Window assembly comprising a solderless electrical connector

Abstract

The present disclosure relates to a window assembly including a solderless electrical connector. The window assembly includes a transparent substrate, a conductive feature formed on a surface of the transparent substrate, and a solderless electrical connector for electrically coupling a wiring harness of a vehicle with the conductive feature. The solderless electrical connector includes an insulating cover and a conductive biasing member. The conductive biasing member includes a first end portion elastically compressed between the insulating cover and the conductive feature such that the conductive biasing member is positioned in electrical contact with the conductive feature, a second end portion configured to be coupled to the wiring harness, and a central region therebetween. The central region defines a cutout region engaged with the insulating cover to retain the conductive biasing member relative to the insulating cover. The solderless electrical connector further includes an adhesive disposed between the insulating cover and the transparent substrate to adhere the insulating cover to the transparent substrate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. non-provisional patent application No. 19 / 174,512, filed April 9, 2025, which is a continuation-in-part of U.S. non-provisional patent application No. 17 / 860,296, filed July 8, 2022, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates generally to window assemblies, and more specifically to window assemblies having electrically insulated solderless electrical connectors. Background Technology

[0004] Window assemblies for vehicles are typically functionalized to include one or more conductive features deployed on a transparent substrate. These conductive features are typically printed circuits formed by depositing conductive ink (typically silver) onto the transparent substrate (usually composed of glass). These conductive features may include, for example, antennas and heating elements. To power these conductive features, wiring harnesses are typically connected to them via electrical connectors. In typical applications, the electrical connectors are mechanically and electrically bonded to the conductive features and the underlying transparent substrate by forming a solder joint between the connector and the conductive features. The industry desires to eliminate the use of lead-based solder in such solder joints. Lead-free solder compositions offer alternatives to lead-based solders but suffer from performance and / or cost disadvantages.

[0005] Conventionally, these conductive features are formed by depositing a conductive paste / ink comprising silver and ceramicfrit on a transparent substrate and then firing the paste / ink to fuse the ceramicfrit component with the transparent substrate. In recent years, efforts have been made to form conductive features using conductive inks containing organic compounds instead of ceramicfrit to eliminate the deformation caused by the firing process described above. However, the problem is that these conductive inks are typically not heat-resistant enough for the temperatures required for conventional soldering applications, which can exhibit peak temperatures between 150°C and 330°C at the solder / ink interface. Therefore, the bonding interface between the conductive ink and the transparent substrate is often affected by conventional soldering applications.

[0006] Furthermore, conductive inks containing organic compounds instead of ceramic frits typically exhibit much lower adhesion to these transparent substrates, thus failing to support traditional soldering applications. Although it is believed that the adhesion properties of conductive inks can be improved via a primer, the organic nature of conductive inks and the lack of frits suggest that it will be difficult to sufficiently improve adhesion to provide adequate bonding performance capable of withstanding soldering.

[0007] Furthermore, conventional solderless connector assemblies have problems in providing sufficient current to these conductive features while maintaining a sufficiently low operating temperature so that the conductive components of the solderless connector do not melt and / or separate from the electrical insulation cover of the solderless connector.

[0008] Therefore, an improved solderless electrical connector is needed. Summary of the Invention

[0009] This disclosure generally relates to a window assembly for a vehicle. The window assembly includes a transparent substrate and conductive features formed on a surface of the transparent substrate. The window assembly also includes a solderless electrical connector for electrically coupling a vehicle wiring harness to the conductive features. The solderless electrical connector includes an insulating cover having an inner surface facing the transparent substrate and an opposing outer surface. The solderless electrical connector also includes a conductive biasing member. The conductive biasing member includes a first end portion extending from the inner surface of the insulating cover and resiliently compressed between the insulating cover and the conductive features, such that the conductive biasing member is positioned in electrical contact with the conductive features. The conductive biasing member also includes a second end portion extending from the outer surface of the insulating cover and configured to couple to the vehicle wiring harness. The conductive biasing member also includes a central region coupled and extending between the first end portion and the second end portion, such that the central region extends through and couples to the insulating cover. The central region defines a cutout region that engages with the insulating cover to retain the conductive biasing member relative to the insulating cover. The solderless connector also includes an adhesive that is applied between the inner surface of the insulating cover and the transparent substrate to adhere the inner surface of the insulating cover to the transparent substrate, and the first end of the conductive biasing member is elastically compressed between the inner surface of the insulating cover and the transparent substrate to maintain electrical communication between the conductive biasing member and the conductive feature.

[0010] The window assembly according to this disclosure advantageously provides a solderless electrical connection to conductive features deployed on a transparent substrate, which does not damage sensitive conductive ink (if used) and improves current carrying capacity and tensile strength / retention force of the bias member relative to the insulating cover. Attached Figure Description

[0011] The advantages of this disclosure will become readily apparent when considered in conjunction with the following detailed description and the accompanying drawings.

[0012] Figure 1 This is a rear perspective view of a vehicle including a rear window assembly, formed according to this disclosure.

[0013] Figure 2 It is a cut along line 2-2 according to an exemplary embodiment. Figure 1A cross-sectional schematic diagram of the window assembly, including a single glass plate and conductive ink applied thereon.

[0014] Figure 3 It is a cut along line 3-3 according to another exemplary embodiment. Figure 1 A cross-sectional schematic diagram of the window assembly, including a single glass plate and conductive ink applied thereon.

[0015] Figure 4 It is a cut along line 4-4 according to another exemplary embodiment. Figure 1 A cross-sectional schematic diagram of a window assembly, including a stacked window assembly with conductive ink applied thereon.

[0016] Figure 5 It is a cut along line 5-5 according to another exemplary embodiment. Figure 1 A cross-sectional schematic diagram of a window assembly, including a stacked window assembly with conductive ink applied thereon.

[0017] Figure 6 It is a cut along line 6-6 according to another exemplary embodiment. Figure 1 A cross-sectional schematic diagram of a window assembly, including a stacked window assembly with conductive ink applied thereon.

[0018] Figure 7 It is a cut along line 7-7 according to another exemplary embodiment. Figure 1 A cross-sectional schematic diagram of a window assembly, including a stacked window assembly with conductive ink applied thereon.

[0019] Figure 8 This is according to an exemplary embodiment. Figure 3 A perspective view of a portion of a window assembly, which has conductive ink applied thereon and also includes a solderless electrical connector electrically connected to the conductive ink.

[0020] Figure 9 According to another exemplary embodiment Figure 4 An exploded view of a portion of a stacked window assembly, wherein the outer transparent substrate and the intermediate layer are scalloped to expose the inner transparent substrate with an inward-facing surface having conductive ink applied thereon.

[0021] Figure 10 yes Figure 9 The assembly view.

[0022] Figure 11 According to another exemplary embodiment Figure 10 A perspective view of the stacked window assembly, and also includes a solderless electrical connector electrically connected to conductive ink opposite to the inner transparent substrate.

[0023] Figure 12 This is a bottom perspective view of a solderless electrical connector according to another exemplary embodiment.

[0024] Figure 13 yes Figure 12 Top perspective view.

[0025] Figure 14 It is based on a construction of a solderless electrical connector. Figure 12 Front view.

[0026] Figure 15 It is based on another construction of solderless electrical connectors. Figure 12 Partial front view.

[0027] Figure 16 It is a section taken along line 14-14 according to an exemplary embodiment of a solderless electrical connector. Figure 14 A schematic diagram of its cross-section.

[0028] Figure 17 yes Figure 3 A perspective view of a portion of a window assembly, having conductive ink applied thereto and including corresponding electrical connection parts and the conductive ink electrically connected. Figures 12-14 Solderless electrical connectors.

[0029] Figure 18 yes Figure 9 A perspective view of a portion of a transparent laminated window assembly, including electrical connections to corresponding electrical connection components and conductive ink applied to the inner surface of the inner transparent substrate. Figures 12-14 Solderless electrical connectors.

[0030] Figure 19 yes Figure 5 A cross-sectional schematic diagram of a portion of the stacked window assembly, and also includes a solderless electrical connector electrically connected to a corresponding electrical connection component and conductive ink applied to the inner surface of the inner transparent substrate.

[0031] Figure 20 This is a flowchart illustrating a method for manufacturing a glass assembly with solderless electrical connectors according to an exemplary embodiment.

[0032] Figure 21 This is a flowchart illustrating a method for manufacturing a glass assembly with solderless electrical connectors according to another related exemplary embodiment.

[0033] Figure 22 This is a flowchart illustrating a method for manufacturing a glass assembly with solderless electrical connectors according to yet another related exemplary embodiment.

[0034] Figure 23This is a flowchart illustrating a method for manufacturing a glass assembly with solderless electrical connectors according to another related exemplary embodiment.

[0035] Figure 24A This is a front view of an example of a conductive biasing member according to this disclosure.

[0036] Figure 24B yes Figure 24A Top perspective view of the conductive biasing component.

[0037] Figure 25 It includes Figures 24A-24B A schematic cross-sectional representation of a solderless electrical connector with conductive biasing components.

[0038] Figure 26A It includes Figures 24A-24B A top perspective view of another construction of a solderless electrical connector with conductive biasing components.

[0039] Figure 26B yes Figure 26A Bottom perspective view of a solderless electrical connector.

[0040] Figure 27 This is a schematic cross-sectional representation of a solderless electrical connector including an adhesive with green strength that maintains the insulating cover against the surface of the transparent substrate without external fixation. Detailed Implementation

[0041] Referring to the accompanying drawings, the same reference numerals are used to identify the same or equivalent parts in the various views. Figure 1 A window assembly 10 with conductive features 16 formed on a transparent substrate 18 is schematically illustrated. Although not strictly necessary, the window assembly 10 can be used in an automotive environment, such as in a vehicle 20, where the conductive features 16 can function to provide an electrical path along a portion of the transparent substrate 18. Of course, it should be understood that the window assembly 10 can also be used outside of an automotive environment.

[0042] As defined herein, the term "transparent" (also known as "substantially transparent") in relation to use with respect to a substrate refers to a material that allows 70% or more of light in a predetermined visible light range to be transmitted through it. Unless otherwise indicated, the predetermined visible light range is a segment of the electromagnetic spectrum visible to the human eye. More simply, this range of wavelengths is called visible light. Typically, the human eye can detect wavelengths from 380 nanometers to 780 nanometers, and therefore, as defined herein, the predetermined visible light range refers to the wavelength of light from 380 nanometers to 780 nanometers, unless otherwise indicated.

[0043] As will be described in the various exemplary embodiments below, the conductive feature 16 is made of conductive ink 52 applied to one or more surfaces of the transparent substrate 18 (e.g., see...). Figures 2-3 ) or 104 (for example, see Figures 4-7 The conductive feature 16 may define one or more buses, antennas, or heating elements. Additionally, the conductive feature 16 may be used with one or more electrical components 22 integrated within or directly coupled to the conductive feature 16. For example, one or more electrical components 22 may include circuit resistance heaters that operate to locally heat a portion of the transparent substrate 18 and / or defrost a portion of the transparent substrate 18. Alternatively or additionally, one or more electrical components 22 may include one or more antennas, LED lights, camera modules, or other such electrical devices. It should be understood that the electrical connection component 14, as shown as a harness 14 in various embodiments herein, can transmit power from a separate power supply to the conductive feature 16 and the associated one or more electrical components 22. As provided herein, the terms electrical connection component 14 and harness 14 may be used interchangeably.

