A high-speed optical module testing system and testing method

Abstract

The application discloses a high-speed optical module testing system and testing method, the system comprises a temperature control box and a testing system combined testing plate arranged in the temperature control box; the temperature control box comprises a box and a temperature control component arranged in the box; the testing system combined testing plate comprises a module interface plate, a signal control plate and a power supply and monitoring plate; the module interface plate is provided with replaceable testing interfaces; the module interface plate is connected with the signal control plate through a first connector to communicate high-frequency signals; the signal control plate is connected with the power supply and monitoring plate through a buckle connector to communicate electrical signals; the module interface plate and the signal control plate are both provided with loss testing radio frequency interfaces; the power supply and monitoring plate is provided with a controller for power supply control, state monitoring and communication management of the module interface plate and the signal control plate, and at least part of the communication interfaces and / or power supply interfaces have redundant configurations for backup of each other. The application can improve testing compatibility and redundancy.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and specifically to a high-speed optical module testing system and testing method. Background Technology

[0002] With the rapid iteration of optical communication technology, the speed and packaging type of high-speed optical modules are showing a diversified development trend. Optical modules with different speeds such as 100G, 400G, 800G, and 1.6T, and different packages such as QSFP28, QSFP-DD, OSFP, and PLCC48 are widely used in data centers, 5G communication, backbone networks and other scenarios. The demand for test boards from optical module manufacturers and R&D institutions is also becoming increasingly diversified.

[0003] Currently, existing high-speed optical module test boards generally suffer from insufficient compatibility and low redundancy, resulting in high procurement, switching, and upgrade costs. Furthermore, it's difficult to balance testing efficiency and accuracy, failing to meet the low-cost, high-efficiency requirements for batch testing of multi-specification optical modules. Therefore, developing a high-speed optical module test board that can effectively reduce usage costs by improving test compatibility and redundancy has become a pressing technical problem in the field of optical module testing. Summary of the Invention

[0004] The main objective of this invention is to provide a high-speed optical module testing system and method to solve the problems of insufficient compatibility and low redundancy of test boards in the prior art.

[0005] The present invention achieves the above objectives through the following technical solutions: In a first aspect, the present invention provides a high-speed optical module testing system, the system comprising a temperature control chamber and a test system combination test board disposed within the temperature control chamber; The temperature control enclosure includes an enclosure and a temperature control component disposed within the enclosure. The temperature control component is used to control the temperature of the light module to be measured. The test system combined test board includes a module interface board, a signal control board, and a power supply and monitoring board; The module interface board is equipped with a replaceable test interface for connecting the optical module under test, so as to be compatible with the testing of optical modules with different rates; The module interface board is connected to the signal control board via a first connector to perform high-frequency signal communication; The signal control board is connected to the power supply and monitoring board via a snap-fit ​​connector to communicate electrical signals; Both the module interface board and the signal control board are equipped with a loss test RF interface for calibrating the loss of the signal transmission path. The power supply and monitoring board is equipped with a controller, which is used to control the power supply, monitor the status and manage the communication of the module interface board and the signal control board, and at least some of the communication interfaces and / or power supply interfaces have redundant configurations that are backups of each other.

[0006] Furthermore, the test system combination test board is at least one, and the temperature control component is at least one set, with one set of the temperature control component corresponding to one test system combination test board, so as to control the temperature of the corresponding optical module under test.

[0007] Furthermore, the temperature control component includes a lower temperature control module and an upper temperature control module, which are used in conjunction with the upper temperature control module to control the temperature of the light module under test.

[0008] Furthermore, the enclosure includes a lower enclosure and an upper enclosure, the lower temperature control module is disposed in the lower enclosure, and the upper temperature control module is disposed in the upper enclosure; at least one of the lower enclosure and the upper enclosure has an opening at its front to provide space for inserting the optical module under test into the test interface.

[0009] Furthermore, both the lower temperature control module and the upper temperature control module integrate a temperature adjustment unit and a temperature sensor, which are used to control the temperature of the optical module under test according to instructions, so as to realize testing at different temperatures.

[0010] Furthermore, the test system combined test board also includes a combined test board mounting base plate, which is fixed to the lower housing by combined test board mounting base plate support columns; the module interface board is fixed to the combined test board mounting base plate by module interface board support columns, the signal control board is fixed to the combined test board mounting base plate by signal control board support columns, and the power supply and monitoring board is fixed to the combined test board mounting base plate by power supply and monitoring board support columns; the connection structure between the module interface board and the signal control board is reinforced by support columns.

