Circuit board, functional component module and electronic device

Abstract

A circuit board, a functional component module and an electronic device. The circuit board includes a substrate and a support assembly. The support assembly adapted to carry a functional component includes a base plate and a plurality of elastic elements, wherein the elastic elements are disposed between the base plate and the substrate to provide a support force to the base plate.

Description

Technical Field

[0001] This invention relates to a circuit board, a functional component module, and an electronic device, and more particularly to a universal circuit board, functional component module, and electronic device. Background Technology

[0002] In existing technologies, solid state disk (SSD) modules typically use a base plate in their heat dissipation devices to improve heat conduction. Thermal adhesive is usually used between the base plate and the SSD module to increase the physical contact area and achieve good heat conduction.

[0003] However, not only is the overall size limited by the choice of product (e.g., solid-state drive module), but when the solid-state drive module is designed with double-sided (front + back) assembly, the thickness of the thermal adhesive and / or the base plate must be adjusted to achieve good contact and thus the expected heat conduction effect. Furthermore, when changing to a single-sided (front) solid-state drive module design, the thickness of the thermal adhesive or the base plate must be adjusted again.

[0004] Therefore, the aforementioned prior art has the following problems:

[0005] 1. The design of the heat dissipation base plate is easily limited by the design of the solid-state drive module products. Different solid-state drive modules must use base plates of different thicknesses and sizes and thermal conductive adhesives.

[0006] Second, when replacing a solid-state drive module, it is essential to ensure that the thickness and dimensions of the base plate and thermal paste used provide adequate contact area. If the dimensions are incompatible, resulting in poor contact area, it is necessary to replace the base plate and thermal paste with suitable ones. This not only increases the risks of disassembly and component replacement but also increases the risk of damage caused by screw removal during the disassembly process. Summary of the Invention

[0007] One objective of this invention is to provide a circuit board that can accommodate different thicknesses and weights of functional modules mounted thereon.

[0008] Another object of the present invention is to provide a functional module that can adjust the distance between itself and the circuit board.

[0009] Another object of the present invention is to provide a universal electronic device.

[0010] A circuit board according to the present invention includes a substrate and a support assembly. The support assembly, suitable for supporting functional components, includes a base plate and a plurality of elastic elements, wherein the elastic elements are disposed between the base plate and the substrate to provide a supporting force to the base plate.

[0011] A functional component module of the present invention includes a functional component and a support assembly for supporting the functional component. The support assembly includes a base plate and a plurality of elastic elements, wherein the elastic elements are disposed on the side of the base plate relatively away from the functional component.

[0012] An electronic device according to the present invention includes a circuit board, functional components, and a support assembly. The circuit board includes a substrate; the functional components are disposed on the substrate; the support assembly supporting the functional components includes a base plate and an elastic element, wherein the elastic element is disposed between the base plate and the substrate.

[0013] In one embodiment of the present invention, the support assembly further includes a plurality of guide posts, wherein the guide posts are disposed on one of the substrate and the base plate facing the other, and the guide posts are located in the corresponding elastic elements.

[0014] In one embodiment of the invention, each of the above-described elastic elements has an alignment hole, and the guide post is adapted to be positioned in the corresponding alignment hole.

[0015] In one embodiment of the present invention, when the guide post is disposed on the surface of the base plate facing the substrate, the substrate also has a plurality of open holes through which the guide post passes.

[0016] In one embodiment of the present invention, the elastic element is a sponge.

[0017] In one embodiment of the present invention, the hardness range of the above-mentioned elastic element is 10 to 30 degrees.

[0018] In one embodiment of the present invention, the tensile strength of the elastic element is in the range of 0.25 to 0.4 MPa.

[0019] In one embodiment of the present invention, the density range of the above-mentioned elastic element is 0.1 to 0.2 g / cm³. 3 .

[0020] In one embodiment of the present invention, a plurality of electronic components are provided on one side of the functional component or a plurality of electronic components are provided on opposite sides of the functional component.

[0021] In one embodiment of the present invention, the electronic device further includes a heat dissipation element disposed on the side of the functional component that is relatively far from the base plate.

