Heat dissipation module and electronic device

Abstract

Embodiments of the present application provide a heat dissipation module and an electronic device, and relate to the technical field of electronics, and improve the heat dissipation effect of the heat dissipation module. The heat dissipation module comprises a body, a heat dissipation assembly and a first partition. The body is provided with an air duct, the body is provided with a first air port and a second air port, and the first air port and the second air port are located at two ends of the air duct. The heat dissipation assembly is arranged in the air duct. The first partition is arranged in the air duct and located between the heat dissipation assembly and the first air port, the first partition and the body form a first air cavity, the first air port is communicated with the first air cavity, and a plurality of first air holes are arranged on the first partition, the area of the first air hole is smaller than the area of the first air port.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a heat dissipation module and electronic device. Background Technology

[0002] Current terminal devices often employ passive cooling solutions. Specifically, heat generated by the chips within the device is transferred through various internal structural components to the outer casing, and ultimately into the ambient air. However, as the power consumption of terminal devices increases, passive cooling solutions become insufficient to meet their cooling requirements, thus necessitating the adoption of active cooling solutions. In active cooling, a fan can be incorporated into the terminal device. Openings on the device's outer surface allow the fan to draw cool air into the device, cool the chips, and then expel the air. However, to meet dust protection requirements, the surface openings on the terminal device are relatively small, resulting in poor heat dissipation. Summary of the Invention

[0003] The purpose of this application is to provide a heat dissipation module and electronic device to improve the heat dissipation effect of the heat dissipation module.

[0004] To achieve the above objectives, embodiments of this application provide the following technical solutions:

[0005] On one hand, a heat dissipation module is provided. The heat dissipation module includes: a body, a heat dissipation component, and a first partition. An air duct is disposed within the body, and a first air inlet and a second air inlet are disposed on the body, located at opposite ends of the air duct. The heat dissipation component is disposed within the air duct. The first partition is disposed within the air duct and between the heat dissipation component and the first air inlet, forming a first air cavity with the body. The first air inlet communicates with the first air cavity, and the first partition has multiple first air holes, the area of ​​which is smaller than the area of ​​the first air inlet.

[0006] In the heat dissipation module provided in this application embodiment, one of the first air vent and the second air vent can be an air inlet, and the other can be an air outlet. The heat dissipation module can be used in electronic devices, and the heat dissipation component can dissipate heat from the heat source components of the electronic device. A first partition is disposed between the first air vent and the heat dissipation component. The first air vent can be either an air inlet or an air outlet. Therefore, the first partition can be positioned close to either the air inlet or the air outlet of the air duct. Since the area of ​​the first air hole on the first partition is smaller than the area of ​​the first air vent, the first air hole on the first partition can meet the dust prevention requirements of the air duct, reducing the entry of dust particles into the air duct. Furthermore, the first partition is disposed within the air duct and is not exposed. Therefore, the shape and area of ​​the first air hole on the first partition can be freely designed without affecting the appearance and refinement of the heat dissipation module. Simultaneously, the area of ​​the first air vent can be increased, thereby increasing the airflow into the air duct and improving the heat dissipation effect of the heat dissipation module. At this point, the shape of the first air vent is not limited by dustproof requirements. Therefore, the first air vent can be designed in various shapes according to appearance requirements, such as round, square, or even irregular shapes like hearts, thereby improving the aesthetic appeal of the heat dissipation module. When the heat dissipation module is applied to electronic devices, the surface of the heat dissipation module with the first and second air vents can serve as the surface of the electronic device, thus improving the aesthetic appeal of the electronic device.

[0007] In some embodiments, the main body is further provided with a third air vent, which is connected to the first air cavity. The third air vent and the first air vent face different directions, and the area of ​​the first air vent is smaller than the area of ​​the third air vent.

[0008] By setting a third air outlet connected to the first air cavity, the air volume can be increased, the air flow resistance can be reduced, and the heat dissipation efficiency of the heat dissipation module can be improved.

[0009] In some embodiments, the air duct includes a first chamber and a second chamber that are connected. A first partition is disposed in the first chamber, and the area in the first chamber other than the first air cavity is the second air cavity. A second air outlet is connected to the second chamber. A fourth air outlet is also disposed on the main body, which is connected to the second air cavity. The area of ​​the fourth air outlet is smaller than the area of ​​the first air outlet.

[0010] By adding a fourth air vent, airflow can be increased, wind resistance reduced, and the heat dissipation effect of the heat dissipation module improved. Furthermore, the area of ​​the fourth air vent is smaller than that of the first air vent, allowing for a smaller fourth air vent to be incorporated into the main body, thus meeting dust prevention requirements.

[0011] In some embodiments, the first partition includes a first sub-partition and a second sub-partition stacked together. The first sub-partition includes a first rib mesh, and the second sub-partition has a plurality of first air passage holes formed thereon, wherein the first rib mesh covers a portion of the first air passage holes in the stacking direction.

[0012] In this design, the first rib mesh is used to shield the larger first air passage, creating multiple first air passages. This reduces the air outlet area of ​​the first air passage. The smaller the air outlet area of ​​the first air passage, the better the dustproof effect of the stacked first and second sub-partitions. Therefore, shielding the first air passage with the first rib mesh increases its area, thus reducing the manufacturing requirements for the first air passage on the second sub-partition and making it easier to produce.

[0013] In some embodiments, the heat dissipation module further includes: a second partition, which is disposed in the air duct and located between the heat dissipation component and the second air outlet. The second partition and the main body form a third air cavity, and the second air outlet is connected to the third air cavity. The second partition is provided with a plurality of second air holes, the area of ​​which is smaller than the area of ​​the second air outlet.

[0014] In this design, the area of ​​the second vent is smaller than that of the second air outlet. This means a smaller vent can be placed on the second partition, allowing it to meet dust prevention requirements and reduce dust particles entering the air duct. Furthermore, since the second partition is located within the air duct and not exposed, the shape and area of ​​the second vent on it can be freely designed without affecting the aesthetic appearance of the heat dissipation module. Simultaneously, the shape of the second air outlet is not limited by dust prevention requirements; therefore, it can be designed in various shapes to meet aesthetic needs, such as round, square, or even irregular shapes like hearts, thereby improving the overall aesthetic appearance of the heat dissipation module. When the heat dissipation module is applied to electronic devices, the surface of the module with the first and second air outlets can serve as the surface of the electronic device, further enhancing its aesthetic appeal.

[0015] In some embodiments, the main body is further provided with a fifth air vent, which is connected to the third air cavity. The fifth air vent and the second air vent face different directions, and the area of ​​the second air vent is smaller than the area of ​​the fifth air vent.

[0016] By setting a fifth air inlet connected to the third air chamber, the air intake of the air duct can be increased, the air resistance can be reduced, and the heat dissipation effect of the heat dissipation module can be improved.

[0017] In some embodiments, the air duct includes a first chamber and a second chamber that are connected. A first partition is disposed in the first chamber, and a second partition is disposed in the second chamber. The area in the second chamber other than the third air chamber is a fourth air chamber. The main body is also provided with a sixth air outlet, which is connected to the fourth air chamber. The area of ​​the sixth air outlet is smaller than the area of ​​the second air outlet.

