Embedded PCB and manufacturing method thereof

Abstract

The embodiment of the application provides an embedded PCB circuit board and a manufacturing method thereof, and relates to the technical field of embedded circuit boards.The embedded PCB circuit board comprises: a chip accommodating unit provided with at least one accommodating cavity or accommodating surface formed by a copper column boss, and the chip is parallel to the bottom surface of the accommodating cavity or the accommodating surface; a chip accommodating unit group formed by at least two chip accommodating units connected and combined with each other; at least one accommodating space is formed in the interior of the PCB circuit board body, and the chip accommodating unit or the chip accommodating unit group is packaged in the corresponding accommodating space; the chip in each chip accommodating unit is perpendicular or horizontal to the plane where the PCB circuit board body is located; the accommodating cavity or the accommodating surface formed by the copper column boss optimizes the chip stress structure and has better stability; the chip accommodating unit enables the chip to be embedded in the circuit board in a vertical posture or a horizontal posture, the design of the circuit board is more flexible, and the overall design difficulty is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of embedded circuit board technology, specifically to an embedded PCB circuit board and its manufacturing method. Background Technology

[0002] Currently, chips in embedded PCB circuit boards are all horizontally embedded. Vertically embedded chips are only found in laboratories. The horizontal embedding method usually results in a large PCB area. As the functions of PCB circuit boards continue to increase, the PCB area also needs to be increased, which brings great inconvenience to the development and application of PCB circuit boards. Summary of the Invention

[0003] To at least partially solve the above-mentioned technical problems, embodiments of the present invention provide an embedded PCB circuit board and a method for manufacturing the same.

[0004] In a first aspect, embodiments of the present invention provide an embedded PCB circuit board, comprising:

[0005] The chip receiving unit has at least one receiving cavity or receiving surface formed by copper pillar protrusions, and the chip is parallel to the bottom surface of the receiving cavity or the receiving surface.

[0006] A chip accommodating unit group is formed by connecting and combining at least two of the chip accommodating units;

[0007] The PCB circuit board body has at least one accommodating space inside, and the chip accommodating unit or the chip accommodating unit group is packaged in the corresponding accommodating space. The chip in each chip accommodating unit is perpendicular or horizontal to the plane on which the PCB circuit board body is located.

[0008] Furthermore, the chip accommodating unit is provided with a thermally conductive substrate; the thermally conductive substrate is a solid thermally conductive structure placed inside the chip accommodating unit, the accommodating cavity or accommodating surface is disposed on the thermally conductive substrate, and the thermally conductive substrate extends to the surface of the chip accommodating unit in at least one direction to form a heat dissipation end face.

[0009] Furthermore, the heat dissipation end face overlaps with the surface of the PCB circuit board body, or the heat dissipation end face extends to the surface of the PCB circuit board body by means of micro-hole electroplating filling, blind trench electroplating filling, or electroplating copper pillars or copper bosses.

[0010] Furthermore, the PCB circuit board body surface is covered with a first copper surface conductor circuit pattern, and the chip accommodating unit is also provided with a copper base boss connected to the chip signal terminal; the copper base boss is connected to the first copper surface conductor circuit pattern.

[0011] Furthermore, the copper-based boss extends into the first copper surface conductor circuit pattern, or the copper-based boss extends into the first copper surface conductor circuit pattern by means of micro-hole electroplating filling, blind trench electroplating filling, or electroplating copper pillars or electroplating copper bosses.

[0012] Furthermore, the thermally conductive substrate is composed of at least one of pure copper plate, graphene copper plate, diamond copper plate, copper substrate, aluminum substrate and ceramic substrate.

[0013] Furthermore, the thermally conductive substrate and the copper-based boss are insulated from each other by at least one insulator, the insulator including a thermally conductive adhesive film, a ceramic sheet, a molding compound, and glass.

[0014] Furthermore, the thermally conductive substrate is provided with cooling channels, and the cooling channels between the chip housing units are connected to form a cooling circulation structure, in which the refrigerant circulates.

[0015] Furthermore, the surface of the chip accommodating unit group is covered with a second copper surface conductor circuit pattern, and the copper base boss of the chip accommodating unit in the chip accommodating unit group is connected to the second copper surface conductor circuit pattern.

