Embedded circuit board and method of manufacturing the same

Abstract

The application discloses an embedded circuit board and a manufacturing method thereof. The embedded circuit board comprises a base layer, a capacitor, an electronic component, a first conductive structure and a first circuit layer. The base layer is provided with a groove, the groove penetrates through at least part of the base layer, the capacitor, the electronic component and the first conductive structure are located in the groove, the first conductive structure is located between the capacitor and the electronic component, a metal piece is arranged on the surface of the electronic component facing the first conductive structure, the first conductive structure is in contact and electrically connected with the metal piece and the capacitor, the first circuit layer is located on the opposite surfaces of the base layer, and the first conductive structure is electrically connected with the first circuit layer.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to an embedded circuit board and its manufacturing method. Background Technology

[0002] Embedded component technology represents a significant innovation in traditional circuit board manufacturing. This technology achieves deep integration between components and the circuit board by directly embedding electronic components inside the circuit board substrate. This integration method not only significantly improves the integration density and reliability of the circuit board but also effectively reduces production costs and signal transmission delays. A key challenge in the process of embedding electronic components into the circuit board substrate is ensuring effective conductivity between them.

[0003] While traditional metal wire connections are stable and reliable, their limitations are becoming increasingly apparent with the trend towards miniaturization and integration. How to achieve signal transmission between components without adding extra wiring has become a pressing problem to solve. Summary of the Invention

[0004] In view of this, this application provides an embedded circuit board that can solve the above-mentioned technical problems and a method for manufacturing the same.

[0005] The first aspect of this application provides an embedded circuit board, comprising:

[0006] A base layer, wherein the base layer is provided with a groove, the groove penetrating at least a portion of the base layer;

[0007] A capacitor, wherein the capacitor is located within the groove;

[0008] An electronic component, wherein the electronic component is located within the groove;

[0009] A first conductive structure is located within the groove and between the capacitor and the electronic component. The electronic component has a metal part on its surface facing the first conductive structure. The first conductive structure is electrically connected to the metal part and the capacitor.

[0010] A first circuit layer is located on two opposite surfaces of the base layer, and the first conductive structure is electrically connected to the first circuit layer.

[0011] The second aspect of this application provides a method for manufacturing an embedded circuit board, comprising the following steps:

[0012] A base layer is provided, and a groove is formed in the base layer that penetrates at least a portion of the base layer;

[0013] A capacitor and electronic components are placed in the groove, and encapsulating adhesive is filled into the groove to form an adhesive layer. The adhesive layer fills the gap between the capacitor, the electronic components and the groove. The electronic components have metal parts on their surface facing the capacitor.

[0014] Metal layers are covered on opposite sides of the base layer, and circuits are fabricated on the metal layers to form a first circuit layer. The first circuit layer includes a metal pad, and the projection of the metal pad along the thickness direction of the base layer is located between the capacitor and the electronic component.

[0015] A first through hole is formed on the surface of the adhesive layer. The first through hole penetrates the adhesive layer located between the capacitor and the electronic component, and exposes the capacitor and the metal part from the first through hole and exposes the metal pad at the bottom of the first through hole.

[0016] The first through hole is electroplated to form a first conductive structure inside the first through hole. The first conductive structure is connected to the metal pad, the metal part, and the capacitor.

[0017] The embedded circuit board provided in this application has a first conductive structure between the side of the capacitor with metal parts and the electronic components. The signal transmission between the capacitor and the electronic components is realized through the first conductive structure without the need for additional wiring, thereby achieving miniaturization and integration of the circuit board. Attached Figure Description

[0018] Figure 1 A cross-sectional schematic diagram of a base layer containing embedded capacitors and electronic components, provided for one embodiment of this application.

[0019] Figure 2 In order to be in Figure 1 The diagram shows a cross-sectional view of the first line layer formed on the base layer.

[0020] Figure 3 This is a cross-sectional schematic diagram of an embedded circuit board provided in one embodiment of this application.

[0021] Figure 4 A cross-sectional schematic diagram of an embedded circuit board provided for another embodiment of this application.

[0022] Explanation of main component symbols

[0023]

[0024] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the features in the embodiments of this application can be combined with each other.

[0026] The following description sets forth numerous specific details to provide a thorough understanding of the embodiments of this application. The described implementations are only a portion, not all, of the embodiments described herein. All other implementations obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of the embodiments of this application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application.

[0028] Please see Figures 1 to 4 This application provides a method for manufacturing an embedded circuit board 100, including the following steps:

[0029] S1: Please refer to Figure 1 A base layer 10 is provided, and a groove 11 is formed in the base layer 10 that penetrates at least part of the base layer 10. A support plate 15 is provided at the bottom of the groove 11 to support the base layer 10.

