Dual-mode communication module comprehensive testing apparatus and method

Abstract

The application discloses a kind of dual-mode communication module comprehensive detection device and method, belong to electric power communication technical field.The device includes: power supply unit, shielded box;Test base plate is set in shielded box, with power supply unit electric connection, integrated with main control chip, for connecting measured module test interface, accompanying test module test interface, multiple external interfaces, wired attenuation circuit, wireless attenuation circuit and ac voltage current acquisition circuit;Measured module test interface and accompanying test module test interface include center coordinator interface and station interface;Industrial control terminal is connected with test base plate, is equipped with host computer test software, for obtaining test scheme and test parameter, test scheme and test parameter are issued to test base plate, receive the detection result returned by main control chip of test base plate.The application constructs high performance, high compatibility, supports the integrated dual-mode communication module comprehensive detection platform of automation management.

Description

Technical Field

[0001] This application belongs to the field of power communication technology, and in particular relates to a comprehensive testing device and method for dual-mode communication modules. Background Technology

[0002] With the advancement of the construction of new power systems, electricity information collection systems are developing towards intelligence and integration. Currently, dual-mode communication technology combining high-speed power line carrier (HPLC) and high-speed radio frequency (HRF) is being vigorously promoted to improve communication reliability and network coverage in complex power environments.

[0003] Against this backdrop, HPLC+HRF dual-mode communication modules have become a core component of power consumption information acquisition systems. Their performance and reliability directly affect the stable operation of the entire acquisition system. Therefore, it is necessary to test the dual-mode communication modules for hardware and software adaptation, protocol compatibility, and other aspects. Existing testing devices are mostly designed for traditional single HPLC modules, and suffer from drawbacks such as limited interfaces, susceptibility to electromagnetic interference in wireless testing, and incompatibility with different manufacturers' specifications. These limitations make it difficult to meet the high-efficiency and accurate testing requirements of next-generation dual-mode communication modules in R&D, production, and quality inspection. Therefore, there is an urgent need to construct a high-performance, highly compatible, and automated integrated dual-mode communication module comprehensive testing platform. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a comprehensive testing device and method for dual-mode communication modules to improve the compatibility and efficiency of dual-mode communication module testing.

[0005] In a first aspect, this application provides a comprehensive testing device for a dual-mode communication module, comprising: Power supply unit, shielded enclosure; The test base plate, located inside the shielded enclosure, is electrically connected to the power supply unit and integrates a main control chip, a test interface for connecting the module under test (DUT) and a test interface for the auxiliary test module (ATM), multiple external interfaces, a wired attenuation circuit, a wireless attenuation circuit, and an AC / DC voltage and current acquisition circuit. The DUT test interface and the ATM test interface include a central coordinator interface and a station interface. An industrial control terminal is communicatively connected to the test baseboard and is equipped with host computer test software for acquiring test plans and test parameters, sending the test plans and test parameters to the test baseboard, and receiving the test results returned by the main control chip of the test baseboard. The display unit is communicatively connected to the industrial control terminal and is used to configure the test plan and test parameters based on user operations, as well as to display the test results.

[0006] According to the dual-mode communication module integrated testing device of this application, by integrating the test interface of the module under test and the test interface of the supporting module on the test base plate, including the central coordinator interface and the site interface, the test base plate is also equipped with multiple external interfaces and a built-in main control chip. This allows for adaptation and expansion according to the communication specifications and physical interface standards of different manufacturers, enabling a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, thus improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0007] According to one embodiment of this application, it also includes: The manufacturing execution system is communicatively connected to the industrial control terminal and is used to store and manage the detection results forwarded by the industrial control terminal, and to perform data comparison and repeatability verification on the information of the module under test; the information of the module under test includes at least one of the following: chip identifier, module identifier, physical address, and asset code.

[0008] In this embodiment, by setting up a manufacturing execution system, the test results forwarded by the industrial control terminal can be uniformly stored and managed, and data comparison and repeatability verification can be performed on information such as chip identifier, module identifier, physical address, and asset code of the tested module. This enables centralized archiving, traceability management, and module identity compliance verification of test data, thereby improving the automation level and traceability of production quality inspection.

[0009] According to one embodiment of this application, the power supply unit includes: Electromagnetic filters are used to filter out grid clutter and electromagnetic interference. The switching power supply is electrically connected to both the electromagnetic filter and the test base plate.

[0010] In this embodiment, by setting an electromagnetic filter and a switching power supply electrically connected to the test base plate, grid clutter and electromagnetic interference can be reduced, the impact of power supply noise on the test results can be reduced, and the test accuracy can be improved.

[0011] According to one embodiment of this application, the plurality of external interfaces of the switching power supply include at least one of an Ethernet interface, an extended input / output interface, an RS485 interface, an RS232 interface, a universal serial bus interface, and an infrared communication interface.

[0012] According to one embodiment of this application, the AC / DC voltage and current acquisition circuit includes a DC voltage acquisition unit and an AC voltage and current acquisition unit; The DC voltage acquisition unit uses the internal analog-to-digital converter of the main control chip to acquire the test point voltage and DC power consumption of the module under test; the AC voltage and current acquisition unit uses an AC acquisition chip to acquire the AC voltage, current and power consumption parameters of the module under test.

[0013] In this embodiment, by setting up a DC voltage acquisition unit and an AC voltage and current acquisition unit, it is possible to test the AC and DC electrical parameters and power consumption indicators of the dual-mode communication module, which can meet various electrical performance testing requirements and further improve the compatibility and efficiency of the test.

[0014] According to one embodiment of this application, the test base plate also integrates a relay control circuit, a reset circuit, and a supercapacitor board interface; The relay control circuit is used to isolate the high-voltage test circuit; The reset circuit is used to perform a system reset on the main control chip; The supercapacitor board interface is used to connect the supercapacitor board; The main control chip is used to control the supercapacitor board to charge and discharge, and to collect the voltage value across the supercapacitor of the module under test.

