A heat dissipation control method and a heat sink system

Abstract

The application provides a control method of a heat sink, the heat sink comprising a refrigeration fin, the control method comprising: calculating the operating power of the refrigeration fin through closed-loop control based on a set first cold end temperature threshold and the temperature deviation of the cold end of the refrigeration fin; calculating the operating power of the refrigeration fin through closed-loop control based on a set first hot end temperature threshold and the temperature deviation of the hot end of the refrigeration fin; and performing double closed-loop control on the refrigeration fin by taking the operating power calculated based on the hot end temperature of the heat sink as a threshold of the operating power calculated based on the cold end temperature of the heat sink.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation control method and a radiator system. Background Technology

[0002] With the development of technology, electronic devices such as cameras and mobile phones have become commonplace in daily life. People can use cameras and mobile phones to take pictures and videos to record their daily lives. During the use of electronic devices, heat is often generated, so users usually use heat sinks for cooling. However, due to their small size, mobile phones, cameras, and other small devices that require heat dissipation have limited space for heat sinks, meaning that the length, width, and height of the heat sink are restricted in their design. Therefore, heat sinks currently on the market are insufficient to quickly cool down electronic devices.

[0003] The problem with the commonly used thermoelectric cooling solutions on the market is that when efficient cooling is required, the higher the power required by the thermoelectric cooler, the higher the temperature of the heat sink on the back of the thermoelectric cooler. If the heat of the heat sink cannot be dissipated in time, the cooling efficiency will be greatly reduced. Summary of the Invention

[0004] The main objective of this application is to provide a control method and system for a heat sink, enabling the heat sink to rapidly cool electronic devices, and gradually reach a balance between the cooling temperature and the heat dissipation temperature of the heat sink fins.

[0005] To solve the above-mentioned technical problems, the technical solution provided by the present invention is as follows:

[0006] A method for controlling a radiator, the radiator including a cooling fin, the control method comprising:

[0007] Based on the set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control.

[0008] Based on the set first hot end temperature threshold and the temperature deviation of the hot end of the cooler, the operating power of the cooler is calculated through closed-loop control.

[0009] The operating power calculated based on the hot end temperature of the heat sink is used as the threshold for the operating power calculated based on the cold end temperature of the heat sink, and the cooling chip is controlled in a dual closed loop.

[0010] In one aspect, the heat sink includes a first temperature sensor for detecting the cold end temperature of the cooling chip; wherein, based on a set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control, including:

[0011] The temperature detected by the first temperature sensor is compared with the preset first cold end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

[0012] On one hand, the step of comparing the temperature detected by the first temperature sensor with a preset first cold-end temperature threshold, and calculating the operating power of the cooling chip through closed-loop control, includes:

[0013] When the temperature detected by the first temperature sensor is lower than or equal to a preset first cold end temperature threshold, the operating power of the cooling chip is reduced.

[0014] When the temperature detected by the first temperature sensor is higher than the preset first cold end temperature threshold, the operating power of the cooling chip is increased.

[0015] In one aspect, the heat sink includes a second temperature sensor for detecting the temperature of the heat sink fins at the hot end; wherein, based on a set first hot end temperature threshold and the temperature deviation at the hot end of the cooling fins, the operating power of the cooling fins is calculated through closed-loop control, including:

[0016] The temperature detected by the second temperature sensor is compared with the preset first hot end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

[0017] On one hand, the step of comparing the temperature detected by the second temperature sensor with a preset first hot-end temperature threshold and calculating the operating power of the cooling chip through closed-loop control includes:

[0018] When the temperature detected by the second temperature sensor is higher than or equal to the preset first hot end temperature threshold, the operating power of the cooling chip is reduced.

[0019] When the temperature detected by the second temperature sensor is lower than the preset first hot end temperature threshold, the operating power of the cooling chip is increased.

[0020] On one hand, the operating power calculated based on the temperature of the cold end of the heat sink is defined as value A, and the operating power calculated based on the temperature of the heat sink is defined as value B; wherein, the step of using the operating power calculated based on the temperature of the hot end of the heat sink as a threshold for the operating power calculated based on the temperature of the cold end of the heat sink, and performing dual closed-loop control of the cooling chip, includes:

[0021] When the value of A is greater than or equal to the value of B, the value of B is used as the operating power of the radiator cooling element.

[0022] When the value of A is less than the value of B, the value of A is used as the operating power of the radiator cooling plate.