[0016] Secondly, embodiments of the present invention provide a method for manufacturing an embedded PCB circuit board, comprising:

[0017] Fabricate at least one chip receiving unit, wherein the at least one chip receiving unit has at least one receiving cavity or receiving surface formed by copper pillar bosses, the chip is parallel to the bottom surface of the receiving cavity or the receiving surface, and the chip receiving unit has copper base bosses connected to the chip signal terminals;

[0018] At least two of the chip accommodating units are interconnected by EMC molding or thick film compression filling to form at least one chip accommodating unit group;

[0019] Grinding exposes the copper-based boss connection pads of the chip accommodating unit;

[0020] The at least one chip housing unit or the group of chip housing units is vertically embedded into the PCB circuit board body, and the packaging process makes the chip in each chip housing unit perpendicular or horizontal to the plane on which the PCB circuit board body is located.

[0021] The embedded PCB circuit board and its manufacturing method provided in this invention include a chip accommodating unit with at least one accommodating cavity or accommodating surface formed by copper pillar bosses, with the chip parallel to the bottom surface of the accommodating cavity or accommodating surface; a chip accommodating unit group composed of at least two chip accommodating units connected to each other; at least one accommodating space formed inside the PCB circuit board body, with the chip accommodating unit or chip accommodating unit group encapsulated in the corresponding accommodating space; the chip in each chip accommodating unit is perpendicular or horizontal to the plane of the PCB circuit board body; the accommodating cavity or accommodating surface formed by the copper pillar bosses optimizes the chip stress structure and has better stability; the chip accommodating unit allows the chip to be embedded in the circuit board in a vertical or horizontal orientation, making the circuit board design more flexible and effectively reducing the overall design difficulty. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the embodiments and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0023] Figure 1 This is a schematic diagram of the structure of a chip accommodating unit group in an embedded PCB circuit board provided by an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the first chip accommodating unit structure provided in an embodiment of the present invention;

[0025] Figure 3 , Figure 4 , Figure 5 They are respectively Figure 2 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0026] Figure 6 This is a schematic diagram of the second chip accommodating unit structure provided in an embodiment of the present invention;

[0027] Figure 7 for Figure 6 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0028] Figure 8 This is a schematic diagram of the third chip accommodating unit structure provided in an embodiment of the present invention;

[0029] Figure 9 for Figure 8 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0030] Figure 10This is a schematic diagram of the fourth chip accommodating unit structure provided in an embodiment of the present invention;

[0031] Figure 11 , Figure 12 They are respectively Figure 10 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0032] Figure 13 This is a schematic diagram of the fifth chip accommodating unit structure provided in an embodiment of the present invention;

[0033] Figure 14 , Figure 15 They are respectively Figure 13 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0034] Figure 16 This is a schematic diagram of the sixth chip accommodating unit structure provided in an embodiment of the present invention;

[0035] Figure 17 , Figure 18 , Figure 19 They are respectively Figure 16 The diagram shows an intermediate structure during the fabrication of the chip accommodating unit structure.

[0036] Figure 20 This is a schematic diagram of a combination structure of a first type of chip accommodating unit structure and a fourth type of chip accommodating unit structure provided in an embodiment of the present invention;

[0037] Figure 21 This is a schematic diagram of a combined structure of a second type of chip accommodating unit structure and a third type of chip accommodating unit structure provided in an embodiment of the present invention;

[0038] Figure 22 This is a flowchart illustrating a method for fabricating a chip accommodating unit structure according to an embodiment of the present invention. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments of this disclosure to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the embodiments of this disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0040] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0041] As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated entries. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments disclosed herein. As used herein, the singular forms “a” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of the stated feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded. Terms such as “connected” or “linked” are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect.

[0042] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and embodiments of this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly so defined herein.

[0043] The embedded PCB circuit board fabrication method of this disclosure can be controlled and executed by electronic devices such as terminal devices or servers. The terminal device can be an in-vehicle device, user equipment (UE), mobile device, user terminal, terminal, cellular phone, cordless phone, personal digital assistant (PDA), handheld device, computing device, in-vehicle device, wearable device, etc. Specifically, it can be implemented by a processor calling computer-readable program instructions stored in memory. Alternatively, the method can be executed by a server.

