Radio frequency assembly and insulator sintering method thereof

Abstract

The application provides a radio frequency assembly and a sintering method of an insulator of the radio frequency assembly, and relates to the technical field of radio frequency assembly preparation. The method comprises the following steps: a first solder ring is loaded into a first hole section from one side of the first hole section, so that the first solder ring is axially clamped on the stepped surface of the stepped hole; the insulator is axially passed through the first solder ring downwards, so that the insulator is loaded into a second hole section; a fixing plate arranged above the insulator in the axial direction is moved downwards, so that a limiting hole on the fixing plate is sleeved outside the central conductor of the insulator, so as to limit the radial deviation of the insulator; sintering is performed under the limiting of the fixing plate, and the fixing plate is removed after the sintering is completed, so that the sintering processing of the insulator of the radio frequency assembly is completed. The application can realize the hierarchical radial limiting of the insulator through the positioning cooperation of the stepped hole structure and the first solder ring.

Description

Technical Field

[0001] This invention relates to the field of radio frequency component manufacturing technology, and in particular to a radio frequency component and a method for sintering its insulators. Background Technology

[0002] In the hermetic assembly process of radio frequency components, the sintering and fixing of the insulator to the metal shell is the core process for realizing the extraction of internal radio frequency signals and ensuring the hermetic performance and electrical reliability of the components.

[0003] The currently common insulator sintering process in the industry is as follows: First, the insulator is inserted into the mounting hole of the shell. Then, a solder ring is placed inside the mounting hole, covering the gap between the insulator and the mounting hole. A fixing plate is fastened to the top of the insulator, and the insulator is radially constrained by the limiting holes on the fixing plate to prevent the insulator from tilting during sintering. Finally, high-temperature sintering is performed to complete the fixing.

[0004] However, this solution presents an irreconcilable contradiction between positioning and assembly: if the diameter of the limiting hole on the fixing plate is too large, the radial limiting effect on the insulator is insufficient, and the insulator is easily pushed off-center during the melting of the solder and the volatilization of the flux, resulting in poor welding consistency; if the diameter of the limiting hole is strictly matched with the outer diameter of the insulator, since the insulator must be installed first and then the fixing plate is fastened, it is difficult to quickly align the limiting hole and the insulator, requiring manual adjustment one by one, resulting in extremely low assembly efficiency. Especially in the scenario of batch sintering of multiple insulators, a single fixing plate needs to correspond to multiple insulators at the same time, and the fastening difficulty of the small-diameter fixing plate is greatly increased, making it unsuitable for the needs of large-scale production and always difficult to balance assembly efficiency and positioning accuracy. Summary of the Invention

[0005] This invention provides a radio frequency component and its insulator sintering method to solve the problem of low production efficiency in existing high-precision insulator sintering and fixing methods.

[0006] In a first aspect, embodiments of the present invention provide a method for sintering an insulator for a radio frequency (RF) component, wherein the outer shell of the RF component is provided with a stepped hole; the stepped hole includes a first hole segment and a second hole segment coaxially arranged from top to bottom; the inner diameter of the first hole segment is larger than the inner diameter of the second hole segment; the method includes: inserting a first solder ring into the first hole segment from one side, so that the first solder ring is axially engaged on the stepped surface of the stepped hole; wherein the outer diameter of the first solder ring matches the inner diameter of the first hole segment; the inner diameter of the first solder ring matches the outer diameter of the insulator of the insulator; and sintering the insulator... The insulator passes axially downward through the first solder ring, allowing the insulator to be installed into the second hole segment. The outer diameter of the insulator is smaller than the inner diameter of the second hole segment. After installation, the upper end of the insulator is not lower than the lower end of the first solder ring, so that the first solder ring radially limits the insulator. The fixing plate located axially above the insulator is moved downward, so that the limiting hole on the fixing plate is fitted outside the center conductor of the insulator, thereby limiting the radial displacement of the insulator. Sintering is performed under the limiting of the fixing plate. After sintering, the fixing plate is removed, completing the sintering process of the insulator for the radio frequency assembly.

[0007] In one possible implementation, the stepped hole includes a third hole segment located below the second hole segment and coaxial with the second hole segment; the inner diameter of the third hole segment is smaller than the outer diameter of the insulator and greater than or equal to the outer diameter of the central conductor.

[0008] In one possible implementation, the inner diameter of the third aperture segment matches the outer diameter of the center conductor; the height of the second aperture segment is greater than the distance from the lower end of the insulator to the lower end of the center conductor.

[0009] In one possible implementation, after installation, the upper end of the insulator is not lower than the upper end of the first solder ring and not higher than the upper end of the first hole segment.

[0010] In one possible implementation, the step of moving the fixing plate located axially above the insulator downwards so that the limiting hole on the fixing plate fits onto the outside of the center conductor of the insulator includes: moving the fixing plate located axially above the insulator downwards so that the limiting hole on the fixing plate fits onto the outside of the center conductor of the insulator; after the limiting hole fits onto the center conductor, continuing to move the fixing plate downwards until the lower surface of the fixing plate contacts the lower protrusion.

[0011] In one possible implementation, after inserting the first solder ring into the first hole segment from one side, the method further includes: providing a second solder ring coaxial with the first hole segment on the outer surface of the outer shell at the opening of the first hole segment, wherein the outer diameter of the second solder ring is larger than the inner diameter of the first hole segment; the second solder ring is in direct contact with the first solder ring; and the first solder ring and the second solder ring have the same melting point.

[0012] In one possible implementation, the axial cross-sections of the first solder ring and the second solder ring are rectangular; the lower surface of the second solder ring near the axis contacts the upper surface of the first solder ring away from the axis; the inner diameter of the second solder ring is smaller than the inner diameter of the first hole segment and larger than the inner diameter of the first solder ring; the height of the first solder ring is not lower than the height of the first hole segment.

[0013] In one possible implementation, the axial cross-sections of the first solder ring and the second solder ring are rectangular; the lower part of the inner side of the second solder ring contacts the upper part of the outer side of the first solder ring; the inner diameter of the second solder ring is equal to the inner diameter of the first hole segment; and the height of the first solder ring is higher than the height of the first hole segment.

[0014] In one possible implementation, the axial cross-section of the first solder ring is rectangular; the axial cross-section of the second solder ring is ┐-shaped; the lower surface of the second solder ring near the axis contacts the upper surface of the first solder ring away from the axis; and the lower part of the inner side of the second solder ring contacts the upper part of the outer side of the first solder ring.

[0015] In a second aspect, embodiments of the present invention provide a radio frequency (RF) component, the RF component including a housing and an insulator; the insulator is sintered onto the housing by an insulator sintering method for an RF component as described in any one of the first aspects.

[0016] This invention addresses the technical problem of balancing positioning accuracy and assembly efficiency in existing insulator sintering processes by using a stepped hole structure in conjunction with the positioning of the first solder ring to achieve graded radial positioning of the insulator.

