Flexible plate manufacturing method and flexible plate for 3D printer using intensive green design

Abstract

The application discloses a kind of 3D printer with intensive green design's flexible plate manufacturing method, by forming new splicing plate structure by unit board adjacent splicing, then along the first cutting line of length direction is completely punched, along the second cutting line of width direction is controlled depth punching;And in the cutting area, first auxiliary copper pattern and second auxiliary copper pattern not connected with effective circuit or plate edge copper skin are arranged, after punching process, form half connection state, then through etching after process, remove auxiliary copper pattern, adopt laser ablation finishing plate edge, can effectively eliminate the precision error caused by invalid area expansion and contraction and multiple punching, improve the precision of contour dimension;Also can maximize the use of plate, meet green energy-saving design;And half connection structure makes that after welding can be nondestructive plate, protect effective circuit not be torn and damaged, adapt to 3D printer module to the use demand of high precision, high reliability flexible plate.

Description

Technical Field

[0001] This invention relates to the field of highly integrated flexible circuit board processing, and more particularly to a method for manufacturing a flexible board with an intensive green design for 3D printers, and a flexible board. Background Technology

[0002] Some of the connecting components of 3D printers use flexible boards (i.e., flexible printed circuit boards, FPCs), which not only require good connection, conductivity, and bending performance, but also have high-density load-bearing capacity to support the mounting and operation of integrated circuits or chips.

[0003] This type of flexible board has strict requirements for the dimensional accuracy of the product. The existing processing method generally adopts the unified production of splicing, that is, splicing multiple unit boards into a large board for batch processing. A certain width of invalid area needs to be reserved between adjacent sub-boards. After the integrated circuit is soldered, the sub-boards are separated by punching.

[0004] However, traditional panel structures and processing techniques have the following drawbacks: (1) Since the invalid area is prone to expansion and contraction deformation during the processing, the dimensional instability of the invalid area will be directly transmitted to the unit board, making it difficult to meet the dimensional accuracy of the final product; and the traditional splicing structure requires multiple step-by-step punching around the sub-board, and the error generated by multiple punching will continue to accumulate, which will further reduce the product processing accuracy.

[0005] (2) The invalid area will be completely cut off and discarded after processing, resulting in a large waste of board material and low material utilization rate, which does not conform to the development concept of green design, energy conservation and emission reduction.

[0006] (3) Traditional processes require punching and separating after the integrated circuit is soldered. The external force generated during the punching process can easily cause the soldered integrated circuit to become loose or have poor soldering, affecting the electrical performance and structural stability of the product.

[0007] Therefore, based on the above background and problems, there is a need to provide a method for manufacturing flexible sheets with intensive green design for 3D printers, as well as flexible sheets themselves. Summary of the Invention

[0008] This invention aims to solve the comprehensive problems of low processing accuracy in flexible sheets with intensive green design for 3D printers in existing technologies. It provides a method for manufacturing a flexible sheet with intensive green design for 3D printers. The flexible sheet is processed using a panel-by-panel method based on design data. The design data includes forming lines, with the area within the forming lines being the effective area and other areas being the ineffective area. The manufacturing method includes the following steps: S10: Design a panel consisting of several adjacent unit boards joined together without gaps, according to the design data; wherein, the forming line includes a first punching line and a second punching line, the first punching line is set at the adjacent boundary in the length direction of the panel, and the second punching line is set at the adjacent boundary in the width direction; S20: A flexible core board is manufactured according to the design data. The flexible core board includes a circuit pattern. Then, a cover film is taken and a window is made on the cover film. After that, the windowed cover film is attached to the surface of the flexible core board to form a surface pattern board. S30: The surface pattern plate is fully punched along the first punching line, and then the depth is controlled along the second punching line to form a punched plate, which is then processed in subsequent processes to form the flexible plate.

[0009] Furthermore, the circuit pattern includes a first auxiliary copper pattern; the flexible core board has the first auxiliary copper pattern on the first punching line, and the first auxiliary copper pattern is not broken during the complete punching.

[0010] Furthermore, the circuit pattern includes a second auxiliary copper pattern; the flexible core board has the second auxiliary copper pattern on the second punching line, and the controlled-depth punching does not break the second auxiliary copper pattern.

[0011] Furthermore, the first auxiliary copper pattern or the second auxiliary copper pattern is disposed in the invalid region and is adjacent to the circuit pattern whose length and width are both ≥254mm in the valid region.

