antenna layer; multiple power vias are arranged around the outer periphery of the RF signal vias, and each power via is electrically connected to a high-current power network in the power supply control layer, so that the high-current power network acts as a shielding potential to electromagnetically shield the RF signal vias.

[0005] In an optional implementation, the power vias are evenly distributed at equal intervals along a circumference centered on the center of the RF signal via.

[0006] In an optional embodiment, the power vias include: an inner ring power via group and an outer ring power via group; there are no other vias between the inner ring power via group and the radio frequency signal vias, the outer ring power via group is arranged at intervals outside the inner ring power via group, and both the inner ring power via group and the outer ring power via group are electrically connected to a high-current power network.

[0007] In an optional implementation, the power via is electrically connected to the copper layer that forms the high-current power network in the power control layer through direct contact with its via wall, and the copper layer is a continuous and complete plane at the connection point with the power via.

[0008] In an optional implementation, the active phased array antenna array is an antenna array in a multi-element high-current array antenna. The multi-element high-current array antenna adopts a left-right symmetrical partitioned independent power supply structure, and the power vias of the left and right partitions are respectively connected to the high-current power supply network corresponding to their respective partitions.

[0009] In an optional embodiment, the high-current power network includes: a first power plane and a second power plane; the first power plane and the second power plane are respectively located in different stacks of the power supply control layer; a plurality of cross-plane interconnecting vias are provided between the first power plane and the second power plane, and each power via is connected to the first power plane and the second power plane.

[0010] In an optional implementation, the power via density in the edge region of the active phased array antenna array is greater than the power via density in the center region of the active phased array antenna array.

[0011] In an optional embodiment, the power via is a variable diameter via structure segmented along the axial direction, with the aperture of the power via in the power supply control layer being larger than the aperture in the radio frequency circuit layer and the antenna layer.

[0012] In a second aspect, the present invention provides a communication device comprising an active phased array antenna array as described in any of the foregoing embodiments.

[0013] Thirdly, the present invention provides a phased array radar system, including the active phased array antenna array described in any of the foregoing embodiments.

[0014] This invention replaces the grounding shielding vias surrounding RF signal vias with power vias that are connected to a high-current power network. Since the power vias do not interrupt the copper path of the high-current power network, they avoid the situation where the power control layer copper is cut off by numerous vias. Compared to the existing method using grounding shielding vias, this invention effectively increases the effective conductive cross-sectional area of ​​the power copper and reduces the line voltage drop under high-current power supply conditions, thus resulting in a smaller voltage difference between the supply voltages of Beform chips at different locations within the antenna array. Therefore, this invention uses the high-current power network as a shielding potential to electromagnetically shield the RF signal vias, ensuring the anti-interference performance of RF signal transmission and solving the technical problem of excessive voltage differences between the supply voltages of Beform chips at different locations in a high-current multi-element phased array antenna. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an active phased array antenna array provided in an embodiment of the present invention; Figure 2 A schematic diagram showing the division between the digital part and the antenna array part of an active phased array antenna; Figure 3 A schematic diagram showing the broken power copper foil supplying power to the Beform chip in an active phased array antenna array. Figure 4 A schematic diagram of the power supply voltage distribution when the power copper foil supplying power to the Beform chip in an active phased array antenna array is partially broken and the load is 60A. Figure 5 A schematic diagram of the power supply voltage distribution when the power copper foil supplying power to the Beform chip in an active phased array antenna array is not interrupted and the load is 60A. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0019] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0020] Example 1 This invention provides an active phased array antenna array, such as... Figure 1As shown, it includes: a radio frequency circuit layer 10, a power supply control layer 20 and an antenna layer 30 stacked from top to bottom; the radio frequency circuit layer is used to lay out radio frequency chips and radio frequency traces; the power supply control layer is used to control the radio frequency chips and supply power to the radio frequency chips; the antenna layer is used to arrange passive antennas; a through radio frequency signal via is provided between the radio frequency circuit layer and the antenna layer for transmitting radio frequency signals between the radio frequency circuit layer and the antenna layer.

[0021] In this embodiment of the invention, a plurality of power vias 50 are arranged around the outer periphery of the radio frequency signal via 40. Each power via is electrically connected to a high-current power network in the power supply control layer, so that the high-current power network acts as a shielding potential to electromagnetically shield the radio frequency signal via.