[0022] In one embodiment of the present invention, the electronic device further includes a thermally conductive pad disposed between the functional component and the heat dissipation component.

[0023] Based on the above, by setting up the support components, the circuit board can accommodate functional components of different thicknesses and weights mounted on it, and the distance between the functional components and the circuit board can be adjusted steplessly, thereby making the electronic device convenient to use with functional components of different thicknesses and weights. Attached Figure Description

[0024] Figure 1A This is an exploded view of the electronic device.

[0025] Figure 1B for Figure 1A Assembly diagram.

[0026] Figure 2A This is a schematic diagram of the support components in Figure 1.

[0027] Figure 2B for Figure 2A A schematic diagram from another perspective.

[0028] Figure 3A This is a schematic diagram showing the components being assembled onto the substrate first. Figure 3B This is a schematic diagram showing how supporting components are first assembled with functional parts to form a functional part module.

[0029] Figure 4 This is an exploded view of the circuit board according to the second embodiment of the present invention.

[0030] Figure 5 This is a schematic diagram showing the guide post protruding from the bottom surface of the substrate.

[0031] The attached figures are labeled as follows:

[0032] 100, 100': Electronic devices

[0033] 110: Circuit board

[0034] 112:Substrate

[0035] 113:Mingkong

[0036] 120: Functional component

[0037] 130: Support component

[0038] 132: Base Plate

[0039] 134: Elastic element

[0040] 134a: Alignment hole

[0041] 136, 136': Guide post

[0042] 140: Thermal pad

[0043] 150: Functional Component Module

[0044] 160: Heat dissipation element

[0045] T: Thickness

[0046] H: Height Detailed Implementation

[0047] Figure 1A This is an exploded view of the electronic device, and Figure 1B for Figure 1A Assembly diagram. Figure 2A for Figure 1A A schematic diagram of the supporting components in the diagram, and Figure 2B for Figure 2A A schematic diagram from another perspective.

[0048] Please refer to this first. Figure 1A and Figure 1B In this embodiment, the electronic device 100 may be a computer or a server, wherein the electronic device 100 includes at least a circuit board 110, a functional component 120, and a support component 130.

[0049] Please refer to the following at the same time Figure 1A , Figure 2A and Figure 2B .

[0050] The circuit board 110 includes a substrate 112. Functional components 120 are disposed on the substrate 112.

[0051] As described above, the functional component 120 in this embodiment is a solid-state drive (SSD) module, but it is not limited thereto. Specifically, the functional component 120 can be selected from two types of SSD modules. One type of SSD module has multiple electronic components on one side (i.e., single-sided mounting); while the other type of SSD module has multiple electronic components on opposite sides (i.e., double-sided mounting). The user selects the appropriate SSD module according to actual needs to install on the support assembly 130.

[0052] The support assembly 130 is used to support the functional component 120, wherein the support assembly 130 includes a base plate 132 and an elastic element 134 disposed between the base plate 132 and the substrate 112. The elastic element 134 disposed between the base plate 132 and the substrate 112 is used to support the base plate 132 and the functional component 120 supported on the base plate 132.

[0053] In this embodiment, the elastic element 134 can be made of sponge, foam, etc., and the elastic element 134 can be disposed between the base plate 132 and the substrate 112 by means of adhesion. The advantage of using sponge as the elastic element 134 and using adhesion to fix the elastic element 134 to the base plate 132 and / or the substrate 112 is that the position of the elastic element 134 corresponding to the base plate 132 or the substrate 112 is less restricted and has a greater selection margin.

[0054] Specifically, compared to the previous use of a spring as the elastic element 134, where the spring needs to be positioned on the base plate 132 or the substrate 112 by means of locking, and therefore requires the formation of corresponding screw holes on the base plate 132 or the substrate 112, the setting position of the elastic element 134 in the prior art is fixed and cannot be arbitrarily determined by the user.

[0055] In contrast, in this case, by using sponge as the elastic element 134 and using an adhesive method to fix the elastic element 134 to the base plate 132 and / or the substrate 112, even if the elastic element 134 is disassembled to replace different functional parts 120, the elastic element 134 can be glued to the corresponding position on the substrate 112 or the base plate 132 as needed.