[0023] In one aspect, the first operating power threshold is set to W1, and the control method further includes:

[0024] Based on the set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. The calculated operating power is then compared with the first operating power threshold to calculate the first operating power.

[0025] Based on the set first hot end temperature threshold and the temperature deviation of the hot end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. The calculated operating power is then compared with the first operating power threshold to calculate the second operating power.

[0026] Wherein, the first operating power is value A, and the second operating power is value B;

[0027] The first operating power threshold is between 20W and 50W.

[0028] In one aspect, the heat sink includes a cooling fan mounted on the hot end of the cooling fin for dissipating heat from the heat sink; the control method further includes:

[0029] Control the operation of the cooling fan.

[0030] On one hand, after maintaining the temperature of the cold end of the cooling chip at a preset first cold end temperature threshold for n seconds, the first cold end temperature threshold of the cooling chip is switched to a second cold end temperature threshold; the first hot end temperature threshold of the cooling chip is switched to a second hot end temperature threshold; the first operating power threshold W1 is switched to a second operating power threshold W2, thereby performing dual closed-loop control on the cooling chip.

[0031] The first cold end temperature threshold is -8 to (-13)℃, and the second cold end temperature threshold is -3 to (-7)℃; the first hot end temperature threshold is 55 to 65℃, and the second hot end temperature threshold is 20 to 45℃; n seconds is 25 to 35 seconds, and W2 is 10 to 30 W.

[0032] On one hand, a fan speed threshold is set, and the control method further includes:

[0033] The deviation between the temperature of the hot end of the cooling chip and a preset second hot end temperature threshold is compared, and closed-loop control of the speed of the cooling fan is performed.

[0034] When the temperature of the hot end of the cooling chip is higher than or equal to a preset second hot end temperature threshold, the operating speed of the cooling fan is increased.

[0035] When the temperature of the hot end of the cooling chip is lower than the preset second hot end temperature threshold, the operating speed of the cooling fan is reduced.

[0036] The calculated operating speed of the cooling fan is compared with the fan speed threshold to output the operating speed of the cooling fan.

[0037] In one aspect, the control method further includes:

[0038] The temperature detected by the first temperature sensor is compared with a preset low temperature threshold.

[0039] When the temperature detected by the first temperature sensor is less than or equal to the low temperature threshold, the heat sink is controlled to enter standby mode.

[0040] When the temperature detected by the first temperature sensor is greater than the low temperature threshold, the radiator is controlled to enter the cooling mode.

[0041] This article also provides a radiator system, including:

[0042] Cooling elements are used for cooling.

[0043] The first temperature detection module is used to detect the temperature of the cold end of the cooling chip;

[0044] The second temperature detection module is used to detect the temperature of the hot end of the cooling chip;

[0045] Fan driver module, used to drive the cooling fan;

[0046] The main control module implements a heat dissipation control method for the cooling element of the radiator based on the temperature of the cold end and the temperature of the hot end of the cooling element.

[0047] Beneficial effects:

[0048] The control method presented in this paper, through dual closed-loop control, gradually brings the cooling temperature of the heat sink and the heat dissipation temperature of the heat sink fins to an equilibrium point. On the one hand, it enables the heat sink to rapidly reduce the temperature of the electronic device, thereby allowing the electronic device to cool down quickly. On the other hand, under high power conditions, it effectively controls the temperature of the heat sink fins at the hot end of the cooling chip, reducing the impact of the hot end on the cooling of the cooling chip, thus ensuring that the heat sink presented in this paper can quickly cool down the electronic device. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0050] Figure 1 This diagram illustrates the schematic of a radiator control system.

[0051] Figure 2 This diagram illustrates a radiator control method.

[0052] Figure 3 This diagram illustrates the calculation of operating power based on the cold end temperature of the radiator in the radiator control method.

[0053] Figure 4 This diagram illustrates the calculation of operating power based on the hot end temperature of the radiator in the radiator control method.

[0054] Figure 5 A schematic diagram illustrating the radiator control method is provided.

[0055] Figure 6 This diagram illustrates the control of the cooling fan in the radiator control method.