[0011] Furthermore, the mounting base plate of the combined test board is provided with an opening for accommodating the lower temperature control module, so that the lower temperature control module can contact the optical module under test inserted into the test interface.

[0012] Furthermore, the power supply and monitoring board is equipped with a fourth communication connector interface, a fifth communication connector interface, a sixth communication connector interface, a seventh communication connector interface, an eighth communication connector interface, and a ninth communication connector interface connected to the controller, as well as a low-voltage power supply interface and a high-voltage power supply interface; the fourth communication connector interface is used to provide a first voltage to the signal control board, the fifth communication connector interface is used to provide a second voltage to the signal control board, and the eighth communication connector interface is used to provide a third voltage to the signal control board, wherein the third voltage is greater than the second voltage, and the second voltage is greater than the first voltage; the sixth communication connector interface is used to communicate with the module interface board to monitor, control, and communicate with the optical module under test, the seventh communication connector interface is used to communicate with the signal control board to monitor the working status, and the ninth communication connector interface is used to supply power, control power supply, and collect current to the module interface board.

[0013] Furthermore, the power supply and monitoring board is also provided with control and monitoring pins, which are used to directly fan out the fourth communication connector interface to the ninth communication connector interface, so as to troubleshoot the hardware of the test system one by one in case of failure.

[0014] Furthermore, the controller is an MCU, and the power supply and monitoring board is also equipped with an MCU-PC communication interface for the MCU to communicate with the host computer.

[0015] Furthermore, the module interface board is equipped with a QSFP-DD RF connector, and a first communication connector interface, a second communication connector interface, a third communication connector interface, a noise-added test RF interface, a voltage monitoring RF interface, and an MCB power supply current acquisition and control connector interface connected to the QSFP-DD RF connector; the first communication connector interface and the second communication connector interface are backups of each other, used for connecting external communication lines to directly power and communicate with the optical module under test; the third communication connector interface is connected to the sixth communication connector interface to enable the controller to monitor, control, and communicate with the optical module under test; the noise-added test RF interface is used to input ripple noise to test the noise immunity of the optical module under test; the voltage monitoring RF interface is connected to an external communication line to read the voltage of the optical module under test; the MCB power supply current acquisition and control connector interface is connected to the ninth communication connector interface to power, control, and acquire current for the module interface board.

[0016] Furthermore, the module interface board is also equipped with a low-voltage power supply interface and a high-voltage power supply interface.

[0017] Furthermore, the signal control board is equipped with a DSP chip, and connected to the DSP chip are a first evaluation and test RF interface, a second evaluation and test RF interface, a DSP test and status monitoring RF interface, a chip monitoring and communication interface, a first multi-power rail power supply interface, a second multi-power rail power supply interface, and a third multi-power rail power supply interface. The first evaluation and test RF interface is used to perform signal evaluation and testing on the electrical chip in the optical module under test, and directly outputs an RF signal. The second evaluation and test RF interface is used to perform signal evaluation and testing on the optical chip in the optical module under test, and directly outputs an optical signal. The DSP test and status monitoring RF interface is used to monitor the status of the DSP chip and output high-speed signals on the module link to the controller. The first multi-power rail power supply interface is connected to the fourth communication connector interface, the second multi-power rail power supply interface is connected to the fifth communication connector interface, and the third multi-power rail power supply interface is connected to the eighth communication connector interface, for providing the corresponding voltage to the DSP chip according to the specifications of the DSP chip. The chip monitoring and communication interface is connected to the seventh communication connector interface, for outputting the status signal of the DSP chip to the controller.

[0018] Furthermore, the module interface board is provided with a second connector for use with the loss test RF interface on the module interface board to measure the signal loss under different trace lengths on the module interface board; the signal control board is provided with a third connector for use with the loss test RF interface on the signal control board to measure the signal loss under different trace lengths on the signal control board; the signal control board is also provided with a loss test RF interface for evaluating the insertion loss gap between the actual board-level circuit and the design.

[0019] Furthermore, the first connector, the second connector, and the third connector are all BTB connectors, and the module interface board is crimped to the signal control board through the first connector; the snap-fit ​​connector includes a snap-fit ​​connector male head disposed on the signal control board and a snap-fit ​​connector female head disposed on the power supply and monitoring board, and the snap-fit ​​connector male head and the snap-fit ​​connector female head are mated and connected.