[0044] In some embodiments, the conductive feature 16 may further include one or more electrical conductors 24 or lines bonded to or integrally formed as an outer layer of the substrate 18. The one or more electrical conductors 24 may include, for example, a conductive layer of silver. In other embodiments, the electrical conductors 24 may be made of other conductive metals besides silver or in place of silver. The electrical conductors 24 may be films, coatings, and / or may take any other form, as long as the electrical conductors 24 are conductive and provide any function known in the art. The electrical conductors 24 may be porous and / or non-porous. In various embodiments, the electrical conductors 24 are porous silver films. In some embodiments, the electrical conductors 24 are electrical extensions of the electrical components 22 and / or the conductive feature 16. In other embodiments, the electrical conductors 24 are applied separately to the substrate 18 and are electrically connected to the electrical components 22 and / or the conductive feature 16.

[0045] In an alternative embodiment, window assembly 10 also has a solderless electrical connector 12 (see...). Figure 8 and Figure 11 ) or 300 (see Figure 15 and 16 The solderless electrical connector mechanically and electrically couples or connects the electrical connection component 14 (such as the wire harness 14 shown herein) to the conductive feature 16 in an electrical contact.

[0046] In some embodiments, such as Figure 2 and Figure 3As shown, the transparent substrate 18 may include a pane of glass 50, shown here as a single pane of glass 50, which includes an outward-facing surface 50A (also referred to as the "P1 surface") and an opposing inward-facing surface 50B (also referred to as the "P2 surface"). In other words, the glass substrate 50 includes first and second opposing surfaces 50A and 50B. When installed in the opening 25 of the vehicle 20, the inward-facing surface 50B is positioned adjacent to the interior region 27 of the vehicle 20, sometimes referred to as the passenger compartment 27 of the vehicle 20, while the outward-facing surface 50A is positioned toward the exterior 29 of the vehicle 20.

[0047] In one example of forming the curved transparent substrate 18, the curved transparent substrate 18 is initially formed as a flat glass sheet. Any suitable flat glass manufacturing process can be used to produce the flat glass sheet, including but not limited to the float process. The flat glass sheet can consist of any suitable glass composition, including but not limited to soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, etc. After forming the flat glass sheet, the flat glass sheet is bent to form the curved transparent substrate 18. Any suitable glass bending process can be used to bend the flat glass sheet, including but not limited to pressure bending, gravity bending (i.e., sag bending), roll forming, or cold bending. The flat glass sheet can be bent into any geometry suitable for the desired application.

[0048] In other examples, the curved transparent substrate 18 is formed as a curved substrate from the outset, rather than being produced and subsequently bent from a flat glass sheet. The curved transparent substrate can be produced using any suitable glass bending manufacturing process, including but not limited to glass blowing. Similar to the flat glass sheet described above, in this example, where the curved transparent substrate 18 is formed from the outset, the curved transparent substrate 18 can be composed of any suitable glass composition, including but not limited to soda-lime glass, aluminosilicate glass, borosilicate glass, borosilicate glass, etc.

[0049] In some examples, the transparent substrate 18 may be formed as a curved transparent substrate 18 before the conductive ink 52 is applied to the surface of the transparent substrate 18. In other examples, the conductive ink 52 is applied to the surface of the transparent substrate 18 before bending the transparent substrate 18 according to the process described above. In these examples, particularly when the conductive ink 52 comprises a ceramic frit, the bending operation also heats the conductive ink 52, causing the ceramic frit component to fuse with the transparent substrate 18 to form the conductive feature 16.

[0050] In some embodiments, the transparent substrate 18 may include various additives to change the transmittance of the transparent substrate 18, for example, to provide various levels of coloring or tinting, while still maintaining the transparent substrate 18 as “transparent” or “substantially transparent” as described above.

[0051] In other embodiments, the transparent substrate 18 may instead be a polymer substrate made entirely of a single plate of transparent polymer material such as polymethyl methacrylate, polycarbonate, polyvinyl butyral, etc.

[0052] In yet other embodiments, such as Figures 4-7 As shown, in contrast to a polymer substrate in the form of a single glass plate 50 or a single plate, the transparent substrate 18 is in the form of a stacked window assembly 90, which includes an inner transparent substrate 106, an outer transparent substrate 100, and an intermediate layer 102 disposed between the inner transparent substrate 106 and the outer transparent substrate 100. In some embodiments, the intermediate layer 102 binds the inner transparent substrate 106 and the outer transparent substrate 100 together and allows the stacked window assembly 90 to retain fragments of the inner transparent substrate 106 and the outer transparent substrate 100 in the event of impact or damage. When installed in an opening 25 of a vehicle 20, the inner transparent substrate 106 is positioned adjacent to the interior region 27 (sometimes referred to as the passenger compartment 27 of the vehicle 20), while the outer transparent substrate 100 is positioned toward the exterior 29 of the vehicle 20.

[0053] In these embodiments, the inner transparent substrate 106 includes opposing surfaces 106A and 106B (i.e., first and second opposing surfaces 106A and 106B), and the outer transparent substrate 100 includes opposing surfaces 100A and 100B (i.e., first and second opposing surfaces 100A and 100B). Similarly, the intermediate layer 102 includes opposing surfaces 102A and 102B (i.e., first and second opposing surfaces 102A and 102B). As described herein, the outward-facing surface 100A is sometimes referred to as P1, and the inward-facing surface 100B is sometimes referred to as P2. Similarly, the inward-facing surface 106A is sometimes referred to as P3, and the outward-facing surface 106B is sometimes referred to as P4.

[0054] In some embodiments, the corresponding inner transparent substrate 106 and outer transparent substrate 100 are formed of the same material as described above with respect to transparent substrate 18 (e.g., a single glass plate or a single polymer substrate). The inner transparent substrate 106 and outer transparent substrate 100 may be composed of the same or different materials. For example, in some embodiments, the inner transparent substrate 106 and outer transparent substrate 100 are substantially transparent glass plates. However, in other embodiments, the inner transparent substrate 106 and / or outer transparent substrate 100 may be plastic, glass fiber, or any other suitable substantially transparent polymer material, such as those described above. In other embodiments, the inner transparent substrate 106 and outer transparent substrate 100 are glass plates with lower transparency. For example, when the laminated window assembly 90 is privacy glass, the transparency of the laminated window assembly 90 is significantly reduced, and thus allows less than 70% light transmission in a predetermined wavelength range, such as greater than 0 to 70% light transmission in a predetermined wavelength range.

[0055] Typically, the intermediate layer 102 is substantially transparent to light and comprises a polymer or thermoplastic resin, such as polyvinyl butyral (PVB). However, other suitable materials for realizing the intermediate layer 102 may also be used. Similar to the inner transparent substrate 106 and the outer transparent substrate 100, the intermediate layer 102 is also substantially transparent to light or otherwise transparent to light. Therefore, the laminated window assembly 90 including the intermediate layer 102 between the inner transparent substrate 106 and the outer transparent substrate 100 may also be substantially transparent to light or otherwise transparent to light.

[0056] In each of the illustrated embodiments, whether in the form of a single transparent substrate 18 or a stacked window assembly 90, the window assembly 10 is curved such that each component of the window assembly 10 includes an inwardly curved surface (such as for...). Figures 2-3 A single glass plate of 50 is 50B or for Figures 4-7 The stacked window assembly 90 is 106A) and the external curved surface (such as for Figures 2-3 A single glass plate of 50 is 50A or for Figures 4-7 The laminated window assembly 90 is 100A). Therefore, in each of the illustrated embodiments, the corresponding components of the curved transparent substrate 18 define an outward-facing surface and an opposing inward-facing surface, both of which are curved.

[0057] In addition, Figure 1 In the vehicle 20 shown, the inner curved surface of the transparent substrate 18 is positioned toward the inner region 27 of the vehicle 20 to further define the boundary of the inner region 27, and the outer curved surface is positioned toward the outer side 29 of the vehicle 20.

[0058] In some embodiments, such as in Figures 2-3In the illustrated embodiments and as described below, the conductive feature 16 includes conductive ink 52 applied to one or both of the outward-facing and inward-facing surfaces (such as 50A, 50B of a single glass plate 50) of a curved transparent substrate 18. In one example, the conductive ink 52 comprises conductive particles (e.g., silver) and a ceramic frit, such that when subjected to firing, the conductive ink 52 fuses with the transparent substrate to form the conductive feature 16. In another example, the conductive ink 52 does not contain a ceramic frit. For example, the conductive ink 52 may comprise a thermosetting organic monomer and conductive particles (e.g., silver nanoparticles, etc.) dispersed within the organic monomer. It should be understood that in other examples, the organic monomer may alternatively be an oligomer or a combination of a monomer and an oligomer. In yet another example, the conductive ink 52 comprises a metal-organic complex, including a silver-organic compound or any other suitable metal-organic complex comprising an organic component and a conductive metal component, such as a copper-organic compound, etc.

[0059] In some embodiments, the applied conductive ink 52 is photocured and / or thermally cured to form cured conductive ink 52, or sintered to form sintered conductive ink on one or both of the outer surface and inner surface of the curved transparent substrate 18 (e.g., 50A, 50B of a single glass plate 50). In other embodiments, particularly where the conductive ink 52 comprises a ceramic frit, the applied conductive ink 52 is fired such that the ceramic frit component fuses with the transparent substrate 18 to form conductive features 16.

[0060] More specifically, one example of curable conductive ink 52 includes thermosetting conductive ink 52. Any suitable thermosetting equipment considered for use with thermosetting conductive ink 52 includes, but is not limited to, an oven, a heat gun, or an IR heater. In the context of this disclosure, thermosetting involves subjecting a curved transparent substrate 18 to temperatures sufficient to cure the conductive ink 52 on the surface of the curved transparent substrate 18. In some examples, as described above, the conductive ink may be fused to the transparent substrate 18.

[0061] In some examples, particularly where the conductive ink 52 does not contain a ceramic frit, the curing temperature for curing the conductive ink 52 is selected considering its thermal degradation temperature. More specifically, a curing temperature lower than the thermal degradation temperature of the conductive ink 52 applied to the transparent substrate 18 is selected to prevent the conductive ink 52 from burning off from the curved transparent substrate 18 and to minimize optical distortion of the curved transparent substrate 18. For example, the conductive ink 52 may have a thermal degradation temperature of 210 degrees Celsius once applied to the transparent substrate 18. Therefore, a curing temperature lower than 210 degrees Celsius, such as 200 degrees Celsius, can be selected.

[0062] In another example, the conductive ink 52 comprises a thermosetting metal-organic complex. The metal-organic complex may include a silver-organic compound or any other suitable metal-organic complex comprising an organic component and a conductive metal component, such as a copper-organic compound. In this example, after the conductive ink 52 containing the metal-organic complex is applied to the surface of the curved transparent substrate 18, the conductive ink 52 may be exposed to a temperature sufficient to volatilize the organic component of the metal-organic complex, such that only metal particles (e.g., silver particles) remain on the surface of the curved transparent substrate 18.

[0063] Another example of curing conductive ink 52 includes photocuring conductive ink 52 using a UV curing device. In this example, conductive ink 52 is photocurable conductive ink 52. Photocurable conductive ink 52 may contain a photoinitiator, an organic monomer, and conductive particles (e.g., silver nanoparticles, etc.) dispersed in the organic monomer. It should be understood that in other examples, the organic monomer may instead be an oligomer or a combination of monomer and oligomer. The photoinitiator may contain any suitable compound that initiates the polymerization of the organic monomer in response to exposure to UV light. For example, the photoinitiator may be a compound that generates a reactive substance (e.g., a free radical, cation, or anion) that initiates the polymerization of the organic monomer and / or oligomer upon exposure to UV light. Therefore, in this example, curing conductive ink 52 includes exposing conductive ink 52 to a UV curing device to activate the photoinitiator to initiate the polymerization of the organic monomer and thus curing the conductive ink.