[0056] The physical properties of the aforementioned elastic element 134 may meet, but are not limited to, the following conditions: hardness range of 10–30 degrees, tensile strength range of 0.25–0.4 MPa, and density range of 0.1–0.2 g / cm³. 3 The elastic element 134, which meets the aforementioned physical property range, has sufficient strength to support the base plate 132 and the functional component 120 supported on the base plate 132, and at the same time has sufficient deformation capacity to be compressed according to the weight of the component supported above. Therefore, the distance between the functional component 120 and the substrate 112 can be adjusted steplessly by the deformation of the elastic element 134, so that functional components 120 of different specifications can be used in the electronic device 100 of this embodiment.

[0057] As described above, the support assembly 130 also includes a plurality of guide posts 136. In this embodiment, the elastic element 134 and the guide post 136 are disposed together on the surface of the substrate 112 facing the base plate 132. Each elastic element 134 has an alignment hole 134a, and the guide post 136 is located in the alignment hole 134a of the corresponding elastic element 134. Through the cooperation of the guide post 136 and the alignment hole 134a, offset when setting the elastic element 134 can be avoided. In this embodiment, the thickness T of the elastic element 134 is greater than the height H of the guide post 136, and the arrangement of the guide post 136 can maintain a minimum distance between the base plate 132 and the substrate 112 (i.e., the height H of the guide post 136), so as to prevent the base plate 132 from impacting the substrate 112 or electronic components disposed on the substrate 112 and adjacent to the base plate 132 due to excessive compression of the elastic element 134.

[0058] Specifically, when the force applied to the elastic element 134 by the user is too great, the elastic element 134 may be over-compressed. At this time, the height H of the guide post 136, which has no deformation capability, is greater than the thickness T of the over-compressed elastic element 134. The guide post 136 provides the force to support the base plate 132. Therefore, there is at least a minimum distance between the base plate 132 and the substrate 112 that is the same as the height H of the guide post 136. This can prevent the base plate 132 from hitting the substrate 112 or other electronic components on the adjacent base plate 132.

[0059] To improve the overall heat dissipation of the electronic device 100, the electronic device 100 may also include a heat dissipation element 160 disposed on the side of the functional component 120 relatively away from the base plate 132. This heat dissipation element 160 may be a combination of a heat sink and heat dissipation fins. In other embodiments, the heat dissipation element 160 may also be a heat sink, heat dissipation fins, a fan, or any two or more of the following: a heat sink, heat dissipation fins, and a fan. The actual heat dissipation element 160 is selected and disposed according to requirements.

[0060] Furthermore, the electronic device 100 may also include a thermally conductive pad 140, which may be disposed between the functional component 120 and the heat dissipation element 160 and / or between the functional component 120 and the base plate 132, depending on the situation. The use of the thermally conductive pad 140 can increase the contact area between the functional component 120 and the heat dissipation element 160 and / or between the functional component 120 and the base plate 132, thereby improving the heat conduction effect.

[0061] The aforementioned thermal pad 140 can be formed of thermally conductive adhesive, or the thermal pad 140 can be replaced with a heat sink, depending on the requirements.

[0062] Please also refer to Figure 1A , Figure 1B and Figure 2B After the functional components 120, support components 130, heat dissipation components 160 and thermal pads 140 are assembled on the circuit board 110 to form the electronic device 100, the weight of the heat dissipation components 160 and the functional components 120 together exert a downward force on the support components 130.

[0063] In known technologies, when the heat sink 160 is assembled on top of the functional component 120, the weight of the heat sink 160 will cause the circuit board 110 to bend, which in turn will cause the electronic components on the circuit board 110 to crack and become unable to continue to operate effectively.

[0064] In contrast, in this embodiment, when the functional component 120 and the heat dissipation element 160 assembled above the functional component 120 apply a downward force to the elastic element 134, the force is distributed to the elastic element 134, causing the elastic element 134 to be compressed and deformed downwards. At the same time, the elastic element 134 also provides an upward elastic restoring force to push against the base plate 132, thus offsetting the downward pressure applied to the upper part of the circuit board 110 due to the weight of the functional component 120 and the heat dissipation element 160. In this way, the circuit board 110 can be effectively prevented from bending and solder cracking can be avoided.

