A conical semiconductor laser

Abstract

The application discloses a conical semiconductor laser and relates to the field of semiconductor lasers, which comprises a semiconductor chip and a bottom heat sink located at the bottom of the semiconductor chip, and an insulating partition layer is arranged at the connecting part of the semiconductor chip and the bottom heat sink, and the insulating partition layer is fixedly assembled with both the semiconductor chip and the bottom heat sink, and the insulating partition layer is used for insulating the semiconductor chip and the bottom heat sink, and a base is fixedly arranged at the bottom of the bottom heat sink, the semiconductor chip in the conical semiconductor laser is comprehensively protected by the protection unit, the semiconductor chip can be prevented from being collided, the heat dissipation unit additionally arranged in the protection unit can uniformly absorb and dissipate the heat generated by the semiconductor chip, the situation that only the bottom of the semiconductor chip has good heat dissipation effect and the top has poor heat dissipation effect is avoided, and therefore, the stability of the conical semiconductor laser in continuous high-power operation and the service life of the conical semiconductor laser are ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor lasers, specifically a tapered semiconductor laser. Background Technology

[0002] Compared to conventional semiconductor lasers, tapered semiconductor lasers are based on stimulated emission. Laser light is generated by the recombination of electrons and holes after current is injected into a PN junction, and the wavelength of the output laser is determined by the semiconductor material. Tapered semiconductor lasers are smaller, have higher photoelectric conversion efficiency, and faster response times than conventional semiconductor lasers, making them more suitable for industrial applications.

[0003] To ensure stable output power of a conical semiconductor laser, effective heat dissipation is necessary. Conical semiconductor lasers generate significant heat during high-power operation, and increased temperature leads to decreased output power, wavelength instability, and reduced lifespan. A common solution is to directly solder the ceramic-encapsulated semiconductor laser chip onto a copper heat sink during assembly. The copper heat sink enhances heat dissipation, thus ensuring the laser's stability under high-power operation.

[0004] However, the above method does not take into account that the contact area between the heat sink and one side of the semiconductor laser chip is large. Due to the laser generation principle of the conical semiconductor laser, the copper heat sink cannot completely enclose the semiconductor laser chip. That is, when the conical semiconductor laser heats up, it cannot dissipate heat evenly. As a result, the conical semiconductor laser will still experience heat rise due to long-term high-power operation, leading to a decrease in output power, unstable wavelength, and a reduced lifespan. Summary of the Invention

[0005] The purpose of this invention is to provide a tapered semiconductor laser to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a conical semiconductor laser, comprising: a semiconductor chip and a bottom heat sink located at the bottom of the semiconductor chip, wherein an insulating partition layer is provided at the connection between the semiconductor chip and the bottom heat sink, and the insulating partition layer is fixedly assembled with both, the insulating partition layer serves to insulate between the semiconductor chip and the bottom heat sink, a base is fixedly provided at the bottom of the bottom heat sink, at least two insulating limiting blocks are fixedly provided on the upper surface of the insulating partition layer, and the two insulating limiting blocks serve to limit the semiconductor chip, a protective unit is provided around the base, and a heat dissipation unit is mounted inside the protective unit; The protective unit is used to protect the outer periphery of the semiconductor chip and prevent the semiconductor chip from being bumped or knocked. The heat dissipation unit is used to uniformly dissipate heat from the outer periphery of the semiconductor chip, and the heat dissipation unit is distributed inside the protective unit. The semiconductor chip includes a tapered amplification region and a ridge waveguide region connected to the tapered amplification region. A Bragg grating structure is also provided at the end of the ridge waveguide region away from the tapered amplification region. The width of the tapered amplification region away from the ridge waveguide region gradually increases. The ends of the tapered amplification region and the ridge waveguide region that are far apart from each other are the front cavity surface and the rear cavity surface of the laser, respectively.

[0007] Preferably, the protective unit includes a top protective plate located on top of the bottom heat sink, and the top protective plate is hinged to both ends of the left and right sides with second connecting blocks. Each second connecting block has a first connecting block at one end near the base. One of the first connecting blocks is hinged to the base, and the other first connecting block is connected to the base with a locking component. The first connecting block can swing upwards from a horizontal position at a maximum angle of 90 degrees. An adjustment component is also provided between the second connecting block and the first connecting block on the same side.