[0056] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0058] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0059] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the term "and / or" throughout the text includes three solutions; taking A and / or B as an example, it includes technical solution A, technical solution B, and a technical solution that simultaneously satisfies A and B. Furthermore, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0060] In a heat sink, a cooling fin is typically used as the core component to dissipate heat from the target device. A cooling fin usually consists of a cold end and a hot end. The cold end is close to the target device, such as a mobile phone or camera, to cool it down; the hot end has a heat sink for heat dissipation. Generally, during heat dissipation, the higher the power, the lower the temperature of the cold end of the cooling fin, while the temperature of the hot end rises. Therefore, increasing the power of the cooling fin can quickly lower the temperature of the cold end. However, this raises a problem: the higher the power required for efficient cooling, the higher the temperature of the heat sink on the hot end of the cooling fin. If the heat from the heat sink cannot be dissipated quickly enough, the hot end of the cooling fin will become too hot to dissipate heat, significantly reducing the cooling efficiency and potentially causing burns to the user.

[0061] In summary, this paper provides a heat dissipation control method that enables radiators using this method to achieve efficient cooling while keeping the temperature of the heat sink at the hot end of the cooling element within a safe range, thus preventing burns to users.

[0062] This article provides a heat sink system, such as Figure 1 As shown, the system includes a main control MCU, temperature sensor A, temperature sensor B, a cooling chip, and fans A and B. The main control MCU, as the core control component of the heatsink, can utilize a heat dissipation control method described in this paper to control the heatsink's operation, including sensor data acquisition, cooling chip control, and fan control. In some aspects, it may also include Bluetooth communication and indicator light control. For example, it can connect to a user's mobile device via Bluetooth to display the heatsink's operating parameters on the user's mobile phone interface. Indicator light control can use different colored indicator lights to indicate the heatsink's operating status, such as Bluetooth connection indicator lights, operating mode indicator lights, and fault indicator lights. Fans A and B are used to dissipate heat from the heatsink; they can be controlled by fan A drive circuit and fan B drive circuit connected to the main control MCU, respectively. The cooling chip, the core component of the heatsink, can specifically be a semiconductor cooling chip and can be controlled by a cooling chip drive circuit connected to the main control MCU. Temperature sensor A is used to detect the temperature of the cold end of the cooling chip, such as, but not limited to, the surface temperature of the silicone rubber at the cold end of the cooling chip. The position of temperature sensor A can be adjusted as needed, provided that the cooling temperature of the cooling chip is detected. Temperature sensor B is used to detect the temperature of the hot end of the radiator's cooling fins. For example, it can detect the temperature of the radiator's hot end. As long as the radiator's cooling temperature can be detected, the position of temperature sensor B can be adjusted as needed.

[0063] The power supply for the heat sink can be input through a power interface, specifically a Type-C IN interface. On the one hand, a step-down circuit can be set between the power interface circuit and the main control MCU module to reduce the voltage to a suitable range, thereby providing power to the main control MCU and downstream devices.

[0064] Please see Figure 2 This paper presents a control method for a heat sink, applied to the aforementioned heat sink. This control method, through dual closed-loop control, gradually achieves an equilibrium between the cooling temperature of the heat sink and the heat dissipation temperature of the heat sink fins. Firstly, this allows the heat sink to rapidly reduce the temperature of the electronic device, thus enabling rapid cooling. Secondly, under high-power conditions, effectively controlling the temperature at the hot end of the heat sink fins reduces the impact of the hot end on the cooling performance of the heat sink, ensuring that the heat sink can quickly cool the electronic device. Furthermore, effective control of the hot end temperature also effectively prevents users from being burned by the heat sink fins. Specifically, the control method is as follows:

[0065] S100: Based on the set first cold end temperature threshold and the temperature of the cold end of the cooler, the operating power of the cooler is calculated through closed-loop control.

[0066] In this method, a target temperature is set, for example, a first cold-end temperature threshold. This first cold-end temperature threshold can be set according to requirements and further testing. For example, it can be the temperature required for rapid cooling of the equipment, or the temperature set for the rapid freezing of water droplets on the surface of the heat sink silicone. Specifically, the first cold-end temperature threshold in this paper can be -8 to (-13)℃. Based on the surface temperature of the silicone of the cooling chip detected by temperature sensor A, the current cooling temperature can be obtained. According to this cooling temperature and the set target temperature, the power of the cooling chip can be calculated through closed-loop control. For details, please refer to [link to relevant documentation]. Figure 3 ,include:

[0067] S101. The temperature detected by the first temperature sensor is compared with the preset first cold end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

[0068] Closed-loop control is a technology that achieves automatic adjustment through feedback. The main control MCU module detects the current temperature in real time through a first temperature sensor (temperature sensor A). The main control MCU module compares the actual temperature with a first cold junction temperature threshold, calculates the deviation, and calculates the operating power of the heat sink based on a PID algorithm (proportional term (P) + integral term (I) + derivative term (D)) adjusted through multiple tests. Closed-loop control can continuously correct through feedback, allowing the heat sink temperature to be adjusted according to the preset value. Among them, the PID algorithm is a classic closed-loop control strategy, and its specific principle will not be discussed in detail here.

