Electronic device and electronic device manufacturing method

Abstract

The application discloses an electronic device and a manufacturing method thereof. The electronic device comprises a housing, a heat sink arranged at least partially in the housing, and having a first accommodating portion, and a circuit board on which a power semiconductor component is mounted, the circuit board being at least partially located in the first accommodating portion and arranged to establish a thermal connection between the power semiconductor component and the heat sink, wherein a first potting material to be cured is filled in the first accommodating portion, and the first potting material at least partially covers the power semiconductor component. The electronic device has good heat dissipation performance and working performance, can improve the overall power density, and avoids complex assembly in the electronic device housing.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more specifically, to electronic devices and methods of manufacturing electronic devices. Background Technology

[0002] With the development of technology and the increasing complexity, integration, and intelligence of device functions, many electronic components, such as high-power-density semiconductor devices, integrated chips, and processors, are installed in numerous electromechanical devices. These electronic components are typically mounted on circuit boards such as PCBs (Printed Circuit Boards). During operation, due to factors such as carrier migration, switching energy loss, and high-current conditions, some electronic components may generate excessive heat, which can lead to heat accumulation, increased temperature, impaired performance, and shortened component lifespan. Summary of the Invention

[0003] In view of the above, this application provides an electronic device and a method for manufacturing an electronic device, which can solve or at least alleviate one or more of the above-mentioned problems and other problems existing in the prior art, or can provide an alternative technical solution to the prior art.

[0004] First, according to a first aspect of this application, an electronic device is provided, comprising:

[0005] case;

[0006] A radiator, at least partially disposed within the housing, and having a first receiving portion; and

[0007] A circuit board on which power semiconductor components are mounted, the circuit board being at least partially located within a first receiving portion and arranged to establish a thermal connection between the power semiconductor components and the heat sink; wherein the first receiving portion is filled with a first potting material to be cured, the first potting material at least partially covering the power semiconductor components.

[0008] In the electronic device according to this application, optionally, the housing has an upwardly opening receiving space, the circuit board is installed into the first receiving space from above through the opening, the electronic device includes a first circuit board, the first circuit board is arranged in the housing and has electronic components installed thereon, the circuit board is electrically connected to the first circuit board, the first circuit board covers the circuit board, and the area of ​​the first circuit board is larger than the area of ​​the circuit board.

[0009] In the electronic device according to this application, optionally, the first potting material is thermally conductive, the power semiconductor device is completely immersed in the first potting material, both sides of the circuit board are thermally connected to the heat sink through the first potting material, the power semiconductor device is mounted on the circuit board by surface mount technology, and the circuit board and the first circuit board are electrically connected by selective soldering process; and / or, the circuit board is arranged vertically relative to the first circuit board, and the first circuit board is arranged horizontally within the housing; and / or, the first circuit board includes a PCBA.

[0010] Optionally, in the electronic device according to this application, the electronic device includes a second circuit board disposed within the housing and on which electronic components are mounted, the second circuit board being electrically connected to the first circuit board.

[0011] In the electronic device according to this application, optionally, the second circuit board is arranged parallel or perpendicular to the first circuit board, and / or an electromagnetic shielding cover is provided in the receiving space of the housing, the electromagnetic shielding cover shielding between the second circuit board and the first circuit board, and / or the electromagnetic shielding cover shielding between the second circuit board and the circuit board.

[0012] Optionally, in the electronic device according to this application, the electronic device includes a heat-generating element, and the heat sink has a second receiving portion arranged adjacent to the first receiving portion, the heat-generating element being at least partially located within the second receiving portion and electrically connected to the first circuit board, the second receiving portion being filled with a second potting material to be cured, and the heat-generating element being at least partially covered by the cured second potting material.

[0013] In the electronic device according to this application, optionally, the heat sink has a cooling channel disposed on at least one side of the first receiving portion and / or at least one side of the second receiving portion, the cooling channel being filled with a heat exchange medium; and / or, the heat-generating component includes an inductor and a transformer; and / or, the second potting material is the same as the first potting material.

[0014] Optionally, in the electronic device according to this application, the electronic device further includes a cover configured to engage with the housing to at least partially close the receiving space of the housing; and / or

[0015] The radiator is integrally formed with the housing, or a portion of the radiator is fixedly connected to the inner wall of the housing; and / or

[0016] The circuit board substrate includes an IMS substrate, an AMB substrate, a DBC substrate, a DBA substrate, and a PCB substrate. The electronic device is a charger. The power semiconductor components include power semiconductor switching devices. The first potting material includes silicone and a mixture of silicone and a thermally conductive agent.