[0012] Further, forming the surface pattern board includes: taking a single-sided flexible copper-clad board and a double-sided flexible copper-clad board, fabricating an inner layer circuit pattern on the double-sided flexible copper-clad board corresponding to the first auxiliary copper pattern or the second auxiliary copper pattern to form a double-sided pattern board; then pressing the single-sided flexible copper-clad board and the double-sided pattern board together to form the surface pattern board.

[0013] Furthermore, the controlled-depth punching involves punching from both surfaces of the surface patterning board to the inner layer circuit pattern, and penetrating to a depth of 8 to 25 micrometers into the inner layer circuit pattern.

[0014] Furthermore, the first auxiliary copper pattern or the second auxiliary copper pattern extends to the edge of the unit plate between the forming line and the forming plate.

[0015] Furthermore, the subsequent process includes removing the invalid area of ​​the punching plate, and then using laser ablation to trim the edge of the unit plate.

[0016] A flexible board is prepared using the above-described manufacturing method.

[0017] Furthermore, integrated circuits or chips are welded to the surface of the flexible board to form an applicable integrated flexible board.

[0018] The main beneficial effects of this technical solution include: (1) By optimizing the panel structure, the invalid area between adjacent unit panels in the traditional panel structure is eliminated, effectively avoiding the dimensional deviation caused by thermal expansion and contraction of the invalid area. At the same time, the structural design also simplifies the punching process, reduces the accumulation of errors caused by multiple punching, and improves the overall processing accuracy of the flexible board. It can fully meet the high-precision use requirements of products in the 3D printer field, and also maximizes the use of the board material, improves the utilization rate of raw materials, and effectively reduces material waste. (2) The boundary in the length direction between adjacent unit plates is fully punched, and then the boundary in the width direction is punched with controlled depth to form a semi-connected structure that retains the short side of the unit plate, and a stable semi-connected state. Furthermore, a first auxiliary copper pattern and a second auxiliary copper pattern are arranged on the corresponding punching line. These auxiliary copper patterns are independently set as point structures and are not connected to the effective circuits inside the board or the large copper foil on the edge of the board. They can play a limiting and protective role in the controlled depth punching operation, effectively avoiding problems such as over-punching and board breakage due to improper control of punching force, and preventing premature failure of the semi-connected structure. It can also buffer the mechanical stress generated by punching, block the stress from being transmitted to the functional circuit, reduce adverse phenomena such as circuit pulling and pattern misalignment, balance the punching processing accuracy and the convenience of subsequent board separation, and comprehensively ensure the overall processing quality and reliability of flexible board. (3) A close and efficient collaborative relationship is formed between each processing step, and the overall process flow is smooth and orderly: First, the basic forming process such as flexible core board production and cover film window bonding is completed, and the circuit layout and board surface protection are completed in advance, laying a regular and reliable board body foundation for subsequent differentiated punching operations; the intermediate process relies on the processing method of combining full punching and controlled depth punching, with the auxiliary copper pattern limiting protection structure, to accurately control the punching depth and forming state, stably maintain the semi-connected structure of the unit board, and ensure the overall positioning is firm during welding operations; finally, the excess auxiliary copper pattern is removed by etching, the invalid area is cleaned, and the board edge is finished by laser ablation, and the finished product is orderly completed. The preceding and following processes are progressive and mutually supportive, reducing processing conflicts and dimensional deviations between processes throughout the process, simplifying the overall production process, and effectively improving the overall forming consistency of the flexible board, thereby improving production efficiency and product yield from the whole process level. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a process flow diagram of an embodiment of the present invention; Figure 2 This is a plan view of the panel according to an embodiment of the present invention; Figure 3 for Figure 2 Schematic diagram of AA section; Figure 4 This is a plan view of the surface pattern plate according to an embodiment of the present invention; Figure 5 for Figure 4 A magnified view of a portion of the image; Figure 6 This is a cross-sectional schematic diagram of the flexible plate according to an embodiment of the present invention; Figure 7 This is a physical schematic diagram of the flexible plate according to an embodiment of the present invention.

[0021] Explanation of reference numerals: 100, forming line; 200, effective area; 300, ineffective area; 400, inner layer circuit pattern; 500, integrated circuit; 10, panel; 1010, unit board; 110, first punching line; 120, second punching line; 20, surface pattern board; 2010, first auxiliary copper pattern; 2020, second auxiliary copper pattern; FD, magnified area; 30, flexible board.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0027] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0028] Please see Figure 1 , Figure 1 This is a process flow diagram of an embodiment of the present invention.