[0008] Preferably, the locking component includes two symmetrically distributed mating portions located at the bottom of the first connecting block, and the edges of the mating portions are provided with chamfered portions. The base has an internal cavity located between the two mating portions. Two symmetrically distributed dome brake rods are slidably mounted inside the base. The mating portions have cylindrical cavities inside. One end of the dome brake rod is slidably embedded inside the cylindrical cavity, and the other end of the dome brake rod slides into the cavity. A sliding sleeve block is fixedly fitted on the outer surface of the dome brake rod, and the sliding sleeve block is slidably mounted inside the base. A first spring is provided between the end of the sliding sleeve block near the cavity and the base. The dome of the dome brake rod is away from the cavity, and the chamfered portion slides in contact with the dome of the dome brake rod. An actuating element is also provided between the two dome brake rods.

[0009] Preferably, the actuating element includes a gear located in the cavity, and toothed plates are fixedly provided on the opposing end faces of the two dome brake rods, and the two toothed plates mesh with the gear simultaneously. The two toothed plates are distributed above and below the gear. A rotating column is fixedly provided inside the gear, and the rotating column rotates through the cavity. A torsion block is fixedly provided at the end of the rotating column away from the cavity, and the torsion block is an internal hexagonal nut.

[0010] Preferably, the adjusting component includes at least two limiting rods fixedly disposed on one end face of the first connecting block near the same side of the second connecting block. A sliding plate is fixedly sleeved on the end face of the limiting rod away from the second connecting block, and the sliding plate is slidably assembled inside the first connecting block. A second spring is also fixedly disposed between the end of the sliding plate away from the second connecting block and the first connecting block. A limiting element is disposed between one of the limiting rods and the first connecting block.

[0011] Preferably, the limiting component includes a limiting sleeve located outside one of the limiting rods, and the limiting sleeve is fixed to the upper end face of the first connecting block. The outer surface of the limiting rod is provided with a plurality of ratchet grooves distributed in a straight line at equal intervals. A limiting slider is slidably assembled inside the limiting sleeve. One end of the limiting slider near the limiting rod extends out of the limiting sleeve. A braking block is fixedly provided on the end face of the limiting sleeve near the limiting rod, and the braking block is movably engaged with the ratchet grooves. A lever is fixedly provided on the upper end face of the limiting slider, and a sliding groove for the lever to slide is provided on the top of the limiting sleeve. An assembly slot is provided inside the limiting sleeve, and an elastically bent spring is placed inside the limiting sleeve. One end of the spring is fixedly embedded in the assembly slot, and the other end of the spring abuts against the end face of the limiting slider away from the limiting rod.

[0012] Preferably, the base, the top protective plate, the first connecting block, and the second connecting block are all made of the same type of engineering plastic material.

[0013] Preferably, a top heat sink is fixedly disposed on one end face of the top protective plate near the bottom heat sink, and a first side heat sink and a second side heat sink are fixedly disposed on one end face of the first connecting block and the second connecting block near the semiconductor chip, respectively. The bottom heat sink, the top heat sink, and the first side heat sink all have a finned structure, and the second side heat sink has a comb-like structure. The finned structure of the first side heat sink and the comb-like structure of the second side heat sink on the same side are staggered.

[0014] Preferably, the bottom heat sink, the top heat sink, the first side heat sink, and the second side heat sink are all made of copper.

[0015] Preferably, the semiconductor chip undergoes ceramic encapsulation.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention provides all-around protection for the semiconductor chip in a conical semiconductor laser through a protective unit, which can prevent the semiconductor chip from being impacted. At the same time, the heat dissipation unit installed inside the protective unit can evenly absorb and dissipate the heat generated by the semiconductor chip, avoiding the situation where only the bottom of the semiconductor chip has good heat dissipation while the top has poor heat dissipation. This ensures the stability and lifespan of the conical semiconductor laser during continuous high-power operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the unfolded structure of the protective unit of the present invention; Figure 3 This is a schematic diagram of the structure of the first side heat sink and the second side heat sink of the present invention; Figure 4 This is a schematic diagram of the internal structure of the base of the present invention; Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle; Figure 6 This is a schematic diagram of the positional distribution of the limiting sleeve and ratchet groove of the present invention; Figure 7 This is a schematic diagram of the internal structure of the limiting sleeve of the present invention.