[0022] Specifically, an active phased array antenna generally consists of a power supply section, a beam control section, an RF section, and an antenna section. The power supply section provides power to the beam control and RF sections via traces and copper foil. In a typical phased array antenna, the power supply and beam control sections are often placed together, collectively referred to as the digital section 60; the RF section and antenna section are often placed together, collectively referred to as the RF section or antenna array section 70. Figure 2 This is a schematic diagram showing the division between the digital part and the antenna array part of an active phased array antenna.

[0023] The structural improvements involved in the embodiments of the present invention mainly target the antenna array part, that is, the active phased array antenna array, whose architecture generally includes a radio frequency circuit layer, a power supply control layer and an antenna layer stacked from top to bottom. The radio frequency (RF) circuit layer is located at the top of the entire stack-up structure. It contains RF chips and RF traces, and is responsible for the generation, amplification, reception, modulation, and demodulation of RF signals. The number of PCB layers required for this part depends on the complexity of the RF circuitry, generally requiring 1 to 7 PCB layers. The second part from the top is the power supply control layer, whose main function is to control and supply power to the top-level RF chip. That is, the power supply control layer carries both the transmission of power supply current and the transmission of control signals such as beam control. This part generally requires 3 to 15 PCB layers or more. The third part from the top is the antenna layer, which is the passive antenna part of the phased array antenna. It consists of antenna elements and antenna array design. The antenna elements radiate the RF signals transmitted from the RF circuit layer in the form of electromagnetic waves, or couple the received external electromagnetic wave signals to the RF circuit layer for processing. In other words, the antenna layer only interacts with the top-level RF circuit layer and does not interact with the intermediate power supply control layer.

[0024] A through-hole RF signal via is provided between the RF circuit layer and the antenna layer. That is, the RF signal via extends from the RF signal output terminal of the RF circuit layer to the antenna feed terminal of the antenna layer, establishing a transmission channel for RF signals between the two layers. Specifically, signals generated by the RF circuit layer are transmitted downwards to the antenna layer via this RF signal via, where they are radiated outwards by the passive antenna elements. Conversely, external RF signals received by the antenna layer are also transmitted upwards to the RF circuit layer via this RF signal via for further processing.

[0025] Since radio frequency (RF) signal vias need to penetrate from the RF circuit layer through the power supply and control layer to reach the antenna layer, existing technologies use grounding vias for shielding to minimize interference and ensure the RF signal is protected. Figure 3 As shown, holes are punched around the RF link for shielding. These holes are generally designed to be connected to the ground network. This results in the power copper foil that supplies power to the Beform chip in the antenna array being less complete. When the Beform chip in the array requires a large current, it is impossible to meet the requirement that the voltage difference between the Beform chips at different positions in the antenna array is less than or equal to 30mV (exemplary value).

[0026] Unlike the grounding via shielding method used in the prior art, the embodiments of the present invention have multiple power vias arranged around the periphery of the radio frequency signal vias, that is, the power network is used to shield the radio frequency signal vias.

[0027] Power vias surrounding RF signal vias are connected to a high-current power network. The stable potential of this high-current power network is applied as a shielding potential to these power vias. When an RF signal is transmitted through an RF signal via, the surrounding power vias and the connected high-current power network together form a shielding structure around the RF signal via. This shielding structure effectively suppresses electromagnetic coupling of external interference signals to the RF signal via and prevents RF signal leakage from interfering with surrounding circuits.

[0028] It should be noted that in this embodiment of the invention, when power vias "pass through" the power control layer, since they connect to a high-current power network rather than a ground network, these power vias do not require additional anti-pads in the power control layer. Instead, they directly contact the large area of ​​copper on the power network, thus avoiding the formation of dense opening areas on the power copper surface as with traditional ground shielding vias. In other words, power vias are only provided on both sides of the copper surface of the high-current power network; no actual power vias are generated on the copper surface of the high-current power network. The copper surface of the high-current power network maintains a relatively complete and continuous shape at the contact point with the power vias, and its effective current transmission cross-sectional area is not significantly reduced due to the setting of shielding vias.

