Pof-based combined pon module control circuit and method

Abstract

The application provides a POF-based combined PON module control circuit and method, and belongs to the technical field of COMBO gateways. The circuit comprises: a POF power supply module, which is used for accessing alternating voltage power supply, converting alternating voltage into direct current voltage, and providing the direct current voltage to a power receiving conversion module; the power receiving conversion module is used for receiving the direct current voltage provided by the POF power supply module and converting the direct current voltage; a DC-DC conversion module is used for converting the direct current voltage converted by the power receiving conversion module into direct current and supplying power to the combined PON module; and a control module is used for reading the optical drive chip currently running in the combined PON module and switching to the corresponding PON mode. The application scheme can simplify the logic of COMBO gateway mode switching.

Description

Technical Field

[0001] This application relates to the field of COMBO gateway technology, and specifically to a POF-based combined PON module control circuit and method. Background Technology

[0002] COMBO gateways (XGPON (10-Gigabit-capable Passive Optical Network, 10G-PON, 10G Passive Optical Network) + GPON (Gigabit-Capable PON)) are gaining popularity among operators due to their versatility in compatibility with different OLT (Optical Line Terminal) modes. Meanwhile, POF (Power over Fiber) gateways integrate the uplink optical and power supply of the gateway into a single cable, and their simplified cabling is gradually being accepted by users.

[0003] One of the technical challenges of COMBO gateways is identifying the current signal mode of the OLT and switching its own PON (Passive Optical Network) mode accordingly. Currently, existing technologies mainly rely on the main control chip to identify different optical signals, which requires the addition of switching chips and logic control pins, placing high demands on chip capabilities and resulting in complex software processing logic.

[0004] Therefore, how to simplify the logic of COMBO gateway mode switching remains an unsolved problem. Summary of the Invention

[0005] The purpose of this application is to provide a POF-based combined PON module control circuit and method, which can solve the problem of complex logic in COMBO gateway mode switching in the prior art.

[0006] In a first aspect, embodiments of this application provide a POF-based combined PON module control circuit, which includes: a POF power supply module, a power receiving conversion module, a DC-DC conversion module, and a control module; The power output terminal of the POF power supply module is connected to the power input terminal of the power receiving conversion module, the power output terminal of the power receiving conversion module is connected to the power input terminal of the DC-DC conversion module, and the power output terminal of the DC-DC conversion module is connected to the power input terminal of the combined PON module. The serial deserialization pin of the combined PON module is connected to the serial deserialization pin of the control module; the signal loss pin of the combined PON module is connected to the receive data pin of the control module; the I2C pin of the combined PON module is connected to the I2C pin of the control module; and the burst enable signal input pin of the combined PON module is connected to the burst enable signal input pin of the control module. The POF power supply module is used to connect to AC voltage, convert AC voltage to DC voltage, and provide DC voltage to the power receiving conversion module; the power receiving conversion module is used to receive the DC voltage provided by the POF power supply module and convert the DC voltage; the DC-DC conversion module is used to convert the DC voltage converted by the power receiving conversion module to DC voltage and power the combined PON module. The control module is used to read the currently running optical drive chip in the combined PON module and switch to the corresponding PON mode.

[0007] In one possible implementation of the first aspect, the POF power supply module includes: a first POF power supply unit and a second POF power supply unit; The power output terminal of the first POF power supply unit is connected to the power input terminal of the power receiving conversion module. The first POF power supply unit is used to connect to AC voltage power supply, convert AC voltage to DC voltage, and provide DC voltage to the power receiving conversion module. The power output terminal of the second POF power supply unit is connected to the power input terminal of the power conversion module. The first POF power supply unit is used to connect to AC voltage power supply, convert AC voltage to DC voltage, and provide DC voltage to the power conversion module.

[0008] In one possible implementation of the first aspect, the first POF power supply unit includes: a first POF interface, a first rectifier chip, and a first capacitor; The positive power supply pin of the first POF interface is connected to the positive AC input terminal of the first rectifier chip, the negative power supply pin of the first POF interface is connected to the negative AC input terminal of the first rectifier chip, and the ground pin of the first POF interface is grounded. The first POF interface is used to connect to AC voltage power supply. The positive DC output terminal of the first rectifier chip and the first terminal of the first capacitor are connected to the positive power supply input terminal of the power conversion module, and the negative DC output terminal of the first rectifier chip and the second terminal of the first capacitor are connected to the negative power supply input terminal of the power conversion module. The first rectifier chip is used to convert AC voltage into DC voltage, and the first capacitor is used to filter the DC voltage. The second POF power supply unit includes: a second POF interface, a second rectifier chip, and a second capacitor; The positive power supply pin of the second POF interface is connected to the positive AC input terminal of the second rectifier chip, the negative power supply pin of the second POF interface is connected to the negative AC input terminal of the second rectifier chip, and the ground pin of the second POF interface is grounded. The second POF interface is used to connect to AC voltage power supply. The positive DC output terminal of the second rectifier chip and the first terminal of the second capacitor are connected to the positive power supply input terminal of the power conversion module, and the negative DC output terminal of the second rectifier chip and the second terminal of the second capacitor are connected to the negative power supply input terminal of the power conversion module. The second rectifier chip is used to convert AC voltage into DC voltage, and the second capacitor is used to filter the DC voltage.

[0009] In one possible implementation of the first aspect, the power receiving conversion module includes: a first power receiving conversion unit and a second power receiving conversion unit; The power input terminal of the first power receiving and conversion unit is connected to the power output terminal of the POF power supply module, and the power output terminal of the first power receiving and conversion unit is connected to the power input terminal of the DC-DC conversion module. The first power receiving and conversion unit is used to receive the DC voltage provided by the POF power supply module and convert the DC voltage. The power input terminal of the second power conversion unit is connected to the power output terminal of the POF power supply module, and the power output terminal of the second power conversion unit is connected to the power input terminal of the DC-DC conversion module. The second power conversion unit is used to receive the DC voltage provided by the POF power supply module and convert the DC voltage.

[0010] In one possible implementation of the first aspect, the first power receiving conversion unit includes: a first POF power receiving chip, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a first diode, a second diode, and a first inductor; The ISNS and HSO pins of the first POF power receiving chip are connected to the second end of the first resistor. The FBH pin of the first POF power receiving chip is connected to the series node of the second and third resistors. The EROUT pin of the first POF power receiving chip is connected to the first end of the third and fourth capacitors. The FBL pin of the first POF power receiving chip is connected to the power ground. The VDD pin of the first POF power receiving chip is connected to the first end of the fifth capacitor. The RDET pin of the first POF power receiving chip is connected to the first end of the fifth resistor. The NC pin, VNEG pin, and EPAD pin of the first POF power receiving chip are connected to the negative power supply output terminal of the POF power supply module. The RCL pin of the first POF power receiving chip is connected to the first end of the sixth resistor. The RFREQ pin of the first POF power receiving chip is connected to the first end of the seventh resistor. The VPOS pin of the first POF power receiving chip is connected to the positive power output terminal of the POF power supply module, the SWO pin of the first POF power receiving chip is connected to the first terminal of the first inductor and the anode of the first diode, and the VSS pin of the first POF power receiving chip is connected to the power ground. The first end of the first resistor, the second end of the sixth capacitor, and the second end of the seventh capacitor are connected to the power supply ground. The first end of the sixth capacitor and the first end of the seventh capacitor are connected to the positive power supply output terminal of the POF power supply module and the power supply input terminal of the DC-DC conversion module. The first end of the second resistor is connected to the power input terminal of the DC-DC converter module. The second resistor, the third resistor, and the fourth resistor are connected in series between the power input terminal of the DC-DC converter module and ground. The first terminal of the eighth capacitor is connected to the first terminal of the third resistor, the second terminal of the eighth capacitor is grounded, and the ninth and tenth capacitors are connected in parallel between the power supply input terminal of the DC-DC converter module and ground. The first end of the eighth resistor is connected to the second end of the third capacitor, and the second ends of the eighth resistor, the fourth capacitor, and the fifth capacitor are connected to the power supply ground. The second end of the fifth resistor and the second end of the seventh resistor are connected to the positive power output terminal of the POF power supply module, and the second end of the sixth resistor is connected to the negative power output terminal of the power supply module. The cathode of the first diode is connected to the first terminal of the seventh capacitor. The first terminals of the eleventh, twelfth, and thirteenth capacitors are connected to the cathode of the first diode. The second terminals of the eleventh, twelfth, and thirteenth capacitors are connected to the second terminal of the first inductor. The second terminal of the thirteenth capacitor is grounded. The anode of the second diode and the second terminal of the fourteenth capacitor are connected to the negative power supply output terminal of the POF power supply module. The cathode of the second diode and the first terminal of the ninth resistor are connected to the positive power supply output terminal of the POF power supply module. The second terminal of the ninth resistor is connected to the first terminal of the fourteenth capacitor.

[0011] In one possible implementation of the first aspect, the second power receiving and conversion unit includes: a second POF power receiving chip, a fifteenth capacitor, a sixteenth capacitor, a seventeenth capacitor, an eighteenth capacitor, a nineteenth capacitor, a twentieth capacitor, a twenty-first capacitor, a twenty-second capacitor, a twenty-third capacitor, a twenty-fourth capacitor, a twenty-fifth capacitor, a twenty-sixth capacitor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a third diode, a fourth diode, and a second inductor; The ISNS and HSO pins of the second POF power receiving chip are connected to the second end of the tenth resistor. The FBH pin of the second POF power receiving chip is connected to the series node of the eleventh and twelfth resistors. The EROUT pin of the second POF power receiving chip is connected to the first end of the fifteenth and sixteenth capacitors. The FBL pin of the second POF power receiving chip is connected to the power ground. The VDD pin of the second POF power receiving chip is connected to the first end of the seventeenth capacitor. The RDET pin of the second POF power receiving chip is connected to the first end of the fourteenth resistor. The NC pin, VNEG pin, and EPAD pin of the second POF power receiving chip are connected to the negative power supply output terminal of the POF power supply module. The RCL pin of the second POF power receiving chip is connected to the first end of the fifteenth resistor. The RFREQ pin of the second POF power receiving chip is connected to the first end of the sixteenth resistor. The VPOS pin of the second POF power receiving chip is connected to the positive power output terminal of the POF power supply module, the SWO pin of the second POF power receiving chip is connected to the first terminal of the second inductor and the anode of the third diode, and the VSS pin of the second POF power receiving chip is connected to the power ground. The first terminal of the tenth resistor, the second terminal of the eighteenth capacitor, and the second terminal of the nineteenth capacitor are connected to the power supply ground. The first terminals of the eighteenth and nineteenth capacitors are connected to the positive power supply output terminal of the POF power supply module and the power supply input terminal of the DC-DC conversion module. The first end of the eleventh resistor is connected to the power input terminal of the DC-DC converter module. The eleventh, twelfth and thirteenth resistors are connected in series between the power input terminal of the DC-DC converter module and ground. The first terminal of the twentieth capacitor is connected to the first terminal of the twelfth resistor, the second terminal of the twentieth capacitor is grounded, and the twentieth and twentieth capacitors are connected in parallel between the power supply input terminal of the DC-DC converter module and ground. The first end of the seventeenth resistor is connected to the second end of the fifteenth capacitor, and the second ends of the seventeenth resistor, the sixteenth capacitor, and the seventeenth capacitor are connected to the power supply ground. The second end of the fourteenth resistor and the second end of the sixteenth resistor are connected to the positive power output terminal of the POF power supply module, and the second end of the fifteenth resistor is connected to the negative power output terminal of the POF power supply module. The cathode of the third diode is connected to the first terminal of the nineteenth capacitor. The first terminals of the twenty-third, twenty-fourth, and twenty-fifth capacitors are connected to the cathode of the third diode. The second terminals of the twenty-third, twenty-fourth, and twenty-fifth capacitors are connected to the second terminal of the second inductor. The second terminal of the twenty-fifth capacitor is grounded. The anode of the fourth diode and the second terminal of the twenty-sixth capacitor are connected to the negative power supply output terminal of the POF power supply module. The cathode of the fourth diode and the first terminal of the eighteenth resistor are connected to the positive power supply output terminal of the POF power supply module. The second terminal of the eighteenth resistor is connected to the first terminal of the twenty-sixth capacitor.