[0018] In the diagram: 1. Semiconductor chip; 2. Conical amplification area; 3. Ridge waveguide area; 4. Bragg grating structure; 5. Bottom heat sink; 6. Insulating partition layer; 7. Insulating limiting block; 8. Base; 9. Top protective plate; 10. Top heat sink; 11. First connecting block; 12. Second connecting block; 13. First side heat sink; 14. Second side heat sink; 15. Cylindrical cavity; 16. Dome brake rod; 17. Sliding sleeve block; 18. First spring; 19. Toothed plate; 20. Gear; 21. Torsion block; 22. Connecting part; 23. Limiting rod; 24. Sliding plate; 25. Second spring; 26. Racket groove; 27. Limiting sleeve; 28. Limiting slider; 29. ​​Pulley; 30. Slide groove; 31. Assembly slot; 32. Spring; 33. Braking corner block; 34. Chamfered part. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1: Please refer to Figures 1-7 The diagram shows a conical semiconductor laser, comprising: a semiconductor chip 1 and a bottom heat sink 5 located at the bottom of the semiconductor chip 1. An insulating partition layer 6 is provided at the connection between the semiconductor chip 1 and the bottom heat sink 5, and the insulating partition layer 6 is fixedly assembled with both. The insulating partition layer 6 is used to insulate between the semiconductor chip 1 and the bottom heat sink 5. A base 8 is fixedly provided at the bottom of the bottom heat sink 5. At least two insulating limit blocks 7 are fixedly provided on the upper end surface of the insulating partition layer 6, and the two insulating limit blocks 7 limit the semiconductor chip 1. A protective unit is provided around the base 8, and a heat dissipation unit is mounted inside the protective unit. The protective unit is used to protect the outer periphery of the semiconductor chip 1 from impacts. The heat dissipation unit is used to uniformly dissipate heat from the outer periphery of the semiconductor chip 1, and the heat dissipation unit is distributed inside the protective unit. Semiconductor chip 1 includes a tapered amplification region 2 and a ridge waveguide region 3 connected to the tapered amplification region 2. A Bragg grating structure 4 is also provided at the end of the ridge waveguide region 3 away from the tapered amplification region 2. The width of the end of the tapered amplification region 2 away from the ridge waveguide region 3 increases step by step. The end faces of the tapered amplification region 2 and the ridge waveguide region 3 that are far apart from each other are the front cavity face and the rear cavity face of the laser, respectively.

[0021] The protective unit includes a top protective plate 9 located on top of the bottom heat sink 5, and second connecting blocks 12 are hinged to both ends of the top protective plate 9. Each second connecting block 12 has a first connecting block 11 near the end of the base 8. One first connecting block 11 is hinged to the base 8, and a locking component is provided between the other first connecting block 11 and the base 8. The first connecting block 11 can swing upward from a horizontal position at a maximum angle of 90 degrees. An adjustment component is also provided between the second connecting block 12 and the first connecting block 11 on the same side. The distance between the second connecting block 12 and the first connecting block 11 can be adjusted by the adjustment component, thereby adjusting the distance between the top protective plate 9 and the bottom heat sink 5. Under the action of the locking component, the bottom heat sink 5, the top protective plate 9, the two sets of first connecting blocks 11 and the second connecting blocks 12 form a rectangular frame. By operating the locking component, the rectangular frame can be disassembled and unfolded or locked and assembled.

[0022] The locking component includes two symmetrically distributed mating portions 22 located at the bottom of the first connecting block 11, with chamfered edges 34 on the edges of the mating portions 22. A cavity is formed inside the base 8, located between the two mating portions 22. Two symmetrically distributed dome brake rods 16 are slidably mounted inside the base 8. A cylindrical cavity 15 is formed inside the mating portion 22. One end of each dome brake rod 16 is slidably embedded inside the cylindrical cavity 15, and the other end of the dome brake rod 16 slides into the cavity. A sliding sleeve block 17 is fixedly fitted onto the outer surface of the dome brake rod 16 and slidably mounted inside the base 8. A first spring is provided between the end of the sliding sleeve block 17 near the cavity and the base 8. 18. The dome of the dome brake rod 16 is far from the cavity, and the chamfered part 34 slides in contact with the dome of the dome brake rod 16. An actuating element is also provided between the two dome brake rods 16. Under the action of the first actuating element, the two dome brake rods 16 can move synchronously in opposite directions to contact the dome brake rod 16's restriction on the cylindrical cavity 15. When the docking part 22 at the bottom of the first connecting block 11 is assembled with the base 8, its chamfered part 34 will push the dome of the extended dome brake rod 16. After the docking part 22 moves down to the appropriate position, the pushed dome brake rod 16 will elastically extend and embed into the interior of the cylindrical cavity 15, thereby locking the docking part 22 on the base 8.