[0020] Secondly, the present invention also provides an optical module testing method, applied to the high-speed optical module testing system described in the first aspect, the method comprising: Insert the optical module under test into the replaceable test interface of the module interface board; The temperature control component is used to control the temperature of the optical module under test in order to conduct tests under different temperature conditions; Using the loss test RF interface on the module interface board and the loss test RF interface on the signal control board, the signal loss under different trace lengths is measured, and the test system is calibrated. The controller monitors the status and controls the power supply of the optical module and DSP, and uses backup communication or power supply interfaces to ensure stable testing.

[0021] In summary, compared with the prior art, the above-described technical solutions conceived by this invention can achieve the following beneficial effects: (1) Distribute the required functional modules for testing on three different test boards: module interface board, signal control board, and power supply and monitoring board. This facilitates the replacement of vulnerable parts, improves the overall lifespan of the system, and reduces costs. (2) The test interface is replaceable, compatible with the testing of optical modules with different rates, and improves system redundancy; (3) Dual backup of signal, power and communication increases the stability and reliability of the entire system; (4) An integrated loss test interface is provided, which can measure signal loss under different trace lengths and calibrate the test system to improve test accuracy; (5) The module can be tested at different temperatures, reducing the difficulty of testing; (6) Supports duplex testing, which can test two optical modules under test at the same time, improving testing efficiency and increasing economic benefits. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a high-speed optical module testing system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the combined test board structure of a test system according to an embodiment of the present invention; Figure 3 This is a block diagram of a module interface board structure according to an embodiment of the present invention; Figure 4 This is a block diagram of a signal control board structure according to an embodiment of the present invention; Figure 5 This is a structural block diagram of a power supply and monitoring board according to an embodiment of the present invention.

[0023] In the diagram: 100, Temperature control enclosure; 101, Lower enclosure; 102, Lower temperature control module; 103, Upper enclosure; 104, Upper temperature control module; 200, Test system assembly test board; 201, Module interface board; 202, Signal control board; 203, Power supply and monitoring board; 204, Power supply and monitoring board support column; 205, Signal control board support column; 206, Module interface board support column; 207, Assembly test board mounting base plate; 208, Assembly test board mounting base plate support column. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. All other embodiments obtained by those skilled in the art based on the embodiments provided by this invention without inventive effort are within the scope of protection of this invention.

[0025] Obviously, the accompanying drawings described below are merely some examples or embodiments of the present invention. Those skilled in the art can apply the present invention to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this invention, modifications to design, manufacturing, or production based on the technical content disclosed in this invention are merely conventional technical means and should not be construed as insufficient disclosure of the present invention.

[0026] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this invention may be combined with other embodiments without conflict.

[0027] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "a," "an," "an," "the," and similar words used in this invention do not indicate quantity limitation and may indicate singular or plural. The terms "comprising," "including," "having," and any variations thereof used in this invention are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms "connected," "linked," "coupled," and similar words used in this invention are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "A plurality" used in this invention refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships may exist; for example, "A and / or B" can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects have an "or" relationship. The terms "first," "second," and "third" used in this invention are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0028] like Figure 1 and Figure 2 As shown, this embodiment of the invention provides a high-speed optical module testing system, which consists of two main parts: a temperature control chamber 100 and a test system combination test board 200, wherein the test system combination test board 200 is disposed inside the temperature control chamber 100.

[0029] The temperature control enclosure 100 includes an enclosure and a temperature control component disposed within the enclosure. The temperature control component is used to control the temperature of the light-measuring module. Specifically, the enclosure includes a lower enclosure 101 and an upper enclosure 103, and the temperature control component includes a lower temperature control module 102 and an upper temperature control module 104.

[0030] The test system combined test board 200 mainly consists of eight parts: module interface board 201, signal control board 202, power supply and monitoring board 203, power supply and monitoring board support column 204, signal control board support column 205, module interface board support column 206, combined test board mounting base plate 207, and combined test board mounting base plate support column 208.

[0031] The lower housing 101 provides lower support for the entire test system assembly test board 200 and is also the lower half of the temperature control housing 100. The lower housing 101 has an opening at the front, providing lower space for the optical module to be inserted into the test interface on the module interface board 201 of the internal test system assembly test board 200; the lower housing 101 has an opening at the rear, providing space for the connection cables between the test system assembly test board 200 and external instruments; the lower housing 101 has a structure at the rear that connects to the upper housing 103.

