Laser system, method of adjusting a laser system, and method of manufacturing an electronic device

Abstract

A laser system, a method of adjusting the laser system, and a method of manufacturing an electronic device are provided. The laser system has a processor that determines a timing difference from a turn-on of a first switch included in a first pulse compression circuit and having a first delay characteristic to a turn-on of a second switch included in a second pulse compression circuit and having a second delay characteristic in a manner to synchronize an oscillation stage laser device and an amplification stage laser device, controls output timings of a first oscillation trigger signal input to the first pulse compression circuit and a second oscillation trigger signal input to the second pulse compression circuit, and corrects the output timing of at least one of the first oscillation trigger signal and the second oscillation trigger signal in a manner to suppress a change in the timing difference in a case where either of the first switch and the second switch is replaced with a third switch having a third delay characteristic.

Description

Technical Field

[0001] This disclosure relates to laser systems, methods for adjusting laser systems, and methods for manufacturing electronic devices. Background Technology

[0002] In recent years, with the miniaturization and high integration of semiconductor integrated circuits, there has been a demand for higher resolution in semiconductor exposure equipment. Therefore, the use of shorter wavelengths of light emitted from exposure light sources has been developed. For example, as gas laser devices for exposure, KrF excimer lasers using lasers with an output wavelength of approximately 248 nm and ArF excimer lasers using lasers with an output wavelength of approximately 193 nm are examples.

[0003] The naturally oscillating light from KrF and ArF excimer lasers has a wide spectral linewidth, reaching 350–400 pm. Therefore, if the projection lens is made of a material that allows ultraviolet light, such as that of KrF and ArF lasers, to pass through, chromatic aberration may sometimes occur. As a result, resolution may be reduced. Therefore, it is necessary to narrow the spectral linewidth of the laser output from the gas laser device to a level that eliminates chromatic aberration. Thus, to achieve spectral linewidth narrowing, a line-narrowing module (LNM) including narrowing elements (etalon, grating, etc.) is sometimes incorporated into the laser resonator of the gas laser device. Hereinafter, gas laser devices that achieve spectral linewidth narrowing will be referred to as narrow-band gas laser devices.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2005-252147

[0007] Patent Document 2: Japanese Patent Application Publication No. 2010-092892 Summary of the Invention

[0008] A laser system according to one aspect of this disclosure includes: an oscillating stage laser device including a first pulse compression circuit; an amplifying stage laser device including a second pulse compression circuit; and a processor that, in a manner to synchronize the oscillating stage laser device and the amplifying stage laser device, determines a timing difference from the activation of a first switch having a first delay characteristic included in the first pulse compression circuit to the activation of a second switch having a second delay characteristic included in the second pulse compression circuit, controls the output timing of a first oscillation trigger signal input to the first pulse compression circuit and a second oscillation trigger signal input to the second pulse compression circuit, and, in the event that either the first switch or the second switch is replaced by a third switch having a third delay characteristic, the processor corrects the output timing of at least one of the first oscillation trigger signal and the second oscillation trigger signal in a manner to suppress changes in the timing difference.

[0009] In one aspect of the adjustment method for a laser system disclosed herein, the laser system includes: an oscillating stage laser device comprising a first pulse compression circuit; and an amplifying stage laser device comprising a second pulse compression circuit, wherein, in a manner that synchronizes the oscillating stage laser device and the amplifying stage laser device, a timing difference is determined from the activation of a first switch having a first delay characteristic included in the first pulse compression circuit to the activation of a second switch having a second delay characteristic included in the second pulse compression circuit. If either the first switch or the second switch is replaced by a third switch having a third delay characteristic, the output timing of at least one of a first oscillation trigger signal input to the first pulse compression circuit and a second oscillation trigger signal input to the second pulse compression circuit is corrected in a manner that suppresses changes in the timing difference.

[0010] A method for manufacturing an electronic device according to one aspect of this disclosure includes the following steps: generating a pulsed laser using a laser system; outputting the pulsed laser to an exposure apparatus; and exposing the pulsed laser on a photosensitive substrate within the exposure apparatus to manufacture the electronic device. The laser system includes: an oscillating stage laser device including a first pulse compression circuit; an amplifying stage laser device including a second pulse compression circuit; and a processor that, in a manner synchronizing the oscillating stage laser device and the amplifying stage laser device, determines a timing difference from the activation of a first switch having a first delay characteristic included in the first pulse compression circuit to the activation of a second switch having a second delay characteristic included in the second pulse compression circuit, controls the output timing of a first oscillation trigger signal input to the first pulse compression circuit and a second oscillation trigger signal input to the second pulse compression circuit, respectively, and, in the event that either the first switch or the second switch is replaced by a third switch having a third delay characteristic, the processor corrects the output timing of at least one of the first oscillation trigger signals and the second oscillation trigger signal in a manner that suppresses changes in the timing difference. Attached Figure Description

[0011] Hereinafter, with reference to the accompanying drawings, several embodiments of the present disclosure will be described as examples only.

[0012] Figure 1 The structure of the exposure system in the comparative example is shown.

[0013] Figure 2 Show Figure 1 The structure of the laser system shown is illustrated.

[0014] Figure 3 Showing contains Figure 2 The structure of the power supply device for the charger and pulse power module is shown.

[0015] Figure 4 This is a timing diagram showing the timing of the oscillation trigger signal and the activation of switches SW1 and SW2 in the comparative example.

[0016] Figure 5 The characteristics of the delay time of switches SW1 and SW2 are shown.

[0017] Figure 6 This is a timing diagram when the switch SW2 in the comparative example is replaced with a switch SW3 that has a different delay time characteristic than the switch SW1.

[0018] Figure 7 This is a flowchart illustrating the steps of synchronous control of the laser system in the embodiment.

[0019] Figure 8 A portion of the delay time characteristics of switch SW3 is shown in a manner that overlaps with the delay time characteristics of switches SW1 and SW2.

[0020] Figure 9 It shows in Figure 7 An example of differential data generated in S7.