[0012] In one possible implementation of the first aspect, the combined PON module includes a GPON optical drive chip and an XGPON optical drive chip; the DC-DC conversion module includes: a first DC-DC conversion unit and a second DC-DC conversion unit; The power input terminal of the first DC-DC conversion unit is connected to the power output terminal of the power receiving conversion module, and the power output terminal of the first DC-DC conversion unit is connected to the power input pin of the XGPON optical drive chip. The first DC-DC conversion unit is used to convert the DC voltage after conversion by the power receiving conversion module into DC voltage and to supply power to the XGPON optical drive chip. The power input terminal of the second DC-DC conversion unit is connected to the power output terminal of the power receiving conversion module, and the power output terminal of the second DC-DC conversion unit is connected to the power input pin of the GPON optical drive chip. The second DC-DC conversion unit is used to convert the DC voltage converted by the power receiving conversion module into DC voltage and to supply power to the GPON optical drive chip.

[0013] In one possible implementation of the first aspect, the first DC-DC conversion unit includes: a first DC-DC conversion chip, a 27th capacitor, a 28th capacitor, a 29th capacitor, a 30th capacitor, a 31st capacitor, a 32nd capacitor, a 33rd capacitor, a 34th capacitor, a 35th capacitor, a 36th capacitor, a 37th capacitor, a 19th resistor, a 20th resistor, a 21st resistor, a 22nd resistor, a 23rd resistor, a 24th resistor, and a third inductor. The power input pin of the first DC-DC converter chip is connected to the power output terminal of the power receiving conversion module; the enable pin of the first DC-DC converter chip is connected to the first terminal of the thirtieth capacitor; the ground pin of the first DC-DC converter chip is grounded; the bootstrap pin of the first DC-DC converter chip is connected to the first terminal of the twenty-first resistor; the switching node output pin of the first DC-DC converter chip is connected to the first terminal of the third inductor; and the feedback pin of the first DC-DC converter chip is connected to the first terminal of the twenty-second resistor. The 27th, 28th and 29th capacitors are connected in parallel between the power supply output terminal of the power conversion module and ground. The first terminal of the 19th resistor is connected to the first terminal of the 29th capacitor. The series connection of the 19th and 20th resistors is connected to the first terminal of the 30th capacitor. The second terminals of the 20th resistor and the 30th capacitor are grounded. The second end of the twenty-first resistor is connected to the first end of the thirty-first capacitor, the second end of the thirty-first capacitor is connected to the first end of the third inductor, and the second end of the third inductor is connected to the power input pin of the XGPON optical drive chip. The second end of the 22nd resistor is connected to the first end of the 24th resistor, the second end of the 24th resistor is connected to the second end of the third inductor, the 32nd capacitor is connected in parallel with the 24th resistor, the first end of the 23rd resistor is connected to the series node of the 22nd and 24th resistors, and the second end of the 23rd resistor is grounded. The thirty-third, thirty-fourth, thirty-fifth, thirty-sixth, and thirty-seventh capacitors are connected in parallel between the power input pin of the XGPON optical drive chip and ground.

[0014] In one possible implementation of the first aspect, the second DC-DC conversion unit includes: a second DC-DC conversion chip, a 38th capacitor, a 39th capacitor, a 40th capacitor, a 41st capacitor, a 42nd capacitor, a 43rd capacitor, a 44th capacitor, a 45th capacitor, a 46th capacitor, a 47th capacitor, a 48th capacitor, a 25th resistor, a 26th resistor, a 27th resistor, a 28th resistor, a 29th resistor, a 30th resistor, and a fourth inductor. The power input pin of the second DC-DC converter chip is connected to the power output terminal of the power receiving conversion module; the enable pin of the second DC-DC converter chip is connected to the first terminal of the forty-first capacitor; the ground pin of the second DC-DC converter chip is grounded; the bootstrap pin of the second DC-DC converter chip is connected to the first terminal of the twenty-seventh resistor; the switching node output pin of the second DC-DC converter chip is connected to the first terminal of the fourth inductor; and the feedback pin of the second DC-DC converter chip is connected to the first terminal of the twenty-eighth resistor. The 38th, 39th and 40th capacitors are connected in parallel between the power supply output terminal of the power conversion module and ground. The first terminal of the 25th resistor is connected to the first terminal of the 40th capacitor. The series connection of the 25th and 26th resistors is connected to the first terminal of the 41st capacitor. The second terminal of the 26th resistor and the second terminal of the 41st capacitor are grounded. The second end of the twenty-seventh resistor is connected to the first end of the forty-second capacitor, the second end of the forty-second capacitor is connected to the first end of the fourth inductor, and the second end of the fourth inductor is connected to the power input pin of the GPON optical drive chip. The second end of the 28th resistor is connected to the first end of the 30th resistor, the second end of the 30th resistor is connected to the second end of the fourth inductor, the 43rd capacitor is connected in parallel with the 30th resistor, the first end of the 29th resistor is connected to the series node of the 28th and 30th resistors, and the second end of the 29th resistor is grounded. The forty-fourth, forty-fifth, forty-sixth, forty-seventh, and forty-eighth capacitors are connected in parallel between the power supply input pin of the GPON optical drive chip and ground.

[0015] Secondly, embodiments of this application provide a POF-based combined PON module control method, implemented based on the POF-based combined PON module control circuit of the first aspect, the method comprising: Based on the POF power supply module, AC voltage is connected to the power supply module, converts the AC voltage to DC voltage, and provides DC voltage to the power conversion module; The power conversion module receives the DC voltage provided by the POF power supply module and converts the DC voltage. Based on the DC-DC conversion module, the DC voltage converted by the power receiving conversion module is converted into DC voltage and then used to power the combined PON module. Based on the control module, the currently running optical drive chip in the combined PON module is read and switched to the corresponding PON mode.

[0016] Thirdly, embodiments of this application provide an electronic device including the POF-based combined PON module control circuit described in the first aspect.

[0017] In this application, the POF power supply module is connected to AC voltage and converts AC voltage to DC voltage; the power receiving conversion module receives the DC voltage provided by the POF power supply module and converts the DC voltage; the DC-DC conversion module performs DC-DC conversion on the DC voltage converted by the power receiving conversion module and supplies power to the combined PON module; the control module reads the currently running optical drive chip in the combined PON module and switches to the corresponding PON mode.

[0018] This application solution does not require adding a switch chip and logic control pins. Instead, it improves the hardware circuit by using POF to power the currently running optical drive chip in the combined PIN module and using the control module to switch the PON mode (COMBO gateway mode). This simplifies the logic of switching the COMBO gateway mode and has strong ease of use and practicality.

[0019] Other features and advantages of the embodiments of this application will be described in detail in the following detailed description section. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic block diagram of the POF-based combined PON module control circuit provided in the embodiments of this application; Figure 2 This is a schematic block diagram of the POF-based combined PON module control circuit provided in the embodiments of this application; Figure 3 This is a schematic circuit diagram of the first POF power supply unit and the second POF power supply unit provided in the embodiments of this application; Figure 4 This is a schematic circuit diagram of the first power receiving conversion unit provided in an embodiment of this application; Figure 5 This is a schematic circuit diagram of the second power receiving conversion unit provided in an embodiment of this application; Figure 6 This is a schematic circuit diagram of the first DC-DC conversion unit provided in the embodiments of this application; Figure 7 This is a schematic circuit diagram of the second DC-DC conversion unit provided in the embodiments of this application; Figure 8 This is a schematic diagram of the steps of the POF-based combined PON module control method provided in the embodiments of this application; Figure 9 This is a schematic diagram of the overall flow of the POF-based combined PON module control method provided in the embodiments of this application; Figure 10 This is a schematic block diagram of the electronic device provided in the embodiments of this application.