[0065] Furthermore, the provision of the elastic element 134 allows the spacing between the base plate 132 and the circuit board 110 to be adjusted according to the thickness and weight of the functional component 120 carried thereon. Therefore, the electronic device 100 of this embodiment can be used for functional components 120 of different specifications.

[0066] Specifically, the functional component 120 is selected from a single-sided and double-sided solid-state drive module, wherein the thickness of the double-sided solid-state drive module is greater than that of the single-sided solid-state drive module; and the thickness difference between the double-sided and single-sided solid-state drive modules can be eliminated by the degree of compression of the elastic element 134.

[0067] In detail, compared to the double-sided solid-state drive module being assembled on the base plate 132, the elastic element 134 is in a more compressed state when the single-sided solid-state drive module is assembled on the base plate 132. The deformation distance of the elastic element 134 from the expanded state to the compressed state is about 0.5mm to 2.5mm, preferably 1.5mm.

[0068] Figure 3A This is a schematic diagram showing the components being assembled onto the substrate first. Figure 3B This is a schematic diagram showing how supporting components are first assembled with functional parts to form a functional part module.

[0069] Incidentally, in this embodiment, the support component 130 can be pre-assembled onto the substrate 112 of the circuit board 110, such as... Figure 3A As shown, this facilitates the subsequent assembly of the functional component 120 onto the base plate 132 of the support assembly 130. Alternatively, the support assembly 130 can be pre-assembled with the functional component 120 to form a functional component module 150, such as... Figure 3B As shown, this facilitates the subsequent assembly of the functional module 150 onto the circuit board 110.

[0070] Second Embodiment

[0071] Figure 4This is an exploded view of the circuit board according to the second embodiment of the present invention. Please refer to... Figure 1A and Figure 4 This embodiment is largely the same as the previous embodiment. The difference between this embodiment and the previous embodiment is that in the electronic device 100' of this embodiment, the guide post 136' passes through the bottom plate 132 from the surface of the base plate 132 toward the functional component 120 and is inserted into a plurality of open holes 113 provided on the substrate 112 for the guide post 136' to pass through.

[0072] Figure 5 This is a schematic diagram showing the guide post protruding from the bottom surface of the substrate. Please also refer to... Figure 4 and Figure 5 When the elastic element 134 is compressed and deformed due to the weight of the functional component 120 and the heat dissipation component 160 carried on the base plate 132, the base plate 132 moves toward the substrate 112. At this time, the guide post 136' is driven by the base plate 132 and penetrates into the open hole 113 of the substrate 112 and protrudes further from the bottom surface of the substrate 112 that is relatively far away from the elastic element 134.

[0073] In this embodiment, the elastic element 134 is positioned corresponding to the open hole 113, and the alignment hole 134a overlaps with the open hole 113 in at least a portion of its range. Therefore, the guide post 136' passes through the alignment hole 134a of the elastic element 134 to be inserted into the open hole 113.

[0074] In another embodiment not shown, the elastic element 134 may also be offset from the open hole 113, and the guide post 136' does not need to pass through the elastic element 134, but passes directly through the open hole 113.

[0075] As can be seen from the above, in this configuration where the guide post 136' passes through the base plate 132 from the surface of the base plate 132 toward the functional component 120 and is inserted into the open hole 113, the thickness difference between the double-sided and single-sided solid-state drive modules is eliminated by the guide post 136' protruding more from the bottom surface of the substrate 112. Therefore, there are more options for the placement of the elastic element 134 used to provide upward elastic restoring force to the base plate 132.

[0076] In summary, in the circuit board, functional component module, and electronic device of the present invention, the support component not only provides a good support effect, but also allows the circuit board to adapt to functional components of different thicknesses and weights disposed thereon, so as to continuously adjust the distance between the functional components and the circuit board, thereby making the electronic device convenient to be used with functional components of different thicknesses and weights.