[0029] Through the above structural design, the embodiments of the present invention achieve effective electromagnetic shielding of radio frequency signals while maximizing the integrity of the copper foil of the high-current power network in the power supply control layer, thereby providing a structural basis for meeting the stringent voltage consistency requirements between the chips of the antenna array.

[0030] This invention replaces the grounding shielding vias surrounding RF signal vias with power vias that are connected to a high-current power network. Since the power vias do not interrupt the copper path of the high-current power network, they avoid the situation where the power control layer copper is cut off by numerous vias. Compared to the existing method using grounding shielding vias, this invention effectively increases the effective conductive cross-sectional area of ​​the power copper and reduces the line voltage drop under high-current power supply conditions, thus resulting in a smaller voltage difference between the supply voltages of Beform chips at different locations within the antenna array. Therefore, this invention uses the high-current power network as a shielding potential to electromagnetically shield the RF signal vias, ensuring the anti-interference performance of RF signal transmission and solving the technical problem of excessive voltage differences between the supply voltages of Beform chips at different locations in a high-current multi-element phased array antenna.

[0031] In one alternative embodiment, the power vias are evenly distributed at equal intervals along a circumference centered on the center of the RF signal via.

[0032] In other words, the centers of all power vias are located on the same circumference centered on the center of the RF signal via, and the central angles between any two adjacent power vias are equal, meaning the arc length between adjacent power vias remains consistent circumferentially. This evenly spaced and uniformly distributed arrangement ensures that the shielding effect provided by each power via around the RF signal via remains balanced circumferentially, preventing uneven shielding in some directions and weaker shielding in others, thus forming a uniform and symmetrical shielding potential distribution circumferentially. Simultaneously, the uniform arrangement also makes the connection points between each power via and the high-current power network in the power control layer more evenly distributed, which is beneficial for the even distribution of power supply current among the power vias and avoids problems such as local overcurrent or excessive local voltage drop caused by uneven arrangement. Therefore, it achieves both uniform shielding and balanced power supply current transmission.

[0033] In one optional embodiment, the power via includes an inner ring power via group and an outer ring power via group; there are no other vias between the inner ring power via group and the radio frequency signal via, the outer ring power via group is spaced outside the inner ring power via group, and both the inner ring power via group and the outer ring power via group are electrically connected to a high-current power network.

[0034] Specifically, the inner ring power vias are positioned immediately adjacent to the RF signal vias, with no other vias between them. This ensures the inner shielding structure is directly close to the RF signal transmission channel, providing the tightest possible shielding protection. The outer ring power vias are spaced apart from the inner ring, surrounding it with a certain distance between them. Both rings of power vias are connected to a high-current power network, which serves as a unified shielding potential source.

[0035] The inner and outer ring power via groups together form a double-ring shielding structure. Compared to a single-ring design, the double-ring structure increases the overall number of shielding vias in the radial direction. In a single-ring design, there are circumferential gaps between adjacent power vias, which constitute weak points in the shielding wall, allowing interference signals to couple into the RF signal vias. In the double-ring structure, the inner and outer ring power via groups are staggered circumferentially (e.g., the position of an inner ring via corresponds to the gap between two adjacent outer ring vias), so that the gaps between the inner ring vias are precisely blocked or covered by the outer ring vias when viewed radially. This complementary staggered arrangement of the inner and outer rings effectively eliminates continuous gaps in the shielding wall in the radial direction, making the shielding potential distribution more dense and continuous in the circumferential direction. This effectively reduces the possibility of interference signals passing through the via gaps, improving the anti-interference capability of the RF signal vias. Simultaneously, the double-ring structure also increases the number of connection points between power vias and high-current power networks in the power supply control layer, which helps reduce overall contact resistance.

[0036] In one alternative embodiment, the power via is electrically connected to the copper layer that forms a high-current power network in the power control layer through its via wall, and the copper layer is a continuous and complete plane at the connection position with the power via.

[0037] In this embodiment of the invention, since the power vias used for shielding are connected to a high-current power network, and the power vias and the power copper layer are at the same potential, there is no need to set up anti-pads for isolation, and the copper layer can remain intact and continuous. That is, in the power control layer, the setting of the power vias does not form an isolation gap or anti-pad opening on the copper layer. The conductive cross-section of the copper layer is not cut off or hollowed out at this position, but maintains the original intact and continuous state of the copper layer.

