Burn-in board, burn-in device, and burn-in process

Abstract

The present disclosure provides a burn-in board, a burn-in device, and a burn-in process. The burn-in board includes a board substrate including a front surface and a back surface, a plurality of sockets mounted on the front surface of the board substrate, and a wiring system located in the board substrate and electrically connected to the sockets. The sockets are configured into a plurality of groups by the wiring system. Each of the groups includes four sockets arranged in a 2x2 square.

Description

[0001] Related applications

[0002] This application claims priority to U.S. Patent Application No. 19 / 098,121 (priority date: April 2, 2025), the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to a pre-firing plate, a pre-firing apparatus having the pre-firing plate, and a pre-firing process using the pre-firing plate. In particular, it relates to a pre-firing plate having group sockets. Background Technology

[0004] Semiconductor components are used in a wide range of electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic devices. The size of semiconductor components continues to shrink to meet the ever-increasing demand for computing power. However, various problems arise during the miniaturization process, and these problems are constantly increasing. Therefore, challenges remain in improving quality, yield, performance, and reliability, as well as reducing complexity.

[0005] The prior art description above is merely to provide background information and does not acknowledge that the prior art description above discloses the subject matter of this disclosure. It does not constitute prior art of this disclosure, and no description of the prior art above should be considered part of this case. Summary of the Invention

[0006] One aspect of this disclosure provides a burn-in board, comprising: a board substrate including a front surface and a rear surface; a plurality of sockets mounted on the front surface of the board substrate; and a wiring system located in the board substrate and electrically connected to the sockets. The sockets are configured into multiple groups by the wiring system. Each of the groups includes four sockets arranged in a 2x2 square.

[0007] Another aspect of this disclosure provides a pre-firing apparatus, comprising: a pre-firing chamber; a pre-firing plate housed within the pre-firing chamber; a test power supply electrically connected to the pre-firing plate; and a pre-firing controller electrically connected to the pre-firing plate. The pre-firing plate includes: a substrate having a front surface and a rear surface; a plurality of sockets mounted on the front surface of the substrate; and a wiring system located in the substrate and electrically connected to the sockets, wherein the sockets are configured into multiple groups via the wiring system, and each group includes four sockets arranged in a 2x2 square array.

[0008] Another aspect of this disclosure provides a pre-burn-in process, comprising: providing a plurality of devices under test (DUTs); providing a pre-burn-in board, comprising: a substrate including a front surface and a rear surface; a plurality of sockets mounted on the front surface of the substrate; and a wiring system located in the substrate, electrically connected to the sockets, and configuring the sockets into a plurality of groups, wherein each of the groups includes four sockets arranged in a 2x2 square array; mounting the DUTs onto the sockets; placing the pre-burn-in board in a pre-burn-in chamber of a pre-burn-in apparatus and electrically connecting the pre-burn-in board and the pre-burn-in apparatus; performing a stress test on the DUTs; a pre-burn-in controller of a pre-burn-in apparatus providing signals to the DUTs through the wiring system of the pre-burn-in board and receiving signals from the DUTs; and recording the test results through the pre-burn-in controller of the pre-burn-in apparatus.

[0009] Due to the design of the pre-burn-in board disclosed herein, the number of sockets can be increased (e.g., up to 320 sockets) without affecting signal synchronization between sockets in different groups or within the same group. This is achieved by customizing the signal transmission path according to the wiring system.

[0010] The technical features and advantages of this disclosure have been broadly summarized above, thus enabling a better understanding of the detailed description of this disclosure that follows. Other technical features and advantages forming the subject matter of the claims will be described below. Those skilled in the art to which this disclosure pertains will understand that the concepts and specific embodiments disclosed below can be readily utilized to achieve the same purpose as this disclosure through modifications or design of other structures or processes. Those skilled in the art will also understand that such equivalent constructions cannot depart from the concept and scope of this disclosure as defined by the claims. Attached Figure Description

[0011] A more complete understanding of this disclosure can be obtained by referring to the detailed description and claims when considered in conjunction with the accompanying drawings, wherein similar reference numerals represent similar elements throughout the drawings, and:

[0012] Figure 1 A front view of the pre-burning apparatus is shown according to an embodiment of the present disclosure.

[0013] Figure 2 A block diagram showing the system configuration of the pre-burning apparatus according to an embodiment of the present disclosure.

[0014] Figure 3 and Figure 4 A plan view of the wiring system of a preheated board is shown according to an embodiment of the present disclosure.

[0015] Figure 5 The wiring circuit of the pre-burned board is shown according to an embodiment of the present disclosure.

[0016] Figure 6 show Figure 5 Signal characteristics in wiring circuits.

[0017] Figure 7 The message indicates that the message has been successfully passed. Figure 5 The rise time diagram of the signal transmitted by the wiring circuit in the diagram.

[0018] Figure 8 The wiring circuit of the pre-burned board is shown according to another embodiment of the present disclosure.

[0019] Figure 9 A perspective view of a pre-burned plate having an anti-flexural structure is shown according to an embodiment of the present disclosure.

[0020] Figure 10 A vertical cross-sectional view of a pre-fired plate with an anti-flexural structure is shown according to an embodiment of the present disclosure.

[0021] Figure 11 A perspective view of a pre-burnt plate having an anti-flexural structure is shown according to another embodiment of this disclosure.

[0022] Figure 12 A perspective view of an anti-flexural structure on a preheated plate is shown according to another embodiment of this disclosure.

[0023] Figure 13 A vertical cross-sectional view of a pre-burned plate with an anti-flexural structure is shown according to another embodiment of the present disclosure.

[0024] Figure 14 and Figure 15 The wiring circuit of the pre-burned board is shown according to an embodiment of the present disclosure.