[0022] Explanation of reference numerals in the attached figures: 100 - POF-based combined PON module control circuit, 200 - Combined PON module, 110 - POF power supply module, 120 - Power receiving and conversion module, 130 - DC-DC conversion module, 140 - Control module, 112 - First POF power supply unit, 114 - Second POF power supply unit, P1 - First POF interface, U1 - First rectifier chip, C1 - First capacitor, P2 - Second POF interface, U2 - Second rectifier chip, C2 - Second capacitor, 122 - First power receiving and conversion unit, 124 - Second power receiving and conversion unit, U3 - First POF power receiving chip, C3 - Third capacitor, C4 - Fourth capacitor, C5 - Fifth capacitor, C6 - Sixth capacitor, C7 - Seventh capacitor, C 8 - Eighth capacitor, C9 - Ninth capacitor, C10 - Tenth capacitor, C11 - Eleventh capacitor, C12 - Twelfth capacitor, C13 - Thirteenth capacitor, C14 - Fourteenth capacitor, R1 - First resistor, R2 - Second resistor, R3 - Third resistor, R4 - Fourth resistor, R5 - Fifth resistor, R6 - Sixth resistor, R7 - Seventh resistor, R8 - Eighth resistor, R9 - Ninth resistor, D1 - First diode, D2 - Second diode, L1 - First inductor, U2 - Second POF receiving chip, C15 - Fifteenth capacitor, C16 - Sixteenth capacitor, C17 - Seventeenth capacitor, C18 - Eighteenth capacitor, C19 - Nineteenth capacitor, C20 - Twentieth capacitor, C21 - Twenty-first capacitor, C22 - Capacitor C22, C23 - Capacitor C24, C25 - Capacitor C25, C26 - Capacitor C26, R10 - Resistor R11 - Resistor R12 - Resistor R13 - Resistor R14 - Resistor R15 - Resistor R16 - Resistor R17 - Resistor R17 - Resistor R18 - Resistor D3 - Diode D4 - Diode D4 - Diode L2 - Inductor L2, 132 - First DC-DC Converter Unit, 134 - Second DC-DC Converter Unit, U5 - First DC-DC Converter Chip, C27 - Capacitor C28 - Capacitor C29 - Capacitor C 30 - Capacitor 30, C31 - Capacitor 31, C32 - Capacitor 32, C33 - Capacitor 33, C34 - Capacitor 34, C35 - Capacitor 35, C36 - Capacitor 36, C37 - Capacitor 37, R19 - Resistor 19, R20 - Resistor 20, R21 - Resistor 21, R22 - Resistor 22, R23 - Resistor 23, R24 - Resistor 24, L3 - Third Inductor, U6 - Second DC-DC Converter Chip, C38 - Capacitor 38, C39 - Capacitor 39, C40 - Capacitor 40, C41 - Capacitor 41, C42 - Capacitor 42, C43 - Capacitor 43, C44 - Capacitor 44C45 - Forty-fifth capacitor, C46 - Forty-sixth capacitor, C47 - Forty-seventh capacitor, C48 - Forty-eighth capacitor, R25 - Twenty-fifth resistor, R26 - Twenty-sixth resistor, R27 - Twenty-seventh resistor, R28 - Twenty-eighth resistor, R29 - Twenty-ninth resistor, R30 - Thirtieth resistor, L4 - Fourth inductor, FB1 - First ferrite bead, FB2 - Second ferrite bead, FB3 - Third ferrite bead, FB4 - Fourth ferrite bead, FB5 - Fifth ferrite bead, FB6 - Sixth ferrite bead, 300 - Electronic equipment. Detailed Implementation

[0023] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0024] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0025] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0027] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."

[0028] Furthermore, in the description of this application, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in some other embodiments," "in other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0030] In this application specification, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to the orientation or positional relationship based on the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use.

[0031] In this application specification, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] COMBO (XGPON + GPON) gateways are gaining popularity among operators due to their versatility in compatibility with different OLT modes, while POF integrates the gateway's uplink optical and power supply into a single cable, and its simplified cabling is gradually being accepted by users.

[0033] One of the technical challenges of COMBO gateways is identifying the current signal mode of the OLT and switching its own PON (Passive Optical Network) mode accordingly. Currently, existing technologies mainly rely on the main control chip to identify different optical signals, which requires the addition of switching chips and logic control pins, placing high demands on chip capabilities and resulting in complex software processing logic.

[0034] Therefore, how to simplify the logic of COMBO gateway mode switching remains an unsolved problem.

[0035] To address the aforementioned deficiencies, this application provides a control circuit and method for a combined PON module based on POF. The POF power supply module is connected to an AC voltage supply and converts the AC voltage into a DC voltage. The power receiving conversion module receives the DC voltage provided by the POF power supply module and converts the DC voltage. The DC-DC conversion module performs DC-DC conversion on the DC voltage converted by the power receiving conversion module and supplies power to the combined PON module. The control module reads the currently running optical drive chip in the combined PON module and switches to the corresponding PON mode.

[0036] This application solution does not require adding a switching chip and logic control pins. Instead, it improves the hardware circuit by using POF to power the currently running optical drive chip in the combined PIN module and using the control module to switch the PON mode (COMBO gateway mode). This simplifies the logic of switching the COMBO gateway mode and has strong ease of use and practicality.

[0037] The overall structure of the POF-based combined PON module control circuit provided in this application is described below through specific embodiments.

[0038] Please see Figure 1 , Figure 1 This is a schematic block diagram of a POF-based combined PON module control circuit 100 provided in an embodiment of this application. Figure 1 As shown, the circuit 100 includes: a POF power supply module 110, a power conversion module 120, a DC-DC conversion module 130, and a control module 140.

[0039] According to one embodiment of this application, the power output terminal of the POF power supply module 110 is connected to the power input terminal of the power receiving conversion module 120, the power output terminal of the power receiving conversion module 120 is connected to the power input terminal of the DC-DC conversion module 130, and the power output terminal of the DC-DC conversion module 130 is connected to the power input terminal of the combined PON module 200.

[0040] According to one embodiment of this application, the serial deserialization pin serde of the combined PON module 200 is connected to the serial deserialization pin serdes of the control module 140, the signal loss pin LOS of the combined PON module 200 is connected to the receive data pin RX_SD of the control module 140, the I2C (IIC, Integrated Circuit Bus) pin of the combined PON module 200 is connected to the I2C pin of the control module 140, and the burst enable signal input pin BEN of the combined PON module 200 is connected to the burst enable signal input pin BEN of the control module 140.

[0041] According to one embodiment of this application, the POF power supply module 110 is connected to an AC voltage power supply, converts the AC voltage to a DC voltage, and provides the DC voltage to the power conversion module 120. The power conversion module 120 receives the DC voltage provided by the POF power supply module 110 and converts the DC voltage.

[0042] According to one embodiment of this application, the DC-DC conversion module 130 performs DC-DC conversion on the DC voltage converted by the power receiving conversion module 120 and supplies power to the combined PON module 200. The control module 140 reads the currently running optical drive chip in the combined PON module 200 and switches to the corresponding PON mode (XGPON mode or GPON mode).

[0043] The POF-based combined PON module control circuit 100 provided in this embodiment does not require the addition of a switching chip and logic control pins. Instead, it improves the hardware circuit by using POF to power the currently running optical drive chip in the combined PIN module and using the control module 140 to switch the PON mode (COMBO gateway mode). This simplifies the logic of switching the COMBO gateway mode and has strong ease of use and practicality.

[0044] The specific structure of the POF-based combined PON module control circuit 100 provided in this application is described below through specific embodiments.

[0045] Please see Figure 2 , Figure 2 This is a schematic block diagram of a POF-based combined PON module control circuit 100 provided in an embodiment of this application. Figure 2 As shown, the POF power supply module 110 includes: a first POF power supply unit 112 and a second POF power supply unit 114.

[0046] According to one embodiment of this application, the power output terminal of the first POF power supply unit 112 is connected to the power input terminal of the power conversion module 120. The first POF power supply unit 112 is connected to an AC voltage power supply, converts the AC voltage to a DC voltage, and provides the DC voltage to the power conversion module 120.

[0047] According to one embodiment of this application, the power output terminal of the second POF power supply unit 114 is connected to the power input terminal of the power conversion module 120. The first POF power supply unit 112 is connected to an AC voltage power supply, converts the AC voltage to a DC voltage, and provides the DC voltage to the power conversion module 120.

[0048] Please see Figure 3 , Figure 3This is a schematic circuit diagram of the first POF power supply unit 112 and the second POF power supply unit 114 provided in the embodiments of this application. Figure 3 As shown, the POF power supply module 110 includes: a first POF power supply unit 112 and a second POF power supply unit 114. The first POF power supply unit 112 includes: a first POF interface P1, a first rectifier chip U1 (rectifier bridge) and a first capacitor C1.

[0049] According to one embodiment of this application, the positive power supply pin V+ of the first POF interface P1 is connected to the positive AC input terminal of the first rectifier chip U1, the negative power supply pin V- of the first POF interface P1 is connected to the negative AC input terminal of the first rectifier chip U1, and the two grounding pins GND of the first POF interface P1 are grounded. The first POF interface P1 is connected to an AC voltage power supply.

[0050] Combination Figure 2 and Figure 3 According to one embodiment of this application, the positive DC output terminal of the first rectifier chip U1 and the first terminal of the first capacitor C1 are connected to the positive power supply input terminal VPOS1 of the power conversion module 120, and the negative DC output terminal of the first rectifier chip U1 and the second terminal of the first capacitor C1 are connected to the negative power supply input terminal VNEG1 of the power conversion module 120. The first rectifier chip U1 converts AC voltage into DC voltage, and the first capacitor C1 filters the DC voltage.

[0051] In one embodiment, power is supplied via a POF connection, providing a 48V DC voltage. Proper isolation from other circuits is required.

[0052] Please continue reading Figure 3 The second POF power supply unit 114 includes: a second POF interface P2, a second rectifier chip U2 (rectifier bridge) and a second capacitor C2.

[0053] According to one embodiment of this application, the positive power supply pin V+ of the second POF interface P2 is connected to the positive AC input terminal of the second rectifier chip U2, the negative power supply pin V- of the second POF interface P2 is connected to the negative AC input terminal of the second rectifier chip U2, and the two grounding pins GND of the second POF interface P2 are grounded. The second POF interface P2 is connected to an AC voltage power supply.

[0054] Combination Figure 2 and Figure 3According to one embodiment of this application, the positive DC output terminal of the second rectifier chip U2 and the first terminal of the second capacitor C2 are connected to the positive power supply input terminal VPOS2 of the power conversion module 120, and the negative DC output terminal of the second rectifier chip U2 and the second terminal of the second capacitor C2 are connected to the negative power supply input terminal VNEG2 of the power conversion module 120. The second rectifier chip U2 converts AC voltage into DC voltage, and the second capacitor C2 filters the DC voltage.

[0055] Please continue reading Figure 2 The power conversion module 120 includes: a first power conversion unit 122 and a second power conversion unit 124.

[0056] According to one embodiment of this application, the power input terminal of the first power receiving conversion unit 122 is connected to the power output terminal of the POF power supply module 110, and the power output terminal of the first power receiving conversion unit 122 is connected to the power input terminal of the DC-DC conversion module 130. The first power receiving conversion unit 122 receives the DC voltage provided by the POF power supply module 110 and converts the DC voltage.

[0057] According to one embodiment of this application, the power input terminal of the second power conversion unit 124 is connected to the power output terminal of the POF power supply module 110, and the power output terminal of the second power conversion unit 124 is connected to the power input terminal of the DC-DC conversion module 130. The second power conversion unit 124 receives the DC voltage provided by the POF power supply module 110 and converts the DC voltage.

[0058] Please see Figure 4 , Figure 4 This is a schematic circuit diagram of the first power receiving and conversion unit 122 provided in an embodiment of this application. Figure 4 As shown, the first power receiving conversion unit 122 includes: a first POF power receiving chip U3, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, a first diode D1, a second diode D2, and a first inductor L1.

[0059] In one embodiment, the POF power receiving chip can be of model Si3404-A-GM.

