Preassembled closed ring net cage and its production and assembly process

Abstract

The application discloses a preassembled closed ring net cage and a production and assembly process thereof and relates to the field of high-voltage switch devices.The preassembled closed ring net cage comprises a box body, two symmetrical box doors fixed on the box body, observation windows fixed on the box doors, switch devices installed in the box body, internal cooling mechanisms arranged in the box body, auxiliary cooling mechanisms arranged on the box body, and control devices fixed on one of the box doors.The internal cooling mechanisms are started by the control devices, the internal cooling mechanisms circulate high-temperature air in the box body, the air in the box body is cooled in the circulation process, the internal cooling mechanisms can be assisted by the auxiliary cooling mechanisms, the temperature in the box body is accurately controlled, switch device failures or insulation aging caused by overheating are prevented, and the operation stability and outdoor environmental adaptability of the device are improved.

Description

Technical Field

[0001] This application relates to the field of high-voltage switchgear, and in particular to prefabricated enclosed ring main units and their manufacturing and assembly processes. Background Technology

[0002] Ring main units are indispensable key equipment in power distribution network systems. They are usually installed at nodes in urban power distribution networks to realize power distribution, control and protection. Traditional ring main units generally adopt a metal shell structure and install high-voltage electrical components such as load switches and circuit breakers inside. They are connected to the external power grid through cable entry and exit. These devices are widely used in power distribution systems in industrial parks, residential communities, commercial complexes and other places, and play an important role in ensuring the continuity and security of power supply.

[0003] With the acceleration of urbanization and the improvement of power grid construction standards, prefabricated enclosed ring main units have gradually become the mainstream product form in the field of outdoor power distribution. Prefabricated enclosed ring main units adopt an integrated design concept, in which core electrical components such as switchgear, transformers, and distribution terminal units are pre-assembled and debugged in the factory, and then transported to the site for installation and commissioning. In order to adapt to the long-term operation requirements of complex outdoor environments, prefabricated enclosed ring main units usually adopt a fully welded sealed shell structure and are filled with dry air at a certain pressure as an insulating medium. Through the application of multi-layer anti-corrosion coatings and multiple sealing structures, the overall protection capability of the equipment is significantly improved, enabling it to effectively resist rainwater erosion, salt spray corrosion and extreme temperature changes, ensuring long-term stable operation of the equipment in a closed environment.

[0004] However, because the prefabricated enclosed ring main unit adopts a fully sealed structure, the interior is basically isolated from the external environment. Although the dry air that is filled in can provide good insulation performance, its thermal conductivity is poor. The heat generated by the switch device during normal operation and the heat dissipated by the semiconductor components during operation continuously accumulate in the sealed space, causing the temperature inside the box to rise continuously. In order to solve this problem, the existing technology usually adopts passive heat dissipation methods, such as setting heat dissipation fins on the surface of the box and increasing the heat dissipation area of ​​the box. However, the heat dissipation effect is poor and it is difficult to cope with the continuous heat dissipation requirements under extreme high temperature environments. The temperature inside the box is prone to exceed the safe operating threshold of the equipment and accelerates the aging of the insulation components. Summary of the Invention

[0005] The purpose of this application is to address the problems mentioned in the background art, which typically employ passive heat dissipation methods, such as setting heat dissipation fins on the surface of the enclosure or increasing the heat dissipation area of ​​the enclosure, resulting in poor heat dissipation performance, difficulty in meeting the continuous heat dissipation requirements under extreme high-temperature environments, easy for the internal temperature of the enclosure to exceed the safe operating threshold of the equipment, and accelerated aging of insulating components. This application provides a pre-assembled closed ring network enclosure and its production and assembly process.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution: A pre-installed enclosed ring network box includes a box body with two symmetrical doors fixed on the box body. Each door has an observation window. A switch device is installed inside the box body. Several temperature sensors are fixed on the inner wall of the box body. An internal cooling mechanism is provided inside the box body. An auxiliary cooling mechanism is provided on the box body. A control device is fixed on one of the doors. Several temperature sensors are electrically connected to the control device.

[0007] By adopting the above technical solution, the internal cooling mechanism is activated by the control device. The internal cooling mechanism circulates the high-temperature air inside the box and cools the air inside the box during the circulation process. At the same time, an auxiliary cooling mechanism can be used to assist in cooling the internal cooling mechanism, thereby achieving precise control of the temperature inside the box, preventing the switching device from malfunctioning or the insulation from aging due to overheating, and improving the operational stability and outdoor environmental adaptability of the equipment.

[0008] Furthermore, the internal cooling mechanism includes two symmetrically fixed circulating cooling chambers inside the housing. An air inlet cover is rotatably connected to the side of the circulating cooling chamber closest to the inside of the housing, and an air outlet cover is rotatably connected to the side of the circulating cooling chamber closest to the air inlet cover. A support assembly is provided between the air inlet cover, the air outlet cover and the circulating cooling chamber. A suction assembly is provided inside the circulating cooling chamber, a cooling assembly is provided inside the circulating cooling chamber, and an air guide assembly is provided inside the circulating cooling chamber.

[0009] By adopting the above technical solution, the high-temperature air inside the chamber is drawn in from the air inlet using the suction component, and then discharged to the cooling component. The cooling component cools the passing high-temperature air and it enters the chamber from the air outlet, thereby preventing external dust and moisture from entering the chamber and effectively reducing the temperature inside the chamber, thus achieving a highly efficient and sealed internal cooling function.

[0010] Furthermore, the suction assembly includes a suction chamber fixed inside the circulating cooling chamber, a suction impeller rotatably connected inside the suction chamber, a partition plate fixed inside the circulating cooling chamber, an air outlet end of the suction chamber penetrating the partition plate, a drive motor disposed outside the housing, the output end of the drive motor penetrating the housing, the circulating cooling chamber and the suction chamber, and fixedly connected to the suction impeller, and the drive motor electrically connected to the control device.

[0011] By adopting the above technical solution, the drive motor starts and drives the suction impeller to rotate at high speed, forming a negative pressure field in the suction chamber, thereby forcing the air in the chamber to enter the circulating cooling chamber, forming forced convection, improving cooling efficiency, thereby accelerating heat dissipation, and improving the response speed and cooling effect of the cooling system.