[0025] Figure 16 and Figure 17 The message indicates that the message has been successfully passed. Figure 14 and Figure 15 The rise time diagram of the signal transmitted by the wiring circuit in the diagram.

[0026] Figure 18 According to an embodiment of this disclosure, the pre-burning process is shown in the form of a flowchart.

[0027] The reference numerals in the attached figures are explained as follows:

[0028] 1: Pre-firing device

[0029] 2a: Through hole

[0030] 3: Connecting rod

[0031] 4: Flame retardant

[0032] 5: Strengthen the framework

[0033] 6: Protective cover

[0034] 10: Pre-firing process

[0035] 11: Pre-burning chamber

[0036] 12: Test power supply

[0037] 13: Pre-burn-in controller

[0038] 20: Pre-fired plate

[0039] 22: Support rod

[0040] 40: Board substrate

[0041] 40BS: Rear surface

[0042] 40FS: Front Surface

[0043] 50: Wiring System

[0044] 50a1~50h10: First wiring system

[0045] 51a1~51a10: Wiring

[0046] 60a~60p: Second wiring system

[0047] 62a1~62a19: Connecting wires

[0048] 70: Socket

[0049] 70A1~70P 20 :socket

[0050] 75A~75P: Row

[0051] 80: Connector

[0052] 90: Compensation circuit

[0053] 91: Capacitor

[0054] 92: Resistor

[0055] 95: Compensation Circuit

[0056] 96: Capacitor

[0057] 97: Resistor

[0058] 100: Component under test

[0059] 111: Constant Temperature Room

[0060] 111C: Capacitor

[0061] 112: Door

[0062] 112C: Capacitor

[0063] 113: Slot

[0064] 114: Track

[0065] 115: Connector

[0066] 116: Evaporator

[0067] 117: Heater

[0068] 118: Fan

[0069] A: signal

[0070] B: Signal

[0071] FSS: Flexural Structure

[0072] G1~G80: Groups

[0073] Ka: Minimum gain

[0074] Kb: Maximum gain

[0075] S11: Steps

[0076] S13: Steps

[0077] S15: Steps

[0078] S17: Steps

[0079] S19: Steps

[0080] T1: Ascent Time

[0081] T2: Rise Time

[0082] X: Direction

[0083] Y: direction

[0084] Z: Direction Detailed Implementation

[0085] The following disclosure provides numerous different embodiments or examples of various components for implementing the embodiments of this disclosure. Specific examples of elements and their arrangements are described below to simplify the embodiments of this disclosure. These are merely examples and should not be construed as limiting the scope of the embodiments of this disclosure. For example, when the description refers to a first component being formed "on" or "on" a second component, it may include embodiments where the first and second components are in direct contact, or embodiments where other components are formed between them without direct contact. Furthermore, reference numerals and / or designations may be repeated in different embodiments of this disclosure. These repetitions are for simplification and clarity and are not intended to define relationships between the different embodiments and / or structures discussed.

[0086] Furthermore, spatially related terms such as "below," "below," "lower," "above," "higher," and similar terms are used to facilitate the description of the relationship between one element or component and another shown in the accompanying drawings. These spatial relation terms are used to cover different orientations of the elements in use or operation, beyond those depicted in the accompanying drawings. Elements may be rotated to different orientations (90 degrees or other orientations), and the spatially related adjectives used therein can be interpreted in the same way.

[0087] It should be understood that when a component or layer is referred to as being "connected to" or "coupled to" another component or layer, it may be a direct connection or coupling to another component or layer, or there may be an intermediate component or layer.

[0088] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. Unless otherwise stated, these terms are used only to distinguish one element from another. Thus, for example, without departing from the teachings of this disclosure, the first element, first component, or first part discussed below may be referred to as the second element, second component, or second part.

[0089] Unless the context otherwise indicates, the use of terms such as “same,” “equal,” “planar,” or “coplanar” in reference to orientation, layout, location, shape, size, quantity, or other measures does not necessarily imply identical orientation, layout, location, shape, size, quantity, or other measures, but is intended to cover orientation, layout, location, shape, size, quantity, or other measures that are substantially identical within acceptable variations, for example, due to manufacturing processes. The term “substantially” may be used in this document to reflect this meaning. For example, items described as “substantially same,” “substantially equal,” or “substantially planar” may be exactly the same, equal, or planar, or may be the same, equal, or planar within acceptable variations, for example, due to manufacturing processes.

[0090] It should be noted that in the description of this disclosure, "above" or "up" corresponds to the direction of the arrow in the Z direction, and "below" or "down" corresponds to the direction of the arrow opposite to the Z direction.

[0091] Figure 1 A front view of the pre-burning apparatus 1 is shown according to an embodiment of the present disclosure. Figure 2 A block diagram showing the system configuration of the pre-burning apparatus 1 according to an embodiment of the present disclosure. Figure 3 and Figure 4 A plan view of the wiring system 50 of the preheated board 20 is shown according to an embodiment of the present disclosure. Figure 5The wiring circuit of the pre-burned board 20 is shown according to an embodiment of the present disclosure. Figure 6 show Figure 5 Signal characteristics in wiring circuits. Figure 7 The message indicates that the message has been successfully passed. Figure 5 A graph showing the rise time of signals transmitted by the wiring circuit. Figure 8 The wiring circuit of the pre-burned board 20 is shown according to another embodiment of the present disclosure.

[0092] The burn-in process is used to test hardware components, identifying defective parts through stress testing. During this process, components may be subjected to higher or more sustained voltages than they experience during normal operation. To further increase the stress, the burn-in process can be performed in a high-temperature environment, such as in a burn-in apparatus.