[0032] The upper housing 103 has an opening at the front, providing upper space for the test interface on the module interface board 201 in the internal test system assembly test board 200 where the optical module is inserted; the upper housing 103 has a structure at the rear that connects to the lower housing 101.

[0033] The lower temperature control module 102 is fixed to the lower housing 101 and integrates a temperature adjustment unit and a temperature sensor. It can work with the upper temperature control module 104 to control the temperature of the optical module under test in real time according to the instructions. The upper surface of the lower temperature control module 102 is in contact with the bottom surface of the outer shell of the optical module under test.

[0034] The upper temperature control module 104 is fixed to the upper housing 103 and integrates a temperature adjustment unit and a temperature sensor. It can control the temperature of the optical module under test in real time according to the instructions of the lower temperature control module 102. The lower surface of the upper temperature control module 104 is in contact with the top surface of the external heat dissipation cage of the optical module under test.

[0035] The temperature control unit can be a TEC, which uses a temperature sensor to sense the temperature of the optical module under test in real time and drives the TEC to heat or cool according to instructions, thereby accurately controlling the optical module under test to be in a low temperature, normal temperature or high temperature state.

[0036] The test system combination test board 200 is at least one, and the temperature control component is at least one set, with one set of temperature control components corresponding to one test system combination test board 200, to control the temperature of the corresponding optical module under test. When two sets of test system combination test boards 200 are set, two optical modules under test can be tested simultaneously, i.e., full-duplex testing is achieved. Figure 1 As shown.

[0037] The combined test board mounting base 207 is fixed to the lower housing 101 by the combined test board mounting base support column 208. The combined test board mounting base 207 has an opening for accommodating the lower temperature control module 102, so that the upper surface of the lower temperature control module 102 contacts the bottom surface of the optical module under test inserted into the test interface. That is, the opening is used to avoid the lower temperature control module 102, ensuring that the upper surface of the lower temperature control module 102 can directly contact the bottom surface of the optical module under test, so as to achieve effective heat conduction.

[0038] The module interface board 201 is fixed to the combined test board mounting base plate 207 via module interface board support columns 206. A first connector, preferably a 32-channel BTB high-speed connector, is mounted on the bottom of the module interface board 201. The module interface board 201 is crimped with the signal control board 202 via this BTB connector for high-frequency signal communication. The connection structure between the module interface board 201 and the signal control board 202 is further reinforced by support columns. The module interface board 201 is provided with a replaceable test interface for connecting the optical module under test, to accommodate testing of optical modules with different speeds.

[0039] The signal control board 202 is fixed to the mounting base plate 207 of the combined test board via the signal control board support column 205. The signal control board 202 is connected to the module interface board 201 via a first connector mounted on the bottom of the module interface board 201. The rear of the signal control board 202 is connected to the power supply and monitoring board 203 via a snap-fit ​​connector for electrical signal communication. The snap-fit ​​connector includes a male snap-fit ​​connector head on the signal control board 202 and a female snap-fit ​​connector head on the power supply and monitoring board 203, and the male and female snap-fit ​​connector heads are mated and connected. The signal control board 202 is equipped with a signal processing chip, preferably a DSP chip.

[0040] The power supply and monitoring board 203 is fixed to the combined test board mounting base 207 via the power supply and monitoring board support column 204. The front of the power supply and monitoring board 203 is connected to the signal control board 202 via a snap-fit ​​connector for electrical signal communication. The power supply and monitoring board 203 is equipped with a controller for power supply control, status monitoring, and communication management of the module interface board 201 and the signal control board 202, and at least some communication interfaces and / or power supply interfaces have redundant configurations for mutual backup. Preferably, the controller is an MCU.