[0015] In this embodiment, by integrating a relay control circuit, a reset circuit, and a supercapacitor board interface into the test base plate, the relay control circuit can achieve electrical isolation of the high-voltage test circuit, reducing interference and damage from high voltage to the low-voltage test circuit and the module under test; the reset circuit can perform system reset on the main control chip, improving the stability of the test device; and by connecting an external supercapacitor board through the supercapacitor board interface, the main control chip manages the charging and discharging process of the supercapacitor board and collects the voltage values ​​across the supercapacitor of the module under test, which can adapt to the testing requirements of the supercapacitor operating conditions of the dual-mode communication module, further improving test compatibility.

[0016] According to one embodiment of this application, it also includes: The radio frequency interface adapter board is used to convert the radio frequency antenna port of the module under test into a standard universal interface, so as to enable the wireless communication test link between the module under test and the auxiliary test module plugged into the test base plate.

[0017] In this embodiment, by setting up an RF interface adapter board, the RF antenna port of the module under test is converted into a standard universal interface, establishing a wireless communication test link between the module under test and the accompanying module on the test baseboard. This solves the problem of inconsistent RF interfaces of different models of dual-mode communication modules, which cannot be directly adapted for connection, and further improves the adaptability and compatibility of the testing device for RF testing of modules of different specifications.

[0018] According to one embodiment of this application, when the module under test is a central coordinator type, the central coordinator interface is connected to the module under test, and the site interface is connected to a site-type companion module; when the module under test is a site type, the site interface is connected to the module under test, and the central coordinator interface is connected to a central coordinator type companion module.

[0019] In this embodiment, by adapting the connection to the central coordinator interface and the site interface according to the role type of the module under test, the same testing device can be compatible with the testing requirements of two different role modules in a dual-mode communication network without changing the hardware, thereby further improving the compatibility and testing efficiency of the comprehensive testing of dual-mode communication modules.

[0020] According to one embodiment of this application, the test scheme includes at least one detection item; the detection item includes at least one of module networking, wireless calibration, sensitivity testing, zero-crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison; The module network includes wired networking and wireless networking. The wired networking is carried out through power line carrier communication, and the wireless networking is carried out through low-power wireless communication.

[0021] In this embodiment, by configuring the test scheme to include test items such as module networking, wireless calibration, sensitivity testing, zero-crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison, the testing device can test the communication performance, electrical performance, energy storage performance, and identity information of the dual-mode communication module. The module networking test item includes wired networking and wireless networking. The wired networking simulates the network construction process under the actual power line channel environment through power line carrier communication, and the wireless networking uses low-power wireless communication to reproduce the networking scenario under radio frequency air interface conditions. This enables the testing of both HPLC single-mode modules and HPLC+HRF dual-mode modules, further improving the compatibility and efficiency of the test.

[0022] According to one embodiment of this application, the device is adapted to detect the tested modules including a single-phase energy meter dual-mode module, a three-phase energy meter dual-mode module, a type II data collector dual-mode module, a concentrator local communication dual-mode module, a converged terminal local dual-mode communication module, a measurement unit dual-mode communication module, and a smart gateway energy meter dual-mode module.

[0023] Secondly, this application provides a comprehensive testing method for a dual-mode communication module, applied to the comprehensive testing device for a dual-mode communication module as described in the first aspect, comprising: The industrial control terminal obtains the user-configured test plan and test parameters through the display unit; The test plan and test parameters are sent to the test base plate; The test results generated by the main control chip of the test baseboard based on the test parameters and executing each test item in the test plan are obtained and displayed through the display unit.

[0024] According to the comprehensive testing method for dual-mode communication modules in this application, by integrating the test interface of the module under test and the test interface of the accompanying module on the test baseboard, including the central coordinator interface and the site interface, and setting up multiple external interfaces and a built-in main control chip, it can be adapted and expanded according to the communication specifications and physical interface standards of different manufacturers. This allows a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0025] Thirdly, this application provides a comprehensive testing method for a dual-mode communication module, applied to the comprehensive testing device for a dual-mode communication module as described in the first aspect, comprising: The test baseboard obtains the test plan and test parameters issued by the industrial control terminal; Based on the test parameters, each test item in the test plan is executed to obtain the test results; The detection results are returned to the industrial control terminal.

[0026] According to the comprehensive testing method for dual-mode communication modules in this application, by integrating the test interface of the module under test and the test interface of the accompanying module on the test baseboard, including the central coordinator interface and the site interface, and setting up multiple external interfaces and a built-in main control chip, it can be adapted and expanded according to the communication specifications and physical interface standards of different manufacturers. This allows a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0027] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects: According to the dual-mode communication module integrated testing device of this application, by integrating the test interface of the module under test and the test interface of the supporting module on the test base plate, including the central coordinator interface and the site interface, the test base plate is also equipped with multiple external interfaces and a built-in main control chip. This allows for adaptation and expansion according to the communication specifications and physical interface standards of different manufacturers, enabling a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, thus improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0028] In some embodiments, by setting up a manufacturing execution system, the test results forwarded by the industrial control terminal can be uniformly stored and managed, and data comparison and repeatability verification can be performed on information such as chip identifier, module identifier, physical address, and asset code of the tested module. This enables centralized archiving, traceability management, and module identity compliance verification of test data, thereby improving the automation level and traceability of production quality inspection.

[0029] In some embodiments, by setting an electromagnetic filter and a switching power supply electrically connected to the test base plate, it is possible to reduce grid clutter and electromagnetic interference, reduce the impact of power supply noise on the test results, and improve test accuracy.

[0030] In some embodiments, by setting up DC voltage acquisition units and AC voltage and current acquisition units, it is possible to test the AC and DC electrical parameters and power consumption indicators of the dual-mode communication module, which can meet various electrical performance testing requirements and further improve the compatibility and efficiency of testing.