[0060] According to one embodiment of this application, the ISNS (current detection input pin) and HSO (hot-swap switch output) pins of the first POF power receiving chip U3 are connected to the second end of the first resistor R1, and the FBH (DC-DC feedback on the high voltage side (relative to VPOS)) pin of the first POF power receiving chip U3 is connected to the series node of the second resistor R2 and the third resistor R3.

[0061] According to one embodiment of this application, the EROUT (error amplifier current output) pin of the first POF power receiving chip U3 is connected to the first terminal of the third capacitor C3 and the fourth capacitor C4, the FBL (low-voltage side (relative to VSS) DC-DC feedback) pin of the first POF power receiving chip U3 is connected to the power ground VSS, and the VDD (internal 5V regulator output) pin of the first POF power receiving chip U3 is connected to the first terminal of the fifth capacitor C5.

[0062] Combination Figure 2 and Figure 4 According to one embodiment of this application, the RDET (detection resistor input) pin of the first POF power receiving chip U3 is connected to the first terminal of the fifth resistor R5. The NC (no connection) pin, VNEG (rectified high voltage power ground) pin, and EPAD (exposed pad on the bottom of the chip) pin of the first POF power receiving chip U3 are connected to the negative power supply output terminal VNEG2 of the POF power supply module 110. The RCL (graded resistor input) pin of the first POF power receiving chip U3 is connected to the first terminal of the sixth resistor R6, and the RFREQ (switching frequency adjustment) pin of the first POF power receiving chip U3 is connected to the first terminal of the seventh resistor R7.

[0063] Combination Figure 3 and Figure 4 In one embodiment, the NC pin, VNEG pin, and EPAD pin of the first POF power receiving chip U3 are connected to the second terminal of the second ferrite bead FB2, and the first terminal of the first ferrite bead FB1 is connected to the DC negative output terminal of the second rectifier chip U2.

[0064] Combination Figure 2 and Figure 4 According to one embodiment of this application, the VPOS (positive terminal of rectified high voltage power supply) pin of the first POF power receiving chip U3 is connected to the positive power supply output terminal VPOS2 of the POF power supply module 110, the SWO (internal switch output) pin of the first POF power receiving chip U3 is connected to the first terminal of the first inductor L1 and the anode of the first diode D1, and the VSS (DC-DC converter primary side ground) pin of the first POF power receiving chip U3 is connected to the power ground VSS.

[0065] Combination Figure 3 and Figure 4In one embodiment, the VPOS pin of the first POF power receiving chip U3 is connected to the DC positive output terminal of the second rectifier chip U2.

[0066] In one embodiment, such as Figure 4 As shown, the first POF power receiving chip U3 also has a VT15V (DC-DC transformer auxiliary winding input) pin, which is not connected.

[0067] Combination Figure 2 and Figure 4 According to one embodiment of this application, the first end of the first resistor R1, the second end of the sixth capacitor C6 and the second end of the seventh capacitor C7 are connected to the power ground VSS, and the first end of the sixth capacitor C6 and the first end of the seventh capacitor C7 are connected to the positive power output terminal VPOS2 of the POF power supply module 110 and the power input terminal 12V_G of the DC-DC conversion module 130.

[0068] Combination Figure 3 and Figure 4 In one embodiment, the first end of the sixth capacitor C6 and the first end of the seventh capacitor C7 are connected to the second end of the first magnetic bead FB1, and the first end of the first magnetic bead FB1 is connected to the positive DC output terminal of the second rectifier chip U2.

[0069] Combination Figure 2 and Figure 4 According to one embodiment of this application, the first end of the second resistor R2 is connected to the power supply input terminal 12V_G of the DC-DC conversion module 130, and the second resistor R2, the third resistor R3 and the fourth resistor R4 are connected in series between the power supply input terminal 12V_G of the DC-DC conversion module 130 and ground.

[0070] Combination Figure 2 and Figure 4 According to one embodiment of this application, the first end of the eighth capacitor C8 is connected to the first end of the third resistor R3, the second end of the eighth capacitor C8 is grounded, and the ninth capacitor C9 and the tenth capacitor C10 are connected in parallel between the power supply input terminal 12V_G of the DC-DC conversion module 130 and ground.

[0071] According to one embodiment of this application, the first end of the eighth resistor R8 is connected to the second end of the third capacitor C3, and the second end of the eighth resistor R8, the second end of the fourth capacitor C4, and the second end of the fifth capacitor C5 are connected to the power ground VSS.

[0072] Combination Figure 2 and Figure 4According to one embodiment of this application, the second end of the fifth resistor R5 and the second end of the seventh resistor R7 are connected to the positive power supply output terminal VPOS2 of the POF power supply module 110, and the second end of the sixth resistor R6 is connected to the negative power supply output terminal VNEG2 of the POF power supply module 110.

[0073] Combination Figure 3 and Figure 4 In one embodiment, the second end of the fifth resistor R5 and the second end of the seventh resistor R7 are connected to the second end of the first magnetic bead FB1, and the first end of the first magnetic bead FB1 is connected to the DC positive output terminal of the second rectifier chip U2.

[0074] According to one embodiment of this application, the cathode of the first diode D1 is connected to the first terminal of the seventh capacitor C7, and the first terminals of the eleventh capacitor C11, the twelfth capacitor C12, and the thirteenth capacitor C13 are connected to the cathode of the first diode D1. The second terminals of the eleventh capacitor C11, the twelfth capacitor C12, and the thirteenth capacitor C13 are connected to the second terminal of the first inductor L1, and the second terminal of the thirteenth capacitor C13 is grounded.

[0075] Combination Figure 2 and Figure 4 According to one embodiment of this application, the anode of the second diode D2 and the second terminal of the fourteenth capacitor C14 are connected to the negative power supply output terminal VNEG2 of the POF power supply module 110, the cathode of the second diode D2 and the first terminal of the ninth resistor R9 are connected to the positive power supply output terminal VPOS2 of the POF power supply module 110, and the second terminal of the ninth resistor R9 is connected to the first terminal of the fourteenth capacitor C14.

[0076] In one embodiment, the cathode of the second diode D2 and the first end of the first ferrite bead FB1 are connected to the positive power supply output terminal VPOS2 of the POF power supply module 110, and the first end of the first ferrite bead FB1 is connected to the first end of the ninth resistor R9.

[0077] Combination Figure 3 and Figure 4 In one embodiment, the first POF power receiving chip U3 receives the DC voltage provided by the second POF power supply unit 114 and converts the DC voltage. The third capacitor C3 is a high-frequency filtering / decoupling capacitor, the fourth capacitor C4 is an auxiliary function / reserved capacitor, and the fifth capacitor C5 is a chip power supply decoupling capacitor. The sixth capacitor C6 is an input high-voltage filtering capacitor, and the seventh capacitor C7 is an input high-voltage filtering capacitor.

[0078] like Figure 4As shown, in one embodiment, the eighth capacitor C8 is a loop compensation capacitor, the ninth capacitor C9 is a supplementary filter / compensation capacitor, and the tenth capacitor C10 is a supplementary filter / compensation capacitor. The eleventh capacitor C11 is an output filter capacitor / electrolytic capacitor, used to smooth the 12V output voltage after buck conversion and reduce low-frequency ripple. The twelfth capacitor C12 and the thirteenth capacitor C13 are output filter capacitors. The fourteenth capacitor C14 is a decoupling capacitor, used to stabilize the power supply of the first POF power receiving chip U3.

[0079] like Figure 4 As shown, in one embodiment, the first resistor R1 is a current sensing resistor, the second resistor R2, the third resistor R3, and the fourth resistor R4 are voltage divider resistors, and the fifth resistor R5 is a sensing resistor. The sixth resistor R6 is a stepping resistor used to set the power level. The seventh resistor R7 is a frequency setting resistor for the adjustable oscillator, used to set the switching frequency of the internal DC-DC converter. The eighth resistor R8 is a switching frequency setting resistor, used to set the switching frequency. The ninth resistor R9 is a stepping resistor used to set the power level.

[0080] like Figure 4 As shown, in one embodiment, the first diode D1 is a freewheeling diode, providing a current freewheeling path for the first inductor L1 when the switch is turned off. The second diode D2 is a rectifier or protection diode, and the first inductor L1 is an energy storage inductor. The first ferrite bead FB1 and the second ferrite bead FB2 are used to suppress high-frequency noise and EMI (Electromagnetic Interference) on the power supply path, ensuring signal integrity.

[0081] Please see Figure 5 , Figure 5 This is a schematic circuit diagram of the second power receiving conversion unit 124 provided in an embodiment of this application. Figure 5 As shown, the second power receiving conversion unit 124 includes: a second POF power receiving chip U4, a fifteenth capacitor C15, a sixteenth capacitor C16, a seventeenth capacitor C17, an eighteenth capacitor C18, a nineteenth capacitor C19, a twentieth capacitor C20, a twenty-first capacitor C21, a twenty-second capacitor C22, a twenty-third capacitor C23, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26, a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a fifteenth resistor R15, a sixteenth resistor R16, a seventeenth resistor R17, an eighteenth resistor R18, a third diode D3, a fourth diode D4, and a second inductor L2.

[0082] According to one embodiment of this application, the ISNS and HSO pins of the second POF power receiving chip U4 are connected to the second terminal of the tenth resistor R10, and the FBH pin of the second POF power receiving chip U4 is connected to the series node of the eleventh resistor R11 and the twelfth resistor R12. The EROUT pin of the second POF power receiving chip U4 is connected to the first terminal of the fifteenth capacitor C15 and the sixteenth capacitor C16, the FBL pin of the second POF power receiving chip U4 is connected to the power ground VSS, and the VDD pin of the second POF power receiving chip U4 is connected to the first terminal of the seventeenth capacitor C17.

[0083] Combination Figure 2 and Figure 5 According to one embodiment of this application, the RDET pin of the second POF power receiving chip U4 is connected to the first terminal of the fourteenth resistor R14, and the NC pin, VNEG pin, and EPAD pin of the second POF power receiving chip U4 are connected to the negative power supply output terminal VNEG1 of the POF power supply module 110. The RCL pin of the second POF power receiving chip U4 is connected to the first terminal of the fifteenth resistor R15, and the RFREQ pin of the second POF power receiving chip U4 is connected to the first terminal of the sixteenth resistor R16.

[0084] Combination Figure 3 and Figure 5 In one embodiment, the NC pin, VNEG pin, and EPAD pin of the second POF power receiving chip U4 are connected to the second end of the fourth magnetic bead FB4, and the first end of the fourth magnetic bead FB4 is connected to the DC negative output terminal of the first rectifier chip U1.