[0030] In this embodiment, the material of the base layer 10 can be selected from, but is not limited to, polyimide, polyethylene, and polycarbonate. The depth of the groove 11 can be set according to the actual size of the capacitor 12 and electronic component 13 embedded within it. The groove 11 can penetrate part or all of the base layer 10. The support plate 15 provides support for the base layer 10, reducing the probability that the portion of the base layer 10 corresponding to the bottom of the groove 11 will collapse due to its thinness and inability to support the weight of the embedded components. If the groove 11 is a through groove, that is, the groove 11 penetrates the base layer 10, the support plate 15 seals one end of the groove 11 to allow for subsequent filling of the groove 11 with encapsulating adhesive.

[0031] S2: Please refer to Figure 1A capacitor 12 and an electronic component 13 are placed in a recess 11, and encapsulating adhesive is filled into the recess 11 to form an adhesive layer 14. The adhesive layer 14 fills the gap between the capacitor 12, the electronic component 13, and the recess 11. A metal part 20 is provided on the surface of the electronic component 13 facing the capacitor 12. The adhesive layer 14 is used to fix the capacitor 12 and the electronic component 13 and to maintain a distance between the capacitor 12 and the electronic component 13, facilitating the subsequent provision of vias and conductive structures between the capacitor 12 and the electronic component 13. The capacitor 12 includes an insulating dielectric 121 and metal plates 122 located on opposite surfaces of the insulating dielectric 121.

[0032] In some embodiments, the metal part 20 on the surface of the electronic component 13 can be formed by electroplating or laminating metal. The material of the metal part 20 can be a conductive metal such as copper or gold.

[0033] In some embodiments, the metal element 20 covers the side surface of the electronic component 13 and the two opposing surfaces connected to the side surface. The metal element 20 covers the upper and lower surfaces of the electronic component 13 and the side surface connected to these surfaces, further enhancing the connection between the electronic component 13 and the subsequent metal pad 311 (see figure). Figure 3 ) and the first conductive structure 33 (refer to) Figure 3 Electrical conductivity. In this embodiment, the metal part 20 covers part of the upper and lower surfaces of the electronic component 13, that is, the metal part 20 does not completely cover the upper and lower surfaces of the electronic component 13.

[0034] S3: Please refer to Figure 1 and Figure 2 Remove the support plate 15.

[0035] S4: Please refer to Figure 2 A metal layer is applied to both sides of the base layer 10, and circuitry is fabricated on the metal layer to form a first circuit layer 31. The first circuit layer 31 includes a metal pad 311, the projection of which along the thickness direction of the base layer 10 is located between the capacitor 12 and the electronic component 13. In this embodiment, the metal layer is made of copper. The metal pad 311 is placed at the bottom of the gap between the capacitor 12 and the electronic component 13 to facilitate the subsequent fabrication of the first via 32 using a laser (see figure). Figure 3 When the laser hits the metal pad 311, the drilling can be stopped, allowing for precise control of the drilling depth.

[0036] S5: Please refer to Figure 1 and Figure 3 A first through hole 32 is formed on the surface of the adhesive layer 14. The first through hole 32 penetrates the adhesive layer 14 located between the capacitor 12 and the electronic component 13, and exposes the capacitor 12 and the metal part 20 from the first through hole 32 and exposes the metal pad 311 at the bottom of the first through hole 32.

[0037] S6: Please refer to Figure 3 Electroplating is performed on the first through-hole 32 to form a first conductive structure 33 within the first through-hole 32. The first conductive structure 33 is connected to the metal pad 311, the metal part 20, and the capacitor 12. In this embodiment, the first conductive structure 33 is specifically a copper conductive pillar.

[0038] S7: Please refer to Figure 4 A first dielectric layer 411 and a second circuit layer 412 are formed on the surface of the first circuit layer 31 away from the base layer 10, and the second circuit layer 412 covers the surface of the first dielectric layer 411 away from the first circuit layer 31.

[0039] S8: Please refer to Figure 4 A second via 413 is formed on the surface of the second circuit layer 412 and / or the first dielectric layer 411. The second via 413 penetrates the second circuit layer 412 and / or the first dielectric layer 411, and a metal pad 311 is exposed at least part of the bottom of the second via 413.

[0040] S9: Please refer to Figure 4 The second via 413 is electroplated to form a second conductive structure 414 within the second via 413, and the second conductive structure 414 is electrically connected to the metal pad 311. In some other embodiments, the electronic component 13 is exposed from the bottom of a portion of the second via 413, and the second conductive structure 414 is electrically connected to the electronic component 13.