[0031] In some embodiments, by integrating a relay control circuit, a reset circuit, and a supercapacitor board interface into the test base plate, the relay control circuit can achieve electrical isolation of the high-voltage test circuit, reducing interference and damage from high voltage to the low-voltage test circuit and the module under test; the reset circuit can perform system reset on the main control chip, improving the stability of the test device operation; by connecting an external supercapacitor board through the supercapacitor board interface, the main control chip manages the charging and discharging process of the supercapacitor board and collects the voltage values ​​across the supercapacitor of the module under test, which can adapt to the testing requirements of the supercapacitor operating conditions of the dual-mode communication module, further improving test compatibility.

[0032] In some embodiments, by setting up an RF interface adapter board, the RF antenna port of the module under test is converted into a standard universal interface, thereby establishing a wireless communication test link between the module under test and the auxiliary test module on the test baseboard. This can solve the problem of inconsistent RF interfaces of different models of dual-mode communication modules and the inability to directly adapt and connect them, further improving the adaptability and compatibility of the testing device for RF testing of modules of different specifications.

[0033] In some embodiments, by adapting the connection center coordinator interface and the site interface according to the role type of the module under test, the same testing device can meet the testing requirements of two different role modules in a dual-mode communication network without changing the hardware, thereby further improving the compatibility and testing efficiency of the comprehensive testing of dual-mode communication modules.

[0034] In some embodiments, by configuring the test scheme to include test items such as module networking, wireless calibration, sensitivity testing, zero-crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison, the testing device can test the communication performance, electrical performance, energy storage performance, and identity information of the dual-mode communication module. The module networking test item includes wired networking and wireless networking. Wired networking simulates the network construction process in the actual power line channel environment through power line carrier communication, while wireless networking uses low-power wireless communication to reproduce the networking scenario under radio frequency air interface conditions. This enables compatibility with the testing of HPLC single-mode modules and HPLC+HRF dual-mode modules, further improving the compatibility and efficiency of the test.

[0035] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the testing device in the related technology provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the integrated testing device for dual-mode communication modules provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the test base plate provided in the embodiments of this application; Figure 4 This is one of the flowcharts illustrating the comprehensive testing method for dual-mode communication modules provided in this application embodiment; Figure 5 This is the second flowchart illustrating the comprehensive testing method for dual-mode communication modules provided in this application embodiment. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0039] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0040] The testing devices in related technologies are mostly designed for traditional single HPLC modules, such as Figure 1 As shown, the test setup includes a PC (personal compute), test equipment, a module under test (DUT), and a companion module. The PC acts as the host computer and establishes a communication connection with the DUT through the test equipment. The test equipment and the companion module also communicate with each other to build a basic test environment.

[0041] In the above scheme, the test equipment has a relatively simple functional configuration, with a basic test baseboard as its hardware structure. The baseboard has a single interface, generally supporting only business serial communication, making it difficult to adapt to the diverse interface requirements of dual-mode communication modules. During testing, the companion module needs to be manually changed according to the role type of the module under test. That is, when the module under test is STA type, a CCO type companion module needs to be configured; when the module under test is CCO type, it needs to be replaced with an STA type companion module.

[0042] The above solution uses the PC as the main control and data storage center. The control of the test process and the storage of test results both rely on the PC software, making the test process highly dependent on manual operation and real-time control by the PC, and making it difficult to achieve automated closed-loop management of the test process.

[0043] This indicates that existing technologies suffer from drawbacks such as limited interface options, susceptibility to electromagnetic interference during wireless testing, and incompatibility with different manufacturers' specifications. Consequently, they struggle to meet the high-efficiency and precise testing requirements of next-generation dual-mode communication modules in R&D, production, and quality control. Therefore, there is an urgent need to develop a high-performance, highly compatible, and automated integrated testing platform for dual-mode communication modules.

[0044] To address at least one of the aforementioned technical problems, embodiments of this application provide a comprehensive testing device and method for dual-mode communication modules. The following, in conjunction with the accompanying drawings, provides a detailed description of the comprehensive testing device and method for dual-mode communication modules provided by this application through specific embodiments and application scenarios.

[0045] like Figure 2 As shown, this application provides a comprehensive testing device for a dual-mode communication module, comprising: Power supply unit 210, shielding enclosure 220; The test base plate 230 is located inside the shielded enclosure 220 and is electrically connected to the power supply unit 210. It integrates a main control chip, a test interface for connecting the module under test, a test interface for the auxiliary test module, multiple external interfaces, a wired attenuation circuit, a wireless attenuation circuit, and an AC / DC voltage and current acquisition circuit. The test interface for the module under test and the test interface for the auxiliary test module include a central coordinator interface and a station interface. The industrial control terminal 240 is connected to the test baseboard 230 and is equipped with host computer test software to obtain test plans and test parameters, send the test plans and test parameters to the test baseboard 230, and receive the test results returned by the main control chip of the test baseboard 230. The display unit 250 is communicatively connected to the industrial control terminal 240 and is used to configure test plans and test parameters based on user operations, as well as to display test results.

[0046] In this embodiment, the input terminal of the power supply unit 210 is connected to the power grid, and the output terminal is electrically connected to the test base plate 230, enabling it to provide the required operating voltage for the module under test, the auxiliary test module, and various functional circuits on the test base plate 230. For example, the power supply unit 210 can provide a 12V power input to the test base plate, with an input current of up to 5A.

[0047] The test base plate 230 is set inside the shielded enclosure 220. The shielded enclosure 220 can provide a closed electromagnetic shielding environment for wireless performance testing, which can reduce the impact of external electromagnetic interference on HRF wireless communication testing, reduce the radiation of radio frequency signals generated during the test, and improve the accuracy of test results.

[0048] like Figure 3 As shown, the test baseboard 230 integrates a main control chip, a test interface for the module under test, a test interface for the auxiliary test module, multiple external interfaces, a wired attenuation circuit, a wireless attenuation circuit, and an AC / DC voltage and current acquisition circuit.