[0044] The present invention will be further described below with reference to the accompanying drawings. It should be understood that the following embodiments are only for illustrating the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Various modifications or substitutions made to the present invention by those skilled in the art without departing from the spirit and substance of the present invention should fall within the scope of protection of the present invention.

[0045] Based on the current status of embedded circuit boards, and to address the shortcomings of related technologies, this invention provides an embedded PCB circuit board, the PCB circuit board body comprising:

[0046] The chip accommodating unit has at least one accommodating cavity or accommodating surface formed by copper pillar bosses, and the chip is parallel to the bottom surface of the accommodating cavity or the accommodating surface.

[0047] It should be noted that the specific structure of the chip's storage unit is designed by computer professionals in this field according to the requirements. Figure 2 , Figure 6 , Figure 8 , Figure 10 , Figure 13 , Figure 16 Each chip accommodating unit structure is shown.

[0048] A chip accommodating unit group is composed of at least two chip accommodating units connected to each other.

[0049] It should be noted that a chip accommodating unit group can be composed of the same or different chip accommodating units, and the specific combination method should be designed by computer professionals in this field according to the requirements. Figure 1 , Figure 20 , Figure 21 Each chip accommodating unit combination is shown.

[0050] It should be understood that before the chip housing unit or chip housing unit group is embedded into the PCB circuit board body, the chip in the housing unit is neither horizontal nor vertical. Only when it is embedded into the PCB circuit board body, due to the embedding angle of the chip housing unit, is the chip perpendicular to the plane of the PCB circuit board body.

[0051] The PCB circuit board body has at least one accommodating space inside, and chip accommodating units or chip accommodating unit groups are packaged in the corresponding accommodating space. The chip in each chip accommodating unit is perpendicular or horizontal to the plane on which the PCB circuit board body is located.

[0052] In some optional embodiments, the chip accommodating unit is provided with a thermally conductive substrate, which is a solid thermally conductive structure placed inside the chip accommodating unit. An accommodating cavity or accommodating surface is disposed on the thermally conductive substrate, and the thermally conductive substrate extends to the surface of the chip accommodating unit in at least one direction to form a heat dissipation end face.

[0053] It should be understood that, in order to adapt to the vertical state of the chip after it is embedded in the PCB circuit board, the thermal conductive substrate is made of a material with good thermal conductivity. The thermal conductive substrate absorbs the heat emitted by the chip and conducts it to the heat dissipation end face, which then conducts the heat outward, effectively improving the thermal conductivity.

[0054] In some alternative embodiments, the heat dissipation end face coincides with the surface of the PCB circuit board body, or the heat dissipation end face extends to the surface of the PCB circuit board body by means of micro-hole electroplating filling, blind trench electroplating filling, or electroplating copper pillars or copper bosses.

[0055] In some alternative embodiments, the surface of the PCB circuit board body is covered with a first copper surface conductor circuit pattern, and the chip accommodating unit is further provided with a copper base boss connected to the chip signal terminal, the copper base boss being connected to the first copper surface conductor circuit pattern.

[0056] It should be noted that the copper-based bumps not only perform signal transmission but also heat dissipation, further improving the chip's heat dissipation efficiency.

[0057] It should be understood that, compared with traditional lead wires, copper-based bosses for signal output are more stable and can effectively enhance the stability of internal components of the PCB circuit board. The copper-based bosses and copper conductor circuit patterns are completely decoupled, making the design of copper conductor circuit patterns more flexible and effectively reducing the manufacturing difficulty of the PCB circuit board.

[0058] In some alternative embodiments, the copper-based boss extends into the first copper surface conductor circuit pattern, or the copper-based boss extends into the first copper surface conductor circuit pattern by means of micro-hole electroplating filling, blind trench electroplating filling, or electroplating copper pillars or electroplating copper bosses.

[0059] In some alternative embodiments, the thermally conductive substrate is composed of at least one of a pure copper plate, a graphene copper plate, a diamond copper plate, a copper substrate, an aluminum substrate, and a ceramic substrate.

[0060] In some alternative embodiments, insulation between the thermally conductive substrate and the copper-based boss is achieved by at least one insulator, including thermally conductive adhesive film, ceramic sheet, molding compound, and glass.