[0018] The addition of a sixth air vent increases airflow and improves the heat dissipation effect of the heat dissipation module. Furthermore, the area of ​​the sixth air vent is smaller than that of the second air vent, allowing for a smaller sixth air vent to be integrated into the main body, thus meeting dust prevention requirements.

[0019] In some embodiments, the second partition includes a third sub-partition and a fourth sub-partition stacked together. The third sub-partition includes a second rib mesh, and the fourth sub-partition has a plurality of second air passages formed thereon, wherein the second rib mesh covers a portion of the second air passages in the stacking direction.

[0020] In this process, the larger second air passage is shielded by a second rib mesh to form the first air passage, thereby reducing the air outlet area of ​​the second air passage. The smaller the air outlet area of ​​the second air passage, the better the dustproof effect of the stacked third and fourth sub-partitions. Therefore, shielding the second air passage with the second rib mesh increases its area, thus reducing the manufacturing requirements for the second air passage on the fourth sub-partition and making it easier to produce.

[0021] In some embodiments, the heat dissipation assembly includes a fan and a heat exchanger. The fan includes an air inlet and an air outlet. The air inlet is close to a first air outlet, and the air outlet is close to a second air outlet. The heat exchanger is disposed between the air outlet and the second air outlet. A first partition is disposed between the air inlet and the first air outlet. A second partition is disposed between the heat exchanger and the second air outlet.

[0022] With this configuration, both the first and second baffles can meet the dust prevention requirements. The first baffle can prevent dust from entering the second air chamber, thus protecting the fan, while the second baffle can prevent dust from entering the fourth air chamber, thus protecting the heat exchange components.

[0023] On the other hand, an electronic device is provided. This electronic device includes the heat dissipation module and heat source device provided in some of the above embodiments. The heat dissipation components of the heat dissipation module are used to dissipate heat from the heat source device.

[0024] The electronic device provided in this application embodiment includes all the structures of the heat dissipation module provided in some of the above embodiments. Therefore, the electronic device provided in this application embodiment includes all the beneficial effects of the heat dissipation module provided in some of the above embodiments, which will not be repeated here.

[0025] In some embodiments, the body includes a middle frame, a rear cover, and an air duct base plate. A first groove is provided on the middle frame, and the rear cover covers the opening of the first groove. A first air vent and a second air vent are provided on the rear cover. The air duct base plate is provided at the bottom of the first groove, and a heat dissipation component is provided on the side of the air duct base plate facing the rear cover.

[0026] The length of the air duct is roughly the same as the length of the back cover. In this case, the air duct has a large volume, which facilitates the placement of the heat dissipation components.

[0027] In some embodiments, the body includes: a mid-frame, a rear cover, a camera decorative ring, and an air duct base plate. The air duct base plate is disposed on the mid-frame and forms a second groove. A heat dissipation component is disposed at the bottom of the second groove. The rear cover has a mounting opening, the camera decorative ring is disposed within the mounting opening, the camera decorative ring covers the opening of the second groove, and a first air vent and a second air vent are disposed on the camera decorative ring.

[0028] The air duct and the heat dissipation components within it are located within the area covered by the camera's decorative ring. This minimizes the area occupied by the air duct and heat dissipation components, thus facilitating the miniaturization of the electronic device.

[0029] In some embodiments, the electronic device further includes a display panel, a mid-frame including a mid-frame motherboard disposed on one side of the display panel, and a mounting position provided on the mid-frame motherboard; a heat source device disposed on the mounting position, and an air duct base plate disposed on the side of the mid-frame motherboard away from the display panel and covering the heat source device; a heat dissipation assembly including a heat exchanger disposed on the air duct base plate, and the heat exchanger and the heat source device being stacked in a third direction, wherein the third direction is the stacking direction of the mid-frame motherboard and the display panel.

[0030] The air duct base plate can be attached to the surface of the heat source device facing away from the display panel, allowing heat generated by the heat source device to be transferred to the air duct base plate. The heat exchanger and heat source device are arranged overlapping each other in a third-order upward orientation. In this configuration, the orthographic projection of the heat exchanger on the motherboard frame can at least partially overlap with the orthographic projection of the heat source device on the motherboard frame. This facilitates the transfer of heat generated by the heat source device to the heat exchanger via the air duct base plate. Furthermore, the overlapping arrangement of the heat exchanger and heat source device in a third-order upward orientation shortens the heat transfer path, improves thermal conductivity, and consequently increases the amount of heat received by the heat exchanger, thereby improving the heat dissipation efficiency of the electronic device. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.

[0032] Figure 1 This is a structural diagram of an electronic device provided in some embodiments of this application;

[0033] Figure 2 for Figure 1 A structural diagram of the electronic equipment in the diagram;

[0034] Figure 3 for Figure 2 Schematic diagram of the central air intake opening;

[0035] Figure 4 for Figure 1 Another structural diagram of the electronic equipment in the diagram;

[0036] Figure 5 for Figure 1 Another structural diagram of the electronic equipment in the process;

[0037] Figure 6 for Figure 1 Another structural diagram of the electronic devices in the diagram;

[0038] Figure 7 for Figure 1 Another structural diagram of the electronic equipment in the diagram;

[0039] Figure 8 for Figure 4 Structural diagram of the first partition in the middle;

[0040] Figure 9 for Figure 4 Another structural diagram of the first partition in the middle;

[0041] Figure 10 for Figure 4 Another structural diagram of the first partition in the middle;

[0042] Figure 11 for Figure 10 A top view of the first partition in the middle;

[0043] Figure 12 for Figure 1 Another structural diagram of the electronic equipment in the process;

[0044] Figure 13 for Figure 1 Another structural diagram of the electronic devices in the diagram;

[0045] Figure 14 for Figure 13 Structural diagrams of the first and second partitions in the middle;

[0046] Figure 15 for Figure 13 Another structural diagram of the first and second partitions in the middle;

[0047] Figure 16 for Figure 1 Another structural diagram of the electronic equipment in the diagram;

[0048] Figure 17for Figure 1 Another structural diagram of the electronic devices in the diagram;

[0049] Figure 18 for Figure 17 A simplified top view of the electronic equipment in the diagram;

[0050] Figure 19 for Figure 18 A simplified side view of the electronic device on the long side of the screen.

[0051] Figure 20 for Figure 13 A simplified top view of the electronic equipment in the diagram;

[0052] Figure 21 for Figure 18 A simplified side view of the electronic device in the diagram. Detailed Implementation

[0053] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0054] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "compriseing," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "some embodiments," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0055] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0056] As used herein, “approximately” or “about” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0057] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0058] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0059] Figure 1 This is a structural diagram of an electronic device 2000 provided in some embodiments of this application.

[0060] Please see Figure 1 This application provides an electronic device 2000. The electronic device 2000 can be of various types. For example, it can be a mobile phone, tablet computer, personal computer (PC), personal digital assistant (PDA), or other different types of user devices or terminal devices. This application does not impose any special limitations on the specific form of the electronic device 2000. Figure 1 In this paper, we will use a mobile phone as an example to illustrate the electronic device 2000.

[0061] Figure 2 for Figure 1 A structural diagram of the electronic device 2000. Among them, in... Figure 2 In the diagram, arrow A indicates the direction of airflow.