[0069] This paper compares the temperature detected by the first temperature sensor with the preset first cold junction temperature threshold, and calculates the operating power of the cooling chip through closed-loop control, including:

[0070] S102. When the temperature detected by the first temperature sensor is lower than or equal to the preset first cold end temperature threshold, reduce the operating power of the cooling chip.

[0071] This paper applies closed-loop control to radiator temperature regulation. Specifically, in this heat dissipation method, a first operating power threshold W1 is set. The first operating power threshold W1 in this paper is 20W-50W. Using high power can enable the cooler to effectively cool to the preset temperature. In this process, a first cold end temperature threshold is set. When the temperature detected by temperature sensor A is lower than or equal to the preset first cold end temperature threshold, the real-time temperature of the cooler is already lower than or close to the first cold end temperature threshold. The cooling temperature of the cooler is low enough. Therefore, the main control MCU module can reduce the power of the cooler and calculate the operating power of the cooler according to the PID algorithm, so that the cooling of the cooler begins to slow down.

[0072] S103. When the temperature detected by the first temperature sensor is higher than the preset first cold end temperature threshold, increase the operating power of the cooling chip.

[0073] In closed-loop control, if the temperature detected by temperature sensor A is higher than the preset first cold end temperature threshold, the main control MCU module can know that the current real-time temperature of the cooling chip has not yet reached the first cold end temperature threshold, and the heat sink has not effectively dissipated heat. Therefore, the main control MCU module can increase the power of the cooling chip and calculate the operating power according to the PID algorithm, so that the cooling chip can accelerate cooling and reduce the cooling temperature of the cooling chip to effectively dissipate heat for electronic devices.

[0074] S104. On the other hand, after calculating the operating power of the cooling chip through closed-loop control based on the set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the calculated operating power is compared with the first operating power threshold to calculate the first operating power.

[0075] As mentioned earlier, a first operating power threshold W1 is set in this control method. After calculating the operating power, considering the possibility of error, this paper constrains the calculated first operating power using the first operating power threshold W1. Specifically, this may include:

[0076] S1041. When the operating power is greater than or equal to the first operating power threshold W1, the first operating power threshold W1 is used to calculate the first operating power.

[0077] In this process, taking a first operating power threshold W1 of 48W as an example, if the main control MCU module calculates an operating power of 100W based on the PID algorithm, and the first operating power threshold W1 is 48W, then the operating power output by the main control MCU module will be 48W. This setting avoids the calculated operating power deviating too much, which is beneficial for protecting the heatsink's cooling fins. On the other hand,

[0078] S1042. When the operating power is less than the first operating power threshold W1, the first operating power is used as the first operating power to calculate the first operating power.

[0079] In this process, taking the first operating power threshold W1 as 48W as an example, if the main control MCU module calculates the operating power as 20W based on the PID algorithm, and the first operating power threshold W1 is 48W, then the operating power output by the main control MCU module is 20W.

[0080] In summary, effective temperature control can be achieved through a cyclical process of monitoring, deviation comparison, and execution.

[0081] On the other hand, please see Figure 2 and Figure 4 For the heatsink fins at the hot end of the radiator, the heat dissipation control method described in this paper also needs to consider the temperature of the heatsink fins to avoid overheating and burning the user. Therefore, the radiator control method described in this paper also includes:

[0082] S200: Based on the set first hot end temperature threshold and the temperature of the hot end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control.

[0083] In this control method, a first hot-end temperature threshold can be set. Specifically, this temperature can be set according to test parameters, specifically a safe temperature to avoid burns to the user. Specifically, the first hot-end temperature threshold can be 55-65℃. Based on this safe temperature, the temperature of the heat sink is detected by a temperature sensor to determine the current operating temperature of the heat sink. Based on this heat sink temperature and the set safe temperature, the operating power of the cooling element can be calculated through closed-loop control. For details, please refer to [link to relevant documentation]. Figure 4 ,include:

[0084] S201. The temperature detected by the second temperature sensor is compared with the preset first hot end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

[0085] Specifically, the main control MCU can detect the real-time temperature of the heat sink through the second temperature sensor (temperature sensor B). The main control MCU compares the deviation of the real-time temperature of the heat sink with the preset first hot end temperature threshold, and outputs adjustment instructions based on the PID algorithm adjusted through multiple tests to calculate the operating power of the cooling chip. This effectively ensures the safety of the heat sink during use. The specific process includes the following steps:

[0086] S202. When the temperature detected by the second temperature sensor is higher than or equal to the preset first hot end temperature threshold, reduce the operating power of the cooling chip.

