Method for improving expansion and contraction deformation of PCB

Abstract

The application provides a method for improving the expansion and contraction deformation of a PCB, which can accurately offset the expansion and contraction deformation of different areas and different units in the production and processing and subsequent use process by performing targeted expansion and contraction compensation on each shipment unit in advance, avoids the defect that the traditional overall compensation scheme cannot be subdivided to a single unit, effectively reduces the probability of part deviation when the PCB is subsequently mounted with components, improves the production precision and product yield of the PCB, and solves the technical problem of expansion and contraction out-of-tolerance of a single shipment unit.

Description

Technical Field

[0001] This application relates to the field of PCB manufacturing technology, specifically to a method for improving the expansion and contraction deformation of PCB boards. Background Technology

[0002] The main components of a PCB include glass fiber cloth, epoxy resin, copper foil, and ink. The most important components are glass fiber cloth and epoxy resin. These materials are highly susceptible to the effects of temperature and humidity during PCB production, subsequent processing, and use, as well as the operating environment. This can lead to abnormal expansion and contraction of the PCB, resulting in component misalignment during component mounting or use.

[0003] In conventional PCB manufacturing, the graphic design is carried out according to the original design drawings at a 1:1 scale. Then, when producing film or exporting production data, the entire PNL board is enlarged or reduced by a certain coefficient. This method can only compensate for the expansion and contraction offset of the entire PNL film or production data when transferring the graphic design to the board, but it cannot subdivide the expansion and contraction adjustment of each shipping unit. In subsequent processing and use, expansion and contraction phenomena will still occur in individual sets or individual PCs. Therefore, there is an urgent need for a method that can improve the expansion and contraction adjustment of individual shipping units.

[0004] Application content

[0005] Given that the background technology only performs uniform expansion and contraction compensation on the entire PNL board during PCB manufacturing, and cannot compensate for different shipping units separately, resulting in expansion and contraction misalignment of individual shipping units during subsequent processing and assembly, this application provides a method to improve PCB board expansion and contraction deformation, including the following steps:

[0006] S1, acquire multiple shipping units of the PCB board;

[0007] S2, based on the expected expansion and contraction changes during the PCB board production process, perform expansion and contraction compensation processing on each of the shipping units to obtain the compensated shipping units.

[0008] S3 involves panelizing multiple shipping units that have undergone expansion and contraction compensation to form a PNL production pattern for PCB production.

[0009] S4. PCB production is carried out according to the PNL production pattern to obtain the finished PCB.

[0010] As an improvement to this application, the shipping unit includes a single SET or a single PCS in the PCB manufacturing process.

[0011] As an improvement to this application, the expansion / contraction compensation process includes:

[0012] The compensation amount is determined based on the characteristics of the PCB material, the production environment, and the processing conditions, and the size of each shipping unit is adjusted by enlarging or shrinking according to the compensation amount.

[0013] As an improvement to this application, the compensation amount is set according to unit length.

[0014] As an improvement to this application, the compensation amount is an increase or decrease of 1mil to 2mil per 100mm.

[0015] As an improvement to this application, multiple shipping units that have undergone expansion and contraction compensation processing are spliced ​​together in a preset arrangement to form a PNL production pattern.

[0016] As an improvement to this application, the expansion and contraction compensation process includes: adjusting the dimensions of the shipping unit in the length and width directions respectively.

[0017] As an improvement to this application, the PNL production pattern is used to generate PCB production data, which is then used in subsequent PCB processing steps.

[0018] As an improvement to this application, the PCB production data includes photoplotting production film.

[0019] This application also provides a PCB board that uses a method described in any of the above claims to improve the expansion and contraction deformation of the PCB board for expansion and contraction compensation design.