[0017] First, the stepped surface of the stepped hole axially supports the first solder ring. Through the matching fit between the inner diameter of the first solder ring and the outer diameter of the insulator, the first solder ring can achieve radial pre-positioning of the insulator before the installation of the fixing plate and during insulator assembly. The pre-positioned insulator has its center conductor position aligned with the position of the fixing plate's limiting hole, facilitating rapid installation of the fixing plate. This embodiment of the invention avoids the limitation of traditional methods that rely entirely on the fixing plate's opening for positioning. It eliminates the need to manually align the fixing plate's limiting hole with the insulator's center conductor, resolving the inherent contradiction that "too large an opening results in poor positioning, while too small an opening increases assembly difficulty."

[0018] Secondly, the radial position of the pre-positioned insulator is stable, and the fixing plate only needs to connect the smaller diameter center conductor through the limiting hole to complete the secondary positioning in the sintering stage, which greatly reduces the difficulty of aligning the fixing plate; especially in the scenario of batch sintering of multiple insulators, a single fixing plate can be quickly aligned and fastened without the need for manual adjustment of each one, which significantly improves the assembly efficiency and welding consistency of batch products.

[0019] Third, the first solder ring serves the dual function of assembling positioning components and welding solder, eliminating the need for additional special positioning fixtures. During the sintering process, the solder melts and fills the installation gap between the insulator and the shell, simultaneously completing the welding and fixing process, which is simple. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a radio frequency component provided in an embodiment of the present invention; Figure 2 This is a flowchart illustrating the implementation of an insulator sintering method for a radio frequency component provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the first solder ring after assembly according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the assembled insulator provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the assembled structure of the fixing plate provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the insulator height relationship structure provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the assembled structure of the second solder ring provided in an embodiment of the present invention; Figure 8 This is another structural schematic diagram of the second solder ring after assembly provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the third structure after the second solder ring is assembled, as provided in the embodiment of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand this solution, the technical solutions in the embodiments of this solution will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this solution, not all of them. Based on the embodiments of this solution, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this solution.

[0022] The term "comprising" and any other variations thereof in the specification, claims, and accompanying drawings of this invention mean "including but not limited to," and are intended to cover a non-exclusive inclusion, not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc., are used to distinguish different objects, not to describe a specific order.

[0023] The implementation of the present invention will be described in detail below with reference to the accompanying drawings: This solution is applied to radio frequency (RF) components (such as microwave components). RF components are core components used for signal transmission and conversion in wireless communication, radar, and other equipment. RF components need to extract electrical signals internally while ensuring a sealed cavity and structural stability; therefore, they are generally composed of two basic components: a housing and insulators.

[0024] The housing serves as the carrier substrate for the RF component, and is typically made of metal or ceramic. It provides structural support and electromagnetic shielding, while also maintaining a sealed environment inside the component. Mounting holes are provided on the housing for installing insulators; the two are generally connected and secured using a sintering process.

[0025] An insulator mainly consists of an insulator body and a center conductor. The center conductor is responsible for transmitting radio frequency signals, while the insulator isolates the center conductor from the housing to prevent electrical short circuits and also shares the structural stress. The insulator is assembled into the mounting holes in the housing, and its position is fixed and sealed by a bonding layer formed by sintering.

[0026] This solution employs a solder sintering connection method. High temperatures melt the solder, and the wetting properties of the molten solder fill the gap between the insulator and the shell. After the temperature drops and the solder solidifies, the insulator and shell are bonded together. It is important to note that a gap must be maintained between the insulator and the shell to allow the molten solder to fill it.

[0027] During the soldering process between the insulator and the shell, a gap exists between them. Under high-temperature conditions, factors such as the flow of molten solder and the airflow generated by the heated flux can easily cause the insulator to shift and become centered. To mitigate this, the industry commonly uses fixing plates with limiting holes to radially constrain the insulator, thereby reducing the likelihood of tilting.

[0028] In actual production, the opening size of this type of fixing plate can cause problems in use. If the diameter of the limiting hole of the fixing plate is set too large, there will be too much room for movement between the limiting hole and the insulator, which will weaken the radial restraint effect on the insulator and make it difficult to effectively control the position of the insulator. If the diameter of the limiting hole is set too small, although the radial restraint effect is improved, due to the assembly sequence, when the insulator is installed into the housing first and then the fixing plate is fastened from above, the limiting hole is not easy to align with the insulator, and manual adjustment is often required.

[0029] When mass production begins, and the same mounting plate needs to be used to fix multiple insulators, the above problems become more apparent, increasing the overall assembly difficulty.

[0030] Therefore, the core problem with the current process lies in the centering and positioning of the insulators. How to reduce the assembly difficulty of the fixing plate while ensuring the effective positioning of the insulators during sintering is the technical challenge that this solution needs to address.

[0031] Unlike traditional assembly methods, this solution relies on the stepped holes in the housing and the solder ring to form a mating structure. First, the solder ring is used to radially limit the insulator, and then a fixing plate is used to assist in constraining the position. The whole process ensures the convenience of assembly while also allowing the insulator to maintain a relatively stable posture during the sintering stage, ultimately completing the assembly and molding of the RF component.

[0032] The embodiments of the present invention achieve radial positioning of the insulator before the installation of the fixing plate by using the stepped hole structure and the positioning cooperation of the first solder ring, so as to solve the technical problem that it is difficult to balance the positioning accuracy and assembly efficiency of the fixing plate in the existing insulator sintering process.

[0033] Figure 1 This is a schematic diagram of the structure of a radio frequency component provided in an embodiment of the present invention. (Refer to...) Figure 1 The radio frequency component has a stepped hole 1 on its housing; the stepped hole 1 includes a first hole segment 11 and a second hole segment 12 arranged coaxially from top to bottom; the inner diameter of the first hole segment 11 is larger than the inner diameter of the second hole segment 12.

[0034] Combined with appendix Figure 1 The radio frequency component housing structure in this embodiment is described below. The housing has mounting holes for assembling insulators; in this design, conventional straight holes are transformed into stepped hole structures. An insulator is sintered within the stepped hole 1.

[0035] The stepped hole 1 includes at least a first hole segment 11 and a second hole segment 12 with coincident axes. The inner diameters of the two hole segments differ, with the first hole segment 11 having a larger internal space. At the junction of the first hole segment 11 and the second hole segment 12, an annular stepped surface is formed around the hole. This stepped surface is the radial end face between the two hole segments and is also the key part for the formation of the stepped structure.

[0036] The purpose of this stepped hole structure is primarily to provide a bearing position and a mating basis for subsequent component assembly. The two sections of holes with different diameters, combined with the annular stepped surface at the joint, provide axial support for the components inserted into the holes. At the same time, the different hole diameters create a dimensional fit, providing structural conditions for positional constraints during the insulator assembly process and facilitating the subsequent layer-by-layer assembly of the solder ring and insulator.