[0021] Figure 10 This is a flowchart illustrating the steps of correcting and controlling the output timing of the oscillation trigger signal in the embodiment. Detailed Implementation

[0022] <Content>

[0023] 1. Comparative Example

[0024] 1.1 Exposure System

[0025] 1.2 Exposure device 200

[0026] 1.3 Laser System 100

[0027] 1.3.1 Structure

[0028] 1.3.2 Actions

[0029] 1.4 Power Supply

[0030] 1.4.1 Structure

[0031] 1.4.2 Actions

[0032] 2. The topic of comparative examples

[0033] 3. A laser system that recalibrates the output timing of the oscillation trigger signal 100

[0034] 3.1 Overview

[0035] 3.2 Actions

[0036] 3.3 Function

[0037] 4. Other

[0038] 4.1 Processor

[0039] 4.2 Supplement

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments described below illustrate several examples of the present disclosure and do not limit the content of the present disclosure. In addition, not all structures and operations described in the embodiments are necessary for the structures and operations of the present disclosure. Furthermore, the same reference numerals are used to refer to the same structural elements, and repeated descriptions are omitted.

[0041] 1. Comparative Example

[0042] 1.1 Exposure System

[0043] Figure 1 The structure of the exposure system in the comparative example is shown. The comparative example disclosed herein is a method that the applicant recognizes as being known only to the applicant, and is not a publicly known example endorsed by the applicant.

[0044] The exposure system includes a laser system 100 and an exposure device 200. Figure 1 The laser system 100 is simplified in the diagram. The laser system 100 includes a laser control processor 130 configured to output pulsed laser LB to the exposure apparatus 200.

[0045] 1.2 Exposure device 200

[0046] like Figure 1As shown, the exposure apparatus 200 includes an illumination optics system 201, a projection optics system 202, and an exposure control processor 230. The exposure control processor 230, in addition to sending oscillation commands Tr0 to the laser control processor 130, also controls the entire exposure apparatus 200. The illumination optics system 201, for example, uses a pulsed laser LB incident from the laser system 100 to illuminate a mask pattern (not shown) disposed on a mask stage RT. The projection optics system 202 projects and reduces the pulsed laser LB passing through the mask onto a workpiece (not shown) disposed on a workpiece stage WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with photoresist.

[0047] The exposure control processor 230 moves the mask stage RT and the workpiece stage WT in parallel and synchronous motion, thereby exposing the workpiece to a pulsed laser LB reflecting the mask pattern by the exposure apparatus 200. After the mask pattern is transferred to a semiconductor wafer through the above exposure process, electronic devices can be manufactured through multiple processes.

[0048] 1.3 Laser System 100

[0049] 1.3.1 Structure

[0050] Figure 2 Show Figure 1 The structure of the laser system 100 is shown. The laser system 100 includes an oscillating laser device 110, an amplifying laser device 120, a laser control processor 130, a synchronization processor 135, and monitoring modules 140 and 150. The oscillating laser device 110 includes a laser cavity 10, a charger 12, a pulse power module 13, a narrowing module 14, and an output mirror 15. The pulse power module 13 corresponds to the first pulse compression circuit in this disclosure. The grating 14c included in the output mirror 15 and the narrowing module 14 constitutes an optical resonator.

[0051] The laser cavity 10 includes windows 10a and 10b, which are arranged in the optical path of the optical resonator. The laser cavity 10 is configured to contain a laser gas containing a laser gain medium and has a pair of electrodes 11a and 11b for applying a voltage to the laser gain medium. The laser gain medium is, for example, ArF, KrF, etc.

[0052] The travel direction of the pulsed laser LB1 output from output mirror 15 is defined as the Z direction. The direction in which electrodes 11a and 11b are opposed is defined as the V direction or -V direction. The Z direction and V direction are mutually perpendicular; the direction perpendicular to both is defined as the H direction or -H direction. Figure 2 The structure of the laser system 100 when viewed in the -H direction is shown in the figure.

[0053] Pulse power module 13 includes (see later) Figure 3 The main capacitor C0 and switch SW1 are described. Switch SW1 is equivalent to the first switch in this disclosure, and is a solid-state switch such as an IGBT (insulated gate bipolar transistor) switch, a BJT (bipolar junction transistor) switch, or a thyristor switch. The main capacitor C0 is connected to the charger 12, and switch SW1 is connected to the synchronous processor 135. The output terminal of the pulse power module 13 is connected to electrodes 11a and 11b.

[0054] The narrowband module 14 includes a prism 14b and a grating 14c. The prism 14b is positioned in the optical path of the light emitted from the window 10a. The prism 14b is rotatable about an axis parallel to the V direction via a rotary table (not shown). The grating 14c is positioned in the optical path of the light transmitted through the prism 14b. The output mirror 15 is composed of partially reflecting mirrors.

[0055] The monitoring module 140 includes a beam splitter 41 and a light sensor 42. The beam splitter 41 is disposed in the optical path of the pulsed laser LB1 output from the output mirror 15, configured to allow a portion of the pulsed laser LB1 to pass through with high transmittance and to reflect another portion. The light sensor 42 is disposed in the optical path of the pulsed laser LB1 reflected by the beam splitter 41.

[0056] The amplification-stage laser device 120 includes a laser cavity 20, a charger 22, a pulse power module 23, a rear mirror 24, and an output mirror 25. The pulse power module 23 is equivalent to the second pulse compression circuit in this disclosure. The rear mirror 24 and the output mirror 25 constitute an optical resonator. The rear mirror 24 is composed of a partial reflector with a reflectivity greater than that of the output mirror 25 and is disposed in the optical path of the pulsed laser LB1. The structures of the laser cavity 20, charger 22, pulse power module 23, and output mirror 25 are the same as those of the laser cavity 10, charger 12, pulse power module 13, and output mirror 15, respectively. The structures of the windows 20a and 20b and the pair of electrodes 21a and 21b included in the laser cavity 20 are the same as those of the windows 10a and 10b and the electrodes 11a and 11b, respectively.

[0057] The monitoring module 150 is configured in the optical path of the pulsed laser LB2 output from the output mirror 25. The beam splitter 51 and the optical sensor 52 included in the monitoring module 150 have the same structure as the beam splitter 41 and the optical sensor 42, respectively.