[0012] Furthermore, the cooling assembly includes a support plate fixed to the circulating cooling chamber, the support plate penetrating the circulating cooling chamber and the housing, a plurality of evenly distributed cooling semiconductor wafers fixed on the support plate, and temperature-conducting metal plates fixed on both sides of the support plate, the cooling semiconductor wafers abutting against the temperature-conducting metal plates, and evenly distributed temperature-conducting fins fixed on the temperature-conducting metal plates, the temperature-conducting fins on the cooling side of the cooling semiconductor wafers extending into the circulating cooling chamber and located on the side of the partition plate away from the suction chamber, the temperature-conducting fins on the heating side of the cooling semiconductor wafers extending out of the housing, and a plurality of the cooling semiconductor wafers being electrically connected to a control device.

[0013] By adopting the above technical solution, the cooling semiconductor chip rapidly absorbs the heat from the airflow in the circulating cooling chamber. The heat is transferred to the cooling side fins through the heat-conducting metal plate, which is preferably made of aluminum alloy with high thermal conductivity. This achieves a green cooling method without compressors or refrigerants, resulting in a quiet, efficient, and environmentally friendly cooling effect.

[0014] Furthermore, the air guiding assembly includes an air guiding plate one inside the circulating cooling chamber, the air guiding plate one being inclined and having air guiding holes between it and the circulating cooling chamber, and an air guiding plate two being fixed inside the circulating cooling chamber, the air guiding plate two being inclined and having air guiding holes between it and the circulating cooling chamber, the air guiding holes on the air guiding plate one and the air guiding holes on the air guiding plate two being staggered.

[0015] By adopting the above technical solution, the inclined arrangement of air guide plate one and air guide plate two forms an upward inclined airflow channel between them, thereby avoiding the possibility of water vapor condensing on the surface of the heat-conducting fins to form condensate water that enters the bottom of the circulating cooling chamber and then enters the box body from the air outlet cover.

[0016] Furthermore, the support assembly includes support rods respectively disposed on the air inlet cover and the air outlet cover. The support rods on the air inlet cover and the air outlet cover are located on the opposite side of the opening and closing direction and are fixedly connected to the circulating cooling chamber. A support electric telescopic rod is disposed between the air inlet cover, the air outlet cover and the support rod. The tail end of the support electric telescopic rod is rotatably connected to the support rod. The telescopic end of the support electric telescopic rod is rotatably connected to the corresponding air inlet cover and the air outlet cover. The support electric telescopic rod is electrically connected to the control device.

[0017] By adopting the above technical solution, the electric telescopic rod supports the movement of the air inlet cover and the air outlet cover, thereby realizing the connection or isolation between the circulating cooling chamber and the internal space of the box, and preventing the cooling system from running idle or external pollutants from entering.

[0018] Furthermore, the auxiliary cooling mechanism includes a cooling chamber fixed to the outside of the housing, the heat-conducting fins on the heating side of the cooling semiconductor chip penetrating the cooling chamber, a first connecting pipe fixed on the cooling chamber, a second connecting pipe fixed to the bottom of the cooling chamber, a connecting pipe fixed on both the first and second connecting pipes, the connecting pipe penetrating the housing and the circulating cooling chamber, a closing assembly provided inside the connecting pipe, the drive motor fixedly connected to the first connecting pipe, and the output end of the drive motor penetrating the first connecting pipe.

[0019] By adopting the above technical solution, the suction component simultaneously draws hot air from the auxiliary cooling mechanism and the box into the circulating cooling chamber. After cooling, part of the cooled air enters the box and part of the cooled air enters the cooling chamber, thereby achieving efficient heat dissipation of the cooling semiconductor chip, effectively extending the service life of the cooling component, and enhancing the continuous operation capability of the entire ring network box in high-temperature environments.

[0020] Furthermore, the closing assembly includes a closing cover rotatably connected inside the connecting pipe, a closing electric telescopic rod is provided between the closing cover and the inner wall of the connecting pipe, the tail of the closing electric telescopic rod is rotatably connected to the inner wall of the connecting pipe, and the telescopic end of the closing electric telescopic rod is rotatably connected to the closing cover.

[0021] By adopting the above technical solution, the closing electric telescopic rod drives the closing cover to move, thereby ensuring that the auxiliary cooling mechanism can intervene in a timely manner when needed and reliably isolate when not needed, further improving the intelligence and energy efficiency of the entire cooling system.

[0022] The production and assembly process of prefabricated enclosed ring network boxes is as follows: S1: Cold-rolled steel plate or stainless steel plate is selected as the main material of the box. The box panel is processed into shape by laser cutting and CNC bending. The panels are welded into a closed box by continuous full welding process to ensure structural strength and basic airtightness. The welded box is sandblasted to remove rust and then sprayed with zinc-rich primer, epoxy micaceous iron oxide intermediate paint and polyurethane topcoat in sequence to form a three-layer anti-corrosion coating. Observation window positions are opened on the box door and an observation window composed of double-layer tempered glass and silicone sealing structure is installed. Temperature sensors are pre-embedded in the inner wall of the box and the cable channels required for the control device are arranged. S2: The switchgear, consisting of core components such as load switches, fuses, and vacuum circuit breakers, is assembled on an independent mounting bracket in the cleanroom and mechanical linkage debugging is completed. The circulating cooling chamber, suction chamber, suction impeller, partition plate, air guide plate one, air guide plate two, refrigeration semiconductor chip, temperature-conducting metal plate, and temperature-conducting fins are pre-assembled into a modular cooling unit outside the box according to the design requirements. S3: Hoist and fix the pre-installed switchgear and internal cooling mechanism into the predetermined positions inside the enclosure according to the design layout. Install the circulating cooling chamber, suction chamber, drive motor, temperature-conducting fins, and cooling chamber. Ensure that the temperature-conducting fins on the heating side of the cooling semiconductor chip extend into the cooling chamber and the temperature-conducting fins on the cooling side extend into the circulating cooling chamber. Install the connecting pipe 1, connecting pipe 2, connecting pipe, and closing assembly in the auxiliary cooling mechanism. All cable entry points adopt a double-seal structure. Install high-elasticity sealing strips around the enclosure door. After closing the door, it is pressed tight by a multi-point locking mechanism. S4: Perform helium mass spectrometry or pressure decay method leak detection on the completed ring network box to ensure that the overall leakage rate is lower than the standard limit, fill with dry air, and complete the pre-assembled ring network box assembly.