[0017] Secondly, according to a second aspect of this application, a method for manufacturing an electronic device is further provided, comprising the steps of:

[0018] Provide circuit boards with power semiconductor components mounted on them;

[0019] The circuit board is placed inside the housing such that it is at least partially located within a first receiving portion of a heat sink, and a thermal connection is established between the power semiconductor components and the heat sink, the heat sink being at least partially disposed within the housing, and the first receiving portion being filled with a first potting material to be cured; and

[0020] After the first potting material has cured, the cured first potting material is made to at least partially cover the power semiconductor device.

[0021] Optionally, the electronic device manufacturing method according to this application may further include the step of:

[0022] A first circuit board with electronic components mounted is provided and electrically connected to the circuit board. Then, the first circuit board and the circuit board are placed together into the housing through an opening in the housing, such that the first circuit board covers the circuit board, and the area of ​​the first circuit board is larger than the area of ​​the circuit board.

[0023] Optionally, the electronic device manufacturing method according to this application may further include the step of:

[0024] The power semiconductor device is completely immersed in the first potting material, and both sides of the circuit board are thermally connected to the heat sink through the first potting material, wherein the first potting material has thermal conductivity; and / or

[0025] Provide a second circuit board with electronic components mounted thereon and electrically connect it to the first circuit board, then place the first circuit board together with the first and second circuit boards into the housing through the opening; and / or

[0026] A heating element is provided and electrically connected to the first circuit board. The first circuit board, along with the heating element, is then placed into the housing through the opening, with the heating element at least partially located within a second receiving portion of the heat sink. This second receiving portion is arranged adjacent to the first receiving portion and filled with a second potting material to be cured. The second potting material is allowed to cure and, once cured, at least partially cover the heating element. And / or

[0027] The circuit board is arranged vertically relative to the first circuit board, and the first circuit board is arranged horizontally within the housing; and / or

[0028] The circuit board is electrically connected to the first circuit board using a selective soldering process; and / or

[0029] The power semiconductor components are mounted on the circuit board using surface mount technology.

[0030] The proposed solution effectively saves space on the main circuit board, allowing for the placement of more power semiconductor components, such as power semiconductor switches, on additional circuit boards, thereby increasing overall power density. Furthermore, by electrically connecting one or more circuit boards to the main circuit board beforehand, complex assembly within the electronic device housing is avoided, simplifying the process, ensuring quality, and reducing costs. In addition, the use of potting materials securely positions the circuit boards and electronic components while promoting heat dissipation, effectively reducing or eliminating the risk of thermal damage. This electronic device exhibits excellent heat dissipation and stable operation, making it widely applicable to various electromechanical devices. Attached Figure Description

[0031] Figure 1 This is a side sectional structural schematic diagram of an embodiment of an electronic device according to this application.

[0032] Figure 2 A processing step of an embodiment of an electronic device manufacturing method according to this application is shown. Detailed Implementation

[0033] refer to Figure 1 The accompanying drawings schematically illustrate the configuration of an embodiment of an electronic device according to this application. In this given embodiment, the electronic device 100 is configured to include a housing 10, a first circuit board 11, a circuit board 12, a second circuit board 13, a heat sink 14, and a cover 18, etc. The electronic device of this application will now be described in detail with reference to this specific embodiment.

[0034] Firstly, the housing 10 can be made of any one or more materials as needed, such as metals like copper, iron, aluminum, or metal alloys. The housing 10 may have a receiving space 102 with an upward opening 101 to accommodate corresponding parts used to constitute the electronic device 100. The housing 10 can be mated with a cover 18, for example, by a detachable or fixed connection, thereby allowing the receiving space 102 to be completely or partially closed according to different application requirements.

[0035] The cover 18 can be made of any suitable material as needed, such as the same or different material as the housing 10, or suitable materials such as stainless steel or aluminum alloy, so that the electronic device 100 has good electromagnetic shielding function. Although in Figure 1 In the example, the cover 18 is schematically shown as having a flat construction; however, it should be understood that this application allows the cover 18 to be configured in any possible shape construction as needed for a particular application. For example, in one or more embodiments, the cover 18 may have structures such as curved surfaces, bulges and / or recesses.