[0058] 1.3.2 Actions

[0059] The laser control processor 130 receives an oscillation command Tr0 from the exposure control processor 230. Based on the oscillation command Tr0, the laser control processor 130 sends a trigger signal Tr1 to the synchronization processor 135. Based on the trigger signal Tr1, the synchronization processor 135 sends charging start signals Tr111 and Tr121 to chargers 12 and 22 respectively, and then sends oscillation trigger signals Tr112 and Tr122 to pulse power modules 13 and 23 respectively. The oscillation trigger signals Tr112 and Tr122 correspond to the first and second oscillation trigger signals in this disclosure, respectively.

[0060] In the oscillating laser device 110, the charger 12 begins charging the main capacitor C0 upon receiving a charging start signal Tr111 from the synchronization processor 135. The switch SW1 included in the pulse power module 13 is turned on upon receiving an oscillation trigger signal Tr112 from the synchronization processor 135. When switch SW1 is turned on, the pulse power module 13 generates a pulsed high voltage from the electrical energy charging the main capacitor C0 and applies this high voltage between electrodes 11a and 11b.

[0061] When a high voltage is applied between electrodes 11a and 11b, a discharge occurs between them. The energy from this discharge excites the laser gas inside the laser cavity 10, causing it to transfer to a higher energy level. When the excited laser gas subsequently transfers to a lower energy level, it emits light of a wavelength corresponding to the energy level difference.

[0062] Light generated inside the laser cavity 10 is emitted to the outside of the laser cavity 10 through windows 10a and 10b. Passing through prism 14b, the beam width of the light emitted from window 10a is widened in a plane parallel to the HZ plane. The light passing through prism 14b is incident on grating 14c.

[0063] Light incident on grating 14c is reflected by multiple slots of grating 14c and diffracted in a direction corresponding to the wavelength of the light. The wavelength of the diffracted light returning from grating 14c to prism 14b is selected by aligning the incident angle of the light incident on grating 14c with the diffraction angle of the diffracted light of the desired wavelength. The incident angle of the light incident on grating 14c changes according to the change in the orientation of prism 14b caused by the rotation angle of the stage, and the wavelength selected by the narrowing module 14 changes accordingly. Prism 14b narrows the beam width of the diffracted light returning from grating 14c in the HZ plane and returns the light to the interior of laser cavity 10 via window 10a.

[0064] The output mirror 15 allows a portion of the light emitted from the window 10b to pass through and be output, while the other portion is reflected back into the laser cavity 10.

[0065] Thus, the light emitted from the laser cavity 10 travels back and forth between the narrowing module 14 and the output mirror 15. This light is amplified each time it passes through the discharge space between electrodes 11a and 11b, and narrowed each time it folds back in the narrowing module 14. The narrowed light, oscillating in this way, is then output as a pulsed laser LB1 from the output mirror 15.

[0066] The monitoring module 140 sends a signal indicating the emission timing of the pulsed laser LB1 to the laser control processor 130. The emission timing of the pulsed laser LB1 roughly corresponds to the timing of the turn-on of the switch SW1 included in the pulse power module 13. The monitoring module 140 also measures the pulse energy and beam profile of the pulsed laser LB1.

[0067] The pulsed laser LB1 output from the oscillating laser device 110 enters the laser cavity 20 via the rear mirror 24 and window 20a. An oscillation trigger signal Tr122 is input to the switch SW2 of the pulsed power module 23 (see reference 110) so that discharge begins between electrodes 21a and 21b at the timing of the pulsed laser LB1 entering the laser cavity 20. Figure 3 The timing is controlled by the switch SW2, which is equivalent to the second switch in this disclosure. The pulsed laser LB1 travels back and forth between the rear mirror 24 and the output mirror 25. The light is amplified each time it passes through the discharge space between electrodes 21a and 21b and is output from the output mirror 25 as the pulsed laser LB2.

[0068] The amplification stage laser device 120 amplifies the pulse energy while maintaining the spectral lines of the pulsed laser LB1, which has been narrowed by the oscillation stage laser device 110. As a result, the laser system 100 can achieve both narrowing and high output.

[0069] The monitoring module 150 sends a signal indicating the emission timing of the pulsed laser LB2 to the laser control processor 130. The emission timing of the pulsed laser LB2 roughly corresponds to the timing of the turn-on of the switch SW2 included in the pulse power module 23. The monitoring module 150 also measures the pulse energy and beam profile of the pulsed laser LB2.

[0070] The pulsed laser LB, after being monitored by module 150, is incident on exposure device 200.

[0071] 1.4 Power Supply

[0072] 1.4.1 Structure

[0073] Figure 3 Showing contains Figure 2The diagram illustrates the structure of the power supply devices for chargers 12 and 22 and pulse power modules 13 and 23. Charger 12 includes a DC variable power supply E. In addition to the main capacitor C0 and switch SW1, pulse power module 13 includes a boost transformer TC, magnetic switches SR0, SR1, and SR2, and first and second transmission capacitors C1 and C2. The output terminals of pulse power module 13 are connected to a peaking capacitor Cp and electrodes 11a and 11b connected in parallel. The peaking capacitor Cp and electrodes 11a and 11b are contained within the laser cavity 10.

[0074] Magnetic switches SR0 to SR2 all include saturable reactors. Magnetic switches SR0 to SR2 are configured to switch to low impedance when the time integral of the voltage applied across them reaches a predetermined value determined by the characteristics of each magnetic switch.

[0075] One terminal of the main capacitor C0 is connected to a DC variable power supply E and a terminal of the magnetic switch SR0, respectively. The other terminal of the main capacitor C0 is connected to a reference potential. The other terminal of the magnetic switch SR0 is connected to the reference potential via the primary winding of the step-up transformer TC and the switch SW1, which are connected in series.

[0076] One terminal of the magnetic switch SR1 is connected to a reference potential via the secondary winding of the step-up transformer TC, and is also connected to one terminal of the first transmission capacitor C1. The other terminal of the first transmission capacitor C1 is connected to the reference potential. That is, the secondary winding of the step-up transformer TC and the first transmission capacitor C1 are connected in parallel. The first transmission capacitor C1 and the magnetic switch SR1 constitute the first magnetic pulse compression circuit PC1.