[0087] When a high-power control heat sink is used, the temperature at the heat sink of the cooling chip is positively correlated with the power; that is, the higher the power, the higher the temperature at the heat sink. Therefore, it is easy to burn the user. This paper sets a first hot end temperature threshold. When the temperature detected by the second temperature sensor (temperature sensor B) is higher than or equal to the preset first hot end temperature threshold, the temperature at the heat sink is likely to burn the user. Therefore, based on closed-loop control, the main control MCU responds quickly and reduces the power of the cooling chip, thereby lowering the temperature at the heat sink and preventing the user from being burned.

[0088] S203. When the temperature detected by the second temperature sensor is lower than the preset first hot end temperature threshold, increase the operating power of the cooling chip.

[0089] In the closed-loop control of the cooling chip, when the temperature detected by temperature sensor B is lower than the first hot end temperature threshold, the temperature of the heat sink is relatively low. Therefore, the main control MCU can increase the power of the cooling chip according to the closed-loop control, thereby enabling the cooling chip to cool down quickly and improve the cooling efficiency.

[0090] In summary, this paper uses temperature sensor B to monitor the temperature at the heat sink, enabling the main control MCU to effectively monitor the temperature at the heat sink and respond promptly to ensure user safety.

[0091] On the other hand, as mentioned earlier, this paper sets a first motion power threshold. In the PID loop at the hot end, the calculated first motion power threshold can also be used to constrain the operating power calculated based on the PID loop at the hot end, specifically including:

[0092] S204. Based on the set first hot end temperature threshold and the temperature deviation of the hot end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. The calculated operating power is then compared with the first operating power threshold to calculate the second operating power.

[0093] As mentioned earlier, in this control method, a first operating power threshold W1 is set. After calculating the operating power, considering the possibility of error, this paper uses the first operating power threshold W1 to constrain the calculated first operating power and calculate the second operating power. Specifically, this may include:

[0094] S2041. When the operating power is greater than or equal to the first operating power threshold W1, the second operating power is calculated using the first operating power threshold W1.

[0095] In this process, taking a first operating power threshold W1 of 48W as an example, if the main control MCU module calculates an operating power of 100W based on the PID algorithm, and the first operating power threshold W1 is 48W, then the operating power output by the main control MCU module will be 48W. This setting avoids the calculated operating power deviating too much, which is beneficial for the protection of the heat sink. On the other hand,

[0096] S2042. When the operating power is less than the first operating power threshold W1, the first operating power is used as the second operating power for calculation.

[0097] In this process, taking the first operating power threshold W1 as 48W as an example, if the main control MCU module calculates the operating power as 30W based on the PID algorithm, and the first operating power threshold W1 is 48W, then the operating power output by the main control MCU module is 30W.

[0098] Please see Figure 1 and Figure 5 This paper employs precise data acquisition and algorithmic processing of cooling temperature, heat sink temperature, and power to implement dual closed-loop control of the cooling system. This achieves both efficient cooling and maintains the heat sink temperature within a safe range. Specifically, the control method described in this paper also includes:

[0099] S300 uses the operating power calculated based on the hot end temperature of the heat sink as the threshold for the operating power calculated based on the cold end temperature of the heat sink to perform dual closed-loop control of the cooling chip.

[0100] In this paper, the process of calculating power based on the cold-end temperature of the thermoelectric cooler is defined as the first closed loop, and the process of calculating power based on the hot-end temperature of the thermoelectric cooler is defined as the second closed loop. The operating power calculated based on the cold-end temperature of the radiator is defined as value A, and the operating power calculated based on the radiator temperature is defined as value B. As mentioned earlier, the operating power calculated based on the first closed loop (first operating power) is value A, and the operating power calculated based on the second closed loop (second operating power) is value B. In this paper, value B is used as the threshold for the operating power calculated from value A to perform dual closed-loop control of the thermoelectric cooler. Specifically, in the dual closed loops of the first and second closed loops, the main control MCU module compares values ​​A and B, and outputs one of these values ​​as the operating power of the radiator's thermoelectric cooler. In summary, by constraining value A with value B, this paper ensures that the thermoelectric cooler can effectively cool while guaranteeing the safety of the radiator's radiator. Please refer to [link to relevant documentation]. Figure 5 Specifically, it includes:

[0101] S301. When the value of A is greater than or equal to the value of B, the value of B shall be used as the operating power of the radiator cooling plate.