[0037] Figure 2 This is a flowchart illustrating the implementation of an insulator sintering method for a radio frequency component according to an embodiment of the present invention. (Refer to...) Figure 2 The method includes: Step 201: Insert the first solder ring 2 into the first hole segment 11 from one side, so that the first solder ring 2 is axially locked on the stepped surface of the stepped hole 1; wherein, the outer diameter of the first solder ring 2 matches the inner diameter of the first hole segment 11; the inner diameter of the first solder ring 2 matches the outer diameter of the insulator 31 of the insulator 3. Figure 3 This is a schematic diagram of the assembled structure of the first solder ring 2 provided in an embodiment of the present invention; see reference. Figure 3 In conjunction with the stepped hole structure of this embodiment, the assembly process and dimensional matching logic of the first solder ring 2 are explained as follows: In this step, the insertion direction of the first solder ring 2 is the axial opening end of the first hole segment 11 of the stepped hole 1, that is, the end face opening on the side with the larger diameter of the stepped hole 1. Since the inner diameter of the first hole segment 11 is larger than the inner diameter of the second hole segment 12, and the outer diameter of the first solder ring 2 is between the two, it cannot pass through the second hole segment 12. Therefore, it can only be inserted from the axial opening end where the first hole segment 11 is located, and placed downward along the axial direction of the hole. Finally, the lower end face of the first solder ring 2 rests on the annular step surface at the junction of the first hole segment 11 and the second hole segment 12, forming an axial limit. It should be noted that during the installation process, the opening direction of the stepped hole 1 is upward, that is, the first hole segment 11 side of the stepped hole 1 faces upward.

[0038] For example, the first solder ring 2 is generally circular; the axial section of the first solder ring 2 is rectangular, forming surface contact with the annular step surface. The axial section is the section parallel to the axial direction.

[0039] The design logic for the two dimensional matching points is as follows: First, the outer diameter of the first solder ring 2 matches the inner diameter of the first hole segment 11. This fit ensures that the radial position of the solder ring is constrained after installation, preventing significant displacement within the first hole segment 11 and helping to maintain its centered position, providing a stable positioning reference for the subsequent assembly of the insulator 3. For example, the outer diameter of the first solder ring 2 is the same as the inner diameter of the first hole segment 11. Second, the inner diameter of the first solder ring 2 matches the outer diameter of the insulator body 31 of the insulator 3. When the insulator 3 is axially inserted into the solder ring, the inner circumferential surface of the solder ring can fit with the outer circumferential surface of the insulator body 31, applying radial constraint to the insulator 3. This allows the insulator 3 to maintain a relatively centered posture during assembly, eliminating the need for manual adjustment. For example, the inner diameter of the first solder ring 2 is the same as the outer diameter of the insulator body 31 of the insulator 3.

[0040] With the above-mentioned dimensional matching, the first solder ring 2 serves as both a welding raw material and a radial positioning component before sintering, eliminating the need for additional dedicated positioning parts for the insulator 3.

[0041] Step 202: Pass the insulator 3 through the first solder ring 2 axially downwards, so that the insulator 31 is installed into the second hole section 12; the outer diameter of the insulator 31 is smaller than the inner diameter of the second hole section 12; after installation, the upper end of the insulator 31 is not lower than the lower end of the first solder ring 2, so that the first solder ring 2 radially limits the insulator 31.

[0042] Figure 4 This is a schematic diagram of the assembled structure of the insulator 3 provided in an embodiment of the present invention; see reference. Figure 4 For example, the insulator 3 is composed of a columnar insulator 31 and a center conductor 32. The center conductor 32 is disposed through the axis of the insulator 31, and the end of the center conductor 32 extends axially out of the end face of the insulator 31. For example, the upper end of the center conductor 32 extends axially out of the upper end face of the insulator 31 to form a fit with the limiting hole of the fixing plate in a subsequent step.

[0043] During assembly, the insulator 3 is inserted downwards along the axial direction of the stepped hole 1, starting from the opening end of the first hole section 11: first passing through the first solder ring 2 pre-supported on the annular stepped surface, and then continuing downwards, allowing the insulator 31 to enter the interior of the second hole section 12. It should be noted that the inner diameter of the first solder ring 2 matches the outer diameter of the insulator 31, thus allowing the insulator 31 to smoothly pass through the first solder ring 2 and enter the interior of the second hole section 12.

[0044] The design logic for the fit of each dimension is as follows: First, the outer diameter of the insulator 31 is smaller than the inner diameter of the second hole segment 12. This dimensional relationship ensures that the insulator 3 can be smoothly installed into the second hole segment 12, reducing the probability of assembly jamming. On the other hand, it can form an annular gap between the insulator 31 and the inner wall of the second hole segment 12. This gap can accommodate the molten solder during the sintering process. After the solder cools and solidifies, the insulator 3 can be fixed and sealed to the outer shell.

[0045] Second, after installation, the upper end of the insulator 31 should not be lower than the lower end of the first solder ring 2. This dimensional condition is a necessary prerequisite for the first solder ring 2 to form a radial limit on the insulator 31. The essence of radial constraint is that the inner circumferential surface of the first solder ring 2 and the outer circumferential surface of the insulator 31 form a cylindrical fit, limiting the radial displacement of the insulator 31 through the contact surface. Only when the upper end of the insulator 31 is not lower than the lower end of the first solder ring 2 will the cylindrical surfaces of the two form an axially overlapping fit area, and only then can the solder ring play a radial constraint role. In actual implementation, the axial fit length between the two can be set according to the positioning accuracy requirements. The longer the fit length, the better the stability of the radial limit.

[0046] Regarding the axial positioning of insulator 3, in the implementation logic of this scheme, it can be constrained by two structures: First, a receiving structure can be set at the bottom of the second hole section 12 to limit the downward limit position of insulator 3; second, the fixing plate assembled later can apply axial restraint to insulator 3 to prevent axial movement of insulator 3 due to factors such as solder flow and furnace airflow during sintering, thus ensuring the stability of the assembly position. The above two constraints will be described in detail in the following embodiments.

[0047] Step 203: Move the fixing plate 4 located axially above the insulator 3 downwards, so that the limiting hole 41 on the fixing plate 4 is fitted onto the outside of the center conductor 32 of the insulator 3, so as to limit the radial displacement of the insulator 3. Figure 5 This is a schematic diagram of the assembled structure of the fixing plate 4 provided in an embodiment of the present invention; see reference. Figure 5 This step is used to complete the secondary radial limiting assembly before sintering. The adaptation form of the fixing plate 4 can be flexibly selected according to the production scenario: an independent fixing plate 4 can be set for a single insulator 3 on a single shell, or multiple insulators 3 on the same shell can be constrained by a single fixing plate 4, or a whole plate of fixing plates 4 can be used to adapt to batch sintering scenarios of multiple sets of shells. For ease of explanation, this embodiment takes the scenario of a single fixing plate 4 corresponding to a single insulator 3 as an example to illustrate the implementation logic of the limiting.

[0048] It should be noted that during implementation, the fixing plate 4 can be relatively positioned with the RF component housing through the matching frame structure, so that the limiting hole 41 on the fixing plate 4 is aligned with the axis of the stepped hole 1 on the housing. The inner diameter of the limiting hole 41 can be flexibly set according to factors such as the positioning accuracy of the fixing plate 4 and the machining tolerance of the center conductor 32, and is usually not less than the outer diameter of the center conductor 32.