[0023] Working principle: When the temperature sensor inside the chamber detects that the internal temperature has reached the preset cooling start threshold, the control device immediately triggers the cooling process. First, the electric telescopic rod of the support component moves synchronously, pushing the air inlet cover and air outlet cover to rotate around the support rod to the fully open state, establishing an airflow channel between the chamber and the circulating cooling chamber. Then, the control device starts the drive motor, driving the suction impeller in the suction chamber to rotate at high speed, forming a negative pressure field in the suction chamber. Under the action of negative pressure, the high-temperature air inside the chamber enters the circulating cooling chamber through the air inlet cover and is sucked into the suction chamber. After being accelerated by the impeller, it passes through the partition plate and enters the area where the cooling component is located.

[0024] After receiving the current signal from the control device, the cooling semiconductor chip of the cooling component uses the Peltier effect to transfer heat. The cooling side quickly absorbs the heat in the airflow through the heat-conducting metal plate and heat-conducting fins, thus cooling the high-temperature air. The heat generated on the heating side is dissipated to the outside of the chamber through the heat-conducting fins on the other side. The cooled airflow enters the air guide component area and flows along the inclined upward channel formed by air guide plate one and air guide plate two, preventing condensate from entering the chamber. Finally, it flows back into the chamber through the air outlet cover and mixes with the remaining high-temperature air to complete one cycle.

[0025] If the temperature sensor inside the cooling chamber detects that the temperature on the heating side of the cooling semiconductor chip exceeds the preset overheat threshold, the control device will activate the auxiliary cooling mechanism. The closing component's electric telescopic rod extends, opening the connecting pipe and allowing some of the low-temperature airflow from the circulating cooling chamber to enter the cooling chamber, directly cooling the heating side's heat-conducting fins to ensure stable performance of the cooling semiconductor chip. When the temperature inside the chamber drops to the safe threshold, the control device sequentially closes the closing component of the auxiliary cooling mechanism and the drive motor of the suction component, and finally controls the support electric telescopic rod to retract, precisely resetting the air inlet and outlet covers. The cooling system then enters standby mode, waiting for the next temperature trigger. The entire process, through the intelligent regulation of the control device, achieves dynamic temperature balance inside the ring network box, ensuring efficient and stable operation of the equipment in a sealed environment.

[0026] In summary, this application includes at least one of the following beneficial effects; 1. In this application, when the internal temperature is detected by the temperature sensor inside the chamber to reach a preset cooling start threshold, the electric telescopic rod of the support assembly moves synchronously, pushing the air inlet cover and air outlet cover to rotate around the support rod to a fully open state, establishing an airflow channel between the chamber and the circulating cooling chamber. Subsequently, the control device starts the drive motor, driving the suction impeller in the suction chamber to rotate at high speed, forming a negative pressure field in the suction chamber. The high-temperature air inside the chamber enters the circulating cooling chamber through the air inlet cover under the negative pressure and is sucked into the suction chamber. After being accelerated by the impeller, it passes through the partition plate and enters the area where the cooling assembly is located. After receiving the current signal from the control device, the cooling semiconductor chip of the cooling assembly realizes heat transfer using the Peltier effect. The cooling side is rapidly absorbed through the thermally conductive metal plate and thermally conductive fins. The heat in the airflow cools the high-temperature air, while the heat generated on the heating side dissipates to the outside of the enclosure through the heat-conducting fins on the other side. The cooled airflow enters the air guide assembly area and flows upward along the inclined channel formed by air guide plate one and air guide plate two, preventing condensate from entering the enclosure. Finally, it flows back into the enclosure through the air outlet cover, mixing with the remaining high-temperature air to complete one cycle. This achieves stable operation of the closed ring main unit in a sealed environment, reduces the occurrence of high temperatures, effectively avoids switch failures and insulation aging caused by overheating, significantly improves operational stability and service life, and ensures a green cooling mode without compressors or refrigerants. It also features quiet operation, high efficiency, and environmental protection, meeting the dual requirements of modern power equipment for reliability and sustainability.

[0027] 2. In this application, when the temperature sensor inside the cooling chamber detects that the temperature on the heating side of the cooling semiconductor chip exceeds a preset overheating threshold, the control device activates the auxiliary cooling mechanism. The closing electric telescopic rod of the closing component extends, opening the connecting pipe and allowing some of the low-temperature airflow in the circulating cooling chamber to enter the cooling chamber, directly cooling the heat-conducting fins on the heating side. This ensures the stable performance of the cooling semiconductor chip. When the temperature inside the chamber drops to a safe threshold, the control device sequentially closes the closing component of the auxiliary cooling mechanism and the drive motor of the suction component. Finally, it controls the retraction of the supporting electric telescopic rod, precisely resetting the air inlet and outlet covers. This further enhances the dynamic response capability and overall reliability of the cooling system, enabling the ring network box to adapt to extreme conditions such as high temperatures and high loads in summer. It effectively prevents the cooling semiconductor chip from failing due to overheating, minimizes energy consumption, and achieves a balance between high efficiency and energy saving in the cooling system. This provides dual protection for the long-term stable operation of the pre-installed enclosed ring network box.

[0028] 3. In this application, by designing the air guide plate one and the air guide plate two to form an upwardly inclined channel, the air first enters the space between the air guide plate one and the air guide plate two through the air guide hole one of the air guide plate one, then flows along the upwardly inclined channel, and then exits through the air guide hole two of the air guide plate two. When a very small amount of dry air in the closed ring network box cools and produces water, the water can settle at the lowest point of the inclination of the air guide plate two, thus achieving the possible purpose of preventing water vapor from condensing on the surface of the heat-conducting fins to form condensate water that enters the bottom of the circulating cooling chamber and then enters the box body from the air outlet cover. Attached Figure Description

[0029] Figure 1 This is a first three-dimensional structural schematic diagram of the pre-installed enclosed ring network box in this application; Figure 2 This is a schematic diagram of the second three-dimensional structure of the pre-installed enclosed ring network box in this application; Figure 3 This is a schematic diagram of the first internal structure of the internal cooling mechanism in this application; Figure 4 This is a schematic diagram of the second internal structure of the internal cooling mechanism in this application; Figure 5 This application Figure 3 Enlarged view of point A in the middle; Figure 6 This is a partial structural diagram of the closed component in this application.