[0049] The test baseboard 230 uses a built-in main control chip to centrally schedule and process the test process. The main control chip can receive test instructions and parameter configurations issued by the industrial control terminal 240, coordinate the collaborative work of various functional circuits, and process the collected test results before sending them back to the industrial control terminal 240.

[0050] The test interfaces for the module under test and the test interfaces for the accompanying modules include the Central Coordinator (COO) interface and the Station (STA) interface. That is, the Central Coordinator interface and the Station interface can be used as test interfaces for the module under test or as test interfaces for the accompanying modules.

[0051] The module under test (DUT) is a dual-mode communication module requiring performance testing and quality verification. The companion module (CUT) is a standard dual-mode communication module that meets performance standards and has completed parameter calibration. Serving as a test reference device, it can establish wired or wireless communication links with the DUT to assist in completing tests such as network interaction, data transmission and reception, and communication compatibility verification. The DUT and CUT establish electrical connections and communication links through corresponding interfaces on the test baseboard 230, forming a test network topology and cooperating to complete the dual-mode communication network test.

[0052] In some embodiments, the module under test may include a single-phase energy meter dual-mode module, a three-phase energy meter dual-mode module, a type II data collector dual-mode module, a concentrator local communication dual-mode module, a converged terminal local dual-mode communication module, a measurement unit dual-mode communication module, and a smart gateway energy meter dual-mode module.

[0053] Because different types of modules differ in communication protocols, interface specifications, and functional focuses, the test baseboard 230 is configured with a central coordinator interface and a site interface to adapt to the testing requirements of dual-mode communication components carried by various terminal devices in the electricity information collection system. Through the central coordinator interface and the site interface, the test module can connect to the test network as a central coordinator or a site, depending on the test scenario, and form a master-slave communication relationship or a peer-to-peer communication relationship with the module under test, thereby completing the comprehensive verification of network performance, protocol compatibility, and collaborative working capabilities.

[0054] In some embodiments, when the module under test is of the central coordinator type, the central coordinator interface is connected to the module under test, and the site interface is connected to the site-type companion module under test; when the module under test is of the site type, the site interface is connected to the module under test, and the central coordinator interface is connected to the central coordinator type companion module under test.

[0055] In an HPLC+HRF dual-mode communication network, communication nodes can be categorized into two types based on their functional roles: Control Controller (CCO) and Target Controller (STA). The CCO is the master node in the network topology, responsible for initiating network setup, managing site access, allocating communication time slots, and maintaining the network topology. It is typically deployed in upper-layer devices such as concentrators, converged terminals, or smart gateways. The STA is a subordinate node in the network topology, responding to management commands from the CCO and performing data reporting and command responses. It is typically deployed in terminal devices such as energy meters, data acquisition units, or measurement units. The integrated testing device for dual-mode communication modules can adapt to the testing needs of modules under test with different roles; therefore, the module under test can be either a CCO or an STA.

[0056] When the module under test (DUT) is a CCO type, it is plugged into the CCO interface of the test baseboard 230 and powered by the power supply unit 210. The main control chip on the test baseboard 230 establishes a control and data communication link with the DUT through the CCO interface. The companion module, acting as a STA, connects to the test network and is plugged into the STA interface of the test baseboard 230. It serves as the communication peer of the DUT, responds to the network management commands of the DUT, and cooperates in completing the networking process.

[0057] With this configuration, tests can be performed on the module under test (CCO) to evaluate its network initiation capability, site management capacity, time slot allocation efficiency, and multi-site concurrent communication scheduling performance, thereby verifying whether the module under test meets the functional specifications and performance indicators of the CCO role.

[0058] When the module under test (DUT) is of type STA, it is plugged into the STA interface of the test baseboard 230 and powered by the power supply unit 210. The main control chip establishes a communication link with the DUT through the STA interface. The companion module, acting as the CCO (Control Center Operator) in the test network, is plugged into the CCO interface of the test baseboard 230. As the communication master control terminal of the DUT, it is responsible for initiating network formation, managing network access authentication, and distributing test data.

[0059] With this configuration, tests can be performed on the STA-type module under test to evaluate its network access response speed, uplink data reporting reliability, downlink command execution accuracy, and communication maintenance capability under weak signal conditions, thereby verifying whether the module under test meets the functional specifications and performance indicators of the STA role.

[0060] In this embodiment, by adapting the connection to the central coordinator interface and the site interface according to the role type of the module under test, the same testing device can be compatible with the testing requirements of two different role modules in a dual-mode communication network without changing the hardware, thereby further improving the compatibility and testing efficiency of the comprehensive testing of dual-mode communication modules.

[0061] In this embodiment, a wired attenuation circuit is used to simulate the transmission attenuation characteristics of a power line channel. By adjusting the attenuation amount, the HPLC communication performance of the module under test under different line conditions can be tested. In some embodiments, the wired attenuation circuit may employ a T-type attenuator.

[0062] The wireless attenuation circuit is used to simulate long-distance transmission and signal weakening scenarios in wireless channels. Through controllable attenuation, the performance of HRF wireless communication under different distances and obstruction conditions can be evaluated, thereby verifying the wireless communication function of the module under test.

[0063] The AC / DC voltage and current acquisition circuit is used to monitor the power consumption status and electrical parameters of each module during the test.

[0064] The test baseboard 230 is also equipped with multiple external interfaces, which can be adapted and expanded according to the communication specifications and physical interface standards of different manufacturers, so that a single testing device can cover the testing needs of dual-mode communication modules of different manufacturers and models.

[0065] In some embodiments, the multiple external interfaces include an Ethernet interface, an extended I / O (input / output) interface, an RS485 interface, an RS232 interface, a Universal Serial Bus (USerial Bus) interface, an infrared communication interface, a DC voltage acquisition interface, an AC voltage and current acquisition interface, and storage circuits, etc.

[0066] Among them, the Ethernet interface enables gigabit / hundred-megabit Ethernet communication between the baseboard and the industrial control terminal 240. The Ethernet peripherals of the main control chip can be connected to the PHY (Physical Layer) chip through the MII (Media Independent Interface) / RMII (Reduced Media Independent Interface) interface, and then connected to the external network cable through the RJ45+ (Registered Jack 45+) network transformer.