[0020] The beneficial effects of this application are as follows: Compared with the prior art, the method provided by this application for improving the expansion and contraction deformation of PCB boards can accurately offset the expansion and contraction deformation of different areas and different units during production and subsequent use by performing targeted expansion and contraction compensation for each shipping unit in advance. This avoids the defects of traditional overall compensation schemes that cannot be subdivided into individual units, effectively reduces the probability of component misalignment when mounting components on the PCB, improves PCB production accuracy and product yield, and solves the long-standing technical problem of excessive expansion and contraction of individual shipping units.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in this application will be briefly described below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort.

[0023] Figure 1 This is a flowchart illustrating a method for improving the expansion and contraction deformation of a PCB board according to this application.

[0024] Figure 2 This is a schematic diagram of the existing overall PNL board compensation method;

[0025] Figure 3 This is a schematic diagram of the unit-level expansion and contraction compensation method in this application. Detailed Implementation

[0026] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0027] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0028] In this document, the term "comprising" indicates the presence of a described feature, integral, step, operation, element, and / or component, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," with exclusions being otherwise specifically emphasized. Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying one or more of the feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0029] In this text, the term "and / or" simply describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " in this text generally indicates that the preceding and following related objects have an "or" relationship.

[0030] The main components of a PCB include glass fiber cloth, epoxy resin, copper foil, and ink. The most important components are glass fiber cloth and epoxy resin. These materials are highly susceptible to the effects of temperature and humidity during PCB production, subsequent processing, and use, as well as the operating environment. This can lead to abnormal expansion and contraction of the PCB, resulting in component misalignment during component mounting or use.

[0031] In conventional PCB manufacturing, the graphic design is carried out according to the original design drawings at a 1:1 scale. Then, when producing film or exporting production data, the entire PNL board is enlarged or reduced by a certain coefficient. This method can only compensate for the expansion and contraction offset of the entire PNL film or production data when transferring the graphic design to the board, but it cannot subdivide the expansion and contraction adjustment of each shipping unit. In subsequent processing and use, expansion and contraction phenomena will still occur in individual sets or individual PCs. Therefore, there is an urgent need for a method that can improve the expansion and contraction adjustment of individual shipping units.

[0032] To address the technical issue of only uniformly compensating for the overall PNL board during PCB manufacturing, which fails to compensate for individual shipping units and results in continued expansion and contraction misalignment in individual shipping units during subsequent processing and assembly, such as... Figure 1 As shown, this application provides a method for improving the expansion and contraction deformation of a PCB board, including the following steps:

[0033] S1, acquire multiple shipping units of the PCB board;

[0034] S2, based on the expected expansion and contraction changes during the PCB board production process, perform expansion and contraction compensation processing on each shipping unit to obtain the compensated shipping unit.

[0035] S3 involves panelizing multiple shipping units that have undergone expansion and contraction compensation to form a PNL production pattern for PCB production.

[0036] S4. PCB production is carried out according to the PNL production pattern to obtain the finished PCB.

[0037] First, multiple shipping units are obtained from the PCB design file. Each shipping unit is a design unit that ultimately forms a single product during PCB production, and each shipping unit corresponds to an independent PCB product area. Then, based on the dimensional changes caused by temperature and humidity during PCB production, processing, and use, expansion and contraction compensation is performed on each shipping unit. The corresponding compensation direction and amount are determined, and the graphic dimensions of each shipping unit are adjusted to offset the expansion and contraction changes during subsequent production. After completing the compensation processing for each shipping unit, multiple compensated shipping units are spliced ​​together according to a preset arrangement to form a PNL production graphic for PCB production. Finally, subsequent PCB production processing is carried out based on the formed PNL production graphic. This application changes the traditional method of uniformly compensating for expansion and contraction of the entire PNL board by refining the compensation object from the entire PNL board to each independent shipping unit. This allows shipping units in different areas and positions to receive corresponding compensation amounts, improving the accuracy of PCB expansion and contraction compensation, reducing defects caused by dimensional deviations of individual shipping units during component insertion, processing, and assembly, and improving PCB production yield.