[0064] In one example, a UV curing device is a UV light-emitting diode (LED). For instance, a UV curing device can emit UV light with wavelengths ranging from 315 nanometers to 400 nanometers (commonly referred to as the UV-A spectrum). A UV LED can also emit UV light with a narrower spectrum, such as UV light with a wavelength of approximately 385 nanometers. Any wavelength within the UV spectrum is considered.

[0065] In some embodiments, the conductive ink 52 may begin curing shortly after application to prevent it from flowing or smudged. For example, curing may begin within a timeframe of 0 to 5 seconds after application. Alternatively, curing may begin less than 5 seconds, less than 4 seconds, less than 3 seconds, less than 2 seconds, or less than 1 second after application.

[0066] In some embodiments, the conductive ink 52 is sintered after application. The sintering process is a process that uses heat or pressure to compact the applied conductive ink 52 and form a solid mass without melting to the point of liquefaction; however, the particles of the conductive ink 52 may aggregate to form the aforementioned solid mass. Therefore, during the sintering process, the applied conductive ink 52 can be heated to a temperature sufficient to sinter the applied conductive ink 52 without melting it (hereinafter referred to as being heated to the sintering temperature). Alternatively, during the sintering process, the applied conductive ink 52 can be subjected to a pressure sufficient to sinter the applied conductive ink 52 without melting it (hereinafter referred to as being pressurized to the sintering pressure). In yet another alternative embodiment, the sintering process can be a combination of heating and pressurizing the applied conductive ink 52 to form sintered conductive ink on the surface of a curved substrate.

[0067] In some other embodiments, the conductive ink 52 may be a conductive silver ink 52 containing silver nanoparticles. In some embodiments, the silver nanoparticles of the conductive silver ink 52 may have an average particle size of 1 nanometer to 100 nanometers. One non-limiting conductive silver ink 52, 104 that can be used is a silver nanoparticle ink available from Fujifilm, which has a sintering temperature of 80°C for 5 minutes. In these embodiments, as described above, the conductive inks 52, 104 are photocured, thermally cured, sintered, or dried after application. For example, the conductive silver ink 52 may be applied and sintered into lines 10 micrometers to 1 millimeter wide on the surface of the curved transparent substrate 18.

[0068] Alternatively, in other embodiments, conductive ink 52 applied to one or more outward and inward facing surfaces (such as 50A, 50B of a single glass plate 50) of the curved transparent substrate 18 remains uncured and unsintered, and is simply dried and otherwise adhered to the respective outward and / or inward facing surfaces.

[0069] For ease of description below, the description of conductive ink 52 refers only to its application to the curved transparent substrate 18 or simply to the guidance of conductive ink 52 (such as regarding...). Figures 2-16 (any of the above), it should be understood that, unless otherwise specifically indicated, the applied conductive ink 52 specifically includes the applied conductive ink 52 that is subsequently cured, sintered, fired or simply dried on the curved transparent substrate 18.

[0070] Figures 2-3 An example of conductive ink applied to a curved transparent substrate 18 is illustrated. In these examples, the curved transparent substrate 18 is a single glass plate 50. Figure 2In the example shown, conductive ink 52 is applied to the inward-facing surface 50B of the curved glass plate 50. Meanwhile, in Figure 3 In the example, conductive ink 52 is applied to the outward surface 50A of the curved glass plate 50. It should be considered that conductive ink 52 may be applied to both the outward surface and the inward surface of the curved transparent substrate 18.

[0071] In some alternative embodiments, such as in Figures 4-7 In the embodiments shown and described below, the transparent substrate 18 is in the form of a laminated window assembly 90, and the conductive feature 16 includes conductive ink 104 applied to one of the outward-facing surfaces 100A and 106A or the inward-facing surfaces 100B and 106B of the respective inner transparent substrate 106 and outer transparent substrate 100 of the laminated window assembly 90. In these embodiments, after the step of applying and / or curing the conductive ink 104, the step of laminating an intermediate layer 102 to each of the inner transparent substrate 106 and the outer transparent substrate 100 is performed. The conductive ink 104 may have the same or different composition as the conductive ink 52.

[0072] First refer to Figure 4 In one embodiment, conductive ink 104 is applied to the surface 106A of the inner transparent substrate 106 and thus deployed between the inner transparent substrate 100 and the intermediate layer 102.

[0073] exist Figure 5 In another embodiment, conductive ink 104 is applied to the inward facing surface 100B of the outer transparent substrate 100 and is thus deployed between the outer transparent substrate 100 and the intermediate layer 102.

[0074] exist Figure 6 In another embodiment, conductive ink 104 is applied to the outward surface 100A of the outer transparent substrate 100, so that the outer transparent substrate 100 is disposed between the intermediate layer 102 and the conductive ink 104.

[0075] exist Figure 7 In another embodiment, conductive ink 104 is applied to the surface 106B of the inner transparent substrate 106, so that the inner transparent substrate 106 is disposed between the intermediate layer 102 and the conductive ink 104.

[0076] In some other embodiments, unlike the outer surfaces 100A and 106A or the inner surfaces 100B and 106B of the respective inner transparent substrate 106 and outer transparent substrate 100 (i.e., one of P1, P2, P3 or P4) applied to the stacked window assembly 90, the conductive ink 104 may be applied to more than one of the outer surfaces 100A and 106A or the inner surfaces 100B and 106B of the respective inner transparent substrate 106 and outer transparent substrate 100. For example, conductive ink 104 can be applied to both surfaces 100A and 100B of the outer transparent substrate 100 (i.e., applied to both P1 and P2); applied to both surfaces 106A and 106B of the inner transparent substrate 106 (i.e., applied to both P3 and P4); applied to the outward-facing surfaces 106B and 100A of the corresponding inner transparent substrate 106 and outer transparent substrate 100 of the laminated window assembly 90 (i.e., P1 and P4); or applied to the inward-facing surfaces 106A and 100B of the corresponding inner transparent substrate 106 and outer transparent substrate 100 of the laminated window assembly 90 (i.e., P2 and P3).

[0077] In some embodiments, the composition of the conductive ink 52, 104 of any applied layer may be the same as or different from the composition of the conductive ink 52, 104 of any other applied layer, and may vary depending on a variety of factors, including the application method or location.

[0078] In some embodiments, the conductive ink 52 prior to application comprises a binder, pigment, and solvent (such as water), and in some embodiments, optionally includes another solvent, such as an organic solvent. In these embodiments, one or both of the binder and pigment can provide the desired level of conductivity to the applied conductive ink 52. In embodiments where the applied conductive ink 52 is photocurable, the binder material comprises a photocurable organic monomer / oligomer, such as acrylic monomers and / or oligomers and mixtures thereof. Exemplary pigments that can be used include conductive pigments, such as carbon black (e.g., CIBlack 7 carbon black). Other pigments may be included that provide the desired color appearance to the applied conductive ink 52, such as various other non-conductive black pigments used in conjunction with the conductive pigments described above.

[0079] Conductive inks 52 and 104 can be applied to a curved transparent substrate using simulated printing processes such as screen printing and spray printing with a mask. For example, to screen print conductive inks 52 and 104, a mask (i.e., a "screen") defining gaps corresponding to the desired printing area is arranged over the transparent substrate 18. The conductive inks 52 and 104 are deposited over the mask by manual processing (such as using rollers, squeegees, brushes, spraying, etc.) to apply the conductive inks 52 and 104 to the transparent substrate 18 in a desired pattern. Any method for applying the conductive inks 52 and 104 is considered.

[0080] In some embodiments, applying conductive inks 52, 104 includes digitally applying the conductive inks 52, 104 to the substrate 18. The term "digitally applied" refers to any suitable application process in which the application of conductive ink 52 is digitally controlled to deposit conductive ink 52 onto the substrate based on a digitally based image. Exemplary processes for digitally applying conductive ink 52 include, but are not limited to, inkjet printing, electrohydrodynamic printing, laser printing, etc. It is worth noting that due to the precise control provided by digitally applying conductive ink 52, conductive ink 52 can be deposited at a significantly higher resolution compared to analog printing processes. For example, conductive ink 52 can be digitally applied to the surface of the curved transparent substrate 18 at a resolution greater than 200 dots per inch, greater than 300 dots per inch, greater than 400 dots per inch, greater than 500 dots per inch, greater than 600 dots per inch, greater than 700 dots per inch, greater than 800 dots per inch, greater than 900 dots per inch, greater than 1000 dots per inch, greater than 1100 dots per inch, greater than 1200 dots per inch, greater than 1300 dots per inch, greater than 1400 dots per inch, greater than 1500 dots per inch, greater than 1600 dots per inch, greater than 1700 dots per inch, greater than 1800 dots per inch, greater than 1900 dots per inch, greater than 2000 dots per inch, greater than 2100 dots per inch, greater than 2200 dots per inch, greater than 2300 dots per inch, greater than 2400 dots per inch, greater than 2500 dots per inch, or greater than 2600 dots per inch. It is worth noting that when applying the conductive ink 52 digitally, there is no need for a mask that is typically required in the printing process. Instead, the conductive ink 52 is deposited directly onto the surface of the curved transparent substrate 18 based on a digital image, thereby eliminating the need for a mask.

[0081] In one example, digitally applying conductive ink 52 includes inkjet printing the conductive ink onto the surface of a curved transparent substrate 18. Generally, the term "inkjet printing" refers to a printing process in which a digitally controlled printhead propels ink droplets onto a substrate based on a digitally based image. Examples of inkjet printing processes include, but are not limited to, continuous inkjet printing, thermal inkjet printing, piezoelectric inkjet printing, and on-demand inkjet printing. The conductive ink 52 can be inkjet printed onto the surface of the curved transparent substrate 18 at resolutions greater than 200 dots per inch, greater than 300 dots per inch, greater than 400 dots per inch, greater than 500 dots per inch, greater than 600 dots per inch, greater than 700 dots per inch, greater than 800 dots per inch, greater than 900 dots per inch, greater than 1000 dots per inch, greater than 1100 dots per inch, greater than 1200 dots per inch, greater than 1300 dots per inch, greater than 1400 dots per inch, greater than 1500 dots per inch, greater than 1600 dots per inch, greater than 1700 dots per inch, greater than 1800 dots per inch, greater than 1900 dots per inch, greater than 2000 dots per inch, greater than 2100 dots per inch, greater than 2200 dots per inch, greater than 2300 dots per inch, greater than 2400 dots per inch, greater than 2500 dots per inch, or greater than 2600 dots per inch.

[0082] In another example, digitally applying conductive ink 52 includes electrohydrodynamically printing the conductive ink 52 onto the surface of a curved transparent substrate 18. Generally, the term "electrohydrodynamic printing" refers to a printing process in which a digitally controlled, charged printhead guides ink through nozzles and onto a substrate based on a digitally based image. In some examples, the nozzle width can be as low as 10 micrometers, such that the linewidth of the applied conductive ink 52 is also 10 micrometers. Of course, it should be appreciated that nozzle widths wider than 10 micrometers can be selected to form conductive features 16 with a linewidth W wider than 10 micrometers. Furthermore, it is possible to perform electrodynamic printing of conductive ink 52 onto the surface of the curved transparent substrate 18 at resolutions greater than 200 dots per inch, greater than 300 dots per inch, greater than 400 dots per inch, greater than 500 dots per inch, greater than 600 dots per inch, greater than 700 dots per inch, greater than 800 dots per inch, greater than 900 dots per inch, greater than 1000 dots per inch, greater than 1100 dots per inch, greater than 1200 dots per inch, greater than 1300 dots per inch, greater than 1400 dots per inch, greater than 1500 dots per inch, greater than 1600 dots per inch, greater than 1700 dots per inch, greater than 1800 dots per inch, greater than 1900 dots per inch, greater than 2000 dots per inch, greater than 2100 dots per inch, greater than 2200 dots per inch, greater than 2300 dots per inch, greater than 2400 dots per inch, greater than 2500 dots per inch, or greater than 2600 dots per inch. In embodiments where conductive inks 52 and 104 are applied digitally (e.g., via an inkjet printing process), the conductive inks 52 and 104 may have linewidths between 10 micrometers and 1 millimeter.