[0041] S10: Please refer to Figure 4 A second dielectric layer 421 and a third dielectric layer 422 are formed on the surface of the second dielectric layer 412 that is away from the first dielectric layer 411, and the third dielectric layer 422 covers the surface of the second dielectric layer 421 that is away from the second dielectric layer 412.

[0042] S11: Please refer to Figure 4 A third via 423 is formed on the surface of the third circuit layer 422 and / or the second dielectric layer 421, and the third via 423 penetrates the third circuit layer 422 and the second dielectric layer 421. The third via 423 is electroplated to form a third conductive structure 424, and the third conductive structure 424 is electrically connected to the second circuit layer 412.

[0043] S12: Please refer to Figure 4 A third dielectric layer 431 and a fourth dielectric layer 432 are formed on the surface of the third dielectric layer 422 that is away from the second dielectric layer 421, and the fourth dielectric layer 432 covers the surface of the third dielectric layer 431 that is away from the third dielectric layer 422.

[0044] S13: Please refer to Figure 4A fourth via 433 is formed on the surface of the fourth circuit layer 432, and the fourth via 433 penetrates the fourth circuit layer 432 and the third dielectric layer 431. The fourth via 433 is electroplated to form a fourth conductive structure 434, and the fourth conductive structure 434 is electrically connected to the third circuit layer 422 and / or the third conductive structure 424.

[0045] S14: Please refer to Figure 4 A protective layer 50 is covered on the surface of the third dielectric layer 431 exposed on the fourth circuit layer 432, and the protective layer 50 covers the surface of the third dielectric layer 431 opposite to the third circuit layer 422.

[0046] Please see Figure 4 This application also provides an embedded circuit board 100, which includes a base layer 10, a capacitor 12, an electronic component 13, a first conductive structure 33, and a first circuit layer 31. The base layer 10 has a groove 11 that penetrates at least a portion of the base layer 10. The capacitor 12, electronic component 13, and first conductive structure 33 are located within the groove 11, with the first conductive structure 33 located between the capacitor 12 and the electronic component 13. A metal element 20 is provided on the surface of the electronic component 13 facing the first conductive structure 33, and the first conductive structure 33 is electrically connected to the metal element 20 and the capacitor 12. The first circuit layer 31 is located on opposite surfaces of the base layer 10, and the first conductive structure 33 is electrically connected to the first circuit layer 31. The capacitor 12 includes an insulating dielectric 121 and metal plates 122 located on opposite surfaces of the insulating dielectric 121. Since the capacitor 12 contains a metal plate 122, and the metal plate 122 is in contact with the first conductive structure 33, the first conductive structure 33 can be electrically connected to both the metal element 20 and the metal plate 122 of the capacitor 12. The capacitor 12 enables electrical conduction between the electronic component 13 and the circuit layer, eliminating the need for additional connection lines and improving the stability and reliability of electrical conduction.

[0047] In some embodiments, the embedded circuit board 100 may include a plurality of capacitors 12, a plurality of electronic components 13, and a plurality of first conductive structures 33. Each first conductive structure 33 is electrically connected to its corresponding capacitor 12 and electronic component 13. Each capacitor 12 and each electronic component 13 is electrically connected to a first circuit layer 31 through a corresponding first conductive structure 33. The plurality of capacitors 12 may be arranged side by side, for example, the projections of the plurality of capacitors 12 along the direction perpendicular to the thickness of the embedded circuit board 100 may overlap each other.

[0048] In some embodiments, the first circuit layer 31 includes a metal pad 311, which is electrically connected to the first conductive structure 33. The projection of the metal pad 311 along the thickness direction of the embedded circuit board 100 is located between the capacitor 12 and the electronic component 13. The metal pad 311 is located at the bottom of the gap between the capacitor 12 and the electronic component 13, facilitating the electrical connection between the first conductive structure 33 and the capacitor and electronic component 13, and improving the stability and reliability of the electrical connection between them.

[0049] In some embodiments, the metal component 20 covers the side surface of the electronic component 13 and the two opposing surfaces connected to the side surface. The metal component 20 covers the upper and lower surfaces of the electronic component 13 and the side surface connected to these upper and lower surfaces, further improving the electrical conductivity between the electronic component 13 and the metal pad 311 and the first conductive structure 33. In this embodiment, the metal component 20 covers only a portion of the upper and lower surfaces of the electronic component 13, meaning the metal component 20 does not completely cover the upper and lower surfaces of the electronic component 13.