[0038] In this embodiment, the shipping unit includes a single SET or a single PCS in the PCB manufacturing process. During the PCB design stage, the PNL board is divided into multiple SET areas, and each SET area further corresponds to one or more PCS products. Independent compensation parameters are established for different SETs or PCS, and the dimensions are adjusted according to the actual expansion and contraction requirements of each unit. After compensation, multiple compensated SETs or PCS are recombined to form the PNL production pattern. This application further refines the compensation object to the SET or PCS level, so that expansion and contraction compensation can correspond to the actual shipped products, rather than adjusting only the production panel as a whole. This can reduce the dimensional deviation between different product units within the same PNL board caused by differences in material distribution and processing environment, and improve the dimensional consistency of individual products.

[0039] In this embodiment, the expansion / contraction compensation process includes:

[0040] The compensation amount is determined based on the PCB material characteristics, production environment, and processing conditions, and the size of each shipping unit is adjusted by enlarging or shrinking according to the compensation amount. When performing expansion and contraction compensation, the compensation parameters are determined based on the factors that affect the size changes during PCB production. The influencing factors include the PCB material composition, the thermal expansion and contraction characteristics of epoxy resin and glass cloth, the temperature and humidity of the production and processing environment, and the subsequent processing conditions. Based on the above factors, the possible size change trend of the PCB board is analyzed, and a corresponding compensation amount is set for each shipping unit.

[0041] When the PCB board is expected to shrink in size, the corresponding shipping unit is compensated for by enlarging in size. When the PCB board is expected to enlarge in size, the corresponding shipping unit is compensated for by shrinking in size. This means that the expansion and contraction compensation no longer uses a fixed ratio for uniform adjustment, but can be targeted to compensate according to the actual change trend. Therefore, it can improve the accuracy of compensation and reduce the impact of environmental factors on the PCB dimensional stability.

[0042] For example, in multilayer board structures, during the expansion and contraction compensation process, the graphic of the shipping unit in a single layer board can be individually matched with the corresponding compensation amount based on the differences in expansion and contraction characteristics of different layer materials. This allows the size of each layer graphic to adapt to the expansion and contraction pattern after final production, further improving the dimensional accuracy of the entire board's shipping units. The panelization process specifically involves keeping the compensated graphic size of each shipping unit unchanged, only adjusting the spacing and relative position between shipping units to obtain PNL production graphics that meet production requirements. After PCB production is completed, the boards are then cut according to individual shipping units to obtain finished PCBs with the required dimensional accuracy.

[0043] In this embodiment, the compensation amount is set according to unit length. For example, every 100mm is used as the compensation benchmark. Based on the dimensional changes generated during PCB production, the corresponding dimensions are increased or decreased by a preset size. Through unit length compensation, shipping units of different sizes can be compensated according to a unified rule. The compensation amount is adjusted proportionally with the PCB size change to improve the consistency of compensation rules between products of different sizes. Furthermore, the compensation amount is increased or decreased by 1mil to 2mil every 100mm. When the length dimension of a shipping unit is 100mm, the dimension in this direction is increased by 1mil to 2mil during the production data design stage. When the size increases, corresponding compensation is performed according to the proportional relationship. Multiple shipping units after compensation are used for subsequent PNL panelization. By setting a specific compensation range, the PCB production data can offset the dimensional shrinkage that may occur during production in advance. Compared with the traditional overall fixed coefficient adjustment method, this application can achieve precise compensation at the unit level and improve product dimensional stability.

[0044] In this embodiment, multiple shipping units that have undergone expansion and contraction compensation are spliced ​​together according to a preset arrangement to form a PNL production graphic. During the arrangement process, the positional relationship between each shipping unit is maintained, and the compensated units are combined to form a complete PNL production graphic. This PNL production graphic serves as the basis for subsequent photoplotting production film or production data output, avoiding local offsets caused by different expansion and contraction degrees of different units.