[0030] Explanation of reference numerals in the attached figures: 1. Enclosure; 2. Enclosure door; 3. Observation window; 4. Switching device; 5. Temperature sensor; 6. Internal cooling mechanism; 61. Circulating cooling chamber; 62. Air inlet cover; 63. Air outlet cover; 64. Suction assembly; 641. Suction impeller; 642. Suction chamber; 643. Partition plate; 644. Drive motor; 65. Cooling assembly; 651. Support plate; 652. Refrigeration semiconductor chip; 653. Temperature-conducting metal plate; 654. Temperature-conducting fins; 66. Air guide assembly; 661. Air guide plate one; 662. Air guide plate two; 67. Support assembly; 671. Support rod; 672. Support electric telescopic rod; 7. Auxiliary cooling mechanism; 71. Cooling chamber; 72. Connecting pipe one; 73. Connecting pipe two; 74. Connecting pipe; 75. Closing assembly; 751. Closing cover; 752. Closing electric telescopic rod; 8. Control device. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1 —6 provides further details regarding this application.

[0032] This application discloses a pre-assembled closed ring network box and its production and assembly process.

[0033] Reference Figure 1 , Figure 2 and Figure 3 The pre-installed enclosed ring network box includes a box body 1, two symmetrical boxes 2 fixed on the box body 1, observation windows 3 fixed on the boxes 2, a switch device 4 installed inside the box body 1, several temperature sensors 5 fixed on the inner wall of the box body 1, an internal cooling mechanism 6 installed inside the box body 1, an auxiliary cooling mechanism 7 installed on the box body 1, a control device 8 fixed on one of the boxes 2, and several temperature sensors 5 electrically connected to the control device 8.

[0034] The enclosure 1, serving as the basic load-bearing structure of the pre-assembled enclosed ring network box, is constructed from welded metal sheets. Two symmetrical doors 2 are installed on the front of the enclosure 1 for easy operation and maintenance. An observation window 3 is fixed to the door 2 for observing the working status of the internal switching device 4. Several temperature sensors 5 are installed on the inner wall of the enclosure 1 to monitor temperature changes in real time. An internal cooling mechanism 6 and an auxiliary cooling mechanism 7 are installed on the enclosure 1, working together to control the internal temperature. A control device 8 is fixed to one of the doors 2 and electrically connected to all temperature sensors 5. It receives temperature signals and controls the start and stop of the internal cooling mechanism 6 and the auxiliary cooling mechanism 7. A temperature threshold is set on the control device 8. The temperature sensors 5 monitor the temperature inside the enclosure 1 in real time. When the temperature exceeds the set threshold, the control device 8 activates the internal cooling mechanism 6, which then cools the enclosure. The high-temperature air inside the chamber 1 is circulated, and during the circulation process, the air inside the chamber 1 is cooled down. The cooled air further reduces the temperature inside the chamber 1. While the internal cooling mechanism 6 is working, the auxiliary cooling mechanism 7 can be used to assist in cooling the internal cooling mechanism 6, thereby improving the cooling effect of the internal cooling mechanism 6 on the high-temperature air. The temperature sensor 5 monitors the temperature inside the chamber in real time, and the control device 8 controls the start and stop of the internal cooling mechanism 6 and the cooling mechanism according to the temperature changes, so as to achieve precise control of the temperature inside the chamber, prevent the switch device 4 from malfunctioning or the insulation from aging due to overheating, and improve the operational stability and outdoor environmental adaptability of the equipment.

[0035] Reference Figure 3 , Figure 4 and Figure 5 The internal cooling mechanism 6 includes two symmetrically fixed circulating cooling chambers 61 inside the housing 1. An air inlet cover 62 is rotatably connected to the side of the circulating cooling chamber 61 closest to the inside of the housing 1, and an air outlet cover 63 is rotatably connected to the side of the circulating cooling chamber 61 closest to the air inlet cover 62. A support assembly 67 is provided between the air inlet cover 62, the air outlet cover 63 and the circulating cooling chamber 61. A suction assembly 64 is provided inside the circulating cooling chamber 61. A cooling assembly 65 is provided inside the circulating cooling chamber 61. An air guide assembly 66 is provided inside the circulating cooling chamber 61.

[0036] Two circulating cooling chambers 61 are located on both sides of the housing 1. Based on the principle of hot and cold air stratification, air inlets are opened at the top of the circulating cooling chambers 61 and air inlet covers 62 are installed to facilitate the entry of hot air into the circulating cooling chambers 61. Air outlets are opened at the lower part of the circulating cooling chambers 61 to refill the housing 1 with cooled air. Corresponding support components 67 control the opening and closing of the air inlet covers 62 and the air outlet covers 63 respectively. During internal cooling, the support components 67 are used to open the air inlet covers 62 and the air outlet covers 63, and then the suction component 64 is used to open the housing 1. High-temperature air is drawn in through the air inlet and then discharged to the cooling component 65. The cooling component 65 cools the passing high-temperature air. The cooled air then passes through the air guide component 66 and finally enters the housing 1 through the air outlet. The opening and closing of the air inlet cover 62 and the air outlet cover 63, combined with the coordinated work of the suction component 64, the cooling component 65 and the air guide component 66, form a closed internal air circulation cooling system. This prevents external dust and moisture from entering the housing and effectively reduces the internal temperature, thus achieving a highly efficient and sealed internal cooling function.