[0085] According to one embodiment of this application, the VPOS pin of the second POF power receiving chip U4 is connected to the positive power supply output terminal of the POF power supply module 110, the SWO pin of the second POF power receiving chip U4 is connected to the first terminal of the second inductor L2 and the anode of the third diode D3, and the VSS pin of the second POF power receiving chip U4 is connected to the power ground VSS.

[0086] Combination Figure 3 and Figure 5 In one embodiment, the VPOS pin of the second POF power receiving chip U4 is connected to the DC positive output terminal of the first rectifier chip U1.

[0087] In one embodiment, such as Figure 5 As shown, the second POF power receiving chip U4 also has a VT15V pin, which is not connected.

[0088] Combination Figure 2 and Figure 5According to one embodiment of this application, the first end of the tenth resistor R10, the second end of the eighteenth capacitor C18, and the second end of the nineteenth capacitor C19 are connected to the power ground VSS, and the first end of the eighteenth capacitor C18 and the first end of the nineteenth capacitor C19 are connected to the positive power output terminal VPOS1 of the POF power supply module 110 and the power input terminal 12V_XG of the DC-DC conversion module 130.

[0089] Combination Figure 3 and Figure 5 In one embodiment, the first end of the eighteenth capacitor C18 and the first end of the nineteenth capacitor C19 are connected to the second end of the third magnetic bead FB3, and the first end of the third magnetic bead FB3 is connected to the DC positive output terminal of the first rectifier chip U1.

[0090] Combination Figure 2 and Figure 5 According to one embodiment of this application, the first end of the eleventh resistor R11 is connected to the power supply input terminal 12V_XG of the DC-DC converter module 130, and the eleventh resistor R11, the twelfth resistor R12 and the thirteenth resistor R13 are connected in series between the power supply input terminal 12V_XG of the DC-DC converter module 130 and ground.

[0091] Combination Figure 2 and Figure 5 According to one embodiment of this application, the first end of the twentieth capacitor C20 is connected to the first end of the twelfth resistor R12, the second end of the twentieth capacitor C20 is grounded, and the twenty-first capacitor C21 and the twenty-second capacitor C22 are connected in parallel between the power supply input terminal 12V_XG of the DC-DC conversion module 130 and ground.

[0092] According to one embodiment of this application, the first end of the seventeenth resistor R17 is connected to the second end of the fifteenth capacitor C15, and the second ends of the seventeenth resistor R17, the sixteenth capacitor C16, and the seventeenth capacitor C17 are connected to the power ground VSS.

[0093] Combination Figure 2 and Figure 5 According to one embodiment of this application, the second end of the fourteenth resistor R14 and the second end of the sixteenth resistor R16 are connected to the positive power supply output terminal VPOS1 of the POF power supply module 110, and the second end of the fifteenth resistor R15 is connected to the negative power supply output terminal VNEG1 of the POF power supply module 110.

[0094] Combination Figure 3 and Figure 5In one embodiment, the second end of the fourteenth resistor R14 and the second end of the sixteenth resistor R16 are connected to the second end of the third ferrite bead FB3, and the first end of the third ferrite bead FB3 is connected to the DC positive output terminal of the first rectifier chip U1.

[0095] According to one embodiment of this application, the cathode of the third diode D3 is connected to the first terminal of the nineteenth capacitor C19, and the first terminals of the twenty-third capacitor C23, the twenty-fourth capacitor C24, and the twenty-fifth capacitor C25 are connected to the cathode of the third diode D3. The second terminals of the twenty-third capacitor C23, the twenty-fourth capacitor C24, and the twenty-fifth capacitor C25 are connected to the second terminal of the second inductor L2, and the second terminal of the twenty-fifth capacitor C25 is grounded.

[0096] Combination Figure 2 and Figure 5 According to one embodiment of this application, the anode of the fourth diode D4 and the second terminal of the twenty-sixth capacitor C26 are connected to the negative power supply output terminal VNEG1 of the POF power supply module 110, the cathode of the fourth diode D4 and the first terminal of the eighteenth resistor R18 are connected to the positive power supply output terminal VPOS1 of the POF power supply module 110, and the second terminal of the eighteenth resistor R18 is connected to the first terminal of the twenty-sixth capacitor C26.

[0097] In one embodiment, the cathode of the fourth diode D4 and the first end of the third ferrite bead FB3 are connected to the positive power supply output terminal VPOS1 of the POF power supply module 110, and the first end of the third ferrite bead FB3 is connected to the first end of the eighteenth resistor R18.

[0098] Combination Figure 3 and Figure 5 In one embodiment, the second POF power receiving chip U4 receives the DC voltage provided by the first POF power supply unit 112 and converts the DC voltage.

[0099] It should be noted that, Figure 5 and Figure 4 The functions of each component are the same, so they will not be described in detail here.

[0100] In one embodiment, two POF power receiving chips are used to convert the power supply into two 12V DC power supplies.

[0101] Please continue reading Figure 2 The combined PON module 200 includes a GPON optical drive chip 210 and an XGPON optical drive chip 220, and the control module 140 is a SOC (System on Chip).

[0102] In one embodiment, the GPON optical drive chip 210 is model UX3320, which is a GPON optical module intelligent transceiver chip that integrates LA and LDD: the chip integrates a limiting amplifier (LA) and a burst-mode laser driver (LDD), which are responsible for processing the received weak light signal and driving the laser to emit light signal, respectively.

[0103] In one embodiment, the XGPON optical drive chip 220 is model UX3361, which is considered an upgraded version of UX3320. It integrates higher-speed LA (10Gbps) and LDD (2.5Gbps), and is similar in function to UX3320, but with stronger performance, and is used in higher-speed 10 Gigabit optical networks.

[0104] In one embodiment, the serial deserialization pins serde of GPON optical drive chip 210 and XGPON optical drive chip 220 are combined with the serial deserialization pin serdes of control module 140 into a single line, with a differential impedance of 50Ω. The signal loss pin LOS of GPON optical drive chip 210 and XGPON optical drive chip 220 is connected to the receive data pin RX_SD of control module 140, and the I2C pins of GPON optical drive chip 210 and XGPON optical drive chip 220 are connected to the I2C pins of control module 140. The burst enable signal input pin BEN of GPON optical drive chip 210 and XGPON optical drive chip 220 is connected to the burst enable signal input pin BEN of control module 140, i.e., BEN is shared; when BEN is enabled, the optical drive chip emits an optical signal.

[0105] In one embodiment, the POF (Power Pointer) selects whether to connect to the GPON optical drive chip 210 or the XGPON optical drive chip 220 to power on the corresponding PON functional module. XGPON and GPON optical drives are powered only through the POF; when no POF is connected, the PON functional module is not powered. The SOC (System-on-a-Chip) uses I2C to determine which optical drive is currently running and switches to the corresponding XGPON or GPON mode.

[0106] It should be noted that the SerDes signal traces should prioritize the XGPON optical drive chip 220 because XGPON's receiving rate is 10G. Therefore, the layout should minimize the distance between the UX3361 and the SOC, and the SerDes traces of the XGPON optical drive chip 220 should be as short as possible.

[0107] Please continue reading Figure 2 The DC-DC conversion module 130 includes a first DC-DC conversion unit 132 and a second DC-DC conversion unit 134.

[0108] According to one embodiment of this application, the power input terminal of the first DC-DC conversion unit 132 is connected to the power output terminal of the power receiving conversion module 120, and the power output terminal of the first DC-DC conversion unit 132 is connected to the power input pin VIN (input power and optical signal) of the XGPON optical drive chip 220. The first DC-DC conversion unit 132 performs DC-DC conversion on the DC voltage converted by the power receiving conversion module 120 and supplies power to the XGPON optical drive chip 220.

[0109] According to one embodiment of this application, the power input terminal of the second DC-DC conversion unit 134 is connected to the power output terminal of the power receiving conversion module 120, and the power output terminal of the second DC-DC conversion unit 134 is connected to the power input pin VIN (input power and optical signal) of the GPON optical drive chip 210. The second DC-DC conversion unit 134 performs DC-DC conversion on the DC voltage converted by the power receiving conversion module 120 and supplies power to the GPON optical drive chip 210.

[0110] Please see Figure 6 , Figure 6 This is a schematic circuit diagram of the first DC-DC conversion unit 132 provided in an embodiment of this application. Figure 6 As shown, the first DC-DC conversion unit 132 includes: a first DC-DC conversion chip U5, a twenty-seventh capacitor C27, a twenty-eighth capacitor C28, a twenty-ninth capacitor C29, a thirtieth capacitor C30, a thirty-first capacitor C31, a thirty-second capacitor C32, a thirty-third capacitor C33, a thirty-fourth capacitor C34, a thirty-fifth capacitor C35, a thirty-sixth capacitor C36, a thirty-seventh capacitor C37, a nineteenth resistor R19, a twentieth resistor R20, a twenty-first resistor R21, a twenty-second resistor R22, a twenty-third resistor R23, a twenty-fourth resistor R24, and a third inductor L3.

[0111] Combination Figure 2 , Figure 5 and Figure 6 In one embodiment, the first DC-DC converter chip U5 may be model JW5393, which is a synchronous buck DC-DC power conversion chip. The first DC-DC converter chip U5 is used to convert the DC voltage converted by the second POF power receiving chip U4 into DC power and to supply power to the XGPON optical drive chip 220.

[0112] Combination Figure 2 and Figure 6According to one embodiment of this application, the power input pin VIN of the first DC-DC converter chip U5 is connected to the power output terminal 12V_XG of the power conversion module 120, and the enable pin EN of the first DC-DC converter chip U5 is connected to the first terminal of the thirtieth capacitor C30. The ground pin GND of the first DC-DC converter chip U5 is grounded, and the bootstrap pin BST of the first DC-DC converter chip U5 is connected to the first terminal of the twenty-first resistor R21. The switching node output pin SW of the first DC-DC converter chip U5 is connected to the first terminal of the third inductor L3, and the feedback pin FB of the first DC-DC converter chip U5 is connected to the first terminal of the twenty-second resistor R22.

[0113] Combination Figure 5 and Figure 6 In one embodiment, the power input pin VIN of the first DC-DC converter chip U5 is connected to the first end of the 22nd capacitor C22.

[0114] Combination Figure 2 and Figure 6 According to one embodiment of this application, the twenty-seventh capacitor C27, the twenty-eighth capacitor C28, and the twenty-ninth capacitor C29 are connected in parallel between the power supply output terminal 12V_XG of the power conversion module 120 and ground. The first terminal of the nineteenth resistor R19 is connected to the first terminal of the twenty-ninth capacitor C29, and the series connection of the nineteenth resistor R19 and the twentieth resistor R20 is connected to the first terminal of the thirtieth capacitor C30. The second terminals of the twentieth resistor R20 and the thirtieth capacitor C30 are grounded.