[0062] Please see Figure 2 The electronic device 2000 may include a device body 1001, a heat source 1002, a cooling fan 1003, and fins 1009. The device body 1001 has a heat dissipation duct 1004, and also has an air inlet 1005 and an air outlet 1006 located at opposite ends of the heat dissipation duct 1004. The cooling fan 1003 and fins 1009 are disposed within the heat dissipation duct 1004. Heat from the heat source 1002 can be transferred to the fins 1009, and the cooling fan 1003 can dissipate heat from the fins 1009, thereby dissipating heat from the heat source 1002.

[0063] The cooling fan 1003 can accelerate the airflow, thereby generating airflow. The airflow can enter the air duct 1004 from the air inlet 1005, exchange heat with the fins 1009, and then be discharged from the air outlet 1006, thereby dissipating heat from the heat source 1002.

[0064] Figure 3 for Figure 2 A schematic diagram of the central air intake gap 1005.

[0065] Please see Figure 3 The air inlet notch 1005 is provided with multiple first dividing strips 1007, which are staggered to divide the air inlet notch 1005 into multiple air inlet holes 1008. The structure of the air outlet notch 1006 can be the same as that of the air inlet notch 1005. For example, the air outlet notch 1006 can be provided with multiple second dividing strips, which are staggered to divide the air outlet notch 1006 into multiple air outlet holes. The structure of the second dividing strips can refer to the first dividing strips 1007, and the structure of the air outlet holes can refer to the air inlet holes 1008.

[0066] Because the cooling fan 1003 or other components require dust protection, the air inlet 1008 and air outlet vents have small areas, high wind resistance, and low air volume, resulting in poor heat dissipation for the electronic device 2000.

[0067] Based on this, this application provides an electronic device 2000.

[0068] Figure 4 for Figure 1 Another structural diagram of the electronic device 2000 in the middle, Figure 4 In the diagram, arrow B indicates the direction of airflow. Figure 5 for Figure 1 Another structural diagram of the electronic equipment 2000 in the system. Figure 5 In the image, arrow C indicates the direction of airflow. Within this... Figure 4 In the embodiment shown, the first air vent 101 is an air inlet opening. Figure 5 In the embodiment shown, the first air vent 101 is an air outlet.

[0069] Please see Figure 4 and Figure 5 The electronic device 2000 includes a heat source device 500 and a heat dissipation module 1000. The heat dissipation module 1000 is used to dissipate heat from the heat source device 500.

[0070] The heat dissipation module 1000 includes: a body 100, a heat dissipation component 200, and a first partition 300.

[0071] The main body 100 is provided with an air duct 400, and the main body 100 is provided with a first air outlet 101 and a second air outlet 102, which are located at both ends of the air duct 400.

[0072] The number of first air vents 101 can be one or more, and all one or more first air vents 101 are connected to the first air cavity 401.

[0073] The number of second air vents 102 can be one or more, and all of them can be connected to the air duct 400.

[0074] Among them, one of the first air vent 101 and the second air vent 102 can be an air inlet and the other can be an air outlet.

[0075] The heat dissipation component 200 is located within the air duct 400.

[0076] The heat dissipation assembly 200 can dissipate heat from the heat source components of the electronic device 2000. For example, the heat dissipation assembly 200 may include a fan 210 located inside the air duct 400. Driven by the fan 210, air can enter the air duct 400 through the air inlet, dissipate heat from the heat source components inside the air duct 400, and then be exhausted from the air outlet of the air duct 400.

[0077] like Figure 4 As shown in the example, the fan 210 may include a fan inlet 211 and a fan outlet 212. When the first outlet 101 is close to the fan inlet 211 and the second outlet 102 is close to the fan outlet 212, the first outlet 101 can serve as the air inlet opening of the air duct 400 and the second outlet 102 can serve as the air outlet opening of the air duct 400.

[0078] like Figure 5As shown, when the first air vent 101 is close to the fan outlet 212 and the second air vent 102 is close to the fan inlet 211, the first air vent 101 can serve as the air outlet of the air duct 400 and the second air vent 102 can serve as the air inlet of the air duct 400.

[0079] In some examples, the heat dissipation assembly 200 may also include a heat exchanger 220. The heat exchanger 220 is disposed within the air duct 400 and near the fan outlet 212 of the fan 210. The heat exchanger 220 may be in direct contact with or indirectly connected to the heat source device 500, so that the heat generated by the heat source device 500 can be transferred to the heat exchanger 220.

[0080] The air discharged from the fan outlet 212 of the fan 210 can exchange heat with the heat exchanger 220, thereby dissipating heat from the heat exchanger 220 and, in turn, dissipating heat from the heat source device 500.

[0081] For example, heat exchanger 220 can be a heat sink fin.

[0082] The first partition 300 is disposed within the air duct 400 and is located between the heat dissipation component 200 and the first air outlet 101. The first partition 300 and the main body 100 form a first air cavity 401. The first air outlet 101 is connected to the first air cavity 401. The first partition 300 is provided with a plurality of first air holes 301, and the area of ​​the first air holes 301 is smaller than the area of ​​the first air outlet 101.

[0083] For example, the first partition 300 can be snapped or glued to the body 100.

[0084] The first partition 300 and the main body 100 form a first air cavity 401, wherein the first air cavity 401 is part of the air duct 400.

[0085] The first partition 300 is disposed between the first air vent 101 and the heat dissipation component 200. The first air vent 101 can be either an air inlet or an air outlet. Therefore, the first partition 300 can be disposed near either the air inlet or the air outlet of the air duct 400.

[0086] exist Figure 4 In the illustrated embodiment, the first air vent 101 is an air inlet, while the second air vent 102 is an air outlet. The heat dissipation component 200 can draw cold air into the first air cavity 401 from the first air vent 101, and then enter other areas in the air duct 400 through the first air hole 301 on the first partition 300. The cold air exchanges heat with the heat source device 500 and other structures in the air duct 400, and after the air temperature rises, it is discharged from the device through the second air vent 102.

[0087] exist Figure 5In the illustrated embodiment, the first air vent 101 is an air outlet, and the second air vent 102 is an air inlet. The heat dissipation assembly 200 can draw cold air into the air duct 400 through the second air vent 102, where it exchanges heat with other structures. After the air temperature rises, it enters the first air chamber 401 through the first air hole 301 on the first partition 300, and then exits through the first air vent 101. For example, when the first air vent 101 is an air outlet, the first partition 300 can be disposed between the heat exchanger 220 and the first air vent 101.

[0088] Since the area of ​​the first vent 301 on the first partition 300 is smaller than the area of ​​the first air outlet 101, the first vent 301 on the first partition 300 can meet the dustproof requirements of the air duct 400, reducing the entry of dust particles into the air duct 400. Furthermore, since the first partition 300 is located inside the air duct 400 and not exposed, the shape and area of ​​the first vent 301 on the first partition 300 can be freely designed without affecting the aesthetic appearance of the heat dissipation module 1000. Simultaneously, the area of ​​the first air outlet 101 can be increased, thereby increasing the air intake of the air duct 400 and improving the heat dissipation effect of the heat dissipation module 1000. At this time, the shape of the first air outlet 101 is not limited by dustproof requirements; therefore, the first air outlet 101 can be designed into various shapes according to aesthetic requirements, such as round, square, or even heart-shaped irregular shapes, thereby improving the aesthetic appearance of the heat dissipation module 1000. When the heat dissipation module 1000 is applied to the electronic device 2000, the surface of the heat dissipation module 1000 with the first air vent 101 and the second air vent 102 can serve as the surface of the electronic device 2000, thereby improving the appearance and refinement of the electronic device 2000.