[0037] Reference Figure 3 , Figure 4 and Figure 5 The suction assembly 64 includes a suction chamber 642 fixed inside the circulating cooling chamber 61. A suction impeller 641 is rotatably connected inside the suction chamber 642. A partition plate 643 is fixed inside the circulating cooling chamber 61. The air outlet of the suction chamber 642 passes through the partition plate 643. A drive motor 644 is provided on the outside of the housing 1. The output end of the drive motor 644 passes through the housing 1, the circulating cooling chamber 61 and the suction chamber 642, and is fixedly connected to the suction impeller 641. The drive motor 644 is electrically connected to the control device 8.

[0038] When the control device 8 receives a high-temperature signal from the temperature sensor 5, the drive motor 644 starts and drives the suction impeller 641 to rotate at high speed, creating a negative pressure field in the suction chamber 642. At this time, the air inlet cover 62 and the air outlet cover 63 of the circulating cooling chamber 61 are opened. The high-temperature air in the box 1 is pushed open by the negative pressure and enters the circulating cooling chamber 61 through the air inlet cover 62. It is then sucked into the suction chamber 642. The high-temperature airflow, accelerated by the suction impeller 641, passes through the partition plate 643 through the air outlet of the suction chamber 642 and enters the rear half of the circulating cooling chamber 61 where the cooling assembly 65 is located, providing a stable cooling environment for subsequent cooling processes. The airflow input is effectively separated into the suction section and the cooling section by the partition plate 643, preventing uncooled high-temperature air from flowing back into the chamber 1 and ensuring cooling efficiency. At the same time, the speed of the drive motor 644 can be adjusted in real time by the control device 8 according to the temperature inside the chamber. The higher the temperature, the faster the speed, in order to enhance the suction force and airflow circulation speed, and realize dynamic cooling control. By driving the suction impeller 641 to rotate through the drive motor 644, the air inside the chamber is forced into the circulating cooling chamber 61 to form forced convection, which improves the cooling efficiency, thereby accelerating the heat dissipation and improving the response speed and cooling effect of the cooling system.

[0039] Reference Figure 3 and Figure 4 The cooling assembly 65 includes a support plate 651 fixed on the circulating cooling chamber 61. The support plate 651 passes through the circulating cooling chamber 61 and the housing 1. Several uniformly distributed cooling semiconductor chips 652 are fixed on the support plate 651. Temperature-conducting metal plates 653 are fixed on both sides of the support plate 651. The cooling semiconductor chips 652 abut against the temperature-conducting metal plates 653. Temperature-conducting fins 654 are uniformly distributed on the temperature-conducting metal plates 653. The temperature-conducting fins 654 on the cooling side of the cooling semiconductor chip 652 extend into the circulating cooling chamber 61 and are located on the side of the partition plate 643 away from the suction chamber 642. The temperature-conducting fins 654 on the heating side of the cooling semiconductor chip 652 extend out of the housing 1. Several cooling semiconductor chips 652 are electrically connected to the control device 8.

[0040] The cooling semiconductor chip 652 employs the thermoelectric cooling principle. When the control device 8 inputs current to it, the cooling side rapidly absorbs heat from the airflow within the circulating cooling chamber 61. This heat is transferred to the cooling-side heat-conducting fins 654 via the heat-conducting metal plate 653 (preferably made of highly thermally conductive aluminum alloy). The increased heat exchange area of ​​the fins efficiently reduces the airflow temperature. Simultaneously, the heat generated on the heating side dissipates to the external environment of the chamber 1 through the heat-conducting metal plate 653 and the heat-conducting fins 654, preventing heat from being conducted back into the chamber 1. Several cooling semiconductor chips 652 are evenly distributed in a matrix on the support plate 651, ensuring comprehensive coverage of the airflow within the circulating cooling chamber 61. The cover enhances cooling uniformity. The low-temperature airflow, after being processed by the cooling component 65, returns to the chamber 1 from the air outlet cover 63, mixing with the high-temperature air inside the chamber to complete one cooling cycle. The control device 8 can dynamically adjust the working power of the cooling semiconductor chip 652 according to the temperature inside the chamber fed back by the temperature sensor 5, to achieve on-demand cooling, ensuring both cooling effect and energy consumption reduction. Through the Peltier effect of the cooling semiconductor chip 652, the heat in the circulating cooling chamber 61 is efficiently conducted to the outside of the chamber 1. At the same time, the contact area is increased by using the thermally conductive metal plate 653 and thermally conductive fins 654, thereby achieving a green cooling method without compressors or refrigerants, achieving a quiet, efficient, and environmentally friendly cooling effect.

[0041] Reference Figure 3 and Figure 4 The air guiding assembly 66 includes an air guiding plate 661 inside the circulating cooling chamber 61. The air guiding plate 661 is inclined and has air guiding holes between it and the circulating cooling chamber 61. An air guiding plate 662 is fixed inside the circulating cooling chamber 61. The air guiding plate 662 is inclined and has air guiding holes between it and the circulating cooling chamber 61. The air guiding holes on the air guiding plate 661 and the air guiding holes on the air guiding plate 662 are staggered.

[0042] Air guide plate 661 is inclined, with its high end near the top of the circulating cooling chamber 61 and its low end near the bottom of the circulating cooling chamber 61. An air guide hole is provided between it and the inner wall of the circulating cooling chamber 61, located at the bottom of air guide plate 661. Air guide plate 662 is also inclined, with its high end near the top of the circulating cooling chamber 61 and its low end near the bottom of the circulating cooling chamber 61. An air guide hole is located at the high end of air guide plate 662, creating an upwardly inclined channel design. Air first enters the air guide plate 661 through the air guide hole. The airflow between the first air guide plate 661 and the second air guide plate 662 flows along the upward inclined channel and is discharged through the second air guide hole of the second air guide plate 662. When a very small amount of dry air in the closed ring network box is cooled and water is discharged, the water can settle at the lowest point of the inclination of the second air guide plate 662. Through the inclined arrangement of the first air guide plate 661 and the second air guide plate 662, an upward inclined airflow channel is formed between them, thereby preventing water vapor from condensing on the surface of the heat-conducting fins 654 to form condensate water that enters the bottom of the circulating cooling chamber 61 and then enters the box 1 from the air outlet cover 63.