[0045] In this embodiment, the expansion and contraction compensation process includes: adjusting the dimensions of the shipping unit in the length and width directions respectively. Specifically, according to the dimensional changes of the PCB board in the X and Y directions, X-direction compensation parameters and Y-direction compensation parameters are set respectively, and the dimensions of each shipping unit are adjusted in the X and Y directions respectively. By controlling the compensation amount in different directions respectively, the problem of different expansion and contraction degrees of PCB materials in different directions can be solved, and the accuracy of two-dimensional dimensional compensation can be improved.

[0046] In this embodiment, the PNL production pattern is used to generate PCB production data, which is then used in subsequent PCB processing steps. After completing cell compensation and PNL panelization, the resulting PNL production pattern is converted into PCB production data for subsequent exposure, processing, and other production processes. This allows expansion and contraction compensation to be directly applied to the source of the PCB production data, offsetting the impact of dimensional changes before production and reducing the need for adjustments in subsequent processes. Furthermore, the PCB production data includes photoplotting production film. Before generating the photoplotting production film, the corresponding film data is output based on the compensated PNL production pattern, thereby introducing cell-level expansion and contraction compensation in the film output stage, enabling the pattern to maintain higher positional accuracy during the transfer to the PCB board.

[0047] This application also provides a PCB board that uses any of the above-mentioned methods to improve the expansion and contraction deformation of the PCB board for expansion and contraction compensation design.

[0048] In this embodiment, as Figure 2 As shown, Figure 2 This diagram illustrates the use of an integral PNL board for expansion and contraction compensation in the existing PCB manufacturing process.

[0049] In the existing PCB production process, a corresponding PNL (Panel Block) panel pattern is usually generated based on the PCB design drawings. When outputting production data, the entire PNL board is enlarged or reduced according to the expansion and contraction changes of the PCB material during production and processing, based on a uniform compensation coefficient. Specifically, the PNL board includes multiple shipping units arranged in a preset manner. Each shipping unit together forms a complete PNL board. When performing expansion and contraction compensation, the entire PNL board is treated as a whole compensation object and compensated along the X or Y direction. The overall size of the PNL board is adjusted simultaneously according to the preset compensation coefficient, so that the size of each shipping unit on the PNL board changes synchronously.

[0050] For example, when PCB material is expected to shrink in size during production, the entire PNL board is enlarged according to a preset ratio during the production data stage to offset the size reduction in subsequent processing. Since the material state, heating conditions and processing environment of different areas of the PNL board may differ, the actual expansion and contraction of the shipping units at different locations are not completely consistent. While using the entire PNL board as a unified compensation method can improve the overall size deviation, it cannot accurately compensate for individual shipping units, resulting in some shipping units still having size offset problems.

[0051] Correspondingly, such as Figure 3 As shown, Figure 3 The diagram shows a method for improving the expansion and contraction deformation of a PCB board provided in this application, after expansion and contraction compensation is performed on a single shipping unit.

[0052] and Figure 2 The overall PNL compensation method shown is different. When designing PCB production data, this application first identifies multiple shipping units in the PNL board independently and sets corresponding expansion and contraction compensation parameters for each shipping unit.

[0053] Specifically, based on the potential dimensional changes of each shipping unit during PCB production, the dimensions of each shipping unit are adjusted in the X or Y direction to ensure that each shipping unit has a corresponding compensation amount. After completing the expansion and contraction compensation for each shipping unit, multiple compensated shipping units are spliced ​​together according to a preset arrangement to form a PNL production pattern for PCB production. When a shipping unit is expected to shrink in a certain direction during production, the corresponding direction of the shipping unit is enlarged and compensated during the production data design stage. For other shipping units with different expansion and contraction changes, different compensation amounts are set according to their actual needs. Through the above methods, each shipping unit in the PNL board has an independent expansion and contraction compensation effect, thereby avoiding the dimensional deviation of individual products due to differences in expansion and contraction in different areas of the PNL board.