[0049] In the preceding process, the first solder ring 2 has already completed the radial pre-positioning of the insulator 3, keeping the insulator 3 in a centered state, with the axis of the central conductor 32 basically coinciding with the axis of the stepped hole 1. Therefore, when the fixing plate 4 moves downward along the axial direction, the limiting hole 41 can be smoothly fitted into the outside of the central conductor 32 without the need for repeated manual adjustments to the alignment position, effectively reducing the assembly difficulty; especially in the case of batch production of multiple insulators 3, this pre-positioning function can significantly improve the efficiency of the pressure plate fastening.

[0050] After the limiting hole 41 is fitted into the center conductor 32, the radial displacement of the entire insulator 3 can be indirectly limited by constraining the radial movement range of the center conductor 32. This limiting effect mainly plays a role in the sintering heating stage: as the temperature rises, the first solder ring 2 gradually melts, and its pre-positioning effect gradually weakens. At this time, the fixing plate 4 takes over the radial constraint function, which can prevent the insulator 3 from tilting due to factors such as the flow of molten solder and the vaporization of flux, and ensure the centering state of the insulator 3 throughout the sintering process.

[0051] It should be noted that the core function of the fixing plate 4 is to radially limit the insulator 3. To ensure the stability of the limiting effect throughout the sintering process, an axial locking structure is required to prevent the fixing plate 4 from axially lifting or shifting due to factors such as airflow disturbance in the furnace and surface tension generated by the melting solder. This part is part of the process support design, and the specific implementation can be flexibly selected according to the production scenario.

[0052] Step 204: Sintering is performed under the constraint of the fixed plate 4. After sintering is completed, the fixed plate 4 is removed to complete the sintering process of the insulator 3 of the radio frequency component.

[0053] This step is the final welding and curing process between insulator 3 and the outer shell, achieving a stable connection between the two through high-temperature sintering.

[0054] After the assembled RF component enters the sintering process, the fixing plate 4 maintains its relative position after assembly throughout the heating, holding, and cooling processes, continuously applying radial constraint to the center conductor 32. The core logic of this setting lies in the phased limiting relay: as the sintering temperature rises above the solder melting point, the first solder ring 2 gradually melts from a solid state, and the radial pre-positioning effect played in the assembly stage gradually diminishes; at this time, the fixing plate 4 takes over the radial limiting function, which can constrain the range of motion of the insulator 3, reduce the risk of positional displacement caused by factors such as molten solder flow and flux volatilization airflow, and maintain the centered posture of the insulator 3.

[0055] During the sintering process, the molten solder will wet and fill the annular gap between the insulator 31 and the inner wall of the second hole section 12. After the temperature gradually drops and the solder cools and solidifies, a continuous welded bonding layer is formed between the insulator 3 and the shell, which not only achieves structural fixation but also ensures the airtightness and electrical isolation requirements of the component.

[0056] After the components have cooled sufficiently and the welded structure has stabilized, remove the fixing plate 4, thus completing the sintering process of the insulator 3 for this RF component. For a detailed structure, please refer to [reference needed]. Figure 1 .

[0057] This invention addresses the technical problem of balancing positioning accuracy and assembly efficiency in the existing insulator 3 sintering process by using a stepped hole structure in conjunction with the positioning of the first solder ring 2 to achieve graded radial positioning of the insulator 3.

[0058] First, the stepped surface of the stepped hole axially supports the first solder ring 2. Through the matching fit between the inner diameter of the first solder ring 2 and the outer diameter of the insulator 31, the first solder ring 2 can achieve radial pre-positioning of the insulator 3 before the installation of the fixing plate 4 and during the assembly of the insulator 3. The pre-positioned insulator 3 has its center conductor 32 aligned with the position of the limiting hole 41 of the fixing plate 4, which facilitates the rapid installation of the fixing plate 4. This embodiment of the invention avoids the limitation of the traditional method that relies entirely on the opening of the fixing plate 4 for positioning. It eliminates the need to manually align the limiting hole 41 of the fixing plate 4 with the center conductor 32 of the insulator 3, thus solving the inherent contradiction that "if the opening of the fixing plate 4 is too large, the positioning effect is poor; if it is too small, the assembly difficulty is high."

[0059] Secondly, the radial position of the pre-positioned insulator 3 is stable, and the fixing plate 4 only needs to be fitted with the smaller diameter center conductor 32 through the limiting hole 41 to complete the secondary positioning in the sintering stage, which greatly reduces the difficulty of aligning the fixing plate 4; especially in the scenario of batch sintering of multiple insulators 3, a single fixing plate 4 can be quickly aligned and fastened without manual adjustment, which significantly improves the assembly efficiency and welding consistency of batch products.

[0060] Third, the first solder ring 2 serves the dual function of assembling and positioning components and welding solder, eliminating the need for additional special positioning fixtures. During the sintering process, the solder melts and fills the installation gap between the insulator 3 and the shell, simultaneously completing the welding and fixing process, which is simple.

[0061] Since the fit gap between the insulator 31 and the second hole segment 12 is small, it is difficult to place an independent solder ring at the lower end of the hole to achieve the limit. Therefore, the axial constraint and radial auxiliary positioning of the lower end of the insulator 3 are usually achieved by optimizing the shell structure and using external tooling. The following describes the different implementation methods.

[0062] One implementation is provided below: bottom auxiliary fixture for lifting and limiting.

[0063] This method does not require modification of the hole structure of the shell itself, and the second hole section 12 can retain its straight-through shape. During sintering and assembly, a positioning fixture is set at the bottom of the shell. The fixture is machined with a positioning structure that is coaxial with the stepped hole 1. By supporting the lower end face of the insulator 31 or constraining the lower section of the central conductor 32, the axial movement and radial displacement of the insulator 3 are restricted.

[0064] The essence of this solution is to transfer the limiting function to a reusable external tooling, without requiring additional modifications to the housing structure, which can reduce the processing difficulty and cost of the housing; at the same time, the fixture can be flexibly replaced according to different insulator specifications, adapting to multi-category small-batch production scenarios.

[0065] Another implementation is provided below: the stepped hole 1 includes a third hole segment 13 located below the second hole segment 12 and coaxial with the second hole segment 12; the inner diameter of the third hole segment 13 is smaller than the outer diameter of the insulator 31 and greater than or equal to the outer diameter of the center conductor 32.

[0066] Reference Figure 3 The three-stage stepped hole (third hole segment 13) is limited by the shell structure itself to achieve the lower end limit. Along the axial direction of the stepped hole 1, from the first hole segment 11 to the bottom of the hole, the first hole segment 11, the second hole segment 12 and the third hole segment 13 are arranged coaxially in sequence. The inner diameter of the three holes decreases in sequence. The connection between the second hole segment 12 and the third hole segment 13 forms a lower annular step surface.

[0067] The dimensional matching logic is as follows: the inner diameter of the third hole segment 13 is smaller than the outer diameter of the insulator 31, but not smaller than the outer diameter of the center conductor 32. After the insulator 3 is installed into the channel, the lower end face of the insulator 31 will abut against the lower annular step surface, thereby restricting the axial downward displacement of the insulator 3 and completing the axial positioning; the center conductor 32 can extend into the interior of the third hole segment 13 without causing structural interference with the hole wall.