[0061] In some alternative embodiments, a cooling channel is provided in the thermally conductive substrate, and the cooling channels between the chip housing units are connected to form a cooling circulation structure, in which the coolant circulates.

[0062] In some alternative embodiments, the surface of the chip accommodating unit group is covered with a second copper surface conductor circuit pattern, and the copper base bosses of the chip accommodating units within the chip accommodating unit group are connected to the second copper surface conductor circuit pattern.

[0063] It should be understood that copper-based bosses can be used not only as signal outputs but also as connection pads, effectively reducing the complexity of the PCB circuit board manufacturing process.

[0064] For ease of understanding, the embodiments of the present invention provide the following chip accommodating unit structure and corresponding manufacturing process.

[0065] The first type of chip housing unit structure is the Vertical Substrate Assembly (VSA) structure process type. The embodiments of this invention list the specific structures and manufacturing processes of Structure 1, Structure 2 and Structure 3. In engineering practice, the specific structures are designed by those skilled in the art according to engineering needs. Any structure formed under the concept of this invention is within the protection scope of this invention, and they are not listed here.

[0066] Structure 1, such as Figure 2 As shown, the heat dissipation structure of Structure 1 has chips on both sides. After the fabricated chip housing unit is embedded into the PCB circuit board, the chip is perpendicular or parallel to the plane of the PCB circuit board. The fabrication process of this structure mainly includes (not shown in the figure):

[0067] Step 11: Prepare a single-sided or double-sided copper plate to form... Figure 3 The cavity and the receiving surface are shown. The grooved part is the receiving cavity, and the other side without the groove is the receiving surface. The receiving copper plate serves as the heat-conducting substrate.

[0068] Step 12: Assemble chip components on one or both sides. This step mounts the chips onto a copper accommodating plate to form a structure such as... Figure 4 The structure shown.

[0069] Step 13: Fabricate a copper-based boss for signal transmission structure on a thermally conductive substrate.

[0070] Specifically, firstly, copper-based bumps for signal transmission structures are fabricated on the thermally conductive substrate of the assembled chip, such as... Figure 5 As shown, the signal transmission structure of Structure 1 has copper-based bosses that extend towards the heat dissipation structure. It has two bosses with an L-shaped cross-section. Then, a prepreg or adhesive film is pressed together, followed by vacuum pressing or film application of the chip assembly copper plate (thermal conductive substrate).

[0071] Step 14: Laser micro-hole or blind trench electroplating filling pattern fabrication Figure 2 The structure shown.

[0072] It should be understood that the first type of chip housing unit structure can achieve direct external heat dissipation from 3, 4, or 5 copper surfaces.

[0073] Structure 2, such as Figure 6 As shown, the heat dissipation structure of Structure 2 is the same as that of Structure 1. The manufacturing process of this structure mainly includes (not shown in the figure):

[0074] Step 21, the same as steps 11 and 12, produces the following: Figure 4 The structure shown.

[0075] Step 22: Fabricate a copper-based boss for signal transmission structure on a thermally conductive substrate.

[0076] Specifically, firstly, copper-based bosses for signal transmission structures are fabricated on the thermally conductive substrate of the assembled chip. The difference from structure one is as follows: Figure 7 As shown, the signal transmission structure of structure two has copper-based bosses that extend outward from the heat dissipation structure and have four bosses. The cross-section of the four bosses is U-shaped. Then, a prepreg or adhesive film is pressed together, and then the chip is assembled into a copper plate (thermal conductive substrate) by vacuum pressing or film application.

[0077] Step 23: Laser micro-hole or blind trench electroplating filling pattern fabrication Figure 6 The structure shown.

[0078] Structure 3, such as Figure 8 As shown, the copper plate embedded chip in structure three provides heat dissipation on all four sides and signals on both sides. The fabrication process of this structure mainly includes (not shown in the figure):

[0079] Step 31, the same as steps 11 and 12, produces the following: Figure 4 The structure shown.

[0080] Step 32: Fabricate a copper-based boss for signal transmission structure on a thermally conductive substrate.