[0036] In the electronic device 100, the first circuit board 11 is electrically connected to, for example, circuit board 12 and second circuit board 13, and then they are arranged together through opening 101 into receiving space 102 of housing 10. Then, potting material injected at the target location and allowed to cure can provide functions such as insulation, waterproofing and dustproofing, improved thermal conductivity, reduced heat dissipation, and / or fixing of components, which will be described in more detail later. The first circuit board 11 is equipped with electronic components such as resistors, capacitors, diodes, integrated chips, etc., and the desired functional application is achieved through the configured electronic components. The first circuit board 11 can typically be a PCBA (Printed Circuit Board Assembly), which mounts the electronic components required for the functional application onto a PCB board. The PCB board serves as a support carrier for the electronic components to connect electronic circuits. Single-layer, two-layer, or more circuits configured as needed on the PCB board provide electronic circuitry. The configured electronic components can be mounted onto their respective circuit layers through processes such as bonding, sintering (e.g., silver sintering), or soldering (e.g., brazing).

[0037] like Figure 1 As shown, circuit board 12 may include substrate 121 and power semiconductor devices 122. Circuit board 12 can be electrically connected to first circuit board 11 using any feasible process, such as selective soldering. Figure 1 The electrical connection between circuit board 12 and first circuit board 11 is schematically indicated by reference numeral 21 in the accompanying drawings.

[0038] The substrate 121 can be, but is not limited to, IMS (Insulated Metal Substrate) substrates, AMB (Active Metal Brazing) substrates, DBC (Direct Bonded Copper) substrates, DBA (Direct Bonded Aluminum) substrates, PCB substrates, etc. Power semiconductor devices 122 can be mounted on the substrate 121 using processes such as surface mount technology. For example, power semiconductor devices 122 can be power semiconductor switching devices, such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gate Bipolar Transistors). One, two, or more power semiconductor devices 122 can be configured on the circuit board 12 as needed; they can be the same or different device types. The power semiconductor devices 122 can be completely or partially covered by immersion in a first potting material 15 to be cured (such as silicone, or a mixture of silicone and a thermally conductive agent). Specific implementations can be designed as needed.

[0039] In one or more embodiments, after the first potting material 15 has cured, the substrate 121 and the power semiconductor device 122 can be fixed in the expected position, that is, the circuit board 12 can be fixed in place. This avoids the conventional method of using mechanical parts (such as spring sheets) to directly press and fix the power semiconductor device mounted on the circuit board, which is often used in the prior art. Such methods are prone to problems such as troublesome installation and operation, space occupation, poor long-term fixation effect, affecting heat dissipation, and increasing costs. The above solution of this application can successfully overcome the above problems.

[0040] By providing an additional circuit board 12, the area occupied by the first circuit board 11, which serves as the main circuit board, can be significantly reduced. More power semiconductor components can be arranged on the substrate 121 of the circuit board 12, thereby significantly improving the overall power density of the electronic device and solving the problem of low power density in existing electronic device products. In addition, unlike existing technical solutions, by first electrically connecting the circuit board 12 and the first circuit board 11, and then arranging them together inside the housing of the electronic device through the opening 101, the circuit board 12 can be immersed in the first potting material 15 to be cured. After the first potting material 15 cures, it can fix the position of the circuit board 12 and thus define the position of the first circuit board 11. This avoids the assembly operation inside the housing commonly used in the industry. Therefore, it not only simplifies the process and avoids the original complex assembly operation, improving work efficiency, but also helps to improve product quality and reduce production costs. Even in special cases, such as when the first circuit board 11 has a relatively large size (e.g., the first circuit board 11 has a larger area than the circuit board 12 and is arranged inside the housing 10 covering the circuit board 12), the solution of this application will not affect the fixed position of the circuit board 12 within the electronic device housing. However, with existing technologies, the first circuit board 11 would occupy limited space within the housing, leading to difficulties in subsequent operations, or even making operation impossible. The second circuit board 13 and the heat-generating component 16, discussed below, can also achieve these positive and significant technical effects using the above or similar methods.