[0115] Combination Figure 5 and Figure 6 In one embodiment, the first end of the twenty-seventh capacitor C27 is connected to the second end of the fifth ferrite bead FB5, and the first end of the fifth ferrite bead FB5 is connected to the first end of the twenty-second capacitor C22.

[0116] Combination Figure 2 and Figure 6 According to one embodiment of this application, the second end of the twenty-first resistor R21 is connected to the first end of the thirty-first capacitor C31, the second end of the thirty-first capacitor C31 is connected to the first end of the third inductor L3, and the second end of the third inductor L3 is connected to the power supply input pin COMBO_VCC_XG(VIN) of the XGPON optical drive chip 220.

[0117] According to one embodiment of this application, the second terminal of the twenty-second resistor R22 is connected to the first terminal of the twenty-fourth resistor R24, the second terminal of the twenty-fourth resistor R24 ​​is connected to the second terminal of the third inductor L3, and the thirty-second capacitor C32 is connected in parallel with the twenty-fourth resistor R24. The first terminal of the twenty-third resistor R23 is connected to the series node of the twenty-second resistor R22 and the twenty-fourth resistor R24, and the second terminal of the twenty-third resistor R23 is grounded.

[0118] Combination Figure 2 and Figure 6 According to one embodiment of this application, the thirty-third capacitor C33, the thirty-fourth capacitor C34, the thirty-fifth capacitor C35, the thirty-sixth capacitor C36, and the thirty-seventh capacitor C37 are connected in parallel between the power supply input pin COMBO_VCC_XG (VIN) of the XGPON optical drive chip 220 and ground.

[0119] like Figure 6 As shown, in one embodiment, the twenty-seventh capacitor C27 is a high-frequency bypass capacitor with a smaller capacitance value, designed for noise suppression at higher frequencies. The twenty-eighth capacitor C28 is also a high-frequency bypass capacitor, further filtering out extremely high-frequency noise (such as those in the hundreds of MHz range) on the input side, working in conjunction with the twenty-seventh capacitor C27 to achieve wideband filtering.

[0120] In one embodiment, the twenty-ninth capacitor C29 is an input decoupling capacitor, placed close to the chip's VIN pin, providing instantaneous current for the chip's switching action and filtering out mid-to-high frequency ripple in the input power supply. The thirtieth capacitor C30 is a delay / soft-start capacitor for the EN pin. The thirty-first capacitor C31 is a bootstrap capacitor, used to provide boosted power to the chip's internal high-side MOSFET drive circuit, ensuring that the high-side switch can be fully turned on and reducing conduction losses.

[0121] In one embodiment, capacitor C32 (the 32nd capacitor) is a high-frequency filter capacitor used to filter out high-frequency noise spikes at the output. Capacitor C33 (the 33rd capacitor) is also a high-frequency filter capacitor, working in conjunction with capacitor C32 (the 32nd capacitor) to suppress high-frequency interference at the output. Capacitor C34 (the 34th capacitor) is an output filter capacitor, also connected in parallel at the output, sharing the filtering and energy storage functions.

[0122] In one embodiment, capacitors C35 (35) and C36 (36) are auxiliary output filter capacitors, further reducing output ripple and improving load transient response. Capacitor C37 (37) is the main output filter capacitor, used to smooth the output voltage and store electrical energy, undertaking the main low-frequency filtering and energy storage tasks.

[0123] In one embodiment, the nineteenth resistor R19 is a voltage divider / current limiting resistor for the VIN pin, and the twentieth resistor R20 is a series voltage divider resistor for the VIN pin. The twenty-first resistor R21 is a current limiting / isolation resistor for the BST pin, and the twenty-second resistor R22 is a feedback voltage divider pull-down resistor (or feedforward compensation resistor).

[0124] In one embodiment, the twenty-third resistor R23 is a feedforward resistor in the feedback network, improving the dynamic response and loop stability of the power supply, and the twenty-fourth resistor R24 ​​is a feedback voltage divider pull-up resistor. The third inductor L3 is a power inductor, an energy storage / filtering inductor, which, together with the output capacitor, forms an LC low-pass filter.

[0125] In one embodiment, the fifth ferrite bead FB5 is a ferrite bead, model L6A6, connected in series on the 12V input path to suppress high-frequency noise and spike interference, prevent noise on the power line from entering the chip, and also prevent chip switching noise from contaminating the input power supply in reverse.

[0126] Please see Figure 7 , Figure 7 This is a schematic circuit diagram of the second DC-DC conversion unit 134 provided in an embodiment of this application. Figure 7 As shown, the second DC-DC conversion unit 134 includes: a second DC-DC conversion chip U6, a 38th capacitor C38, a 39th capacitor C39, a 40th capacitor C40, a 41st capacitor C41, a 42nd capacitor C42, a 43rd capacitor C43, a 44th capacitor C44, a 45th capacitor C45, a 46th capacitor C46, ​​a 47th capacitor C47, a 48th capacitor C48, a 25th resistor R25, a 26th resistor R26, a 27th resistor R27, a 28th resistor R28, a 29th resistor R29, a 30th resistor R30, and a fourth inductor L4.

[0127] Combination Figure 2 , Figure 4 and Figure 7 In one embodiment, the second DC-DC converter chip U6 may be a JW5393, which is a synchronous buck DC-DC power converter chip. The second DC-DC converter chip U6 is used to convert the DC voltage converted by the first POF power receiving chip U3 into DC power and to supply power to the GPON optical drive chip 210.

[0128] Combination Figure 2 and Figure 7According to one embodiment of this application, the power input pin VIN of the second DC-DC converter chip U6 is connected to the power output terminal 12V_G of the power receiving conversion module 120, and the enable pin EN of the second DC-DC converter chip U6 is connected to the first terminal of the forty-first capacitor C41. The ground pin GND of the second DC-DC converter chip U6 is grounded, and the bootstrap pin BST of the second DC-DC converter chip U6 is connected to the first terminal of the twenty-seventh resistor R27. The switching node output pin SW of the second DC-DC converter chip U6 is connected to the first terminal of the fourth inductor L4, and the feedback pin FB of the second DC-DC converter chip U6 is connected to the first terminal of the twenty-eighth resistor R28.

[0129] Combination Figure 4 and Figure 7 The power input pin VIN of the second DC-DC converter chip U6 is connected to the first terminal of the tenth capacitor C10.

[0130] Combination Figure 2 and Figure 7 According to one embodiment of this application, the thirty-eighth capacitor C38, the thirty-ninth capacitor C39, and the fortieth capacitor C40 are connected in parallel between the power supply output terminal 12V_G of the power conversion module 120 and ground. The first terminal of the twenty-fifth resistor R25 is connected to the first terminal of the fortieth capacitor C40, the series connection of the twenty-fifth resistor R25 and the twenty-sixth resistor R26 is connected to the first terminal of the fortieth capacitor C41, and the second terminals of the twenty-sixth resistor R26 and the fortieth capacitor C41 are grounded.

[0131] Combination Figure 4 and Figure 7 The first terminal of the thirty-eighth capacitor C38 is connected to the second terminal of the sixth ferrite bead FB6, and the first terminal of the sixth ferrite bead FB6 is connected to the first terminal of the tenth capacitor C10.

[0132] Combination Figure 2 and Figure 7 According to one embodiment of this application, the second end of the twenty-seventh resistor R27 is connected to the first end of the forty-second capacitor C42, the second end of the forty-second capacitor C42 is connected to the first end of the fourth inductor L4, and the second end of the fourth inductor L4 is connected to the power supply input pin COMBO_VCC_G (VIN) of the GPON optical drive chip 210.

[0133] According to one embodiment of this application, the second terminal of the twenty-eighth resistor R28 is connected to the first terminal of the thirtieth resistor R30, and the second terminal of the thirtieth resistor R30 is connected to the second terminal of the fourth inductor L4. The forty-third capacitor C43 is connected in parallel with the thirtieth resistor R30, the first terminal of the twenty-ninth resistor R29 is connected to the series node of the twenty-eighth resistor R28 and the thirtieth resistor R30, and the second terminal of the twenty-ninth resistor R29 is grounded.

[0134] Combination Figure 2 and Figure 7 According to one embodiment of this application, capacitors C44 (44), C45 (45), C46 (46), C47 (47), and C48 (48) are connected in parallel between the power supply input pin COMBO_VCC_G (VIN) of the GPON optical drive chip 210 and ground.

[0135] It should be noted that, Figure 7 and Figure 6 The functions of each component are the same, so they will not be described in detail here.

[0136] In one embodiment, the two 12V power supplies are converted to 3.3V via DC-DC conversion to power the UX3361 and UX3320 optical drive chips respectively.

[0137] Please see Figure 8 , Figure 8 This is a schematic diagram illustrating the steps of the POF-based combined PON module control method provided in this application embodiment. The POF-based combined PON module control circuit 100 can implement this method, such as... Figure 8 As shown, the method includes the following steps: S801 is based on the AC voltage power supply of the POF power supply module 110, which converts the AC voltage into DC voltage and provides DC voltage to the power conversion module 120.

[0138] S802, the power conversion module 120 receives the DC voltage provided by the POF power supply module 110 and converts the DC voltage.

[0139] S803, based on DC-DC conversion module 130, performs DC-DC conversion on the DC voltage converted by power conversion module 120 and supplies power to combined PON module 200.

[0140] S804, based on the control module 140, reads the currently running optical drive chip in the combined PON module 200 and switches to the corresponding PON mode.

[0141] It should be noted that the specific implementation principle of this embodiment has been described in the above embodiments, and will not be repeated here.

[0142] Please see Figure 9 , Figure 9 This is a schematic diagram of the overall flow of the POF-based combined PON module control method provided in the embodiments of this application. Figure 9 As shown, the process is as follows: (1) The gateway is powered on, but the PON module is not powered on; (2) POF access; (3) XGPON module powered OR (or) GPON module powered; (4) The SOC reads the current optical drive via IIC to determine whether to switch modes; (5) Register and go online.

[0143] It should be noted that the specific implementation principle of this embodiment has been described in the above embodiments, and will not be repeated here.

[0144] This application combines the COMBO gateway with the POF, and uses the power supply function of the POF to simplify the logic of COMBO gateway mode switching at the hardware level.

[0145] In this application, the GPON and XGPON modules are powered off when not in use, avoiding power consumption, unnecessary heat dissipation, and signal interference. When in use, only one of the GPON and XGPON modules is powered, preventing signal interference between the two optical drive modules and reducing heat dissipation. Switching between the two PON modules via switching chips and MOSFETs is unnecessary, reducing the complexity of the circuit design.