[0102] After the main control MCU module calculates the value of A based on the first closed loop and the value of B based on the second closed loop, it compares the value of A and the value of B. When the value of A is greater than or equal to the value of B, the value of B is used as the operating power of the heat sink cooling chip. The cooling chip in the heat sink system mentioned above operates at this operating power.

[0103] S302. When the value of A is less than the value of B, the value of A shall be used as the operating power of the radiator cooling plate.

[0104] In this scenario, after calculating value A based on the first closed loop and value B based on the second closed loop, the main control MCU module compares values ​​A and B, and uses value A as the operating power of the heat sink's cooling element. The cooling element in the aforementioned heat sink system operates at this power.

[0105] In this method, by constraining the A value with the B value, the cooling coil can effectively cool while ensuring the safety of the heat sink fins. Specifically, when the heat sink temperature and the cold end temperature of the cooling coil are close to the first hot end temperature threshold and the first cold end temperature threshold, respectively, the power varies within a certain range. The cold end can reach the target temperature and effectively cool the electronic device near that temperature, while the hot end temperature is also constrained by the second closed loop. Furthermore, the operating power calculated based on the second closed loop can, in turn, constrain the operating power calculated based on the first closed loop, thereby preventing the heat sink temperature from becoming too high. In summary, this achieves a balance between the hot and cold ends of the heat sink cooling coil.

[0106] In this paper, a cooling fan is installed on the heatsink to dissipate heat. Once the heatsink is powered on, the fan operates at full speed to cool the heatsink.

[0107] In this paper, after maintaining the temperature of the cold end of the thermoelectric cooler at a preset first cold end temperature threshold for n seconds (where n seconds is 25-30 seconds), the main control MCU module switches the first cold end temperature threshold to a second cold end temperature threshold; the first hot end temperature threshold to the second hot end temperature threshold; and the first operating power threshold W1 to the second operating power threshold W2 (W2 is 10-30W), thus performing dual closed-loop control of the thermoelectric cooler. Specifically, based on the new setting parameters, such as the second cold end temperature threshold, the second hot end temperature threshold, and the second operating power threshold W2, the dual closed-loop control process of the main control MCU module is consistent with the previous description, where the first cold end temperature threshold is -8 to (-13)℃, the second cold end temperature threshold is -3 to (-7)℃; the first hot end temperature threshold is 55-65℃, the second hot end temperature threshold is 20-45℃; n seconds is 25-35 seconds, and W2 is 10-30W. In this paper, the first cold end temperature threshold and the second cold end temperature threshold are demonstrated in demonstration mode (super cooling plus unattached temperature-controlled electronic device or cooling plus unattached temperature-controlled electronic device). The surface of the heat sink silicone can approach this temperature. This temperature threshold corresponds to the cooling chip operating at high power. The main control MCU uses this high power to enable the heat sink to cool down quickly.

[0108] In the usage mode (attached to the surface of the temperature-controlled electronic device, the mode can be super cooling mode or cooling mode), it means that the heat sink operates at high power to cool down the first cold end temperature threshold and the second cold end temperature threshold. In actual use, the temperature of the heat sink silicone surface and the electronic device surface takes into account the temperature after heat exchange between the heat sink cold end temperature and the electronic device temperature.

[0109] With this setup, the heatsink can quickly cool the electronic device at the first cold-end temperature threshold. Once the temperature drops, the second cold-end temperature threshold can stabilize the temperature. At this point, the power of the cooling chip can be switched to a lower power, resulting in a decrease in the temperature of the heatsink. Therefore, the speed of the cooling fan can be reduced. This paper does not limit the number of cooling fans; for example, it can use one cooling fan or two cooling fans.

[0110] Please see Figure 6 This article also sets a fan speed threshold. The testing standard for this fan speed threshold is designed to ensure that the noise generated by the fan rotation will not bother the user. For example, the fan speed threshold is controlled at approximately 75% of full speed. Control methods include:

[0111] S400: Based on the deviation between the temperature of the hot end of the cooling chip and the preset second hot end temperature threshold, the speed of the cooling fan is controlled in a closed loop.