[0029] A method for manufacturing a flexible sheet with an intensive green design for 3D printers, wherein the flexible sheet 30 is processed by splicing according to design data, the design data including a forming line 100, the area within the forming line 100 being the effective area 200, and other areas being the ineffective area 300, the manufacturing method includes the following steps: Please see Figure 2 and Figure 3 , Figure 2 This is a plan view of the panel according to an embodiment of the present invention; Figure 3 for Figure 2 A schematic diagram of the AA section.

[0030] Step S10: According to the design data, the panel 10 is designed by splicing several unit panels 1010 together without gaps; wherein, the forming line 100 includes a first punching line 110 and a second punching line 120. The first punching line 110 is set at the adjacent boundary in the length direction of the unit panel 1010, and the second punching line 120 is set at the adjacent boundary in the width direction.

[0031] By adopting a panel structure design with seamless adjacent splicing of panel 10, the traditional practice of reserving an invalid area 300 between adjacent unit panels 1010 is abandoned. The panel layout is optimized from the structural source, and only the minimum process spacing required for punching is retained between adjacent unit panels 1010.

[0032] On the one hand, it can maximize the utilization of the effective surface area of ​​the panel 10, improve the utilization rate of raw materials, reduce the waste of resources caused by cutting and discarding of materials, and achieve the production goal of energy saving and consumption reduction. On the other hand, the ineffective area 300 of traditional panels is prone to large expansion, contraction, warping and other dimensional instability problems. The structure of the panel 10 of the present invention can effectively eliminate the dimensional interference factors caused by the ineffective area 300, avoid the expansion and contraction deformation of the ineffective area 300 from being transmitted to the unit panel 1010, ensure the stability of the overall size of the panel 10 from the processing basis, improve the accuracy and consistency of the panel shape, and meet the stringent requirements of 3D printer modules for high precision and high stability.

[0033] Therefore, the structural design of the panel 10 allows for the effective separation of adjacent unit panels 1010 by setting a first punching line 110 at the dividing point along the length of the unit panel 1010 and milling the first punching line 110 in a single operation. This eliminates the need for repeated punching on all four sides of each unit panel 1010 as in traditional paneling, simplifying the panel separation process, reducing mechanical stress damage and error accumulation caused by multiple punching operations, effectively reducing the impact on the circuitry of the panel during separation, improving production efficiency and product yield, and making the overall processing flow simpler, more efficient, and more reliable.

[0034] Please see 4 and Figure 5 , Figure 4 This is a plan view of the surface pattern plate according to an embodiment of the present invention; Figure 5 for Figure 4 A magnified view of a portion of the image.

[0035] Step S20: A flexible core board is fabricated based on the design data. The flexible core board includes circuit patterns. Then, a cover film is taken and a window is made in the cover film. After that, the windowed cover film is attached to the surface of the flexible core board to form a surface pattern board 20.

[0036] By pre-treating the cover film with precise windowing and fully attaching it to the surface of the flexible core board, the insulation protection, circuit positioning, and size determination of the board can be completed before milling. This avoids problems such as alignment deviation and poor bonding caused by processing and attaching at the same time in subsequent processes, effectively improving the stability and controllability of subsequent milling processes.

[0037] Meanwhile, this step of first processing to form the surface pattern board 20 can also avoid problems such as exposed circuit layer, warped film layer or damaged core board layer that are easy to occur during the subsequent milling process. It ensures clear milling path and consistent punching depth, improves milling positioning accuracy and board separation yield, makes subsequent processing smoother and dimensional accuracy easier to guarantee, and improves the overall processing consistency of the board and product reliability.

[0038] Figure 4 Local magnified region FD such as Figure 5As shown.

[0039] Optionally, the circuit pattern includes a first auxiliary copper pattern 2010; the flexible core board is provided with the first auxiliary copper pattern 2010 on the first punching line 110, and the first auxiliary copper pattern 2010 is punched completely without breaking it.

[0040] By setting the first auxiliary copper pattern 2010, it plays a precise limiting and tough support role during the punching process. Structurally, it avoids the problem of over-punching caused by uneven punching or uncontrolled punching force, prevents the plate from being accidentally and completely broken and losing the semi-connection retention effect, and ensures that the adjacent unit plates 1010 are still in a stable and controllable connection state after punching.