[0089] In some examples, a first partition 300 is provided between the first air vent 101 and the heat dissipation component 200, while no partition is provided between the second air vent 102 and the heat dissipation component 200. In this case, the area of ​​the second air vent 102 is smaller than the area of ​​the first air vent 101. This arrangement allows the second air vent 102 to meet the dustproof requirements of the air duct 400, preventing dust particles from entering the air duct 400.

[0090] Figure 6 for Figure 1 Another structural diagram of the electronic equipment 2000 in the system. Figure 6 In the diagram, arrow D indicates the direction of airflow. Figure 7 for Figure 1 Another structural diagram of the electronic device 2000 in the middle, Figure 7 In the diagram, arrow E indicates the direction of airflow. Wherein, Figure 6 In the illustrated embodiment, the first air vent 101, the third air vent 103, and the fourth air vent 104 are air inlets. Figure 7In the illustrated embodiment,

[0091] Please see Figure 6 and Figure 7 In some embodiments, the main body 100 is also provided with a third air vent 103, which is connected to the first air cavity 401. The third air vent 103 and the first air vent 101 face different directions, and the area of ​​the first air hole 301 is smaller than the area of ​​the third air vent 103.

[0092] The third air vent 103 and the first air vent 101 can be disposed on different surfaces of the body 100, so that the third air vent 103 and the first air vent 101 face different directions.

[0093] For example, when the electronic device 2000 is a display device, the body 100 may include a first surface 110 and a second surface 120, and the electronic device 2000 may include a display surface 130, wherein the first surface 110 and the display surface 130 are disposed opposite to each other, and the second surface 120 is connected between the first surface 110 and the display surface 130. The second surface 120 may intersect with the first surface 110, and the second surface 120 may intersect with the display surface 130.

[0094] In some examples, the first air vent 101 may be located on the first surface 110, while the third air vent 103 may be located on the second surface 120.

[0095] In other examples, the first air vent 101 can be located on the second surface 120, and the third air vent 103 can be located on the first surface 110.

[0096] By setting a third air outlet 103 connected to the first air cavity 401, the air volume can be increased, the air flow resistance can be reduced, and the heat dissipation efficiency of the heat dissipation module 1000 can be improved.

[0097] In some other examples, the third air vent 103 and the first air vent 101 can face the same direction. In this case, both the third air vent 103 and the first air vent 101 can be located on the first surface 110.

[0098] For example, such as Figure 6 As shown, both the first air vent 101 and the third air vent 103 can be air inlets. By setting the third air vent 103, the area of ​​the air inlet can be increased, thereby increasing the air volume.

[0099] In other examples, such as Figure 7 As shown, both the first air vent 101 and the third air vent 103 can be air outlets. By setting the third air vent 103, the area of ​​the air outlet can be increased, thereby increasing the air volume.

[0100] Please see Figure 6 and Figure 7 In some embodiments, the air duct 400 includes a first chamber 410 and a second chamber 420 connected together, a first partition 300 is located in the first chamber 410, the area in the first chamber 410 other than the first air cavity 401 is the second air cavity 402, and the second air outlet 102 is connected to the second chamber 420.

[0101] The main body 100 is also provided with a fourth air vent 104, which is connected to the second air cavity 402. The area of ​​the fourth air vent 104 is smaller than the area of ​​the first air vent 101.

[0102] like Figure 6 As shown, when both the first air vent 101 and the fourth air vent 104 are air inlets, the fan 210 can be located in the second air chamber 402, and the heat exchanger 220 can be located in the second chamber 420. At this time, the fan air inlet 211 is close to the first air vent 101, and the fan air outlet 212 is close to the second air vent 102.

[0103] At this time, air can enter the first air cavity 401 of the first chamber 410 from the first air vent 101 and the third air vent 103, and then enter the second air cavity 402 from the first air hole 301 on the first partition 300. At the same time, air can enter the second air cavity 402 from the fourth air vent 104. The air in the second air cavity 402 can enter the fan 210 from the fan inlet 211, and then exit from the fan outlet 212 of the fan 210, entering the second chamber 420. In the second chamber 420, it exchanges heat with the heat exchanger 220, dissipating heat from the heat source device 500, and then exits from the second air vent 102.

[0104] like Figure 7 As shown, when the first air vent 101 and the fourth air vent 104 are both air outlets and the second air vent 102 is an air inlet, the fan 210 can be installed in the second chamber 420 and the heat exchanger 220 can be located in the first chamber 410.

[0105] At this time, air can enter the second chamber 420 from the second air vent 102, then enter the fan inlet 211 of the fan 210, and be discharged from the fan outlet 212 to the second air cavity 402 of the first chamber 410. The air exchanges heat with the heat exchanger 220 in the second air cavity 402 and dissipates heat from the heat source device 500. Some of the air can be discharged from the fourth air vent 104, and another part of the air can be discharged from the first air hole 301 on the first partition 300 to the first air cavity 401 of the first chamber 410. The air in the first air cavity 401 can be discharged from the first air vent 101 and the third air vent 103.

[0106] For example, a fourth air vent 104 may be provided on the second surface 120, wherein the number of fourth air vents 104 may be one or more.

[0107] By setting a fourth air vent 104, the airflow can be increased, the air resistance reduced, and the heat dissipation effect of the heat dissipation module 1000 improved. In addition, the area of ​​the fourth air vent 104 is smaller than that of the first air vent 101, so that a smaller fourth air vent 104 can be set on the main body 100, thereby meeting the dust prevention requirements.

[0108] For example, both the first air vent 101 and the fourth air vent 104 are air inlets. By setting the fourth air vent 104, the area of ​​the air inlet can be increased, thereby increasing the air volume.

[0109] In some other examples, both the first air vent 101 and the fourth air vent 104 are air outlets. By setting the fourth air vent 104, the area of ​​the air outlet can be increased, thereby increasing the air volume.

[0110] Figure 8 for Figure 4 Structural diagram of the first partition 300. Figure 9 for Figure 4 Another structural diagram of the first partition 300. Wherein, in Figure 8 and Figure 9 In the middle, the shape of the first air vent 301 is different.

[0111] Please see Figure 8 and Figure 9 In some embodiments, a plurality of first air vents 301 may be arranged in an array on the first partition 300.

[0112] Among them, such as Figure 8 As shown, the first air vent 301 can be square, such as... Figure 9 As shown, the first air vent 301 can also be circular, rhomboid, etc. In the embodiments provided in this application, the shape of the first air vent 301 is not limited.

[0113] Figure 10 for Figure 4 Another structural diagram of the first partition 300 in the middle. Figure 11 for Figure 10 Top view of the first partition 300 in the middle.