[0083] Note that after digital application but before the applied conductive ink 52 cures, the applied conductive ink 52 can diffuse or disperse on the surface of the curved transparent substrate 18. For example, the conductive ink 52 can be digitally applied at a resolution of 400 dots per inch; however, before curing, the conductive ink 52 digitally applied at a resolution of 400 dots per inch can diffuse on the surface of the curved transparent substrate 18, resulting in a lower resolution for the conductive feature 16 after curing, such as 200 dots per inch, compared to the initial resolution during digital application. Additionally, the curing process itself may affect the resolution of the conductive feature 16. For example, the conductive ink 52 may expand or contract during the curing step, thus affecting the resolution of the conductive feature 16.

[0084] Therefore, the resolution of the conductive ink 52 when it is digitally applied may differ from the resolution of the conductive feature 16 after the digitally applied conductive ink 52 has been cured. Thus, after the digitally applied conductive ink 52 has been cured, the conductive feature 16 may have a resolution greater than 200 dots per inch. Specifically, the conductive feature 16 may have a resolution greater than 200 dots per inch, greater than 300 dots per inch, greater than 400 dots per inch, greater than 500 dots per inch, greater than 600 dots per inch, greater than 700 dots per inch, greater than 800 dots per inch, greater than 900 dots per inch, greater than 1000 dots per inch, greater than 1100 dots per inch, greater than 1200 dots per inch, greater than 1300 dots per inch, greater than 1400 dots per inch, greater than 1500 dots per inch, greater than 1600 dots per inch, greater than 1700 dots per inch, greater than 1800 dots per inch, greater than 1900 dots per inch, greater than 2000 dots per inch, greater than 2100 dots per inch, greater than 2200 dots per inch, greater than 2300 dots per inch, greater than 2400 dots per inch, greater than 2500 dots per inch, or greater than 2600 dots per inch.

[0085] Figure 8 and Figure 11 The illustration generally depicts an embodiment of a solderless electrical connector 12 for electrically and mechanically coupling or connecting a wire harness 14 to a conductive feature 16. In some embodiments, the solderless electrical connector 12 includes an adhesive 150 for mechanically connecting the wire harness 14 to the conductive feature 16 disposed on a substrate 18. In some embodiments, the adhesive 150 is conductive and may therefore also be referred to as conductive adhesive 150, and the conductive adhesive 150 is also part of the electrical connection that electrically connects the wire harness 14 to the conductive feature 16 disposed on the substrate 18. In other embodiments, the adhesive 150 is non-conductive, and the non-conductive adhesive 150 is not part of the electrical connection that electrically connects the wire harness 14 to the conductive feature 16 disposed on a transparent substrate 18, but only serves as a mechanical connection between the wire harness 14 and the transparent substrate 18.

[0086] Figure 8 The illustration depicts a device with, according to an exemplary embodiment, having, as shown in the figure. Figure 2 A solderless electrical connector 12 is used with a curved glass panel 50 on which conductive ink 52 is applied to the inward-facing surface 50B. Meanwhile, Figure 11 The illustration shows a parallel between the two embodiments according to another exemplary embodiment. Figure 4 A solderless electrical connector 12 is used with a laminated window assembly 90, which has conductive ink 104 applied to a surface 106A of an inner transparent substrate 106.

[0087] In alternative embodiments, such as Figure 15 and Figure 16As shown, a solderless electrical connector 300 according to another alternative embodiment is provided (see...). Figures 12-14 ). Figure 15 The diagram illustrates the relationship with, as shown in the image. Figure 2 A solderless electrical connector 300 is used with a curved glass panel 50 on which conductive ink 52 is applied to the inward-facing surface 50B. Meanwhile, Figure 16 The illustration shows that in Figure 5 A solderless electrical connector 300 is used on a laminated window assembly 90, which has conductive ink 104 applied to the inward-facing surface 100B of the outer transparent substrate 100.

[0088] although Figure 8 , Figure 11 , Figure 15 and Figure 16 The accompanying drawings show a flat transparent substrate 18, but these substrates 18 are illustrated as flat only for ease of illustration. In reality, Figure 8 and Figure 15 Glass panel 50 and Figure 11 and Figure 16 Substrates 100, 102, and 106 in the middle are with Figures 2-7 The corresponding curved substrates / panels shown and described above are even though they are depicted as flat.

[0089] First refer to Figure 8 and Figure 11 According to certain exemplary embodiments, the solderless electrical connector 12 includes an adhesive 150 for mechanically connecting the wire harness 14 to conductive ink 52, 104 applied to an outer substrate 100 or inner substrate 106 of a single planar or stacked window assembly 90 of the glass 50.

[0090] In some embodiments, the selected adhesive 150 is conductive to transfer electrical energy from the wire harness 14 to the conductive feature 16, and is therefore a conductive adhesive. Thus, the function of the conductive adhesive 150 is to mechanically and electrically connect the wire harness 14 to the conductive ink 52, 104 applied to the outer substrate 100 or inner substrate 106 of the single planar or laminated window assembly 90 of the glass 50.

[0091] Additionally, the adhesive 150 applied to the transparent substrate 18 and / or the applied conductive inks 52, 104 is cured at a temperature below the thermal degradation temperature of the applied conductive inks 52, 104. This is desirable to prevent loss of conductivity along some or all of the conductive features 16, and particularly within the applied conductive inks 52, 104. This curing can be performed via a photocuring process, a thermal curing process, or a combination thereof.

[0092] In some embodiments, the adhesive 150 has an initial tack strength (i.e., initial contact bond strength) sufficient to maintain the solderless connector 12 in a sealed and bonded state with the transparent substrate 18 and / or the conductive ink 52, 104 applied to the transparent substrate 18 during use without external fixation during the curing process.

[0093] like Figure 8 and Figure 11 As also illustrated, in some exemplary embodiments, the solderless electrical connector 12 further includes a terminal assembly 160, which serves as an electrical connection attachment point for the wire harness 14, thereby electrically connecting the wire harness 14 to the conductive inks 52, 104 via the solderless electrical connector 12.

[0094] Terminal assembly 160 includes a base plate portion 162 having a lower surface 164 and an upper surface 166, and a peripheral edge 168 connecting the lower surface 164 to the upper surface 166. The lower surface 164 is deployed on and in contact with adhesive 150. Terminal assembly 160 also includes a flange portion 170 coupled to and extending from a portion of the peripheral edge 168. Figure 8 and Figure 11 In the middle, the flange portion 170 is L-shaped and includes a first portion 172 extending laterally to the upper surface 166 and a second portion 174 extending laterally to the first portion 172. Figure 8 and Figure 11 In the embodiment, the second part 174 provides an electrical coupling point for the wire harness 14 (in Figure 8 and Figure 11 (As shown in the diagram, it is disconnected from the second part 174).

[0095] In some embodiments, both the base plate portion 162 and the flange portion 170 are formed of a conductive material, such as metal or a metal alloy, and thus when the wire harness 14 is coupled to the flange portion 170, an electrical connection is formed between the wire harness 14 and the conductive inks 52, 104 via the flange portion 170 and the base plate portion 162 of the solderless connector 12. In some examples, the base plate portion 162 and the flange portion 170 are integrally formed, but they can also be formed as two separate components that are fixed to and electrically connected to each other (when both the base plate portion 162 and the flange portion 170 are formed of a conductive material) to form an integral structure.

[0096] In alternative embodiments, the base portion 162 is formed of a non-conductive or insulating material (such as a non-conductive polymeric material), and the flange portion 170 is formed of the aforementioned conductive material. In some embodiments, the polymeric material may be a durable plastic material, such as nylon. In these embodiments, the flange portion 170 may be coupled to the base portion 162 by a molding operation (e.g., injection molding) to form an integral structure. In embodiments where the adhesive 150 is a conductive adhesive or is in electrical contact with a transparent substrate that is in electrical contact with conductive inks 52, 104, in order to provide electrical connection, the lower surface of the first portion 172 of the flange portion 170 is positioned such that the first portion 172 is in electrical contact with the adhesive 150, which is in electrical contact with the conductive inks 52, 104.

[0097] exist Figure 8 and Figure 11 In each embodiment including conductive adhesive 150, conductive adhesive 150 is applied to the outer surfaces 53 and 105 of conductive inks 52 and 104 opposite to surfaces 50B and 106A of glass panels 50 and 106, to which conductive inks 52 and 104 are applied. Alternatively, when using non-conductive adhesive 150, non-conductive adhesive 150 may be applied directly to the glass panels 50 and 106, adjacent to or otherwise close to the outer surfaces 53 and 105 of conductive inks 52 and 104 of the glass panels 50 and 106.

[0098] Specifically, in the presence of conductive adhesive 150 Figure 8 In a representative embodiment, conductive adhesive 150 is applied to the outer surface 53 of conductive ink 52, which is opposite to the inward-facing surface 50B of the individual glass plate 50. For example... Figure 8 As shown above, Figure 2 In the embodiment described above, conductive ink 52 is applied to the inward-facing surface 50B; however, in alternative embodiments, according to the above... Figure 3 In the embodiments described herein, conductive ink 52 may be applied to the outward surface 50A, or to both the inward surface 50B and the outward surface 50A.

[0099] In containing conductive adhesive 150 Figure 11 In a representative embodiment, according to the above Figure 4 In the embodiment described herein, conductive adhesive 150 is applied to the outer surface 105 of conductive ink 104 opposite to the surface 106A of the inner substrate 106.

[0100] More specifically, in order to comply with the above Figure 5The embodiments described herein apply conductive adhesive 150 to the outer surface 105 of conductive ink 104 opposite to the surface 106A of the inner substrate 106, with the aim of being able to access the conductive ink 104 without having to cut or otherwise remove portions of the outer transparent substrate 100 and the intermediate layer 102 for such application.

[0101] Therefore, as about Figure 11 Best shown Figure 9 and Figure 10 Thus, during the respective formation processes of the outer transparent substrate 100 and the intermediate layer 102 of the stacked window assembly 90, the outer transparent substrate 100 and the intermediate layer 102 of the stacked window assembly 90 are fan-shaped (i.e., the edges of each of the outer transparent substrate 100 and the intermediate layer 102 include fan-shaped edge regions 100C, 102C) to expose the inward-facing surface 106A of the portion of the outer substrate 100 having the conductive ink 104. Preferably, this fan-shaped formation occurs during the initial formation of the outer transparent substrate 100 and the intermediate layer 102.

[0102] When the stacked window assembly 90 is assembled via a stacking method, such as Figure 10 As shown, the fan-shaped edge regions 100C and 102C are aligned to form a co-extending fan-shaped edge 107, wherein a portion of the outward surface 106A of the inner substrate 106 and a portion of the conductive ink 104 are uncovered and can be used for the application of the conductive adhesive 150, which corresponds to the area removed by the fan-shaped edge.

[0103] In the illustrated embodiment, the fan-shaped edge regions 100C, 102C are located on the outer periphery of the laminated window assembly 90. However, in other embodiments, the fan-shaped edge regions 100C, 102C may be internal relative to the respective outer substrate 100 and intermediate layer 102, and thus the fan-shaped edge regions 100C, 102C define openings surrounded by the respective outer substrate 100 and intermediate layer 102.