[0067] RS485 (Recommended Standard 485) interface: The main control chip connects to the RS485 chip via UART (Universal Asynchronous Receiver / Transmitter) for communication with the Type II data acquisition unit.

[0068] Infrared communication interface: Infrared remote control and communication are achieved through infrared transceiver tubes, and the infrared communication function of the Type II data acquisition unit is tested.

[0069] RS232 (Recommended Standard 232) interface: The UART of the main control chip is connected to the RS232 chip to realize the conversion between TTL (Transistor-Transistor Logic) and RS232 levels. The RS232 interface is connected to the industrial control terminal as a communication interface with the host computer.

[0070] Expanded I / O interfaces: The remaining GPIO (General Purpose Input / Output) of the main control chip are brought out through pin headers / terminals and can be configured as input, output, or multiplexed functions as needed.

[0071] USB interface: The main control chip's USB peripheral is configured in HOST (host / master terminal) mode to connect to the converged terminal communication module and serve as a business communication interface for USB communication.

[0072] Storage circuit: The main control chip's SPI (Serial Peripheral Interface) peripheral is connected to Flash memory to achieve persistent data storage, which is used to store test plans and test parameters.

[0073] In some embodiments, the test baseboard 230 may further include a 12V power interface, a DC-DC power conversion circuit, a press detection switch interface, and a debugging interface. The 12V power interface provides an external 12V DC input (such as an adapter or industrial power supply) to the test baseboard 230; the DC-DC power conversion circuit converts the 12V to 5V, 2.5V, or 3.3V via a power management chip to power modules with different voltage requirements (such as Ethernet chips, main control chips, and storage circuits); the press detection switch interface detects the pressed and released states of mechanical buttons for starting and stopping the test; and the debugging interface is used for downloading programs to the main control chip and for online debugging.

[0074] In this embodiment, the industrial control terminal 240 is communicatively connected to the test baseboard 230 and is equipped with host computer testing software that supports user input, editing, and storage of various standardized test schemes and custom test parameters. During test execution, the industrial control terminal 240 can obtain the user-configured test scheme and test parameters through the host computer testing software, and send the test scheme and test parameters to the main control chip of the test baseboard 230. The main control chip then drives each functional circuit to execute the test task according to a preset process. After the test is completed, the industrial control terminal 240 receives the test results returned by the test baseboard 230. The host computer testing software can parse, statistically analyze, and perform analysis on the test results to generate a test report containing various performance indicators, test conclusions, and anomaly records.

[0075] In some embodiments, the test scheme includes at least one test item; the test item includes at least one of module networking, wireless calibration, sensitivity testing, zero-crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison. Modular networking includes wired networking and wireless networking. Wired networking is conducted through power line carrier communication, while wireless networking is conducted through low-power wireless communication.

[0076] In this embodiment, the wired networking is performed via power line carrier communication. During the test, the module under test (DUT) and the auxiliary module under test (AD) establish a power line electrical connection through the DUT test interface and the AD module test interface on the test base plate 230. The main control chip controls the DUT to send a carrier signal on the power line, and the AD module receives and parses the signal to complete the networking process. This verifies the network initiation capability, signal modulation and demodulation performance, and power line channel adaptability of the DUT in HPLC communication mode.

[0077] The wireless networking adopts a low-power wireless communication method for networking. During the test, the module under test and the supporting module establish a wireless radio frequency link. The low-power wireless signal transmission and reception and networking interaction are completed in the electromagnetic shielding environment provided by the shielded box 220, thereby verifying the wireless networking capability, radio frequency transmission power control and reception demodulation performance of the module under test in HRF communication mode.

[0078] In this embodiment, by configuring the test scheme to include test items such as module networking, wireless calibration, sensitivity testing, zero-crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison, the testing device can test the communication performance, electrical performance, energy storage performance, and identity information of the dual-mode communication module. The module networking test item includes wired networking and wireless networking. The wired networking simulates the network construction process under the actual power line channel environment through power line carrier communication, and the wireless networking uses low-power wireless communication to reproduce the networking scenario under radio frequency air interface conditions. This enables the testing of both HPLC single-mode modules and HPLC+HRF dual-mode modules, further improving the compatibility and efficiency of the test.

[0079] The display unit 250 communicates with the industrial control terminal 240 and serves as the human-machine interface for the testing device. For example, the display unit 250 and the industrial control terminal 240 can be connected via an HDMI (High-Definition Multimedia Interface) interface. The display unit 250 presents a graphical interface displaying a list of test items, parameter input boxes, test progress bars, and result charts. Users can perform operations such as selecting test schemes, configuring test parameters, and starting / stopping test tasks through the visual operation interface of the display unit 250. For example, users can select parameters such as the type of module under test, protocol type, and communication interface on the display unit 250 interface, and configure test schemes and test parameters.

[0080] During the test, the display unit 250 can display the test status and intermediate results; after the test, the display unit 250 can display the test results, such as the values ​​of various performance indicators, the comparison with the standard threshold, and the pass / fail judgment conclusion, so that users can understand the overall performance of the module under test.

[0081] According to the dual-mode communication module integrated testing device of this application, by integrating the test interface of the module under test and the test interface of the supporting module on the test base plate, including the central coordinator interface and the site interface, the test base plate is also equipped with multiple external interfaces and a built-in main control chip. This allows for adaptation and expansion according to the communication specifications and physical interface standards of different manufacturers, enabling a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, thus improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0082] In some embodiments, it also includes: The manufacturing execution system 260 is communicatively connected to the industrial control terminal 240. It is used to store and manage the test results forwarded by the industrial control terminal 240, and to perform data comparison and repeatability verification on the information of the module under test. The information of the module under test includes at least one of the following: chip identifier, module identifier, physical address, and asset code.