[0041] When the first circuit board 11, together with the electrically connected circuit board 12, is placed into the housing 10 through the opening 101, a thermal connection can be established between the power semiconductor components 122 on the circuit board 12 and the heat sink 14. This forms a heat transfer path between the heat sink 14 and the power semiconductor components 122, allowing the heat sink 14 to dissipate heat and cool the power semiconductor components 122. This helps prevent heat accumulation, effectively reducing or eliminating the risk of thermal damage to components and improving system stability. As an optional configuration, as used in this embodiment, the circuit board 12 can be arranged perpendicularly to the first circuit board 11. For example, the first circuit board 11 and the circuit board 12 can be arranged horizontally and vertically within the housing 10, respectively. This allows for flexible use of the limited space within the housing, enabling the placement of a relatively larger number of power semiconductor components 122 on the circuit board 12, thus increasing the overall power density. In different applications, one, two, or more circuit boards 12 can be arranged within the housing 10 of the electronic device as needed. Figure 1 The example exemplifies the configuration of two circuit boards 12, which are spaced apart in the receiving space 102 and each is provided with a different number of power semiconductor components 122.

[0042] As an optional configuration, the electronic device 100 also includes one or more second circuit boards 13. For example... Figure 1 In the example, the second circuit board 13 can be arranged parallel to the first circuit board 11; of course, in one or more embodiments, one or more second circuit boards 13 can be arranged perpendicular to the first circuit board 11. Any suitable electronic components 131 can be mounted on the second circuit board 13, which can cooperate with the first circuit board 11 and / or circuit board 12 to realize the functional application of the electronic device 100. For example, the second circuit board 13 can be used to perform various possible functions such as signal filtering, boosting or bucking.

[0043] The second circuit board 13 can be electrically connected to the first circuit board 11, for example, through any feasible process such as selective soldering. Figure 1 Reference numeral 22 is used to schematically illustrate the electrical connection between the second circuit board 13 and the first circuit board 11. Depending on the application requirements, this application allows for the configuration of one, two, or more second circuit boards 13 in an electronic device. Furthermore, in one or more embodiments, an electromagnetic shielding cover 19, such as an aluminum alloy cover, can be optionally configured for one or more second circuit boards 13. The electromagnetic shielding cover 19 can be configured as needed to shield between the second circuit board 13 and the first circuit board 11, and / or between the second circuit board 13 and the circuit board 12, in order to better avoid unwanted signal interference and improve the operating performance of the electronic device.

[0044] The heat sink 14 is installed in the electronic device 100 to provide cooling and other functions. The heat sink 14 is generally made of metal materials such as copper or aluminum to ensure good heat transfer performance. Figure 1 In this embodiment, the heat sink 14 is integrally formed with the housing 10, for example, by processes such as stamping, casting, or machining. This helps to ensure the overall structure of the electronic device and increases the heat dissipation area. In one or more embodiments, the heat sink 14 can be designed and manufactured separately, and then a portion of the heat sink 14 (such as the bottom, side, etc.) can be fixedly connected to the inner wall of the housing 10, for example, by welding, plugging, screwing, or any other feasible method. In addition, in one or more embodiments, a portion of the heat sink 14 can extend to the outside of the housing 10.

[0045] refer to Figure 1 The exemplary structure shown herein allows the radiator 14 to be configured with a first receiving portion 141 and a second receiving portion 142. For example, from Figure 1From the side view shown, the heat sink 14 is constructed in an upward-opening U-shape to form, for example, a first receiving portion 141 and / or a second receiving portion 142, for placing items such as the circuit board 12 and the heat-generating components 16. The volume, structure, arrangement, and number of these receiving portions can be designed as needed.

[0046] For example, the first receiving portion 141 may be defined by the sidewall of the heat sink 14, the sidewall of the vertical structure 40 inside the housing 10 (or the inner wall of the housing 10 itself), and the bottom surface formed by the housing 10 or the heat sink 14. This structural configuration facilitates the filling of the curable first potting material 15 into the first receiving portion 141. The aforementioned vertical structure 40 may be integrally formed with the housing 10 or structurally integrated through processes such as welding. It can be used for synergistic heat dissipation and can therefore be understood as being integrated into the heat sink 14. The entirety or a portion of the circuit board 12 may be arranged inside the first receiving portion 141. When the first potting material 15 to be cured is injected into the first receiving portion 141, the first receiving portion 141 may be filled with the first potting material 15 in whole or in part, depending on specific needs. This achieves the purpose of fixing the circuit board 12 in place and at least partially covering the power semiconductor device 122 after immersing the circuit board 12 in the first potting material 15 and allowing it to cure. The second receiving portion 142 is optionally arranged adjacent to the first receiving portion 141. At least partially, a heat-generating component 16, optionally configured in the electronic device 100, can be arranged within the second receiving portion 142 so that a heat sink 14 can be used to dissipate heat and cool the heat-generating component 16. For example, the heat-generating component 16 may include, but is not limited to, inductors, transformers, such as PFC (Power Factor Correction) converters, DAB (Dual Active Bridge) converters, etc. The heat-generating component 16 and the first circuit board 11 can be electrically connected using any feasible method, such as selective soldering processes. Figure 1 The electrical connection between the heating element 16 and the first circuit board 11 is schematically indicated by reference numeral 23 in the accompanying drawings.