[0077] The other terminal of magnetic switch SR1 is connected to one terminal of magnetic switch SR2, and also to one terminal of the second transmission capacitor C2. The other terminal of the second transmission capacitor C2 is connected to a reference potential. The second transmission capacitor C2 and magnetic switch SR2 together form the second magnetic pulse compression circuit PC2.

[0078] The other terminal of the magnetic switch SR2 is connected to one terminal and electrode 11a of the peaking capacitor Cp. The other terminal and electrode 11b of the peaking capacitor Cp are connected to a reference potential.

[0079] 1.4.2 Actions

[0080] When charger 12 receives a charging start signal Tr111 from synchronous processor 135, it charges the main capacitor C0 through DC variable power supply E. When switch SW1 receives an oscillation trigger signal Tr112 from synchronous processor 135 and is turned on, the voltage of the main capacitor C0 is applied to magnetic switch SR0. When the time integral value of the voltage applied to magnetic switch SR0 reaches a predetermined value, magnetic switch SR0 is turned on, and a pulsed current flows from the main capacitor C0 to magnetic switch SR0, the primary winding of step-up transformer TC, and switch SW1.

[0081] When current flows through the primary winding of the step-up transformer TC, a current corresponding to the winding ratio of the step-up transformer TC flows through the secondary winding of the step-up transformer TC via electromagnetic induction. When current flows through the secondary winding of the step-up transformer TC, the first transfer capacitor C1 is charged, and the voltage of the first transfer capacitor C1 is applied to the magnetic switch SR1. When the time integral value of the voltage applied to the magnetic switch SR1 reaches a predetermined value, the magnetic switch SR1 is turned on, and a pulsed current flows through the magnetic switch SR1.

[0082] When current flows through magnetic switch SR1, the charge of the first transfer capacitor C1 is transferred to the second transfer capacitor C2, which is then charged. A voltage is applied to magnetic switch SR2 through the second transfer capacitor C2. Compared to the pulse width of the current charging the first transfer capacitor C1, the pulse width of the current charging the second transfer capacitor C2 is shorter and is converted to a higher voltage. When the time integral of the voltage applied to magnetic switch SR2 reaches a predetermined value, magnetic switch SR2 is turned on, and a pulsed current flows through it.

[0083] When current flows through magnetic switch SR2, the charge of the second transfer capacitor C2 is transferred to the peaking capacitor Cp, and the peaking capacitor Cp is charged. Compared with the pulse width of the current charging the second transfer capacitor C2, the pulse width of the current charging the peaking capacitor Cp is shorter and is high-voltage.

[0084] When the voltage of the peaking capacitor Cp reaches the breakdown voltage of the laser gas, a discharge occurs between electrodes 11a and 11b. This excites the laser gas, causing laser oscillation. Switch SW1 switches at a predetermined repetition frequency, thereby outputting a pulsed laser LB1 at that frequency.

[0085] The structure and operation of charger 22 and pulse power module 23 are the same as those of charger 12 and pulse power module 13. However, the switch included in pulse power module 23 is set as SW2.

[0086] Figure 4This is a timing diagram showing the timing of the oscillation trigger signals Tr112 and Tr122 and the turn-on of switches SW1 and SW2 in the comparative example. Figure 4 The vertical dashed lines in the diagram represent events that are timed the same. After receiving the trigger signal Tr1, the synchronization processor 135 outputs... Figure 4 The charging start signals Tr111 and Tr121 (not shown) are followed by oscillation trigger signals Tr112 and Tr122. The output timing of the oscillation trigger signals Tr112 and Tr122 is determined by adding correction times Δt0112 and Δt0122 to the reference time ST, respectively. The reference time ST is set to a time after which the chargers 12 and 22, having received the charging start signals Tr111 and Tr121, have sufficient time to charge their respective main capacitors C0. The synchronization processor 135 controls the output timing of the oscillation trigger signals Tr112 and Tr122 in a manner that optimizes the synchronization between the oscillation stage laser device 110 and the amplification stage laser device 120.

[0087] Before the laser system 100 is put into operation, an adjustment oscillation is performed. The adjustment oscillation is performed as follows: while changing the time difference between the calibration time Δt0112 and Δt0122, the laser oscillation is performed, and the time difference when the measured results of the pulse energy and beam profile of the pulsed lasers LB1 and LB2 are in the optimal state is determined as the synchronization time difference Δt0.

[0088] The synchronization time difference Δt0 is a crucial control parameter for optimizing the relationship between the timing of the pulsed laser LB1 entering the laser cavity 20 and the timing of the start of discharge between electrodes 21a and 21b. More directly, this relationship is defined by the timing difference Δs0 between the switching on of switches SW1 and SW2. If the delay time DS1 of switch SW1 from receiving the oscillation trigger signal Tr112 to switching on is always the same as the delay time DS2 of switch SW2 from receiving the oscillation trigger signal Tr122 to switching on, then the timing difference Δs0 and the synchronization time difference Δt0 are always the same. If the timing difference Δs0 is always the same as the synchronization time difference Δt0, then the oscillation stage laser device 110 and the amplification stage laser device 120 can be properly synchronized by determining the synchronization time difference Δt0.

[0089] Figure 5 The characteristics of the delay times DS1 and DS2 of switches SW1 and SW2 are shown. The characteristics of delay times DS1 and DS2 are respectively equivalent to the first delay characteristic and the second delay characteristic in this invention. Figure 5The horizontal axis represents the number of pulses N from the starting pulse of the pulsed laser LB continuously output from the laser system 100, and the vertical axis represents the delay time DS. The delay time DS is equivalent to the delay times DS1 and DS2 of switches SW1 and SW2, respectively.

[0090] The delay time DS sometimes varies depending on the number of pulses N from the starting pulse, and the variation sometimes differs depending on the repetition frequency of the pulsed laser LB. For example, there is a tendency for the delay time DS to be larger as the number of pulses N from the starting pulse increases, and there is also a tendency for the change in delay time DS to decrease as the number of pulses N further increases, thus the delay time DS approximately converges to a fixed value. Additionally, for example, there is a tendency for the change in delay time DS corresponding to the change in the number of pulses N to be larger as the repetition frequency of the pulsed laser LB increases, and the delay time DS tends to be larger when converging to a fixed value. Furthermore, when the oscillation of the pulsed laser LB stops for a certain period and then resumes outputting the pulsed laser LB, the number of pulses N returns to 1, and the delay time DS returns to its initial value.