[0041] It is worth noting that, in the process of completely punching without severing the first auxiliary copper pattern 2010, an optional "notch" can be set on the punch corresponding to that position, or the punching force can be controlled during direct punching to remove the copper-free substrate of the surface pattern plate 20 without severing the first auxiliary copper pattern 2010, thus maintaining its edge connection and support. The first auxiliary copper pattern 2010 only serves an auxiliary connection function and is not directly connected to the effective circuit pattern inside the unit board 1010. This does not affect the electrical performance of the product, and it can reliably withstand the mechanical stress of punching by relying on the excellent toughness and structural strength of copper itself. This makes it easier to accurately control the punching depth and punching boundary, improving the consistency and stability of the punching process.

[0042] Optionally, the circuit pattern includes a second auxiliary copper pattern 2020; the flexible core board is provided with the second auxiliary copper pattern 2020 on the second punching line 120, and the second auxiliary copper pattern 2020 is not broken during depth punching, which has the same beneficial effect as the first auxiliary copper pattern 2010, and will not be described in detail here.

[0043] Optionally, the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is set in the invalid region 300 and is adjacent to the line pattern in the valid region 200 whose length and width are both ≥254mm.

[0044] The first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is placed in a large copper area in a non-dense circuit area, avoiding the positions of critical circuits such as fine circuits, narrow-pitch traces and functional pads. This avoids processing risks such as interference, etching misalignment, and pattern adhesion between the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 and the effective circuits. It also avoids the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 affecting the nearby circuit patterns when the flexible board 30 is subsequently removed, which could cause problems such as circuit skewing or even breakage.

[0045] In other words, the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is made in a large copper area with sufficient processing capacity. This allows for a more generous processing allowance, which can improve the etching accuracy, alignment accuracy and punching controllability of the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020. It also reduces processing errors caused by limited space and dense patterns. This allows the auxiliary connection structure to stably play its role in preventing over-punching and ensuring partial connection, without affecting the forming quality of the core circuit pattern. Overall, this improves the processing yield of the board and the reliability of the product.

[0046] It is worth noting that the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is a circuit pattern that is not interconnected with the circuit pattern in the effective area 200 of the unit board 1010, nor with the ineffective area 300 on the board edge. This can effectively prevent the stress from being transmitted to the large copper area of ​​the effective circuit or ineffective area 300 inside the unit board 1010 when the connecting copper wire is torn or punched by external force. This reduces problems such as circuit pulling, pattern misalignment, and board deformation caused by connection relationship, and maximizes the protection of the integrity and positional accuracy of the effective circuit pattern.

[0047] Furthermore, the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is an independent point structure that does not participate in the electrical circuit and does not affect the normal electrical performance of the product. While realizing the functions of auxiliary connection and anti-overshooting, it further improves the processing stability and product reliability.

[0048] Optionally, the width of the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 is 25 micrometers to 100 micrometers.

[0049] Since the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 only serves as a punching limit and does not need to bear the electrical conduction function, if its width is set too large, it will not only increase the difficulty of punching and cutting, making it difficult to achieve precise cutting, but will also generate excessive tensile stress during the subsequent board separation and tearing process, which can easily cause problems such as cracking of the board substrate and damage to the circuit.

[0050] Therefore, limiting the width within this reasonable range can not only stably play its role in providing auxiliary support and preventing overcutting, ensuring the stability and reliability of the semi-connecting structure, but also reduce the difficulty of punching and cutting, facilitate quick and non-destructive tearing and separation of the plate in the later stage, effectively avoid the risk of plate breakage, and further improve the smoothness of processing and the quality of product forming.

[0051] Please see Figure 6 and Figure 7 , Figure 6 This is a cross-sectional schematic diagram of the flexible plate according to an embodiment of the present invention.

[0052] Step S30: The surface pattern plate 20 is fully punched along the first punching line 110, and then the depth is controlled along the second punching line 120 to form a punched plate. After subsequent processing, a flexible plate 30 is formed.

[0053] By completing the full punching along the first punching line 110 in one go, the unit board 1010 can be quickly separated and positioned along its length, eliminating the redundancy and error accumulation caused by multiple punching processes in traditional methods, and ensuring neat punching boundaries and high dimensional consistency. Then, a controlled-depth punching is performed along the second punching line 120, which can accurately cut the cover film and the board body, while maintaining the continuity and integrity of the preset connection structure. This ensures that the overall structure of the panel 10 maintains overall rigidity and stable positioning during the integrated circuit 500 welding process, avoiding board body shaking or displacement during welding, which could lead to poor welding.