[0083] In this embodiment, the Manufacturing Execution System (MES) 260 is communicatively connected to the Industrial Control Terminal 240, for example, via an Ethernet interface. After completing a single or batch test operation of the modules under test, the Industrial Control Terminal 240 can forward all raw test data, process parameters, exception logs, and test results of the modules under test to the Manufacturing Execution System 260.

[0084] The Manufacturing Execution System 260 is equipped with a database that enables structured archiving, categorized storage, and unified ledger management of test data for dual-mode communication modules from different batches, models, and manufacturers.

[0085] The manufacturing execution system 260 can also perform data comparison and repeatability verification on the information of the module under test. The information of the module under test may include at least one of the following: chip identifier, module identifier, physical address, and asset code.

[0086] When receiving inspection results, the Manufacturing Execution System 260 can extract information from the module under test and compare it with stored historical data to determine whether the module under test is undergoing its first inspection or a repeat inspection. If the same information corresponds to multiple inspection records, a repeatability check can be performed to analyze whether the results of each inspection are consistent. Through data comparison and repeatability check, it is possible to verify whether the same inspection module is submitted for inspection or stored repeatedly, reducing the problems of missed inspections, duplicate inspections, and incorrect inspections in the batch production quality inspection process.

[0087] In this embodiment, by setting up a manufacturing execution system, the test results forwarded by the industrial control terminal can be uniformly stored and managed, and data comparison and repeatability verification can be performed on information such as chip identifier, module identifier, physical address, and asset code of the tested module. This enables centralized archiving, traceability management, and module identity compliance verification of test data, thereby improving the automation level and traceability of production quality inspection.

[0088] In some embodiments, the power supply unit 210 includes: Electromagnetic filter 211 is used to filter out grid-side noise and electromagnetic interference; The switching power supply 212 is electrically connected to the electromagnetic filter 211 and the test base plate 230, respectively.

[0089] In this embodiment, the electromagnetic filter 211 is connected to an external power grid, and the switching power supply 212 is electrically connected to both the electromagnetic filter 211 and the test base plate 230. The external power grid energy is filtered by the electromagnetic filter 211 and regulated by the switching power supply 212 before providing a stable operating power supply to the test base plate 230. For example, a 12V power input can be provided to the test base plate, with an input current of up to 5A.

[0090] In real-world power grid environments, grid voltage typically includes harmonic noise, pulse interference, voltage spikes, and high-frequency electromagnetic noise. These grid interference signals can affect power supply stability, easily causing module flickering, communication jitter, and parameter drift, thus leading to deviations in test results. Electromagnetic filter 211 is an anti-interference filter device at the power input end, used to filter out grid-side noise and electromagnetic interference, reducing conducted and radiated interference at the input end.

[0091] The switching power supply 212 can perform voltage conversion, current regulation, and voltage stabilization on the input mains power. The switching power supply 212 can output appropriate voltage and current according to the rated operating parameters of different types of modules under test, meeting the power supply requirements of various types of modules under test, such as single-phase dual-mode energy meter modules, three-phase dual-mode energy meter modules, and local dual-mode communication modules for converged terminals.

[0092] In this embodiment, by setting an electromagnetic filter and a switching power supply electrically connected to the test base plate, grid clutter and electromagnetic interference can be reduced, the impact of power supply noise on the test results can be reduced, and the test accuracy can be improved.

[0093] In some embodiments, the AC / DC voltage and current acquisition circuit includes a DC voltage acquisition unit and an AC voltage and current acquisition unit; The DC voltage acquisition unit uses the internal analog-to-digital converter of the main control chip to acquire the test point voltage and DC power consumption of the module under test; the AC voltage and current acquisition unit uses an AC acquisition chip to acquire the AC voltage, current and power consumption parameters of the module under test.

[0094] In this embodiment, the DC voltage acquisition unit can divide, filter, and impedance-match the analog voltage signals at each test point of the module under test through a signal conditioning circuit before inputting them to the analog input channel of the analog-to-digital converter (ADC) inside the main control chip. The ADC converts the continuous analog voltage signals into discrete digital quantities, and the main control chip can then calculate the actual voltage value at each test point based on the converted digital quantities. The DC voltage acquisition unit can also combine the known sampling resistor value or the current signal obtained from the current sensing amplifier to obtain the DC power consumption data of the module under test through power calculation. This approach reduces the number of external independent ADC chips required, simplifies the circuit layout of the test baseboard 230, and reduces hardware costs and system complexity.

[0095] In HPLC power line carrier communication mode, the module under test couples signals and transmits data through power lines. The voltage, current and power parameters on the AC side are important indicators for evaluating the module's communication performance and electrical safety.

[0096] The AC acquisition chip is a dedicated integrated circuit designed for AC power frequency signal measurement. It integrates functional modules such as multi-channel synchronous sampling, true RMS value calculation, power factor measurement and harmonic analysis, and can perform high-precision acquisition and parameter extraction of AC voltage and current signals over a wide dynamic range.

[0097] The AC voltage and current acquisition unit transforms the voltage signal from the AC side of the module under test using a voltage transformer or a resistor divider network, and performs proportional conversion on the current signal using a current transformer or a shunt resistor. The transformed current signal is then input to the AC acquisition chip, which calculates power consumption parameters such as active power, reactive power, apparent power, and power factor. Compared to the analog-to-digital converter inside the main control chip, the AC acquisition chip offers higher anti-interference capabilities and lower temperature drift.

[0098] In this embodiment, by setting up a DC voltage acquisition unit and an AC voltage and current acquisition unit, it is possible to test the AC and DC electrical parameters and power consumption indicators of the dual-mode communication module, which can meet various electrical performance testing requirements and further improve the compatibility and efficiency of the test.

[0099] In some embodiments, the test base plate also integrates a relay control circuit, a reset circuit, and a supercapacitor board interface. Relay control circuit, used to isolate and test high-voltage circuits; The reset circuit is used to perform a system reset on the main control chip. Supercapacitor board interface, used to connect to the supercapacitor board; The main control chip is used to control the charging and discharging of the supercapacitor board and to collect the voltage values ​​across the supercapacitor of the module under test.