[0112] Specifically, the deviation between the second hot end temperature threshold and the temperature detected at the hot end of the cooling chip can be compared. Taking a second hot end temperature threshold of 45°C as an example, the following process can be performed:

[0113] S500: When the temperature of the hot end of the cooling chip is higher than or equal to the preset second hot end temperature threshold, increase the operating speed of the cooling fan.

[0114] S600: When the temperature of the hot end of the cooling chip is lower than the preset second hot end temperature threshold, reduce the operating speed of the cooling fan.

[0115] S700 compares the calculated operating speed of the cooling fan with a fan speed threshold to output the operating speed of the cooling fan. Specifically, this includes:

[0116] S701. When the operating speed of the cooling fan is greater than or equal to the fan speed threshold, the fan speed threshold shall be used as the operating speed of the radiator fan.

[0117] S702. When the operating speed of the cooling fan is less than the fan speed threshold, the operating speed of the cooling fan shall be taken as the operating speed of the radiator fan.

[0118] On the one hand, when users use electronic devices, they turn on the heatsink, which quickly cools the device. However, when users stop using the device, they may forget to turn the heatsink off. If the heatsink is constantly cooling the device in standby mode, the surface temperature of the thermal paste on the heatsink may become too low. Alternatively, users may remove the heatsink from the cooled device but forget to turn it off; this process is equivalent to the heatsink being unloaded. In these scenarios, the excessively low temperature of the cooled device can easily lead to condensation, potentially damaging the device. Furthermore, prolonged unloaded operation of the heatsink can cause its lifespan to decrease and condensation to accumulate. Therefore, this paper also includes a low-temperature and no-load detection function. Users can turn on this switch and set a preset low-temperature threshold, which can be determined through testing.

[0119] S800: When the cold end temperature detected by the first temperature sensor is less than or equal to the low temperature threshold, control the heat sink to enter standby mode.

[0120] S900: When the cold end temperature detected by the first temperature sensor is greater than the low temperature threshold, the radiator is controlled to enter the cooling mode.

[0121] With this setup, when the user turns on the low temperature and no-load detection function, for example by turning on the switch through the UI interface; during the process of the main control MCU module controlling the cooling chip to cool down rapidly at high power, if the temperature sensor A detects that the cold end temperature is less than or equal to the low temperature threshold, the main control MCU module controls the cooling chip to enter standby mode; if the temperature sensor A detects that the temperature is greater than the low temperature threshold, the main control MCU module controls the heat sink to enter cooling mode.

[0122] In summary, users can use the main control MCU module to determine if the heat sink is experiencing low temperature or no-load conditions, and can promptly implement corresponding protection mechanisms, such as shutting down the cooling chip's operating power and entering standby mode. When the temperature is too high, the main control MCU module can restart the cooling chip to quickly cool the electronic device. For example, the low temperature threshold can be set to 13-15℃ when the surface temperature of the electronic device is detected.

[0123] This article also provides a computer scale storage medium that stores a computer program, which, when executed by a processor, implements the aforementioned heat dissipation control method.

[0124] All or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc. The program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. Alternatively, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc. It can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0125] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A method for controlling a radiator, characterized in that, The radiator includes a cooling plate, and the control method includes: Based on the set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. Based on the set first hot end temperature threshold and the temperature deviation of the hot end of the cooler, the operating power of the cooler is calculated through closed-loop control. The operating power calculated based on the hot end temperature of the heat sink is used as the threshold for the operating power calculated based on the cold end temperature of the heat sink, and the cooling chip is controlled in a dual closed loop.

2. The control method for the radiator according to claim 1, characterized in that, The heat sink includes a first temperature sensor for detecting the cold end temperature of the cooling chip; wherein, based on a set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control, including: The temperature detected by the first temperature sensor is compared with the preset first cold end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

3. The control method for the radiator according to claim 2, characterized in that, The step of comparing the temperature detected by the first temperature sensor with a preset first cold junction temperature threshold and calculating the operating power of the cooling chip through closed-loop control includes: When the temperature detected by the first temperature sensor is lower than or equal to a preset first cold end temperature threshold, the operating power of the cooling chip is reduced. When the temperature detected by the first temperature sensor is higher than the preset first cold end temperature threshold, the operating power of the cooling chip is increased.