[0093] The components undergoing the pre-burn-in process can be connected to a pre-burn-in device, which typically consists of a pre-burn-in chamber and a pre-burn-in controller. The pre-burn-in chamber can house a pre-burn-in board. The pre-burn-in board may include sockets that allow multiple devices under test (DUTs, i.e., hardware components) to be installed and pre-burned in simultaneously. The pre-burn-in device integrated with the pre-burn-in chamber can be responsible for providing various signals to and receiving various signals from the DUTs via the pre-burn-in board.

[0094] During operation, the burn-in device applies a power supply voltage to the device under test (DUT), facilitating signal input and output while subjecting the DUT to thermal stress. For example, the thermal stress range can be from approximately -25°C to approximately +125°C. By combining electrical and thermal stress in a controlled environment, the burn-in process effectively screens DUTs to ensure reliability and defect identification.

[0095] Reference Figure 1 and Figure 2 A pre-burning device 1 can be provided. In some embodiments, the pre-burning device 1 may include a pre-burning chamber 11, a test power supply 12, and a pre-burning controller 13. The pre-burning chamber 11 may accommodate a plurality of pre-burning plates 20 and apply thermal stress to the device under test 100 mounted on the pre-burning plates 20 during the pre-burning process.

[0096] In some embodiments, the pre-burning chamber 11 may include a constant temperature chamber 111 defined by an insulated wall, and the constant temperature chamber 111 is equipped with a door 112 that can be opened and closed to allow entry and exit. Multiple slots 113 may be provided within the constant temperature chamber 111, each slot 113 being equipped with a pair of rails 114 for supporting both ends of the pre-burning plates 20. The pre-burning plates 20 can slide into place along the rails 114 through the door 112. In some embodiments, the constant temperature chamber 111 may contain two rows of slots 113, 24 levels per row, accommodating up to 48 pre-burning plates 20. The specific number and arrangement of the slots 113 can be adjusted according to testing efficiency and other considerations. Each slot 113 may include a connector electrically connected to the test power supply 12 and the pre-burning controller 13 to ensure that all pre-burning plates 20 are correctly integrated into the pre-burning device 1.

[0097] In some embodiments, the pre-burning chamber 11 may also be equipped with an evaporator 116, a heater 117, and a fan 118 to regulate the temperature within the constant temperature chamber 111. The air within the constant temperature chamber 111 can be cooled by the evaporator 116 or heated by the heater 117, while the fan 118 ensures uniform circulation. These components work together under the control of the pre-burning controller 13 to maintain the required thermal stress conditions. The test power supply 12 and the pre-burning controller 13 can be connected via connector 115 of the pre-burning device 1 to each element under test 100 on the pre-burning plate 20 to provide the necessary voltage and control signals.

[0098] The pre-burn-in controller 13 plays a crucial role in the pre-burn-in process. It manages the voltage applied to the device under test (DUT) 100, controls signal input and output, and regulates the temperature within the constant temperature chamber 111. Furthermore, the pre-burn-in controller 13 monitors the DUT 100 during the pre-burn-in process, identifying components exhibiting abnormal responses as defective. It records the serial numbers of these defective DUTs (corresponding to their slots and positions on the pre-burn-in board 20) and compiles test results for feedback. This integrated approach ensures thorough screening and reliable identification of defective components. In some embodiments, the pre-burn-in controller 13 can provide signals to the pre-burn-in board 20 through various channel types, including, but not limited to, clock channels (CLK), scan channels (SCAN), input / output channels (I / O), and optional address channels (ADD).

[0099] In some embodiments, the device under test 100 may include memory elements (e.g., static random access memory (SRAM), synchronous dynamic random access memory (SDRAM), flash memory (e.g., high-capacity NOR / NAND flash memory), memory cards (e.g., high-capacity Secure Digital (SD), Micro SD, CompactFlash, Solid State Disk (SSD), or any other non-volatile memory), memory cards, memory modules, or other semiconductor elements).

[0100] Reference Figure 2 and Figure 3 The pre-burn-in board 20 can be a key component of the pre-burn-in process, and may include a board-substrate 40, a plurality of sockets 70 for accommodating the component under test 100, a wiring system 50, and a connector 80 for establishing an electrical connection with the connector 115 of the pre-burn-in device 1. Each component may play a specific role in ensuring the functionality and reliability of the pre-burn-in process.

[0101] For the sake of brevity, clarity and ease of description, only one pre-burned plate 20 will be described.

[0102] In some embodiments, the substrate 40 may serve as the base for a pre-fired board, providing a platform for mounting other components. In some embodiments, the substrate 40 may have a generally rectangular shape. In some embodiments, the substrate 40 may include a material with insulating properties. In some embodiments, the substrate 40 may include, for example, a flame retardant material, a composite epoxy material, polyimide, or other applicable insulating materials. In some embodiments, the substrate 40 may be a multilayer board, and the wiring system 50 may be composed of conductive paths (such as wiring patterns and vias) formed in the substrate 40.

[0103] Connector 80 can be located at one end of the substrate 40, allowing connector 80 of pre-burning plate 20 to mate with pre-burning chamber 11. Alignment between connector 80 of pre-burning plate 20 and connector 115 of pre-burning device 1 establishes an electrical connection between socket 70 and pre-burning controller 13. The wiring length from each socket 70 to the connector depends on the position of the socket on pre-burning plate 20.

[0104] In some embodiments, the sockets 70 may be arranged in a matrix pattern on the front surface 40FS of the substrate 40. For example, 20 sockets 70 are aligned in one direction in each row, forming sequentially labeled socket rows (e.g., row 75A, row 75B). The pre-burn-in board 20 may include 16 rows (e.g., rows 75A to 75P), with 20 sockets in each row, for a total of 320 sockets. This arrangement maximizes the board's capacity and efficiency. However, the number and arrangement of the sockets can be adjusted as needed to meet specific testing requirements.

