An efficient power supply architecture

Abstract

The application proposes a high-efficiency power supply architecture, which sets the bus converter and the voltage regulation module on the same side of the XPU substrate, that is, the side opposite to the XPU; by shortening the power transmission path between the voltage regulation module and the XPU and the power transmission path between the bus converter and the voltage regulation module, the loss on the transmission path is reduced. On the other hand, by integrating the passive element with the bus converter, or setting the voltage regulation module and the bus converter on an intermediate substrate, the assembly process of the system is simplified.

Description

Technical Field

[0001] This invention belongs to the field of high-frequency power supply technology, and in particular relates to a high-efficiency power supply architecture. Background Technology

[0002] In recent years, with the development of technologies such as data centers, artificial intelligence, and supercomputers, more and more powerful ASICs have been applied, such as CPUs, GPUs, machine learning accelerators, network switches, and servers. These consume large amounts of current, such as thousands of amperes. To meet the requirements of rapid response to load dynamics, the current industry practice is to use a two-stage converter: a front-end bus converter (converting a 48V bus to a 12V bus or even lower) + a rear-end voltage regulation module to achieve the 48V to 1V voltage conversion. The rear-end voltage regulation module is vertically aligned with the XPU to minimize the power transmission path between the voltage regulation module and the XPU, thereby reducing parasitic impedance and power loss along the power transmission path. However, due to space limitations and heat dissipation requirements, the bus converter is usually located on the same side of the smart card motherboard as the XPU, resulting in an excessively long power transmission path between the bus converter and the voltage regulation module.

[0003] Therefore, how to develop an efficient power supply architecture to solve the problems faced by existing technologies is an urgent issue that needs to be addressed in this field. Summary of the Invention

[0004] In view of this, one of the objectives of the present invention is to provide a high-efficiency power supply architecture, including an XPU, an XPU substrate, a smart card motherboard, a voltage regulation module, and a bus converter; the XPU is disposed on the top surface of the XPU substrate, and the bottom surface of the XPU substrate is attached to, fixed to, and electrically connected to the top surface of the smart card motherboard; the bus converter and the voltage regulation module are both disposed below the XPU; the voltage regulation module is vertically corresponding to the XPU; the bus converter is electrically connected to the voltage regulation module; and the voltage regulation module is electrically connected to the XPU.

[0005] Preferably, the bus converter is disposed on the bottom surface of the smart card motherboard.

[0006] Preferably, the bus converter and the projection of the XPU substrate on the bottom surface of the smart card motherboard at least partially overlap.

[0007] Preferably, the bus converter and the voltage regulation module are arranged adjacent to each other, and the bus converter and the voltage regulation module are electrically connected through a smart card motherboard.

[0008] Preferably, the voltage regulation module is embedded in the smart card motherboard, and the bottom surface of the voltage regulation module is inside the smart card motherboard, flush with the bottom surface of the smart card motherboard, or protrudes from the smart card motherboard.

[0009] Preferably, the voltage regulation module is directly electrically connected to the XPU substrate.

[0010] Preferably, the bus converter and the voltage regulation module are arranged vertically and correspondingly, and the bus converter and the voltage regulation module are directly electrically connected or electrically connected through the smart card motherboard.

[0011] Preferably, the voltage regulation module is disposed between the XPU and the smart card motherboard; the bus converter is disposed perpendicularly to the voltage regulation module.

[0012] Preferably, the voltage regulation module is disposed between the XPU and the XPU substrate, and the voltage regulation module and the XPU are directly electrically connected.

[0013] Preferably, the voltage regulation module is disposed between the XPU substrate and the smart card motherboard, and the voltage regulation module and the XPU are electrically connected through the XPU substrate; the bus converter is electrically connected to the voltage regulation module through the smart card motherboard.

[0014] Preferably, both the voltage regulation module and the bus converter include a stepped structure, and the two stepped structures are arranged vertically opposite each other.

[0015] Preferably, the two stepped structures are fitted together, and the voltage regulation module and the bus converter are electrically connected through the two stepped structures.

[0016] Preferably, it further includes a front heat dissipation device and a rear heat dissipation device; the front heat dissipation device is thermally connected to the XPU; the rear heat dissipation device is thermally connected to the bus converter and / or voltage regulation module.

[0017] Preferably, the voltage regulation module is thermally connected to a metal block and a rear heat dissipation device.