[0081] Specifically, firstly, copper-based bumps for signal transmission structures are fabricated on the thermally conductive substrate of the assembled chips. The differences from Structure 1 and Structure 2 are as follows: Figure 9 As shown, the signal transmission structure of Structure 3 has four copper-based bosses that extend outward from the heat dissipation structure. The cross-section of the four bosses has a specific structure, which is set according to engineering needs and will not be described in detail here. Unlike Structure 1 and Structure 2, the heat-conducting substrate has added upper and lower heat dissipation surfaces to further improve heat dissipation efficiency. Then, a prepreg or adhesive film is pressed together, followed by vacuum pressing or film application of the chip assembly copper plate (heat-conducting substrate).

[0082] Step 33: Laser micro-hole or blind trench electroplating filling pattern fabrication Figure 8 The structure shown.

[0083] The second type of chip housing unit structure, the thermoelectric separation metal substrate m-side signal and n-side heat dissipation structure, the specific structure and manufacturing process of the following four structures are listed in the embodiments of the present invention. In specific engineering practice, the specific structure shall be designed by those skilled in the art according to the engineering needs. Any structure formed under the concept of the present invention shall be within the protection scope of the present invention. The embodiments of the present invention are not listed one by one.

[0084] Structure four, such as Figure 10 As shown, Structure 4 is suitable for chips where the signal end face and the heat-conducting end face are on the same surface. The fabrication process of this structure mainly includes (not shown in the figure):

[0085] Step 41: Prepare a hot spot separation convex copper metal perforated plate.

[0086] To achieve the fabrication of a hotspot-separated copper heat sink with independently isolated heat dissipation copper areas, free from signal circuit interference, and possessing ultra-high thermal conductivity and low thermal resistance, in some embodiments, the raised copper heat sink base can be deeply etched into shape using a segmented precision etching process. The copper layer in non-mask areas is uniformly etched away, retaining the central solid raised copper base. A pre-drilled array of thermally conductive vias is provided for the heat dissipation structure, with copper plating as a base layer and metallization of the thermally conductive vias.

[0087] Step 42: Fabricate a copper boss template as a copper-based boss for signal transmission structure, i.e., the signal end, and fill it with a thermally conductive insulating film. Vacuum press the copper metal perforated plate, i.e. the heat dissipation structure, to achieve double-sided heat dissipation and double-sided signal structure.

[0088] Specifically, the molded integrated substrate enables a dual-sided heat dissipation and dual-sided signal transmission architecture, achieving complete separation of thermoelectricity and heat.

[0089] Step 43: Fabricate the surface treatment of the cross-hole metallization planar pattern and assemble the chip metal substrate.

[0090] It should be understood that this step is used to complete microvia interconnection, circuit shaping, surface treatment, and chip mounting, ensuring seamless bonding between the chip and the copper-based heat dissipation / signal structure, and achieving the required electrical and thermal conductivity performance. High-temperature tin soldering, copper sintering, and silver sintering processes can be employed.

[0091] Step 44: Repeat vacuum pressing, film lamination, and chip embedding.

[0092] It should be understood that this step completely embeds the chip inside the chip housing unit, with full dielectric encapsulation and protection, resulting in a stable structure, balanced stress, and a fully formed chip housing unit with double-sided heat dissipation and double-sided signal transmission.

[0093] It should be noted that whether or not the structure of this embodiment adopts a raised copper structure is optional and can be selected by those skilled in the art according to engineering needs. Single-sided or double-sided raised copper structures are also optional, which will not be elaborated here.

[0094] In addition, in some embodiments, the metal substrate type may be selected from a combination of materials such as copper, aluminum, copper-aluminum composite plate, copper-clad diamond, and copper-clad graphene.

[0095] It should be noted that the various signal and heat dissipation surfaces and their combinations in the second type of chip accommodating unit structure are also applicable to the second type of chip accommodating unit structure. The second type of chip accommodating unit structure can achieve direct external heat dissipation from 3-sided, 4-sided, and 5-sided copper blocks.

[0096] The third type of chip accommodating unit structure, the specific structure and manufacturing process of structure five are listed in this embodiment. In specific engineering practice, the specific structure is designed by those skilled in the art according to engineering needs. Any structure formed under the concept of this invention is within the protection scope of this invention. The embodiments of this invention are not listed one by one.