[0105] In some embodiments, each socket 70 may include a plurality of contact probes (e.g., 16 probes) that make electrical contact with the terminals of the device under test 100. Once the device under test 100 is installed, the contact probes ensure a secure and reliable electrical connection, thereby enabling accurate testing.

[0106] The relationship between wiring length and signal delay is a critical factor in electrical system design and performance, especially in high-speed or high-frequency circuits. Signal delay, or propagation delay, refers to the time required for an electrical signal to travel from one point to another. This delay is directly affected by the physical length of the wiring, as the signal must travel through the entire conductor at a finite propagation speed.

[0107] Longer line lengths increase the total resistance, capacitance, and inductance of a circuit. These parasitic elements collectively affect the rise and fall times of signals, reducing propagation speed and introducing delay. Lines with branching points or forks (such as daisy-chain connections) increase the effective path length, exacerbating the problem. Inconsistent line lengths at branching points can lead to timing mismatches or deviations, disrupting the synchronous operation of the circuit. This effect is particularly pronounced in high-frequency systems, where even small differences in line length can cause significant phase shifts due to shorter signal wavelengths, potentially resulting in constructive or destructive interference.

[0108] The material properties of traces and insulation, including conductivity and dielectric constant, also affect signal delay. These properties vary with temperature, making longer traces more susceptible to temperature-induced delays. In sensitive applications such as printed circuit boards (PCBs) or burn-in boards, precise control of trace lengths is essential to minimize deviations and ensure signal consistency across all paths. Matching trace lengths and managing branch points within tight tolerances is critical for maintaining data integrity and synchronization.

[0109] In some embodiments, the pre-burned board 20 may include two types of wiring systems 50, such as a first wiring system 50a1 to 50h10 and a second wiring system 60a to 60p. The first wiring systems 50a1 to 50h10 and the second wiring systems 60a to 60p may have different connection configurations between the connector 80 and the socket 70 on the board substrate 40. The connection configuration represents the electrical connection topology between the connector 80 and the socket 70, which can be determined by the positional relationship of the wiring and branch points. The type of connection configuration is classified according to the presence and location of branch points. The first wiring systems 50a1 to 50h10 employ a connection configuration with branch points, while the second wiring systems 60a to 60p employ a connection configuration without branch points. The wiring system 50 is not limited to these two types and may include other connection configurations as needed.

[0110] Taking 50a1 as an example, representing the first wiring system 50a1 to 50h10, it employs a branch connection topology. Between connector 80 and socket 70, the wiring branches to connect multiple sockets. For example, in the first wiring system 50a1, the wiring branches into two paths between connector 80 and sockets 70A1 and 70B1. Subsequently, sockets 70 aligned in the same direction (such as sockets 70A1 and 70A2 or 70B1 and 70B2) are connected in a daisy-chain configuration. This topology ensures that the wiring length between the branch point and its corresponding socket, as well as between adjacent sockets within each daisy-chain, is substantially equal. Therefore, the signal transmission time of sockets connected through the same wiring system is effectively synchronized.

[0111] Similarly, subsequent first wiring systems, such as 50a2 and 50a3, use the same configuration as 50a1. For example, first wiring system 50a2 connects connectors to sockets 70A3, 70A4, 70B3, and 70B4, while first wiring system 50a3 connects sockets 70A5, 70A6, 70B5, and 70B6. All first wiring systems 50a1 to 50h10 use this pattern, with each system connecting four sockets arranged in two rows. The board substrate 40 can combine a total of 80 first wiring systems to accommodate 320 sockets distributed across 16 rows of sockets.

[0112] Conversely, the second wiring system, taking 60A as an example, uses a daisy-chain connection topology without branch points. In this configuration, single-row outlets (such as 70A1 to 70A) 20 The connections are made sequentially along a straight path. For example, in the second wiring system 60a, the sockets forming the socket bar 75A are connected sequentially via connecting lines 62a1 to 62a19. This configuration ensures simplicity of the wiring path and reduces complexity.

[0113] All subsequent second wiring systems (including 60b to 60p) have the same structure as second wiring system 60a, with each connected to a single row of outlets. For example, second wiring system 60b connects to outlets 70B1 to 70B. 20 This forms a socket strip 75B, while the second wiring system 60c connects sockets 70C1 to 70C in the socket strip 75C. 20 There are a total of 16 second wiring systems on the board substrate 40, each of which corresponds to one of the 16 socket bars.

[0114] The physical layout of the pre-burned board 20 positions the connector 80 at one end, while the sockets 70 are aligned in rows along the length of the board. Therefore, the wiring length between the connector 80 and the socket 70 increases with the distance between the socket 70 and the connector 80. For example, in the first wiring system 50a10, the length to socket 70A... 20 The cable length to the point furthest from the connector is longer than the cable length to the socket 70A1 (closest to the connector). This variation in cable length is inherent to the layout and can be managed through a consistent connection design to ensure stable signal transmission.

[0115] In the description of this disclosure, the direction from connector 80 to each socket row 75A to 75P (i.e., the Y direction) may be referred to as the signal transmission direction or the first direction.

[0116] Reference Figures 2 to 4 In some embodiments, the sockets 70 can be grouped according to the signal transmission path (e.g., wiring system 50). The sockets 70 are organized into a total of 80 groups, labeled groups G1 to G80. Each group includes four sockets 70, each socket accommodating one device under test (DUT) 100. In one group, two sockets (e.g., 70A1 and 70A2) are aligned along the signal transmission direction (i.e., the Y direction), while another two sockets (e.g., 70B1 and 70B2) are directly adjacent to sockets 70A1 and 70A2 respectively along a direction perpendicular to the signal transmission direction (i.e., the X direction). In other words, the four sockets 70 can be adjacent to each other and arranged in a 2x2 matrix along the Y and X directions. For example, sockets 70A1, 70A2, 70B1, and 70B2 are classified as group G1. Similarly, sockets 70A3, 70A4, 70B3 and 70B4 form group G2, while sockets 70C1, 70C2, 70D1 and 70D2 form group G11, and so on.