[0054] This segmented and differentiated punching scheme is highly compatible with the structure of the preceding board, which not only fully leverages the material-saving advantages of the panel 10 result, but also relies on controlled-depth punching to form a reliable semi-connected state, providing structural protection for the subsequent welding of integrated circuit 500 and easy board separation, effectively reducing the damage of punching stress to the circuit and integrated circuit 500, and improving the yield of subsequent processing.

[0055] Optionally, forming another surface pattern board includes: taking a single-sided flexible copper-clad laminate and a double-sided flexible copper-clad laminate, and fabricating an inner layer circuit pattern 400 on one side of the double-sided flexible copper-clad laminate corresponding to the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 to form a double-sided pattern board; then pressing the single-sided flexible copper-clad laminate and the double-sided pattern board together, with the inner layer circuit pattern 400 pressed into the board body; thus forming another surface pattern board.

[0056] In a conventional structure without an inner layer circuit pattern 400, excessive depth-controlled punching compensation can easily cause direct breakage in the middle of the board, leading to failure of the semi-connection structure and unexpected separation of unit board 1010. Therefore, by adding an inner layer circuit pattern 400 to the circuit pattern and adopting a double-sided depth-controlled punching process from both the front and back surfaces of the surface pattern board 20 to the inner layer circuit pattern 400, the prominent problems of over-punching, semi-connection failure, and board separation damage that are prone to occur in traditional depth-controlled punching are solved.

[0057] Specifically, the added inner layer circuit pattern 400 can rely on the excellent toughness and structural strength of its copper layer to precisely limit the punching depth and termination position, so that the controlled-depth punching can be stopped when it reaches the copper layer 400. This can reliably punch through the upper and lower cover film layers and the core board substrate layer without breaking the inner layer circuit pattern 400, thus avoiding over-punching from the root and maintaining a stable semi-connected state, providing a solid structural foundation for the smooth peeling of the subsequent unit board 1010.

[0058] It is worth noting that the double-sided synchronous depth control punching and the added inner layer circuit pattern 400 work together effectively to avoid local overcutting and undercutting defects caused by uneven depth, board misalignment, stress concentration and other factors in single-sided punching. This ensures that the cover film layer and the substrate layer in the punching area are cut off evenly and thoroughly, eliminating the hidden dangers of board separation difficulties and tearing damage caused by residual film layer from single-sided punching.

[0059] The combination of this structural design and milling process not only ensures regular punching boundaries and high dimensional accuracy, but also provides sufficient overall rigidity and positioning stability for subsequent integrated circuit 500 welding processes. At the same time, it achieves smooth final board separation without residue or damage to effective circuitry, improving the reliability, processing consistency and overall product yield of the depth-controlled punching process.

[0060] Furthermore, the controlled depth punching is performed from the two surfaces of the other surface patterning board to the inner layer circuit pattern 400, and punching into the inner layer circuit pattern 400 to a depth of 8 micrometers to 25 micrometers.

[0061] Since factors such as sheet thickness deviation, die wear, and slight warping of the board surface can easily cause the actual die cutting depth to deviate from the design value, depth compensation of 8 micrometers to 25 micrometers can effectively offset the above processing errors, ensuring that the depth-controlled die cutting is accurately applied to the position of the inner layer circuit pattern 400, and can cut off a certain thickness of the inner layer circuit pattern 400, so that a die cutting indentation is formed on the copper layer surface of the inner layer circuit pattern 400, which facilitates the subsequent peeling of the flexible board 30.

[0062] Furthermore, the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 extends to the edge of the unit plate 1010 between the forming line 100.

[0063] These two auxiliary copper patterns are not connected to the circuit pattern of the effective area 200, nor do they extend into the effective area 200; a gap is maintained between them.

[0064] Because the second punching line 120 uses controlled-depth punching, the board is not completely punched off, and unit board 1010 is still in a semi-connected state. During the subsequent board separation and tearing process, if the auxiliary copper pattern is directly connected to the effective circuit pattern, the tearing stress will be transmitted along the copper layer to the effective area 200, which can easily lead to circuit tearing or damage to the board substrate.

[0065] Therefore, by independently setting the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 in the area between the edge of the unit board 1010 and the forming line 100, and maintaining a gap with the effective circuit pattern, the tearing stress can be effectively blocked and act only on the first auxiliary copper pattern 2010 or the second auxiliary copper pattern 2020 itself, thereby protecting the integrity of the circuit pattern in the effective area 200 and the strength of the board structure, avoiding irreversible damage during board separation, and further improving the processing reliability and finished product yield of the flexible board 30.