[0041] like Figure 3 As shown, the module interface board 201 is equipped with: (1) Second connector: a 32-channel BTB high-speed connector, serving as a full-channel RF interface; used in combination with the first loss test RF interface and the second loss test RF interface to measure the signal loss of the second connector and the RF interface on the module interface board 201 when the signal is 1 times the trace length and the signal is 2 times the trace length, so as to calibrate the entire test system and improve the test accuracy; (2) First loss test RF interface: used in conjunction with the second connector to test the signal loss of the second connector and the RF interface at a signal length of 1 times the trace length; (3) Second loss test RF interface: Used in conjunction with the second connector to test the signal loss of the second connector and the RF interface at twice the signal trace length; (4) First communication connector interface: external communication line, without passing through the circuit on the PCB, can directly power and communicate with the module, which is convenient for troubleshooting possible abnormalities on the PCB link when the module is tested abnormally; (5) Second communication connector interface: external communication line, serving as a backup redundancy for the first communication connector interface; (6) Third communication connector interface: connected to the sixth communication connector interface on the power supply and monitoring board 203; used for MCU to monitor, control and communicate with the module; adopts I2C communication protocol; supports online control and offline control; when the MCU detects communication, it releases the communication link, so it can intelligently switch between local communication and external communication; (7) QSFP DD RF connector: used for electrical connection of the optical module under test; (8) Low-voltage power supply interface: Provides 3.3V voltage to the entire module interface board 201; (9) High voltage power supply interface: provides 12V voltage to the entire module interface board 201, which is mutually exclusive with the low voltage power supply interface; when using 12V power supply, the load capacity is strong, the power supply requirements are lower, the power supply compatibility is better, and the entire test system has better compatibility with instruments and meters. (10) Noise-added test RF interface: used for ripple noise input, to test the module's noise immunity, mainly used in the R&D stage to fully verify whether the module's performance meets the design requirements; (11) Voltage monitoring RF interface: External communication line, no need to go through the circuit on the PCB, no filter circuit in the middle, can directly read the module voltage, which is closer to the real situation; (12) MCB power supply current acquisition and control connector interface: supplies power to the entire module interface board 201, controls the power supply and acquires the current of the module; connects to the ninth communication connector interface on the power supply and monitoring board 203.

[0042] like Figure 4 As shown, the signal control board 202 is equipped with: (1) DSP chip; (2) First evaluation test RF interface: to perform signal evaluation test on the electrical chips in the module, and output the RF signal directly, which can more accurately estimate the overall signal design quality; (3) Second evaluation test RF interface: to perform signal evaluation test on the optical chip in the module, and output the optical signal directly, which can more accurately estimate the overall signal design quality; (4) Third connector: a 32-channel BTB high-speed connector, used in combination with the third loss test RF interface and the fourth loss test RF interface to measure the signal loss of the third connector and the RF interface on the signal control board 202 at one signal trace length and two signal trace length, so as to calibrate the entire test system and improve the test accuracy. (5) Third loss test RF interface: Used in conjunction with the third connector to test the signal loss of the third connector and the RF interface at a signal length of one times the trace length; (6) Fourth loss test RF interface: Used in conjunction with the third connector to test the signal loss of the third connector and the RF interface at twice the signal trace length; (7) Fifth loss test RF interface: insertion loss test to evaluate the gap between the actual circuit of the board and the design; (8) First multi-rail power supply interface: connected to the fourth communication connector interface on the power supply and monitoring board 203, providing 0.4V voltage according to the DSP specifications, making the DSP run more stably and improving the overall stability of the test system; (9) Second multi-rail power supply interface: connected to the fifth communication connector interface on the power supply and monitoring board 203, providing 0.75V voltage according to the DSP specifications, making the DSP run more stably and improving the overall stability of the test system; (10) Third multi-power rail power supply interface: connected to the eighth communication connector interface on the power supply and monitoring board 203, providing 0.9V voltage according to the DSP specifications, making the DSP run more stably and improving the overall stability of the test system; the selection of the first multi-power rail power supply interface, the second multi-power rail power supply interface and the third multi-power rail power supply interface depends on the specifications of the DSP. (11) DSP testing and status monitoring RF interface: to monitor the status of the DSP and output high-speed signals on the module link to the MCU; (12) Chip monitoring and communication interface: connected to the seventh communication connector interface on the power supply and monitoring board 203, supporting I2C, SPI and MDIO communication protocols; outputting the low-speed status signal of the DSP to the MCU.

[0043] (13) 32-channel snap-on high-speed interface male connector, which is paired with the 32-channel snap-on high-speed interface female connector on the power supply and monitoring board for electrical signal connection between the signal control board and the power supply and monitoring board.