[0047] When manufacturing the electronic device 100, the first circuit board 11, together with the circuit board 12 electrically connected to it, the heat-generating element 16, and the second circuit board 13 (if any), can be placed into the housing 10 through the opening 101. This allows the heat-generating element 16 to be immersed in the second potting material 17 (such as silicone, or a mixture of silicone and a thermally conductive agent) that has been injected into the second receiving portion 142 and is awaiting curing. Depending on the application requirements, the second receiving portion 142 can be completely or partially filled with the second potting material 17. By means of the cured second potting material 17, the heat-generating element 16 can be completely or partially covered by the potting material.

[0048] In different applications, the second potting material 17 can be the same as or different from the first potting material 15. For example, it can be different types of silicone, or different mixtures made by mixing silicone with different thermally conductive agents (such as alumina, boron nitride, silicon nitride, etc.), or a variety of other potting materials that can be used in semiconductor electronics technology, so as to fully meet various practical needs. In actual use, the first potting material 15 and the second potting material 17 with appropriate thermal conductivity can be selected as needed, such as in the range of 0.5-3.0 W / (m·K), for example 0.5 W / (m·K), 0.6 W / (m·K), 1 W / (m·K), 1.5 W / (m·K), 2.0 W / (m·K), 2.5 W / (m·K) or 3 W / (m·K), and so on. The specific coverage thickness of the first potting material 15 and the second potting material 17 at their respective potting locations can be set as needed, for example, within the range of 0.5mm to 3mm, such as 0.5mm, 0.8mm, 1mm, 1.5mm, 2mm, 2.5mm, or 3mm, and so on. The values ​​listed above are for illustrative purposes only, and this application does not impose any specific limitations.

[0049] By configuring and using a first potting material 15 and / or a second potting material 17 with thermal conductivity, heat dissipation and cooling are more effectively promoted. For example, in one or more embodiments, the power semiconductor device 122 can be completely immersed in such a first potting material 15, and both sides of the circuit board 12 can be thermally connected to the heat sink 14 through such a first potting material 15, so as to better utilize the heat sink 14 for heat dissipation and cooling, and to dissipate heat in a timely manner.

[0050] Continue to refer to Figure 1 As disclosed in this embodiment, the heat sink 14 can be configured to have cooling channels 143 so that heat exchange medium 30 (such as water or other suitable liquid) filled in the cooling channels 143 can be used to exchange heat with the power semiconductor device 122, heat-generating device 16, etc., as described above, thereby promoting timely heat dissipation, reducing the temperature of these devices, and preventing heat accumulation. The cooling channels 143 can be designed in terms of structure, arrangement, and quantity according to specific needs. For example, the cooling channels 143 can be provided on at least one side of the first receiving portion 141 or at least one side of the second receiving portion 142, or the cooling channels 143 can be provided on one or more sides of each of the first receiving portion 141 and the second receiving portion 142. This application does not impose any limitations on this.

[0051] It should be noted that this electronic device is allowed to have many possible implementation types, such as AC-DC converter, DC-DC converter, charger, rectifier, inverter, bidirectional power converter, etc., and this application does not make any restrictions in this regard.

[0052] According to this application, a method for manufacturing an electronic device is also provided, for example, as can be referred to Figure 2 A specific example is given in the accompanying drawing. This embodiment of the electronic device manufacturing method may include the following steps:

[0053] First, in step S11, a first circuit board and a circuit board on which power semiconductor devices are mounted (hereinafter referred to as "additional circuit board") can be provided. The first circuit board and the additional circuit board have been described above, and can be referred to in the relevant descriptions.

[0054] In step S12, the first circuit board and the auxiliary circuit board can be electrically connected in any feasible manner. For example, the auxiliary circuit board can be soldered to the corresponding circuit layer on the first circuit board by selective soldering process as described above.