[0043] Reference Figure 3 , Figure 4 and Figure 5 The support assembly 67 includes support rods 671 respectively disposed on the air inlet cover 62 and the air outlet cover 63. The support rods 671 on the air inlet cover 62 and the air outlet cover 63 are located on the opposite side of the opening and closing direction and are fixedly connected to the circulating cooling chamber 61. A support electric telescopic rod 672 is disposed between the air inlet cover 62, the air outlet cover 63 and the support rods 671. The tail of the support electric telescopic rod 672 is rotatably connected to the support rod 671. The telescopic end of the support electric telescopic rod 672 is rotatably connected to the corresponding air inlet cover 62 and the air outlet cover 63. The support electric telescopic rod 672 is electrically connected to the control device 8.

[0044] The supporting electric telescopic rod 672 adopts a waterproof and dustproof shell, and the main body is made of 304 stainless steel. When the control device 8 detects that the temperature inside the chamber is higher than the preset critical value, it immediately sends a start signal to the supporting electric telescopic rod 672. The supporting electric telescopic rod 672 on the side of the air inlet cover 62 extends along the preset trajectory, pushing the air inlet cover 62 to rotate around the supporting rod 671, maximizing the entry area of ​​high-temperature air. The supporting electric telescopic rod 672 on the side of the air outlet cover 63 moves synchronously, pushing the air outlet cover 63 open, providing a smooth return channel for the cooled airflow. After the temperature inside the chamber drops to a safe range, the control device 8 issues a closing command, and the supporting electric telescopic rod 672 slowly retracts, driving the air inlet cover 62 and the air outlet cover 63 to accurately reset. The opening and closing of the air inlet cover 62 and the air outlet cover 63 are driven by the electric telescopic rod to realize the connection or isolation between the circulating cooling chamber 61 and the internal space of the chamber, avoiding the cooling system from running dry or external pollutants from entering.

[0045] Reference Figure 3 , Figure 4 and Figure 6 The auxiliary cooling mechanism 7 includes a cooling chamber 71 fixed to the outside of the housing 1. The heat-conducting fins 654 on the heating side of the cooling semiconductor chip 652 pass through the cooling chamber 71. A connecting pipe 72 is fixed on the cooling chamber 71. A connecting pipe 73 is fixed to the bottom of the cooling chamber 71. A connecting pipe 74 is fixed on both the connecting pipe 72 and the connecting pipe 73. The connecting pipe 74 passes through the housing 1 and the circulating cooling chamber 61. A closing component 75 is provided inside the connecting pipe 74. A drive motor 644 is fixedly connected to the connecting pipe 72. The output end of the drive motor 644 passes through the connecting pipe 72.

[0046] The heat-conducting fins 654 on the heating side of the cooling semiconductor chip 652 penetrate the cooling chamber 71, transferring heat into the cooling chamber 71. A connecting pipe 72 is fixed to the cooling chamber 71, and a connecting pipe 73 is fixed to the bottom of the cooling chamber 71. Connecting pipes 74 are fixed to both connecting pipes 72 and 73, penetrating the housing 1 and the circulating cooling chamber 61. A closing component 75 is installed inside the connecting pipe 74. A temperature sensor 5 is installed inside the cooling chamber 71. When the heating semiconductor chip overheats, the control device 8 opens the closing component 75, and the suction component 64 simultaneously draws hot air from the auxiliary cooling mechanism 7 and the housing 1 into the circulating cooling chamber 61. After cooling, some of the cooled air enters the housing 1, and some of the cooled air... Warm air enters the cooling chamber 71 and directly cools the heat-conducting fins 654 on the heating side, quickly removing heat from the fin surface and further improving the heat exchange efficiency of the cooling semiconductor chip 652. This prevents performance degradation or failure due to excessively high heating side temperature. When the control device 8 detects that the heating side temperature has dropped to a preset threshold, the closing component 75 automatically closes the connecting pipe 74, cutting off the airflow channel between the circulating cooling chamber 61 and the cooling chamber 71. The auxiliary cooling mechanism 7 stops operating to reduce unnecessary energy consumption. By allowing the auxiliary cooling mechanism 7 to utilize the internal circulating airflow for secondary use, efficient heat dissipation of the cooling semiconductor chip 652 is achieved, effectively extending the service life of the cooling component 65 and enhancing the continuous operation capability of the entire ring network box in high-temperature environments.

[0047] Reference Figure 3 , Figure 4 and Figure 6 The closing assembly 75 includes a closing cover 751 rotatably connected inside the connecting pipe 74. A closing electric telescopic rod 752 is provided between the closing cover 751 and the inner wall of the connecting pipe 74. The tail of the closing electric telescopic rod 752 is rotatably connected to the inner wall of the connecting pipe 74, and the telescopic end of the closing electric telescopic rod 752 is rotatably connected to the closing cover 751.

[0048] The closed electric telescopic rod 752 is electrically connected to the control device 8. Its operation is precisely controlled by the control device 8 based on the temperature signal of the heating side fins fed back by the temperature sensor 5 inside the cooling chamber 71. When the temperature inside the cooling chamber 71 exceeds the preset threshold, the control device 8 sends an extension command to the closed electric telescopic rod 752. The closed electric telescopic rod 752 pushes the closing cover 751 to rotate around the rotation point, so that the connecting pipe 74 is fully opened, allowing the low-temperature airflow in the circulating cooling chamber 61 to enter the cooling chamber 71. When the temperature inside the cooling chamber 71 drops back to a safe range, the control device 8 issues a retraction command, and the closed electric telescopic rod 752 pulls the closing cover 751 to reset. The rapid opening and closing of the connecting pipe 74 is achieved through electric control, ensuring that the auxiliary cooling mechanism 7 can intervene in a timely manner when needed and reliably isolate when not needed, further improving the intelligence and energy efficiency of the entire cooling system.

