Module cards and combinations of module cards and slots

Abstract

The present invention provides a module card and a combination of a module card and a socket. The module card includes a substrate, a first chip, a second chip, an adhesive, a plurality of metal contacts, a thermally conductive layer, and a thermally conductive material. The substrate has a first surface and a second surface and is formed with a plurality of vias. The first chip and the second chip are disposed on the first surface. The adhesive attaches the second chip to the first surface. The metal contacts and the thermally conductive layer are disposed on the second surface. The thermally conductive material is filled in the vias and is in contact with the adhesive and the thermally conductive layer.

Description

Technical Field

[0001] This invention relates to a module card and a combination of the module card and a slot, and more particularly to a module card with good heat dissipation capabilities and a combination thereof with a slot. Background Technology

[0002] The instruction cycles of chips in current flash memory cards are becoming increasingly faster, causing the overall surface temperature of the memory card to rise continuously, raising concerns about burns for users. Furthermore, increased temperature leads to decreased chip performance, slower data processing speeds, and reduced reliability and stability. Overheating can also cause chip malfunctions and even shorten its lifespan. Therefore, heat dissipation technology is necessary to maintain a stable operating temperature for the chips. Summary of the Invention

[0003] In view of this, the present invention provides a module card and a combination of the module card and the slot to solve the above problems.

[0004] To achieve the above objectives, the module card of the present invention comprises: a substrate having opposing first and second surfaces, wherein a chip placement area is defined on the first surface, and a plurality of vias are formed in the substrate, the plurality of vias extending from the first surface through the substrate to the second surface; a first chip disposed on the first surface of the substrate; a second chip disposed within the chip placement area; an adhesive disposed between the second chip and the substrate for attaching the second chip to the first surface of the substrate; a plurality of metal contacts disposed on the second surface of the substrate and electrically connected to the first chip and the second chip; a thermally conductive layer disposed on the second surface of the substrate for contacting a thermally conductive sheet on a slot; and a thermally conductive material filling the plurality of vias and contacting the adhesive and the thermally conductive layer.

[0005] The combination of the module card and slot of the present invention includes a slot and the aforementioned module card. The slot includes: a substrate; a plurality of metal contacts disposed on the substrate and electrically connected to the substrate; and a heat-conducting sheet disposed on the substrate. When the module card is inserted into the slot, the plurality of metal contacts of the slot respectively contact the plurality of metal contacts of the module card, and the heat-conducting sheet of the slot contacts the heat-conducting layer of the module card.

[0006] The module card according to the present invention has good heat dissipation capabilities, which can prevent the surface temperature from rising continuously, so that users will not have any concerns about being burned.

[0007] To make the above and other objects, features and advantages of the present invention more apparent, embodiments of the present invention are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0008] The nature of this disclosure is best understood by reading in conjunction with the accompanying drawings and the following detailed description. It should be noted that, in accordance with standard industry practice, the various components are not drawn to scale. In practice, the dimensions of the various components may be arbitrarily increased or decreased for clarity of explanation.

[0009] Figure 1 This is a schematic diagram of the module card of the present invention.

[0010] Figure 2 for Figure 1 Sectional view along line AA.

[0011] Figure 3 for Figure 1 Sectional view of line BB along the middle.

[0012] Figure 4 This is a schematic diagram of the slot of the present invention.

[0013] Figure 5 for Figure 4 Cross-sectional view along line CC.

[0014] Figure 6 This is a schematic diagram of the combination of the module card and slot of the present invention.

[0015] Symbol explanation:

[0016] 100 Module Cards

[0017] 110 First Chip

[0018] 112 welding wire

[0019] 120 Second Chip

[0020] 122 wire bonding

[0021] 124 Adhesive

[0022] 130 substrate

[0023] 131 First Surface

[0024] 132 Second Surface

[0025] 133 pilot hole

[0026] 134 Thermally conductive materials

[0027] 135 Chip Setup Area

[0028] 140 sealing colloid

[0029] 150 First solder mask layer

[0030] 151 First Window

[0031] 160 Second solder mask layer

[0032] 161 Second Window

[0033] 170 thermal conductive layer

[0034] 180 metal contacts

[0035] 200 slots

[0036] 230 substrate

[0037] 231 First Surface

[0038] 232 Second Surface

[0039] 270 thermal pad

[0040] 280 metal contacts Detailed Implementation

[0041] The following disclosure provides numerous different embodiments or instances for implementing various features of this disclosure. Specific examples of components and configurations are described below to simplify this disclosure. Of course, these components and configurations are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first member above or on a second member may include embodiments where the first member and the second member are formed in direct contact, and may also include embodiments where additional members may be formed between the first member and the second member such that the first member and the second member are not in direct contact. Additionally, reference numerals and / or letters may be repeated in various instances of this disclosure. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0042] In addition, for ease of description, spatial relative terms such as “under,” “below,” “lower,” “overlapping,” “upper,” and similar terms may be used herein to describe the relationship between one component or member and one or more components or members as illustrated in the figures. Besides the orientations depicted in the figures, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0043] Figure 1 This is a schematic diagram of the module card 100 of the present invention. Figure 2 for Figure 1 A cross-sectional view along line AA, where the area enclosed by the dashed line is the chip setting area 135. Figure 3 for Figure 1 Sectional view of line BB along the middle.

[0044] Please refer to Figures 1 to 3The module card 100 of the present invention includes a substrate 130 in which conductive lines (not shown) are arranged. The substrate 130 has a first surface 131 and a second surface 132 opposite to each other, and the first surface 131 and the second surface 132 are located in different planes, for example, the first surface 131 is the top surface and the second surface 132 is the bottom surface, but not limited thereto.

[0045] In one embodiment, the substrate 130 may be a single-layer or multi-layer circuit board.

[0046] The first surface 131 of the substrate 130 is covered by a first solder mask 150. The first solder mask 150 is configured to have a first window 151, exposing the first surface 131 of the substrate 130. A chip placement area 135 is defined on the first surface 131 of the substrate 130, which is located within the first window 151, meaning that the chip placement area 135 is not covered by the first solder mask 150.

[0047] The second surface 132 of the substrate 130 is covered by a second solder resist layer 160. The second solder resist layer 160 is configured to have a second window 161. A thermally conductive layer 170 is disposed on the second surface 132 of the substrate 130, which is exposed through the second window 161, that is, the thermally conductive layer 170 is not completely covered by the second solder resist layer 160.

[0048] In one embodiment, the heat-conducting layer 170 may be made of a heat-conducting material such as gold or copper. The shape of the heat-conducting layer 170 may be circular, rectangular, or any shape.

[0049] A plurality of vias 133 are formed in the substrate 130, which pass through the substrate 130 from the first surface 131 to the second surface 132. The vias 133 are located between the chip mounting area 135 and the second window 161, and are connected to the first window 151 and the second window 161.

[0050] The vias 133 are filled with a thermally conductive material 134, such as gold or copper. The thermally conductive material 134 in the vias 133 is in contact with the thermally conductive layer 170.

[0051] One or more, such as a plurality of first chips 110, are disposed on the first surface 131 of the substrate 130. Each of the first chips 110 has an active surface and a back surface opposite to the active surface. The first chips 110 can be stacked vertically or in a stepped manner on the substrate 130 and are adhered to the substrate 130 with adhesive or epoxy resin. When the first chips 110 are stacked in a stepped manner on the substrate 130, they can be electrically connected to the substrate 130 through a plurality of bonding wires 112.

[0052] In one embodiment, the first chip 110 may be a memory die.

[0053] A second chip 120 is further disposed on the first surface 131 of the substrate 130, having an active surface and a back surface opposite to the active surface. The back surface of the second chip 120 is adhered to the chip placement area 135 with a highly thermally conductive adhesive 124. The adhesive 124 is made of a thermally conductive material and contacts the thermally conductive material 134 within the vias 133. The second chip 120 can be electrically connected to the substrate 130 via a plurality of bonding wires 122.

[0054] In one embodiment, the second chip 120 is a chip that generates high heat, such as a controller die or a power management die, but the present invention is not limited thereto.

[0055] An encapsulant 140 is formed on the first surface 131 of the substrate 130, which covers the second chip 120, the first chips 110 and the bonding wires 112 and 122 to protect the components.

[0056] A plurality of metal contacts 180, such as gold fingers, are provided on the second surface 132 of the substrate 130, which are exposed from the second solder mask layer 160. These metal contacts 180 are used for electrical connection with external circuits.

[0057] According to the module card 100 of the present invention, the first chips 110 can be electrically connected to the metal contacts 180 through the bonding wires 112 and the conductive lines on the substrate 130; the second chip 120 can be electrically connected to the metal contacts 180 through the bonding wires 122 and the conductive lines on the substrate 130, thereby the first chips 110 and the second chips 120 can be electrically connected to an external circuit through the metal contacts 180.