[0044] like Figure 5 As shown, the power supply and monitoring board 203 is equipped with: (1) Controller: MCU; (2) Fourth communication connector interface: connected to the first multi-power rail power supply interface of the signal control board 202, so that the MCU provides 0.4V voltage to the DSP; (3) Fifth communication connector interface: connected to the second multi-power rail power supply interface of the signal control board 202, so that the MCU provides 0.75V voltage to the DSP; (4) Sixth communication connector interface: connected to the third communication connector interface of the module interface board 201, enabling the MCU to monitor, control and communicate with the module; (5) Seventh communication connector interface: connected to the chip monitoring and communication interface of the signal control board 202, enabling the MCU to monitor the working status of the DSP; (6) Eighth communication connector interface: connected to the third multi-power rail power supply interface of the signal control board 202, so that the MCU provides 0.9V voltage to the DSP; (7) Ninth communication connector interface: connected to the MCB power supply current acquisition and control connector interface of the module interface board 201, so that the MCU supplies power to the entire module interface board 201, controls the power supply and acquires the current of the module. (8) Low-voltage power supply interface: provides 3.3V voltage to the power supply and monitoring board 203; (9) High voltage power supply interface: provides 12V voltage to the power supply and monitoring board 203; it is mutually exclusive with the low voltage power supply interface, so that the voltage input can be flexibly selected, the power supply requirements are lower, the power supply compatibility is better, and the entire test system has better compatibility with instruments and meters. (10) First control and monitoring pin: used to directly fan out all control functions without going through the circuit on the PCB, making it convenient to troubleshoot the hardware of the test system one by one when a fault occurs; (11) Second control and monitoring pin: used to directly fan out all control functions without going through the circuit on the PCB, making it convenient to troubleshoot the hardware of the test system one by one when a fault occurs; (12) 32-channel snap-on high-speed interface female connector, which is paired with the 32-channel snap-on high-speed interface male connector on the signal control board for electrical signal connection between the signal control board and the power supply and monitoring board; (13) MCU-PC communication interface: used for communication between MCU and host computer.

[0045] This invention also provides an optical module testing method, applied to the high-speed optical module testing system described in the above embodiments, the method comprising the following steps: Step S1: Insert the optical module under test into the replaceable test interface of the module interface board 201. Depending on the rate specifications of the optical module under test, the corresponding test interface can be replaced to accommodate the testing requirements of optical modules with different rates.

[0046] Step S2: The lower temperature control module 102 and the upper temperature control module 104 are used to control the temperature of the optical module under test. The upper surface of the lower temperature control module 102 is in contact with the bottom surface of the housing of the optical module under test, and the lower surface of the upper temperature control module 104 is in contact with the top surface of the external heat dissipation cage of the optical module under test. The temperature of the optical module under test is sensed in real time by temperature sensors integrated inside the lower temperature control module 102 and the upper temperature control module 104, and the temperature regulation unit (such as TEC) is driven to heat or cool according to the instructions, so as to accurately control the optical module under test to be in the required temperature state (low temperature, normal temperature or high temperature) for testing under different temperature conditions.

[0047] Step S3: Using the first and second loss test RF interfaces on the module interface board 201, in conjunction with the second connector, measure the signal loss under different trace lengths between the second connector and the corresponding RF interface; using the third and fourth loss test RF interfaces on the signal control board 202, in conjunction with the third connector, measure the signal loss under different trace lengths between the third connector and the corresponding RF interface; using the fifth loss test RF interface on the signal control board 202, evaluate the insertion loss difference between the actual board-level circuit and the design. Based on the measured loss values, calibrate the entire test system to improve test accuracy.

[0048] Step S4: The power supply and monitoring board 203 controller performs power supply control, status monitoring, and communication management on the module interface board 201 and the signal control board 202. Specifically, the power supply and monitoring board 203 connects to the third communication connector interface on the module interface board 201 via the sixth communication connector interface to monitor, control, and communicate with the optical module; it connects to the chip monitoring and communication interface on the signal control board 202 via the seventh communication connector interface to monitor the DSP's operating status; it connects to the first multi-power rail power supply interface on the signal control board 202 via the fourth communication connector interface to provide 0.4V to the DSP chip; it connects to the second multi-power rail power supply interface on the signal control board 202 via the fifth communication connector interface to provide 0.75V to the DSP chip; it connects to the third multi-power rail power supply interface on the signal control board 202 via the eighth communication connector interface to provide 0.9V to the DSP chip; and it connects to the MCB power supply current acquisition and control connector interface on the module interface board 201 via the ninth communication connector interface to perform power supply control and current acquisition on the module interface board 201. During the testing process, backup communication interfaces, such as the first communication connector interface and the second communication connector interface, or backup power supply interfaces, are used to ensure stable testing.

[0049] When two optical modules under test need to be tested simultaneously, two sets of test system combination test boards 200 can be set up in the temperature control chamber 100. One set of temperature control components corresponds to one test system combination test board 200 to control the temperature of the corresponding optical module under test, realize duplex testing, improve testing efficiency, and increase economic benefits.