[0054] Depend on Figure 2 and Figure 3In comparison, existing technologies typically use the entire PNL board as a unified compensation object, adjusting the overall board size through a single compensation coefficient. This application, however, changes the traditional compensation method, shifting the compensation object from the entire PNL board to multiple independent shipping units. This application first compensates for the expansion and contraction of each shipping unit separately, then reassembles the compensated shipping units to form a PNL production pattern. This ensures that shipping units in different areas receive a more matching compensation amount. Therefore, this application can improve the matching degree between PCB production data and actual processing changes, reduce positional shifts caused by expansion and contraction differences in individual shipping units, and improve dimensional stability during PCB manufacturing.

[0055] The advantages of this application are:

[0056] This application improves upon the traditional method of uniformly adjusting the expansion and contraction of the entire PNL board by performing expansion and contraction compensation for each shipping unit separately. After completing the unit compensation, the boards are reassembled to form the PNL pattern for production. This improves the accuracy of expansion and contraction compensation from the overall level to the unit level, accurately offsetting dimensional changes caused by material properties, temperature and humidity environment, and processing conditions during PCB production. This improves the dimensional stability of the PCB board, reduces the defect rate in subsequent insertion, processing, and assembly processes, and increases production yield.

[0057] It should be noted that this application is not limited to the above-described embodiments. The above embodiments are merely examples, and any embodiments with the same structure and effect as the technical concept within the scope of this application are included in the technical scope of this application. Furthermore, various modifications that can be conceived by those skilled in the art to the embodiments, and other ways of constructing by combining some of the constituent elements of the embodiments, without departing from the spirit of this application, are also included in the scope of this application.

Claims

1. A method for improving the expansion and contraction deformation of a PCB board, characterized in that, Includes the following steps: S1, obtain multiple shipping units of the PCB board; S2, based on the expected expansion and contraction changes during the PCB board production process, perform expansion and contraction compensation processing on each of the shipping units to obtain the compensated shipping units; S3 involves panelizing multiple shipping units that have undergone expansion and contraction compensation to form a PNL production pattern for PCB production. S4. PCB production is carried out according to the PNL production pattern to obtain the finished PCB.

2. The method for improving the expansion and contraction deformation of a PCB board according to claim 1, characterized in that, The shipping unit includes a single SET or a single PCS in the PCB manufacturing process.

3. The method for improving the expansion and contraction deformation of a PCB board according to claim 1, characterized in that, The expansion / contraction compensation process includes: The compensation amount is determined based on the characteristics of the PCB material, the production environment, and the processing conditions, and the size of each shipping unit is adjusted by enlarging or shrinking according to the compensation amount.

4. The method for improving the expansion and contraction deformation of a PCB board according to claim 3, characterized in that, The compensation amount is set according to the unit length.

5. The method for improving the expansion and contraction deformation of a PCB board according to claim 4, characterized in that, The compensation amount is an increase or decrease of 1mil to 2mil per 100mm.

6. The method for improving the expansion and contraction deformation of a PCB board according to claim 1, characterized in that, Multiple shipping units, after undergoing expansion and contraction compensation processing, are spliced ​​together according to a preset arrangement to form a PNL production diagram.

7. The method for improving the expansion and contraction deformation of a PCB board according to claim 1, characterized in that, The expansion and contraction compensation process includes adjusting the dimensions of the shipping unit in both the length and width directions.

8. The method for improving the expansion and contraction deformation of a PCB board according to claim 1, characterized in that, The PNL production pattern is used to generate PCB production data, which is then used in subsequent PCB manufacturing processes.

9. A method for improving the expansion and contraction deformation of a PCB board according to claim 8, characterized in that, The PCB production data includes photoplotting production films.

10. A PCB board, characterized in that, The method for improving the expansion and contraction deformation of PCB boards as described in any one of claims 1-9 is used for expansion and contraction compensation design.

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