[0068] The essence of this solution is to utilize an integrated stepped structure with decreasing aperture, replacing additional limiting components with fixed stepped surfaces to achieve lower-end load-bearing without occupying radial fit gaps. The stepped structure can be machined simultaneously with the upper hole section, resulting in good process continuity and making it suitable for scenarios with ample machining allowance for the shell.

[0069] The following explains how to improve the positioning of the lower end of the insulator 3 when the third hole section 13 is set.

[0070] In one possible implementation, the inner diameter of the third aperture segment 13 matches the outer diameter of the center conductor 32; the height of the second aperture segment 12 is greater than the distance from the lower end of the insulator 31 to the lower end of the center conductor 32.

[0071] For example, the inner diameter of the third hole segment 13 is equal to the outer diameter of the center conductor 32.

[0072] The inner diameter of the third hole segment 13 matches the outer diameter of the center conductor 32. The logic behind this design is to create a coordinated radial positioning with the upper first solder ring 2: the upper first solder ring 2 hugs the outer circumference of the insulator 31, completing the pre-centering of the upper part of the insulator 3; after the lower center conductor 32 extends into the third hole segment 13, the inner wall of the third hole segment 13 forms a circumferential constraint on the center conductor 32, achieving radial positioning of the lower part of the insulator 3. The combined effect of these two positioning points improves the overall coaxiality of the insulator 3 and reduces the probability of the insulator 3 tilting during sintering.

[0073] Meanwhile, the height of the second hole segment 12 is greater than the distance from the lower end of the insulator 31 to the lower end of the center conductor 32. This ensures that when the lower end of the insulator 31 has just passed through the first solder ring 2 and completed pre-alignment, the center conductor 32 has not yet passed through the third hole segment 13. Furthermore, with the insulator 31 in the pre-aligned state, the axis of the center conductor 32 is aligned with the axis of the third hole segment 13. The center conductor 32 can be smoothly introduced into the third hole segment 13 along the axis without significantly increasing the assembly difficulty due to the high precision requirements of the lower end, thus balancing positioning accuracy and assembly convenience.

[0074] The essence of this solution is to rely on the stepped structure of the shell itself to achieve lower positioning by using the cooperation of the central conductor 32 and the third hole segment 13 without adding additional lower limiting parts, thus complementing the positioning function of the upper solder ring; the matching of height dimensions ensures that the positioning structure can play an effective role.

[0075] The above describes how the lower end of insulator 3 is fixed. The following describes how the upper end of insulator 3 is fixed.

[0076] In one possible implementation, after installation, the upper end of the insulator 31 is not lower than the upper end of the first solder ring 2, and not higher than the upper end of the first hole segment 11.

[0077] Figure 6 This is a schematic diagram of the height relationship structure of the insulator 31 provided in an embodiment of the present invention; see reference. Figure 6 It should be noted that, after assembly, the upper end face of the insulator 31 is not lower than the upper end face of the first solder ring 2 in the axial direction, and not higher than the upper end face of the first hole segment 11. This dimensional design can simultaneously improve the radial positioning effect and the solder flow control capability, and the logical essence is explained below.

[0078] 1. The requirement in the above text that "the upper end of the insulator 31 is not lower than the lower end of the solder ring" only ensures that there is an axial mating section between the two, which can achieve basic radial restraint. In this embodiment, the upper end of the insulator 31 is raised to be no lower than the upper end of the solder ring, which means that the entire axial height of the first solder ring 2 forms a cylindrical mating with the outer circumferential surface of the insulator 31. The effective length of the circumferential contact is longer, and the radial restraint effect is more stable. With the increase in the mating length, the centering posture of the insulator 3 is less affected by assembly disturbances, the positioning accuracy is improved, and it can also provide more accurate guidance for the subsequent insertion of the center conductor 32 into the lower positioning structure, reducing the probability of assembly jamming.

[0079] 2. Provided that the solder ring itself has enough solder to fill the weld gap, this size fit can form a two-way enclosure structure, reducing the probability of abnormal solder overflow.

[0080] On the one hand, the upper end of the insulator 31 is higher than the upper end of the solder ring, which is equivalent to forming a barrier structure that is higher than the solder layer on the radial inner side of the solder ring. After the solder melts, it is not easy to overflow towards the center of the insulator 3 due to the surface tension and the barrier of the inner wall, which can reduce the risk of solder contaminating the central conductor 32 and affecting the electrical performance.

[0081] On the other hand, the upper end of the insulator 31 does not extend beyond the upper end face of the first hole segment 11, and in conjunction with the circumferential sidewall of the first hole segment 11, it can form a barrier on the radially outer side of the solder ring. When the solder melts and diffuses, the hole wall can restrict the solder from overflowing to the end face of the outer shell, which helps to maintain a stable amount of solder in the welding area and reduce solder waste and subsequent cleaning work.

[0082] 3. The axial height of the first solder ring 2 can be flexibly designed according to the solder usage requirements, and there are several feasible options for the positional relationship between its upper end and the upper end of the first hole section 11: If the amount of solder required is small, the height of the solder ring can be set to be less than the depth of the first hole section 11. The solder ring is completely contained inside the first hole section 11, and the outer enclosure effect is better, so the solder is less likely to overflow. If it is necessary to increase the solder supply, the upper end of the solder ring can be set to be flush with the upper end of the first hole section 11, maximizing the solder volume without protruding out of the hole.

[0083] This embodiment achieves dual functions of positioning and solder control by matching the axial dimensions of the stepped hole 1 and the insulator 3, eliminating the need for additional material blocking structures and improving process reliability without increasing the number of parts.

[0084] In one possible implementation, the step of moving the fixing plate 4, which is located axially above the insulator 3, downward so that the limiting hole 41 on the fixing plate 4 is fitted onto the outside of the center conductor 32 of the insulator 3 includes: moving the fixing plate 4, which is located axially above the insulator 3, downward so that the limiting hole 41 on the fixing plate 4 is fitted onto the outside of the center conductor 32 of the insulator 3; after the limiting hole 41 fits onto the center conductor 32, continuing to move the fixing plate 4 downward until the lower surface of the fixing plate 4 contacts the lower protrusion.

[0085] This implementation further limits the downward assembly process of the fixing plate 4: after the center conductor 32 is inserted into the limiting hole 41, the fixing plate 4 continues to move downward along the axial direction until the lower surface of the fixing plate 4 contacts the stop protrusion structure below. This assembly design has two functions: first, it provides a clear axial installation reference for the fixing plate 4, ensuring the consistency of the assembly position in mass production; second, it can constrain the solder below through end face contact, reducing the risk of solder overflow during sintering.

[0086] Regarding the lower protruding stop structure, there are several possible implementation forms, which can be flexibly selected according to process requirements: The first method uses the upper peripheral end face of the first hole segment 11 on the outer shell as the positioning reference. This structure is a solid end face of the shell itself, and the fixing plate 4 stops after descending to the lower surface and fitting against the end face of the outer shell. The positioning reference in this method is directly formed by machining the shell, and the position is stable and reliable, making it suitable for mass production scenarios with high requirements for assembly consistency. In this structure, the fixing plate 4 mainly achieves axial positioning through the shell, and the constraint effect on the internal solder ring is relatively indirect.