[0023] The triggering element includes a gear 20 located in the cavity. The opposing end faces of the two dome brake rods 16 are each fixedly provided with a toothed plate 19, and the two toothed plates 19 mesh with the gear 20 simultaneously. The two toothed plates 19 are distributed above and below the gear 20. A rotating column is fixedly provided inside the gear 20, and the rotating column rotates through the cavity. A torsion block 21 is fixedly provided at the end of the rotating column away from the cavity. The torsion block 21 is an internal hexagonal nut, which can be rotated by a wrench, thereby causing the rotating column to rotate with the gear 20, so that the two toothed plates 19 move synchronously in opposite directions with the two dome brake rods 16.

[0024] The base 8, top protective plate 9, first connecting block 11, and second connecting block 12 are all made of the same engineering plastic material. The base 8, top protective plate 9, first connecting block 11, and second connecting block 12 made of engineering plastic material not only meet the requirements of insulation but also have good rigidity.

[0025] A top heat sink 10 is fixedly installed on one end face of the top protective plate 9 near the bottom heat sink 5. A first side heat sink 13 and a second side heat sink 14 are fixedly installed on one end face of the first connecting block 11 and the second connecting block 12 near the semiconductor chip 1, respectively. The bottom heat sink 5, the top heat sink 10, and the first side heat sink 13 are all finned structures, and the second side heat sink 14 is comb-shaped. The finned structure of the first side heat sink 13 and the comb-shaped structure of the second side heat sink 14 on the same side are staggered. When the second connecting block 12 and the first connecting block 11 are close to each other, several second side heat sinks 14 can be embedded in the gaps of the first side heat sink 13, that is, it will not affect the position adjustment of the first connecting block 11 and the second connecting block 12.

[0026] The bottom heat sink 5, the top heat sink 10, the first side heat sink 13, and the second side heat sink 14 are all made of copper. Copper has good thermal conductivity and is cheaper than precious metals.

[0027] Semiconductor chip 1 undergoes ceramic encapsulation, which is done by encapsulating semiconductor chip 1 with nitride ceramic material, giving semiconductor chip 1 excellent insulation, high temperature resistance, and corrosion resistance.

[0028] Example 2: Please refer to Figure 6 and Figure 7 This embodiment is a further description of other embodiments. The adjusting component includes at least two limiting rods 23 fixedly disposed on one end face of the first connecting block 11 near the same side of the second connecting block 12. A sliding plate 24 is fixedly sleeved on the end face of the limiting rod 23 away from the second connecting block 12, and the sliding plate 24 is slidably assembled inside the first connecting block 11. A second spring 25 is also fixedly disposed between the end of the sliding plate 24 away from the second connecting block 12 and the first connecting block 11. A limiting element is disposed between one of the limiting rods 23 and the first connecting block 11. According to the electronic structure and shell structure size of the semiconductor laser, the distance between the top protective plate 9 and the bottom heat sink 5 can be reduced and adjusted. Moreover, under the action of the limiting element, the position between the top protective plate 9 and the bottom heat sink 5 can be limited.

[0029] The limiting component includes a limiting sleeve 27 located outside one of the limiting rods 23, and the limiting sleeve 27 is fixed to the upper end face of the first connecting block 11. The outer surface of the limiting rod 23 has several ratchet grooves 26 distributed in a straight line at equal intervals. A limiting slider 28 is slidably mounted inside the limiting sleeve 27. One end of the limiting slider 28 near the limiting rod 23 extends out of the limiting sleeve 27. A braking block 33 is fixedly provided on the end face of the limiting sleeve 27 near the limiting rod 23, and the braking block 33 engages movably with the ratchet grooves 26. A lever 29 is fixedly provided on the upper end face of the limiting slider 28, and the limiting sleeve 27... The top of 7 has a groove 30 for sliding the lever 29. The inside of the limiting sleeve 27 has an assembly slot 31. The inside of the limiting sleeve 27 is a spring piece 32 that is elastically bent. One end of the spring piece 32 is fixedly embedded in the inside of the assembly slot 31, and the other end of the spring piece 32 abuts against the end face of the limiting slider 28 away from the limiting rod 23. When the limiting rod 23 moves downward, it can intermittently push the brake block 33 through several ratchet grooves 26. Under the elastic pressure of the spring piece 32 on the limiting slider 28, the brake block 33 can prevent the ratchet grooves 26 from moving upward.