[0077] In addition, the use of thermal pads can increase the contact area between the base plate and functional components and / or between functional components and heat dissipation elements, effectively improving the overall thermal conductivity of electronic devices.

Claims

1. A circuit board, comprising: One substrate; A support assembly adapted to support a functional component, including a base plate and a plurality of elastic elements, wherein the plurality of elastic elements are disposed between the base plate and the substrate to provide support force to the base plate.

2. The circuit board of claim 1, wherein the support assembly further comprises a plurality of guide posts disposed on the surface of one of the substrate and the base plate facing the other, and the plurality of guide posts are located in the corresponding plurality of elastic elements.

3. The circuit board of claim 2, wherein each of the plurality of elastic elements has a pair of alignment holes, and the plurality of guide posts are adapted to be positioned in the corresponding alignment holes.

4. The circuit board as claimed in claim 2, wherein when the plurality of guide posts are disposed on the surface of the base plate facing the substrate, the substrate further comprises a plurality of open holes for the plurality of guide posts to pass through.

5. The circuit board of claim 1, wherein the plurality of elastic elements are sponges.

6. The circuit board of claim 1, wherein the hardness of the plurality of elastic elements is in the range of 10 to 30 degrees.

7. The circuit board of claim 1, wherein the tensile strength of the plurality of elastic elements is in the range of 0.25 to 0.4 MPa.

8. The circuit board of claim 1, wherein the density of the plurality of elastic elements is in the range of 0.1 to 0.2 g / cm³. 3 .

9. A functional component module, comprising: One functional component; A support assembly for carrying the functional component includes a base plate and a plurality of elastic elements, wherein the plurality of elastic elements are disposed on the side of the base plate relatively away from the functional component.

10. The functional component module of claim 9, wherein the plurality of elastic elements are sponges.

11. The functional component module as claimed in claim 9, wherein the hardness range of the plurality of elastic elements is 10 to 30 degrees.

12. The functional component module as claimed in claim 9, wherein the tensile strength of the plurality of elastic elements is in the range of 0.25 to 0.4 MPa.

13. The functional component module of claim 9, wherein the density range of the plurality of elastic elements is 0.1 to 0.2 g / cm³. 3 .

14. The functional component module as claimed in claim 9, wherein a plurality of electronic components are provided on one side of the functional component or a plurality of electronic components are provided on opposite sides of the functional component.

15. An electronic device comprising: A circuit board, including a substrate; A functional component is disposed on the substrate; as well as A support assembly for carrying the functional component includes a base plate and a plurality of elastic elements, wherein the plurality of elastic elements are disposed between the base plate and the substrate.

16. The electronic device of claim 15, wherein the support assembly further comprises a plurality of guide posts disposed on one of the substrate and the base plate facing the other, and the plurality of guide posts are located in corresponding plurality of elastic elements.

17. The electronic device of claim 16, wherein each of the plurality of elastic elements has a pair of alignment holes, and the plurality of guide posts are adapted to be positioned in the corresponding alignment holes.

18. The electronic device of claim 16, wherein when the plurality of the guide posts are disposed on the surface of the base plate facing the substrate, the substrate further has a plurality of open holes for the plurality of the guide posts to pass through.

19. The electronic device of claim 15, wherein the plurality of elastic elements are sponges.

20. The electronic device of claim 15, wherein the hardness of the plurality of elastic elements is in the range of 10 to 30 degrees.

21. The electronic device of claim 15, wherein the tensile strength of the plurality of elastic elements is in the range of 0.25 to 0.4 MPa.

22. The electronic device of claim 15, wherein the density of the plurality of elastic elements is in the range of 0.1 to 0.2 g / cm³. 3 .

23. The electronic device of claim 15, wherein a plurality of electronic components are provided on one side of the functional component or a plurality of electronic components are provided on opposite sides of the functional component.

24. The electronic device of claim 15 further includes a heat dissipation element disposed on the side of the functional component that is relatively far from the base plate.

25. The electronic device of claim 24, further comprising a thermally conductive pad disposed between the functional component and the heat dissipation element.

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