[0087] The second method uses the upper end face of the first solder ring 2 as the stopping reference. During the downward movement of the fixing plate 4, its lower surface directly abuts against the upper end face of the first solder ring 2, which serves as the endpoint of the downward movement. The essence of this method is to allow the fixing plate 4 to directly apply axial constraint to the first solder ring 2: in the initial stage of sintering heating, it can fix the axial position of the solder ring, reducing the possibility of displacement; during the solder melting stage, the lower end face of the fixing plate 4 can form an axial barrier, restricting the upward and outward overflow of molten solder, while guiding the solder to flow downwards into the gap between the insulator 3 and the shell, which helps improve the filling efficiency and welding sealing effect of the solder. When using this method, the fixing plate 4 does not need to contact the end face of the shell; a gap can be left between them, and the stopping position is determined by the axial height of the first solder ring 2.

[0088] It should be noted that the core function of the fixing plate 4 in the basic scheme is to limit the radial displacement of the insulator 3, and it is not necessary for it to form end face contact with the structure below. If only the radial limiting requirement needs to be met, the fixing plate 4 can stay at the corresponding axial position of the center conductor 32, as long as the limiting hole 41 and the center conductor 32 form an effective fit. The axial stop design in this implementation is an optimization and supplement based on the radial limiting, and can be selected according to the actual requirements of solder control and assembly consistency.

[0089] In one possible implementation, after the first solder ring 2 is inserted into the first hole segment 11 from one side, the method further includes: providing a second solder ring 5 coaxial with the first hole segment 11 on the outer surface of the outer shell at the opening of the first hole segment 11, wherein the outer diameter of the second solder ring 5 is larger than the inner diameter of the first hole segment 11; the second solder ring 5 is in direct contact with the first solder ring 2; and the first solder ring 2 and the second solder ring 5 have the same melting point.

[0090] This implementation method is suitable for scenarios where the gap between the insulator 3 and the shell is large and a large amount of solder is required. By adding an external second solder ring 5, the amount of solder supplied can be supplemented without increasing the size of the shell hole or the height of the solder ring inside the hole.

[0091] Figure 7 This is a schematic diagram of the assembled structure of the second solder ring 5 provided in an embodiment of the present invention; see reference. Figure 7 It should be noted that the second solder ring 5 is coaxially arranged on the end face of the outer shell where the opening of the first hole section 11 is located. Its outer diameter is larger than the inner diameter of the first hole section 11. Therefore, the whole ring is located on the outer shell surface outside the stepped hole 1 and cannot fall into the channel.

[0092] The assembly sequence is as follows: After inserting the first solder ring 2 into the stepped hole 1 and supporting it on the annular stepped surface, the second solder ring 5 is placed on the outer shell end face at the opening of the first hole segment 11, so that the second solder ring 5 is in direct contact with the upper end face of the first solder ring 2, ensuring that a stable heat conduction and solder connection path is formed between the two. For example, the insulator 3 is installed before the second solder ring 5 is placed. With this assembly sequence, the inner diameter of the second solder ring 5 only needs to match the radial dimension of the first solder ring 2, without needing to avoid the assembly path of the insulator 3, allowing for more flexible size design. Alternatively, the insulator 3 is installed after the second solder ring 5 is placed.

[0093] It should be further noted that increasing the solder amount solely by increasing the volume of the first solder ring 2 has two limitations: First, if the axial height of the solder ring is simply increased, the solder is prone to collapse in the molten state and overflow along the upper end of the insulator 31 toward the central conductor 32, which may affect the electrical performance; Second, if the radial dimension of the solder ring is increased, the inner diameter of the first hole segment 11 needs to be increased accordingly, which will increase the overall space occupied by the housing and is not conducive to the miniaturization design of the RF components.

[0094] By adopting a double solder ring structure with the hole inside and outside, the additional solder supply can be transferred to the outer end face of the housing, breaking through the limitation of the limited space inside the hole, while avoiding the overflow risk caused by the excessive volume of a single ring.

[0095] It should also be noted that the first solder ring 2 and the second solder ring 5 are made of solder material with the same melting point, and they will reach the melting state simultaneously during the sintering heating process.

[0096] The first solder ring 2, located inside the hole, is adjacent to the mating gap between the insulator 3 and the second hole segment 12. After melting, it will first seep into the gap under the action of capillary action and gravity. Since the two solder rings are in direct contact, the liquid solder of the second solder ring 5 will continuously flow to replenish the area of ​​the first solder ring 2 under the traction of surface tension. Then, guided by the first solder ring 2, it will gradually fill the mating gap below.

[0097] During this process, the first solder ring 2 serves the dual function of filling and guiding the flow, while the second solder ring 5 acts as an external solder reserve to continuously supply solder, ensuring that the solder fills the gap in an orderly and stable manner. This not only guarantees the amount of solder supplied but also reduces the probability of collapse and overflow caused by the concentrated melting of a large amount of solder.

[0098] The following describes different implementations of the end-face contact of the double solder rings.

[0099] Reference Figure 7 In one possible implementation, the axial cross-section of the first solder ring 2 and the second solder ring 5 is rectangular; the inner side of the lower surface of the second solder ring 5 contacts the outer side of the upper surface of the first solder ring 2; the inner diameter of the second solder ring 5 is smaller than the inner diameter of the first hole segment 11 and larger than the inner diameter of the first solder ring 2; the height of the first solder ring 2 is not lower than the height of the first hole segment 11.

[0100] This implementation is a double solder ring end-face contact implementation. The axial cross-sections of the first solder ring 2 and the second solder ring 5 are both rectangular. The two achieve solder conduction through direct contact of the local ring bands on the upper and lower end faces. The specific structure and design logic are as follows.

[0101] Regarding the structural arrangement and contact pattern, it should be noted that, along the axial direction of the stepped hole 1, the first solder ring 2 is accommodated inside the first hole section 11, with its lower end supported on the annular stepped surface; the second solder ring 5 is coaxially arranged on the outer shell end face at the opening of the first hole section 11. The contact area between the two is located on the outer ring band of the upper end face of the first solder ring 2 and the inner ring band of the lower end face of the second solder ring 5, that is, the inner ring portion of the second solder ring 5 is stacked on the outer ring end face of the first solder ring 2, forming a surface contact.

[0102] Regarding the design logic of the radial dimensions, it should be noted that the inner diameter of the second solder ring 5 is set to be smaller than the inner diameter of the first hole segment 11 and larger than the inner diameter of the first solder ring 2. This size range corresponds to two design considerations: First, the inner diameter being smaller than the inner diameter of the first hole segment 11 allows the inner edge of the second solder ring 5 to extend directly above the opening of the first hole segment 11, forming a radially overlapping area with the first solder ring 2 inside the hole, providing space for the upper and lower end faces to contact and ensuring sufficient contact area between the two; Second, the inner diameter being larger than the inner diameter of the first solder ring 2 avoids the second solder ring 5 from extending excessively inward, which will neither obstruct the axial assembly path of the insulator 3 nor hinder the flow of molten solder towards the central gap.