[0104] In some embodiments, the conductive adhesive 150 may also be applied to the peripheral edge portions 52A, 104A of the conductive inks 52, 104 and to the surfaces 50A, 106A of the curved transparent substrate 18 adjacent to the peripheral edge portions 52A, 104A of the conductive inks 52, 104. Therefore, the conductive adhesive 150 can form a peripheral seal near the peripheral edge portions 52A, 104A of the conductive inks 52, 104.

[0105] After the conductive adhesive 150 is applied, the lower surface 164 of the base plate portion 162 is deployed on and in contact with the conductive adhesive 150 relative to the transparent substrate 18.

[0106] Next, the conductive adhesive 150 is cured to fix the base plate portion 162 to the conductive inks 52, 104 and optionally to the transparent substrate 18 (as described above in embodiments where the thermally conductive adhesive 150 is applied to the surfaces 50A, 106A of the curved transparent substrate 18 adjacent to the peripheral edge portions 52A, 104A of the conductive inks 52, 104).

[0107] In an exemplary embodiment, as described above, the adhesive 150 is cured at a temperature below the thermal degradation temperature of the applied conductive inks 52, 104. This is desirable in order to prevent partial or complete loss of conductivity of the applied conductive inks 52, 104 along the conductive feature 16.

[0108] In some embodiments, the adhesive 150 is photocured at a temperature below the thermal degradation temperature of the conductive inks 52 and 104. In some other embodiments, the adhesive 150 is thermally cured at a temperature below the thermal degradation temperature of the applied conductive inks 52 and 104. In still other embodiments, the applied adhesive 150 is both photocured and thermally cured at a temperature below the thermal degradation temperature of the conductive inks 52 and 104.

[0109] Exemplary conductive adhesives 150 that may be used include, but are not limited to, acrylate polymers, epoxy polymers, or acrylate and epoxy copolymers or polyurethane adhesives. The conductive adhesive 150 may be a reactive adhesive (i.e., an adhesive that begins to cure in response to external stimuli such as exposure to light, heat, moisture, or other initiating chemicals). In some examples, the conductive adhesive 150 may include a photoinitiator that initiates the polymerization of the adhesive in response to exposure to UV light. The conductivity of these conductive adhesives 150 may be provided by the polymer itself (i.e., an intrinsically conductive polymer) or by conductive fillers (such as metal or carbon fillers (powder or fibers)) dispersed in the polymer.

[0110] As Figure 11 In an alternative embodiment, adhesive 150 is applied to the outer surface 105 of the applied conductive ink 104, which according to Figure 5 , Figure 6 and Figure 7 The implementation of the stacked window assembly 90 shown in the figure is applied.

[0111] exist Figure 5 In the embodiments, the general principle is the same as Figure 11 The procedure is the same as in the previous procedure, except that the inner transparent substrate 106 (instead of the outer transparent substrate 100) and the intermediate layer 102 are fan-shaped, and the adhesive 150 is applied to the outer surface 105 of the conductive ink 104, which was previously applied to the inward facing surface 100B of the outer transparent substrate 100.

[0112] for Figure 6 and Figure 7 The embodiments follow the same principles as those described above. Figure 8 The same overall process is used, wherein neither the inner transparent substrate 106 nor the outer transparent substrate 100 (together with the intermediate layer 102) is fan-shaped, but rather the adhesive 150 is applied to the outer surface 105 of the conductive ink 104, which has previously been applied to the outward surface 100A of the outer transparent substrate 100 (e.g., Figure 6 (in the middle) or has been applied to the surface 106B of the inner transparent substrate 106.

[0113] Now for reference Figures 12-18 and with Figure 8 and Figure 11 Unlike the use of adhesive 150 and terminal assembly 160 as solderless electrical connector 12 to electrically couple conductive ink 52 to wire harness 14, an alternative solderless connector 300 can be used.

[0114] First refer to Figures 12-16 and Figures 24A-26B According to an alternative embodiment, the solderless electrical connector 300 includes an insulating cover 302 as a main component, a conductive biasing member 320, and an adhesive 350 for adhering the insulating cover 302 to a transparent substrate 18, wherein at least a portion of the conductive biasing member 320 is elastically compressed between the insulating cover 302 and the conductive features 16 disposed on the transparent substrate 18.

[0115] The insulating cover 302 may be formed of a durable polymer material (such as nylon) and is generally in the form of a plate defined within an inner surface 306, an outer surface 308, and an edge surface 310 that extends between and connects the inner surface 306 and the outer surface 308.

[0116] The conductive bias member 320 may be in the form of one or more leaf springs 320. Each conductive bias member / leaf spring 320 includes a first end 322 and an opposing second end 324, and a central region 326 coupling the first end 322 and the second end 324 and extending between the first end 322 and the second end 324. The second end 324 of each conductive bias member / leaf spring 320 may define an opening 328 or other structure serving as a coupling point for the wires of the wire harness 14. The conductive bias member / leaf spring 320 is formed of a conductive material, such as a metal or metal alloy, which allows electricity to flow from the wire harness 14 to the conductive features 16 deployed on the transparent substrate 18 when the solderless connector 300 is assembled and coupled to the transparent substrate 18 in the assembled state further described below and the wire harness 14 is connected to the conductive bias member / leaf spring 320. In some examples, the conductive bias member / leaf spring 320 is formed of copper or a copper alloy (e.g., copper-nickel, beryllium copper, etc.). For example, the conductive bias member / leaf spring 320 can be stamped, die-cut, or similarly made from a sheet of copper or copper alloy. The copper or copper alloy sheet forming the conductive bias member / leaf spring 320 can have a thickness of about 0.4 mm, but other thicknesses are considered.

[0117] Each conductive bias member / leaf spring 320 includes a first end portion 322 extending from the inner surface 306 of the insulating cover 302 and elastically compressed between the insulating cover 302 and a conductive feature 16 disposed on the transparent substrate 18, such that the conductive bias member / leaf spring 320 is positioned and maintained in electrical contact with the conductive feature 16. Each conductive bias member / leaf spring 320 also includes a second end portion 324 extending from the outer surface 308 of the insulating cover 302 and configured to couple to a wiring harness 14 of the vehicle. Each conductive bias member / leaf spring 320 also includes a central region 326 coupling the first end portion 322 and the second end portion 324 and extending between the first end portion 322 and the second end portion 324, such that the central region 326 passes through the insulating cover 302 and is secured to the insulating cover 302.

[0118] like Figures 12-16 and Figures 24A-26BAs shown in the embodiments, the second end 324 of each of the biasing members / leaf springs 320 may be bent along its length and extend outward and laterally away from the outer surface 308 of the insulating cover 302, such that the end 324a of the second end 324 of the conductive biasing member / leaf spring 320 is furthest from the outer surface 308 of the insulating cover 302. In cases where one or more leaf springs 320 comprise a pair of leaf springs 320, the ends 324a of the respective second ends 324 are positioned closer to each other than the remaining length of the respective second ends 324 (such as portions of the second ends 324 adjacent to the central region 326) are positioned closer to each other. In a further alternative embodiment, the second end 324 may extend along its length substantially perpendicular to the outer surface 308 between the central region and the corresponding end 324a, with the end 324a furthest from the outer surface 308 of the insulating cover 302.

[0119] like Figures 12-16 and Figures 24A-26B As shown in the embodiments, the first end 322 of each conductive bias member / leaf spring 320 may be straight or curved along its length and extends outward and laterally away from the inner surface of the insulating cover 302, such that the end 322a of the second end 322 of the conductive bias member / leaf spring 320 is furthest from the inner surface 306 of the insulating cover 302. In the case where one or more leaf springs 320 comprise a pair of leaf springs 320, and as shown, the ends 322a of each first end 322 are positioned closer to each other than the remaining length of each first end 322 (such as the portion of the first end 322 adjacent to the central region 326) is positioned closer to each other.

[0120] In some embodiments, the end 322a is bent relative to the remainder of the length of the first end 322 in order to provide additional surface area for coupling with the transparent substrate 18.

[0121] In some other embodiments, such as Figure 15 and Figure 24A As shown, the first end 322 of the conductive bias member / leaf spring 320 includes a stepped portion 323 adjacent to the central portion 326. When the insulating cover 302 is coupled to the glass plate 50 as part of forming a solderless electrical connector 300, the stepped portion 323 allows additional length of the first end 322 of the bias member / leaf spring 320 to contact the inner surface 306 of the insulating cover 302.

[0122] exist Figures 12-16 and Figures 24A-26BThe conductive biasing member / leaf spring 320 used in any of these configurations may be molded within or otherwise coupled to the insulating cap 302, such that a central region 326 extends through and is secured to the insulating cap 302, a first end 322 extends outwardly away from the inner surface 306, and a second end 324 extends outwardly away from the outer surface 308. For example, the insulating cap 302 may be overmolded over the central region 326 of the conductive biasing member / leaf spring 320, such that the insulating cap 302 is coupled to the central region 326 of the conductive biasing member / leaf spring 320. Other configurations for coupling the insulating cap 302 to the central region 326 of the conductive biasing member / leaf spring 320 are also considered.

[0123] In some embodiments, the conductive bias member / leaf spring 320 is in the form of a metal (such as aluminum, copper, etc.) or a metal alloy (such as an aluminum alloy, copper alloy, etc.). In some high-current examples, the conductive bias member / leaf spring 320 is made of beryllium copper and may include a plating of an additional conductive material (such as silver). In other embodiments, the conductive bias member / leaf spring 320 is in the form of a polymeric material and / or an elastomeric material (which may include additives to impart conductivity), which resists compression set over time and maintains a degree of functional elasticity over time in a temperature range from about -40 degrees Celsius to about 120 degrees Celsius.

[0124] In other alternative embodiments, the polymer material of the conductive bias member / leaf spring 320 may include foam, such as open-cell foam or closed-cell foam. In some embodiments, the polymer material and / or elastomer material of the conductive bias member / leaf spring 320 may include, for example, polyurethane, rubber (such as rubber formed from ethylene propylene diene monomer (EPDM)), or polystyrene, and may contain additives such as silver particles to impart conductivity.

[0125] To facilitate connection with the conductive feature 16, the conductive bias member / leaf spring 320 is conductive. When the conductive bias member / leaf spring 320 is composed of a conductive polymer, conductivity can be provided by the polymer itself (i.e., an intrinsically conductive polymer), conductive fillers dispersed in the polymer (such as metal or carbon fillers (powder or fiber)), and / or by using a conductive skin (such as a metal or metal alloy foil) disposed on the polymer.

[0126] In some other embodiments, such as Figure 16 and Figures 24A-25As shown, the central region 326 of the conductive bias member / leaf spring 320 defines a pair of cut-out regions 327 along its length. These cut-out regions 327 are used to increase the tensile strength of the bias member / leaf spring 320 molded within the insulating cap 302 during use. The cut-out regions 327 can define any suitable geometry and, in some examples, can be relative. In other words, in these configurations, the conductive bias member / leaf spring 320 is held relative to the insulating cap 302, rather than directly relative to the conductive feature 16. Therefore, advantageously, compared to configurations without cut-out regions 327 for engaging the insulating cap 302, the cut-out regions 327 increase the holding force of the bias member / leaf spring 320 relative to the insulating cap 302.