[0100] In testing projects involving high-voltage access, such as voltage testing, power consumption testing, and capacitor charging / discharging testing of dual-mode communication modules, the test circuit operates under high voltage and high current conditions. If the strong and weak current circuits are not isolated, it can easily cause breakdown and damage to weak current components such as the main control chip and sampling circuit. Furthermore, strong current crosstalk can severely interfere with the weak current sampling signal, leading to distorted test data. The main control chip can send on / off control signals to the relay control circuit according to the type of test being performed. After responding, the relay control circuit switches the corresponding contact state. That is, when high-voltage parameter acquisition or power line carrier communication testing is required, the relay contacts are closed to conduct the high-voltage circuit; when the test ends or an abnormal state is detected, the relay contacts are opened to disconnect the high-voltage circuit.

[0101] During prolonged batch automated testing, the main control chip continuously performs data processing, instruction scheduling, and signal acquisition, which can easily lead to operational failures such as program buffer overflow, instruction lag, and abnormal program crashes. The reset circuit can monitor the operating status of the main control chip in real time. When it detects a program freeze, operational abnormality, or receives a manual reset command, it outputs a reset signal to restart the main control chip, initialize the program, clear abnormal cached data, and restore the main control chip to its normal operating state.

[0102] The supercapacitor board interface is an external expansion interface of the test baseboard 230, used to connect an external supercapacitor board for charging and discharging testing of the module under test. During testing, the main control chip sends charging and discharging control commands to the connected supercapacitor board through the supercapacitor board interface, adjusting the charging current, charging voltage threshold, and discharge load connection status to simulate the charging and discharging cycle of the supercapacitor under actual operating conditions. The main control chip can use an internal analog-to-digital converter or an external voltage detection circuit to collect the voltage values ​​across the supercapacitor, recording the voltage rise curve during charging, the voltage hold level after full charge, and the voltage drop rate during discharging to determine whether the supercapacitor energy storage performance of the module under test is qualified.

[0103] In this embodiment, by integrating a relay control circuit, a reset circuit, and a supercapacitor board interface into the test base plate, the relay control circuit can achieve electrical isolation of the high-voltage test circuit, reducing interference and damage from high voltage to the low-voltage test circuit and the module under test; the reset circuit can perform system reset on the main control chip, improving the stability of the test device; and by connecting an external supercapacitor board through the supercapacitor board interface, the main control chip manages the charging and discharging process of the supercapacitor board and collects the voltage values ​​across the supercapacitor of the module under test, which can adapt to the testing requirements of the supercapacitor operating conditions of the dual-mode communication module, further improving test compatibility.

[0104] In some embodiments, it also includes: The RF interface adapter board is used to convert the RF antenna port of the module under test into a standard universal interface, so as to enable the wireless communication test link between the module under test and the auxiliary module plugged into the test baseboard.

[0105] Because different manufacturers and models of dual-mode communication modules have different designs for their RF antenna ports, the module under test cannot directly establish a physical connection with the standard RF interface of the module under test on the test baseboard 230. If a test fixture is designed separately for each interface type, it will increase the hardware cost and debugging time of the testing device.

[0106] One end of the RF interface adapter board is equipped with a connector or contact spring that matches the RF antenna port of the module under test, enabling compatibility with the RF antenna ports of different types of modules under test. The other end is equipped with a standard universal interface, such as the SMA (SubMiniature version A) standard interface, so that the module under test can establish a wireless communication test link with the SMA interface of the companion module plugged into the test base plate 230 through the SMA interface.

[0107] In this embodiment, by setting up an RF interface adapter board, the RF antenna port of the module under test is converted into a standard universal interface, establishing a wireless communication test link between the module under test and the accompanying module on the test baseboard. This solves the problem of inconsistent RF interfaces of different models of dual-mode communication modules, which cannot be directly adapted for connection, and further improves the adaptability and compatibility of the testing device for RF testing of modules of different specifications.

[0108] This application also provides a comprehensive testing method for dual-mode communication modules, applied to the aforementioned comprehensive testing device for dual-mode communication modules. The executing entity of the comprehensive testing method for dual-mode communication modules can be an industrial control terminal within the comprehensive testing device for dual-mode communication modules.

[0109] like Figure 4 As shown, the comprehensive testing method for the dual-mode communication module includes steps 410, 420, and 430.

[0110] Step 410: The industrial control terminal obtains the user-configured test plan and test parameters through the display unit; Step 420: Send the test plan and test parameters to the test base plate; Step 430: Obtain the test results generated by the main control chip of the test baseboard based on the test parameters and execute each test item in the test plan, and display the test results through the display unit.

[0111] The implementation process of each step in the comprehensive testing method for dual-mode communication modules can be referred to the content of the comprehensive testing device for dual-mode communication modules mentioned above, and will not be repeated in this application.

[0112] According to the comprehensive testing method for dual-mode communication modules in this application, by integrating the test interface of the module under test and the test interface of the accompanying module on the test baseboard, including the central coordinator interface and the site interface, and setting up multiple external interfaces and a built-in main control chip, it can be adapted and expanded according to the communication specifications and physical interface standards of different manufacturers. This allows a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0113] This application also provides a comprehensive testing method for a dual-mode communication module, applied to the aforementioned comprehensive testing device for dual-mode communication modules. The main body executing the comprehensive testing method for dual-mode communication modules can be the test base plate in the comprehensive testing device for dual-mode communication modules.

[0114] like Figure 5 As shown, the comprehensive testing method for the dual-mode communication module includes steps 510, 520, and 530.

[0115] Step 510: The test baseboard obtains the test plan and test parameters issued by the industrial control terminal; Step 520: Execute each test item in the test plan based on the test parameters to obtain the test results; Step 530: Return the test results to the industrial control terminal.