[0103] Regarding the axial height matching logic, it should be noted that the axial height of the first solder ring 2 is set to be no less than the depth of the first hole segment 11. The core purpose of this design is to ensure reliable physical contact between the two solder rings, thus opening up the path for heat conduction and solder transfer. If the height of the first solder ring 2 is lower than the depth of the first hole segment 11, its upper end face will be recessed inside the hole, forming an axial gap with the second solder ring 5 above, making direct contact impossible and hindering continuous solder flow.

[0104] When the height of the first solder ring 2 is equal to the depth of the first hole segment 11, the upper end face of the first solder ring 2 is flush with the end face of the outer shell. At this time, the inner end face of the second solder ring 5 is in contact with the first solder ring 2, and the outer end face is in contact with the surface of the outer shell. The overall support is the most stable, which is the preferred implementation state.

[0105] When the height of the first solder ring 2 is slightly greater than the depth of the first hole section 11, the upper surface of the first solder ring 2 will be slightly higher than the end face of the outer shell. At this time, the inner side of the second solder ring 5 is slightly supported, and there is a small gap between the outer side and the end face of the outer shell. In this state, the second solder ring 5 can still maintain coaxial positioning through inner contact. If combined with the axial constraint of the subsequent fixing plate 4, the positional stability can be further guaranteed, so it is also within the scope of implementation. The limit of not less than covers the reasonable range from flush to slightly higher, which can adapt to different machining tolerances and process requirements.

[0106] The core advantage of the end-face contact method in this embodiment is that the contact area is a continuous planar ring, with a relatively sufficient contact area, more uniform heat conduction during sintering, and better melting synchronization of the two solder rings; at the same time, the molten solder can be smoothly conducted through the entire contact ring, and the flow process is stable, which helps to improve the uniformity of solder filling.

[0107] The following describes a second implementation of the double solder ring end face contact.

[0108] Figure 8 This is a schematic diagram of another structure of the second solder ring 5 after assembly according to an embodiment of the present invention; see reference. Figure 8 In one possible implementation, the axial cross-section of the first solder ring 2 and the second solder ring 5 is rectangular; the lower part of the inner side of the second solder ring 5 contacts the upper part of the outer side of the first solder ring 2; the inner diameter of the second solder ring 5 is equal to the inner diameter of the first hole segment 11; and the height of the first solder ring 2 is higher than the height of the first hole segment 11.

[0109] This implementation is the second contact form of the double solder rings, which adopts a radial cylindrical contact method, different from the aforementioned end face contact form. It can achieve radial self-positioning of the second solder ring 5. The specific structure and design logic are as follows.

[0110] Regarding the structural arrangement and contact pattern, it should be noted that the first solder ring 2 is accommodated within the first segment 11 of the stepped hole 1, with its lower end supported by the annular stepped surface. Furthermore, the axial height of the first solder ring 2 is greater than the depth of the first segment 11. Therefore, the upper part of the first solder ring 2 extends beyond the opening of the first segment 11, protruding outside the end face of the outer casing. The second solder ring 5 is coaxially sleeved on the outer side of the exposed segment of the first solder ring 2. The contact area between the two is a cylindrical fit: the lower part of the inner side of the second solder ring 5 and the upper part of the outer side of the first solder ring 2 are in contact with each other, forming an axially extending circumferential contact surface.

[0111] Regarding the radial dimensions and self-positioning logic, it should be noted that the inner diameter of the second solder ring 5 is set to be equal to the inner diameter of the first hole segment 11. Since the outer diameter of the first solder ring 2 matches the inner diameter of the first hole segment 11, after the second solder ring 5 is fitted, its inner cylindrical surface can form a circumferential fit with the outer cylindrical surface of the first solder ring 2.

[0112] The purpose of this design is to achieve radial self-positioning of the second solder ring 5: during assembly, the second solder ring 5 is simply fitted downward along the exposed section of the first solder ring 2, and the coaxiality is automatically ensured by means of cylindrical mating, without the need for additional adjustment of the centering position, thus improving the ease of assembly; at the same time, during the sintering and heating process, the second solder ring 5 is less prone to radial displacement, and the solder conduction path is more stable.

[0113] Regarding the design logic for axial positioning, it should be noted that relying solely on the side contact of the cylindrical surface can only constrain the radial displacement of the second solder ring 5. Its axial position lacks a clear bearing reference, and there is a possibility of it sliding downwards along the outer surface of the first solder ring 2. Therefore, in actual implementation, an axial stop structure needs to be provided: the lower end face of the second solder ring 5 abuts against the outer end face of the outer shell around the opening of the first hole section 11, with the outer shell end face providing axial support.

[0114] This axial positioning method works in conjunction with the radial cylindrical positioning to constrain the spatial position of the second solder ring 5: the radial position is limited by the outer cylindrical surface of the first solder ring 2, and the lower axial position is supported by the end face of the outer shell, which can ensure the positional stability of the solder ring before sintering and in the early stage of heating.

[0115] Compared to end-face contact, the mating surface of the cylindrical contact in this embodiment extends axially. This results in a larger contact area, a wider path for heat conduction and solder transfer, and better synchronization of melting between the two solder rings. Furthermore, the exposed section of the first solder ring 2 facilitates guidance and positioning, reducing the difficulty of assembling and aligning the second solder ring 5, making it more suitable for mass production scenarios. During the melting process, the liquid solder in the second solder ring 5 can flow downwards along the mating cylindrical surface, flowing into the first solder ring 2 and then filling the mating gap, resulting in stronger guiding properties for the solder flow.

[0116] Figure 9 This is a schematic diagram of the third structure after the second solder ring 5 is assembled according to an embodiment of the present invention. (Refer to...) Figure 9 In one possible implementation, the axial cross-section of the first solder ring 2 is rectangular; the axial cross-section of the second solder ring 5 is ┐-shaped; the inner side of the lower surface of the second solder ring 5 contacts the outer side of the upper surface of the first solder ring 2; and the lower part of the inner side of the second solder ring 5 contacts the upper part of the outer side of the first solder ring 2.

[0117] This implementation is the third contact form of the double solder ring, which adopts a composite mating structure of end face and cylindrical surface, and can simultaneously take into account radial positioning accuracy and solder conduction stability. The specific structure and design logic are as follows.

[0118] Regarding the structural form and contact relationship, it should be noted that the first solder ring 2 still adopts a rectangular axial cross section, is housed inside the first hole section 11, its lower end is supported on the annular step surface, and its upper part can extend out of the opening of the first hole section 11. The axial cross section of the second solder ring 5 is ┐-shaped, consisting of a radially extending horizontal ring section and an axially extending vertical ring section combined into one unit, and the whole is coaxially arranged at the opening of the first hole section 11.

[0119] The two components form two mutually perpendicular contact points: firstly, the inner region of the lower surface of the horizontal section of the second solder ring 5 forms an end-face contact with the outer region of the upper surface of the first solder ring 2; secondly, the lower region of the inner side of the vertical section of the second solder ring 5 forms a cylindrical contact with the upper region of the outer side of the first solder ring 2. These two contact surfaces are interconnected, forming a continuous conductive and mating interface.