[0127] Figures 24A-26B Another configuration of the solderless electrical connector 300 is shown, which includes a conductive biasing member / leaf spring 320 with a cutout region 327. (See diagram below.) Figure 24A As best shown, in some examples, the first end 322 of the conductive bias member / leaf spring 320 has a first width W1, and the central region 326 of the conductive bias member / leaf spring 320 has a second width W2 greater than the first width W1. Here, the cut-out region 327 has a third width W3, which is equal to or greater than the first width W1 and less than the second width W2, such that the cut-out region 327 engages with the insulating cap 302 to hold the conductive bias member / leaf spring 320 relative to the insulating cap 302 (see [link to documentation]). Figure 25 The second end 324 of the conductive bias member / leaf spring 320 also defines a width, which may be equal to or greater than the first width W1. Advantageously, because the third width W3 of the cut-out region 327 is equal to or greater than the first width W1 of the first end 322, Figure 24A The cut-out region 327 has a cross-sectional area equal to or greater than that of the first end 322 of the conductive biasing member 320. Therefore, for Figures 24A-26B The construction of the structure allows for minimal to no localized heating of the cut-out region 327 when current flows through the conductive bias member 320, thereby increasing the current-carrying capacity while still engaging the insulating cover 302 to hold the conductive bias member / leaf spring 320 relative to the insulating cover 302. It should be understood that... Figures 24A-26BThe configuration shown is an exemplary configuration in which the first end 322 (and preferably the second end 324) of the conductive bias member / leaf spring 320 has a first width W1, the central region 326 of the conductive bias member / leaf spring 320 has a second width W2 greater than the first width W1, and the cut-out region 327 has a third width W3 equal to or greater than the first width W1 and less than the second width W2. Other configurations in which the cut-out region 327 has a cross-sectional area equal to or greater than the first end 322 of the conductive bias member 320 are also considered.

[0128] Adhesive 350 can be applied to the inner surface 306 of the insulating cover 302, which is adjacent to the intersection 309 of the inner surface 306 and the edge surface 310. Additionally, adhesive 350 can also be applied to areas of the inner surface 306 not associated with the second end 324 of the bias member / leaf spring 320. As described in further detail below, the surface area of ​​adhesive 350 applied to the inner surface 306 of the insulating cover 302 (along with the type of adhesive used) can be limited such that the initial tack strength of adhesive 350 is sufficient to maintain the insulating cover 302 against the surface of the transparent substrate 18 without external fixation while adhesive 350 cures.

[0129] In some embodiments, the adhesive 350 is in the form of a tape (i.e., adhesive tape) adhered to the inner surface 306. In some embodiments, the adhesive 350 used in the tape 350 is non-conductive, while in other embodiments, the adhesive 350 and / or the tape adhesive 350 may be as described above. Figures 8-11 The adhesive 150 described is similar to an adhesive. Before being applied to the inner surface, the tape adhesive 350 may include a carrier layer (i.e., a liner), which is removed before the tape adhesive 350 is applied to the inner surface 306. As described below, a separate, opposing carrier layer may also be provided, which is subsequently removed before the tape adhesive 350 is applied to the transparent substrate 18.

[0130] In some embodiments, the selected adhesive 350 should have an initial tack strength (i.e., initial contact bond strength) sufficient to keep the insulating cap 302 against the surface of the transparent substrate 18 in a sealed and bonded state without external fixation during the curing process. In other words, the initial tack strength of the adhesive 350 is sufficient to keep the insulating cap 302 against the surface of the transparent substrate 18 as the adhesive 350 cures, wherein the first end 322 of the conductive bias member / leaf spring 320 is elastically compressed between the insulating cap 302 and the conductive feature 16 disposed on the transparent substrate 18 without external fixation. Advantageously, eliminating the need for external fixation of the insulating cap 302 against the transparent substrate 18 during adhesive 350 curing simplifies the assembly process and saves time and money.

[0131] For example, refer to Figure 27 As a result of the elastic compression of the first end 322 of the conductive biasing member / leaf spring 320 between the insulating cover 302 and the conductive feature 16 disposed on the transparent substrate 18, the conductive biasing member / leaf spring 320 applies a force F to push the insulating cover 302 away from the transparent substrate 18. In these configurations, such as Figure 27 As shown, the initial tack strength GS of the adhesive 350 is equal to or greater than the force F, such that the adhesive 350 keeps the insulating cover 302 against the surface of the transparent substrate 18 without external fixation when the adhesive 350 is cured.

[0132] In one measured configuration, the force F is approximately 6.5 N. However, it should be understood that the force F is variable between configurations based on many factors, including but not limited to the composition, thickness, and deformation level of the conductive bias member / leaf spring 320. Therefore, the initial tack strength GS is equal to or greater than 6.5 N, such that the adhesive 350 holds the insulating cap 302 against the surface of the transparent substrate 18 without external fixation when the adhesive 350 cures. It should be understood that the initial tack strength GS of the adhesive 350 can be defined / adjusted by many factors, including the composition of the adhesive 350 and the surface area on which the adhesive 350 is applied. For example, the initial tack strength characteristics of the adhesive 350 (typically determined from the adhesive supplier, either from a specification sheet or on request) and / or the surface area on which the adhesive 350 is applied can be selected or adjusted based on the force F applied by the first end 322 of the conductive bias member / leaf spring 320 when it is elastically compressed between the insulating cap 302 and the conductive feature 16 deployed on the transparent substrate 18.

[0133] Exemplary adhesives 350 that can be used include, but are not limited to, acrylate polymers, epoxy polymers, acrylate and epoxy copolymers, and polyurethane adhesives. Adhesive 350 may be a reactive adhesive (i.e., an adhesive that begins to cure in response to external stimuli such as exposure to light, heat, moisture, or other initiating chemicals). In some examples, adhesive 350 may include a photoinitiator that initiates polymerization of the adhesive in response to exposure to UV light. An exemplary acrylate and epoxy copolymer-based tape adhesive is Structural Bonding Tape 9550 (available from 3M in St. Paul, Minnesota). TM (Purchase required). Another exemplary tape adhesive based on epoxy resin chemistry is UV-LUX. ® (It can be purchased from Lohmann GmbH & Co.KG in Newvid, Germany).

[0134] In some embodiments, the adhesive tape 350 is a solid state pressure-sensitive adhesive (PSA) tape 350 that adheres to the transparent substrates 18, 100 by applying pressure to the tape 350 to remove air bubbles between the tape 350 and the transparent substrates 18, 100, ensuring close contact between the tape 350 and the transparent substrates 18, 100. In some embodiments, the pressure applied to the PSA tape 350 initiates a curing process within the PSA tape 350, as described above, which occurs at a temperature below the thermal degradation temperature of the conductive ink 104. In still other embodiments, in addition to using pressure to initiate a curing process within the PSA tape 350, the PSA tape can be photocured and / or thermally cured, as described above, which occurs at a temperature below the thermal degradation temperature of the conductive ink 104.

[0135] In some embodiments, the adhesive 350 is conductive, and is a conductive adhesive 350. The conductivity of the conductive adhesive 350 may be provided by the polymer itself (i.e., an intrinsically conductive polymer) or by conductive fillers (such as metal or carbon fillers (powder or fibers)) dispersed in the polymer.

[0136] like Figure 17 and Figure 18In the two exemplary embodiments shown in the best assembly state (and described in further detail below), the first end 322 is positioned to make electrical contact with the conductive feature 16 disposed on the transparent substrate 18 and elastically compressed between the insulating cap 302 and the conductive feature 16 disposed on the transparent substrate 18. In embodiments where the adhesive 350 is in the form of a tape, any carrier layer is removed from the tape adhesive 350, and then the tape adhesive is photocured. Afterward, the tape adhesive 350 is pressed onto the transparent substrate 18 or onto the outer surfaces 53, 105 of the applied conductive inks 52, 104 to directly adhere the insulating cap 302 to the transparent substrate 18, or indirectly adhere it to the transparent substrate 18 via the conductive inks 52, 104, such that the first end 322 of the conductive bias member / leaf spring 320 is also sealed between the adhesive 350, the inner surface 306 of the insulating cap 302, and the top surface of the applied conductive inks 52, 104. If the adhesive 350 is not in the form of tape, a carrier removal step is not required. Instead, the adhesive 350 is applied to the transparent substrate 18 or to the outer surfaces 53 and 105 of the applied conductive inks 52 and 104 to directly adhere the insulating cover 302 to the transparent substrate 18, or indirectly to the transparent substrate 18 via the conductive inks 52 and 104. This allows the first end 322 of the conductive bias member / leaf spring 320 to be also sealed between the adhesive 350, the inner surface 306 of the insulating cover 302, and the top surface of the conductive inks 52 and 104. Additionally, the second end 324 of the conductive bias member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302 in a direction away from the transparent substrate 18 and the conductive inks 52 and 104, and is configured to be linearly coupled to the wire harness 14 via an opening 328 at the second end 324.

[0137] Figure 15 and Figure 16 The illustration shows an embodiment in which a solderless electrical connector 300 mechanically and electrically connects a wire harness 14 to a conductive feature 16 disposed on a transparent substrate 18 and is in an assembled state. Figure 15 The diagram illustrates the solderless electrical connector 300 and... Figure 2 It is used together with a curved glass panel 50 having conductive ink 52 applied to the inward-facing surface 50B, while Figure 16 The illustration shows that Figure 5 The solderless electrical connector 12 is used on the laminated window assembly 90, which has conductive ink 104 applied to the inward-facing surface 100B of the outer transparent substrate 100.

[0138] Similar to about Figure 8 and Figure 15In conjunction with the foregoing description, this subject matter disclosure also contemplates alternative embodiments in which the solderless electrical connector 300 is used with a curved glass panel 50 having, according to Figure 3 The embodiment shown in the figure has conductive ink 104 applied to the outward surface 50A, or to both the outward surface 50A and the inward surface 50B.

[0139] Even further, similar to... Figure 11 and Figure 16 In conjunction with the above description, this subject matter disclosure also contemplates alternative embodiments, wherein, according to the above description, alternative embodiments are also considered. Figure 5 , 6 In the embodiment of the stacked window assembly 90 illustrated in Figure 7, a solderless electrical connector 300 is used to apply conductive ink 104.

[0140] In the embodiment where the inner transparent substrate 106 (instead of the outer transparent substrate 100) and the intermediate layer 102 are fan-shaped and conductive ink 104 has been previously applied to the inward-facing surface 100B of the outer transparent substrate 100, by means of the above... Figure 16 The procedure discussed in the article is essentially the same as that used to introduce the solderless electrical connector 300.

[0141] Neither the inner transparent substrates 100 nor 106 (together with the intermediate layer 102) are fan-shaped; instead, conductive ink 104 has been previously applied to the outward surface 100A of the outer transparent substrate 100 (e.g., Figure 6 In an alternative embodiment, or in which an application has been made to the inward facing surface 106B of the inner transparent substrate 106, by means of the above-described Figure 15 The procedure discussed in the section on a single glass plate 50 is essentially the same as that introduced for the solderless electrical connector 300.

[0142] Next reference Figure 19 It shows including Figure 17 Another alternative embodiment of the laminated window assembly 90 of the solderless electrical connector 300. In this embodiment, a conductive foil 111 (i.e., conductive strip 111) is used to form an electrical connection with the conductive ink layer 104 applied to the inward facing surface 100B (P2) of the outer transparent substrate 100 and / or applied to the inward facing surface 106A of the inner transparent substrate 106. In this embodiment, the electrical connection component 14 is deployed on the outside of the outer transparent substrate 100 or the inside of the inner transparent substrate 106, and does not require... Figure 18 The fan-shaped arrangement in the middle.

[0143] For ease of description and explanation, in Figure 19 In one embodiment, conductive ink 104 has been applied to the inward facing surface 100B (i.e., P2) of the outer transparent substrate 100 and thus deployed between the outer transparent substrate 100 and the intermediate layer 102.

[0144] refer to Figure 19 The conductive foil 111 (shown herein as aluminum foil 111) is electrically coupled or connected to the conductive ink 104 at its outer edge, and in some embodiments is physically connected to the conductive ink 104. The conductive foil 111 extends along the edge of the outer surface 100A (i.e., along P1) of the outer substrate 100 and is coupled to the solderless electrical connector 300, which includes an insulating cover 302, a biasing member 320, and an adhesive 350.