[0055] In step S13, the first circuit board and the auxiliary circuit board that are electrically connected can be placed into the housing through the opening on the electronic device housing. A heat sink is provided in the housing. When placing them, the auxiliary circuit board can be arranged at a preset position so that the power semiconductor components on the auxiliary circuit board can establish a thermal connection with the heat sink. For example, the auxiliary circuit board can be immersed in the first potting material that has been filled into the first receiving part of the heat sink and is to be cured. The heat sink can then be used to dissipate heat and cool down the power semiconductor components on the auxiliary circuit board.

[0056] In step S14, after the first potting material has cured, the power semiconductor components on the additional circuit board can be partially or completely covered by the first potting material.

[0057] The configuration and use of the first circuit board, the auxiliary circuit board, the second circuit board, the heat sink, and the first and second potting materials have been discussed in detail above. Therefore, more step features can be obtained by referring to the relevant descriptions, thereby forming more specific implementation schemes of this electronic device manufacturing method.

[0058] For example, one or more second circuit boards can be provided and electrically connected to the first circuit board, such as using a selective soldering process. The first circuit board, along with the additional and second circuit boards, is then placed into the housing through an opening in the electronic device housing. For instance, the first circuit board can be arranged inside the housing, covering the additional circuit board, and it can have a larger area than the additional circuit board. Of course, in one or more embodiments of the method according to this application, only the additional circuit board can be provided and arranged inside the electronic device housing, for example, by immersing it in a first potting material that has been filled into a first receiving portion of a heat sink and is awaiting curing. The additional circuit board is then positioned and fixed after the first potting material has cured.

[0059] For another example, one or more heat-generating components can be provided and electrically connected to a first circuit board. The first circuit board, along with an additional circuit board and the heat-generating components, is then placed into the housing of the electronic device through an opening in the housing. This positions the heat-generating components in a position where they can maintain thermal connection with the heat sink. For instance, the heat-generating components can be completely or partially immersed in a second potting material that has been filled into a second receiving portion of the heat sink and is awaiting curing, thereby fixing the heat-generating components in place. Alternatively, the additional circuit board can be arranged vertically relative to the first circuit board, while the first circuit board is arranged horizontally within the housing of the electronic device. Furthermore, the first potting material can be filled between the additional circuit board and the heat sink after curing, or both sides of the additional circuit board can be thermally connected to the heat sink through the first potting material, allowing the power semiconductor components to be completely immersed in the first potting material, thus better achieving one or more positive effects such as insulation, component fixation, heat dissipation, and waterproofing / dustproofing.

[0060] The above examples illustrate the electronic device and its manufacturing method according to this application. These examples are only for explaining the principles and implementation methods of this application and are not intended to limit the application. Various modifications and improvements can be made by those skilled in the art without departing from the scope of this application. Therefore, all equivalent technical solutions should fall within the scope of this application and be defined by the claims of this application.

Claims

1. An electronic device (100), characterized in that, include: Shell (10); A radiator (14), said radiator (14) being at least partially disposed within said housing (10), and said radiator (14) having a first receiving portion (141); and A circuit board (12) on which power semiconductor devices (122) are mounted, the circuit board (12) being at least partially located within a first receiving portion (141) and arranged to establish a thermal connection between the power semiconductor devices (122) and the heat sink (14); wherein a first potting material (15) is filled within the first receiving portion (141), the first potting material (15) at least partially covering the power semiconductor devices (122).

2. The electronic device (100) according to claim 1, wherein, The housing (10) has an upward-opening (101) receiving space (102). The circuit board (12) is installed into the first receiving part (141) from above through the opening (101). The electronic device (100) includes a first circuit board (11). The first circuit board (11) is arranged in the housing (10) and has electronic components installed. The circuit board (12) is electrically connected to the first circuit board (11). The first circuit board (11) covers the circuit board (12). The area of ​​the first circuit board (11) is larger than the area of ​​the circuit board (12).

3. The electronic device (100) according to claim 2, wherein, The first potting material (15) is thermally conductive, the power semiconductor device (122) is completely immersed in the first potting material (15), both sides of the circuit board (12) are thermally connected to the heat sink (14) through the first potting material (15), the power semiconductor device (122) is mounted on the circuit board (12) by surface mount technology, the circuit board (12) and the first circuit board (11) are electrically connected by selective soldering process; and / or, the circuit board (12) is arranged vertically relative to the first circuit board (11), the first circuit board (11) is arranged horizontally in the housing (10); and / or, the first circuit board (11) includes a PCBA.