[0018] Preferably, the system further includes an intermediate substrate, the top surface of which is attached to, fixed to, and electrically connected to the bottom surface of the smart card motherboard; the voltage adjustment module is disposed on the bottom surface of the intermediate substrate; the voltage adjustment module is electrically connected to the XPU through the intermediate substrate, the smart card motherboard, and the XPU substrate.

[0019] Preferably, the bus converter is disposed on the bottom surface of the intermediate substrate, and the bus converter is electrically connected to the smart card motherboard through the intermediate substrate; the bus converter and the voltage regulation module are electrically connected through the intermediate substrate.

[0020] Preferably, the bus converter is a bus converter assembly, and the voltage regulation module is a voltage regulation module assembly; the bus converter assembly and the voltage regulation module assembly are arranged adjacent to each other and electrically connected through an intermediate substrate.

[0021] Preferably, the top surface of the bus converter is provided with a hollowed-out groove, which is used to house passive components.

[0022] Preferably, it further includes a passive element, which is integrated with the bus converter; the passive element is disposed adjacent to the top surface of the bus converter, and the pins of the passive element are disposed on the top surface of the bus converter.

[0023] Preferably, the bus converter is disposed on the bottom surface of the smart card motherboard; the bus converter is electrically connected to the voltage regulation module through the smart card motherboard and the intermediate substrate.

[0024] The beneficial effects of this invention are:

[0025] This invention proposes an efficient power supply architecture that places the bus converter and voltage regulation module on the same side of the XPU substrate, that is, the side opposite to the XPU. By shortening the power transmission path between the voltage regulation module and the XPU and between the bus converter and the voltage regulation module, the losses on the transmission path are reduced.

[0026] On the other hand, by integrating passive components with the bus converter, or by placing the voltage regulation module and the bus converter on an intermediate substrate, the system assembly process is simplified. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 Existing technologies for power supply architecture;

[0029] Figures 2A to 2E It is a high-efficiency power supply architecture;

[0030] Figure 3 For another efficient power supply architecture;

[0031] Figures 4A to 4C For another efficient power supply architecture;

[0032] Figure 5A and Figure 5B This is a high-efficiency power supply architecture that employs an ultra-thin voltage regulation module;

[0033] Figure 6A and Figure 6B This is a partial structure of a high-efficiency power supply device. Detailed Implementation

[0034] One of the core aspects of this invention is to provide a high-efficiency power supply architecture.

[0035] Figure 1 The diagram shows the existing power supply architecture, in which the XPU20 is disposed on the top surface of the XPU substrate 11. The bottom surface of the XPU substrate 11 and the top surface of the smart card motherboard 10 are fixed and electrically connected by a conductive connection part 110, wherein a solder ball is preferred for the conductive connection part. The bus converter 41 is disposed on the top surface of the smart card motherboard 10, i.e., on the same side as the XPU, and does not overlap with the XPU substrate 11. The voltage regulation module 40 is disposed on the bottom surface of the smart card motherboard 10, and the voltage regulation module 40 is perpendicularly corresponding to the XPU20, i.e., the projections of the voltage regulation module 40 and the XPU20 on the top surface of the smart card motherboard at least partially overlap. In this power supply architecture, the bus converter 41 and the XPU20 share a front heat dissipation device 30; the top surface of the voltage regulation module 40 is attached and fixed to the bottom surface of the smart card motherboard 10 and electrically connected, and a rear heat dissipation device 31 is disposed on its bottom surface; the rear heat dissipation device 31 is used to dissipate heat from the voltage regulation module 40. In this embodiment, the power transmission path L1 between the bus converter 41 and the voltage regulation module 40 is as follows: Figure 1 In the diagram, Lh and Ll represent the thickness of the smart card motherboard 10 and the horizontal distance between the bus converter 41 and the voltage regulation module 40. Therefore, in the prior art, the power transmission path L1 is relatively long, resulting in significant power losses along it.