[0145] In such Figure 19 Also shown in the assembled state, the first end 322 of the bias member 320 is positioned in electrical contact with the conductive foil 111 extending along the outward surface 100A of the outer substrate 100, and is elastically compressed between the molded insulating cap 302 and the conductive foil 111. In embodiments where the adhesive 350 is in tape form, any carrier layer is removed from the tape adhesive 350, and then photocuring of the tape adhesive 350 is initiated. The tape adhesive 350 is then pressed onto the outward surface 100A and optionally along the top surface of the conductive foil 111 to directly adhere the insulating cap 302 to the outward surface 100A of the substrate 100, and / or indirectly to the outward surface 100A of the substrate 100 via the conductive foil 111, such that the first end 322 of the bias member / leaf spring 320 is also hermetically positioned between the adhesive 350, the inner surface 306 of the insulating cap 302, and the top surface of the conductive foil 111. If the adhesive 350 is not in tape form, the carrier removal step is not required. Additionally, the second end 324 of the bias member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302 in a direction away from the substrate 100 and the conductive foil 111, and is configured to interact with the aforementioned... Figure 17 The same manner described herein is used for wire coupling with the wire harness 14 via an opening 328 at the second end 324. Therefore, by actuation of the electrical connection member 14, P2 (or, in an alternative embodiment where conductive ink 104 is applied to the inward-facing surface 106A, P3, such as in…) Figure 4 Electrical excitation occurs in the conductive ink 104 (in the middle), wherein charge is extended to the conductive ink 104 through the conductive foil.

[0146] As described above, this disclosure also relates to an associated method for manufacturing a glass assembly having a solderless electrical connector 12, which utilizes an adhesive 150 and a terminal assembly 160, as well as a single glass plate 50 (see corresponding to...). Figure 8 of Figure 20 (Flowchart) or stacked window component 90 (see corresponding to) Figure 11 of Figure 21(Flowcharts) and the use of adhesive 150 according to certain exemplary embodiments described above. This disclosure also relates to an association method for manufacturing a glass assembly having an alternative solderless electrical connector 300 on a single glass plate 50 or a laminated window assembly 90 (see corresponding to...). Figure 15 and Figure 16 of Figure 21 and Figure 22 (Flowchart).

[0147] refer to Figure 20 An exemplary embodiment of a method 500 for forming a glass assembly 10 having a solderless electrical connector 12 on a single glass plate 50 is provided. For ease of description, regarding... Figure 8 The embodiments are described Figure 20 The flowchart shows that the solderless electrical connector 12 is deployed on the inward facing surface 50B of a single glass plate 50. However, in the case where the solderless electrical connector 12 is deployed on the outward facing surface 50A of a single glass plate 50, it can be determined according to... Figure 20 The flowchart uses the same procedure, with slight differences in the procedure described in step 504 below.

[0148] First, referring to step 502, as described above, a curved transparent substrate 18 is formed as a single glass plate 50 having an inward facing surface 50B and an outward facing surface 50A.

[0149] Next, in step 504, conductive ink 52 is applied to one or both of the inward-facing surface 50B and the outward-facing surface 50A (e.g., ...). Figure 8 As shown, applied to as Figure 2 (The inward-facing surface 50B). A suitable method for applying conductive ink 52 has been described above. In some embodiments, as part of step 504 and after the application of conductive ink 52, the conductive ink 52 is photocured, thermocured, sintered, or otherwise dried onto the curved glass substrate 50 as described above.

[0150] In step 506, adhesive 150 is applied to a portion of conductive ink 52 and optionally to the surface of the curved transparent substrate 18 adjacent to conductive ink 52 (i.e., applied to a portion of the edge of the adjacent conductive ink 52 facing inward toward surface 50B).

[0151] In step 508, the terminal assembly 160 is positioned on the adhesive 150 opposite the conductive ink 52. Specifically, the lower surface 164 of the base plate portion 162 is disposed on and in contact with the upper surface of the adhesive 150. More specifically, the lower surface 164 of the base plate portion 162 is pressed into the upper surface of the adhesive 150.

[0152] In embodiments where the base plate portion 162 is formed of a non-conductive material, during step 508, the second portion 174 of the flange portion 170 also contacts the upper surface of the adhesive 150. In some alternative embodiments where the base plate portion 162 is formed of a conductive material, during step 508, the second portion 174 of the flange portion 170 also contacts the upper surface of the adhesive 150.

[0153] In embodiments where the base plate portion 162 and the flange portion 170 are separate components, step 508 may further include a sub-step of securing the base plate portion 162 and the flange portion 170 to each other to form an integral structure before or after deployment onto the adhesive.

[0154] Next, in step 510, the adhesive 150 is cured to form the solderless electrical connector 12. In step 510, the adhesive 150 is cured at a temperature below the thermal degradation temperature of the applied conductive ink 52. This is desirable to prevent loss of conductivity along part or all of the applied conductive ink 52 and therefore the conductive feature 16 due to degradation caused by exposure of the applied conductive ink 52 to temperatures above its thermal degradation temperature.

[0155] In some embodiments, the adhesive 150 is photocured at a temperature below the thermal degradation temperature of the applied conductive ink 52. In some other embodiments, the adhesive 150 is thermally cured at a temperature below the thermal degradation temperature of the applied conductive ink 52. In still other embodiments, the adhesive 150 is both photocured and thermally cured at a temperature below the thermal degradation temperature of the applied conductive ink 52.

[0156] exist Figure 20 In an alternative embodiment of the method, before positioning the terminal assembly 160 on the adhesive 150 opposite the conductive ink 52 as in step 508, the steps of curing the adhesive 150 as in step 510, and in particular the steps of photocuring the adhesive 150 as in step 510, are started.

[0157] In step 512, the wire harness 14 is coupled to the terminal assembly 160. Specifically, such as in Figure 8 In the middle, the wire harness 14 is linearly coupled to the second part 174 of the flange portion 170.

[0158] Next reference Figure 21 An exemplary embodiment of a method 600 for forming a glass assembly 10 having a solderless electrical connector 12 on a laminated window assembly 90 is provided. For ease of description, regarding Figure 11 The embodiments are described Figure 21The flowchart shows that the solderless electrical connector 12 is deployed on the surface 106A of the inner transparent substrate 106. However, in the case where the solderless electrical connector 12 is deployed on the inward-facing surface 100B of the outer transparent substrate 100, it can be determined according to... Figure 21 The flowchart uses the same procedure, with slight differences in the procedure described in step 604 below.

[0159] First, refer to step 602, and as follows: Figure 9 As best shown, an outer transparent substrate 100, an intermediate layer 102, and an inner transparent substrate 106 are formed, wherein the outer transparent sheet 100 and the intermediate layer 102 are formed with fan-shaped edges 100C and 102C as described above. Although in Figure 9 Not shown, but as part of these molding steps, the outer transparent substrate 100, the intermediate layer 102 and the inner transparent substrate 106 are formed as curved outer transparent substrate 100, curved intermediate layer 102 and inner transparent substrate 106.

[0160] Next, in step 604, conductive ink 104 is applied to at least one surface 100B, 106A of one or both of the outer transparent substrate 100 and the inner transparent substrate 100 (e.g., ...). Figure 11 As shown, the conductive ink 104 is applied to the surface 106A of the inner transparent substrate 106. The method for applying the conductive ink 104 is the same as described above and will not be repeated here for the sake of brevity. Optionally, as part of step 604, the applied conductive ink 104 is photocured and / or thermally cured to form cured conductive ink, or sintered to form sintered conductive ink 104, or otherwise dried as described above.

[0161] Next, in step 605, as Figure 10 As shown, a laminated window assembly 90 is formed, wherein an intermediate layer 102 is disposed between an outer transparent substrate 100 and an inner transparent substrate 106, and conductive ink 104 is disposed between the intermediate layer 102 and the inner transparent sheet 106. As part of step 605, heat and pressure are applied sufficient to form a laminate, wherein the intermediate layer 102 is bonded to both the outer transparent substrate 100 and the conductive ink 104, but insufficient to degrade the conductive ink 104. Additionally, as part of step 605, fan-shaped edge regions 100C and 102C are aligned to form a co-extending fan-shaped edge 107, and a portion of the surface 106A of the inner transparent substrate 106 and a portion of the conductive ink 104 remain uncovered.

[0162] Next, in step 606, adhesive 150 is applied to a portion of conductive ink 104 and optionally to the surface 106A of the inner transparent substrate 106 adjacent to conductive ink 104 (i.e., applied to a portion of the edge of the conductive ink 104 adjacent to the surface 106A facing inward).

[0163] In step 608, the terminal assembly 160 is positioned on the adhesive 150 opposite the conductive ink 104. Specifically, the lower surface 164 of the base plate portion 162 is deployed on and in contact with the upper surface of the adhesive 150. More specifically, the lower surface 164 of the base plate portion 162 is pressed into the upper surface of the adhesive 150.

[0164] If the base plate portion 162 is formed of a non-conductive material, during step 608, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150. In some alternative embodiments, if the base plate portion 162 is formed of a conductive material, during step 608, the second portion 174 of the flange portion 170 is also brought into contact with the upper surface of the adhesive 150.

[0165] If the base plate portion 162 and the flange portion 170 are separate components, step 608 may also include a sub-step in which the base plate portion 162 and the flange portion 170 are secured to each other to form an integral structure before or after the adhesive 150 is applied.

[0166] Next, in step 610, the adhesive 150 is cured by the method described above to form the solderless electrical connector 12, which will not be repeated here for the sake of brevity.

[0167] In step 612, the wire harness 14 is coupled to the terminal assembly 160. Specifically, such as Figure 11 In the middle, the wire harness 14 is linearly coupled to the second part 174 of the flange portion 170.

[0168] Next reference Figure 22 An exemplary method 700 is provided for forming a glass assembly 10 with solderless electrical connectors 300 on a single glass plate 50. For ease of description, the flowchart is relative to... Figure 15 The embodiments described herein involve a solderless electrical connector 300 deployed on an inward-facing surface 50B of a single glass plate 50. However, the solderless electrical connector 300 can also be deployed on an outward-facing surface 50A of a single glass plate 50, depending on the specific embodiment. Figure 22 The flowchart uses the same procedure, with minor differences in the procedure described in step 704 below.

[0169] First, referring to step 702, as described above, a single glass plate 50 is formed into a curved glass sheet having an inward-facing surface 50B and an outward-facing surface 50A.

[0170] Next, in step 704, by means of the above-described Figure 17 The same procedure described in step 504 applies conductive ink 52 to one or both of the inward-facing surface 50B and the outward-facing surface 50A (e.g., Figure 8 As shown, Figure 2 The conductive ink 52 is applied to the inward-facing surface 50B, and will not be repeated here. The method for applying the conductive ink 104 is the same as described above, and will not be repeated here for the sake of brevity. Optionally, as part of step 704, the applied conductive ink 52 is photocured and / or thermally cured to form cured conductive ink, or sintered to form sintered conductive ink 52, or otherwise dried as described above.

[0171] In step 706, a solderless electrical connector 300 is formed according to an alternative embodiment or otherwise provided.

[0172] In some embodiments of the solderless connector, as described above, the biasing member / leaf spring 320 may be molded within or otherwise coupled to the molded insulating cover 302, such that a central region 326 extends through and is secured to the insulating cover 302, a first end 322 extends outwardly away from the inner surface 306, and a second end 324 extends outwardly away from the outer surface 308. An adhesive 350 is then applied to the inner surface 306 of the insulating cover 302 at the intersection 309 of the inner surface 306 and the edge surface 308. Furthermore, in some embodiments, the adhesive 350 may also be applied to a region of the inner surface 306 that is independent of the second end 324 of the biasing member / leaf spring 320.