[0117] Reference Figure 5 and Figure 6This embodiment describes how a compensation circuit addresses signal attenuation and delay caused by long wiring paths, thereby ensuring consistent and reliable test results. Since the rise and fall of the test signal are symmetrical, this description focuses on the rise time, but these principles also apply to the fall time.

[0118] Different types of devices under test (DUTs) require different test signals. For example, clock testing involves only the input signal, resulting in a relatively low test speed and a long rise time. Conversely, memory testing requires high-speed operation, demanding short rise and fall times for both input and output signals to ensure accurate data transfer during write and read operations. The rise time of the test signal is significantly affected by the wiring length connecting connector 80 and receptacle 70. For example, in the same receptacle row 75A, a shorter wiring length (like the wiring length in the first wiring system connecting receptacles near the connector (e.g., 70A1)) results in minimal signal attenuation and a shorter rise time. Conversely, connecting to a more distant receptacle (e.g., 70A1) results in less signal attenuation and a shorter rise time. 20 Longer wiring paths will experience greater attenuation, resulting in longer rise times. For example, in the same group G1, sockets 70A2 and 70B2 with longer wiring will also experience greater attenuation compared to sockets 70A1 and 70B1 with shorter wiring.

[0119] Reference Figures 3 to 7 A compensation circuit 90 (also called a first compensation circuit 90) can be integrated to mitigate the adverse effects of long wiring lengths between groups of sockets 70 on the same socket strip. For example, for socket strip 75A, the compensation circuit 90 can be connected to a first wiring system 50a10 with extended lengths (e.g., wiring 51a10), such as connecting connector 80 to the furthest socket (e.g., 70A). 20 The first wiring system 50a10. The compensation circuit 90 can use an RC filter (including a parallel combination of capacitor 91 and resistor 92) to adjust the frequency characteristics of the transmitted signal. By acting as a high-pass filter, the compensation circuit 90 can reduce the amplitude of low-frequency components while amplifying high-frequency components. This adjustment effectively shortens the rise time of the signal, enabling the compensated signal to meet strict time requirements even when transmitted through long wiring.

[0120] In some embodiments, wiring 51a10 is not limited to being connected to compensation circuit 90, but may also be connected to, for example, a terminating resistor to achieve impedance matching between the input and output sides of the device under test 100. Compensation circuit 90 may also be connected to the first wiring system 50b1 to 50h10 or the second wiring system 60a to 60p, and is not limited to the first wiring system 50a1 to 50a10.

[0121] Figure 6 shows the frequency characteristic of the compensation circuit 90, where the horizontal axis represents frequency and the vertical axis represents gain. The compensation circuit 90 functions as a high-pass filter. When the frequency of the test signal exceeds the high-side threshold frequency (fb), the compensation circuit 90 transmits the signal at the maximum gain Kb. Conversely, when the frequency of the test signal is lower than the low-side threshold frequency (fa), the compensation circuit 90 transmits the signal at the minimum gain Ka. For frequencies between the low-side threshold frequency (fa) and the high-side threshold frequency (fb), the compensation circuit 90 outputs a signal whose gain increases with frequency, ranging from Ka to Kb. In effect, the compensation circuit 90 reduces the amplitude of the low-frequency components of the signal relative to the high-frequency components.

[0122] The threshold frequencies (fa, fb) and the corresponding gains Ka and Kb are configured according to the required rise time of the test signal. For example, to achieve a shorter rise time, the threshold frequencies (fa, fb) can be set to lower values. In this way, the frequency characteristic of the test signal adjusted by the compensation circuit 90 can be adjusted according to the required rise or fall time specifications of the test signal.

[0123] Figure 7 shows a comparison of the voltage characteristics of the signal compensated by the compensation circuit 90 and the signal not compensated by the compensation circuit 90. The vertical axis represents voltage, and the horizontal axis represents time. In this figure, Plot A represents the characteristic of signal A that is not compensated by the compensation circuit 90, and Plot B represents the characteristic of signal B that is compensated by the compensation circuit. The rise time of the test signal is defined as the time required for the voltage to change from 20% to 80% of its maximum value during the rising period, assuming that the maximum voltage at the time of rising is 100%. In Figure 7 , A(100%) represents the maximum voltage of signal A when rising, and A(80%) and A(20%) correspond to 80% and 20% of the maximum voltage of signal A when rising, respectively. Similarly, B(100%) represents the maximum voltage of signal B when rising, and B(80%) and B(20%) represent 80% and 20% of the maximum voltage of signal B when rising, respectively.

[0124] The rise time of signal A, which is not compensated by the circuit, is denoted as T1, and the rise time of signal B, which is compensated by the circuit, is denoted as T2 (T2<T1). For the rising waveform of the test signal, the initial part of the rising is mainly affected by the high-frequency components of the signal, while the later part of the rising is mainly affected by the low-frequency components. The compensation circuit 90 reduces the gain of the low-frequency components while increasing the gain of the high-frequency components. As shown in Figure 7As shown, for signal B, the voltage characteristics from the start of its rise to a specific point follow the same trend as signal A. However, the maximum voltage during the rise of signal B is lower than that of signal A. This means that the compensation circuit 90 shortens the apparent rise time by suppressing the maximum voltage during the rise, without changing the slope of the test signal voltage rise. Therefore, even in systems with long wiring lengths, the compensation circuit 90 can effectively shorten the rise time of the test signal, enabling it to operate efficiently under long wiring conditions.