[0146] This application also provides an electronic device; please refer to [link to relevant documentation]. Figure 10 , Figure 10 This is a schematic block diagram of the electronic device 300 provided in an embodiment of this application. Figure 10 As shown, the electronic device 300 includes a POF-based combined PON module control circuit 100.

[0147] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0148] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A combined PON module control circuit based on POF, characterized in that, The circuit includes: a POF power supply module (110), a power conversion module (120), a DC-DC conversion module (130), and a control module (140). The power output terminal of the POF power supply module (110) is connected to the power input terminal of the power receiving conversion module (120), the power output terminal of the power receiving conversion module (120) is connected to the power input terminal of the DC-DC conversion module (130), and the power output terminal of the DC-DC conversion module (130) is connected to the power input terminal of the combined PON module (200). The serial deserialization pin of the combined PON module (200) is connected to the serial deserialization pin of the control module (140), the signal loss pin of the combined PON module (200) is connected to the data receiving pin of the control module (140), the I2C pin of the combined PON module (200) is connected to the I2C pin of the control module (140), and the burst enable signal input pin of the combined PON module (200) is connected to the burst enable signal input pin of the control module (140). The POF power supply module (110) is used to connect to AC voltage power supply, convert AC voltage to DC voltage, and provide DC voltage to the power receiving conversion module (120); the power receiving conversion module (120) is used to receive the DC voltage provided by the POF power supply module (110) and convert the DC voltage; the DC-DC conversion module (130) is used to convert the DC voltage converted by the power receiving conversion module (120) into DC voltage and supply power to the combined PON module (200); The control module (140) is used to read the currently running optical drive chip in the combined PON module (200) and switch to the corresponding PON mode.

2. The POF-based combined PON module control circuit according to claim 1, characterized in that, The POF power supply module (110) includes: a first POF power supply unit (112) and a second POF power supply unit (114). The power output terminal of the first POF power supply unit (112) is connected to the power input terminal of the power receiving conversion module (120). The first POF power supply unit (112) is used to connect to AC voltage power supply, convert AC voltage to DC voltage, and provide DC voltage to the power receiving conversion module (120). The power output terminal of the second POF power supply unit (114) is connected to the power input terminal of the power conversion module (120). The first POF power supply unit (112) is used to connect to AC voltage power supply, convert AC voltage to DC voltage, and provide DC voltage to the power conversion module (120).

3. The POF-based combined PON module control circuit according to claim 2, characterized in that, The first POF power supply unit (112) includes: a first POF interface (P1), a first rectifier chip (U1), and a first capacitor (C1). The positive power supply pin of the first POF interface (P1) is connected to the positive AC input terminal of the first rectifier chip (U1), the negative power supply pin of the first POF interface (P1) is connected to the negative AC input terminal of the first rectifier chip (U1), the ground pin of the first POF interface (P1) is grounded, and the first POF interface (P1) is used to connect to AC voltage power supply. The positive DC output terminal of the first rectifier chip (U1) and the first terminal of the first capacitor (C1) are connected to the positive power supply input terminal of the power conversion module (120), and the negative DC output terminal of the first rectifier chip (U1) and the second terminal of the first capacitor (C1) are connected to the negative power supply input terminal of the power conversion module (120). The first rectifier chip (U1) is used to convert AC voltage into DC voltage, and the first capacitor (C1) is used to filter the DC voltage. The second POF power supply unit (114) includes: a second POF interface (P2), a second rectifier chip (U2), and a second capacitor (C2). The positive power supply pin of the second POF interface (P2) is connected to the positive AC input terminal of the second rectifier chip (U2), the negative power supply pin of the second POF interface (P2) is connected to the negative AC input terminal of the second rectifier chip (U2), the ground pin of the second POF interface (P2) is grounded, and the second POF interface (P2) is used to connect to AC voltage power supply. The positive DC output terminal of the second rectifier chip (U2) and the first terminal of the second capacitor (C2) are connected to the positive power supply input terminal of the power conversion module (120), and the negative DC output terminal of the second rectifier chip (U2) and the second terminal of the second capacitor (C2) are connected to the negative power supply input terminal of the power conversion module (120). The second rectifier chip (U2) is used to convert AC voltage into DC voltage, and the second capacitor (C2) is used to filter the DC voltage.

4. The POF-based combined PON module control circuit according to claim 1, characterized in that, The power conversion module (120) includes: a first power conversion unit (122) and a second power conversion unit (124); The power input terminal of the first power receiving conversion unit (122) is connected to the power output terminal of the POF power supply module (110), and the power output terminal of the first power receiving conversion unit (122) is connected to the power input terminal of the DC-DC conversion module (130). The first power receiving conversion unit (122) is used to receive the DC voltage provided by the POF power supply module (110) and convert the DC voltage. The power input terminal of the second power conversion unit (124) is connected to the power output terminal of the POF power supply module (110), and the power output terminal of the second power conversion unit (124) is connected to the power input terminal of the DC-DC conversion module (130). The second power conversion unit (124) is used to receive the DC voltage provided by the POF power supply module (110) and convert the DC voltage.

5. The POF-based combined PON module control circuit according to claim 4, characterized in that, The first power receiving conversion unit (122) includes: a first POF power receiving chip (U3), a third capacitor (C3), a fourth capacitor (C4), a fifth capacitor (C5), a sixth capacitor (C6), a seventh capacitor (C7), an eighth capacitor (C8), a ninth capacitor (C9), a tenth capacitor (C10), an eleventh capacitor (C11), a twelfth capacitor (C12), a thirteenth capacitor (C13), a fourteenth capacitor (C14), a first resistor (R1), a second resistor (R2), a third resistor (R3), a fourth resistor (R4), a fifth resistor (R5), a sixth resistor (R6), a seventh resistor (R7), an eighth resistor (R8), a ninth resistor (R9), a first diode (D1), a second diode (D2), and a first inductor (L1); The ISNS and HSO pins of the first POF power receiving chip (U3) are connected to the second end of the first resistor (R1), the FBH pin of the first POF power receiving chip (U3) is connected to the series node of the second resistor (R2) and the third resistor (R3), the EROUT pin of the first POF power receiving chip (U3) is connected to the first end of the third capacitor (C3) and the fourth capacitor (C4), the FBL pin of the first POF power receiving chip (U3) is connected to the power ground, and the VDD pin of the first POF power receiving chip (U3) is connected to the first end of the fifth capacitor (C5). The RDET pin of the first POF power receiving chip (U3) is connected to the first end of the fifth resistor (R5). The NC pin, VNEG pin, and EPAD pin of the first POF power receiving chip (U3) are connected to the negative power supply output terminal of the POF power supply module (110). The RCL pin of the first POF power receiving chip (U3) is connected to the first end of the sixth resistor (R6). The RFREQ pin of the first POF power receiving chip (U3) is connected to the first end of the seventh resistor (R7). The VPOS pin of the first POF power receiving chip (U3) is connected to the positive power supply output terminal of the POF power supply module (110), the SWO pin of the first POF power receiving chip (U3) is connected to the first terminal of the first inductor (L1) and the anode of the first diode (D1), and the VSS pin of the first POF power receiving chip (U3) is connected to the power ground. The first end of the first resistor (R1), the second end of the sixth capacitor (C6) and the second end of the seventh capacitor (C7) are connected to the power supply ground. The first end of the sixth capacitor (C6) and the first end of the seventh capacitor (C7) are connected to the positive power supply output terminal of the POF power supply module (110) and the power supply input terminal of the DC-DC conversion module (130). The first end of the second resistor (R2) is connected to the power supply input terminal of the DC-DC converter module (130), and the second resistor (R2), the third resistor (R3) and the fourth resistor (R4) are connected in series between the power supply input terminal of the DC-DC converter module (130) and ground. The first terminal of the eighth capacitor (C8) is connected to the first terminal of the third resistor (R3), the second terminal of the eighth capacitor (C8) is grounded, and the ninth capacitor (C9) and the tenth capacitor (C10) are connected in parallel between the power supply input terminal of the DC-DC conversion module (130) and ground. The first end of the eighth resistor (R8) is connected to the second end of the third capacitor (C3), and the second end of the eighth resistor (R8), the second end of the fourth capacitor (C4), and the second end of the fifth capacitor (C5) are connected to the power supply ground. The second end of the fifth resistor (R5) and the second end of the seventh resistor (R7) are connected to the positive power supply output terminal of the POF power supply module (110), and the second end of the sixth resistor (R6) is connected to the negative power supply output terminal of the POF power supply module (110). The cathode of the first diode (D1) is connected to the first terminal of the seventh capacitor (C7), the first terminals of the eleventh capacitor (C11), the twelfth capacitor (C12), and the thirteenth capacitor (C13) are connected to the cathode of the first diode (D1), the second terminals of the eleventh capacitor (C11), the twelfth capacitor (C12), and the thirteenth capacitor (C13) are connected to the second terminal of the first inductor (L1), and the second terminal of the thirteenth capacitor (C13) is grounded. The anode of the second diode (D2) and the second terminal of the fourteenth capacitor (C14) are connected to the negative power supply output terminal of the POF power supply module (110). The cathode of the second diode (D2) and the first terminal of the ninth resistor (R9) are connected to the positive power supply output terminal of the POF power supply module (110). The second terminal of the ninth resistor (R9) is connected to the first terminal of the fourteenth capacitor (C14).