[0038] In one optional implementation, the active phased array antenna array is an antenna array in a multi-element high-current array antenna. The multi-element high-current array antenna adopts a left-right symmetrical partitioned independent power supply structure, and the power vias of the left and right partitions are respectively connected to the high-current power supply network corresponding to their respective partitions.

[0039] In this embodiment of the invention, the aforementioned active phased array antenna array is specifically applied to a multi-element high-current array antenna. A multi-element high-current array antenna refers to an antenna array containing a large number of antenna elements, such as 1024 elements or more, where active devices such as the Beform chip consume a significant amount of power supply current during operation, typically exceeding 60A, and sometimes reaching 120A or higher. To address the power supply requirements of this type of multi-element high-current array antenna, this embodiment of the invention employs a symmetrical, independently partitioned power supply structure. Specifically, the entire antenna array is physically divided into a left-side region and a right-side region, arranged symmetrically. Each region has its own independent high-current power supply network. The high-current power supply network of the left-side region is dedicated to powering the Beform chip and other loads in the left-side region, and the high-current power supply network of the right-side region is dedicated to powering the Beform chip and other loads in the right-side region.

[0040] Regarding the shielding structure, each of the left and right sections is independently configured with a corresponding high-current power supply network and a matching power via shielding structure. Specifically, the power vias surrounding the RF signal vias in the left section are connected to the high-current power supply network in the left section, and the power vias surrounding the RF signal vias in the right section are connected to the high-current power supply network in the right section. Through independent power supply to the left and right symmetrical sections, each section only needs to handle half of the total current. For example, if the total current is 120A, each section handles 60A, thus reducing the current carrying capacity of a single power network and helping to minimize voltage drop on the power network within each section. Simultaneously, the shielding structures of the left and right sections are each connected to the high-current power supply network of their respective sections, ensuring consistency between the shielding structure and the power supply structure at the section level. This avoids issues such as circuitous power supply paths or unstable shielding potentials caused by cross-section connections. This design, combining independent power supply and independent shielding for each section, is particularly suitable for large-scale antenna arrays, effectively balancing the voltage distribution across the entire array and improving array amplitude and phase consistency.

[0041] In one optional embodiment, the high-current power network includes: a first power plane and a second power plane; the first power plane and the second power plane are respectively located in different stacks of the power supply control layer; a plurality of cross-plane interconnecting vias are provided between the first power plane and the second power plane, and each power via is connected to the first power plane and the second power plane.

[0042] In other words, the power supply control layer contains two copper foil layers specifically designed to carry high current power supply. Multiple cross-plane connection vias are provided between the first power plane and the second power plane. These cross-plane connection vias electrically connect the two power planes, so that the two power planes are at the same potential, thus forming a parallel relationship in physical structure.

[0043] Regarding the connection method between power vias and power planes, each power via ring located around the periphery of the RF signal via is simultaneously connected to both the first and second power planes. Since the power vias are connected to both power planes simultaneously, these power vias are connected at the same potential on both the first and second power planes. Therefore, it is not necessary to create isolation anti-pads on either power plane, and the copper traces of both power planes maintain a continuous and intact shape as the power vias pass through.

[0044] The two power planes are located on different layers and connected in parallel vias across the planes, which allows for a more uniform distribution of the power supply current in the vertical direction, thus improving the current density distribution and heat dissipation conditions within the power supply control layer. Furthermore, compared to the prior art using grounding vias for shielding, this embodiment of the invention can retain more copper area on the two power planes, thereby reducing the voltage drop across the power supply.

[0045] In one alternative implementation, the power via density in the edge region of the active phased array antenna array is greater than the power via density in the center region of the active phased array antenna array.

[0046] Given that RF signal vias in the edge region of the antenna array are spatially closer to the outer boundary of the array, external interference signals are more likely to couple into the RF signal transmission path from the side or from the array edge, thus requiring stronger shielding protection. Increasing the density of power vias in the edge region can reduce the gap between adjacent power vias, decrease "gaps" in the shielding wall, and make the shielding potential distribution more continuous and dense, thereby improving the anti-interference capability of the edge region. In contrast, the RF signal vias in the center region of the antenna array are surrounded by other signal vias and circuit structures, and are relatively less susceptible to external interference. Therefore, the density of power vias can be appropriately reduced to save layout space occupied by the vias.