[0125] Reference Figure 3 , Figure 4 ,and Figure 8 In some embodiments, a compensation circuit 95 (also referred to as a second compensation circuit 95) may be integrated to mitigate the adverse effects of longer wiring lengths within the same group of outlets 70. For example, in group G1, outlets 70A2 and 70B2 have longer wiring lengths than outlets 70A1 and 70B1. The compensation circuit 95 may be connected to outlet 70A2 (or 70B2) with the longer wiring length (e.g., wiring 51a2). The compensation circuit 95 may employ an RC filter (including a parallel combination of capacitor 96 and resistor 97) to adjust the frequency characteristics of the transmitted signal. By acting as a high-pass filter, the compensation circuit 95 can reduce the amplitude of low-frequency components while amplifying high-frequency components. This adjustment effectively shortens the signal rise time, allowing the compensated signal to meet stringent timing requirements even when transmitted over longer wiring. In some embodiments, wiring 51a2 may be part of a first wiring system 50a1.

[0126] The compensation circuit 95 can also be connected to the first wiring system 50a2 to 50h10, and is not limited to the first wiring system 50a1.

[0127] The compensation circuit design reduces the low-frequency amplitude relative to the high-frequency amplitude, enabling the burn-in device 1 to maintain high test accuracy. By connecting the compensation circuit to longer wiring paths, wiring systems of varying lengths can be optimized. This ensures uniform signal performance across all connections. By compensating for frequency characteristics according to the required signal dynamics, the burn-in device 1 achieves consistent rise and fall times, thereby improving overall test reliability and scalability.

[0128] By grouping these sockets 70 based on the signal transmission path (i.e., arranging them in a 2×2 matrix along the Y and X directions), the signal delay occurs only once in each group. For example, in group G1, the signal delay is limited to occurring between sockets 70A1 and 70A2 or between sockets 70B1 and 70B2. This signal delay can be compensated using compensation circuitry 95 or by systematically adjusting the offset of sockets 70A2 and 70B2.

[0129] Figure 9 This is a perspective view of a pre-burned plate 20 having an anti-flexure structure FSS according to an embodiment of the present disclosure. Figure 10 This is a vertical cross-sectional view of a pre-burned plate 20 with an anti-flexural structure FSS according to an embodiment of the present invention.

[0130] Reference Figure 9 and Figure 10 The pre-burnt plate 20 may also include a flexure-resistant structure (FSS). When the component under test (DUT) 100 is placed on each of the sockets 70 of the pre-burnt plate 20 using component mounting and removal, significant mechanical pressure is applied to the DUT 100. This pressure, and any resulting vibration, is transmitted to the substrate 40 through the sockets 70. To prevent the substrate 40 from bending or deflecting under such mechanical stress or vibration, the flexure-resistant structure (FSS) can be implemented on the rear surface 40BS of the substrate 40. This structure ensures that the pre-burnt plate 20 maintains its integrity and stability during operation.

[0131] Reference Figure 9 and Figure 10 In some embodiments, the anti-flexure structure FSS may include a plurality of square column-shaped support rods 22. The support rods 22 may be attached to the rear surface 40BS of the substrate 40 to provide structural support. In some embodiments, the support rods 22 may be securely fixed to the rear surface 40BS of the substrate 40 by screws or by using adhesive to prevent displacement.

[0132] Reference Figure 9 and Figure 10 In some embodiments, the anti-deflection structure FSS may include a reinforcing frame 5. The reinforcing frame 5 is constructed of rectangular strips to form a rectangular frame body and can be fixed near the edge of the rear surface 40BS of the substrate 40. The reinforcing frame 5 can provide additional structural support to ensure rigidity and stability, especially in areas susceptible to stress or deformation. By being positioned close to the edge, the reinforcing frame 5 can effectively reduce bending or deflection of the structure under stress.

[0133] Reference Figure 9 and Figure 10 In some embodiments, the anti-flexure structure FSS may include a protective cover 6. The protective cover 6 may be designed as a rectangular flat plate and further added to enhance structural integrity and protect the support rod 22 and the reinforcing frame 5. The protective cover 6 can be securely fixed to the reinforcing frame 5, ensuring a stable and protective closure. By attaching the protective cover 6 to the reinforcing frame 5, the anti-flexure structure FSS achieves mechanical protection and a clean, streamlined appearance, effectively protecting the underlying support rod 22 from external forces or environmental factors.

[0134] Figure 11This is a perspective view of a pre-burned plate 20 having an anti-flexural structure FSS according to another embodiment of the present disclosure. Figure 12 A perspective view of a portion of the anti-deflection structure FSS provided on the preheated plate 20 according to another embodiment of the present invention. Figure 13 This is a vertical cross-sectional view of a pre-burned plate with an anti-flexural structure FSS according to another embodiment of the present invention.

[0135] Reference Figures 11 to 13 In some embodiments, the anti-flexure structure FSS may include support members (including multiple support rods 22), connectors (including multiple connecting rods 3), reinforcing frame 5, and protective cover 6.

[0136] The reinforcing frame 5 is constructed of rectangular strips to form a rectangular frame body, which can be fixed near the edge of the rear surface 40BS of the substrate 40. The reinforcing frame 5 provides additional structural support, ensuring rigidity and stability, especially in areas susceptible to stress or deformation. By being positioned close to the edge, the reinforcing frame 5 effectively reduces bending or deflection of the structure under stress.

[0137] Each support rod 22 can be a square rod, with a height approximately equal to the height of the reinforcing frame 5. The longitudinal length of each support rod 22 can be designed to fit the width of the reinforcing frame 5. A circular through hole 2a can be formed on the side surface of each support rod 22. The shape and size of the through hole 2a can be closely matched with the cross-sectional profile of the circular rod-shaped connecting rod 3 to ensure a snug fit.