[0173] In such Figures 12-16 In an exemplary embodiment, the adhesive 350 is in the form of a tape that adheres to the inner surface 306 and may be non-conductive or conductive.

[0174] Next, in step 708, the solderless connector 300 is coupled to the conductive ink 52. Specifically, the first end 322 of each of the bias members 320 is positioned in electrical contact with the conductive ink 52 and is elastically compressed between the molded insulating cap 302 and the conductive ink 52. Adhesive 350 is pressed onto the transparent substrate 18, specifically onto the outward surface 50B of the individual glass plate 50 or onto the outer surface 53 of the conductive ink 52, to directly adhere the insulating cap 302 to the transparent substrate 18 / individual glass plate 50, or indirectly to the transparent substrate 18 / individual glass plate 50 via the conductive ink 52, such that the first end 322 of the bias member / leaf spring 320 is also hermetically positioned between the adhesive 350, the inner surface 306 of the insulating cap 302, and the top surface of the conductive ink 52. Furthermore, the second end 324 of the bias member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302 in a direction away from the transparent substrate 18 / single glass plate 50 and conductive ink 52.

[0175] Next, in step 710, the adhesive 350 is cured to form the solderless electrical connector 12. In step 710, curing of the adhesive 350 is initiated by applying a stimulus. Specifically, the adhesive 350 is cured at a temperature below the thermal degradation temperature of the conductive ink 52. This is desirable to prevent loss of conductivity along part or all of the conductive feature 16 due to degradation of the conductive ink 52 when exposed to temperatures above its thermal degradation temperature.

[0176] In some embodiments, the photocurable / photoinitiated adhesive 350 is photocured / photoinitiated at a temperature below the thermal degradation temperature of the conductive ink 52. For example, the adhesive 350 is photocured / photoinitiated by briefly exposing it to a UV light source. In such embodiments, once externally initiated, the curing process can be self-continuous, but slow enough to provide a minimal amount of time (e.g., greater than about 20 seconds) for the user to perform the remaining steps. In one instance, self-continuous curing can be facilitated by providing one or more of a catalyst and an initiator having multiple microcapsules that release the catalyst and / or initiator upon exposure to a light source such as a UV lamp.

[0177] In some other embodiments, the adhesive 350 is thermally cured at a temperature below the thermal degradation temperature of the conductive ink 52. In these embodiments, the applied adhesive 350 may be cured in an oven or by other thermal methods or in the environment, provided that the curing is carried out at a temperature below the thermal degradation temperature of the conductive inks 52 and 104 as described above. In still other embodiments, the adhesive 350 is both photocured and thermally cured at a temperature below the thermal degradation temperature of the conductive ink 52 by the methods described above.

[0178] If the adhesive 350 is a photoactivated tape adhesive 350, the carrier material is removed from the adhesive 350, and light is applied to the tape adhesive 350 before it is applied to the transparent substrate 18, specifically to the outward surface 50B of the individual glass plate 50 or to the outer surface 53 of the conductive ink 52 to directly adhere the insulating cover 302 to the transparent substrate 18 / individual glass plate 50, or to the transparent substrate 18 / individual glass plate 50 as in step 708.

[0179] In step 712, the harness 14 is coupled to the second end 324 of each of the bias members 320. Specifically, such as in Figure 15 In the middle, the wires of the wire harness 14 are electrically coupled to the second end 324 of each of the bias members 320 through an opening in the bias member 320.

[0180] Next reference Figure 23 An exemplary embodiment of a method 800 for forming a glass assembly 10 having a solderless electrical connector 300 on a laminated window assembly 90 is provided. For ease of description, relative to... Figure 16 The flowchart is described using an embodiment in which the solderless electrical connector 300 is deployed on the outward facing surface 100A of the outer transparent substrate 100. However, the same procedure can be used according to the flowchart when the solderless electrical connector 300 is deployed on the inward facing surface 100B of the outer transparent substrate 100, with slight differences in the procedure described in step 804.

[0181] First, refer to step 802, and as follows: Figure 9 As shown in the best embodiment, the outer transparent substrate 100, the intermediate layer 102 and the inner transparent substrate 106 are formed as described above, and will not be repeated here.

[0182] Next, in step 804, conductive ink 104 is applied to at least one surface 100B, 106A of one or both of the outer transparent substrate 100 and the inner transparent substrate 106 (in... Figure 16 (Seen in the figure is the outward-facing surface 100A applied to the outer transparent substrate 100).

[0183] The method for applying conductive ink 104 is the same as described above. Figure 17 The method for applying conductive ink 52 in step 504 is the same and will not be repeated here for the sake of brevity. Optionally, as part of step 804, the applied conductive ink 104 may be photocured and / or thermally cured to form cured conductive ink, or sintered to form sintered conductive ink 104, or otherwise dried as described above.

[0184] Next, in step 805, a laminated window assembly 90 is formed using the same method as described above, wherein an intermediate layer 102 is disposed between the outer transparent substrate 100 and the inner transparent substrate 106, and conductive ink 104 is disposed between the intermediate layer 102 and the inner transparent sheet 106, as shown. Figure 16 As shown, it will not be repeated here.

[0185] In step 806, the solderless electrical connector 300 according to the above method is formed according to the alternative embodiment or otherwise provided, and will not be repeated here for the sake of brevity.

[0186] Next, in step 808, the solderless connector 300 is coupled to the conductive ink 104. Specifically, the first end 322 of each of the bias members 320 is positioned in electrical contact with the conductive ink 104 and is elastically compressed between the molded insulating cap 302 and the conductive ink 104. Adhesive 350 is pressed onto the transparent substrate 18, and specifically onto the outward surface 106B of the inner transparent sheet 106 or onto the outer surface 105 of the conductive ink 104, to directly adhere the insulating cap 302 to the transparent substrate 18 / inner transparent sheet 106, or indirectly to the transparent substrate 18 / inner transparent sheet 106 via the conductive ink 104, such that the first end 322 of the bias member / leaf spring 320 is also hermetically positioned between the adhesive 350, the inner surface 306 of the insulating cap 302, and the top surface 105 of the conductive ink 104. Furthermore, the second end 324 of the bias member / leaf spring 320 extends outward from the outer surface 308 of the insulating cover 302 in a direction away from the transparent substrate 18 / inner transparent sheet 106 and conductive ink 104.

[0187] Next, in step 810, in accordance with the above... Figure 20 Step 710 cures the adhesive 350 in essentially the same way to form the solderless electrical connector 300 and will not be repeated here for the sake of brevity.

[0188] In step 812, the harness 14 is coupled to the second end 324 of each of the bias members 320. Specifically, such as in Figure 16 In the middle, the wires of the wire harness 14 are electrically coupled to the second end 324 of each of the bias members 320 through an opening in the bias member 320.

[0189] Several embodiments have been described in the foregoing specification. However, the embodiments described herein are not intended to be exhaustive or to limit the invention to any particular form. The nature of the terms used is descriptive rather than restrictive. In view of the above teachings, many modifications and variations are possible, and the invention may be practiced in other ways without specific description.

[0190] In addition to those already mentioned herein, various additional changes and variations can be made to the above embodiments. This disclosure is given for illustrative purposes and should not be construed as an exhaustive description of all embodiments or as limiting the scope of the claims to the specific elements described and illustrated in connection with these embodiments. For example, and not limited thereto, any individual element of the described embodiments may be replaced by an alternative element that provides substantially similar functionality or otherwise provides sufficient operation. This includes, for example, alternative elements currently known, such as those that may be known to those skilled in the art, and alternative elements that may be developed in the future, such as those that those skilled in the art may identify as alternatives after development. Any reference to an element of a claim in the singular, such as the use of the articles “a,” “an,” “the,” or “the,” should not be construed as limiting the element to the singular. It will be further understood that the term “comprising” has the same meaning as the term “including.”

Claims

1. A window assembly for a vehicle, the window assembly comprising: Transparent substrate; Conductive features are formed on the surface of the transparent substrate; as well as A solderless electrical connector for electrically coupling a vehicle's wiring harness to the conductive features, the solderless electrical connector comprising: An insulating cover, the insulating cover including an inner surface facing the transparent substrate and an opposing outer surface; A conductive biasing member, the conductive biasing member comprising: A first end portion extends from the inner surface of the insulating cover and is elastically compressed between the insulating cover and the conductive feature portion, such that the conductive biasing member is positioned in electrical contact with the conductive feature portion; A second end, extending from the outer surface of the insulating cover and configured to couple to a wiring harness of the vehicle; and A central region, coupled and extending between the first end and the second end, such that the central region extends through and is coupled to the insulating cover, the central region defining a cutout area that engages with the insulating cover to hold the conductive biasing member relative to the insulating cover; and An adhesive is deployed between the inner surface of the insulating cover and the transparent substrate to adhere the inner surface of the insulating cover to the transparent substrate, and the first end of the conductive biasing member is elastically compressed between the inner surface and the transparent substrate to maintain electrical communication between the conductive biasing member and the conductive feature.

2. The window assembly of claim 1, wherein the first end of the conductive biasing member has a first width; and The central region of the conductive biasing member has a second width greater than the first width, and the cut-out region has a third width equal to or greater than the first width and less than the second width, such that the cut-out region engages with the insulating cover to hold the conductive biasing member relative to the insulating cover.

3. The window assembly of claim 1, wherein the conductive biasing member comprises beryllium copper.

4. The window assembly of claim 1, wherein the first end of the conductive biasing member is bent along its length to provide additional surface area for positioning the first end to make electrical contact with the conductive feature.

5. The window assembly of claim 4, wherein the first end of the conductive biasing member includes a stepped portion adjacent to the central region to allow additional surface area of ​​the first end to be positioned in electrical contact with the conductive feature.

6. The window assembly of claim 1, wherein the initial tack strength of the adhesive is sufficient to maintain the insulating cover against the surface of the transparent substrate when the adhesive cures and the first end of the conductive biasing member is elastically compressed between the insulating cover and the conductive feature without external fixation.

7. The window assembly of claim 6, wherein elastic compression of the first end of the conductive biasing member between the insulating cover and the conductive feature applies a force to push the insulating cover away from the transparent substrate, and wherein the initial tack strength of the adhesive is equal to or greater than the force.

8. The window assembly of claim 1, wherein the adhesive comprises a photoinitiator that initiates curing of the adhesive in response to exposure to UV light.

9. The window assembly of claim 1, wherein the adhesive is a pressure-sensitive adhesive.

10. The window assembly of claim 1, wherein the adhesive is tape.

11. The window assembly of claim 1, wherein the first end of the conductive biasing member is disposed between the adhesive, the inner surface of the insulating cover, and the conductive feature disposed on the transparent substrate.

12. The window assembly of claim 1, wherein the conductive feature comprises a conductive ink layer formed on the surface of the transparent substrate.

13. The window assembly of claim 12, wherein the conductive ink comprises conductive particles and a ceramic frit, such that when subjected to firing, the conductive ink fuses with the transparent substrate to form a conductive feature.

14. The window assembly of claim 12, wherein the conductive ink comprises conductive particles and organic monomers.

15. The window assembly of claim 14, wherein the conductive ink comprises a photoinitiator that initiates curing of the conductive ink in response to exposure to UV light.

16. The window assembly of claim 14, wherein the conductive ink is a thermosetting conductive ink.

17. The window assembly of claim 12, wherein the conductive ink is screen-printed on the surface of the transparent substrate.

18. The window assembly of claim 1, wherein the transparent substrate is a first transparent substrate; and The window assembly further includes a second transparent substrate and an intermediate layer disposed between the first transparent substrate and the second transparent substrate.

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