[0047] In other words, the power vias located at the edge of the antenna array have a higher density of power vias around their periphery, meaning there are more power vias per unit circumference; while the power vias located at the center of the antenna array have a relatively lower density of power vias around their periphery, meaning there are fewer power vias per unit circumference.

[0048] This differentiated layout strategy of edge encryption and center sparseness can optimize the via layout density and power copper utilization on the antenna array while ensuring the overall shielding effect, thus achieving a balance between shielding effectiveness and space resource utilization.

[0049] In one alternative embodiment, the power via is a variable diameter via structure segmented along the axial direction, with the aperture of the power via in the power supply control layer being larger than the aperture in the radio frequency circuit layer and the antenna layer.

[0050] In this embodiment of the invention, the power via can adopt a variable diameter structure design in the axial direction. Specifically, the power via is divided into multiple segments along its axial direction (i.e., the direction perpendicular to each layer's stack-up surface, i.e., the thickness direction of the antenna array), with each segment corresponding to a different stack-up region. The aperture of the power via in the segment containing the power supply control layer is set to be larger than the aperture in the segments containing the RF circuit layer and the antenna layer. That is, the same power via has a larger diameter when contacting the power supply control layer, and a smaller diameter when passing through the RF circuit layer and the antenna layer. The aperture of the via expands when entering the power supply control layer from the RF circuit layer, and shrinks to a smaller aperture when leaving the power supply control layer and entering the antenna layer.

[0051] The beneficial effects of this variable-diameter structure are reflected in two aspects. Firstly, in the power supply control layer, since power vias need to be electrically connected to the copper layer of the high-current power network to transmit large currents, a larger aperture means a larger contact area between the via wall and the copper layer. According to the inverse relationship between contact resistance and contact area, a larger contact area helps reduce the contact resistance between the power via and the power network, thereby reducing the local voltage drop at the connection point and improving the voltage accuracy of high-current power supply. Secondly, in the RF circuit layer and antenna layer, maintaining a smaller aperture for the power vias avoids excessively encroaching on the space for RF chips and traces in the RF circuit layer, and also avoids excessively encroaching on the space for antenna elements and antenna arrays in the antenna layer, thus avoiding negative impacts on RF and antenna performance.

[0052] The following uses a typical 1024 array antenna as an example to compare the actual effects of using traditional grounding vias and power supply vias in this embodiment of the invention. When the Beform chip requires 120A of power at 1.0V, the array is divided into left and right sides for power supply, with an average of 60A supplied to each side.

[0053] First, the shielded vias around the RF link are connected to the ground network copper foil. In the design, the power network has two layers. Because the copper foil is interrupted by the ground vias, the cross-sectional area of ​​the power layer copper foil is relatively small. The integrity of the high-current power copper foil has a significant impact on the voltage drop. Specifically, the voltage drop is V_drop = I*R, where V_drop is the voltage drop, I is the current flowing through the copper foil, and R is the DC resistance of the copper foil. R = ρ*L / S, where ρ is the resistivity of copper, approximately 0.0175 Ωmm² / m at room temperature; L is the copper trace length; and S is the cross-sectional area of ​​the copper foil. S = copper foil width (mm) * copper foil thickness (mm). Therefore, the final formula is V_drop = I*ρ*L / S. When I, ρ, and L are constant, the smaller S is, the larger V_drop is.

[0054] When using the grounding network for the shielded holes, measurements show that the length L is 0.157m, the effective width of the copper foil is approximately 55mm, and the effective thickness of the copper foil is approximately 0.07mm. Therefore, the calculated voltage drop V_drop = 60(A) * 0.0175(Ωmm² / m) * 0.157(m) / (55(mm) * 0.07(mm)) = 0.04282V = 42.82mV. According to Sigrity simulation, the voltage difference between the same supply voltage of the Beform chips at different locations in the antenna array is 960 - 915 = 45mV. Figure 4 A schematic diagram of the power supply voltage distribution when the power copper foil supplying power to the Beform chip in an active phased array antenna array is partially broken and the load is 60A.

[0055] Now, the radio frequency link is shielded by punching holes around it with a power network. The stack-up remains the same, with two power networks. As described above, when the shielding hole uses a high-current power network, the copper width of its power layer is much larger than that of the power layer when the shielding hole uses a ground network. Consequently, the cross-sectional area of ​​the copper layer of the power layer is much larger than that of the power layer when the shielding hole uses a ground network.