[0036] Example 1

[0037] like Figures 2A to 2D As shown, the bus converter 41 is moved from the top surface of the smart card motherboard 10 to the bottom surface, that is, it is placed together with the voltage regulation module 40 on the bottom surface of the smart card motherboard 10. Figure 2A As shown, the bus converter 41 and the XPU substrate 11 do not overlap in the vertical direction, thus not occupying the space required for the output capacitor around the voltage regulation module 40. Therefore, the power transmission path between the bus converter 41 and the voltage regulation module 40 is L1. This reduces the power transmission path and the losses along the transmission path. On the other hand, the bus converter 41 and the voltage regulation module 40 share the rear heat dissipation device 31, which can reduce the heat dissipation pressure on the front heat dissipation device 30. Figure 2B In another embodiment, the bus converter 41 and the XPU substrate 11 at least partially overlap in the vertical direction, occupying part of the space of the output capacitor around the voltage regulation module 40, but further shortening the power transmission path between the bus converter 41 and the XPU 20. Furthermore, the bus converter 41 and the XPU 20 can be arranged adjacent to each other, achieving the shortest power transmission path between them.

[0038] The high-efficiency power supply architecture also includes other chips 21, which are disposed on the top surface of the XPU substrate 11 and around the XPU 20. These chips 21 are thermally connected to the front heat sink 30.

[0039] Figure 2C Another implementation of Embodiment 1 is shown. Since the smart card motherboard 10 may include multiple power rails, each power rail requires multiple filter capacitors or other passive components to be disposed on the bottom surface of the smart card motherboard 10. In this embodiment, a slot 410 is provided on the top surface of the bus converter 41. The slot 410 is used to accommodate passive components 411, i.e., multiple filter capacitors or other passive components. The shape and depth of the slot 410 can be set according to actual needs and are not limited. In another embodiment, such as... Figure 2D As shown, the passive element 411 can be integrated into the bus converter 41. The passive element 411 is located near the top surface of the bus converter 41, and the pins of the passive element 411 are exposed on the top surface of the bus converter. This structure can shorten the power transmission path and solve the problem of space for the passive element. On the other hand, it also simplifies the system assembly process and improves the working reliability of the bus converter.

[0040] Figure 2E Another efficient power supply architecture is shown, in which the voltage regulation module 40 and the bus converter 41 are both fixed and electrically connected to the smart card motherboard 10, and are electrically connected through the smart card motherboard 10; and both the voltage regulation module 40 and the bus converter 41 are thermally connected to the rear heat sink 31. The voltage regulation module 40 is vertically aligned with the XPU 20. Both the voltage regulation module 40 and the bus converter 41 include stepped portions, with two stepped portions at least partially overlapping vertically, which can reduce the area or space occupied by the voltage regulation module and the bus converter. The two stepped portions can also be fitted and / or electrically connected, further reducing the power transmission path and power transmission impedance between the bus converter and the voltage regulation module.

[0041] Example 2

[0042] Based on all the embodiments shown in Example 1, an intermediate substrate 50 is added. Figure 3Taking this example, a bus converter 41 and a voltage regulation module 40 are disposed on the bottom surface of the intermediate substrate 50. This allows the bus converter 41 and the voltage regulation module 40 to be fixed and transmit power through the intermediate substrate 50, thereby reducing the power transmission impedance between them. The top surface of the intermediate substrate 50 is fixed and electrically connected to the bottom surface of the smart card motherboard 10. The output power of the voltage regulation module 40 is transmitted to the XPU 20 via the intermediate substrate 50 and the smart card motherboard 10. In this embodiment, the bus converter 41 and the voltage regulation module 40 can be pre-positioned on the intermediate substrate 50 and then assembled as a whole with the smart card motherboard 10, further simplifying the assembly process on the system. In other embodiments, only the voltage regulation module 40 can be disposed on the bottom surface of the intermediate substrate 50, and the bus converter 41 can be disposed on the bottom surface of the smart card motherboard 10; the bus converter 41 is electrically connected to the voltage regulation module 40 through the smart card motherboard 10 and the intermediate substrate 50.

[0043] Example 3

[0044] Figures 4A to 4C As shown, another efficient power supply architecture is illustrated, in which the voltage regulation module 40 is embedded within the smart card motherboard 10, allowing the XPU substrate 11 to be directly electrically connected to the voltage regulation module 40 via the conductive connection portion 110, further reducing the distance between the voltage regulation module 40 and the XPU 20. More specifically, as... Figure 4A As shown, the bottom surface of the voltage regulation module 40 is exposed on the bottom surface of the smart card motherboard 10; optionally, the bottom surface of the voltage regulation module 40 can be embedded in the smart card motherboard 10, flush with the bottom surface of the smart card motherboard 10, or protrude from the bottom surface of the smart card motherboard 10. The bus converter 41 is disposed on the bottom surface of the smart card motherboard 10 and vertically below the XPU substrate 11; however, the projections of the bus converter 41 and the voltage regulation module 40 on the bottom surface of the smart card motherboard do not overlap; furthermore, the bottom surface of the bus converter 41 is thermally connected to the rear heat dissipation device 31; the bottom surface of the voltage regulation module 40 can be attached to the rear heat dissipation device via a metal block. Figure 4B As shown, the bottom surface of the voltage regulation module 40 protrudes from the bottom surface of the smart card motherboard 10, and the voltage regulation module 40 is thermally connected to the rear heat dissipation device 31 via multiple metal pillars 42. In another embodiment, as... Figure 4C As shown, the bottom surface of the voltage regulation module 40 and the top surface of the bus converter 41 are fixed and thermally connected. The bottom surface of the bus converter 41 is thermally connected to the rear heat dissipation device 31. Figure 4C The examples shown are for illustrative purposes only and are not intended to be limiting.