[0114] Please see Figure 10 and Figure 11In some embodiments, the first partition 300 includes a first sub-partition 310 and a second sub-partition 320 stacked together. The first sub-partition 310 includes a first rib mesh 311, and the second sub-partition 320 has a plurality of first air passage holes 322 formed thereon. The first rib mesh 311 blocks a portion of the first air passage holes 322 in the stacking direction H to form a first air passage hole 301.

[0115] Please see Figure 11 The first rib mesh 311 may include a plurality of first ribs 3111 extending along a first direction L1 and a plurality of second ribs 3112 extending along a second direction L2. The plurality of first ribs 3111 may be arranged sequentially along the second direction L1 and the plurality of second ribs 3112 may be arranged sequentially along the first direction. The first ribs 3111 and the second ribs 3112 intersect.

[0116] For example, the first direction L1 and the second direction L2 can be perpendicular.

[0117] Among them, multiple first ribs 3111 and multiple second ribs 3112 can be arranged in a cross pattern to form multiple third air passages 312.

[0118] In some examples, the first sub-partition 310 may further include two first frame borders 313 disposed opposite each other in the first direction L1 and two second frame borders 314 disposed opposite each other in the second direction L2, wherein the two ends of the first frame borders 313 are respectively connected to the two second frame borders 314, and the two ends of the second frame borders 314 are respectively connected to the two second ribs 3112. The two first frame borders 313 and the two second frame borders 314 can form a first air passage area, and the first ribs 3111 and the second ribs 3112 can be disposed within the first air passage area, wherein the two ends of the first ribs 3111 can be respectively connected to the two first frame borders 313, and the two ends of the second ribs 3112 can be respectively connected to the two second frame borders 314. A plurality of first ribs 3111 and a plurality of second ribs 3112 can divide the first air passage area into a plurality of third air passage holes 312. The plurality of third air passage holes 312 can be arranged in an array.

[0119] exist Figure 11 In the embodiment shown, the third air passage 312 is square. However, the third air passage 312 can also be rectangular, circular, rhomboid, etc. In this embodiment, the shape of the third air passage 312 is not limited.

[0120] like Figure 11 As shown, a plurality of first air passage holes 322 are formed on the second sub-partition 320, wherein the plurality of first air passage holes 322 can be arranged in an array.

[0121] For example, the second sub-partition 320 may include a third rib mesh 321, which may include a plurality of third ribs 3211 extending along a first direction L1 and a plurality of fourth ribs 3212 extending along a second direction L2. The plurality of third ribs 3211 may be arranged sequentially along the second direction L1 and the plurality of fourth ribs 3212 may be arranged sequentially along the first direction, with the third ribs 3211 and the fourth ribs 3212 intersecting.

[0122] Among them, the third rib 3211 and the fourth rib 3212 are arranged in an intersecting manner to form multiple first air passage holes 322.

[0123] exist Figure 11 In the embodiment shown, the first air passage 322 is square. However, the first air passage 322 can also be rectangular or circular. In this embodiment, the shape of the first air passage 322 is not limited.

[0124] In some examples, the second sub-partition 320 may further include two third sidewalls 323 disposed opposite to each other in the first direction L1 and two fourth sidewalls 324 disposed opposite to each other in the second direction L2, wherein the two ends of the third sidewalls 323 are respectively connected to the two fourth sidewalls 324, and the two ends of the fourth sidewalls 324 are respectively connected to the two third sidewalls 323. The two third sidewalls 323 and the two fourth sidewalls 324 can form a second air passage area, and third ribs 3211 and fourth ribs 3212 can be disposed within the second air passage area, wherein the two ends of the third ribs 3211 can be respectively connected to the two third sidewalls 323, and the two ends of the fourth ribs 3212 can be respectively connected to the two fourth sidewalls 324. Multiple third ribs 3211 and multiple fourth ribs 3212 can divide the second air passage area into multiple third air passage holes 312. The multiple third air passage holes 312 can be arranged in an array.

[0125] The first sub-partition 310 and the second sub-partition 320 are stacked in the stacking direction H. At this time, the orthogonal projection of the first rib mesh 311 of the first sub-partition 310 onto the second sub-partition 320 can cover part of the first air passage 322 of the second sub-partition 320, thereby reducing the air passage area of ​​the first air passage 322 and thus forming the first air passage 301. At this time, the first rib mesh 311 and the third rib mesh 321 together form the first air passage 301.

[0126] Among them, the first reinforcing mesh 311 can divide part of the first air passage 322 into multiple first air passages 301, such as Figure 11 As shown, the first reinforcing mesh 311 can divide part of the first air passage 322 into four first air passages 301.

[0127] In the embodiments provided in this application, the first air passage 322 with a larger area is shielded by the first rib mesh 311 to form a plurality of first air passages 301, thereby increasing the area of ​​the first air passage 322. As a result, the process requirements for the first air passage 322 on the second sub-partition 320 are lower and it is easier to manufacture.

[0128] In some examples, the orthographic projection of the first frame 313 and the second frame 314 onto the second sub-partition 320 can partially obscure the first air vent 322 to form a plurality of first air vents 322.

[0129] Figure 12 for Figure 1 Another structural diagram of the electronic equipment 2000. Figure 12 In the diagram, arrow F indicates the direction of airflow.

[0130] Please see Figure 12 In some embodiments, the heat dissipation module 1000 further includes: a second partition 600, which is disposed within the air duct 400 and located between the heat dissipation component 200 and the second air vent 102. The second partition 600 and the body 100 form a third air cavity 403, and the second air vent 102 is connected to the third air cavity 403. The second partition 600 is provided with a plurality of second air holes 601, and the area of ​​the second air holes 601 is smaller than the area of ​​the second air vent 102.

[0131] The second partition 600 can be snapped or glued to the main body 100.

[0132] For example, when the first air vent 101 is the air inlet of the air duct 400 and the second air vent 102 is the air outlet of the air duct 400, the first partition 300 is located between the first air vent 101 and the fan air inlet 211 of the fan 210, while the second partition 600 is located between the second air vent 102 and the fan air outlet 212 of the fan 210. For example, the second partition 600 can be located between the heat exchanger 220 and the second air vent 102.

[0133] At this time, air enters the first air chamber 401 from the first air inlet 101, and then enters the second air chamber 402 from the first air hole 301 on the first partition 300. The air in the second air chamber 402 can enter the fan 210 from the fan inlet 211 and be discharged to the second chamber 420 from the fan outlet 212. It exchanges heat with the heat exchanger 220 and dissipates heat from the heat source device 500. Then it is discharged to the third air chamber 403 from the second air hole 601 of the second partition 600, and then discharged from the second air inlet 102.

[0134] When the heat dissipation module 1000 includes the second partition 600, the first air vent 101 can also serve as the air outlet of the air duct 400, and the second air vent 102 can serve as the air inlet of the air duct 400.