[0138] The connecting rod 3 can be designed to pass through the through hole 2a on the support rod 22. The longitudinal length of each connecting rod 3 can be adapted to the length of the reinforcing frame 5. Before installation, the connecting rod 3 can be inserted into the through hole 2a of the support rod 22, thereby effectively screwing the support rod 22 onto the connecting rod 3. This connection integrates all the support rods 22 into a unified structure, thereby enhancing the rigidity of the anti-flexural structure FSS.

[0139] Because the through hole 2a on the support rod 22 matches the cross-sectional shape and size of the connecting rod 3, the connecting rod 3 will not easily slip or slide out once inserted. This robust connection ensures that the support rod 22 is firmly held in place relative to the connecting rod 3, thus providing high overall rigidity. Therefore, if an external force is applied to one of the support rods 22, the force will be distributed across the entire anti-flexure structure FSS, preventing any individual support rod 22 from displacing or breaking.

[0140] Once assembled, the entire anti-flexure structure FSS, consisting of interconnected support rods 22 and connecting rods 3, can be placed on the rear surface 40BS of the substrate 40. Then, a rectangular flat protective cover 6 can be placed on the anti-flexure structure FSS. This protective cover is attached to the reinforcing frame 5, securing the entire assembly in place.

[0141] The support rods 22, having the same height as the reinforcing frame 5, are located between the substrate 40 and the protective cover 6. They provide continuous support through direct contact with the substrate 40 and the protective cover 6, effectively preventing the substrate 40 from bending under applied external forces. This integrated design ensures structural stability and durability, and enables it to withstand mechanical stress and vibration.

[0142] Figure 14 and Figure 15 The wiring circuit of the pre-burned board 20 is shown according to an embodiment of the present disclosure. Figure 16 and Figure 17 The message indicates that the message has been successfully passed. Figure 14 and Figure 15 The rise time diagram of the signal transmitted by the wiring circuit in the diagram.

[0143] In some embodiments, the pre-burnt plate 20 may include external capacitors connected to the first wiring systems 50a1 to 50h10 and / or the second wiring systems 60a to 60p. These embodiments are related to... Figures 1 to 8 The main difference in the illustrated embodiment is the inclusion of these external capacitors, while other configurations remain unchanged. Only the differences are described here. Figures 1 to 8 The same components in the illustrated embodiments retain the same reference numerals, and further description is omitted.

[0144] Reference Figure 14 and Figure 15 The first wiring system 50a1 may include a section of wiring 51a1 that connects a branch point of the wiring system to connector 80. A first capacitor 111C may be connected to wiring 51a1. Similarly, the first wiring system 50a10 may include a section of wiring 51a10 that connects a branch point of the system to connector 80. A second capacitor 112C may be connected to wiring 51a10. The capacitance of the first capacitor 111C may be greater than the capacitance of the second capacitor 112C. The connection point of the second capacitor 112C is not limited to... Figure 15 The downstream of the compensation circuit 90 shown can also be located upstream.

[0145] Each socket (e.g., 70A1) is equipped with multiple densely arranged contact probes that correspond to the terminals of the component under test 100. This dense arrangement is also present in other sockets (e.g., 70A2 to 70P). 20The short distances between adjacent probes and the conductors on the substrate 40 can cause crosstalk, especially with high-frequency signals. Crosstalk becomes more pronounced when the rise and / or fall times of the test signal are short because such signals contain more high-frequency components. While reducing high-frequency components can suppress crosstalk, it also increases the rise and / or fall times of the test signal. This requires a trade-off between minimizing crosstalk and maintaining signal time performance. Furthermore, as... Figures 1 to 13 The illustrated example shows that the rise and fall times of the test signal can be affected by the wiring length.

[0146] Reference Figures 14 to 17 Capacitors 111C and 112C can be connected to wirings 51a1 and 51a10 respectively to balance the trade-off between crosstalk suppression and the rise and / or fall times required for the test signal. For wiring 51a1, which is shorter and has minimal signal attenuation, the rise time is naturally shorter, such as... Figure 16 The figure is shown as a dashed line. To solve this problem, a first capacitor 111C with a larger capacitance can be connected to wiring 51a1. This increases the rise time (T1), as shown in the figure. Figure 16 As shown in the solid line graph, this effectively suppresses high-frequency components and reduces crosstalk.

[0147] Reference Figures 14 to 17 For wiring 51a10, which is relatively long and has significant signal attenuation, its rise time is naturally longer, such as... Figure 17 As shown in the dashed diagram. At this point, a second capacitor 112C with a smaller capacitance value can be connected to wiring 51a10. This will cause a slight increase in the rise time (T2), as... Figure 17 As shown in the solid line graph. Although the rise time adjustment range of the second capacitor 112C is narrower than that of the first capacitor 111C, its suppression of high-frequency components in the test signal effectively reduces crosstalk.

[0148] Therefore, the pre-burn-in board 20 and pre-burn-in device 1 in this embodiment utilize external capacitors 111C and 112C connected to the first wiring systems 50a1 and 50a10. These wiring systems connect multiple sockets (e.g., 70A1 and 70A2) to the connector 80, and the wiring lengths throughout the system are different. The first capacitor 111C is connected to the shorter section of wiring 51a1, while the second capacitor 112C is connected to the longer section of wiring 51a10. This configuration can suppress crosstalk and maintain acceptable rise and / or fall times for the test signal.

[0149] External capacitors can also be connected to other wiring systems within the pre-burned board 20, such as the first wiring systems 50a2 to 50a9 and 50b1 to 50h10. In this case, the capacitance of the capacitors can be scaled based on the wiring length, with shorter wiring requiring capacitors with larger capacitance.