[0056] When using a power network for the shielding aperture, measurements show that the length L is 0.157m, the effective width of the copper foil is approximately 80mm, and the effective thickness of the copper foil is approximately 0.07mm. Therefore, the calculated voltage drop V_drop = 60(A) * 0.0175(Ωmm² / m) * 0.157(m) / (80(mm) * 0.07(mm)) = 0.02944V = 29.44mV. Sigrity simulations show that the voltage difference between the same supply voltage of the Beform chips at different locations in the antenna array is less than or equal to 30mV (the smaller the better). Figure 5 This diagram illustrates the power supply voltage distribution in an active phased array antenna array when the copper foil supplying power to the Beform chip is uninterrupted and the load is 60A. The actual voltage difference is 953-923=30mV.

[0057] In summary, by connecting the shielded holes around the RF link to a complete high-current power copper foil, it is possible to power the Beform chips in multi-element high-current antenna arrays. This ensures that the voltage difference between the Beform chips at different positions in the antenna array is less than or equal to 30mV (the smaller the better), without increasing the antenna thickness and weight or losing antenna elements. This achieves efficient, fast, and reliable power supply.

[0058] Example 2 This invention also provides a communication device, which includes the active phased array antenna array provided in Embodiment 1 above.

[0059] This invention also provides a phased array radar system, which includes the active phased array antenna array provided in Embodiment 1 above.

[0060] Example 3 In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0061] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0062] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An active phased array antenna array, comprising: The radio frequency circuit layer, power supply control layer, and antenna layer are stacked sequentially from top to bottom; the radio frequency circuit layer is used to lay out radio frequency chips and radio frequency traces. The power supply control layer is used to control the radio frequency chip and supply power to the radio frequency chip; the antenna layer is used to arrange a passive antenna; a through radio frequency signal via is provided between the radio frequency circuit layer and the antenna layer for transmitting radio frequency signals between the radio frequency circuit layer and the antenna layer; The feature is that a plurality of power vias are arranged around the periphery of the radio frequency signal via, and each power via is electrically connected to a high-current power network in the power supply control layer, so that the high-current power network acts as a shielding potential to electromagnetically shield the radio frequency signal via.

2. The active phased array antenna array according to claim 1, characterized in that, The power vias are evenly distributed at equal intervals along the circumference of a circle centered on the center of the radio frequency signal via.

3. The active phased array antenna array according to claim 1, characterized in that, The power vias include: an inner ring power via group and an outer ring power via group; There are no other vias between the inner ring power via group and the radio frequency signal via. The outer ring power via group is arranged at intervals outside the inner ring power via group, and both the inner ring power via group and the outer ring power via group are electrically connected to the high current power network.

4. The active phased array antenna array according to claim 1, characterized in that, The power via is electrically connected to the copper layer that constitutes the high-current power network in the power supply control layer through direct contact with its via wall. The copper layer is a continuous and complete plane at the connection position with the power via.

5. The active phased array antenna array according to claim 1, characterized in that, The active phased array antenna array is an antenna array in a multi-element high-current array antenna. The multi-element high-current array antenna adopts a left-right symmetrical partitioned independent power supply structure. The power vias of the left and right partitions are respectively connected to the high-current power supply network corresponding to their respective partitions.

6. The active phased array antenna array according to claim 1, characterized in that, The high-current power supply network includes: a first power plane and a second power plane; The first power plane and the second power plane are located in different layers of the power supply control layer; a plurality of cross-plane connecting vias are provided between the first power plane and the second power plane, and each power via is connected to the first power plane and the second power plane.

7. The active phased array antenna array according to claim 1, characterized in that, The density of power vias in the edge region of an active phased array antenna array is greater than that in the center region.

8. The active phased array antenna array according to claim 1, characterized in that, The power via is a variable diameter via structure segmented along the axial direction, and the diameter of the power via in the power supply control layer is larger than the diameter in the radio frequency circuit layer and the antenna layer.

9. A communication device, characterized in that, The active phased array antenna array includes any one of claims 1-8.

10. A phased array radar system, characterized in that, The active phased array antenna array includes any one of claims 1-8.

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