[0091] like Figure 5 As shown, even with the same switch, the delay time DS changes during operation. Switches SW1 and SW2 need to have the same delay times DS1 and DS2 while incorporating this variable characteristic; therefore, switches of the same model are used as switches SW1 and SW2.

[0092] 2. The topic of comparative examples

[0093] Pulse power modules 13 and 23 are replaced as their service life expires or their performance deteriorates. The timing of replacement may differ for pulse power modules 13 and 23. For example, when replacing pulse power module 23, it is preferable to replace it with a new pulse power module 23 that includes a switch SW2 of the same model as the switch SW1 included in pulse power module 13.

[0094] However, switch SW2, which is the same model as switch SW1, may sometimes be unavailable due to production stoppages. In this case, to prevent synchronization deviation between the oscillating laser device 110 and the amplifying laser device 120, it is necessary to replace not only pulse power module 23 but also pulse power module 13 to ensure that the switch models are consistent, which may result in additional costs.

[0095] The implementation described below relates to the following: even if the delay time characteristics of the switches included in the pulse power modules 13 and 23 are different, the oscillating laser device 110 and the amplifying laser device 120 will be properly synchronized.

[0096] 3. A laser system that recalibrates the output timing of the oscillation trigger signal 100

[0097] 3.1 Overview

[0098] Figure 6 This is a timing diagram showing the case where switch SW2 in the comparative example is replaced with switch SW3, which has a different delay time characteristic than switch SW1. Even though switch SW2 is replaced with switch SW3, it is desirable that the timing difference Δs0 between the turn-on of switches SW1 and SW3 is equal to the timing difference Δs0 before the replacement (refer to...). Figure 4 The same applies. Therefore, in this embodiment, the correction time Δt0122 for outputting the oscillation trigger signal Tr122 is recalibrated based on the delay time DS3 of switch SW3. Switch SW3 is equivalent to the third switch in this disclosure, and the characteristic of the delay time DS3 is equivalent to the third delay characteristic in this disclosure.

[0099] The structure of the laser system 100 in the embodiment is the same as that in the comparative example.

[0100] 3.2 Actions

[0101] Figure 7 This is a flowchart illustrating the steps of synchronous control of the laser system 100 in the embodiment.

[0102] In S1, the laser control processor 130 acquires data on the delay times DS1 and DS2 of the switches SW1 and SW2 before replacement. The characteristics of the delay times DS1 and DS2 do not need to be measured while the switches SW1 and SW2 are mounted on the laser system 100; they can be measured by connecting to a measuring instrument (not shown). Alternatively, the delay time characteristics of other switches with the same model as switches SW1 and SW2 can also be acquired.

[0103] In S2, the laser control processor 130 and the synchronization processor 135 perform adjustment oscillation to determine the synchronization time difference Δt0 in an optimal manner between the oscillation stage laser device 110 and the amplification stage laser device 120. This process is the same as in the comparative example. By determining the synchronization time difference Δt0, the timing difference Δs0 between the activation of switches SW1 and SW2 is determined.

[0104] In S3, the laser control processor 130 and the synchronization processor 135 officially operate the laser system 100. Here, for example, according to... Figure 4 Synchronization control is performed using correction times Δt0112 and Δt0122, which correspond to the synchronization time difference Δt0.

[0105] In S4, the laser control processor 130 determines the approaching end of the service life of the pulse power modules 13 and 23 and the deterioration of their performance, and decides whether to replace one of them.

[0106] When neither pulse power modules 13 nor 23 need to be replaced (S4: No), the laser control processor 130 puts the laser system 100 into operation while remaining in standby mode until it determines "Yes" in S4. However, unlike the determination in S4, the processing of this flowchart can end if the laser system 100 is stopped.

[0107] If one of the pulse power modules 13 and 23 is replaced (S4: Yes), the laser control processor 130 determines in S5 whether the characteristics of the delay time have changed. For example, if the pulse power module 23 is replaced, it determines whether the characteristics of the delay time are different in the switch SW2 mounted on the pulse power module 23 and the newly mounted switch SW3.

[0108] If the delay time characteristic remains unchanged (S5: No), in S6, one of the pulse power modules 13 and 23 is replaced. During the replacement operation, the operation of the laser system 100 is stopped. After S6, in S3, the laser control processor 130 and the synchronization processor 135 restart the laser system 100.

[0109] If the delay time characteristic changes (S5: Yes), in S7, the laser control processor 130 obtains data on the delay time DS3 characteristic of the newly mounted switch SW3. The laser control processor 130 also generates differential data between the delay time DS2 characteristic of the replaced switch SW2 and the delay time DS3 characteristic of switch SW3.

[0110] exist Figure 8 In the diagram, a portion of the characteristic of the delay time DS3 of switch SW3 is shown in a manner that overlaps with the characteristics of the delay times DS1 and DS2 of switches SW1 and SW2. Figure 8 In the diagram, the characteristics of the delay time DS3 at 3kHz are represented by a dashed line. The difference in delay time when the repetition frequency and the number of pulses N from the starting pulse are the same is defined as the difference DEF.

[0111] Figure 9 Shown in Figure 7 An example of differential data generated in S7. Figure 9 The horizontal axis represents the number of pulses N from the starting pulse, and the vertical axis represents the differential DEF. Differential data can be generated for each repetition frequency and each number of pulses N, and the differential data can also be stored in the form of a table.

[0112] Refer again Figure 7 In step S8, one of the pulse power modules 13 and 23 is replaced. During the replacement operation, the operation of the laser system 100 is stopped. After S8, in step S9, the laser control processor 130 and the synchronization processor 135 restart the laser system 100.

[0113] In S10, the laser control processor 130 and the synchronization processor 135 perform correction control of the output timing of the oscillation trigger signals Tr112 and Tr122, and perform synchronization control in the laser system 100, including switches SW1 and SW3 with different delay times. For details of this process, see [reference needed]. Figure 10 That will be discussed later.