[0050] In summary, this invention provides a high-speed optical module testing system and method. By distributing the required functional modules across three different test boards—a module interface board, a signal control board, and a power supply and monitoring board—it facilitates the replacement of vulnerable components, extends the overall system lifespan, and reduces costs. The use of replaceable test interfaces ensures compatibility with testing optical modules at different speeds, enhancing system redundancy. Dual backup design for signal, power, and communication systems increases the stability and reliability of the entire system. An integrated loss test interface allows for the measurement and calibration of signal loss at different trace lengths, improving test accuracy. A temperature control component enables testing of modules at various temperatures, reducing testing complexity. Furthermore, by providing at least one set of test system boards corresponding one-to-one with the temperature control component, full-duplex testing is supported, improving testing efficiency and increasing economic benefits.

[0051] It should be noted that, depending on the implementation needs, the various steps / components described in this invention can be broken down into more steps / components, or two or more steps / components or parts of the operation of steps / components can be combined into new steps / components to achieve the purpose of this invention.

[0052] Those skilled in the art will readily understand that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A high-speed optical module testing system, characterized in that, The system includes a temperature control chamber and a test system assembly test board disposed within the temperature control chamber; The temperature control enclosure includes an enclosure and a temperature control component disposed within the enclosure. The temperature control component is used to control the temperature of the light-measuring module. The test system combined test board includes a module interface board, a signal control board, and a power supply and monitoring board; The module interface board is equipped with a replaceable test interface for connecting the optical module under test, so as to be compatible with the testing of optical modules with different rates; The module interface board is connected to the signal control board via a first connector to perform high-frequency signal communication; The signal control board is connected to the power supply and monitoring board via a snap-fit ​​connector to communicate electrical signals; Both the module interface board and the signal control board are equipped with a loss test RF interface for calibrating the loss of the signal transmission path. The power supply and monitoring board is equipped with a controller, which is used to control the power supply, monitor the status and manage the communication of the module interface board and the signal control board, and at least some of the communication interfaces and / or power supply interfaces have redundant configurations that are backups of each other.

2. The high-speed optical module testing system according to claim 1, characterized in that, The test system combination test board is at least one, and the temperature control component is at least one set, with one set of the temperature control component corresponding to one test system combination test board, so as to control the temperature of the corresponding optical module under test.

3. The high-speed optical module testing system according to claim 2, characterized in that, The temperature control component includes a lower temperature control module and an upper temperature control module, which work together to control the temperature of the light module under test.

4. The high-speed optical module testing system according to claim 3, characterized in that, The enclosure includes a lower enclosure and an upper enclosure. The lower temperature control module is disposed in the lower enclosure, and the upper temperature control module is disposed in the upper enclosure. At least one of the lower enclosure and the upper enclosure has an opening at its front to provide space for the optical module under test to be inserted into the test interface.

5. The high-speed optical module testing system according to claim 3 or 4, characterized in that, Both the lower temperature control module and the upper temperature control module integrate a temperature adjustment unit and a temperature sensor, which are used to control the temperature of the optical module under test according to instructions, so as to realize testing at different temperatures.

6. The high-speed optical module testing system according to claim 4, characterized in that, The test system combined test board also includes a combined test board mounting base plate, which is fixed to the lower housing by combined test board mounting base plate support columns; the module interface board is fixed to the combined test board mounting base plate by module interface board support columns, the signal control board is fixed to the combined test board mounting base plate by signal control board support columns, and the power supply and monitoring board is fixed to the combined test board mounting base plate by power supply and monitoring board support columns; the connection structure between the module interface board and the signal control board is reinforced by support columns.

7. The high-speed optical module testing system according to claim 6, characterized in that, The mounting base of the combined test board has an opening for accommodating the lower temperature control module, so that the lower temperature control module can contact the optical module under test inserted into the test interface.

8. The high-speed optical module testing system according to claim 1, characterized in that, The power supply and monitoring board is equipped with a fourth communication connector interface, a fifth communication connector interface, a sixth communication connector interface, a seventh communication connector interface, an eighth communication connector interface, and a ninth communication connector interface connected to the controller, as well as a low-voltage power supply interface and a high-voltage power supply interface; the fourth communication connector interface is used to provide a first voltage to the signal control board, the fifth communication connector interface is used to provide a second voltage to the signal control board, and the eighth communication connector interface is used to provide a third voltage to the signal control board, wherein the third voltage is greater than the second voltage, and the second voltage is greater than the first voltage; The sixth communication connector interface is used to communicate with the module interface board to monitor, control and communicate with the optical module under test. The seventh communication connector interface is used to communicate with the signal control board to monitor the working status. The ninth communication connector interface is used to supply power, control power supply and collect current for the module interface board.