[0135] In this design, the area of ​​the second vent 601 is smaller than that of the second air outlet 102. This means that a smaller vent 601 can be provided on the second partition 600. In this case, the second vent 601 can be designed to meet dust prevention requirements, reducing the amount of dust particles entering the air duct 400. Furthermore, the second partition 600 is located within the air duct 400 and is not exposed. Therefore, the shape and area of ​​the second vent 601 on the second partition 600 can be freely designed without affecting the aesthetic appearance of the heat dissipation module 1000. Simultaneously, the shape of the second air outlet 102 is not limited by dust prevention requirements. Therefore, the second air outlet 102 can be designed in various shapes according to aesthetic needs, such as round, square, or even heart-shaped irregularities, thereby improving the aesthetic appearance of the heat dissipation module 1000. When the heat dissipation module 1000 is applied to the electronic device 2000, the surface of the heat dissipation module 1000 with the first air outlet 101 and the second air outlet 102 can serve as the surface of the electronic device 2000, further enhancing its aesthetic appearance.

[0136] Please see Figure 12 In some embodiments, the main body 100 is also provided with a fifth air vent 105, which is connected to the third air cavity 403. The fifth air vent 105 and the second air vent 102 face different directions, and the area of ​​the second air hole 601 is smaller than the area of ​​the fifth air vent 105.

[0137] The fifth air vent 105 can be one or more.

[0138] By setting a fifth air outlet 105 connected to the third air cavity 403, the air intake of the air duct 400 can be increased, the wind resistance can be reduced, and the heat dissipation effect of the heat dissipation module 1000 can be improved.

[0139] For example, the heat dissipation module 1000 may also include a third surface 140, which is connected between the first surface 110 and the display surface 130, and the third surface 140 may be disposed opposite to the second surface 120.

[0140] The fifth air vent 105 can be located on the third surface 140, while the second air vent 102 can be located on the first surface 110. Alternatively, the fifth air vent 105 can be located on the first surface 110, while the second air vent can be located on the third surface 140.

[0141] Figure 13 for Figure 1 Another structural diagram of the electronic equipment 2000. Figure 13 In the diagram, arrow G indicates the direction of airflow.

[0142] Please see Figure 13In some embodiments, the second partition 600 is located in the second chamber 420, and the area in the second chamber 420 other than the third air chamber 403 is the fourth air chamber 404; the main body 100 is also provided with a sixth air vent 106, which is connected to the fourth air chamber 404, and the area of ​​the sixth air vent 106 is smaller than the area of ​​the second air vent 102.

[0143] The number of sixth air vents 106 can be one or more, and the sixth air vents 106 can be set on the third surface 140.

[0144] For example, when the first air vent 101 is an air inlet and the second air vent 102 is an air outlet, the heat exchanger 220 can be disposed in the fourth air cavity 404. Air exchanges heat with the heat exchanger 220 in the fourth air cavity 404 to dissipate heat from the heat source device 500. After dissipating heat, part of the air can be discharged from the sixth air vent 106, and another part of the air can be discharged from the second air hole 601 on the second partition 600 to the third air cavity 403. The air in the third air cavity 403 can be discharged from the second air vent 102 and the fifth air vent 105.

[0145] The sixth air vent 106 increases airflow and improves the heat dissipation effect of the heat dissipation module 1000. Furthermore, the area of ​​the sixth air vent 106 is smaller than that of the second air vent 102, allowing the smaller sixth air vent 106 to be installed on the main body 100, thus meeting dust prevention requirements.

[0146] In some embodiments, a plurality of second air vents 601 may be arranged in an array on the second partition 600. The second air vents 601 may be circular or square; the shape of the second air vents 601 is not limited in the embodiments provided in this application. The structure of the second partition 600 and the shape of the second air vents 601 can be referred to... Figure 12 and Figure 13 The first partition 300 is provided.

[0147] In some examples, the first partition 300 and the second partition 600 can be independent components. In this case, the first partition 300 and the second partition 600 can be manufactured separately and then installed in the heat dissipation module 1000 respectively.

[0148] Please see Figure 12 and Figure 13 In some embodiments, the heat dissipation assembly 200 includes a fan 210 and a heat exchanger 220. The heat exchanger 220 is close to the fan outlet 212 of the fan 210, the fan inlet 211 is close to the first air outlet 101, and the fan outlet 212 is close to the second air outlet 102. Therefore, the first air outlet 101 can serve as the air inlet of the air duct 400, and the second air outlet 102 can serve as the air outlet of the air duct 400.

[0149] The heat exchanger 220 is disposed between the fan outlet 212 and the second air outlet 102. The first partition 300 is disposed between the fan inlet 211 and the first air outlet 101, and the second partition 600 is disposed between the heat exchanger 220 and the second air outlet 102.

[0150] The fan 210 is located in the second air chamber 402, and the heat exchanger 220 can be located in the fourth air chamber 404.

[0151] With this configuration, both the first partition 300 and the second partition 600 can meet the dust prevention requirements. The first partition 300 can prevent dust from entering the second air chamber 402, thereby protecting the fan 210. The second partition 600 can prevent dust from entering the fourth air chamber 404, thereby protecting the heat exchanger 220.

[0152] Figure 14 for Figure 13 The structural diagram of the first partition 300 and the second partition 600.

[0153] Please see Figure 14 In some other embodiments, the first partition 300 and the second partition 600 can be integrally formed. The heat dissipation module 1000 may include a partition 700, wherein a first region 710 of the partition 700 is provided with a plurality of first vents 301, and a second region 720 of the partition 700 is provided with a plurality of second vents 601. The first region 710 can serve as the first partition 300, and the second region 720 can serve as the second partition 600.

[0154] Figure 15 for Figure 13 Another structural diagram of the first partition 300 and the second partition 600.

[0155] Please see Figure 15 In some embodiments, the second partition 600 includes a third sub-partition 610 and a fourth sub-partition 620 stacked together. The third sub-partition 610 includes a second rib mesh 611, and the fourth sub-partition 620 has a plurality of second air passage holes 622 formed thereon. The second rib mesh 611 shields a portion of the second air passage holes 622 in the stacking direction H to form a second air passage hole 601.

[0156] In this process, the second air passage 622, which has a larger area, is shielded by the second rib mesh 611 to form multiple second air passages 601. As a result, the process requirements for the second air passage 622 on the fourth sub-partition 620 are lower, making it easier to manufacture.

[0157] In some examples, the third sub-partition 610 can be integrally formed with the first sub-partition 310, and the fourth sub-partition 620 can be integrally formed with the second sub-partition 320.

[0158] Please see you later. Figure 13 In some embodiments, the air duct 400 may include a bottom surface 810, a side surface 820, and a top surface 830. The bottom surface 810 and the top surface 830 are disposed opposite each other in a third direction L3, and the side surface 820 is connected between the bottom surface 810 and the top surface 830. A first air outlet 101 is disposed on the top surface 830, and a second air outlet 102 is disposed on the top surface 830.

[0159] The fan 210 and heat exchanger 220 of the heat dissipation component 200 are mounted on the bottom surface 810 of the air duct.

[0160] The fan 210 has an air inlet 211 facing the top surface 830 of the air duct and an air outlet 212 facing the side surface 820 of the air duct. The fan 210 and the top surface 830 of the air duct are spaced apart.

[0161] The heat dissipation module 1000 may also include a partition 900, which is connected between the top surface 830 of the air duct and the fan 210, so that the partition 900 and the fan 210 can divide the air duct 400 into a first chamber 410 and a second chamber 420.