[0114] After S10, the laser control processor 130 starts the laser system 100 into operation while remaining in standby mode until it determines "yes" in S4. Even if one of the pulse power modules 13 and 23 is replaced, there is no need to re-set the synchronization time difference Δt0, so it does not need to return to S2. Unlike the determination in S4, if the laser system 100 is stopped, the processing of this flowchart can be terminated.

[0115] Figure 10 This is a flowchart illustrating the steps of correcting and controlling the output timing of the oscillation trigger signals Tr112 and Tr122 in the embodiment. Figure 10 The process shown is equivalent to Figure 7 The S10 subroutine.

[0116] In S11, when the laser control processor 130 receives the oscillation command Tr0 from the exposure control processor 230, the synchronization processor 135 outputs oscillation trigger signals Tr112 and Tr122 at a timing determined by the initial characteristics. The initial characteristics refer to, for example... Figure 9 The differential data shown is the differential DEF when the number of pulses N is 1. The initial characteristics reflect the difference between the data of the delay time DS2 of the replaced switch SW2 and the data of the delay time DS3 of the switch SW3, and are characteristics independent of the repetition frequency.

[0117] In S12, the synchronous processor 135 determines the repetition frequency based on the difference between the time of the next oscillation instruction Tr0 and the time of the previous oscillation instruction Tr0. The previous oscillation instruction Tr0 is equivalent to the first oscillation instruction in this disclosure, and the next oscillation instruction Tr0 is equivalent to the second oscillation instruction in this disclosure. Here, the reciprocal of the time interval of the oscillation instruction Tr0 closest to the current time is set as the repetition frequency. By reflecting this repetition frequency in the recalibration in S14, changes in the time interval of the oscillation instruction Tr0 can be responded to immediately.

[0118] In S13, the synchronization processor 135 determines whether the repetition frequency is above a threshold. For example, if the repetition frequency is above 100Hz, it is determined that the repetition frequency is above the threshold. If the repetition frequency is below the threshold (S13: No), it returns to S11 and uses the timing output oscillation trigger signals Tr112 and Tr122 determined by the initial characteristics. If the repetition frequency is above the threshold (S13: Yes), the process proceeds to S14.

[0119] In S14, the synchronization processor 135 uses the delay time DS obtained by applying the repetition frequency and pulse number N to the differential data to correct the correction time Δt0112 or Δt0122 again. For example, when the pulse power module 23 is replaced with a pulse power module including switch SW3, the value DS2-DS3 obtained by subtracting the delay time DS3 of switch SW3 from the delay time DS2 of switch SW2 is compared with the current correction time Δt0122 (refer to...). Figure 4 Add the results together and use the result as the new correction time Δt0122 (refer to...). Figure 6 Therefore, the variation in the timing difference Δs0 between the switching on of switches SW1 and SW3 can be suppressed. Alternatively, the variation in the timing difference Δs0 between the switching on of switches SW1 and SW3 can also be suppressed by subtracting DS2-DS3 from the current correction time Δt0112. DS2-DS3 is obtained from the differential data.

[0120] In S15, the synchronization processor 135 outputs oscillation trigger signals Tr112 and Tr122 at an output timing determined using correction times Δt0112 and Δt0122. One of the correction times Δt0112 and Δt0122 is the correction time obtained by re-correction in S14.

[0121] In S16, the synchronization processor 135 determines whether the laser control processor 130 has received the next oscillation command Tr0 within a certain time period. This certain time period could be, for example, 1 second. If the next oscillation command Tr0 is received within the certain time period (S16: Yes), the synchronization processor 135 returns the process to S12. If the next oscillation command Tr0 is not received within the certain time period (S16: No), the synchronization processor 135 terminates the processing of this flowchart.

[0122] Here, the case where correction is performed on one of the correction times Δt0112 and Δt0122 by generating differential data has been described, but this disclosure is not limited to this. It is also possible to perform correction on both correction times Δt0112 and Δt0122 without generating differential data. For example, if the pulse power module 23 containing switch SW2 is replaced with a pulse power module containing switch SW3, the delay time DS3 of switch SW3 can be added to the current correction time Δt0112, and the delay time DS2 of switch SW2 can be added to the current correction time Δt0122. In this case, the variation in the timing difference Δs0 between the turn-on of switches SW1 and SW3 can also be suppressed.

[0123] 3.3 Function

[0124] (1) According to an embodiment, the laser system 100 includes: an oscillating stage laser device 110 including a pulse power module 13, an amplifying stage laser device 120 including a pulse power module 23, and a laser control processor 130 or a synchronization processor 135. The laser control processor 130 or the synchronization processor 135, in a manner that synchronizes the oscillating stage laser device 110 and the amplifying stage laser device 120, determines a timing difference Δs0 from the closing of a switch SW1 with a first delay characteristic included in the pulse power module 13 to the closing of a switch SW2 with a second delay characteristic included in the pulse power module 23, and controls the output timing of each of the oscillation trigger signals Tr112 and Tr122 input to the pulse power module 13. When either switch SW1 or switch SW2 is replaced by a switch SW3 with a third delay characteristic, the laser control processor 130 or the synchronization processor 135 corrects the output timing of at least one of the oscillation trigger signals Tr112 and Tr122 in a manner that suppresses changes in the timing difference Δs0.

[0125] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 based on the delay characteristics of the switches included in the pulse power modules 13 and 23, the oscillation stage laser device 110 and the amplification stage laser device 120 can be synchronized even when using switches with different delay characteristics. When it is necessary to replace the switch of either the oscillation stage laser device 110 or the amplification stage laser device 120, it is not necessary to replace it with a switch having the same characteristics as the other, thus reducing maintenance costs.

[0126] (2) According to the embodiment, the first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include: the relationship between the number of pulses N of the pulsed laser LB continuously output from the laser system 100 from the starting pulse and the delay time DS from the output timing of the oscillation trigger signal Tr112 or Tr122 until it is turned on. The laser control processor 130 or the synchronization processor 135 corrects the output timing based on the number of pulses N.

[0127] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 according to the delay time DS that varies with the number of pulses N from the start pulse, the variation of the timing difference Δs0 of the switching included in the pulse power modules 13 and 23 can be suppressed.