[0097] Structure 5 features a ceramic substrate with m-side signal and n-side heat dissipation, where m ≥ 1 and n ≥ 1. It includes a ceramic substrate, copper bosses, insulating film, embedded chip, and multi-sided heat dissipation (2-4 sides). It utilizes advanced double-sided or multi-sided signal packaging PCB technology, differing from the pure S-cell copper frame structure. It introduces a 3D ceramic dam metallized cavity, combining the advantages of high insulation, high thermal conductivity, low expansion, and high reliability of ceramics. The design allows for flexible implementation of double-sided, three-sided, and four-sided chip heat dissipation and multi-directional signal output. The fabrication process of this structure mainly includes (not shown in the figure):

[0098] Step 51: Prepare a 3D ceramic substrate.

[0099] Specifically, this can include patterning, damming, or metallized via processes. A 3D ceramic substrate with a three-dimensional dammed cavity, front-side patterned circuitry, and vertically metallized vias is fabricated to form a chip housing cavity, insulating barrier, and vertical heat and electrical conduction paths, providing a ceramic substrate carrier for multi-faceted heat dissipation and multi-faceted signal extraction.

[0100] Step 52: Assemble the chip onto the 3D ceramic substrate.

[0101] Specifically, this includes signal processing and heat dissipation. The power die is precisely mounted inside the ceramic cavity, enabling accurate heat dissipation on the back of the chip and precise signal connection on the bottom and sides, establishing a low-resistance, low-parasitic signal path.

[0102] Step 53: Fabricate the boss copper template, adhesive film, chip assembly ceramic substrate, and vacuum film lamination and thermal curing. It should be understood that this embodiment is only an exemplary example of the fabrication process of structure five. In engineering practice, the process can be adjusted based on the chip design to achieve 2 to 4-sided heat dissipation and signal structure.

[0103] Step 54: Micro-hole and blind groove fabrication, electroplating filling pattern fabrication.

[0104] Specifically, blind holes and blind slots can be precisely machined using lasers to vertically penetrate the upper copper boss, the middle adhesive film, and the bottom ceramic metallization layer. Electroplating fills the holes to achieve low parasitic interconnection, ultimately completing the complete circuit pattern.

[0105] This embodiment uses a 3D ceramic dam cavity as the core load-bearing structure to solve the problems of high stress, weak insulation, and thermal expansion mismatch of pure copper frames. The ceramic metallized holes, combined with the side dam structure, support 2-4 facet multi-dimensional heat dissipation and multi-directional signal output. Copper boss templates are composite-cured with insulating film, balancing structural strength, zero voids, low stress, and high thermal conductivity. Laser-drilled micro-via blind slots combined with electroplated fillers achieve high-density, low-parasitic vertical interconnects, especially suitable for high-frequency, high-power SiC / GaN chips.

[0106] It should be understood that the ceramic substrate may or may not have metallized holes, depending on the engineering requirements, and may or may not have dams.

[0107] The ceramic substrate type can be selected from, but is not limited to, Si3N4, AlN, ZTA, Al2O3, etc.

[0108] It should be understood that other signals, heat dissipation surfaces and their combinations in the first type of chip accommodating unit structure can also be used in the third type of chip accommodating unit structure, and will not be listed one by one in the embodiments of the present invention.

[0109] The fourth type of chip housing unit structure features a microchannel cold plate embedded chip with double-sided heat dissipation and double-sided signaling. This chip housing unit can realize side conduction heat dissipation, top and bottom conduction heat dissipation, and their combinations. At the same time, the insulating properties of the ceramic sheet can be further combined with structures such as copper plates, microchannels, and heat sinks to improve heat dissipation efficiency.

[0110] Step 61: Prepare the microchannel cold plate.

[0111] In some embodiments, the fabrication of the microchannel cold plate includes perforations and grooves.

[0112] Step 62: Assemble the chip onto the micro cold plate.

[0113] It should be understood that the micro-cold plate is used for heat dissipation, i.e., a heat dissipation structure.

[0114] Step 63: Fabricate the boss copper template, prepreg or film, and chip microchannel cold plate.

[0115] Specifically, vacuum pressing or film bonding is used to achieve double-sided heat dissipation and double-sided signal structure.

[0116] Step 64: Laser micro-hole blind groove electroplating filling pattern is formed.

[0117] It should be understood that the fourth type of chip housing unit can realize heat dissipation through side openings of microchannel coolant, heat dissipation through upper and lower parts, or heat dissipation through front and rear parts, as well as combinations thereof.