[0050] In some embodiments, the embedded circuit board 100 further includes an adhesive layer 14, which fills the gap between the capacitor 12, the electronic component 13, and the recess 11. The adhesive layer 14 is used to fix the capacitor 12 and the electronic component 13, reducing the probability of displacement of the two components within the recess 11 due to external forces, thereby affecting the circuit board circuit contact.

[0051] In some embodiments, the embedded circuit board 100 further includes an add-on structure 40 located on the surface of the first wiring layer 31 facing away from the base layer 10. The add-on structure 40 includes a first add-on wiring layer 41, which includes a first dielectric layer 411, a second wiring layer 412, and a second conductive structure 414. The first dielectric layer 411 is located on the surface of the first wiring layer 31 facing away from the base layer 10, and the second wiring layer 412 is located on the surface of the first dielectric layer 411 facing away from the first wiring layer 31. The second conductive structure 414 penetrates at least the first dielectric layer 411 and is electrically connected to at least one of the first conductive structure 33, the first wiring layer 31, and the electronic component 13.

[0052] In some embodiments, the add-on structure 40 further includes a second add-on circuit layer 42, which includes a second dielectric layer 421, a third circuit layer 422, and a third conductive structure 424. The second dielectric layer 421 is located on the surface of the second circuit layer 412 opposite to the first dielectric layer 411, and the third circuit layer 422 is located on the surface of the second dielectric layer 421 opposite to the second circuit layer 412. The third conductive structure 424 penetrates the third circuit layer 422 and the second dielectric layer 421, and is electrically connected to the second conductive structure 414 and / or the second circuit layer 412. The third conductive structure 424 serves to conduct electricity and dissipate heat, allowing the heat generated during the operation of the embedded components to be dissipated from the circuit board in a timely manner.

[0053] In some embodiments, one end of the first conductive structure 33 is electrically connected to the second conductive structure 414, and the second conductive structure 414 is electrically connected to the second circuit layer 412. Since both sides of the first conductive structure 33 are simultaneously electrically connected to the metal plate 122 of the metal component 20 and the capacitor 12, the first conductive structure 33 can achieve electrical conduction between the electronic component 13, the capacitor 12, the first circuit layer 31, and the second circuit layer 412. The other end of the first conductive structure 33 is connected to the metal pad 311, the metal pad 311 is connected to another second conductive structure 414, and the second conductive structure 414 is connected to a third conductive structure 424, thereby forming a heat-conducting channel to conduct the heat generated by the electronic component 13 and the capacitor 12 to the outside of the embedded circuit board 100 for heat dissipation.

[0054] In some embodiments, the diameter of the first conductive structure 33 can be 100μm to 200μm, and the diameter of the second conductive structure 414 used for heat dissipation can be 150μm to 300μm.

[0055] In some embodiments, the add-on structure 40 further includes a third add-on circuit layer 43, which includes a third dielectric layer 431, a fourth circuit layer 432, and a fourth conductive structure 434. The third dielectric layer 431 is located on the surface of the third circuit layer 422 opposite to the second dielectric layer 421, and the fourth circuit layer 432 is located on the surface of the third dielectric layer 431 opposite to the third circuit layer 422. The fourth conductive structure 434 penetrates the fourth circuit layer 432 and the third dielectric layer 431, and is electrically connected to at least one of the third conductive structure 424, the third circuit layer 422, and the fourth circuit layer 432. The fourth conductive structure 434 serves to conduct electricity and dissipate heat; when the fourth conductive structure 434 is connected to the third conductive structure 424, the heat generated during the operation of the embedded components can be dissipated from the circuit board in a timely manner. When the fourth conductive structure 434 is electrically connected to the third circuit layer 422 and the fourth circuit layer 432, the fourth conductive structure 434 serves to conduct electricity between the electronic component 13, the capacitor 12 and the circuit layers of the embedded circuit board 100.

[0056] This application does not impose any special restrictions on the number of layers in the added-layer structure 40, and the number of layers in the added-layer structure 40 can be determined according to the actual design requirements.

[0057] In some embodiments, the embedded circuit board 100 further includes a protective layer 50, the location of which is adjusted according to the number of layers in the add-on structure 40. When the add-on structure 40 includes only the first add-on circuit layer 41, the protective layer 50 covers the first dielectric layer 411 exposed on the surface of the second circuit layer 412. When the add-on structure 40 includes both the first add-on circuit layer 41 and the second add-on circuit layer 42, the protective layer 50 covers the second dielectric layer 421 exposed on the surface of the third circuit layer 422. When the add-on structure 40 includes the first add-on circuit layer 41, the second add-on circuit layer 42, and the third add-on circuit layer 43, the protective layer 50 covers the third dielectric layer 431 exposed on the surface of the fourth circuit layer 432.