[0128] (3) According to the embodiment, when the repetition frequency of the pulsed laser LB is less than a threshold, the laser control processor 130 or the synchronization processor 135 uses the delay time DS when the number of pulses N is set to the minimum value to correct the output timing of the oscillation trigger signal Tr112 or Tr122.

[0129] Therefore, when the repetition frequency is low and the delay time DS is not easily affected by previous pulses, high-precision correction can be performed by correcting according to the starting pulse.

[0130] (4) According to the embodiment, the first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the repetition frequency of the pulsed laser LB output by the laser system 100 and the delay time DS from the output timing of the oscillation trigger signal Tr112 or Tr122 to the on-time. The laser control processor 130 or the synchronization processor 135 corrects the output timing based on the repetition frequency.

[0131] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 according to the delay time DS that varies according to the repetition frequency of the pulse laser LB, the variation of the timing difference Δs0 of the switching included in the pulse power modules 13 and 23 can be suppressed.

[0132] (5) According to the embodiment, when the repetition frequency is less than a threshold, the laser control processor 130 or the synchronization processor 135 uses a fixed value that is independent of the repetition frequency to correct the output timing of the oscillation trigger signal Tr112 or Tr122.

[0133] Therefore, when the repetition frequency is low and the delay time DS is not easily affected by previous pulses, high-precision correction can be achieved by using a fixed value for correction.

[0134] (6) According to the embodiment, the laser control processor 130 or the synchronization processor 135 receives a first oscillation command Tr0 for outputting a first pulse of the pulsed laser LB and a second oscillation command Tr0 for outputting a second pulse of the pulsed laser LB after the first pulse, and determines the repetition frequency based on the time difference between the first oscillation command Tr0 and the second oscillation command Tr0.

[0135] Therefore, by determining the repetition frequency based on the time difference between the first and second oscillation commands Tr0, appropriate corrections can be made even when the repetition frequency changes.

[0136] (7) According to the embodiment, the laser control processor 130 or the synchronization processor 135 corrects the output timing of the oscillation trigger signal Tr112 or Tr122 based on the time difference between the first and second oscillation commands Tr0 that are closest to the current time.

[0137] Therefore, by applying a correction based on the repetition frequency determined by the first and second oscillation commands Tr0 closest to the current moment, appropriate correction can be made quickly even when the repetition frequency changes.

[0138] (8) According to the embodiment, the laser control processor 130 or the synchronization processor 135 corrects the output timing based on the number of pulses N and the repetition frequency.

[0139] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 according to the delay time DS that varies with both the number of pulses N from the start pulse and the repetition frequency of the pulsed laser LB, the change in the timing difference Δs0 of the turn-on of the pulse power modules 13 and 23 can be suppressed.

[0140] (9) According to the embodiment, the laser control processor 130 or the synchronization processor 135 corrects the timing of the output of either the oscillation trigger signal Tr112 or the oscillation trigger signal Tr122, that is, the oscillation trigger signal Tr112 or Tr122 of the switches SW1 and SW2 that is replaced by the switch SW3.

[0141] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 of the switch that has been replaced by switch SW3, the output timing of the oscillation trigger signal Tr112 or Tr122 of the unreplaced switch can be maintained, thus enabling stable control.

[0142] According to embodiment (10), the laser control processor 130 or the synchronization processor 135 corrects the output timing of the oscillation trigger signal Tr112 or Tr122 based on the difference DEF between the delay characteristic of either the first or second delay characteristic, i.e., the delay characteristic of the switch SW1 or SW2 that is replaced by the switch SW3, and the third delay characteristic.

[0143] Therefore, by correcting the output timing of the oscillation trigger signal Tr112 or Tr122 based on the differential DEF of the delay characteristics of the old and new switches after replacement, stable control can be achieved by maintaining the timing difference Δs0 between the switching on of the switches contained in the pulse power modules 13 and 23 before and after replacement.

[0144] According to embodiment (11), the laser control processor 130 or the synchronization processor 135 stores the differential DEF data in the form of a table.

[0145] Therefore, by storing the difference DEF of the delay characteristics of the old and new switches after replacement in the form of a table, the computational load can be reduced and rapid control can be achieved.

[0146] In embodiment (12), the laser control processor 130 or the synchronization processor 135 may also correct the output timing of both the oscillation trigger signals Tr112 and Tr122.

[0147] Therefore, by correcting the output timing of both the oscillation trigger signals Tr112 and Tr122, it is possible to accurately correct the delay characteristics of the two switches contained in the oscillation stage laser device 110 and the amplification stage laser device 120, respectively.

[0148] In other respects, the implementation method is the same as that of the comparative example.

[0149] 4. Other

[0150] 4.1 Processor

[0151] Processors such as laser control processor 130, synchronization processor 135, and exposure control processor 230 can be physically configured in hardware to execute the various processes included in this disclosure. For example, the processor can also be a computer including a memory storing control programs that define various processes and a processing device for executing the control programs. The control programs can be stored in a single memory or separately in multiple physically separate memories, defining various processes through the control programs as a collection of these memories. The processing device can be a general-purpose processing device such as a CPU or a purpose-specific processing device such as a GPU.

[0152] Alternatively, the processor can be programmed in software to perform the various processes included in this disclosure. For example, the processor can also be obtained by installing the functions of performing various processes into a dedicated device such as an ASIC or a programmable device such as an FPGA.

[0153] The various processes included in this disclosure can be executed by a single computer, a single dedicated device, or a single programmable device, or can be executed through the cooperation of multiple physically separate computers, multiple dedicated devices, or multiple programmable devices. The various processes can also be executed by a combination of at least two of more than one computer, more than one dedicated device, and more than one programmable device.

[0154] 4.2 Supplement

[0155] The foregoing description is not limiting but merely illustrative. Therefore, modifications can be made to the embodiments of this disclosure without departing from the claims, as will be apparent to those skilled in the art. Furthermore, those skilled in the art will readily recognize that embodiments of this disclosure can be combined.

[0156] Unless explicitly stated otherwise, all terms used in this specification and the claims as a whole shall be interpreted as “non-limiting” terms. For example, terms such as “comprising,” “containing,” “having,” and “possessing” shall be interpreted as “not excluding the presence of structural elements other than those described.” Furthermore, the modifier “a” shall be interpreted as “at least one” or “one or more.” The term “at least one of A, B, and C” shall be interpreted as “A,” “B,” “C,” “A+B,” “A+C,” “B+C,” or “A+B+C.” Moreover, it shall be interpreted as also including combinations of these elements with elements other than “A,” “B,” and “C.”