[0030] Working principle: In this scheme, the cone-shaped semiconductor laser is in a state before complete assembly. Figure 2 After the semiconductor chip 1 is installed at its position, other electronic components and laser accessories are installed. After installation, the protective unit is assembled. During assembly, the two sets of first connecting blocks 11 and second connecting blocks 12, the top protective plate 9, and the base 8 are folded and assembled. Figure 1 In the state of the process, when the docking part 22 contacts the base 8, the chamfered part 34 of its edge will first push the dome position of the dome brake rod 16, so that the dome brake rod 16 extends into the cavity until the docking part 22 moves to the assembly position. At this time, under the reaction force of the first spring 18, the dome brake rod 16 will be embedded in the interior of the cylindrical cavity 15, thereby locking the position of the docking part 22, that is, allowing the protection unit to provide comprehensive protection for the semiconductor chip 1, which can ensure the safety of the cone semiconductor laser.

[0031] After the protective unit is installed, the bottom heat sink 5, the top heat sink 10, the two sets of first connecting blocks 11 and second connecting blocks 12 can surround the outer circumference of the semiconductor chip 1. At the same time, the operator can adjust the position of the top protective plate 9 through the space above the semiconductor chip 1, so that the top heat sink 10 is as close as possible to the semiconductor chip 1. During the adjustment process, simply press the top protective plate 9 down along with the top heat sink 10. At this time, the limit rod 23 will extend into the interior of the first connecting block 11 along with the slide 24, compressing the second spring 25. At the same time, the ratchet groove 26 will continuously push the brake block 33. After the protective plate 9 moves to the appropriate position with the top heat sink 10, the brake block 33 restricts the ratchet groove 26, and the spring 32 applies elastic pressure to the limit slider 28, so that the limit rod 23 cannot move upward with the top protective plate 9 to reset, that is, the position of the top heat sink 10 is maintained. Through the action of the bottom heat sink 5 around the semiconductor chip 1, the top heat sink 10, the two sets of first connecting blocks 11 and the second connecting blocks 12, the heat generated by the semiconductor chip 1 during operation can be evenly absorbed and then dissipated into the air, thereby avoiding uneven heat dissipation of the semiconductor chip 1 and ensuring the stability of the conical semiconductor laser during continuous operation.

[0032] In practical use, refer to Figure 1 The location shown in the diagram should be such that a cooling fan is installed on the outside of the protective unit, and the airflow blown by the cooling fan should be directed towards the front and rear ports of the protective unit. When the high-speed airflow passes through the inside of the protective unit, it can quickly dissipate the heat absorbed by the bottom heat sink 5, the top heat sink 10, the two sets of first connecting blocks 11 and the second connecting block 12, and ensure the heat dissipation effect on the semiconductor chip 1.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cone-shaped semiconductor laser, characterized in that, include: A semiconductor chip (1) and a bottom heat sink (5) located at the bottom of the semiconductor chip (1). An insulating partition layer (6) is provided at the connection between the semiconductor chip (1) and the bottom heat sink (5), and the insulating partition layer (6) is fixedly assembled with both. A base (8) is fixedly provided at the bottom of the bottom heat sink (5). At least two insulating limit blocks (7) are fixedly provided on the upper surface of the insulating partition layer (6). A protective unit is provided around the base (8), and a heat dissipation unit is installed inside the protective unit. The protective unit is used to protect the outer periphery of the semiconductor chip (1) and prevent the semiconductor chip (1) from being bumped or knocked. The heat dissipation unit is used to uniformly dissipate heat from the outer periphery of the semiconductor chip (1), and the heat dissipation unit is distributed inside the protective unit. The semiconductor chip (1) includes a tapered amplification region (2) and a ridge waveguide region (3) connected to the tapered amplification region (2). A Bragg grating structure (4) is also provided at the end of the ridge waveguide region (3) away from the tapered amplification region (2). The width of the end of the tapered amplification region (2) away from the ridge waveguide region (3) increases gradually. The ends of the tapered amplification region (2) and the ridge waveguide region (3) that are far apart from each other are the front cavity surface and the rear cavity surface of the laser, respectively.