[0058] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An embedded circuit board, characterized in that, include: A base layer, wherein the base layer is provided with a groove, the groove penetrating at least a portion of the base layer; A capacitor, wherein the capacitor is located within the groove; An electronic component, wherein the electronic component is located within the groove; A first conductive structure is located within the groove and between the capacitor and the electronic component. The electronic component has a metal part on its surface facing the first conductive structure. The first conductive structure is electrically connected to the metal part and the capacitor. A first circuit layer is located on two opposite surfaces of the base layer, and the first conductive structure is electrically connected to the first circuit layer.

2. The embedded circuit board as described in claim 1, characterized in that, The first circuit layer includes a metal pad that is electrically connected to the first conductive structure. The projection of the metal pad along the thickness direction of the embedded circuit board is located between the capacitor and the electronic component.

3. The embedded circuit board as described in claim 1, characterized in that, The embedded circuit board also includes an adhesive layer that fills the gap between the capacitor, the electronic component, and the groove.

4. The embedded circuit board as described in claim 2, characterized in that, The embedded circuit board further includes a first augmentation circuit layer, which includes a first dielectric layer, a second circuit layer, and a second conductive structure. The first dielectric layer is located on the surface of the first circuit layer away from the base layer, and the second circuit layer is located on the surface of the first dielectric layer away from the first circuit layer. The second conductive structure penetrates at least the first dielectric layer and is electrically connected to at least one of the first conductive structure, the first circuit layer, and the electronic component.

5. The embedded circuit board as described in claim 4, characterized in that, The embedded circuit board further includes a second augmentation layer, which includes a second dielectric layer, a third circuit layer, and a third conductive structure. The second dielectric layer is located on the surface of the second circuit layer opposite to the first dielectric layer, and the third circuit layer is located on the surface of the second dielectric layer opposite to the second circuit layer. The third conductive structure penetrates the third circuit layer and the second dielectric layer, and is electrically connected to the second conductive structure and / or the second circuit layer.

6. The embedded circuit board as described in claim 5, characterized in that, The embedded circuit board also includes a protective layer that covers the second dielectric layer exposed on the surface of the third circuit layer.

7. The embedded circuit board as described in claim 5, characterized in that, One end of the first conductive structure is electrically connected to the second conductive structure, and the second conductive structure is electrically connected to the second circuit layer; the other end of the first conductive structure is connected to the metal pad, the metal pad is connected to another second conductive structure, and the other second conductive structure and the third conductive structure are connected for heat dissipation of the embedded circuit board.

8. A method for manufacturing an embedded circuit board, characterized in that, Includes the following steps: A base layer is provided, and a groove is formed in the base layer that penetrates at least a portion of the base layer; A capacitor and electronic components are placed in the groove, and encapsulating adhesive is filled into the groove to form an adhesive layer. The adhesive layer fills the gap between the capacitor, the electronic components and the groove. The electronic components have metal parts on their surface facing the capacitor. Metal layers are covered on opposite sides of the base layer, and circuits are fabricated on the metal layers to form a first circuit layer. The first circuit layer includes a metal pad, and the projection of the metal pad along the thickness direction of the base layer is located between the capacitor and the electronic component. A first through hole is formed on the surface of the adhesive layer. The first through hole penetrates the adhesive layer located between the capacitor and the electronic component, and exposes the capacitor and the metal part from the first through hole and exposes the metal pad at the bottom of the first through hole. The first through hole is electroplated to form a first conductive structure inside the first through hole. The first conductive structure is connected to the metal pad, the metal part, and the capacitor.

9. The method for manufacturing an embedded circuit board as described in claim 8, characterized in that, The manufacturing method further includes: A first dielectric layer and a second circuit layer are formed on the surface of the first circuit layer away from the base layer, and the second circuit layer covers the surface of the first dielectric layer away from the first circuit layer. A second via is formed on the surface of the second circuit layer and / or the first dielectric layer, the second via penetrating the second circuit layer and / or the first dielectric layer, and the metal pad is exposed at least part of the bottom of the second via; The second through hole is electroplated to form a second conductive structure inside the second through hole, and the second conductive structure is connected to the metal pad.

10. The method for manufacturing an embedded circuit board as described in claim 9, characterized in that, The electronic component is exposed from the bottom of a portion of the second via, and the second conductive structure is connected to the electronic component.

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