Claims

1. A laser system comprising: An oscillating laser device, comprising a first pulse compression circuit; Amplification-level laser device, comprising a second pulse compression circuit; and The processor, in a manner that synchronizes the oscillating stage laser device with the amplifying stage laser device, determines a timing difference from the activation of a first switch with a first delay characteristic included in the first pulse compression circuit to the activation of a second switch with a second delay characteristic included in the second pulse compression circuit, and controls the output timing of the first oscillation trigger signal input to the first pulse compression circuit and the second oscillation trigger signal input to the second pulse compression circuit. When either the first switch or the second switch is replaced by a third switch with a third delay characteristic, the processor corrects the output timing of at least one of the first oscillation trigger signal and the second oscillation trigger signal in a manner that suppresses changes in the timing difference.

2. The laser system according to claim 1, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the continuously output pulsed laser from the starting pulse and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of the pulses based on the pulse number.

3. The laser system according to claim 2, wherein, When the repetition frequency of the pulsed laser is less than a threshold, the processor corrects the output timing of at least one of them using the delay time when the number of pulses is set to the minimum value.

4. The laser system according to claim 1, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the repetition frequency of the pulsed laser output by the laser system and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of the components based on the repetition frequency.

5. The laser system according to claim 4, wherein, When the repetition frequency is less than a threshold, the processor uses a fixed value independent of the repetition frequency to correct the output timing of the at least one party.

6. The laser system according to claim 4, wherein, The processor receives a first oscillation command for outputting a first pulse of the pulsed laser and a second oscillation command for outputting a second pulse of the pulsed laser after the first pulse, and determines the repetition frequency based on the time difference between the first oscillation command and the second oscillation command.

7. The laser system according to claim 6, wherein, The processor corrects the output timing of at least one of the two oscillation instructions based on the time difference between the first oscillation instruction and the second oscillation instruction that are closest to the current time.

8. The laser system according to claim 1, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the continuously output pulsed laser from the laser system starting from the starting pulse and the repetition frequency of the pulsed laser and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of the pulses based on the pulse number and the repetition frequency.

9. The laser system according to claim 1, wherein, The processor corrects the output timing of the oscillation trigger signal, which is either the first oscillation trigger signal or the second oscillation trigger signal, and which is either the first switch or the second switch that has been replaced by the third switch.

10. The laser system according to claim 9, wherein, The processor corrects the output timing of the oscillation trigger signal of the first switch and the second switch that is replaced by the third switch based on the difference between the delay characteristic of the first switch and the second switch that is either the first delay characteristic or the second delay characteristic, and the third delay characteristic.

11. The laser system according to claim 10, wherein, The processor stores the difference data in the form of a table.

12. The laser system according to claim 1, wherein, The processor corrects the output timing of both the first oscillation trigger signal and the second oscillation trigger signal.

13. A method for adjusting a laser system, the laser system comprising: An oscillating laser device, comprising a first pulse compression circuit; and An amplified laser device, comprising a second pulse compression circuit, wherein... To synchronize the oscillating stage laser device with the amplifying stage laser device, the timing difference from the activation of the first switch with a first delay characteristic included in the first pulse compression circuit to the activation of the second switch with a second delay characteristic included in the second pulse compression circuit is determined. When either the first switch or the second switch is replaced by a third switch with a third delay characteristic, the output timing of at least one of the first oscillation trigger signal input to the first pulse compression circuit and the second oscillation trigger signal input to the second pulse compression circuit is corrected in a manner that suppresses the change in the timing difference.

14. The adjustment method for the laser system according to claim 13, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the continuously output pulsed laser from the starting pulse and the delay time from the corresponding output timing to the on-time. The output timing of at least one of them is corrected based on the number of pulses.

15. The adjustment method for the laser system according to claim 13, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the repetition frequency of the pulsed laser output by the laser system and the delay time from the corresponding output timing to the on-time. The output timing of at least one of them is corrected based on the repetition frequency.

16. The adjustment method for the laser system according to claim 13, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the continuously output pulsed laser from the laser system starting from the starting pulse and the repetition frequency of the pulsed laser and the delay time from the corresponding output timing to the on-time. The output timing of at least one of the pulses is corrected based on the pulse number and the repetition frequency.

17. A method for manufacturing an electronic device, comprising the following steps: Pulsed laser light is generated using a laser system; The pulsed laser is output to the exposure device; and Within the exposure apparatus, the pulsed laser is used to expose a photosensitive substrate to manufacture the electronic device. The laser system has the following features: An oscillating laser device, comprising a first pulse compression circuit; Amplification-level laser device, comprising a second pulse compression circuit; and The processor, in a manner that synchronizes the oscillating stage laser device with the amplifying stage laser device, determines a timing difference from the activation of a first switch with a first delay characteristic included in the first pulse compression circuit to the activation of a second switch with a second delay characteristic included in the second pulse compression circuit, and controls the output timing of the first oscillation trigger signal input to the first pulse compression circuit and the second oscillation trigger signal input to the second pulse compression circuit. When either the first switch or the second switch is replaced by a third switch with a third delay characteristic, the processor corrects the output timing of at least one of the first oscillation trigger signal and the second oscillation trigger signal in a manner that suppresses changes in the timing difference.

18. The method for manufacturing an electronic device according to claim 17, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the pulsed laser continuously output from the laser system from the starting pulse and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of the pulses based on the number of pulses.

19. The method for manufacturing an electronic device according to claim 17, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the repetition frequency of the pulsed laser and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of them based on the repetition frequency.

20. The method for manufacturing an electronic device according to claim 17, wherein, The first delay characteristic, the second delay characteristic, and the third delay characteristic respectively include the relationship between the number of pulses of the pulsed laser continuously output from the laser system from the starting pulse and the repetition frequency of the pulsed laser and the delay time from the corresponding output timing to the on-time. The processor corrects the output timing of at least one of the pulses based on the pulse number and the repetition frequency.

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