4. The electronic device (100) according to claim 2, wherein, The electronic device (100) includes a second circuit board (13), which is arranged inside the housing (10) and has electronic components installed thereon. The second circuit board (13) is electrically connected to the first circuit board (11).

5. The electronic device (100) according to claim 4, wherein, The second circuit board (13) is arranged parallel or perpendicular to the first circuit board (11), and / or an electromagnetic shielding cover (19) is provided in the receiving space (102) of the housing (10), the electromagnetic shielding cover (19) shields between the second circuit board (13) and the first circuit board (11), and / or the electromagnetic shielding cover (19) shields between the second circuit board (13) and the circuit board (12).

6. The electronic device (100) according to claim 2, wherein, The electronic device (100) includes a heat-generating element (16), and the heat sink (14) has a second receiving portion (142) arranged adjacent to the first receiving portion (141). The heat-generating element (16) is at least partially located in the second receiving portion (142) and electrically connected to the first circuit board (11). The second receiving portion (142) is filled with a second potting material (17), and the heat-generating element (16) is at least partially covered by the cured second potting material (17).

7. The electronic device (100) according to claim 6, wherein, The radiator (14) has a cooling channel (143) disposed on at least one side of the first receiving portion (141) and / or at least one side of the second receiving portion (142), and the cooling channel (143) is filled with a heat exchange medium (30); and / or, the heat-generating component (16) includes an inductor and a transformer; and / or, the second potting material (17) is the same as the first potting material (15).

8. The electronic device (100) according to any one of claims 1-7, wherein, The electronic device (100) further includes a cover (18) configured to engage with the housing (10) to at least partially close the receiving space (102) of the housing (10); and / or The radiator (14) is integrally formed with the housing (10), or a portion of the radiator (14) is fixedly connected to the inner wall of the housing (10); and / or The substrate (121) of the circuit board (12) includes an IMS substrate, an AMB substrate, a DBC substrate, a DBA substrate and a PCB substrate. The electronic device (100) is a charger. The power semiconductor components (122) include power semiconductor switching devices. The first potting material (15) includes silicone and a mixture of silicone and thermal conductive agent.

9. A method for manufacturing an electronic device, characterized in that, Including the following steps: A circuit board (12) on which power semiconductor components (122) are mounted is provided; The circuit board (12) is placed inside the housing (10) such that the circuit board (12) is at least partially located in the first receiving portion (141) of the heat sink (14) and a thermal connection is established between the power semiconductor device (122) and the heat sink (14), which is at least partially arranged inside the housing (10), and the first receiving portion (141) is filled with a first potting material (15) to be cured. as well as After the first potting material (15) has cured, the cured first potting material (15) covers at least partially the power semiconductor device (122).

10. The method for manufacturing an electronic device according to claim 9, wherein, It also includes the following steps: A first circuit board (11) on which electronic components are mounted is provided and electrically connected to the circuit board (12). Then, the first circuit board (11) and the circuit board (12) are placed together into the housing (10) through an opening (101) on the housing (10), such that the first circuit board (11) covers the circuit board (12) and the area of ​​the first circuit board (11) is larger than the area of ​​the circuit board (12).

11. The method for manufacturing an electronic device according to claim 10, wherein, It also includes the following steps: The power semiconductor device (122) is completely immersed in the first potting material (15), and both sides of the circuit board (12) are thermally connected to the heat sink (14) through the first potting material (15), wherein the first potting material (15) is thermally conductive; and / or A second circuit board (13) with electronic components mounted is provided and electrically connected to the first circuit board (11). Then, the first circuit board (11), together with the circuit board (12) and the second circuit board (13), is placed into the housing (10) through the opening (101); and / or A heating element (16) is provided and electrically connected to the first circuit board (11). The first circuit board (11), together with the circuit board (12) and the heating element (16), is placed into the housing (10) through the opening (101), with the heating element (16) at least partially located in the second receiving portion (142) of the heat sink (14). The second receiving portion (142) is arranged adjacent to the first receiving portion (141) and filled with a second potting material (17) to be cured. After the second potting material (17) cures, it at least partially covers the heating element (16); and / or The circuit board (12) is arranged vertically relative to the first circuit board (11), and the first circuit board (11) is arranged horizontally within the housing (10); and / or The circuit board (12) is electrically connected to the first circuit board (11) using a selective soldering process; and / or The power semiconductor device (122) is mounted on the circuit board (12) using surface mount technology.

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