[0116] The implementation process of each step in the comprehensive testing method for dual-mode communication modules can be referred to the content of the comprehensive testing device for dual-mode communication modules mentioned above, and will not be repeated in this application.

[0117] According to the comprehensive testing method for dual-mode communication modules in this application, by integrating the test interface of the module under test and the test interface of the accompanying module on the test baseboard, including the central coordinator interface and the site interface, and setting up multiple external interfaces and a built-in main control chip, it can be adapted and expanded according to the communication specifications and physical interface standards of different manufacturers. This allows a single testing device to be compatible with the testing needs of modules from different manufacturers and with different roles in dual-mode communication networks, improving test compatibility. The testing device also includes a shielded enclosure, an industrial control terminal, and a display unit, which not only provides an electromagnetic shielding environment for wireless testing, isolating external electromagnetic interference and improving the accuracy of wireless performance testing, but also realizes automatic distribution of test parameters and parameter schemes, data feedback, and result visualization, improving testing efficiency and constructing a high-performance, highly compatible, and automated management-supporting integrated dual-mode communication module comprehensive testing platform.

[0118] This application also provides a non-transitory computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described dual-mode communication module integrated detection method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0119] Among them, readable storage media include computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disks or optical disks, etc.

[0120] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described dual-mode communication module integrated detection method.

[0121] Among them, readable storage media include computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0122] This application embodiment also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described dual-mode communication module comprehensive detection method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0123] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0124] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0125] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of this application.

[0126] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0127] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0128] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A comprehensive testing device for a dual-mode communication module, characterized in that, include: Power supply unit, shielded enclosure; The test base plate, located inside the shielded enclosure, is electrically connected to the power supply unit and integrates a main control chip, a test interface for connecting the module under test (DUT) and a test interface for the auxiliary test module (ATM), multiple external interfaces, a wired attenuation circuit, a wireless attenuation circuit, and an AC / DC voltage and current acquisition circuit. The DUT test interface and the ATM test interface include a central coordinator interface and a station interface. An industrial control terminal is communicatively connected to the test baseboard and is equipped with host computer test software for acquiring test plans and test parameters, sending the test plans and test parameters to the test baseboard, and receiving the test results returned by the main control chip of the test baseboard. The display unit is communicatively connected to the industrial control terminal and is used to configure the test plan and test parameters based on user operations, as well as to display the test results.

2. The apparatus according to claim 1, characterized in that, Also includes: The manufacturing execution system is communicatively connected to the industrial control terminal and is used to store and manage the detection results forwarded by the industrial control terminal, and to perform data comparison and repeatability verification on the information of the module under test; the information of the module under test includes at least one of the following: chip identifier, module identifier, physical address, and asset code.

3. The apparatus according to claim 1, characterized in that, The power supply unit includes: Electromagnetic filters are used to filter out grid clutter and electromagnetic interference. The switching power supply is electrically connected to both the electromagnetic filter and the test base plate.

4. The apparatus according to claim 1, characterized in that, The multiple external interfaces of the switching power supply include at least one of the following: Ethernet interface, extended input / output interface, RS485 interface, RS232 interface, universal serial bus interface, and infrared communication interface.

5. The apparatus according to claim 1, characterized in that, The AC / DC voltage and current acquisition circuit includes a DC voltage acquisition unit and an AC voltage and current acquisition unit; The DC voltage acquisition unit uses the internal analog-to-digital converter of the main control chip to acquire the test point voltage and DC power consumption of the module under test; the AC voltage and current acquisition unit uses an AC acquisition chip to acquire the AC voltage, current and power consumption parameters of the module under test.

6. The apparatus according to claim 1, characterized in that, The test base plate also integrates a relay control circuit, a reset circuit, and a supercapacitor board interface. The relay control circuit is used to isolate the high-voltage test circuit; The reset circuit is used to perform a system reset on the main control chip; The supercapacitor board interface is used to connect the supercapacitor board; The main control chip is used to control the supercapacitor board to charge and discharge, and to collect the voltage value across the supercapacitor of the module under test.

7. The apparatus according to claim 1, characterized in that, Also includes: The radio frequency interface adapter board is used to convert the radio frequency antenna port of the module under test into a standard universal interface, so as to enable the wireless communication test link between the module under test and the auxiliary test module plugged into the test base plate.

8. The apparatus according to claim 1, characterized in that, When the module under test is of the central coordinator type, the central coordinator interface is connected to the module under test, and the site interface is connected to the site-type companion module. When the module under test is of the site type, the site interface is connected to the module under test, and the central coordinator interface is connected to the central coordinator type companion module.

9. The apparatus according to claim 1, characterized in that, The test plan includes at least one test item; the test item includes at least one of the following: module networking, wireless calibration, sensitivity test, zero crossing detection, voltage acquisition, capacitor charging and discharging, identification information reading and writing, and version information comparison. The module network includes wired networking and wireless networking. The wired networking is carried out through power line carrier communication, and the wireless networking is carried out through low-power wireless communication.

10. The apparatus according to claim 1, characterized in that, The devices are compatible with the following modules: single-phase energy meter dual-mode module, three-phase energy meter dual-mode module, type II data collector dual-mode module, concentrator local communication dual-mode module, fusion terminal local dual-mode communication module, measurement unit dual-mode communication module, and smart gateway energy meter dual-mode module.

11. A comprehensive testing method for a dual-mode communication module, characterized in that, The dual-mode communication module integrated testing device as described in any one of claims 1-10 includes: The industrial control terminal obtains the user-configured test plan and test parameters through the display unit; The test plan and test parameters are sent to the test base plate; The test results generated by the main control chip of the test baseboard based on the test parameters and executing each test item in the test plan are obtained and displayed through the display unit.

12. A comprehensive testing method for a dual-mode communication module, characterized in that, The dual-mode communication module integrated testing device as described in any one of claims 1-10 includes: The test baseboard obtains the test plan and test parameters issued by the industrial control terminal; Based on the test parameters, each test item in the test plan is executed to obtain the test results; The detection results are returned to the industrial control terminal.

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