4. The control method for the radiator according to claim 1, characterized in that, The heat sink includes a second temperature sensor for detecting the temperature of the heat sink fins at the hot end; wherein, based on a set first hot end temperature threshold and the temperature deviation at the hot end of the cooling fins, the operating power of the cooling fins is calculated through closed-loop control, including: The temperature detected by the second temperature sensor is compared with the preset first hot end temperature threshold, and the operating power of the cooling chip is calculated through closed-loop control.

5. The control method for the radiator according to claim 4, characterized in that, The step of comparing the temperature detected by the second temperature sensor with a preset first hot-end temperature threshold and calculating the operating power of the cooling chip through closed-loop control includes: When the temperature detected by the second temperature sensor is higher than or equal to the preset first hot end temperature threshold, the operating power of the cooling chip is reduced. When the temperature detected by the second temperature sensor is lower than the preset first hot end temperature threshold, the operating power of the cooling chip is increased.

6. The control method for the radiator according to claim 1, characterized in that, The operating power calculated based on the temperature of the cold end of the heat sink is defined as value A, and the operating power calculated based on the temperature of the heat sink is defined as value B; wherein, the step of using the operating power calculated based on the temperature of the hot end of the heat sink as a threshold for the operating power calculated based on the temperature of the cold end of the heat sink, and performing dual closed-loop control of the cooling chip, includes: When the value of A is greater than or equal to the value of B, the value of B is used as the operating power of the radiator cooling element. When the value of A is less than the value of B, the value of A is used as the operating power of the radiator cooling plate.

7. The control method for a radiator according to claim 6, characterized in that, The control method further includes setting a first operating power threshold W1: Based on the set first cold end temperature threshold and the temperature deviation of the cold end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. The calculated operating power is then compared with the first operating power threshold to calculate the first operating power. Based on the set first hot end temperature threshold and the temperature deviation of the hot end of the cooling chip, the operating power of the cooling chip is calculated through closed-loop control. The calculated operating power is then compared with the first operating power threshold to calculate the second operating power. Wherein, the first operating power is value A, and the second operating power is value B; The first operating power threshold is between 20W and 50W.

8. The control method for a radiator according to claim 7, characterized in that, The heat sink includes a cooling fan mounted on the hot end heat sink of the cooling chip for dissipating heat from the heat sink. The control method further includes: Control the operation of the cooling fan.

9. The control method for a radiator according to claim 8, characterized in that, After maintaining the temperature of the cold end of the cooling chip at a preset first cold end temperature threshold for n seconds, the first cold end temperature threshold of the cooling chip is switched to a second cold end temperature threshold; the first hot end temperature threshold of the cooling chip is switched to a second hot end temperature threshold; the first operating power threshold W1 is switched to a second operating power threshold W2, and the cooling chip is subjected to dual closed-loop control. The first cold end temperature threshold is -8 to (-13)℃, and the second cold end temperature threshold is -3 to (-7)℃; the first hot end temperature threshold is 55 to 65℃, and the second hot end temperature threshold is 20 to 55℃; n seconds is 25 to 35 seconds, and W2 is 10 to 30 W.

10. The control method for a radiator according to claim 9, characterized in that, The control method further includes setting a fan speed threshold and: The deviation between the temperature of the hot end of the cooling chip and a preset second hot end temperature threshold is compared, and the speed of the cooling fan is controlled in a closed loop. When the temperature of the hot end of the cooling chip is higher than or equal to a preset second hot end temperature threshold, the operating speed of the cooling fan is increased. When the temperature of the hot end of the cooling chip is lower than the preset second hot end temperature threshold, the operating speed of the cooling fan is reduced. The calculated operating speed of the cooling fan is compared with the fan speed threshold to output the operating speed of the cooling fan.

11. The control method for a radiator according to claim 2, characterized in that, The control method further includes: The temperature detected by the first temperature sensor is compared with a preset low temperature threshold. When the temperature detected by the first temperature sensor is less than or equal to the low temperature threshold, the radiator is controlled to enter standby mode. When the temperature detected by the first temperature sensor is greater than the low temperature threshold, the radiator is controlled to enter the cooling mode.

12. A radiator system, characterized in that, include: Cooling elements are used for cooling. The first temperature detection module is used to detect the temperature of the cold end of the cooling chip; The second temperature detection module is used to detect the temperature of the hot end of the cooling chip; Fan driver module, used to drive the cooling fan; The main control module, based on the temperature of the cold end and the temperature of the hot end of the cooling chip, performs the heat dissipation control method according to any one of claims 1-11 on the cooling chip of the radiator.

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