[0150] Figure 18 According to an embodiment of this disclosure, the pre-burning process 10 is shown in the form of a flowchart.

[0151] In step S11, multiple components under test 100 can be provided and installed on multiple sockets 70 of the preheating plate 20.

[0152] In step S13, the pre-fired plate 20 is placed in the pre-fired chamber 11 of the pre-fired device 1 and electrically connected to the pre-fired device 1. The pre-fired chamber 11 can be designed to accommodate the pre-fired plate 20 and apply thermal stress to the element under test 100. The electrical connection between the pre-fired plate 20 and the pre-fired chamber 11 can be established through the connector 80 of the pre-fired plate 20 and the connector 115 of the pre-fired device 1.

[0153] In step S15, a stress test is performed on the component under test 100. The temperature of the stress test can be between about -25°C and about +125°C. The temperature inside the preheating chamber 11 can be regulated by the evaporator 116, the heater 117, and the fan 118 to ensure consistent temperature conditions for the stress test.

[0154] In step S17, signals can be input and output to the device under test (DUT) 100 via a pre-burn-in controller 13 of the pre-burn-in apparatus 1. Signals can be transmitted to the DUT 100 via the wiring system 50 of the pre-burn-in board 20. In some embodiments, these signals (which may include test signals for evaluating DUT functionality) can affect the quality of the pre-burn-in process based on their rise and fall times. During the pre-burn-in process, the pre-burn-in controller 13 can monitor the DUT's response to the input signals. Any DUT 100 exhibiting an abnormal response may be identified as a defective product by the pre-burn-in controller.

[0155] In step S19, the test results can be recorded by the pre-burn-in controller 13.

[0156] One aspect of this disclosure provides a pre-burned board, comprising: a substrate including a front surface and a rear surface; a plurality of sockets mounted on the front surface of the substrate; and a wiring system located in the substrate and electrically connected to the sockets. The sockets are configured into multiple groups by the wiring system. Each of the groups includes four sockets arranged in a 2x2 square array.

[0157] Another aspect of this disclosure provides a pre-firing apparatus, comprising: a pre-firing chamber; a pre-firing plate housed within the pre-firing chamber; a test power supply electrically connected to the pre-firing plate; and a pre-firing controller electrically connected to the pre-firing plate. The pre-firing plate includes: a substrate having a front surface and a rear surface; a plurality of sockets mounted on the front surface of the substrate; and a wiring system located in the substrate and electrically connected to the sockets, wherein the sockets are configured into multiple groups via the wiring system, and each group includes four sockets arranged in a 2x2 square array.

[0158] Another aspect of this disclosure provides a pre-burn-in process, comprising: providing a plurality of devices under test (DUTs); providing a pre-burn-in board, comprising: a substrate including a front surface and a rear surface; a plurality of sockets mounted on the front surface of the substrate; and a wiring system located in the substrate, electrically connected to the sockets, and configuring the sockets into a plurality of groups, wherein each of the groups includes four sockets arranged in a 2x2 square array; mounting the DUTs onto the sockets; placing the pre-burn-in board in a pre-burn-in chamber of a pre-burn-in apparatus and electrically connecting the pre-burn-in board and the pre-burn-in apparatus; performing a stress test on the DUTs; a pre-burn-in controller of a pre-burn-in apparatus providing signals to the DUTs through the wiring system of the pre-burn-in board and receiving signals from the DUTs; and recording the test results through the pre-burn-in controller of the pre-burn-in apparatus.

[0159] Due to the design of the pre-burned board disclosed herein, the number of sockets 70 can be increased (e.g., up to 320 sockets) without affecting signal synchronization between different groups or within the same group of sockets 70. This is achieved by customizing the signal transmission path according to the wiring system 50.

[0160] While this disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions, and alternatives may be made without departing from the concept and scope of this disclosure as defined in the claims. For example, many of the processes described above may be implemented using different methods, and other processes or combinations thereof may be substituted for many of the processes described above.

[0161] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure of this document that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used based on this disclosure. Accordingly, such processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of the claims of this application.

Claims

1. A pre-fired plate, comprising: A substrate, comprising a front surface and a rear surface; Multiple sockets are mounted on the front surface of the substrate. as well as A wiring system, located in the board substrate and electrically connected to the plurality of sockets, The multiple sockets are configured into multiple groups through a wiring system. Each of the aforementioned groups comprises four sockets arranged in a 2x2 square.

2. The pre-burnt board as claimed in claim 1 further includes a connector attached to the board substrate and electrically connected to the wiring system.

3. The pre-fired plate as claimed in claim 2, wherein the plate substrate has a generally rectangular shape.

4. The pre-burnt plate as claimed in claim 3, wherein the number of the plurality of sockets is 320.

5. The pre-burnt plate as claimed in claim 3, wherein the number of the plurality of groups is 80.

6. The pre-burned board of claim 3, wherein the wiring system includes a plurality of wires of different lengths connected to the connector.

7. The pre-burning board as described in claim 6 further includes a first compensation circuit electrically connected to the longest wire among the plurality of wires.

8. The pre-burned board as claimed in claim 7, wherein the first compensation circuit compensates for a frequency characteristic of a signal transmitted through the wiring system.

9. The pre-burnt board of claim 7, wherein the compensation circuit comprises a parallel combination of a capacitor and a resistor.

10. The pre-burnt plate of claim 7 further includes an external capacitor electrically connected to the wiring system.

11. The pre-burning plate as claimed in claim 7, further comprising a first capacitor electrically connected to the shortest wire among the plurality of wirings, and a second capacitor electrically connected to the longest wire among the plurality of wirings, wherein a capacitance of the first capacitor is greater than a capacitance of the second capacitor.

12. The pre-burnt plate of claim 7, further comprising an anti-flexure structure located on the rear surface of the plate substrate.

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