[0045] Example 4

[0046] In this embodiment, an ultra-thin voltage regulation module 40 is used, such as... Figure 5A As shown, the voltage regulation module 40 is disposed between the XPU substrate 11 and the smart card motherboard 10, with the voltage regulation module 40 and the XPU being vertically aligned. The bus converter 41 is disposed on the bottom surface of the smart card motherboard 10, and is vertically aligned with the voltage regulation module 40. The bottom surface of the bus converter 41 is thermally connected to the rear heat dissipation device 31. Therefore, the shortest power transmission path between the voltage regulation module 40 and the XPU 20, as well as between the bus converter 41 and the voltage regulation module 40, can be obtained, further reducing power loss on the transmission path and meeting the dynamic performance requirements of the XPU 20.

[0047] Figure 5B Another embodiment is shown, in which the voltage regulation module 40 is disposed between the XPU 20 and the XPU substrate 11, and the voltage regulation module 40 and the XPU 20 are directly electrically connected, further shortening the power transmission path between the voltage regulation module 40 and the XPU 20, reducing losses in the transmission path, and improving dynamic performance. The bus converter 41 is disposed on the bottom surface of the smart card motherboard 10 and is thermally connected to the rear heat dissipation device 31; the bus converter 41 is vertically corresponding to the voltage regulation module 40, so that the power transmission path between the bus converter 41 and the voltage regulation module 40 is minimized.

[0048] In relation to the high-efficiency power supply architecture shown in Embodiment 2, the present invention also illustrates a partial structure of a high-efficiency power supply device, such as... Figure 6A and Figure 6B As shown. Figure 6A A top view schematic diagram of the high-efficiency power supply device is shown. Figure 6B A three-dimensional schematic diagram of the high-efficiency power supply device is shown. The voltage regulation module assembly 401 and the bus converter assembly 411 are adjacently disposed on the same surface of an intermediate substrate 50, and are electrically connected through the intermediate substrate 50 to achieve the 54V to 0.8V conversion requirement. The voltage regulation module assembly 401 includes multiple voltage regulation modules to convert a 3.3V / 1.8V input voltage to a 0.8V output voltage. The bus converter assembly 411 may also include multiple bus converters to convert a 54V input voltage to a 3.3V / 1.8V output voltage. Multiple ball grid arrays (BGAs) are disposed on the bottom surface of the intermediate substrate 50. These BGAs include the positive input terminal Vin+ of the bus converter 41, the positive output terminal Vo+ of the voltage regulation module 40, the ground terminal GND, a sampling signal terminal, and a control signal terminal. Detailed BGA layouts can be arranged according to proximity principles and are not limited thereto.

[0049] The power module described in the above embodiments can also be part of an electronic device, as long as it meets the technical features and benefits disclosed in this invention; the technical features in the above embodiments can be combined and used according to requirements to obtain corresponding technical benefits.

[0050] The terms "equal to," "identical to," or "equal to" disclosed in this invention must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" is defined as the angle between two line segments or lines being less than or equal to 45 degrees. "Perpendicular" is defined as the angle between two line segments or lines being within the range of [60, 120] degrees. The definition of "phase misalignment" also needs to consider the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%.

[0051] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0052] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-efficiency power supply architecture, characterized in that, The system includes an XPU, an XPU substrate, a smart card motherboard, a voltage regulation module, and a bus converter. The XPU is disposed on the top surface of the XPU substrate, and the bottom surface of the XPU substrate is attached to, fixed to, and electrically connected to the top surface of the smart card motherboard. The bus converter and the voltage regulation module are both disposed below the XPU. The voltage regulation module is vertically aligned with the XPU. The bus converter is electrically connected to the voltage regulation module, and the voltage regulation module is electrically connected to the XPU.