[0162] In other examples, the fan 210 is spaced apart from the top surface 830 of the air duct and spaced apart from the side surface 820 of the air duct. The separator 900 can be connected between the top surface 830 of the air duct and the fan 210, and between the side surface 820 of the air duct and the fan 210.

[0163] In some examples, the first partition 300 is parallel to the bottom surface 810 and the top surface 830 of the air duct. The orthographic projection of the first air vent 101 onto the first partition 300 lies within the area where the plurality of first air holes 301 are located. The first air vent 101 and the plurality of first air holes 301 are positioned directly opposite each other, resulting in a shorter air path, which reduces airflow loss and improves the heat dissipation efficiency of the heat dissipation module 1000.

[0164] The first partition 300 can be connected between the side 820 of the air duct and the first part of the partition 900, wherein the first part is the part of the partition 900 located between the fan 210 and the top surface 830 of the air duct.

[0165] For example, the divider 900 can be a partition plate, which can be made of materials such as plastic or metal. Alternatively, the divider 900 can be foam.

[0166] In other examples, the second partition 600 is parallel to the bottom surface 810 and the top surface 830 of the air duct, and the orthographic projection of the second air vent 102 on the second partition 600 is located within the area where the multiple second air holes 601 are located. The second air vent 102 and the multiple second air holes 601 are arranged facing each other, resulting in a shorter air path, which reduces airflow loss and improves the heat dissipation efficiency of the heat dissipation module 1000.

[0167] Figure 16 for Figure 1 Another structural diagram of the electronic device 2000 in the system. Among them, Figure 16 Another arrangement of the first partition 300 and the second partition 600 is shown.

[0168] Please see Figure 16 In some other examples, the first partition 300 is connected between the side surface 820 and the top surface 830 of the air duct. In this case, there is an acute angle between the first partition 300 and the side surface 820 of the air duct, and there is an acute angle between the first partition 300 and the top surface 830 of the air duct.

[0169] In some other examples, the second partition 600 is connected between the side surface 820 and the top surface 830 of the air duct, in which case there is an acute angle between the second partition 600 and the side surface 820 of the air duct, and an acute angle between the second partition 600 and the top surface 830 of the air duct.

[0170] Figure 17 for Figure 1 Another structural diagram of the electronic devices in the 2000 series. Figure 18 for Figure 17 A simplified top view of the electronic equipment in the 2000. Figure 19 for Figure 18 A simplified side view of the electronic device 2000 on its long side.

[0171] Please see Figure 17 In some embodiments, the electronic device 2000 may include a display panel 910, and a heat dissipation module may be disposed on the side of the display panel 910 opposite to the display surface 130.

[0172] The main body 100 includes a middle frame 150, a rear cover 180 and an air duct base plate 160. A first groove 155 is provided on the middle frame 150, and the rear cover 180 covers the opening of the first groove. A first air vent 101 and a second air vent 102 are provided on the rear cover 180.

[0173] The air duct base plate 160 is located at the bottom of the first groove, and the heat dissipation component 200 is located on the side of the air duct base plate 160 facing the rear cover 180.

[0174] For example, in Figure 17In the illustrated embodiment, the mid-frame 150 includes a mid-frame mainboard 151 and a mid-frame perimeter plate 152. The mid-frame perimeter plate 152 is arranged around the edge of the mid-frame mainboard 151 and connected to the mid-frame mainboard 151. In this case, the mid-frame perimeter plate 152 and the mid-frame mainboard 151 can form a first groove. At this time, the surface of the mid-frame mainboard 151 facing away from the display panel 910 can serve as the bottom of the first groove.

[0175] Among them, the surface of the air duct base plate 160 facing away from the display panel 910 can be used as the bottom surface 810 of the air duct, the surface of the middle frame 152 facing the air duct base plate 160 and not covered by the air duct base plate 160 can be used as the side surface 820 of the air duct, and the surface of the back cover 180 facing the air duct base plate 160 can be used as the top surface 830 of the air duct.

[0176] The third air vent 103 and the fourth air vent 104 can be installed on the middle frame panel 152, and the fifth air vent 105 and the sixth air vent 106 can be installed on the middle frame panel 152.

[0177] Please see Figure 18 The heat dissipation component 200 is projected onto the back cover 180, covering a portion of the back cover 180.

[0178] For example, the electronic device 2000 is approximately cuboid. In this case, the electronic device 2000 has a long side, a short side, a back surface, and a display surface. The back cover 180 is positioned away from the middle frame 150 (e.g., Figure 17 The surface shown is the back side, the long side connects the back side and the display surface, and the end side connects the back side and the display surface. The length of the long side is greater than the length of the end side.

[0179] Please see Figure 19 The length of the air duct 400 is approximately the same as the length of the back cover 180, which means that the length of the air duct 400 is approximately the same as the length of the long side of the electronic device 2000. At this time, the air duct 400 has a relatively large volume, which facilitates the placement of the heat dissipation component 200.

[0180] For example, the back cover 180 is approximately rectangular, and the dimension of the back cover 180 in its length direction can be the length of the rectangular back cover 180.

[0181] exist Figures 17 to 19 In the embodiment shown, the first partition 300 and the second partition 600 can be connected to the middle frame 152, that is, the groove sidewall of the first groove.

[0182] Figure 20 for Figure 13 A simplified top view of the electronic equipment in the 2000. Figure 21 for Figure 18 A simplified side view of the electronic device 2000.

[0183] In some embodiments, please see below. Figure 13 and simultaneously combined Figure 20 and Figure 21 The main body 100 includes: a middle frame 150, a rear cover 180, a camera decorative ring 190, and an air duct base plate 160. The air duct base plate 160 is disposed on the middle frame 150 and forms a second groove. The heat dissipation assembly 200 is disposed at the bottom of the second groove. The rear cover 180 is provided with a mounting opening, and the camera decorative ring 190 is disposed in the mounting opening. The camera decorative ring 190 covers the opening of the second groove. A first air vent 101 and a second air vent 102 are disposed on the camera decorative ring 190.

[0184] The camera decorative ring 190 can be glued to the back cover 180. The camera decorative ring 190 can be set in the mounting opening of the back cover. The shape of the camera decorative ring 190 can be circular, rectangular, square or racetrack-shaped. The shape of the camera decorative ring 190 is not limited here.

[0185] In this configuration, the orthographic projection of the air duct 400 onto the camera decorative ring 190 can cover a portion of the camera decorative ring 190. At this point, the air duct 400 and the heat dissipation component 200 within it are located within the area covered by the camera decorative ring 190. Consequently, the area occupied by the air duct 400 and the heat dissipation component 200 is relatively small, which is beneficial for the miniaturization of the electronic device 2000.

[0186] For example, the mid-frame 150 includes a mid-frame motherboard 151, and the air duct base plate 160 is located on the mid-frame motherboard 151.

[0187] In some examples, the camera decorative ring 190 can be plate-shaped. In this case, the first partition 300 and the second partition 600 can be connected to the groove sidewall of the second recess.

[0188] In other examples, the camera decorative ring 190 can form a third groove, the opening of which aligns with the opening of the second groove, thereby connecting the camera decorative ring 190 to the base plate 160. In this case, both the first partition 300 and the second partition 600 can be connected to the sidewall of the third groove in the camera decorative ring 190.