[0066] Optionally, the subsequent process includes removing the invalid area 300 of the punched plate, and then using laser ablation to trim the edge of the unit plate 1010.

[0067] First, removing the stripping invalid area 300 can eliminate the non-functional areas left over from the processing of panel 10, reducing the interference of redundant structures on subsequent assembly and welding. Then, the edge of unit board 1010 is precisely trimmed at the micron level through laser ablation, effectively eliminating processing defects such as burrs, warping, and copper overflow left over from punching, making the board edge flat and smooth, and the dimensional accuracy strictly matching the design requirements, avoiding problems such as excessive assembly gaps and integrated circuit 500 welding misalignment caused by irregular board edges.

[0068] It is worth noting that the laser ablation cutting process has a small heat-affected zone and will not damage the internal effective circuitry, cover film, or soldered integrated circuits 500 of the unit board 1010. It can achieve fine cleaning of the board edge while ensuring structural integrity and electrical performance stability.

[0069] Please see Figure 7 , Figure 7 This is a physical schematic diagram of the flexible plate according to an embodiment of the present invention.

[0070] This embodiment also discloses a flexible plate 30. The flexible plate 30 made by the above-described manufacturing method has high dimensional accuracy and high material utilization, and is suitable for the high precision and high reliability requirements of 3D printer modules.

[0071] Furthermore, an integrated circuit 500 or a chip is welded to the surface of the flexible board 30 to form an applicable integrated flexible board.

[0072] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a flexible sheet with an intensive green design for a 3D printer, wherein the flexible sheet is processed by splicing according to design data, the design data including forming lines, the area within the forming lines being the effective area, and other areas being the ineffective area, characterized in that... The manufacturing method includes the following steps: S10: Design a panel consisting of several adjacent unit panels joined together without gaps, according to the design data; The forming line includes a first punching line and a second punching line. The first punching line is set at the adjacent boundaries in the length direction of the panel, and the second punching line is set at the adjacent boundaries in the width direction; S20: A flexible core board is manufactured according to the design data. The flexible core board includes a circuit pattern. Then, a cover film is taken and a window is made on the cover film. After that, the windowed cover film is attached to the surface of the flexible core board to form a surface pattern board. S30: The surface pattern plate is fully punched along the first punching line, and then the depth is controlled along the second punching line to form a punched plate, which is then processed in subsequent processes to form the flexible plate.

2. The manufacturing method as described in claim 1, characterized in that, The circuit pattern includes a first auxiliary copper pattern; The flexible core board has the first auxiliary copper pattern on the first punching line, and the first auxiliary copper pattern is not broken during the complete punching.

3. The manufacturing method as described in claim 2, characterized in that, The circuit pattern includes a second auxiliary copper pattern; The flexible core board has a second auxiliary copper pattern on the second punching line, and the controlled-depth punching does not break the second auxiliary copper pattern.

4. The manufacturing method as described in claim 3, characterized in that, The first auxiliary copper pattern or the second auxiliary copper pattern is disposed in the invalid region and is adjacent to the circuit pattern whose length and width are both ≥254mm in the valid region.

5. The manufacturing method as described in claim 3, characterized in that, Forming the surface pattern plate includes: Choose single-sided flexible copper-clad laminates and double-sided flexible copper-clad laminates. An inner layer circuit pattern is fabricated on one side of the double-sided copper-clad flexible board corresponding to the first auxiliary copper pattern or the second auxiliary copper pattern to form a double-sided pattern board. Then, the single-sided flexible copper-clad board and the double-sided patterned board are laminated together, and the inner layer circuit pattern is laminated inside the board body; The surface pattern plate is formed.

6. The manufacturing method as described in claim 5, characterized in that, The controlled-depth punching involves punching from both surfaces of the surface patterning board to the inner layer circuit pattern, and into the inner layer circuit pattern to a depth of 8 to 25 micrometers.

7. The manufacturing method as described in claim 3, characterized in that, The first auxiliary copper pattern or the second auxiliary copper pattern extends to the edge of the unit plate between the forming line and the forming plate.

8. The manufacturing method as described in claim 1, characterized in that, The subsequent process includes removing the invalid area of ​​the punched plate, and then using laser ablation to trim the edge of the unit plate.

9. A flexible board, characterized in that, The flexible plate is manufactured using the manufacturing method described in any one of claims 1 to 8.

10. The flexible plate as described in claim 9, characterized in that, Integrated circuits or chips are welded to the surface of the flexible board to form an applicable integrated flexible board.

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