[0058] Figure 4 This is a schematic diagram of the slot 200 of the present invention. Figure 5 for Figure 4 Cross-sectional view along line CC.

[0059] Please refer to Figure 4 and Figure 5 The slot 200 of the present invention includes a substrate 230 in which conductive lines (not shown) are arranged. The substrate 230 has a first surface 231 and a second surface 232 opposite to each other, and the first surface 231 and the second surface 232 are located in different planes.

[0060] The substrate 230 is provided with a plurality of metal contacts 280, which are electrically connected to the substrate 230 and protrude from the first surface 231. The metal contacts 280 are used to contact the metal contacts 180 on the module card 100 respectively.

[0061] A heat-conducting sheet 270 is also provided on the substrate 230, which is thermally connected to the substrate 230 and protrudes from the first surface 231. The heat-conducting sheet 270 can be made of metal, such as gold or copper, but the present invention is not limited thereto.

[0062] Figure 6 This is a schematic diagram of the combination of the module card 100 and the slot 200 of the present invention.

[0063] The slot 200 of this invention can be mounted on an electronic device, such as a computer. Please refer to... Figure 6 When the module card 100 is inserted into the slot 200 and positioned, the metal contacts 280 will directly contact the metal contacts 180 respectively. In this way, the first chip 110 and the second chip 120 can be electrically connected to an external circuit.

[0064] According to the module card 100 of the present invention, when the module card 100 is inserted into the slot 200 and positioned, the heat-conducting pad 270 will directly contact the heat-conducting layer 170 on the module card 100. The heat generated by the second chip 120 during operation will be conducted to the external electronic device through the adhesive 124 attached to its bottom, the heat-conducting material 134 in the through holes 133, the heat-conducting layer 170 and the heat-conducting pad 270, thereby reducing the temperature of the module card 100.

[0065] The module card 100 of this invention is suitable for making common flash memory cards on the market, such as SD cards and microSD cards, but this invention is not limited thereto.

[0066] When the module card of the present invention is used in conjunction with the corresponding slot, the heat generated by its chip during operation is easily conducted to the external electronic device, thus having good heat dissipation capability and preventing the surface temperature from continuously rising.

[0067] While the present invention has been disclosed through the foregoing embodiments, it is not intended to limit the invention. Anyone skilled in the art to which this invention pertains can make various modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A module card, characterized in that, Include: A substrate has a first surface and a second surface opposite to each other. A chip placement area is defined on the first surface. A plurality of vias are formed in the substrate, and the plurality of vias pass through the substrate from the first surface to the second surface. A first chip is disposed on the first surface of the substrate; The second chip is disposed within the chip setting area; An adhesive is disposed between the second chip and the substrate to attach the second chip to the first surface of the substrate; A plurality of metal contacts are disposed on the second surface of the substrate and electrically connected to the first chip and the second chip; A thermally conductive layer is disposed on the second surface of the substrate for contacting the thermally conductive sheet on the slot; as well as Thermally conductive material is filled into the plurality of guide holes and comes into contact with the adhesive and the thermally conductive layer.

2. The module card as described in claim 1, characterized in that, Also includes: An encapsulant is formed on the first surface of the substrate and covers the first chip and the second chip.

3. The module card as described in claim 1, characterized in that, Also includes: A solder resist layer is disposed on the first surface of the substrate and does not cover the chip placement area.

4. The module card as described in claim 1, characterized in that, The thermally conductive material is made of gold or copper.

5. The module card as described in claim 1, characterized in that, The heat-conducting layer is made of gold or copper.

6. The module card as described in claim 1, characterized in that, The adhesive is made of a thermally conductive material.

7. The module card as described in claim 1, characterized in that, Also includes: A solder resist layer covers the second surface of the substrate, wherein the thermally conductive layer is exposed from the solder resist layer.

8. The module card as described in claim 1, characterized in that, The first chip is a memory chip.

9. The module card as described in claim 1, characterized in that, The second chip is a control chip or a power management chip.

10. A combination of a module card and a slot, characterized in that, Include: Slots, including: substrate; A plurality of metal contacts are disposed on the substrate and electrically connected to the substrate; and A heat-conducting sheet is disposed on the substrate; and The module card as described in any one of claims 1 to 9, wherein the module card is inserted into the slot, the plurality of metal contacts of the slot respectively contact the plurality of metal contacts of the module card, and the heat-conducting sheet of the slot contacts the heat-conducting layer of the module card.

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