[0118] It should be noted that the specific implementation of the refrigeration cycle structure in this embodiment is not limited, and can be designed by those skilled in the art according to engineering needs and in combination with relevant existing technologies, which will not be elaborated here.

[0119] In the embodiments of the present invention, different types of chip accommodating units can be arbitrarily combined according to engineering needs. Two combination schemes are given below.

[0120] Combination Scheme 1 Figure 20The diagram illustrates a combination of the aforementioned first type of chip accommodating unit structure and the fourth type of chip accommodating unit structure. In this combination, the fourth type of chip accommodating unit can achieve direct external heat dissipation of copper blocks on 3, 4, or 5 sides, as well as heat dissipation through the flow of coolant on the right side opening of the microchannel coolant, heat dissipation through the upper and lower parts, or heat dissipation through the front and rear parts, and combinations thereof. The first type of chip accommodating unit can achieve direct external heat dissipation of copper blocks on 3, 4, or 5 sides.

[0121] Combination Scheme 2 Figure 21 The diagram illustrates a combination of the aforementioned second-type chip accommodating unit structure and the third-type chip accommodating unit structure. In this combination, the third-type chip accommodating unit can achieve heat dissipation through conduction from the right side of the ceramic sheet, the top and bottom, or the front and rear, as well as combinations thereof. Simultaneously, the insulating properties of the ceramic sheet can be further combined with structures such as copper plates, microchannels, and heat sinks to improve efficiency. The second-type chip accommodating unit enables direct external heat dissipation from copper blocks on 3, 4, or 5 sides.

[0122] In summary, in the embodiments of the present invention, when manufacturing an embedded PCB circuit board, the VSA is first cut into vertical substrate packaging structure functional units, and then the VSA functional units are packaged. The VSA unit is rotated 90 degrees so that the chip plane is perpendicular to the plane of the PCB circuit board and is mounted in the limiting hole groove of the horizontal substrate (HAS). Then, copper foil, prepreg or adhesive film are used for secondary vacuum pressing or film application. By combining vertical chip packaging with a back-to-back design to maximize chip layout density, copper or ceramic bumps on all four sides of the chip form 360-degree protection, minimizing vertical pressing stress impact and Z-axis CTE stress adaptation risks. The exposed copper or ceramic heat dissipation surface is ground. Compared to direct horizontal chip packaging through dense holes or slots, vertical packaging combined with horizontal secondary packaging can directly access the horizontal package surface with zero interface heat. In particular, the copper bump extension structure can further expand the heat dissipation area and improve heat dissipation capacity. Based on the planar pattern combined with the copper bump terminal composite structure, high-density layer addition can be achieved in the secondary horizontal packaging structure without affecting the model transmission wiring density. In addition, laser or mechanical drilling is used to metallize the layer addition, solder mask surface treatment is cut into shape, and after final inspection, the horizontal and vertical composite packaged chip is embedded in the packaging substrate or PCB board.

[0123] The embedded PCB circuit board provided in this embodiment optimizes the chip stress structure by forming a cavity or accommodating surface with copper pillar bosses, resulting in better stability. The chip accommodating unit allows the chip to be embedded vertically or horizontally in the circuit board, making the circuit board design more flexible and effectively reducing the overall design difficulty of the circuit board. Vertical chips can effectively reduce the size of the PCB circuit board.

[0124] To realize the aforementioned embedded PCB circuit board, embodiments of the present invention provide a method for manufacturing an embedded PCB circuit board, such as... Figure 22 As shown, the method includes:

[0125] S221. Fabricate at least one chip receiving unit, wherein the at least one chip receiving unit has at least one receiving cavity or receiving surface formed by a copper pillar boss, the chip is parallel to the bottom surface of the receiving cavity or the receiving surface, and the chip receiving unit has a copper base boss connected to the signal terminal of the chip.

[0126] S222. At least two chip housing units are interconnected by EMC encapsulation or thick film compression filling to form at least one chip housing unit group.

[0127] S223. Grind to expose the copper-based boss connection pads of the chip housing unit.

[0128] S224. At least one chip accommodating unit or a group of chip accommodating units is vertically embedded into the PCB circuit board body, and the packaging process makes the chip in each chip accommodating unit perpendicular or horizontal to the plane on which the PCB circuit board body is located.