[0049] The production and assembly process of prefabricated enclosed ring network boxes is as follows: S1: Cold-rolled steel plate or stainless steel plate is selected as the main material of the box body 1. The box body 1 panel is processed by laser cutting and CNC bending process. The panels are welded into a closed box body 1 by continuous full welding process to ensure structural strength and basic air tightness. The welded box body 1 is sandblasted to remove rust and then sprayed with zinc-rich primer, epoxy micaceous iron oxide intermediate paint and polyurethane topcoat in sequence to form a three-layer anti-corrosion coating. Observation window 3 is opened on the box door 2 and an observation window 3 consisting of double-layer tempered glass and silicone sealing structure is installed. Temperature sensor 5 is pre-embedded in the inner wall of the box body 1 and the cable channel required for the control device 8 is arranged. S2: The switchgear 4, composed of core components such as load switches, fuses, and vacuum circuit breakers, is assembled on an independent mounting bracket in the cleanroom and mechanical linkage debugging is completed. The circulating cooling chamber 61, suction chamber 642, suction impeller 641, partition plate 643, air guide plate 1 661, air guide plate 2 662, cooling semiconductor chip 652, temperature-conducting metal plate 653, and temperature-conducting fins 65 are pre-assembled into a modular cooling unit outside the box 1 according to the design requirements. S3: Hoist and fix the pre-installed switch device 4 and internal cooling mechanism 6 into the predetermined position inside the box 1 according to the design layout. Install the circulating cooling chamber 61, suction chamber 642, drive motor 644, temperature-conducting fins 654, and cooling chamber 71. Ensure that the heating side temperature-conducting fins 654 of the cooling semiconductor chip 652 extend into the cooling chamber 71 and the cooling side temperature-conducting fins 654 extend into the circulating cooling chamber 61. Install the connecting pipe 1 72, connecting pipe 2 73, connecting pipe 74, and closing component 75 in the auxiliary cooling mechanism 7. All cable entry points adopt a double-seal structure. Install high-elasticity sealing strips around the box door 2. After closing the door, it is pressed by a multi-point locking mechanism. S4: Perform helium mass spectrometry or pressure decay method leak detection on the completed ring network box to ensure that the overall leakage rate is lower than the standard limit, fill with dry air, and complete the pre-assembled ring network box assembly.

[0050] Working principle: When the temperature sensor 5 inside the housing 1 detects that the internal temperature has reached the preset cooling start threshold, the control device 8 immediately triggers the cooling process. First, the electric telescopic rod 672 of the support component 67 moves synchronously, pushing the air inlet cover 62 and the air outlet cover 63 to rotate around the support rod 671 to the fully open state, establishing an airflow channel between the housing 1 and the circulating cooling chamber 61. Then, the control device 8 starts the drive motor 644, driving the suction impeller 641 in the suction chamber 642 to rotate at high speed, forming a negative pressure field in the suction chamber 642. Under the action of negative pressure, the high-temperature air in the housing 1 enters the circulating cooling chamber 61 through the air inlet cover 62 and is sucked into the suction chamber 642. After being accelerated by the impeller, it enters the area where the cooling component 65 is located through the partition plate 643.

[0051] After receiving the current signal from the control device 8, the cooling semiconductor chip 652 of the cooling component 65 uses the Peltier effect to transfer heat. The cooling side quickly absorbs the heat in the airflow through the heat-conducting metal plate 653 and the heat-conducting fins 654, thus cooling the high-temperature air. The heat generated on the heating side is dissipated to the outside of the box 1 through the heat-conducting fins 654 on the other side. The cooled airflow enters the area of ​​the air guide component 66 and flows along the inclined upward channel formed by the first air guide plate 661 and the second air guide plate 662, preventing condensate from entering the box 1. Finally, it flows back into the box through the air outlet cover 63 and mixes with the remaining high-temperature air to complete one cycle.

[0052] If the temperature sensor 5 inside the cooling chamber 71 detects that the temperature on the heating side of the cooling semiconductor chip 652 exceeds the preset overheat threshold, the control device 8 will activate the auxiliary cooling mechanism 7. The closing electric telescopic rod 752 of the closing component 75 will extend, opening the connecting pipe 74, allowing some of the low-temperature airflow in the circulating cooling chamber 61 to enter the cooling chamber 71 and directly cool the heating side heat-conducting fins 654, ensuring the stable performance of the cooling semiconductor chip 652. When the temperature inside the chamber 1 drops to the safe threshold, the control device 8 will sequentially close the closing component 75 of the auxiliary cooling mechanism 7 and the drive motor 644 of the suction component 64, and finally control the support electric telescopic rod 672 to retract, so that the air inlet cover 62 and the air outlet cover 63 are precisely reset. The cooling system enters the standby state, waiting for the next temperature trigger. The entire process is intelligently controlled by the control device 8 to achieve dynamic temperature balance inside the ring network box, ensuring efficient and stable operation of the equipment in a sealed environment.

[0053] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A pre-assembled enclosed ring network box, comprising a box body (1), characterized in that: The box (1) has two symmetrical doors (2) fixed on it. The doors (2) are fixed with observation windows (3). The box (1) is equipped with a switch device (4). The inner wall of the box (1) is fixed with several temperature sensors (5). The box (1) is equipped with an internal cooling mechanism (6). The box (1) is equipped with an auxiliary cooling mechanism (7). One of the doors (2) is fixed with a control device (8). The temperature sensors (5) are electrically connected to the control device (8).

2. The pre-assembled enclosed ring network box according to claim 1, characterized in that: The internal cooling mechanism (6) includes two symmetrically fixed circulating cooling chambers (61) inside the housing (1). An air inlet cover (62) is rotatably connected to the side of the circulating cooling chamber (61) near the inside of the housing (1). An air outlet cover (63) is rotatably connected to the side of the circulating cooling chamber (61) near the air inlet cover (62). A support assembly (67) is provided between the air inlet cover (62), the air outlet cover (63) and the circulating cooling chamber (61). A suction assembly (64) is provided inside the circulating cooling chamber (61). A cooling assembly (65) is provided inside the circulating cooling chamber (61). An air guide assembly (66) is provided inside the circulating cooling chamber (61).

3. The pre-assembled enclosed ring network box according to claim 2, characterized in that: The suction assembly (64) includes a suction chamber (642) fixed inside the circulating cooling chamber (61), a suction impeller (641) is rotatably connected inside the suction chamber (642), a partition plate (643) is fixed inside the circulating cooling chamber (61), the air outlet of the suction chamber (642) passes through the partition plate (643), a drive motor (644) is provided on the outside of the housing (1), the output end of the drive motor (644) passes through the housing (1), the circulating cooling chamber (61) and the suction chamber (642), and is fixedly connected to the suction impeller (641), and the drive motor (644) is electrically connected to the control device (8).