9. The high-speed optical module testing system according to claim 8, characterized in that, The power supply and monitoring board is also equipped with control and monitoring pins, which are used to directly fan out the fourth communication connector interface to the ninth communication connector interface, so as to troubleshoot the hardware of the test system one by one in case of failure.

10. The high-speed optical module testing system according to claim 8, characterized in that, The controller is an MCU, and the power supply and monitoring board is also equipped with an MCU-PC communication interface for the MCU to communicate with the host computer.

11. The high-speed optical module testing system according to claim 8, characterized in that, The module interface board is equipped with a QSFP-DD RF connector, and a first communication connector interface, a second communication connector interface, a third communication connector interface, a noise testing RF interface, a voltage monitoring RF interface, and an MCB power supply current acquisition and control connector interface connected to the QSFP-DD RF connector. The first and second communication connector interfaces are backups of each other and are used to directly power and communicate with the optical module under test by connecting an external communication line. The third communication connector interface is connected to the sixth communication connector interface so that the controller can monitor, control, and communicate with the optical module under test. The noise testing RF interface is used to input ripple noise to test the noise immunity of the optical module under test. The voltage monitoring RF interface is connected to an external communication line for reading the voltage of the optical module under test; the MCB power supply current acquisition and control connector interface is connected to the ninth communication connector interface for power supply, power control and current acquisition of the module interface board.

12. The high-speed optical module testing system according to claim 11, characterized in that, The module interface board is also equipped with a low-voltage power supply interface and a high-voltage power supply interface.

13. The high-speed optical module testing system according to claim 8, characterized in that, The signal control board is equipped with a DSP chip, and connected to the DSP chip are a first evaluation and test RF interface, a second evaluation and test RF interface, a DSP test and status monitoring RF interface, a chip monitoring and communication interface, a first multi-power rail power supply interface, a second multi-power rail power supply interface, and a third multi-power rail power supply interface. The first evaluation and test RF interface is used to perform signal evaluation and testing on the electrical chip in the optical module under test, and directly outputs an RF signal. The second evaluation and test RF interface is used to perform signal evaluation and testing on the optical chip in the optical module under test, and directly outputs an optical signal. The DSP test and status monitoring RF interface is used to monitor the status of the DSP chip and output high-speed signals on the module link to the controller. The first multi-power rail power supply interface is connected to the fourth communication connector interface, the second multi-power rail power supply interface is connected to the fifth communication connector interface, and the third multi-power rail power supply interface is connected to the eighth communication connector interface, for providing the corresponding voltage to the DSP chip according to the specifications of the DSP chip. The chip monitoring and communication interface is connected to the seventh communication connector interface, for outputting the status signal of the DSP chip to the controller.

14. The high-speed optical module testing system according to claim 1, characterized in that, The module interface board is provided with a second connector for use with the loss test RF interface on the module interface board to measure the signal loss under different trace lengths on the module interface board; the signal control board is provided with a third connector for use with the loss test RF interface on the signal control board to measure the signal loss under different trace lengths on the signal control board; the signal control board is also provided with a loss test RF interface for evaluating the insertion loss difference between the actual board-level circuit and the design.

15. The high-speed optical module testing system according to claim 14, characterized in that, The first connector, the second connector, and the third connector are all BTB connectors. The module interface board is crimped to the signal control board through the first connector. The snap-fit ​​connector includes a male snap-fit ​​connector on the signal control board and a female snap-fit ​​connector on the power supply and monitoring board. The male snap-fit ​​connector and the female snap-fit ​​connector are mated and connected.

16. A method for testing optical modules, applied to the high-speed optical module testing system according to any one of claims 1 to 15, characterized in that, include: Insert the optical module under test into the replaceable test interface of the module interface board; The temperature control component is used to control the temperature of the optical module under test in order to conduct tests under different temperature conditions; Using the loss test RF interface on the module interface board and the loss test RF interface on the signal control board, the signal loss under different trace lengths is measured, and the test system is calibrated. The controller performs power supply control, status monitoring, and communication management on the module interface board and the signal control board, and utilizes backup communication or power supply interfaces to ensure stable testing.

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