[0189] The bottom of the third groove enclosed by the camera decorative ring 190 can serve as the top surface 830 of the air duct, the bottom of the second groove on the air duct bottom plate 160 can serve as the bottom surface 810 of the air duct, and the sidewalls of the second groove and the third groove can together form the side surface 820 of the air duct.

[0190] For example, the camera decorative ring 190 may include a decorative base plate 191 and a decorative surround plate 192, wherein the decorative surround plate 192 is arranged around the edge of the decorative base plate, and the decorative base plate 191 and the decorative surround plate 192 form a third groove, and a third air vent 103 and a fourth air vent 104 may be provided on the decorative surround plate 192.

[0191] Please see Figure 13 , Figure 17 and Figure 17 In some embodiments, the electronic device 2000 further includes a display panel 910, and the mid-frame 150 includes a mid-frame motherboard 151, which is disposed on one side of the display panel 910 and has a mounting position.

[0192] The heat source device 500 is mounted on the mounting position, and the air duct base plate 160 is located on the side of the middle frame main board 151 away from the display panel 910 and covers the heat source device 500.

[0193] The heat dissipation assembly 200 includes a heat exchanger 220, which is disposed on the air duct base plate 160. The heat exchanger 220 and the heat source device 500 are stacked on a third direction L3, wherein the third direction L3 is the stacking direction of the middle frame motherboard 151 and the display panel 910.

[0194] For example, the heat source device 500 may include a CPU (central processing unit), a GPU (graphics processing unit), or a PMU (power management unit). The power components are mounted on the motherboard and installed in mounting positions via the motherboard, thereby securing the heat source device 500.

[0195] The air duct base plate 160 can be attached to the surface of the heat source device 500 away from the display panel 910. At this time, the heat generated by the heat source device 500 can be transferred to the air duct base plate 160.

[0196] The heat exchanger 220 and the heat source device 500 are arranged overlappingly on the third direction L3. At this time, the orthographic projection of the heat exchanger 220 on the middle frame motherboard 151 can at least partially coincide with the orthographic projection of the heat source device 500 on the middle frame motherboard 151. This facilitates the transfer of heat generated by the heat source device 500 to the heat exchanger 220 through the air duct base plate 160. The overlapping arrangement of the heat exchanger 220 and the heat source device 500 on the third direction L3 can shorten the heat transfer path, improve the heat conduction efficiency, and thus increase the heat received by the heat exchanger 220, thereby improving the heat dissipation efficiency of the electronic device 2000.

[0197] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation module, characterized in that, include: The main body has an air duct inside and a first air inlet and a second air inlet on the main body, with the first air inlet and the second air inlet located at both ends of the air duct. A heat dissipation component is disposed within the air duct; A first partition is disposed within the air duct and located between the heat dissipation component and the first air outlet. The first partition and the main body form a first air cavity, and the first air outlet is connected to the first air cavity. The first partition is provided with a plurality of first air holes, the area of ​​which is smaller than the area of ​​the first air outlet.

2. The heat dissipation module according to claim 1, characterized in that, The main body is also provided with a third air vent, which is connected to the first air cavity. The third air vent and the first air vent face different directions, and the area of ​​the first air vent is smaller than the area of ​​the third air vent.

3. The heat dissipation module according to claim 1 or 2, characterized in that, The air duct includes a first chamber and a second chamber that are connected. The first partition is disposed in the first chamber. The area in the first chamber other than the first air chamber is the second air chamber. The second air outlet is connected to the second chamber. The main body is also provided with a fourth air vent, which is connected to the second air cavity, and the area of ​​the fourth air vent is smaller than the area of ​​the first air vent.

4. The heat dissipation module according to any one of claims 1-3, characterized in that, The first partition includes a first sub-partition and a second sub-partition stacked together. The first sub-partition includes a first rib mesh, and the second sub-partition has a plurality of first air passage holes formed thereon. The first rib mesh covers a portion of the first air passage holes in the stacking direction.

5. The heat dissipation module according to any one of claims 1-4, characterized in that, Also includes: The second partition is disposed within the air duct and located between the heat dissipation component and the second air outlet. The second partition and the main body form a third air cavity, and the second air outlet is connected to the third air cavity. The second partition is provided with a plurality of second air holes, the area of ​​which is smaller than the area of ​​the second air outlet.

6. The heat dissipation module according to claim 5, characterized in that, The main body is also provided with a fifth air vent, which is connected to the third air cavity. The fifth air vent and the second air vent face different directions, and the area of ​​the second air vent is smaller than the area of ​​the fifth air vent.

7. The heat dissipation module according to claim 5 or 6, characterized in that, The air duct includes a first chamber and a second chamber that are connected. The first partition is disposed in the first chamber, the second partition is disposed in the second chamber, and the area in the second chamber other than the third air chamber is a fourth air chamber. The main body is also provided with a sixth air vent, which is connected to the fourth air cavity, and the area of ​​the sixth air vent is smaller than the area of ​​the second air vent.

8. The heat dissipation module according to claim 7, characterized in that, The second partition includes a third sub-partition and a fourth sub-partition stacked together. The third sub-partition includes a second rib mesh, and the fourth sub-partition has a plurality of second air passage holes formed therein. The second rib mesh covers a portion of the second air passage holes in the stacking direction.

9. The heat dissipation module according to any one of claims 5-8, characterized in that, The heat dissipation component includes a fan and a heat exchanger. The fan includes an air inlet and an air outlet. The air inlet is close to the first air outlet, and the air outlet is close to the second air outlet. The heat exchanger is disposed between the air outlet and the second air outlet. The first partition is disposed between the air inlet and the first air outlet; The second baffle is disposed between the heat exchanger and the second air outlet.

10. An electronic device, characterized in that, include: The heat dissipation module as described in any one of claims 1-9; A heat source device, wherein the heat dissipation component of the heat dissipation module is used to dissipate heat from the heat source device.

11. The electronic device according to claim 10, characterized in that, The main body includes a middle frame, a rear cover, and an air duct bottom plate. A first groove is provided on the middle frame, and the rear cover covers the opening of the first groove. The first air vent and the second air vent are provided on the rear cover. The air duct base plate is disposed at the bottom of the first groove, and the heat dissipation component is disposed on the side of the air duct base plate facing the rear cover.

12. The electronic device according to claim 10, characterized in that, The main body includes: a middle frame, a back cover, a camera decorative ring, and an air duct base plate. The air duct base plate is disposed on the middle frame and forms a second groove. The heat dissipation component is disposed at the bottom of the second groove. The rear cover is provided with an installation port, the camera decorative ring is disposed in the installation port, the camera decorative ring covers the groove of the second groove, and the first air vent and the second air vent are disposed on the camera decorative ring.

13. The electronic device according to claim 11 or 12, characterized in that, The electronic device further includes a display panel, and the middle frame includes a middle frame motherboard, which is disposed on one side of the display panel and has a mounting position. The heat source device is disposed on the mounting position, and the air duct base plate is disposed on the side of the middle frame main board away from the display panel and covers the heat source device; The heat dissipation assembly includes a heat exchanger, which is disposed on the air duct base plate. The heat exchanger and the heat source device are stacked in a third direction, wherein the third direction is the stacking direction of the mid-frame motherboard and the display panel.

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