[0120] Regarding the size matching and positioning logic, it should be noted that, for this structure, the corresponding size design clearly defines the mating boundaries of each component: In the radial direction, the outer diameter of the horizontal section of the second solder ring 5 is larger than the inner diameter of the first hole section 11, ensuring that the ring can rest on the end face of the outer shell; the inner diameter of the horizontal section is larger than the inner diameter of the first solder ring 2, avoiding obstruction of the assembly path of the insulator 3; the inner diameter of the vertical section matches the outer diameter of the first solder ring 2 to achieve radial positioning of the cylindrical surface mating. In the axial direction, the height of the vertical section can match the length of the first solder ring 2 extending out of the hole, ensuring that the two contact surfaces can simultaneously fit into place.

[0121] Regarding axial positioning, the basic layout logic of this structure is to place it on the outer surface of the outer shell. The second solder ring 5 is not completely suspended on the first solder ring 2; the lower outer surface of its vertical section can directly abut against the outer end face of the outer shell around the first hole section 11, with the shell end face providing the main axial support. The lower surface of the horizontal section overlaps the upper end face of the first solder ring 2, forming contact conduction. In this way, the axial direction is supported and limited by the shell end face, while the radial direction is constrained and offset by the cylindrical surface.

[0122] The composite contact structure in this embodiment essentially integrates the advantages of end-face contact and cylindrical contact: the cylindrical contact ensures the coaxiality of the second solder ring 5, allowing for automatic centering during assembly by simply fitting it downwards along the first solder ring 2, without requiring additional radial adjustment; the end-face contact provides ample solder conduction area, resulting in better synchronicity of melting between the two rings. The combined effect of the two contact surfaces improves the reliability of assembly positioning and widens the solder conduction path.

[0123] This invention provides a radio frequency (RF) component, which includes a housing and an insulator 3; the insulator 3 is sintered onto the housing by the insulator 3 sintering method of the RF component as described in any of the above possible implementations.

[0124] For example, the physical product prepared by the above sintering method is a radio frequency (RF) component. The RF component includes a housing, an insulator 3, and a solder connection structure, wherein the insulator 3 includes an insulator 31 and a through-hole central conductor 32.

[0125] For example, after sintering, a stepped hole 1 is formed on the outer shell of the radio frequency component. The stepped hole 1 includes at least a coaxial first hole segment 11 and a second hole segment 12. The inner diameter of the first hole segment 11 is larger than the inner diameter of the second hole segment 12. The insulator 3 is assembled in the stepped hole 1. The insulator 31 is located in the area of ​​the second hole segment 12. The central conductor 32 extends along the axis and extends out of both ends of the insulator 31. A solder layer is filled between the insulator 31 and the inner wall of the second hole segment 12. After the solder cools and solidifies, it solidifies the insulator 3 and the outer shell into one piece, and at the same time forms a sealed interface.

[0126] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for sintering insulators of a radio frequency component, characterized in that, The RF component housing has a stepped hole; the stepped hole includes a first hole segment and a second hole segment arranged coaxially from top to bottom; the inner diameter of the first hole segment is larger than the inner diameter of the second hole segment; the method includes: The first solder ring is inserted into the first hole section from one side, so that the first solder ring is axially engaged on the stepped surface of the stepped hole; wherein, the outer diameter of the first solder ring matches the inner diameter of the first hole section; the inner diameter of the first solder ring matches the outer diameter of the insulator. The insulator is passed axially downward through the first solder ring, so that the insulator is installed into the second hole section; the outer diameter of the insulator is smaller than the inner diameter of the second hole section; after installation, the upper end of the insulator is not lower than the lower end of the first solder ring, so that the first solder ring radially limits the insulator; The fixing plate located axially above the insulator is moved down so that the limiting hole on the fixing plate is fitted onto the outside of the center conductor of the insulator to limit the radial displacement of the insulator. Sintering is performed under the constraint of the fixed plate. After sintering is completed, the fixed plate is removed to complete the sintering process of the insulator of the radio frequency component.

2. The insulator sintering method for radio frequency components as described in claim 1, characterized in that, The stepped hole further includes a third hole segment located below the second hole segment and coaxial with the second hole segment; the inner diameter of the third hole segment is smaller than the outer diameter of the insulator and greater than or equal to the outer diameter of the central conductor.

3. The insulator sintering method for radio frequency components as described in claim 2, characterized in that, The inner diameter of the third hole segment matches the outer diameter of the central conductor; The height of the second hole segment is greater than the distance from the lower end of the insulator to the lower end of the center conductor.

4. The insulator sintering method for radio frequency components as described in claim 1, characterized in that, After installation, the upper end of the insulator shall not be lower than the upper end of the first solder ring, nor higher than the upper end of the first hole segment.

5. The insulator sintering method for radio frequency components as described in claim 1, characterized in that, The step of moving the fixing plate located axially above the insulator downwards, so that the limiting hole on the fixing plate is fitted onto the outside of the center conductor of the insulator, includes: The fixing plate located axially above the insulator is moved down so that the limiting hole on the fixing plate is fitted onto the outside of the center conductor of the insulator; After the center conductor is fitted into the limiting hole, the fixing plate is moved down until the lower surface of the fixing plate contacts the lower protrusion.

6. The insulator sintering method for radio frequency components as described in claim 1, characterized in that, After inserting the first solder ring into the first hole segment from one side, the method further includes: A second solder ring, coaxial with the first hole segment, is provided on the outer surface of the outer shell at the opening of the first hole segment. The outer diameter of the second solder ring is larger than the inner diameter of the first hole segment. The second solder ring is in direct contact with the first solder ring. The first solder ring and the second solder ring have the same melting point.

7. The insulator sintering method for radio frequency components as described in claim 6, characterized in that, The axial cross-sections of the first solder ring and the second solder ring are rectangular; The lower surface of the second solder ring near the shaft center contacts the upper surface of the first solder ring away from the shaft center. The inner diameter of the second solder ring is smaller than the inner diameter of the first hole segment, but larger than the inner diameter of the first solder ring. The height of the first solder ring is not lower than the height of the first hole segment.

8. The insulator sintering method for radio frequency components as described in claim 6, characterized in that, The axial cross-sections of the first solder ring and the second solder ring are rectangular; The lower part of the inner side of the second solder ring contacts the upper part of the outer side of the first solder ring; The inner diameter of the second solder ring is equal to the inner diameter of the first hole segment; The height of the first solder ring is higher than the height of the first hole segment.

9. The insulator sintering method for radio frequency components as described in claim 6, characterized in that, The first solder ring has a rectangular axial cross-section; the second solder ring has a U-shaped axial cross-section. The lower surface of the second solder ring near the shaft center contacts the upper surface of the first solder ring away from the shaft center. The lower part of the inner side of the second solder ring contacts the upper part of the outer side of the first solder ring.

10. A radio frequency component, characterized in that, The radio frequency component includes a housing and an insulator; the insulator is sintered onto the housing by the insulator sintering method of the radio frequency component as described in any one of claims 1 to 9.

Images