[0129] The embedded PCB manufacturing method provided in this embodiment optimizes the chip stress structure by forming a cavity or surface with copper pillar bosses, resulting in better stability. The chip accommodating unit allows the chip to be embedded vertically or horizontally in the circuit board, making the circuit board design more flexible and effectively reducing the overall design difficulty of the circuit board. Vertical chips can effectively reduce the size of the PCB circuit board.

[0130] Example embodiments have been disclosed herein. While specific terminology has been used, it is intended and should be interpreted only in a general illustrative sense and is not intended to be limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the embodiments of this disclosure as set forth in the appended claims.

Claims

1. An embedded PCB circuit board, characterized in that, include: The chip receiving unit has at least one receiving cavity or receiving surface formed by copper pillar protrusions, and the chip is parallel to the bottom surface of the receiving cavity or the receiving surface. A chip accommodating unit group is formed by connecting and combining at least two of the chip accommodating units; The PCB circuit board body has at least one accommodating space inside, and the chip accommodating unit or the chip accommodating unit group is packaged in the corresponding accommodating space. The chip in each chip accommodating unit is perpendicular or horizontal to the plane on which the PCB circuit board body is located.

2. The embedded PCB circuit board according to claim 1, characterized in that, The chip housing unit is provided with a thermally conductive substrate; The thermally conductive substrate is a solid thermally conductive structure placed inside the chip housing unit. The housing cavity or housing surface is disposed on the thermally conductive substrate, and the thermally conductive substrate extends to the surface of the chip housing unit in at least one direction to form a heat dissipation end face.

3. The embedded PCB circuit board according to claim 2, characterized in that, The heat dissipation end face overlaps with the surface of the PCB circuit board body, or the heat dissipation end face extends to the surface of the PCB circuit board body by means of micro-hole electroplating filling, blind groove electroplating filling, or electroplating copper pillars or copper bosses.

4. The embedded PCB circuit board according to claim 3, characterized in that, The PCB circuit board body surface is covered with a first copper conductor circuit pattern, and the chip accommodating unit is also provided with a copper-based boss connected to the chip signal terminal. The copper-based boss is connected to the first copper surface conductor circuit pattern.

5. The embedded PCB circuit board according to claim 4, characterized in that, The copper-based boss extends into the first copper surface conductor circuit pattern, or the copper-based boss extends into the first copper surface conductor circuit pattern by means of micro-hole electroplating filling, blind trench electroplating filling, or electroplating copper pillars or electroplating copper bosses.

6. The embedded PCB circuit board according to claim 2, characterized in that, The thermally conductive substrate is composed of at least one of pure copper plate, graphene copper plate, diamond copper plate, copper substrate, aluminum substrate and ceramic substrate.

7. The embedded PCB circuit board according to claim 4, characterized in that, The thermally conductive substrate and the copper-based boss are insulated from each other by at least one insulator, the insulator including thermally conductive adhesive film, ceramic sheet, molding compound and glass.

8. The embedded PCB circuit board according to claim 2, characterized in that, The thermally conductive substrate is provided with a cooling channel, and the cooling channels between the chip housing units are connected to form a cooling cycle structure, in which the refrigerant circulates.

9. The embedded PCB circuit board according to claim 4, characterized in that, The surface of the chip accommodating unit group is covered with a second copper surface conductor circuit pattern, and the copper base boss of the chip accommodating unit in the chip accommodating unit group is connected to the second copper surface conductor circuit pattern.

10. A method for manufacturing an embedded PCB circuit board, characterized in that, include: Fabricate at least one chip receiving unit, wherein the at least one chip receiving unit has at least one receiving cavity or receiving surface formed by copper pillar bosses, the chip is parallel to the bottom surface of the receiving cavity or the receiving surface, and the chip receiving unit has copper base bosses connected to the chip signal terminals; At least two of the chip accommodating units are interconnected by EMC molding or thick film compression filling to form at least one chip accommodating unit group; Grinding exposes the copper-based boss connection pads of the chip accommodating unit; The at least one chip housing unit or the group of chip housing units is vertically embedded into the PCB circuit board body, and the packaging process makes the chip in each chip housing unit perpendicular or horizontal to the plane on which the PCB circuit board body is located.

Images