6. The POF-based combined PON module control circuit according to claim 4, characterized in that, The second power receiving conversion unit (124) includes: a second POF power receiving chip (U4), a fifteenth capacitor (C15), a sixteenth capacitor (C16), a seventeenth capacitor (C17), an eighteenth capacitor (C18), a nineteenth capacitor (C19), a twentieth capacitor (C20), a twenty-first capacitor (C21), a twenty-second capacitor (C22), a twenty-third capacitor (C23), a twenty-fourth capacitor (C24), a twenty-fifth capacitor (C25), a twenty-sixth capacitor (C26), a tenth resistor (R10), an eleventh resistor (R11), a twelfth resistor (R12), a thirteenth resistor (R13), a fourteenth resistor (R14), a fifteenth resistor (R15), a sixteenth resistor (R16), a seventeenth resistor (R17), an eighteenth resistor (R18), a third diode (D3), a fourth diode (D4), and a second inductor (L2); The ISNS and HSO pins of the second POF power receiving chip (U4) are connected to the second end of the tenth resistor (R10). The FBH pin of the second POF power receiving chip (U4) is connected to the series node of the eleventh resistor (R11) and the twelfth resistor (R12). The EROUT pin of the second POF power receiving chip (U4) is connected to the first end of the fifteenth capacitor (C15) and the sixteenth capacitor (C16). The FBL pin of the second POF power receiving chip (U4) is connected to the power ground. The VDD pin of the second POF power receiving chip (U4) is connected to the first end of the seventeenth capacitor (C17). The RDET pin of the second POF power receiving chip (U4) is connected to the first end of the fourteenth resistor (R14). The NC pin, VNEG pin, and EPAD pin of the second POF power receiving chip (U4) are connected to the negative power supply output terminal of the POF power supply module (110). The RCL pin of the second POF power receiving chip (U4) is connected to the first end of the fifteenth resistor (R15). The RFREQ pin of the second POF power receiving chip (U4) is connected to the first end of the sixteenth resistor (R16). The VPOS pin of the second POF power receiving chip (U4) is connected to the positive power supply output terminal of the POF power supply module (110), the SWO pin of the second POF power receiving chip (U4) is connected to the first terminal of the second inductor (L2) and the anode of the third diode (D3), and the VSS pin of the second POF power receiving chip (U4) is connected to the power ground. The first end of the tenth resistor (R10), the second end of the eighteenth capacitor (C18), and the second end of the nineteenth capacitor (C19) are connected to the power supply ground. The first end of the eighteenth capacitor (C18) and the first end of the nineteenth capacitor (C19) are connected to the positive power supply output terminal of the POF power supply module (110) and the power supply input terminal of the DC-DC conversion module (130). The first end of the eleventh resistor (R11) is connected to the power supply input terminal of the DC-DC converter module (130), and the eleventh resistor (R11), the twelfth resistor (R12) and the thirteenth resistor (R13) are connected in series between the power supply input terminal of the DC-DC converter module (130) and ground. The first end of the twentieth capacitor (C20) is connected to the first end of the twelfth resistor (R12), the second end of the twentieth capacitor (C20) is grounded, and the twenty-first capacitor (C21) and the twenty-second capacitor (C22) are connected in parallel between the power supply input terminal of the DC-DC conversion module (130) and ground. The first end of the seventeenth resistor (R17) is connected to the second end of the fifteenth capacitor (C15), and the second ends of the seventeenth resistor (R17), the sixteenth capacitor (C16), and the seventeenth capacitor (C17) are connected to the power supply ground. The second end of the fourteenth resistor (R14) and the second end of the sixteenth resistor (R16) are connected to the positive power supply output terminal of the POF power supply module (110), and the second end of the fifteenth resistor (R15) is connected to the negative power supply output terminal of the POF power supply module (110). The cathode of the third diode (D3) is connected to the first terminal of the nineteenth capacitor (C19). The first terminals of the twenty-third capacitor (C23), the twenty-fourth capacitor (C24), and the twenty-fifth capacitor (C25) are connected to the cathode of the third diode (D3). The second terminals of the twenty-third capacitor (C23), the twenty-fourth capacitor (C24), and the twenty-fifth capacitor (C25) are connected to the second terminal of the second inductor (L2). The second terminal of the twenty-fifth capacitor (C25) is grounded. The anode of the fourth diode (D4) and the second terminal of the second sixteenth capacitor (C26) are connected to the negative power supply output terminal of the POF power supply module (110). The cathode of the fourth diode (D4) and the first terminal of the eighteenth resistor (R18) are connected to the positive power supply output terminal of the POF power supply module (110). The second terminal of the eighteenth resistor (R18) is connected to the first terminal of the second sixteenth capacitor (C26).

7. The POF-based combined PON module control circuit according to any one of claims 1-6, characterized in that, The combined PON module (200) includes a GPON optical drive chip (210) and an XGPON optical drive chip (220); the DC-DC conversion module (130) includes a first DC-DC conversion unit (132) and a second DC-DC conversion unit (134). The power input terminal of the first DC-DC conversion unit (132) is connected to the power output terminal of the power receiving conversion module (120), and the power output terminal of the first DC-DC conversion unit (132) is connected to the power input pin of the XGPON optical drive chip (220). The first DC-DC conversion unit (132) is used to convert the DC voltage converted by the power receiving conversion module (120) into DC voltage and to supply power to the XGPON optical drive chip (220). The power input terminal of the second DC-DC conversion unit (134) is connected to the power output terminal of the power receiving conversion module (120), and the power output terminal of the second DC-DC conversion unit (134) is connected to the power input pin of the GPON optical drive chip (210). The second DC-DC conversion unit (134) is used to convert the DC voltage converted by the power receiving conversion module (120) into DC voltage and to supply power to the GPON optical drive chip (210).

8. The POF-based combined PON module control circuit according to claim 7, characterized in that, The first DC-DC conversion unit (132) includes: a first DC-DC conversion chip (U5), a twenty-seventh capacitor (C27), a twenty-eighth capacitor (C28), a twenty-ninth capacitor (C29), a thirtieth capacitor (C30), a thirty-first capacitor (C31), a thirty-second capacitor (C32), a thirty-third capacitor (C33), a thirty-fourth capacitor (C34), a thirty-fifth capacitor (C35), a thirty-sixth capacitor (C36), a thirty-seventh capacitor (C37), a nineteenth resistor (R19), a twentieth resistor (R20), a twenty-first resistor (R21), a twenty-second resistor (R22), a twenty-third resistor (R23), a twenty-fourth resistor (R24), and a third inductor (L3); The power input pin of the first DC-DC converter chip (U5) is connected to the power output terminal of the power receiving conversion module (120), the enable pin of the first DC-DC converter chip (U5) is connected to the first terminal of the thirtieth capacitor (C30), the ground pin of the first DC-DC converter chip (U5) is grounded, the bootstrap pin of the first DC-DC converter chip (U5) is connected to the first terminal of the twenty-first resistor (R21), the switching node output pin of the first DC-DC converter chip (U5) is connected to the first terminal of the third inductor (L3), and the feedback pin of the first DC-DC converter chip (U5) is connected to the first terminal of the twenty-second resistor (R22). The twenty-seventh capacitor (C27), the twenty-eighth capacitor (C28), and the twenty-ninth capacitor (C29) are connected in parallel between the power supply output terminal of the power receiving conversion module (120) and ground. The first terminal of the nineteenth resistor (R19) is connected to the first terminal of the twenty-ninth capacitor (C29). The series connection of the nineteenth resistor (R19) and the twentieth resistor (R20) is connected to the first terminal of the thirtieth capacitor (C30). The second terminals of the twentyth resistor (R20) and the thirtieth capacitor (C30) are grounded. The second end of the 21st resistor (R21) is connected to the first end of the 31st capacitor (C31), the second end of the 31st capacitor (C31) is connected to the first end of the third inductor (L3), and the second end of the third inductor (L3) is connected to the power supply input pin of the XGPON optical drive chip (220). The second end of the 22nd resistor (R22) is connected to the first end of the 24th resistor (R24), the second end of the 24th resistor (R24) is connected to the second end of the third inductor (L3), the 32nd capacitor (C32) is connected in parallel with the 24th resistor (R24), the first end of the 23rd resistor (R23) is connected to the series node of the 22nd resistor (R22) and the 24th resistor (R24), and the second end of the 23rd resistor (R23) is grounded. The thirty-third capacitor (C33), the thirty-fourth capacitor (C34), the thirty-fifth capacitor (C35), the thirty-sixth capacitor (C36), and the thirty-seventh capacitor (C37) are connected in parallel between the power supply input pin of the XGPON optical drive chip (220) and ground.

9. The POF-based combined PON module control circuit according to claim 7, characterized in that, The second DC-DC conversion unit (134) includes: a second DC-DC conversion chip (U6), a thirty-eighth capacitor (C38), a thirty-ninth capacitor (C39), a fortieth capacitor (C40), a forty-first capacitor (C41), a forty-second capacitor (C42), a forty-third capacitor (C43), a forty-fourth capacitor (C44), a forty-fifth capacitor (C45), a forty-sixth capacitor (C46), a forty-seventh capacitor (C47), a forty-eighth capacitor (C48), a twenty-fifth resistor (R25), a twenty-sixth resistor (R26), a twenty-seventh resistor (R27), a twenty-eighth resistor (R28), a twenty-ninth resistor (R29), a thirtieth resistor (R30), and a fourth inductor (L4); The power input pin of the second DC-DC converter chip (U6) is connected to the power output terminal of the power receiving conversion module (120), the enable pin of the second DC-DC converter chip (U6) is connected to the first terminal of the forty-first capacitor (C41), the ground pin of the second DC-DC converter chip (U6) is grounded, the bootstrap pin of the second DC-DC converter chip (U6) is connected to the first terminal of the twenty-seventh resistor (R27), the switching node output pin of the second DC-DC converter chip (U6) is connected to the first terminal of the fourth inductor (L4), and the feedback pin of the second DC-DC converter chip (U6) is connected to the first terminal of the twenty-eighth resistor (R28). The thirty-eighth capacitor (C38), the thirty-ninth capacitor (C39), and the fortieth capacitor (C40) are connected in parallel between the power supply output terminal of the power receiving conversion module (120) and ground. The first terminal of the twenty-fifth resistor (R25) is connected to the first terminal of the fortieth capacitor (C40). The series connection of the twenty-fifth resistor (R25) and the twenty-sixth resistor (R26) is connected to the first terminal of the fortieth capacitor (C41). The second terminal of the twenty-sixth resistor (R26) and the second terminal of the fortieth capacitor (C41) are grounded. The second end of the 27th resistor (R27) is connected to the first end of the 42nd capacitor (C42), the second end of the 42nd capacitor (C42) is connected to the first end of the fourth inductor (L4), and the second end of the fourth inductor (L4) is connected to the power supply input pin of the GPON optical drive chip (210). The second end of the 28th resistor (R28) is connected to the first end of the 30th resistor (R30), the second end of the 30th resistor (R30) is connected to the second end of the fourth inductor (L4), the 43rd capacitor (C43) is connected in parallel with the 30th resistor (R30), the first end of the 29th resistor (R29) is connected to the series node of the 28th resistor (R28) and the 30th resistor (R30), and the second end of the 29th resistor (R29) is grounded. The forty-fourth capacitor (C44), forty-fifth capacitor (C45), forty-sixth capacitor (C46), forty-seventh capacitor (C47), and forty-eighth capacitor (C48) are connected in parallel between the power supply input pin of the GPON optical drive chip (210) and ground.

10. A control method for a combined PON module based on POF, characterized in that, The method is implemented based on the POF-based combined PON module control circuit according to any one of claims 1-9, and includes: Based on the AC voltage power supply module (110), the AC voltage is converted into DC voltage and supplied to the power conversion module (120); The power conversion module (120) receives the DC voltage provided by the POF power supply module (110) and converts the DC voltage. Based on the DC-DC conversion module (130), the DC voltage converted by the power receiving conversion module (120) is converted into DC voltage and used to power the combined PON module (200); Based on the control module (140), the currently running optical drive chip in the combined PON module (200) is read and switched to the corresponding PON mode.

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