2. The cone-shaped semiconductor laser according to claim 1, characterized in that: The protective unit includes a top protective plate (9) located on top of the bottom heat sink (5), and the top protective plate (9) is hinged to both the left and right ends with second connecting blocks (12). Each second connecting block (12) has a first connecting block (11) at one end near the base (8). One of the first connecting blocks (11) is hinged to the base (8), and the other first connecting block (11) is connected to the base (8) with a locking component. An adjustment component is also provided between the second connecting block (12) and the first connecting block (11) on the same side.

3. A cone-shaped semiconductor laser according to claim 2, characterized in that: The locking component includes a docking part (22) located at the bottom of the first connecting block (11), and the edge of the docking part (22) is provided with a chamfered part (34). The base (8) has a cavity inside, and two dome brake rods (16) are slidably mounted inside the base (8). The docking part (22) has a cylindrical cavity (15) inside. One end of the dome brake rod (16) is slidably embedded in the cylindrical cavity (15), and the other end of the dome brake rod (16) slides into the cavity. A sliding block (17) is fixedly sleeved on the outer surface of the dome brake rod (16). A first spring (18) is provided between the end of the sliding block (17) near the cavity and the base (8). An actuating element is also provided between the two dome brake rods (16).

4. A cone-shaped semiconductor laser according to claim 3, characterized in that: The trigger includes a gear (20) located in the cavity. The opposing end faces of the two dome brake rods (16) are fixedly provided with toothed plates (19), and the two toothed plates (19) mesh with the gear (20) at the same time. A rotating column is fixedly provided inside the gear (20), and the rotating column rotates through the cavity. A torsion block (21) is fixedly provided at the end of the rotating column away from the cavity.

5. A cone-shaped semiconductor laser according to claim 2, characterized in that: The adjusting component includes at least two limiting rods (23) fixedly disposed on one end face of the second connecting block (12) near the first connecting block (11). A sliding plate (24) is fixedly sleeved on one end face of the limiting rod (23) away from the second connecting block (12), and the sliding plate (24) is slidably assembled inside the first connecting block (11). A second spring (25) is provided on one end of the sliding plate (24) away from the second connecting block (12). A limiting element is provided between one of the limiting rods (23) and the first connecting block (11).

6. A cone-shaped semiconductor laser according to claim 5, characterized in that: The limiting component includes a limiting sleeve (27) located outside one of the limiting rods (23). The outer surface of the limiting rod (23) has several ratchet grooves (26). A limiting slider (28) is slidably fitted inside the limiting sleeve (27). A braking block (33) is fixedly provided on one end face of the limiting sleeve (27) near the limiting rod (23), and the braking block (33) is movably engaged with the ratchet grooves (26). The upper surface of the limiting slider (28)... A lever (29) is fixedly provided on the end face, and a sliding groove (30) for sliding the lever (29) is provided on the top of the limiting sleeve (27). An assembly slot (31) is provided inside the limiting sleeve (27). An elastically bent spring piece (32) is placed inside the limiting sleeve (27). One end of the spring piece (32) is fixedly embedded inside the assembly slot (31), and the other end of the spring piece (32) abuts against the end face of the limiting slider (28).

7. A cone-shaped semiconductor laser according to claim 2, characterized in that: The base (8), the top protective plate (9), the first connecting block (11), and the second connecting block (12) are all made of the same type of engineering plastic material.

8. A cone-shaped semiconductor laser according to claim 5, characterized in that: The top protective plate (9) is fixedly provided with a top heat sink (10) on one end face near the bottom heat sink (5). The first connecting block (11) and the second connecting block (12) are respectively fixedly provided with a first side heat sink (13) and a second side heat sink (14) on one end face near the semiconductor chip (1). The bottom heat sink (5), the top heat sink (10), and the first side heat sink (13) are all in a finned structure. The second side heat sink (14) is in a comb-like structure. The finned structure of the first side heat sink (13) and the comb-like structure of the second side heat sink (14) on the same side are interleaved.

9. A cone-shaped semiconductor laser according to claim 8, characterized in that: The bottom heat sink (5), the top heat sink (10), the first side heat sink (13), and the second side heat sink (14) are all made of copper.

10. A cone-shaped semiconductor laser according to claim 1, characterized in that: The semiconductor chip (1) is ceramic packaged.

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