4. The pre-assembled enclosed ring network box according to claim 3, characterized in that: The cooling assembly (65) includes a support plate (651) fixed on the circulating cooling chamber (61). The support plate (651) passes through the circulating cooling chamber (61) and the housing (1). A plurality of uniformly distributed cooling semiconductor chips (652) are fixed on the support plate (651). Temperature-conducting metal plates (653) are fixed on both sides of the support plate (651). The cooling semiconductor chips (652) abut against the temperature-conducting metal plates (653). Temperature-conducting fins (654) are uniformly distributed on the temperature-conducting metal plates (653). The temperature-conducting fins (654) on the cooling side of the cooling semiconductor chip (652) extend into the circulating cooling chamber (61) and are located on the side of the partition plate (643) away from the suction chamber (642). The temperature-conducting fins (654) on the heating side of the cooling semiconductor chip (652) extend out of the housing (1). A plurality of the cooling semiconductor chips (652) are electrically connected to the control device (8).

5. The pre-assembled enclosed ring network box according to claim 2, characterized in that: The air guide assembly (66) includes an air guide plate (661) inside the circulating cooling chamber (61). The air guide plate (661) is inclined and has an air guide hole between it and the circulating cooling chamber (61). An air guide plate (662) is fixed inside the circulating cooling chamber (61). The air guide plate (662) is inclined and has an air guide hole between it and the circulating cooling chamber (61). The air guide holes on the air guide plate (661) and the air guide holes on the air guide plate (662) are staggered.

6. The prefabricated enclosed ring network box according to claim 2, characterized in that: The support assembly (67) includes support rods (671) respectively disposed on the air inlet cover (62) and the air outlet cover (63). The support rods (671) on the air inlet cover (62) and the air outlet cover (63) are located on the opposite side of the opening and closing direction and are fixedly connected to the circulating cooling chamber (61). A support electric telescopic rod (672) is disposed between the air inlet cover (62), the air outlet cover (63) and the support rod (671). The tail of the support electric telescopic rod (672) is rotatably connected to the support rod (671). The telescopic end of the support electric telescopic rod (672) is rotatably connected to the corresponding air inlet cover (62) and the air outlet cover (63). The support electric telescopic rod (672) is electrically connected to the control device (8).

7. The pre-assembled enclosed ring network box according to claim 4, characterized in that: The auxiliary cooling mechanism (7) includes a cooling chamber (71) fixed on the outside of the box (1). The heat-conducting fins (654) on the heating side of the cooling semiconductor chip (652) penetrate the cooling chamber (71). A connecting pipe (72) is fixed on the cooling chamber (71). A connecting pipe (73) is fixed at the bottom of the cooling chamber (71). A connecting pipe (74) is fixed on both the connecting pipe (72) and the connecting pipe (73). The connecting pipe (74) penetrates the box (1) and the circulating cooling chamber (61). A closing component (75) is provided inside the connecting pipe (74). The drive motor (644) is fixedly connected to the connecting pipe (72). The output end of the drive motor (644) penetrates the connecting pipe (72).

8. The pre-assembled enclosed ring network box according to claim 7, characterized in that: The closing assembly (75) includes a closing cover (751) rotatably connected inside the connecting pipe (74). A closing electric telescopic rod (752) is provided between the closing cover (751) and the inner wall of the connecting pipe (74). The tail of the closing electric telescopic rod (752) is rotatably connected to the inner wall of the connecting pipe (74), and the telescopic end of the closing electric telescopic rod (752) is rotatably connected to the closing cover (751).

9. The production and assembly process of prefabricated enclosed ring network boxes, characterized in that: This production and assembly process is applicable to the pre-assembled closed ring network box described in any one of claims 1-8 above, and the production and assembly process is as follows: S1: Select cold-rolled steel plate or stainless steel plate as the main material of the box (1), process the box (1) panel by laser cutting and CNC bending process, and weld each panel into a closed box (1) by continuous full welding process to ensure structural strength and basic air tightness. Sandblasting and rust removal treatment are carried out on the welded box (1), and zinc-rich primer, epoxy micaceous iron oxide intermediate paint and polyurethane topcoat are sprayed in sequence to form a three-layer anti-corrosion coating. An observation window (3) hole is opened on the box door (2), and an observation window (3) composed of double-layer tempered glass and silicone sealing structure is installed. A temperature sensor (5) is pre-embedded in the inner wall of the box (1), and the cable channel required for the control device (8) is arranged. S2: The switchgear (4), composed of core components such as load switch, fuse, and vacuum circuit breaker, is assembled on an independent mounting bracket in the clean room and mechanical linkage debugging is completed. The circulating cooling chamber (61), suction chamber (642), suction impeller (641), partition plate (643), air guide plate one (661), air guide plate two (662), refrigeration semiconductor chip (652), temperature-conducting metal plate (653), and temperature-conducting fin (654) are pre-assembled into a modular cooling unit outside the box (1) according to the design requirements. S3: Hoist and fix the pre-installed switch device (4) and internal cooling mechanism (6) in the predetermined position inside the box (1) according to the design layout. Install the circulating cooling chamber (61), suction chamber (642), drive motor (644), temperature-conducting fins (654), and cooling chamber (71). Ensure that the heating side temperature-conducting fins (654) of the cooling semiconductor chip (652) extend into the cooling chamber (71) and the cooling side temperature-conducting fins (654) extend into the circulating cooling chamber (61). Install the connecting pipe one (72), connecting pipe two (73), connecting pipe (74), and closing component (75) in the auxiliary cooling mechanism (7). All cable entry points adopt a double-sealing structure. Install high-elasticity sealing strips around the box door (2). After closing the door, press it with a multi-point locking mechanism. S4: Perform helium mass spectrometry or pressure decay method leak detection on the completed ring network box to ensure that the overall leakage rate is lower than the standard limit, fill with dry air, and complete the pre-assembled ring network box assembly.

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