2. The high-efficiency power supply architecture according to claim 1, characterized in that, The bus converter is located on the bottom surface of the smart card motherboard.

3. The high-efficiency power supply architecture according to claim 2, characterized in that, The bus converter and the XPU substrate project onto the bottom surface of the smart card motherboard at least partially overlap.

4. The high-efficiency power supply architecture according to claim 3, characterized in that, The bus converter and the voltage regulation module are arranged adjacent to each other, and the bus converter and the voltage regulation module are electrically connected through a smart card motherboard.

5. The high-efficiency power supply architecture according to claim 2, characterized in that, The voltage regulation module is embedded in the smart card motherboard, and the bottom surface of the voltage regulation module is inside the smart card motherboard, flush with the bottom surface of the smart card motherboard, or protrudes from the smart card motherboard.

6. The high-efficiency power supply architecture according to claim 5, characterized in that, The voltage regulation module is directly electrically connected to the XPU substrate.

7. The high-efficiency power supply architecture according to claim 5, characterized in that, The bus converter is arranged vertically opposite to the voltage regulation module, and the bus converter and the voltage regulation module are directly electrically connected or electrically connected through the smart card motherboard.

8. The high-efficiency power supply architecture according to claim 2, characterized in that, The voltage regulation module is located between the XPU and the smart card motherboard; the bus converter is vertically corresponding to the voltage regulation module.

9. The high-efficiency power supply architecture according to claim 2, characterized in that, The voltage regulation module is disposed between the XPU and the XPU substrate, and the voltage regulation module is directly electrically connected to the XPU.

10. The high-efficiency power supply architecture according to claim 8, characterized in that, The voltage regulation module is disposed between the XPU substrate and the smart card motherboard, and the voltage regulation module and the XPU are electrically connected through the XPU substrate; the bus converter is electrically connected to the voltage regulation module through the smart card motherboard.

11. The high-efficiency power supply architecture according to claim 2, characterized in that, Both the voltage regulation module and the bus converter include stepped structures, and the two stepped structures are arranged vertically and correspondingly.

12. The high-efficiency power supply architecture according to claim 11, characterized in that, The two stepped structures are fitted together, and the voltage regulation module and the bus converter are electrically connected through the two stepped structures.

13. The high-efficiency power supply structure according to claim 1, characterized in that, It also includes a front heat dissipation device and a rear heat dissipation device; the front heat dissipation device is thermally connected to the XPU; the rear heat dissipation device is thermally connected to the bus converter and / or voltage regulation module.

14. The high-efficiency power supply structure according to claim 13, characterized in that, The voltage regulation module is thermally connected to a metal block and a heat dissipation device on the back.

15. The high-efficiency power supply structure according to claim 1, characterized in that, It also includes an intermediate substrate, the top surface of which is attached to, fixed to, and electrically connected to the bottom surface of the smart card motherboard; the voltage adjustment module is disposed on the bottom surface of the intermediate substrate; the voltage adjustment module is electrically connected to the XPU through the intermediate substrate, the smart card motherboard, and the XPU substrate.

16. The high-efficiency power supply structure according to claim 15, characterized in that, The bus converter is disposed on the bottom surface of the intermediate substrate, and the bus converter is electrically connected to the smart card motherboard through the intermediate substrate; the bus converter and the voltage regulation module are electrically connected through the intermediate substrate.

17. The high-efficiency power supply structure according to claim 16, characterized in that, The bus converter is a bus converter assembly, and the voltage regulation module is a voltage regulation module assembly; the bus converter assembly and the voltage regulation module assembly are arranged adjacent to each other and are electrically connected through an intermediate substrate.

18. The high-efficiency power supply structure according to claim 1, characterized in that, The top surface of the bus converter is provided with a hollowed-out groove, which is used to house passive components.

19. The high-efficiency power supply structure according to claim 1, characterized in that, It also includes a passive element, which is integrated with the bus converter; the passive element is disposed adjacent to the top surface of the bus converter, and the pins of the passive element are disposed on the top surface of the bus converter.

20. The high-efficiency power supply structure according to claim 15, characterized in that, The bus converter is located on the bottom surface of the smart card motherboard; the bus converter is electrically connected to the voltage regulation module through the smart card motherboard and the intermediate substrate.

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